Manufacturing process for light-emitting devices

Abstract

Method for manufacturing a light-emitting device, comprising: - Providing a first substrate (201) with an intermediate layer (3); and a first light-emitting element (101) attached to the intermediate layer (3); - Providing a second substrate (202); and - Sliding the first light-emitting element (101) towards the second substrate (202) by means of at least two projections (30; 30A, 30B) formed on the intermediate layer (3), wherein, in a cross-sectional view, the at least two projections (30) overlap the first light-emitting element (101).

Description

BACKGROUND Technical area

[0001] The present disclosure relates to a light-emitting device and its manufacturing method, and in particular a method for transferring a large number of light-emitting elements. Description of the state of the art

[0002] Light-emitting diodes (LEDs) are widely used in various applications, such as the pixels in a display and the light sources in a backlight module. During the manufacturing of the display and the backlight module, it is problematic to efficiently arrange the numerous LEDs on the circuit board of the display or the backlight module.

[0003] US 2010 / 0258543A1 describes a method for transferring electronic components with the following steps: Arranging a first substrate on which the electronic component is mounted with a flat release layer. The flat shape of the release layer is equal to or smaller than the electronic component. Arranging a second substrate on which an adhesive layer is provided. Irradiating an irradiation area with a laser beam larger than the base area of ​​the release layer to remove the release layer and separate the electronic component from the first substrate and transfer it to the second substrate.

[0004] US 2010 / 0259164A1 describes a manufacturing process for a display device comprising a first step in which light-emitting elements are collectively transferred to a transmission area of ​​a second substrate. The light-emitting elements can be formed in any specified number on a first substrate. The manufacturing process includes a second step of transferring light-emitting elements remaining on the first substrate to multiple light-emitting elements mounted on the second substrate, wherein at least the first substrate is moved with respect to the transmission area on the second substrate, and wherein the first substrate is rotated in a plane.

[0005] WO 2017 / 123780A1 describes a process that involves cutting a wafer to form discrete components. In this process, discrete components are transferred onto a transparent support. The discrete components adhere to a release layer on the transparent support. Discrete components are then released from the transparent support. Upon release, one of the discrete components is deposited.

[0006] US 2018 / 0130683A1 describes a method and apparatus for soldering a chip onto a substrate. A chip carrier is positioned between a flash lamp and the substrate. The chip is mounted on the substrate-facing side of the chip carrier, with solder between the chip and the substrate. The flash lamp generates a light pulse to heat the chip, causing it to detach from the chip carrier toward the substrate. The solder is at least partially melted by contact with the heated chip, thus fixing the chip to the substrate. SUMMARY OF THE REVELATION

[0007] This disclosure discloses a method according to claim 1.

[0008] Preferably, the method can further include forming a bonding pad on the first substrate.

[0009] The bonding pad is preferably arranged between the first adhesive unit and the first substrate.

[0010] Preferably, the method can further include forming a second adhesive unit on the first substrate.

[0011] Preferably, the second adhesive unit is connected to the first light-emitting element.

[0012] Preferably, the process can further include the formation of an intermediate layer on the second substrate.

[0013] The intermediate layer is preferably arranged between the second light-emitting element and the second substrate.

[0014] The intermediate layer is preferably connected to the third light-emitting element.

[0015] Preferably, the method can further include forming a projection on the intermediate layer to push the second light-emitting element towards the first adhesive unit.

[0016] Preferably, the first light-emitting element emits light with a first peak wavelength and the second light-emitting element emits light with a second peak wavelength that differs from the first peak wavelength.

[0017] Preferably, the method can further include forming a second adhesive unit on the first substrate.

[0018] Preferably, the method can further include forming a spacer between the first substrate and the second substrate.

[0019] Preferably, the first adhesive unit comprises insulating material and conductive particles.

[0020] This disclosure discloses a method for manufacturing a light-emitting device, comprising providing a first substrate, forming a first adhesive unit on the first substrate, forming a first light-emitting element on the first substrate, providing a second substrate comprising an intermediate layer, forming a second light-emitting element on the second substrate, forming a first projection to push the second light-emitting element towards the first substrate, and connecting the second light-emitting element to the first adhesive unit.

[0021] Preferably, the method can further include forming a bonding pad on the first substrate; preferably, the bonding pad is covered by the first adhesive unit.

[0022] Preferably, the method can further include forming a second adhesive unit on the first substrate.

[0023] Preferably, the method can further include forming a second projection to push the second light-emitting element towards the first substrate.

[0024] Preferably, the method can further include forming a third light-emitting element on the second substrate.

[0025] Preferably, the third light-emitting element is pushed through the first projection towards the first substrate.

[0026] Preferably, the method can further include forming a second projection to push the second light-emitting element and the third light-emitting element towards the first substrate.

[0027] This disclosure discloses a method for manufacturing a light-emitting device, comprising providing a first substrate, forming a first adhesive unit and a second adhesive unit on the first substrate, forming a first light-emitting element on the first substrate, providing a second substrate, forming a second light-emitting element on the second substrate, forming a first projection to push the second light-emitting element to the first substrate, and connecting the second light-emitting element to the first adhesive unit and the second adhesive unit.

[0028] Preferably, the method can further include forming a second projection to push the second light-emitting element towards the first substrate.

[0029] Preferably, the method can further comprise providing a first bonding pad and a second bonding pad on the first substrate, wherein the first bonding pad is covered by the first adhesive unit and the second bonding pad is covered by the second adhesive unit.

[0030] Another aspect concerns a light-emitting device comprising a first substrate, a first adhesive unit on the first substrate, a first light-emitting element on the first substrate, a second substrate, a second light-emitting element on the second substrate, and a third light-emitting element on the second substrate, wherein the second light-emitting element is bonded to the first adhesive unit. The third light-emitting element overlaps with the first light-emitting element when the second light-emitting element is bonded to the first adhesive unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are included to facilitate a straightforward understanding of the application and are incorporated herein as part of this description. The drawings illustrate the embodiments of the application and, together with the description, serve to illustrate the principles of the application. Fig. Figures 1A-1C show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. Figure 1D shows a schematic view of a light-emitting device according to an embodiment of the present disclosure. Fig. Figures 2A-2C show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. Figures 3A-3C show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. Figure 3D shows a schematic view of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. Figures 4A-4G show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. Figures 5A-5G show schematic views of the projection and the adhesive unit according to an embodiment of the present disclosure. Fig. Figures 6A-6C show schematic views of the spacer and substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EXECUTION FORMS

[0032] To better and more concisely explain the disclosure, the same name or reference symbol that appears or is given in different paragraphs or figures in the description shall have the same or equivalent meaning once defined somewhere in the disclosure. The following is a description of the embodiments of this disclosure, along with the drawings.

[0033] The Fig. Figures 1A-1C show schematic views of the fabrication of a light-emitting device according to an embodiment of the present disclosure. The light-emitting device is, for example, a display with LED chips, LED assemblies, and / or LED CSPs (Chip Scale Packages) as pixels, or a backlight module with LED chips, LED assemblies, and / or LED CSPs as light sources. The fabrication method of this embodiment comprises a process that can efficiently transfer a large number of LED chips, LED assemblies, and / or LED CSPs onto the backplane of the display, the backplane of a backlight module, or a predetermined substrate.

