System and method for monitoring the operating conditions of a semiconductor manufacturing device

Abstract

Method for operating a device (10, EP1-EP4) for manufacturing or analyzing semiconductor wafers (123), the method comprising: Detection of sound and / or vibrations in a process chamber (100) of the device (10, EP1-EP4) during an operation of the device (10, EP1-EP4); Receiving an electrical signal corresponding to the detected sound and / or vibrations by a signal processor (310); Processing of the received electrical signal by the signal processor (310); Detecting an event during the operation of the device (10, EP1-EP4) based on the processed electrical signal; and Controlling the operation of the device (10, EP1-EP4) according to the detected event, wherein the method, upon detecting a change in characteristic noises or characteristic vibrations of the device (10, EP1-EP4), includes predicting or estimating the next maintenance time of the device (10, EP1-EP4) based on the change.

Description

TECHNICAL AREA

[0001] This disclosure relates to chemical-mechanical polishing processes used in semiconductor manufacturing processes and to a device for chemical-mechanical polishing. BACKGROUND

[0002] Various types of equipment are used in the manufacture of semiconductor devices. This equipment includes manufacturing fixtures for processing semiconductor wafers and testing devices. Generally, these devices are well-maintained; however, they can malfunction for various reasons.

[0003] From publications US 2005 / 0092089A1 and US 2008 / 0002832A1, methods are known for detecting mechanical interference in equipment for the manufacture of semiconductor devices based on acoustic signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, in accordance with standard industry practice, various elements are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the various features may be enlarged or reduced as desired for clarity of description. Fig. Figure 1 is a schematic view of a device in normal operation for a semiconductor manufacturing operation according to one embodiment. Fig. Figure 2 is a schematic view of a device in abnormal operation for a semiconductor manufacturing operation according to one embodiment. Fig. Figure 3 is a schematic view of a device in abnormal operation for a semiconductor manufacturing operation according to one embodiment. The Fig. 4A and Fig. Figure 4B are simulated diagrams in the time and frequency domain of sound emitted by the operated device in normal operation according to an embodiment. The Fig. 5A and Fig. Figure 5B are simulated diagrams in the time and frequency domain of sound emanating from the operated device in an abnormal operation according to an embodiment. Fig. Figure 6 is a schematic view of a system for controlling semiconductor manufacturing equipment according to one embodiment. Fig. Figure 7 shows an exemplary flowchart for a method for controlling a manufacturing device according to one embodiment. The Fig. 8 and Fig. Figure 9 shows a control device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0005] A method and devices according to the invention, which take into account possible abnormal operating conditions, are provided according to claims 1, 14, and 19. The following disclosure provides many different embodiments or examples for implementing various features of the specified subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, only examples and are not intended to be limiting.For example, forming a first element over or on a second element in the following description may include embodiments in which the first and second elements are in direct contact, and may also include embodiments in which additional elements may be formed between the first and second elements, so that the first and second elements need not be in direct contact. Additionally, the present disclosure may repeat reference numerals and / or letters in the various examples. This repetition serves the purpose of simplicity and clarity and does not in itself imply any relationship between the various described embodiments and / or configurations.

[0006] Furthermore, spatially relative terms such as "below," "under," "lower," "above," "upper," and similar terms may be used here for the sake of simplicity to describe the relationship of one element or device to other element(s) or device(s), as shown in the figures. These spatially relative terms are intended to encompass various orientations of the device being used or operated, in addition to the orientation shown in the figures. The device may be oriented differently (rotated by 90 degrees or in a different orientation), and the spatially relative terms used here may be interpreted accordingly. Additionally, the term "made of" may mean either "comprising" or "consisting of."

[0007] The present disclosure relates generally to methods and devices for monitoring and controlling one or more semiconductor manufacturing or analysis devices. In particular, the methods and devices described herein enable the monitoring of the operating conditions of the devices in order to detect abnormal behavior.

[0008] The Fig. Figures 1-3 show schematic views of a semiconductor manufacturing or analysis apparatus according to an embodiment of the present disclosure. Fig. Figure 1 shows a state of the device during normal operation, and the Fig. 2 and Fig. Figure 3 shows states of the device during an abnormal operation. In the present disclosure, “an abnormal operation” includes, but is not limited to, a mechanical fault, mechanical failure, wear and tear, and an operation that may cause damage to a semiconductor wafer, an operation that may require immediate assistance and / or maintenance, or any other condition that prevents the operation of the devices. Furthermore, in some embodiments, the abnormal operation includes a predicted event that will soon lead to mechanical failure and / or damage to a wafer.An abnormal operation, condition, or movement includes, but is not limited to, wafer scratching by a moving or stationary part of the equipment, collision of a moving part, movement of a moving part that is slower or faster than a predetermined or intended speed, loosening of parts, accumulation of particles or dust, mishandling of a wafer (dropping), misalignment of a wafer relative to a handler, stage, and / or wafer stocker or wafer container, or any other mechanical problems that produce a specific sound. Furthermore, an abnormal operation, condition, or movement includes abnormal gas flow when gas is injected into a chamber or when gas is extracted or evacuated from the chamber.

[0009] In some embodiments of the present disclosure, the semiconductor fabrication or analysis apparatus 10 comprises a wafer stage 110 on which a semiconductor wafer 123 is placed, and a wafer handling mechanism 120 (e.g., a wafer handler) for transferring the wafer 123 to and from the wafer stage 110. In some embodiments, the wafer stage 100 can move horizontally in XY directions and / or vertically in a Z direction.

[0010] In some embodiments, the semiconductor manufacturing or analysis device 10 is housed in a process chamber 100. Although in Fig. Not shown in Figure 1, the process chamber 100 includes a wafer inlet and / or outlet opening, such as a loading chamber, so that the semiconductor wafer 123 can be transferred into the process chamber 100 from the outside. In some embodiments, the process chamber 100 can be airtight, thus reducing the pressure within the process chamber 100. In other embodiments, the process chamber 100 is air-permeable.

