SHIELDING IN ELECTRONIC ASSEMBLIES
By coupling a shield to the bottom of a printed circuit board with a hole, the z-height and manufacturing complexity of electronic assemblies are reduced, enabling effective electromagnetic shielding and thermal management for ultra-low profile devices.
DE102018120665B4Undetermined Publication Date: 2026-06-25INTEL CORP
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- INTEL CORP
- Filing Date
- 2018-08-23
- Publication Date
- 2026-06-25
AI Technical Summary
Technical Problem
Existing electromagnetic shielding methods for electronic assemblies with gapped printed circuit boards increase z-height and manufacturing complexity, making them unsuitable for ultra-low profile applications and requiring additional surface mount soldering processes.
Method used
A shield is coupled to the bottom of a printed circuit board with a hole, extending into the board to reduce z-height and simplify manufacturing, while providing electromagnetic shielding and thermal management through conductive structures.
Benefits of technology
The solution maintains a low z-height and reduces manufacturing complexity, making it suitable for ultra-low profile devices like laptops and handheld computing devices, with the shield also serving as a heat sink or heat spreader.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
Electronic assembly (100) comprising: a printed circuit board (102) through which a hole (112) extends, the printed circuit board (102) having a first surface (116) and a second opposite surface (118); a shield (120) coupled to the second surface (118) of the printed circuit board (102), the shield (120) extending into the hole (112) towards the first surface (116);and an integrated circuit, IC, package (150) coupled to the second surface (118) of the printed circuit board (102), wherein the shield (120) has a recess (152) that is at least partially in the hole (112), the IC package (150) has a package substrate (106) and an electronic component (108) that is coupled to the package substrate (106), and the electronic component (108) extends into the recess (152), wherein the package substrate (106) has a conductive trace (148) that is conductively coupled to the shield (120) and extends through the package substrate (106) between different locations on a first surface (126) of the package substrate (106), and the printed circuit board (102) has a conductive trace (146) that is conductively coupled to the shield (120) and extends through the circuit board (102) between different locations on the second surface (118) of the circuit board (102).
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