[0034] Referring to Fig. In embodiment 1A, several first light-emitting elements 101 are arranged on a first substrate 201 by means of an intermediate layer 3. Specifically, the first substrate 201 has a first bottom surface 2010 and a first top surface 2011, and the first light-emitting elements 101 are arranged on the first bottom surface 2010 via the intermediate layer 3. In this embodiment, the light-emitting element can be an LED chip, an LED assembly, and / or an LED CSP. The intermediate layer 3 can cover the first bottom surface 2010 of the first substrate 201 continuously or intermittently. For example, the intermediate layer 3 covers almost or all of the area of ​​the first bottom surface 2010, or it covers only the area of ​​the first bottom surface 2010 that corresponds to the first light-emitting element 101.The first light-emitting element 101 comprises a substrate (not shown), a p-type semiconductor layer (not shown), an n-type semiconductor layer (not shown), a light-emitting layer (not shown), a first electrode pad 120, and a second electrode pad 121. In one embodiment, there is no substrate (e.g., growth substrate) contained within the first light-emitting element 101. Furthermore, the first light-emitting element 101 has a top surface 1010, a bottom surface 1011 opposite the top surface 1010, and a side surface 1012 arranged between the top surface 1010 and the bottom surface 1011. The top surface 1010 of the first light-emitting element 101 is connected to the intermediate layer 3.In one embodiment, the underside 1011 is not a flat surface, but a stepped surface consisting of a surface of the p-type semiconductor layer, a surface of the n-type semiconductor, and a surface of the light-emitting layer. The first and second electrode pads 120, 121 are electrically connected to the p-type semiconductor layer and the n-type semiconductor layer, respectively.

[0035] Referring to Fig. In 1A, the second substrate 202 has a second bottom surface 2021 and a second top surface 2020 and faces the bottom surface 1011. A plurality of connection pads 104 are arranged on the second top surface 2020. The connection pads 104 are configured to establish an electrical connection with the first and second electrode pads 120, 121 and to connect the first light-emitting element 101 to power (not shown) and / or the control circuit (not shown). The first light-emitting elements 101 are moved onto the second substrate 202 and inserted into the Fig. 1B and Fig. Subsequent processes shown in 1C are electrically connected with the multitude of connection pads 104.

[0036] In one embodiment, the first light-emitting element 101 comprises a semiconductor layer with a group III-V semiconductor material to emit incoherent light. The group III-V semiconductor material can be Al x Iny Tall (1-x-y) North Al x In y Tall (1-x-y)Let P be where 0 ≤ x, y ≤ 1; (x + y) ≤ 1. The first light-emitting element 101 can emit red light with a peak wavelength or dominant wavelength of 610–650 nm, green light with a peak wavelength or dominant wavelength of 495–570 nm, blue light with a peak wavelength or dominant wavelength of 450–495 nm, violet light with a peak wavelength or dominant wavelength of 400–440 nm, or UV light with a peak wavelength of 200–400 nm, based on various semiconductor materials. In one embodiment, the first light-emitting element 101 comprises a light-emitting layer and a wavelength conversion material on the light-emitting layer. The wavelength conversion material comprises one or more phosphors, a quantum dot material, or combinations thereof.Phosphorus can be yellow-green, red, or blue. Yellow-green phosphorus includes YAG, TAG, silicate, vanadate, alkaline earth metal selenide, or metal nitride. Red phosphorus includes fluoride (K₂TiF₆:Mn). 4+ , K2SiF6:Mn 4+ ), silicate, vanadate, alkaline earth metal sulfide, oxynitride, or a mixture of tungsten and molybdate. The blue phosphorus comprises BaMgAl 10 O 17 :Eu 2+The quantum dot material can be ZnS, ZnSe, ZnTe, ZnO, CdS, CdSe, CdTe, GaN, GaP, GaSe, GaSb, GaAs, AlN, AlP, AlAs, InP, InAs, Te, PbS, InSb, PbTe, PbSe, SbTe, ZnCdSeS, CuInS, CsPbCl3, CsPbBr3, or CsPbI3. In one embodiment, the first light-emitting element 101 can emit white light with a wavelength conversion material, wherein the white light has a color temperature between 10,000 K and 20,000 K and a color point coordinate (x, y) in the CIE 1931 chromaticity diagram, where 0.27 ≤ x ≤ 0.285; 0.23 ≤ y ≤ 0.26. In one embodiment, the white light emitted by the first light-emitting element 101 has a color temperature between 2200K and 6500K (e.g. 2200K, 2400K, 2700K, 3000K, 5700K, 6500K) and has a color point coordinate (x, y) that is located in the 7-step MacAdam ellipse in the CIE1931 color chart.

[0037] The first substrate 201 is a substrate configured to support the light-emitting elements. In one embodiment, the first substrate 201 is a substrate that can be fully or partially restored after stretching or bending, for example, a blue tape. In another embodiment, the first substrate 201 is a rigid substrate that cannot be restored after deformation at room temperature, such as a sapphire substrate. The second substrate 202 is a substrate configured to receive the light-emitting elements transferred from the first substrate 201. In one embodiment, the second substrate 202 is a printed circuit board with conductive and insulating materials. The conductive materials can be copper, tin, gold, or aluminum. The insulating material can be epoxy, glass fiber, aluminum oxide, aluminum nitride, or combinations thereof.In one embodiment, the connecting pad 104 comprises titanium, chromium, platinum, copper, nickel, gold, tin, or alloys thereof. The connecting pad 104 can be single-layered or multi-layered. In one embodiment, the second substrate 202 is a backplane of a backlight module or a backplane of a display.

[0038] Referring to Fig. 1B Several adhesive units 5 are arranged such that they cover more than two connection pads 104. The adhesive unit 5 comprises insulating material and conductive particles 501 dispersed therein. As in Fig. As shown in Figure 1B, two spacers 61, 62 are optionally arranged between the first substrate 201 and the second substrate 202 to maintain a distance between them, preventing the first light-emitting element 101 from directly contacting the connecting pad 104 or the adhesive unit 5 before being separated from the first substrate 201. In one embodiment, the distance between the first substrate 201 and the second substrate 202, maintained by the spacers 61, 62, is greater than twice the height of the first light-emitting element 101. In another embodiment, the distance between the first substrate 201 and the second substrate 202 can be maintained by a different mechanism, thus eliminating the need for the spacer. In one embodiment, the spacers 61, 62 are arranged at edge sections and / or midsections of the second substrate 202.In another embodiment, one or more spacers (not shown) are arranged between the spacers 61, 62. In one embodiment, the spacers 61, 62 are formed on the first substrate 201 or on the second substrate 202 before the first light-emitting elements 101 are transferred. The spacers can be arranged to form various patterns on the substrate, and for the corresponding description, reference is made to the relevant section. Fig. Reference is made to paragraphs 6A-6C and the related paragraphs.