[0011] Examples of semiconductor fabrication or analysis equipment 10 include a fabrication apparatus such as, but not limited to, a plasma etching apparatus, a chemical vapor deposition (CVD) apparatus, a sputtering apparatus, an atomic layer deposition (ALD) apparatus, an epitaxial growth apparatus, a tempering apparatus, a thermal oxidation apparatus, an ion implantation apparatus, a lithography apparatus, a wet processing apparatus or any other apparatus used for processing semiconductor wafers;and an analytical device, such as, but not limited to, a critical dimension (CD) measuring device, such as a scanning electron microscope (SEM) and an optical microscope, a film thickness measuring device, a superposition measuring device, a particle and / or defect testing device, an electrical properties measuring device, or any other device used for analyzing and measuring machined semiconductor wafers.

[0012] As in Fig. As shown in Figure 1, one or more monitoring devices 250 are arranged inside or outside the process chamber 100. In some embodiments, the one or more monitoring devices 250 are vibration monitoring devices. In certain embodiments, the vibration monitoring device is a microphone.

[0013] The mechanical movement of the wafer handling mechanism 120 and / or the wafer stage 110 generates characteristic noises in the process chamber 100. If the process chamber 100 and / or any other parts of the semiconductor manufacturing or analysis device 10 include moving parts, such moving parts may also generate characteristic noises through their movement. In some embodiments, the moving parts include a wafer stage, a lifting pin in the wafer stage, a wafer handling mechanism, a valve, an opening / closing gate, a movable cover, or any other moving parts.

[0014] Fig. Figure 4A shows an example of the characteristic sounds in the time domain that are captured by one or more microphones 250, and Fig. Figure 4B shows an example of the characteristic noises in the frequency domain when the semiconductor manufacturing or analysis device 10 is operating normally. The amplitude and frequency of the characteristic noises inside and / or outside the process chamber 100 may depend on operations and / or movements of the parts of the semiconductor manufacturing or analysis device 10. Fig. 4B shows the average strength from time 0 s to time 4 s.

[0015] For example, the semiconductor fabrication or analysis device 10 generates different characteristic noises when the wafer transfer mechanism 120 transfers the wafer 123, when the wafer transfer mechanism 120 places the wafer 123 onto the wafer stage 110, and when the wafer transfer mechanism 120 picks up the wafer 123 from the wafer stage 110. The semiconductor fabrication or analysis device 10 can generate different characteristic noises when the wafer stage 110 moves upwards and when the wafer stage 110 moves downwards. The semiconductor fabrication or analysis device 10 can generate different characteristic noises during wafer processing and / or wafer analysis.

[0016] Although not shown in the figures, in some embodiments the sound spectrum includes noises with frequencies ranging from no more than fractions of Hertz (e.g. 0.01 Hz) to frequencies of several tens or hundreds of megahertz (e.g. 20 MHz to 200 MHz).

[0017] When the semiconductor manufacturing or analysis device 10 is operating normally, the characteristic noises corresponding to each of the operations and / or movements are essentially the same, and the sound spectra in the time and frequency domain remain essentially the same.

[0018] In contrast, the sound spectrum should change if an abnormal operation, abnormal condition, or abnormal movement occurs in the semiconductor manufacturing or analysis apparatus 10.

[0019] The Fig. 2 and Fig. Figure 3 schematically shows a semiconductor manufacturing or analysis device 10 that is operating abnormally.

[0020] In Fig. 2. A part of the wafer handling mechanism 120 (e.g., an arm) collides with a part of the wafer stage 110 during a wafer transfer movement because the wafer stage 110 is misaligned with respect to the wafer handling mechanism 120. In such a case, the collision of the part of the wafer handling mechanism 120 and the part of the wafer stage 110 produces abnormal noises. Similarly, a collision occurs as described in Fig. Figure 3 shows a part of the wafer handling mechanism 120 colliding with a part of the wafer stage 110 during a wafer transfer movement when the wafer handling mechanism 120 is misaligned with the wafer stage 110. In such a case, the collision of the part of the wafer handling mechanism 120 and the part of the wafer stage 110 generates abnormal noises. Such abnormal noises can be detected by the one or more microphones 250.

[0021] Fig. Figure 5A shows an example of the characteristic sounds that are captured in the time domain by the one or more microphones 250, and Fig. Figure 5B shows an example of the characteristic noises in the frequency domain when the semiconductor manufacturing or analysis device 10 is operating abnormally. Fig. 5B shows the average strength from time 0 s to time 4 s.

[0022] As in Fig. As shown in 5A, at that time approximately 1 s, abnormal noises, such as those caused by a collision of two parts, are detected by microphones 250, and corresponding peaks can be seen at about 3.2 Hz in the Fig. The frequency range shown in 5B can be observed.

[0023] Changes in the sound spectrum thus indicate an abnormal operation and / or movement of the semiconductor manufacturing or analysis device 10. As explained above, in some embodiments, a collision of two parts that should not otherwise occur causes the abnormal noises. In other embodiments, an abnormal movement of the wafer handling mechanism 120, caused, for example, by wear of moving components, causes a different type of abnormal noise. In other words, the sound spectra of the abnormal noises caused by different abnormal events differ from one another.

[0024] As in the Fig. As shown in Figures 1-3, the semiconductor manufacturing or analysis device 10 comprises one or more microphones 250 arranged inside and / or outside the process chamber 100 of the semiconductor manufacturing or analysis device 10. The semiconductor manufacturing or analysis device 10 further comprises a signal processor 310, which is functionally connected to the one or more microphones 250 and configured to receive and process an electrical signal from the one or more microphones 250. The semiconductor manufacturing or analysis device 10 further comprises a device controller 320, which is functionally connected to the various motion mechanisms of the semiconductor manufacturing or analysis device 10 and the signal processor 310.The device controller 320 is configured to receive a signal from the signal processor 310 and to control the operations and / or movements of the motion mechanisms of the semiconductor manufacturing or analysis device 10 based on the signal. In some embodiments, the device controller 320 and the signal processor 310 are separate devices, and in other embodiments, the signal processor 310 is part of the device controller 320.

[0025] In some embodiments, the one or more microphones 250 are selected to optimize the collection of noise from the semiconductor manufacturing or analysis device 10. For example, the one or more microphones 250 comprise a single broadband microphone designed to capture sound in the range of approximately 0.01 Hz to approximately 200 MHz. In other embodiments, the one or more microphones 250 comprise multiple narrowband microphones optimized to capture specific frequency ranges.For example, the one or more microphones 250 may include one or more infrasound microphones designed to detect sounds with frequencies from about 0.01 Hz to about 20 Hz, one or more acoustic microphones designed to detect sounds with frequencies from about 20 Hz to about 20 kHz (the audible range), and one or more ultrasonic microphones designed to detect sounds from about 20 kHz to about 200 MHz (the ultrasonic range). An example of an infrasound microphone includes, but is not limited to, an electret condenser microphone. Examples of acoustic and ultrasonic microphones include, but are not limited to, piezoelectric microphones, capacitive microphones, moving-coil microphones, or optoacoustic microphones.

[0026] In some embodiments, the one or more microphones 250 are arranged at one or more locations inside and / or outside the process chamber 100 of the semiconductor manufacturing or analysis apparatus 10 to detect the noise.

[0027] In some embodiments, one or more microphones 250 are arranged at one or more locations on or near an inner wall of the process chamber 100. In some embodiments, the one or more microphones 250 may be attached directly to the inner wall or may be attached to the process chamber 100 by a mounting device (a bracket). In other embodiments, one or more microphones 250 are arranged on or near moving elements of the semiconductor fabrication or analysis apparatus 10. For example, one or more microphones 250 are arranged on or near the wafer stage 110, and one or more microphones 250 are arranged on or near the wafer handling mechanism 120.In some embodiments, one or more microphones 250 can be attached directly to the moving elements or can be attached to the moving elements by a mounting device (a bracket). In other embodiments, one or more microphones 250 are arranged at or near a point where two moving elements intersect during their operations and / or movements. Furthermore, in certain embodiments, one or more microphones 250 are arranged outside the process chamber 100. For example, one or more microphones 250 are arranged on or near an outer wall of the process chamber 100.

[0028] In some embodiments, the distribution and arrangement of the microphones is optimized based on the frequency and amplitude of the sound expected at a specific location inside and / or outside the process chamber 100. It is expected that higher-frequency sounds will be directional and attenuate in the radial direction. For such sounds, narrowband microphones designed to detect directional noise are used in certain embodiments.

[0029] In some embodiments, one or more infrasound microphones are arranged on an upper wall of the process chamber 100; one or more narrowband acoustic microphones, which together cover the entire acoustic spectrum (i.e., from about 20 Hz to about 20 kHz), are arranged on side walls of the process chamber 100; one or more narrowband ultrasonic microphones, which together cover a sound spectrum in the range of about 20 kHz to about 200 MHz, are arranged on a bottom surface of the wafer stage 110; and one or more narrowband ultrasonic microphones, which together cover a sound spectrum in the range of about 20 kHz to about 200 MHz, are arranged on the wafer handling mechanism 120. However, the arrangements and types of microphones are not limited to the configurations described above.

[0030] In some embodiments, each of the one or more microphones 250 is hardwired to the signal processor 310 to transmit electrical signals corresponding to the detected sounds. In other embodiments, each of the one or more microphones 250 transmits the electrical signals corresponding to the detected sounds wirelessly to the signal processor 310. For example, in certain embodiments, the microphones transmit the electrical signals to the signal processor 310 using a wireless communication protocol, such as Bluetooth or IEEE 802.11 (Wi-Fi), but are not limited to such protocols. Other types of wireless communication protocols, including proprietary protocols, are considered within the scope of this disclosure.

[0031] In one embodiment, the signal processor 310 comprises one or more non-volatile, computer-readable memories, an interface configured to receive electrical signals from the one or more microphones 250, and one or more processors configured to process and analyze the received electrical signals. The signal processing includes, but is not limited to, synchronizing the electrical signals and filtering them to reduce noise.

[0032] In some embodiments, the one or more microphones 250 are spatially distributed and unsynchronized within the process chamber 100 to facilitate microphone installation. In such embodiments, synchronization of the electrical signals received by the various microphones at the signal processor 310 can be performed if necessary.In one embodiment, synchronizing the electrical signals comprises generating a clock signal with a frequency substantially separate from the frequencies of the unsynchronized electrical signals, transmitting the clock signal to each of the microphones, receiving a combined signal comprising a combination of the clock signal and the respective unsynchronized electrical signal from each of the microphones, splitting each of the combined signals to recover the unsynchronized electrical signal and the clock signal, and aligning the unsynchronized signals according to the recovered clock signal to produce synchronized electrical signals.In such embodiments, consideration is given to selecting the frequency of the clock signal such that there is little to no energy overlap with the unsynchronized electrical signals, in order to avoid masking information contained in the electrical signals. For example, in some embodiments, the clock signal has a frequency in the gigahertz (GHz) range, where the electrical signals received by the one or more microphones have very little or no energy.

[0033] In one embodiment, all microphones 250 are synchronized using a signal from the device controller 320. For example, in some embodiments, the device controller 320 sends a "start capture" signal to each of the microphones simultaneously, and each of the microphones begins to capture the sound signals in response to receiving the "start capture" signal.

[0034] The device controller 320 also receives operating signals indicating each operation and / or movement of the various parts of the semiconductor manufacturing or analysis device 10. In some embodiments, the device controller 320 synchronizes the "initiate detection" signal with the start of an operation and / or movement of the various parts of the semiconductor manufacturing or analysis device 10. Thus, the sound detection (and consequently the generation of electrical signals) at each of the microphones is synchronized with the commencement of the operation and / or movement of the various parts of the semiconductor manufacturing or analysis device 10. Other methods for synchronizing the electrical signals from the unsynchronized microphones are considered within the scope of this disclosure.