[0039] The adhesive unit 5 physically and electrically connects the first light-emitting element 101 and the connecting pad 104. The adhesive unit 5 comprises insulating material and conductive particles 501 dispersed therein. The conductive particles 501 can be aggregated on the connecting pads 104 and on the first and second electrode pads 120, 121 by heating. The first light-emitting element 101 can be electrically connected to the connecting pad 104 by the aggregated conductive particles 501 in the insulating material of the adhesive unit 5. The insulating material can be silicone, epoxy, or the like. The material of the conductive particles 501 can be tin, copper, silver, gold, or the like. More precisely, the aggregated conductive particles 501 form a conductive column 502 that connects the electrode pads and the connecting pads, as shown in Fig. The diagram is shown in 1D. In one embodiment, the thickness of the adhesive unit 5 after bonding with the first light-emitting element 101 is less than 5 µm. In another embodiment, the thickness of the adhesive unit 5 after bonding with the first light-emitting element 101 is greater than 3 µm. In a further embodiment, the thickness of the adhesive unit 5 after bonding with the first light-emitting element 101 is between 1 µm and 4 µm. In these embodiments, the adhesive unit is an ACP (anisotropic conductive paste) or an ACF (anisotropic conductive film).

[0040] In one embodiment, the adhesive unit 5 consists solely of insulating material. A metal structure (not shown) is formed on a surface of the first and second electrode pads 120, 121 opposite the connecting pads 104. The metal structure can be single- or multi-layered. The metal structure is deformed to create an electrical and physical connection with the connecting pad 104 and the first and second electrode pads 120, 121 after heating and / or pressing, such that the deformed metal structure forms the electrical connection path between the connecting pad 104 and the first and second electrode pads 120, 121. In one embodiment, the metal structure comprises lead, tin, indium, gold, or alloys thereof. Before the connecting pad 104 is covered by the adhesive unit 5, the surface of the connecting pad and the surface of the metal structure can be oxidized, forming an oxide layer.If the adhesive unit 5 contains flux, it can remove the oxide from the surface of the metal structure and the oxide from the surface of the bonding pad 104. Therefore, the adhesive unit 5 improves the strength of the bond between the metal structure and the bonding pad 104 and facilitates deformation of the metal structure within the adhesive unit 5.

[0041] In one embodiment, the adhesive unit 5 comprises insulating material and conductive particles. The first and second electrode pads 120, 121 can be made of metal and comprise multiple layers. In one embodiment, the metal comprises lead, tin, indium, gold, or an alloy thereof. In another embodiment, the outermost layer of the first and second electrode pads 120, 121 comprises lead, tin, indium, gold, or an alloy thereof. The conductive particles can be aggregated onto the connecting pads 104 and the first and second electrode pads 120, 121 by heat and / or force. Subsequently, the conductive particles within the adhesive unit 5 are electrically connected to and directly bonded with the first and second electrode pads 120, 121 and the connecting pads 104.

[0042] Referring to Fig. In this embodiment, projections 30 are formed on the intermediate layer 3, and the first light-emitting elements 101, located directly beneath the projections 30, are pushed away from the intermediate layer 3. In this embodiment, a projection 30 pushes a first light-emitting element 101, located directly beneath the projection 30, toward the adhesive unit 5. The first light-emitting element 101 is detached from the intermediate layer 3 before it comes into contact with the adhesive units 5 on the second substrate 202. In other words, the first light-emitting elements 101 do not come into contact with the intermediate layer 3 during their movement from the first substrate 201 to the second substrate 202.Furthermore, the movement distance of the first light-emitting element 101 after detachment from the intermediate layer 3 is equal to or less than the distance between the first substrate 201 and the second substrate 202 minus the height of the first light-emitting element 101 and the height of the connecting pads 104. In another embodiment, the intermediate layer 3 has a bubble layer (not shown) and an adhesive structure (not shown). The bubble layer is formed between the first substrate 201 and the adhesive structure. The adhesive structure is bonded to the first light-emitting element 101. By heating the bubble layer, one or more bubbles (not shown) are generated, causing the bubble layer (not shown) and / or the adhesive structure to bulge and form the projections 30.As described above, the first light-emitting element 101, which is slid onto the second substrate 202, can be fixed to the second substrate 202 by the adhesive unit 5. In a further embodiment, one or more projections 30 can be formed to press one or more first light-emitting elements 101, and for a corresponding description, see the [reference to be added]. Fig. Reference is made to paragraphs 5A-5G and the related sections. Fig. In 1C, two first light-emitting elements 101, which are moved from the first substrate 201 to the second substrate 202, are spaced apart from each other by three first light-emitting elements 101 while they are arranged on the first substrate 201. The two first light-emitting elements 101, which are moved from the first substrate 201 to the second substrate 202, can be spaced apart from each other by four or more first light-emitting elements 101 or by two or fewer first light-emitting elements 101. Thus, the distance between two adjacent first light-emitting elements 101 on the second substrate 202 can be determined by the number of first light-emitting elements 101 between two first light-emitting elements 101 to be transferred while they are arranged on the first substrate 201.

[0043] The protrusions 30 are generated by applying a laser to the bubble layer. In one embodiment, the laser has a wavelength between 260 nm and 380 nm. For example, the wavelength can be 266 nm, 355 nm, or 375 nm. In one embodiment, the bubble layer is heated to form gas, which accumulates into bubbles. The bubble layer and / or the adhesive structure are bulged to form protrusions. The gas in the bubbles does not escape from the intermediate layer 3. In another embodiment, the first substrate 201 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, and the laser can pass through the first substrate 201. In one embodiment, the bubble layer comprises polyimide.

[0044] Fig. Figure 1D shows a schematic view of a light-emitting device according to an embodiment of the present disclosure. The light-emitting device 1000 in Fig. 1D comprises a first light-emitting element 101, a second substrate 202, and an adhesive unit 5. The first light-emitting element 101 is attached to the second substrate 202 and has the first and second electrode pads 120 and 121, respectively, and the second substrate 202 has connecting pads 104. The adhesive unit 5 includes conductive particles 501, and some of the conductive particles 501 can be aggregated to form the conductive column 502 to electrically connect the first light-emitting element 101 and the connecting pads 104, while the remainder of the conductive particles 501 are distributed within the adhesive unit 5. In one embodiment, the column 502 has an upper section 5012 near the first light-emitting element 101, a lower section 5010 near the second substrate 202 and a neck section 5011 between the upper section 5012 and the lower section 5010.The width of the neck section 5011 is smaller than the width of the upper section 5012 or smaller than the width of the lower section 5010. Some conductive particles 501 are dispersed within the insulating material but are not aggregated on the first and second electrode pads 120, 121 or on the connecting pad 104. The deformation of the adhesive unit 5 can be achieved by heating and / or pressing. In one embodiment, the adhesive unit 5 covers at least a portion of the side surface 1012. When the first light-emitting element 101 is detached from the intermediate layer 3, residues may remain on the first light-emitting element 101.In one embodiment, the second substrate 202 comprises conductive wires (not shown), active electronic elements (not shown), and / or passive electronic elements (not shown) arranged on the second bottom surface 2021 and / or the second top surface 2020 to control one or more first light-emitting elements 101. The conductive wires can be metal wires, and the metal wire material can be copper, aluminum, or gold. The active electronic element can be a control chip or a transistor. The passive electronic element can be a resistor or a capacitor.

[0045] The Fig. Figures 2A-2C show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. Fig. 2A, the second light-emitting elements 102 on the third substrate 203 are slid onto the second substrate 202, while the first light-emitting elements 101 are connected to the second substrate 202 via the adhesive units 5. As in the upper part of Fig. As shown in Figure 2A, a second substrate 202 and the first light-emitting elements 101, adhesive units 5, and connecting pads 104 arranged on the second substrate 202 are provided, as are the third substrate 203 and the intermediate layer 3 and the second light-emitting elements 102 on the third substrate 203, and the spacers 61, 62 between the second substrate 202 and the third substrate 203. As shown in the lower part of Fig. As shown in Figure 2A, the second light-emitting elements 102 on the third substrate 203 are transferred to the second substrate 202. In other words, after the first light-emitting elements 101 on the second substrate 202, as shown in Figure 2A, the second light-emitting elements 102 are transferred to the second substrate 202. Fig. As shown in Figures 1A-1C, a third substrate 203 with second light-emitting elements 102 arranged on it is provided, and all or part of the second light-emitting elements 102 are transferred to the area of ​​the second substrate 202 not occupied by the first light-emitting elements 101. The third substrate 203 has a third bottom surface 2030 and a third top surface 2031, and the second light-emitting elements 102 are arranged via the intermediate layer 3 on the third bottom surface 2030. More precisely, the intermediate layer 3 discussed above is formed on the third bottom surface 2030 of the third substrate 203. The projections 30 are formed from the intermediate layer 3 to allow the second light-emitting elements 102 to be pushed, which are arranged directly beneath the projections 30 to come into direct contact with the adhesive units 5.The intermediate layer 3 can continuously or intermittently cover the third underside 2030 of the third substrate 203. For example, the intermediate layer 3 covers almost or completely the area of ​​the third underside 2030, or only the area of ​​the third underside 2030 corresponding to the second light-emitting element 102. The spacers 61, 62 are arranged between the second substrate 202 and the third substrate 203 to prevent direct contact between the second light-emitting element 102 and the first light-emitting element 101, between the second light-emitting element 102 and the connecting pads 104, or between the second light-emitting element 102 and the adhesive unit 5 before the transfer process. For the arrangement of the spacers 61, 62 on the second substrate 202, reference can be made to the... Fig. Reference is made to paragraphs 6A-6C and the associated paragraphs. In one embodiment, the distance between the second substrate 202 and the third substrate 203 is greater than twice the height of the first light-emitting element 101 or greater than twice the height of the second light-emitting element 102. The method for sliding the second light-emitting elements 102 onto the adhesive units 5 is similar to the method for sliding the first light-emitting elements 101 onto the adhesive units 5, and reference is made to the preceding paragraphs for a corresponding description. During the sliding of the second light-emitting elements 102, some of the second light-emitting elements 102 on the third substrate 203 overlap with the first light-emitting elements 101 that have been transferred to the second substrate 202. The second light-emitting element 102 (i.e.,The second non-transmitted light-emitting elements (the second light-emitting elements), which overlaps with the first light-emitting element 101, are not transmitted to the second substrate 202. The second non-transmitted light-emitting element 102 may overlap wholly or partially with the first light-emitting element 101. Although the first light-emitting elements 101 and some of the second light-emitting elements 102 overlap, the overlapping first light-emitting element 101 and the second light-emitting element 102 are not in direct contact with each other, since the distance between the second substrate 202 and the third substrate 203 is greater than the sum of the heights of the overlapping first light-emitting elements 101 and second light-emitting elements 102, as is . Fig. Figure 2A shows the following: The second light-emitting elements 102 are pushed onto the second substrate 202 by the projections 30 to be bonded to the adhesive units 5 on the second substrate 202. The adhesive units 5 are formed on the second substrate 202 before the second light-emitting elements 102 are pushed onto it. Alternatively, the adhesive units 5 are formed on the second substrate 202 before the first light-emitting elements 101 are bonded to the second substrate 202. The spacers 61, 62 are positioned between the second substrate 202 and the third substrate 203 to prevent the second light-emitting element 102 from coming into direct contact with the first light-emitting element 101, the bonding pad 104, or the adhesive unit 5.

[0046] As in Fig. As shown in Figure 2A, the second light-emitting elements 102 are pushed to the second substrate 202 and separated from the third substrate 203. The space between the third substrate 203 and the second substrate 202 can be adjusted to prevent direct contact between the first light-emitting element 101 and the second light-emitting element 102. Therefore, the second light-emitting element 102, which overlaps the first light-emitting element 101, is not in direct contact with the first light-emitting element 101 and can be held in the same position without being removed beforehand while the second light-emitting elements 102 are pushed to the connecting pads 104. Referring to Fig. In 2A, a laser is applied to the intermediate layer 3 to form the protrusions. In one embodiment, the third substrate 203 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, allowing the laser to pass through the third substrate 203. Descriptions of the laser can be found in the preceding paragraphs.

[0047] Fig. Figure 2B shows the schematic view of the third light-emitting elements 103 on the fourth substrate 204, which are pushed to the connecting pads 104 on the second substrate 202 to form the light-emitting device 2000 in Fig. 2C to form, while the first light-emitting elements 101 and the second light-emitting elements 102 are connected to the second substrate 202 via the adhesive units 5. The fourth substrate 204 has a fourth bottom surface 2040 and a fourth top surface 2041, and the third light-emitting elements 103 are on the fourth bottom surface 2040 via the intermediate layer 3. In other words, Fig. Figure 2B shows the transfer of the third light-emitting elements 103 to the area of ​​the second substrate 202 that is not occupied by the first light-emitting elements 101 or the second light-emitting elements 102, while the first light-emitting elements 101 and the second light-emitting elements 102 are arranged on the second substrate 202. The intermediate layer 3 is arranged on the fourth underside 2040 of the fourth substrate 204, and several projections 30 are formed to push the third light-emitting elements 103 outwards from the intermediate layer 3 to the adhesive units 5. The third light-emitting elements 103 are further attached to the adhesive units 5 by heating the adhesive units 5 and / or pressing the third light-emitting elements 103 after the third light-emitting elements 103 and the adhesive units 5 have been joined.The spacers 61, 62 are arranged between the second substrate 202 and the fourth substrate 204 to prevent direct contact between the third light-emitting element 103 and the first and second light-emitting elements 101, 102, direct contact between the third light-emitting element 103 and the connecting pads 104, and direct contact between the third light-emitting element 103 and the adhesive unit 5 before the transfer process of the third light-emitting element 103 is completed. The procedure for sliding the third light-emitting element 103 onto the adhesive units 5 is similar to the procedure for sliding the first light-emitting element 101 onto the adhesive units 5, and reference is made to the preceding paragraphs for the corresponding descriptions. The intermediate layer 3 can cover the fourth underside 2040 of the fourth substrate 204 continuously or intermittently.For example, the intermediate layer 3 covers almost or completely the area of ​​the fourth substructure 2040, or only the area of ​​the fourth substructure 2040 that corresponds to the third light-emitting element 103. As shown in the side view of . Fig. As shown in Figure 2B, some third light-emitting elements 103, located on the fourth substrate 204, overlap with the first light-emitting elements 101 on the second substrate 202, and some third light-emitting elements 103, located on the fourth substrate 204, overlap with the second light-emitting elements 102 on the second substrate 202. The third light-emitting elements 103 that overlap with the first light-emitting elements 101 and 102 are not removed when the third light-emitting elements 103 are connected to the connecting pads 104. The space between the fourth substrate 204 and the second substrate 202 is large enough to prevent direct contact between the first light-emitting elements 101 and 102 and the third light-emitting elements 103.In other words, the distance between the fourth substrate 204 and the second substrate 202 is greater than the sum of the heights of the first light-emitting element 101 and the third light-emitting element 103, and greater than the sum of the heights of the second light-emitting element 102 and the third light-emitting element 103. The overlapping first light-emitting elements 101 (or second light-emitting elements 102) and third light-emitting elements 103 are not in direct contact with each other. As in . Fig. As shown in Figure 2B, the adhesive units 5 are formed on the second substrate 202 before the third light-emitting elements 103 are moved to the second substrate 202. Furthermore, the adhesive units 5 can be formed on the second substrate 202 before the first light-emitting elements 101 are connected to the second substrate 202, or before the second light-emitting elements 102 are connected to the second substrate 202. Referring to Fig. In 2B, a laser is used to form the protrusions. In one embodiment, the fourth substrate 204 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, and the laser can pass through the fourth substrate 204. The descriptions of the laser can be found in the preceding paragraphs.