[0035] In one embodiment, the signal processor 310 is configured to filter the electrical signals received by each of the microphones 250 in order to reduce ambient noise and other background noise in order to improve the signal-to-noise ratio (SNR). Various methods for filtering electrical signals are known in the art and are not described in detail here.

[0036] Signal analysis includes, without limitation, detection of the sound source position, time-domain analysis of the sound spectrum, conversion of the electrical signal from the time domain to the frequency domain, frequency-domain analysis of the sound spectrum, signal decomposition, structure detection, structure comparison, structure matching, etc. In some embodiments, the detected noise is filtered and / or smoothed by a filter circuit and / or a smoothing circuit before conversion to the frequency domain. In the frequency domain, adjacent peaks can be smoothly blended to form a "spectral curve" of the sound, which can be used in structure detection, structure comparison, and / or structure matching operations.

[0037] In certain embodiments, the signal processor 310 is configured to detect the location of a noise source. The noise source can be detected using a triangulation algorithm. For example, in cases where the microphones 250 are unsynchronized, in some embodiments the microphones 250 are arranged such that they comprise three or more microphones with identical bandwidth and frequency sensitivity, arranged inside and / or outside the process chamber 100.In some embodiments, the bandwidth and center frequency of the three or more microphones are selected, for example, according to a frequency domain analysis of the sound spectrum during operations and / or movement of the moving parts of the operation and / or movement of the various parts of the semiconductor manufacturing or analysis device 10, in order to maximize the strength of the sound signals received or captured by the three or more microphones. After a synchronization process, a time difference in the arrival of the specific sound received by the three or more microphones can then be used to calculate the distance of the sound source from each of the three or more microphones, which in turn is used to calculate the location of the sound source.

[0038] In embodiments where the microphones 250 are synchronized, e.g., by the device controller 320, the signal processor 310 is configured to receive the synchronized electrical signals, process the signals to detect a common structure in the signals from microphones capturing noise in an overlapping frequency band, and calculate a time difference of the common structure originating from the different microphones. The location of a source of this common structure is calculated based on the time difference using the positions of the microphones providing the common structure.

[0039] In various embodiments, algorithms such as Fourier transform (e.g., fast Fourier transform (FFT), discrete Fourier transform (DFT), etc.), Laplace transform or wavelet transform are used to convert the time domain signals into frequency domain signals.

[0040] Structure detection can involve a model-based method or a machine learning method. In some embodiments, a model-based method is used to detect structures in the sound spectrum after synchronizing all electrical signals received by the microphones 250. In the model-based method, a model of the sound spectrum for a normal operation and / or movement of the various moving parts of the semiconductor manufacturing or analysis device 10 is generated using a regression analysis performed over several normal operations and / or movements of the various parts of the semiconductor manufacturing or analysis device 10. Two or more model sound spectra can be obtained and stored for different parts and / or movements in the system.In general, different movements cause different sounds, and thus different sound spectra are obtained and stored with respect to the different movements. For example, the signal processor 310 detects a collision between part of the wafer handling mechanism 120 and part of the wafer stage 110 based on a model of sound spectra for a collision between part of the wafer handling mechanism 120 and part of the wafer stage 110.

[0041] In some embodiments, the signal processor 310 is configured to "learn" and store normal sound spectra of the characteristic noises of the operations and / or movements of the various moving parts of the semiconductor manufacturing or analysis device 10. The signal processor 310 compares the signal spectra received by the one or more microphones 250 with the model sound spectra synchronously with the operations and / or movements of the various moving parts of the semiconductor manufacturing or analysis device 10. If a deviation from the model sound spectra exceeds a threshold, the signal processor can, in some embodiments, detect an abnormal operation.In some embodiments, a structural matching procedure is used to determine whether the signal spectra received by the one or more microphones 250 differ from the model sound spectra. If a match value is less than a threshold (e.g., 70–90%, where 100% represents a perfect match), the signal processor determines that an anomalous condition exists. By comparing the signal spectra received by the one or more microphones 250 with two or more model sound spectra for different parts or movements, it is possible to determine what type of anomaly has occurred. In further embodiments, the intensity in the frequency domain is monitored for one or more specific frequency values ​​or ranges. If the intensity decreases by a predetermined amount (e.g.,If the intensity (10-30% or more) is higher than the (previously stored) intensity during a normal operation, the signal processor determines that an abnormal condition exists. The specific frequency values ​​or ranges can be obtained in advance by intentionally inducing an abnormal operation.

[0042] In some embodiments, once a structure in the sound spectra (hereinafter referred to interchangeably as "sound structure") has been detected, the signal processor 310 generates a feedback signal based on the sound structure, which contains information regarding the operation and / or movement of the various moving parts of the semiconductor manufacturing or analysis device 10, and transmits the feedback signal to the device controller 320. The feedback signal can simply be an "all OK" signal if the sound structure indicates normal operation and / or movement.

[0043] In contrast, if the structure of the sound spectra indicates an abnormal operation and / or movement, the feedback signal signals to the device control 320 that an abnormal or unusual event has occurred. In such cases, the feedback signal includes information about the unusual event, indicating, for example, the type of event and the source of the anomaly.

[0044] In one embodiment, the device controller 320 comprises one or more non-volatile, computer-readable memories, an interface configured to receive the feedback signal from the signal processor 310, and one or more processors for analyzing the feedback signal and controlling the operations and / or movements of the various moving parts of the semiconductor fabrication or analysis device 10. In some embodiments, when the device controller 320 receives a feedback signal indicating the occurrence of an abnormal event, the device controller 320 stops the operations and movements of the semiconductor fabrication or analysis device 10. In certain embodiments, if the abnormal event is insignificant or self-correcting, the device controller 320 may continue the operations and movements of the semiconductor fabrication or analysis device 10.In some embodiments, the log for the occurrence of abnormal events is stored in the device control 320 and / or transmitted to a central server that manages the entire semiconductor manufacturing process / all semiconductor manufacturing equipment.