[0048] Referring to Fig. 2C comprises the light-emitting device 2000, consisting of first light-emitting elements 101, second light-emitting elements 102, third light-emitting elements 103, the second substrate 202, adhesive units 5, and connecting pads 104. In one embodiment, the adhesive units 5, arranged between the first, second, and third light-emitting elements 101, 102, 103 and the second substrate 202, are directly connected to the underside of the light-emitting elements, for example, the underside 1011. In another embodiment, conductive wires, active electronic elements, and passive electronic elements are arranged on the second underside 2021 and / or the second upper surface 2020 of the second substrate 202, which are electrically connected to the connecting pads 104 to control the first light-emitting elements 101, 102, 103.Descriptions of the conductive wires, active electronic elements and passive electronic elements can be found in the previous paragraphs.

[0049] In one embodiment, the first light-emitting element 101, the second light-emitting element 102, and the third light-emitting element 103 emit light with different peak wavelengths. For example, the first light-emitting element 101 emits red light with a peak wavelength of 610–650 nm, the second light-emitting element 102 emits green light with a peak wavelength of 495–570 nm, and the third light-emitting element 103 emits blue light with a peak wavelength of 450–495 nm. In one embodiment, the light-emitting device 2000 is a display with the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 as pixels.

[0050] In one embodiment, the light-emitting device 2000 emits light of a single color. The first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 emit light with the same or similar peak wavelengths. For example, the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 emit blue light with a peak wavelength between 420 nm and 495 nm. In one embodiment, the light-emitting device 2000 is a light source for everyday lighting applications and emits light with a color temperature between 2200 K and 6500 K (for example, 2200 K, 2400 K, 2700 K, 3000 K, 5700 K, 6500 K).In one embodiment, the light-emitting device 2000 is a backlight source of an LCD display and emits light with a color temperature between 10000K and 20000K and has a color point coordinate (x, y) in the CIE 1931 color chart, where 0.27≦x≦0.285; 0.23≦y≦0.26. To provide colored light, the first light-emitting elements 101, the second light-emitting elements 102 and the third light-emitting elements 103 can be covered together by the same wavelength conversion structure, or the first light-emitting elements 101, the second light-emitting elements 102 and the third light-emitting elements 103 can each be covered by different wavelength conversion structures to convert light from the first light-emitting elements 101, the second light-emitting elements 102 and the third light-emitting elements 103.The wavelength conversion structure includes materials for converting light, such as phosphorus, quantum dots, or dyes.

[0051] The Fig. Figures 3A-3C show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. As in Fig. As shown in Figure 3A, a sixth substrate 702 and a fifth substrate 701 with an intermediate layer 3 formed on them are provided, and the first light-emitting elements 101 are connected to the fifth substrate 701 via the intermediate layer 3. The first light-emitting elements 101 are then slid onto the sixth substrate 702 through the projections 30. Descriptions of the intermediate layer, the light-emitting element, and the projection can be found in the preceding paragraphs. The first light-emitting element 101 has a bottom surface 1010 near the sixth substrate 702 and a top surface 1011 near the fifth substrate 701. The first light-emitting elements 101 are connected to the intermediate layer 3 via the first and second electrode pads 120, 121.The fifth substrate 701 has a fifth bottom surface 7010 and a fifth top surface 7011, and the first light-emitting elements 101 are arranged across the intermediate layer 3 on the fifth bottom surface 7010. The intermediate layer 3 can cover the fifth bottom surface 7010 of the fifth substrate 701 continuously or intermittently. For example, the intermediate layer 3 covers almost or completely the area of ​​the fifth bottom surface 7010 or only the area of ​​the fifth bottom surface 7010 that corresponds to the first light-emitting element 101. The first light-emitting elements 101, arranged directly beneath the projections 30, are pushed by the projections 30 to the sixth substrate 702. The bottom surface 1010 is directly connected to the sixth substrate 702. The sixth substrate 702 can be adhesive, allowing the first light-emitting elements 101 to be attached to predetermined positions on the sixth substrate 702.For example, the sixth substrate, 702, is a blue band or a UV separator band. Referring to... Fig. In 3A, a laser is applied to the intermediate layer 3 to form the projections. In one embodiment, the fifth substrate 701 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, and the laser can pass through the fifth substrate 701. The descriptions of the laser can be found in the preceding paragraphs. In this embodiment, a spacer is arranged between the fifth substrate 701 and the sixth substrate 702 to prevent direct contact between the first light-emitting element 101 and the sixth substrate 702 during the transmission of the first light-emitting elements 101.

[0052] Fig. Figure 3B shows the second light-emitting elements 102 on the seventh substrate 703 and the third light-emitting elements 103 on the eighth substrate 704, and the step of transferring the second and third light-emitting elements 102 to the sixth substrate 702 by means of the projections 30. More precisely, the second and third light-emitting elements 102 and 103 are transferred to the sixth substrate 702, while the first light-emitting elements 101 are arranged on the sixth substrate 702. Referring to the upper part of Fig. In 3B, a sixth substrate 702 and the first light-emitting elements 101 arranged thereon are provided, and a seventh substrate 703 and several second light-emitting elements 102 and an intermediate layer 3 arranged thereon are provided. The seventh substrate 703 has a seventh bottom surface 7030 and a seventh top surface 7031. An intermediate layer 3 is formed on the seventh bottom surface 7030 of the seventh substrate 703, and the second light-emitting elements 102 are arranged over the intermediate layer 3 on the seventh bottom surface 7030. The projections 30 push the second light-emitting elements 102 towards the sixth substrate 702. The intermediate layer 3 can cover the seventh bottom surface 7030 of the seventh substrate 703 continuously or intermittently.For example, the intermediate layer 3 covers almost or completely the area of ​​the seventh substructure 7030, or only the area of ​​the seventh substructure 7030 corresponding to the second light-emitting element 102. Referring to the lower part of . Fig. In 3B, a sixth substrate 702 and the first and second light-emitting elements 101, 102 arranged thereon, as well as an eighth substrate 704 and several third light-emitting elements 103 and an intermediate layer 3 arranged thereon, are provided. The eighth substrate 704 has an eighth bottom surface 7040 and an eighth top surface 7041. An intermediate layer 3 is formed on the eighth bottom surface 7040 of the eighth substrate 704, and the third light-emitting elements 103 are arranged over the intermediate layer 3 on the eighth bottom surface 7040. The projections 30 push the third light-emitting elements 103 towards the sixth substrate 702. The intermediate layer 3 can cover the eighth bottom surface 7040 of the eighth substrate 704 continuously or intermittently.For example, the intermediate layer 3 covers almost or completely the area of ​​the eighth substructure 7040, or only the area of ​​the eighth substructure 7040 corresponding to the third light-emitting element 103. The distance between the sixth substrate 702 and the seventh substrate 703 is greater than the sum of the height of the first light-emitting element 101 and the height of the second light-emitting element 102. The distance between the sixth substrate 702 and the eighth substrate 704 is greater than the sum of the height of the first light-emitting element 101 and the height of the third light-emitting element 103, or the sum of the height of the second light-emitting element 102 and the height of the third light-emitting element 103. Referring to... Fig. In 3B, a laser is applied to the intermediate layer 3 on the seventh substrate 703 and another laser is applied to the intermediate layer 3 on the eighth substrate 704 to form the projections 30. In one embodiment, each of the seventh substrate 703 and eighth substrate 704 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, so that the laser can pass through the seventh substrate 703 and the eighth substrate 704. The descriptions of the laser can be found in the preceding paragraphs.

[0053] Fig. Figure 3C shows the step of connecting the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 on the sixth substrate 702 to the ninth substrate 705. As shown in the upper part of Fig. As shown in Figure 3C, the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are arranged on the sixth substrate 702. Next, as shown in the middle part of Fig. As shown in Figure 3C, the sixth substrate 702 is turned upside down, and a ninth substrate 705 with the connecting pads 104 and the adhesive units 5 is placed under the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103. After the sixth substrate 702 is turned upside down, it moves toward the ninth substrate 705. Alternatively, after the sixth substrate 702 is turned upside down, it is fixed in place, and the ninth substrate 705 moves toward the sixth substrate 702. Or, the sixth substrate 702 and the ninth substrate 705 move toward each other. In either case, the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 move toward the ninth substrate 705 before being connected by the adhesive units 5.Subsequently, the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are attached to the adhesive units 5 by heating the adhesive units 5 and / or pressing the sixth substrate 702. Then, as described in the lower part of . Fig. Figure 3C shows the sixth substrate 702 removed to form the light-emitting device 3000. The light-emitting device 3000 comprises the first light-emitting elements 101, the second light-emitting elements 102, the third light-emitting elements 103, the ninth substrate 705, the adhesive units 5, and the connecting pads 104. The light-emitting device 3000 can be a display or a backlight module. The description of the adhesive unit can be found in the preceding paragraphs and is omitted here for brevity.

[0054] With the exception of the one in the Fig. According to the manufacturing process disclosed in 3A-3C, the light-emitting elements can be moved onto a substrate with an intermediate layer arranged thereon, before being connected to a substrate with adhesive units and bonding pads arranged thereon to form the light-emitting device 3000. More precisely, with reference to Fig. In the 3D process, the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are transferred onto a sixth substrate 702 with an intermediate layer 3 formed on it. The sixth substrate 702 has a sixth bottom surface 7021 and a sixth top surface 7020. The first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are arranged on the sixth top surface 7020 via the intermediate layer 3. Then, a ninth substrate 705 with connecting pads 104 and adhesive units 5 arranged on it is provided. The ninth substrate 705 has a ninth bottom surface 7051 and a ninth top surface 7050. The connecting pads 104 and the adhesive units 5 are arranged on the ninth top surface 7050.The sixth substrate 702 is turned over, and the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are moved toward the ninth substrate 705. Several projections 30 are formed on the intermediate layer 3. The first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are pushed through the projections 30 onto the ninth substrate 705, and the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 are attached to the adhesive units 5 by heating the adhesive units 5 and / or pressing the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 onto the adhesive units 5. The sixth substrate 702 is then removed to form the light-emitting device 3000.Referring to . Fig. In 3D, a laser is applied to the intermediate layer 3 to form the projections 30. In one embodiment, the sixth substrate 702 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, so that the laser can pass through the sixth substrate 702. Descriptions of the laser can be found in the preceding paragraphs. In this embodiment, conductive wires, active electronic elements, and / or passive electronic elements are arranged on the ninth bottom surface 7051 and / or the ninth top surface 7050 of the ninth substrate 705. For descriptions of the conductive wires, active electronic elements, and passive electronic elements, reference is made to the preceding paragraphs. In one embodiment, with reference to the Fig. 3C and Fig. In the 3D-illustrated step, a spacer is positioned between the sixth substrate 702 and the ninth substrate 705. The spacer maintains the distance between these two substrates to prevent the first light-emitting elements 101, the second light-emitting elements 102, and the third light-emitting elements 103 from directly contacting the adhesive units 5 or the ninth substrate 705 before being detached from the sixth substrate 702. Descriptions of the spacer can be found in the preceding paragraphs.

[0055] The Fig. Figures 4A-4G show schematic views of the manufacture of a light-emitting device according to an embodiment of the present disclosure. As in Fig. Figure 4A shows a tenth substrate 901 with several first light-emitting elements 101 and an eleventh substrate 902. The tenth substrate 901 is connected to the eleventh substrate 902 via the adhesive structure 50. The first light-emitting element 101 is surrounded by the adhesive structure 50. The description of the first light-emitting element 101 can be found in the preceding paragraphs. The adhesive structure 50 physically fixes the tenth substrate 901 to the eleventh substrate 902. In one embodiment, the adhesive structure 50 comprises an insulating material such as silicone or epoxy. The first light-emitting element 101 has a top surface 1010 facing the tenth substrate 901, a bottom surface 1011 facing the eleventh substrate 902, and a side surface 1012 connecting the top surface 1010 and the bottom surface 1011. In one embodiment, the underside 1011 is brought into direct contact with the adhesive structure 50.In one embodiment, the tenth substrate 901 is a substrate for growing epitaxial layers of the first light-emitting elements 101. In one embodiment, the tenth substrate 901 comprises sapphire, silicon, germanium, or nitride. In one embodiment, the adhesive structure 50 is arranged between the first and second electrode pads 120, 121 and the eleventh substrate 902.

[0056] Referring to Fig. In step 4B, a portion of the tenth substrate 901 is removed to form a thinned substrate 9010. The thinned substrate 9010 has a smaller thickness than the tenth substrate 901. In one embodiment, the thickness of the thinned substrate 9010 is between 10 µm and 50 µm.