[0045] In the preceding embodiments, a microphone is used as the vibration monitoring device 250. In further embodiments, a vibration sensor capable of detecting a vibration of a spatial part of the semiconductor fabrication or analysis device 10 is used as the vibration monitoring device 250. In such a case, one or more vibration sensors are attached to an inner wall and / or an outer wall of the process chamber 100, to the wafer stage 110, and / or to the wafer handling device 120 to detect a vibration of each of these parts.

[0046] Similar to the sound detection cases described above, the operation and / or movement of the various moving parts of the semiconductor manufacturing or analysis device 10 generates characteristic vibrations that are generally characteristic of the operation and / or movement of the various moving parts of the semiconductor manufacturing or analysis device 10. For example, the semiconductor manufacturing or analysis device 10 generates different characteristic vibrations when the wafer transfer mechanism 120 transfers the wafer 123, when the wafer transfer mechanism 120 places the wafer 123 onto the wafer stage, and when the wafer transfer mechanism 120 picks up the wafer 123 from the wafer stage. The semiconductor manufacturing or analysis device 10 may generate different characteristic vibrations when the wafer stage 110 moves upward and when the wafer stage 110 moves downward.The semiconductor manufacturing or analysis device 10 can generate different characteristic vibrations during wafer processing and / or wafer analysis.

[0047] In some embodiments, the vibrations detected by the one or more vibration sensors are analyzed by the signal processor 310. The vibration signals for a normal operation of each of the operations and / or movements of various moving parts of the semiconductor manufacturing or analysis device 10 are repeatedly acquired and stored in the signal processor 310. The signal processor can generate a model of the vibration spectrum for each of the operations and / or movements of various moving parts of the semiconductor manufacturing or analysis device 10.

[0048] During operation of the semiconductor manufacturing or analysis device 10, the signal processor 310 monitors vibration signals transmitted by the one or more vibration sensors 250 and compares the signal spectrum of the detected vibration signal with the model vibration signal spectrum for normal operation. If a deviation from the model vibration spectrum exceeds a threshold, the signal processor 310 determines that an abnormal event has occurred in the semiconductor manufacturing or analysis device 10.

[0049] In further embodiments, the vibration signals for an abnormal operation of each of the operations and / or movements of various moving parts of the semiconductor manufacturing or analysis device 10 are repeatedly received and stored in the signal processor 310, and the signal processor generates a model for the vibration spectrum of an abnormal operation for each of the operations and / or movements of various moving parts of the semiconductor manufacturing or analysis device 10.

[0050] During an operation of the semiconductor manufacturing or analysis device 10, the signal processor 310 monitors vibration signals transmitted by the one or more vibration sensors 250 and determines whether the signal spectrum of the detected vibration signal matches the model vibration signal spectrum for an abnormal operation. If the vibration spectrum is detected as being identical or similar to the model vibration spectrum for an abnormal operation, the signal processor 310 determines that an abnormal event is occurring in the semiconductor manufacturing or analysis device 10. In such a case, the signal processor 310 can determine the type of abnormal event based on the model vibration signal spectrum.

[0051] The same or similar configurations, processes and / or operations as set out above in relation to the embodiments in which a microphone is used as a vibration monitoring device may be applied to the embodiments in which a vibration sensor is used as a vibration monitoring device.

[0052] In the present embodiments, various vibration sensors are used. These include an accelerometer, a piezoelectric sensor, and a MEMS sensor (microelectromechanical system sensor), among others. The vibration sensors can detect vibrations in a frequency range of approximately 0.01 Hz to approximately 30 kHz or in a frequency range of approximately 10 Hz to approximately 10 kHz.

[0053] Fig. Figure 6 is a schematic view of a system for controlling semiconductor manufacturing equipment according to one embodiment.

[0054] In Fig. 6. A plurality of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4 are communicatively connected to a central server CTR. Each of the devices EP1, EP2, EP3, and EP4 corresponds to the semiconductor fabrication or analysis device 10 as described in the Fig. Figures 1-3 are shown. In some embodiments, the majority of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4 are the same type of device. In other embodiments, the majority of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4 comprise one or more other types of devices.

[0055] The central server CTR receives monitoring signals from each of the plurality of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4 to monitor their operating conditions. In some embodiments, the device controller 320 transmits the monitoring signal from each of the plurality of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4 to the central server CTR. In other embodiments, the central server CTR can perform some of the functionalities of the device controller 320 and / or the signal processor 310 and directly monitor the process conditions of each of the plurality of semiconductor fabrication or analysis devices EP1, EP2, EP3, and EP4.

[0056] When the central server CTR receives a monitoring signal indicating the occurrence of normal operation by one or more of the majority of semiconductor manufacturing or analysis devices EP1, EP2, EP3 and EP4, the central server CTR issues a warning signal, for example by displaying a warning message on a screen and / or stopping the operation of these one or more devices.

[0057] In further embodiments, the central server CTR and / or the device controller 320 monitors the characteristic noises or vibrations and predicts or estimates the next maintenance time based on a change in the characteristic noise or vibration. For example, moving parts wear down due to long-term operation, which causes a change in the characteristic noises or vibrations. By detecting such a change in the characteristic noises or vibrations, the central server CTR and / or the device controller 320 predicts or estimates the next maintenance time, thus preventing mechanical failure that could damage the wafer and / or the device.

[0058] Fig. Figure 7 shows an exemplary flowchart for a method for controlling one or more manufacturing devices according to an embodiment of the present disclosure. Equipment, devices, processes, and configurations that are the same as or similar to those of the preceding embodiments are used in the following embodiments, and their detailed description can be omitted.

[0059] In S710, a device (the semiconductor fabrication or analysis device 10) begins operation to process or analyze a wafer according to a process sequence. In S720, the device monitors noise or vibration inside and / or outside the device. In S730, the device processes the detected noise or vibration. In S740, the device detects an abnormal event. Then, in S750, the device outputs a feedback signal, and in some embodiments, the feedback signal is sent to a central server (e.g., the CTR of Fig. 6) transferred.