[0057] Referring to Fig. In step 4C, the thinned substrate 9010 is subdivided into several unit substrates 901a, 901b, and 901c. The unit substrates 901a, 901b, and 901c are each associated with different first light-emitting elements 101. For example, unit substrate 901a is associated with first light-emitting element 101a, unit substrate 901b is associated with first light-emitting element 101b, and unit substrate 901c is associated with first light-emitting element 101c. The process for forming the unit substrates 901a, 901b, and 901c can be carried out using a cutting blade or a laser with a wavelength between 260 nm and 380 nm. When forming several unit substrates 901a, 901b, 901c, the first light-emitting elements 101 and the eleventh substrate 902 are not damaged, but part of the adhesive structure 50 is removed.The unit substrate 901a, 901b, 901c has a narrower width than the thinned substrate 9010, and a unit substrate 901a, 901b, 901c corresponds to or covers only one first light-emitting element 101. In one embodiment, a unit substrate 901a, 901b, 901c corresponds to two or more first light-emitting elements 101.

[0058] Referring to Fig. In 4D, a twelfth substrate 903 is provided, which is covered by an intermediate layer 3. The twelfth substrate 903 has a twelfth bottom surface 9030 and a twelfth top surface 9031. The intermediate layer 3 is arranged on the twelfth bottom surface 9030. The unit substrates 901a, 901b, and 901c are connected to the twelfth substrate 903 via the intermediate layer 3. In another aspect, the first light-emitting element 101 and the corresponding unit substrate 901a, 901b, and 901c are connected to the twelfth substrate 903 via the intermediate layer 3.

[0059] Referring to Fig. In step 4E, the eleventh substrate 902 is removed to expose the first light-emitting elements 101. The underside 1011 and the first and second electrode pads 120, 121 of the first light-emitting elements 101 are exposed. The adhesive structure 50 can be removed completely or partially before or after the removal of the eleventh substrate 902. In one embodiment, a section of the adhesive structure 50 remains on the first light-emitting element 101 and / or the unit substrates 901a, 901b, 901c after the removal of the eleventh substrate 902. In another embodiment, a section of the adhesive structure 50 remains on the first and second electrode pads 120, 121 after the removal of the eleventh substrate 902.

[0060] Referring to Fig. 4F has a thirteenth substrate 904 arranged beneath the twelfth substrate 903. The thirteenth substrate 904 has a thirteenth bottom surface 9041 and a thirteenth top surface 9040. The connecting pads 104 are arranged on the thirteenth top surface 9040. A portion of the thirteenth top surface 9040 is exposed, not covered by the connecting pads 104. Subsequently, projections 30 are formed to extend the first light-emitting elements 101 to the thirteenth substrate 904. For example, the first light-emitting elements 101a, 101b, 101c are pushed away from the twelfth substrate 903 by the projections 30, and the first light-emitting elements 101a, 101b, 101c are then attached to the thirteenth substrate 904 to form a light-emitting device 4000, as shown in Fig. 4G is shown. Referring to Fig. In 4F, a laser is used to form the projections 30. In one embodiment, the twelfth substrate 903 has a transmittance of over 90% or a reflectivity of less than 10% with respect to the laser, so that the laser can pass through the twelfth substrate 903. The descriptions of the laser can be found in the preceding paragraphs. In one embodiment, a spacer is arranged between the twelfth substrate 903 and the thirteenth substrate 904 to prevent the first light-emitting elements 101 from coming into direct contact with the thirteenth substrate 904 before leaving the twelfth substrate 903. For the description of the spacer, reference is made to the preceding paragraphs as well as paragraphs that describe the Fig. 6A-6C correspond, and is omitted for the sake of brevity.

[0061] Referring to Fig. In 4G, the light-emitting device 4000 comprises the first light-emitting elements 101 (e.g., the first light-emitting elements 101a, 101b, 101c), the thirteenth substrate 904, the unit substrates 901a, 901b, 901c, and the connecting pads 104. The first light-emitting elements 101 are connected to the unit substrates 901a, 901b, and 901c. For example, the first light-emitting element 101a is connected to unit substrate 901a, the first light-emitting element 101b is connected to unit substrate 901b, and the first light-emitting element 101c is connected to unit substrate 901c. The unit substrate 901a has a top surface 90100a parallel to the thirteenth top surface 9040 and an inclined surface 90100b not parallel to the thirteenth top surface 9040.The light from the first light-emitting element 101 leaves the unit substrate 901a from the inclined surface 90100b to increase the luminous intensity and improve the uniformity of the light field provided by the light-emitting device 4000.

[0062] In one embodiment, conductive wires, active electronic elements and / or passive electronic elements are arranged on the thirteenth top surface 9040 and / or on the thirteenth bottom surface 9041. Referring to Fig. In 4G, for example, the first light-emitting elements 101a, 101b, 101c in the light-emitting device 4000 are electrically connected to the conductive wires (not shown) on the thirteenth top surface 9040. The light-emitting device 4000 can receive power and control signals through the conductive wires (not shown) to transmit the power and control signals to control the first light-emitting elements 101a, 101b, 101c together or separately. In one embodiment, the connection pads 104 on the thirteenth top surface 9040 are arranged at a predetermined distance, and the first light-emitting elements 101 are arranged on the connection pads 104 at the predetermined distance. Descriptions of the conductive wires, active electronic elements, and passive electronic elements can be found in the preceding paragraphs.

[0063] Furthermore, one or more spacing-adjusting substrates and associated processes can be integrated into the manufacturing process to change the distance between two adjacent first light-emitting elements 101 in the light-emitting device 4000. The spacing-adjusting substrate can be stretched in one or two dimensions to change the distance between the light-emitting elements arranged on it. For example, a first spacing-adjusting substrate and a corresponding process are used according to the one described in Fig. The process described in section 4E was carried out. Referring to Fig. 4E provides the first spacing-adjusting substrate to be attached to the first light-emitting element 101 from the side opposite the twelfth substrate 903. The twelfth substrate 903 is then removed, and the first light-emitting elements 101 and the corresponding unit substrates 901a, 901b, 901c are transferred from the twelfth substrate 903 to the first spacing-adjusting substrate, with the first light-emitting elements 101 in direct contact with the first spacing-adjusting substrate and the corresponding unit substrates 901a, 901b, 901c exposed. After the transfer of the first light-emitting elements 101 and the corresponding unit substrates 901a, 901b, 901c to the first spacing-adjusting substrate, the first spacing-adjusting substrate is stretched to increase the distance between two first light-emitting elements 101.The first spacing-adjusting substrate can be stretched in one or two dimensions, thus increasing the distance between two first light-emitting elements 101 in one or two dimensions. After stretching the first spacing-adjusting substrate, a second spacing-adjusting substrate is provided to transfer first light-emitting elements 101 by directly connecting the unit substrates 901a, 901b, 901c and the second spacing-adjusting substrate, and the first spacing-adjusting substrate is then removed.After transferring the first light-emitting elements 101 and the corresponding unit substrates 901a, 901b, 901c onto the second spacing-adjusting substrate, the second spacing-adjusting substrate is slid towards the thirteenth substrate 904 to connect the first light-emitting elements 101 and the thirteenth top surface 9040, and the second spacing-adjusting substrate is removed to form the light-emitting device 4000. The spacing-adjusting substrate can be a blue band and has an area that is the same as or different from that of the twelfth substrate 903. Furthermore, the substrate 201, 202, 203, 204, 701, 702, 702, 703, 704, 705, 902, 903, 904 can be stretched in one dimensional direction or in two dimensional directions to change the distance in one dimensional direction or the distances in two dimensional directions between the light-emitting elements arranged on it.