[0060] The Fig. 8 and Fig. Figure 9 shows a control device according to an embodiment of the present disclosure. One or more of the signal processor 310, the device controller 320, and the central server CTR, as described above, can be implemented by a computer system 900 located in the Fig. 8 and Fig. 9 is shown.

[0061] Fig. Figure 8 is a schematic view of a computer system that performs one or more of the functionalities of the signal processor 310, the device controller 320, and / or the central server CTR. The foregoing embodiments can be implemented using computer hardware and computer programs running on it. Fig. 8 is a computer system 900 with a computer 901, which includes a drive for optical solid storage discs (e.g. CD-ROM or DVD-ROM) 905 and a magnetic disk drive 906, a keyboard 902, a mouse 903 and a monitor 904.

[0062] Fig. Figure 9 is a diagram showing an internal configuration of the Computer System 900. Fig.In addition to the optical drive 905 and the magnetic disk drive 906, the computer 901 is equipped with one or more processors 911, such as a microprocessor unit (MPU), a ROM 912 in which a program, such as a boot-up program, is stored, a random-access memory (RAM) 913 connected to the MPU 911 in which an instruction of an application program is temporarily stored and in which a temporary memory area is provided, a hard disk 914 in which an application program, a system program and data are stored, and a bus 915 that connects the MPU 911, the ROM 912, etc. Note that the computer 901 may include a network card (not shown) for providing a connection to a LAN.

[0063] The program that causes the computer system 900 to perform the functions described above in the preceding embodiments can be stored on an optical disk 921 or a magnetic disk 922, which is inserted into the optical disk drive 905 or the magnetic disk drive 906, and can be transferred to the hard disk 914. Alternatively, the program can be transferred to the computer 901 via a network (not shown) and stored on the hard disk 914. At the time of execution, the program is loaded into RAM 913. The program can be loaded from the optical disk 921 or the magnetic disk 922, or directly from a network.

[0064] For example, the program need not necessarily include an operating system (OS) or a third-party program to cause the Computer 901 to perform the functions described above in the preceding embodiments. The program may simply include a section of instructions to call a suitable function (a module) in a controlled manner and obtain the desired results.

[0065] In some embodiments of the programs, the functions implemented by the programs do not include functions that can only be implemented by hardware. For example, functions that can only be implemented by hardware, such as in a data acquisition unit or an output unit like a network interface, are not included in the functions implemented by the programs described above. Furthermore, the computer running the programs may consist of a single computer or multiple computers.

[0066] Furthermore, all or part of the programs for implementing the functions described above are part of another program used for semiconductor manufacturing processes. Additionally, all or part of the programs for implementing the functions are implemented by a ROM, which may be located, for example, in a semiconductor device.

[0067] It should be noted that the embodiments described above can be applied to manufacturing or analysis devices for flat panel displays such as liquid crystal displays and electroluminescent displays, whose manufacturing processes are similar to those for semiconductor devices.

[0068] It is understood that not all advantages have necessarily been described herein; no particular advantage is required in all embodiments or examples, and other embodiments or examples may offer other advantages.

[0069] For example, by capturing and analyzing characteristic noises generated by one or more moving parts of a semiconductor manufacturing or analysis device, it is possible to effectively detect abnormal operation of the device. Furthermore, by monitoring these characteristic noises, it is possible to predict the next maintenance time and thus prevent damage to the wafer and / or the device.

[0070] According to one aspect of the present disclosure, in a method for operating a device for manufacturing or analyzing semiconductor wafers, sound is detected in a process chamber of the device during operation. An electrical signal corresponding to the detected sound is received by a signal processor. The received electrical signal is processed by the signal processor. An event during the operation of the device is detected based on the processed electrical signal. The operation of the device is controlled according to the detected event. In one or more of the preceding or following embodiments, the signal processor, in response to the detection of the event, sends a feedback signal to a controller of the device corresponding to the detected event. The controller controls the operation of the device based on the feedback signal.In one or more of the preceding or following embodiments, the sound is detected by one or more microphones. In one or more of the preceding or following embodiments, the sound is detected by several microphones with different detection frequency ranges. In one or more of the preceding or following embodiments, at least one of the several microphones has a detection frequency range in the audible sound range. In one or more of the preceding or following embodiments, at least one of the several microphones has a detection frequency range in the ultrasonic sound range. In one or more of the preceding or following embodiments, the several microphones are arranged inside the process chamber. In one or more of the preceding or following embodiments, the several microphones are arranged both inside and outside the process chamber.In one or more of the preceding or following embodiments, the device further comprises a wafer handler for transferring a semiconductor wafer, and at least one of the multiple microphones is arranged on the wafer handler. In one or more of the preceding or following embodiments, the device further comprises a movable wafer stage on which a semiconductor wafer is placed, and at least one of the multiple microphones is arranged on the movable wafer stage. In one or more of the preceding or following embodiments, the event comprises at least one from the group consisting of a mechanical fault, a mechanical failure, and a collision of two or more parts.In one or more of the preceding or following embodiments, processing the electrical signal comprises at least one of the following: filtering the electrical signal to remove noise or ambient sound from the detected sound; detecting the location of a source of the detected sound; processing the electrical signal in a time domain or in a frequency domain; and recognizing structures in the detected sound as predetermined events during the operation of the device. In one or more of the preceding or following embodiments, recognizing structures comprises matching structures of sounds with known events based on event models or using a previously learned correspondence between structures of sounds and events.

[0071] According to another aspect of the present disclosure, in a method for operating multiple devices for manufacturing or analyzing semiconductor wafers, each of the multiple devices comprises a process chamber. In the method, sound is detected in a process chamber of the device in each of the multiple devices during an operation. Electrical signals from the multiple devices, corresponding to the detected sound, are received by one or more computers. The one or more computers process the received electrical signals. One or more events during the operation of each of the multiple devices are detected based on the processed electrical signals. The operation of each of the multiple devices is controlled according to the one or more detected events.In one or more of the preceding or following embodiments, the multiple devices are each one from the group consisting of a plasma etching device, a chemical vapor deposition (CVD) device, a sputtering device, an atomic layer deposition (ALD) device, an epitaxial growth device, a tempering device, a thermal oxidation device, an ion implantation device, a lithography device, a wet processing device, a critical dimension (CD) measuring device, a scanning electron microscope (SEM) and an optical microscope, a film thickness measuring device, a superposition measuring device, a particle testing device, a defect testing device and an electrical properties measuring device.In one or more of the preceding or following embodiments, each of the multiple devices comprises a wafer handler for transferring a semiconductor wafer, and the sound comprises sound generated by the wafer handler as it is moved. In one or more of the preceding or following embodiments, each of the multiple devices comprises a movable wafer stage on which a semiconductor wafer is arranged, and the sound comprises sound generated by the wafer stage as it is moved. In one or more of the preceding or following embodiments, if the one or more detected events correspond to a predetermined event indicating a mechanical failure, the operation of one or more devices in which the one or more events were detected is stopped.

[0072] According to another aspect of the present disclosure, in a method for operating a device for manufacturing or analyzing semiconductor wafers, a vibration in a process chamber of the device is detected by one or more sensors during operation of the device. An electrical signal corresponding to the detected vibration is received by a signal processor. The signal processor processes the received electrical signal. An event during the operation of the device is detected based on the processed electrical signal. The operation of the device is controlled according to the detected event.

[0073] According to one aspect of the present disclosure, an apparatus for manufacturing or analyzing semiconductor wafers comprises a wafer handler for transferring a semiconductor wafer, a wafer stage on which a semiconductor wafer is placed, a process chamber in which the wafer handler and the wafer stage are arranged, one or more microphones arranged for detecting sound generated by the apparatus during an operation of the apparatus and transmitting an electrical signal corresponding to the detected sound, a signal processor configured to receive the electrical signal from the one or more microphones, process the electrical signal and detect an event during the operation of the apparatus, and a controller for controlling the operation of the apparatus according to the detected event.In one or more of the preceding or following embodiments, the signal processor, in response to the detection of the event, sends a feedback signal to the controller corresponding to the detected event, and the controller regulates the operation of the device based on the feedback signal. In one or more of the preceding or following embodiments, the device comprises multiple microphones for sound detection. In one or more of the preceding or following embodiments, the multiple microphones have different detection frequency ranges. In one or more of the preceding or following embodiments, at least one of the multiple microphones has a detection frequency range in the audible sound range. In one or more of the preceding or following embodiments, at least one of the multiple microphones has a detection frequency range in the ultrasonic sound range.In one or more of the preceding or following embodiments, the multiple microphones are arranged inside and outside the process chamber. In one or more of the preceding or following embodiments, the device further comprises a wafer handler for transferring a semiconductor wafer, and at least one of the multiple microphones is arranged on the wafer handler. In one or more of the preceding or following embodiments, the device further comprises a movable wafer stage on which a semiconductor wafer is placed, and at least one of the multiple microphones is arranged on the movable wafer stage. In one or more of the preceding or following embodiments, the event comprises at least one from the group consisting of a mechanical fault, a mechanical failure, and a collision of two or more parts.In one or more of the preceding or following embodiments, processing the electrical signal comprises at least one of the following: filtering the electrical signal to remove noise or ambient sound from the detected sound; detecting the location of a source of the detected sound; processing the electrical signal in a time domain or in a frequency domain; and recognizing structures in the detected sound as predetermined events during the operation of the device. In one or more of the preceding or following embodiments, recognizing structures comprises matching structures of sounds with known events based on event models or using a previously learned correspondence between structures of sounds and events.In one or more of the preceding or following embodiments, the device is one from the group consisting of a plasma etching device, a chemical vapor deposition (CVD) device, a sputtering device, an atomic layer deposition (ALD) device, an epitaxial growth device, a tempering device, a thermal oxidation device, an ion implantation device, a lithography device, and a wet processing device. In one or more of the preceding or following embodiments, the device is one from the group consisting of a critical dimension (CD) measuring device, a scanning electron microscope (SEM), an optical microscope, a film thickness measuring device, a superposition measuring device, a particle testing device, a defect testing device, and an electrical properties measuring device.

[0074] According to another aspect of the present disclosure, a system for manufacturing or analyzing semiconductor wafers comprises a central server and several semiconductor manufacturing or analysis devices that are communicatively connected to the central server.Each of the multiple semiconductor fabrication or analysis devices comprises a wafer handler for transferring a semiconductor wafer, a wafer stage on which a semiconductor wafer is placed, a process chamber in which the wafer handler and the wafer stage are arranged, one or more microphones arranged for detecting sound generated by the device during an operation of the device and for transmitting an electrical signal corresponding to the detected sound, and one or more computers configured to detect the electrical signal from the one or more microphones, process the electrical signal, detect an event during the operation of the device, and control the operation of the device according to the detected event.In one or more of the preceding or following embodiments, each of the multiple semiconductor fabrication or analysis devices further comprises one or more microphones. In one or more of the preceding or following embodiments, each of the multiple semiconductor fabrication or analysis devices further comprises multiple microphones with different detection frequency ranges. In one or more of the preceding or following embodiments, at least one of the multiple microphones has a detection frequency range in the audible sound range and / or the ultrasonic sound range. In one or more of the preceding or following embodiments, each of the multiple semiconductor fabrication or analysis devices further comprises a wafer handler for transferring a semiconductor wafer and a wafer stage on which the semiconductor wafer is placed.At least one of the multiple microphones is positioned on the wafer handler and / or the wafer stage.

[0075] According to another aspect of the present disclosure, an apparatus for manufacturing or analyzing semiconductor wafers comprises a wafer handler for transferring a semiconductor wafer, a wafer stage on which a semiconductor wafer is placed, a process chamber in which the wafer handler and the wafer stage are arranged, one or more sensors arranged to detect vibrations generated by the apparatus during operation of the apparatus and to transmit an electrical signal corresponding to the detected vibrations, a signal processor configured to receive the electrical signal from the one or more sensors, process the electrical signal and detect an event during operation of the apparatus, and a controller for controlling the operation of the apparatus according to the detected event.

Claims

[1] A method for operating an apparatus (10, EP1-EP4) for producing or analyzing semiconductor wafers (123), the method comprising: Detecting sound and / or vibrations in a process chamber (100) of the device (10, EP1-EP4) during an operation of the device (10, EP1-EP4); Obtaining an electrical signal corresponding to the detected sound and / or vibrations by a signal processor (310); Processing the received electrical signal by the signal processor (310); Detecting an event during operation of the device (10, EP1-EP4) based on the processed electrical signal; and Controlling the operation of the device (10, EP1-EP4) according to the detected event, wherein the method comprises, upon detecting a change in characteristic noises or characteristic vibrations of the device (10, EP1-EP4), predicting or estimating the next maintenance time of the device (10, EP1-EP4) based on the change. [2] The method of claim 1, further comprising: in response to detecting the event, transmitting a feedback signal corresponding to the detected event by the signal processor (310) to a controller of the device (10, EP1-EP4), wherein the controller controls the operation of the device (10, EP1-EP4) based on the feedback signal. [3] Method according to claim 1 or 2, wherein the sound is detected by one or more microphones (250). [4] Method according to one of the preceding claims, wherein the sound is detected by a plurality of microphones (250) with different detection frequency ranges. [5] The method of claim 4, wherein at least one of the plurality of microphones (250) has a detection frequency range in an audible sound range. [6] The method of claim 4 or 5, wherein at least one of the plurality of microphones (250) has a detection frequency range in an ultrasonic sound range. [7] The method according to any one of claims 4 to 6, wherein the plurality of microphones (250) are arranged within the process chamber (100). [8] Method according to one of claims 4 to 6, wherein the plurality of microphones (250) are arranged inside and outside the process chamber (100). [9] A method according to any one of claims 4 to 8, wherein: the device (10, EP1-EP4) further comprises a wafer handler (120) for transferring a semiconductor wafer (123), and at least one of the plurality of microphones (250) is arranged on the wafer handler (120). [10] Method according to one of claims 4 to 6, wherein the device (10, EP1-EP4) further comprises a movable wafer stage (110) on which a semiconductor wafer (123) is placed, and at least one of the plurality of microphones (250) is arranged on the movable wafer stage (110). [11] A method according to any one of the preceding claims, wherein the event comprises at least one of the group consisting of a mechanical fault, a mechanical failure and a collision of two or more parts. [12] A method according to any one of the preceding claims, wherein processing the electrical signal comprises at least one of the group consisting of filtering the electrical signal to remove noise or ambient sounds from the detected sound, detecting a location of a source of the detected sound, processing the electrical signal in a time domain or in a frequency domain, and detecting structures in the detected sound as corresponding to predetermined events during operation of the device (10, EP1-EP4). [13] The method of claim 12, wherein detecting structures comprises matching structures of sounds with known events based on event models or using a previously learned correspondence between structures of sounds and events. [14] Apparatus (10, EP1-EP4) for producing or analyzing semiconductor wafers (123), the apparatus (10, EP1-EP4) comprising: a wafer handler (120) for transferring a semiconductor wafer (123); a wafer stage (110) on which a semiconductor wafer (123) is placed; a process chamber (100) in which the wafer handler (120) and the wafer stage (110) are arranged; one or more microphones (250) arranged to detect sound and / or vibrations generated by the device (10, EP1-EP4) during operation of the device (10, EP1-EP4) and transmit an electrical signal corresponding to the detected sound and / or vibrations; a signal processor (310) configured to receive the electrical signal from the one or more microphones (250), process the electrical signal, and detect an event during operation of the device (10, EP1-EP4); and a controller (320) configured to control the operation of the device (10, EP1-EP4) according to the detected event, wherein, when the signal processor (310) detects a change in characteristic noises or characteristic vibrations of the device (10, EP1-EP4), the controller (320) is configured to predict or estimate the next maintenance time of the device (10, EP1-EP4) based on the change in the characteristic noises or characteristic vibrations. [15] Device (10, EP1-EP4) according to claim 14, wherein: the signal processor (310) sends a feedback signal corresponding to the detected event to the controller (320) in response to the detection of the event, and the controller (320) controls the operation of the device (10, EP1-EP4) based on the feedback signal. [16] Device (10, EP1-EP4) according to claim 14 or 15, wherein the sound is detected by a plurality of microphones (250) having a detection frequency range comprising an audible sound range and / or an ultrasonic range. [17] The device (10, EP1-EP4) of claim 16, wherein the plurality of microphones (250) are arranged inside and outside the process chamber (100). [18] Device (10, EP1-EP4) according to one of claims 14 to 17, wherein: processing the electrical signal comprises detecting a structure in the detected sound in a frequency domain and / or a time domain as corresponding to a predetermined event during operation of the device (10, EP1-EP4), and detecting structures comprises matching a structure of sounds with predetermined events based on event models and / or using a previously learned correspondence between structures of sounds and events. [19] A system for manufacturing or analyzing semiconductor wafers (123), the system comprising: a central server (CTR); and a plurality of semiconductor manufacturing or analysis devices (10, EP1-EP4) communicatively connected to the central server (CTR), wherein: each of the plurality of semiconductor manufacturing or analysis devices (10, EP1-EP4) comprises: a wafer handler (120) for transferring a semiconductor wafer (123); a wafer stage (110) on which a semiconductor wafer (123) is placed; a process chamber (100) in which the wafer handler (120) and the wafer stage (110) are arranged; one or more microphones (250) arranged to detect sound and / or vibrations generated by the device (10, EP1-EP4) during operation of the device (10, EP1-EP4) and transmit an electrical signal corresponding to the detected sound and / or vibrations; one or more computers (900, 901) configured to receive the electrical signal from the one or more microphones (250), process the electrical signal, detect a change in characteristic sounds or characteristic vibrations of the device (10, EP1-EP4) based on the electrical signal, and estimate or predict the next maintenance time of the device (10, EP1-EP4) based on the change in the characteristic sounds or characteristic vibrations.

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