[0064] Referring to the in Fig. The process shown in 3A-3C can be incorporated into the process in Fig. 4A-4G, a relative position adjustment substrate for adjusting the relative position of the first light-emitting elements 101 on the thirteenth substrate 904 is integrated. For example, a relative position adjustment substrate is provided, and the first light-emitting elements 101 are in Fig. The first four electrodes are connected to the relative position setting substrate. Subsequently, the twelfth substrate 903 is removed to expose the unit substrates 901a, 901b, and 901c. The first light-emitting elements 101 and the unit substrates 901a, 901b, and 901c are then slid onto the thirteenth substrate 904. Therefore, the first light-emitting elements 101 are connected to the thirteenth substrate 904 via the unit substrates 901a, 901b, and 901c. Wires are then provided to connect the first and second electrode pads 120 and 121 and the connecting pads 104 to form a light-emitting device. In one embodiment, the relative position setting substrate is a blue ribbon.

[0065] The Fig. Figures 5A-5G show schematic views of the projection and the adhesive unit according to an embodiment of the present disclosure. Referring to Fig. 5A: Two projections 30A, 30B push the first light-emitting element 101 away from the intermediate layer 3, causing the first light-emitting element 101 to fly towards the adhesive unit 5. Referring to Fig. 5B push the projections 30 the first light-emitting elements 101a, 101b away from the intermediate layer 3, so that the first light-emitting elements 101a, 101b fly to the adhesive units 5a, 5b. Referring to Fig. 5C pushes the projections 30A, 30B, 30C the first light-emitting elements 101a, 101b away from the intermediate layer 3, causing the first light-emitting elements 101a, 101b to fly towards the adhesive units 5a, 5b. The first light-emitting element 101, which is pushed through the projection 30, can be bonded to different adhesive units 5. Referring to Fig. In step 5D, the first light-emitting element 101 is pushed through the projection 30 to the adhesive units 5a and 5b. The first electrode pad 120 of the first light-emitting element 101 is connected to the adhesive unit 5a, which covers the connecting pad 104a. The second electrode pad 121 of the first light-emitting element 101 is connected to the adhesive unit 5b, which covers the connecting pad 104b. Referring to Fig. At step 5E, the first light-emitting element 101 is pushed through the projections 30A, 30B to the adhesive units 5a, 5b. Referring to Fig. In step 5F, the first light-emitting element 101a is pushed through the projection 30 to the adhesive units 5a, 5b, and the first light-emitting element 101b is pushed through the projection 30 to the adhesive units 5c, 5d. Referring to Fig. In step 5G, the first light-emitting elements 101a, 101b are pushed through the projections 30A, 30B, 30C to the adhesive units 5a, 5b, 5c, 5d. In one embodiment, the projection 30 does not push the first light-emitting element 101 away from the intermediate layer 3, but can be pulled upwards so that the first light-emitting element 101 comes into direct contact with the adhesive unit 5. That is, the first light-emitting element 101 can be in contact with both the adhesive unit 5 and the projection 30 simultaneously during the transfer process.

[0066] The Fig. Figures 6A-6C show schematic views of the spacer and substrate according to an embodiment of the present disclosure. For clarity, only the substrate and the spacer are characterized, and the light-emitting element, the connecting section, and the adhesive unit are omitted. Fig. 6A-6C not specified. Referring to Fig. In 6A, the spacers 61a, 61b, 62a, 62b, 62b are positioned at the corners 202a, 202b, 202c, 202d of the second substrate 202. In one embodiment, the spacer can be placed at locations other than the corner of the substrate. Referring to Fig. In 6B, the spacers 63a, 63b, 63c, 63d are arranged near the edge faces 202ab, 202ac, 202cd, 202bd, and the spacers are not arranged at the corners 202a, 202b, 202c, 202d. In one embodiment, the spacer can be placed around the geometric center of the substrate. Referring to Fig. In a top view, spacers 64a, 64b, 64c, 64d surround the geometric center C of the second substrate 202. The arrangement of the spacers is not based on the one shown in the Fig. The patterns shown in 6A-6C are limited, and the patterns in the Fig. 6A-6C can be combined. For example, the patterns in the Fig. 6A, Fig. 6C combined, and the spacers can be arranged at the corners and around the geometric center of the substrate. Or the patterns in the Fig. 6A, Fig. 6B are combined and the spacers can be positioned at the corners and edges of the substrate. Or the patterns in the Fig. 6B, Fig. 6C are combined, and the spacers can be arranged around the geometric center of the substrate and the edge sections of the substrate.

[0067] The one in the Fig. The manufacturing process disclosed in 1A-1C, 2A-2C, 3A-3C, 4A-4G can be used to produce the products described in the Fig.The disclosed embodiment 5A-5G integrates this. That is, one or more projections 30 can be formed to move one or more first light-emitting elements 101 simultaneously in the manufacturing processes mentioned above. A single adhesive unit 5 can be formed to cover one or more connecting pads 104. A single first light-emitting element 101 can be connected to one or more adhesive units 5.

[0068] The following are examples: 1. A method for manufacturing a light-emitting device, comprising: providing a first substrate (201); forming a first adhesive unit (5) on the first substrate (201); forming a first light-emitting element (101) on the first substrate (201); providing a second substrate (202); forming a second light-emitting element (102) on the second substrate (202); forming a third light-emitting element (103) on the second substrate (202); and joining the second light-emitting element (102) to the first adhesive unit (5), wherein the third light-emitting element (103) overlaps the first light-emitting element (101) during the joining of the second light-emitting element (102) to the first adhesive unit (5). 2. The method according to the example, further comprising forming a bonding pad (104) on the first substrate, wherein the bonding pad is arranged between the first adhesive unit and the first substrate. 3. The method according to Example 1 or 2, further comprising forming a second adhesive unit on the first substrate, wherein the second adhesive unit is connected to the first light-emitting element. 4. The method according to Example 1, 2 or 3, further comprising forming an intermediate layer on the second substrate, wherein the intermediate layer is arranged between the second light-emitting element and the second substrate. 5. The method according to Example 4, wherein the intermediate layer is connected to the third light-emitting element. 6. The method according to Example 4 or 5, further comprising forming a projection on the intermediate layer for sliding the second light-emitting element to the first adhesive unit. 7. The method according to one of Examples 1, 2, 3 or 4, wherein the first light-emitting element emits light with a first peak wavelength and the second light-emitting element emits light with a second peak wavelength that is different from the first peak wavelength. 8. The method according to one of the preceding examples, further comprising forming a second adhesive unit on the first substrate. 9. The method according to one of the preceding examples, further comprising forming a spacer (62) between the first substrate and the second substrate. 10. The method according to any of the preceding examples, wherein the first adhesive unit comprises an insulating material and conductive particles. 11. Method for manufacturing a light-emitting device, comprising: providing a first substrate; forming a first adhesive unit on the first substrate; forming a first light-emitting element on the first substrate; providing a second substrate with an intermediate layer; forming a second light-emitting element on the second substrate; forming a first projection for sliding the second light-emitting element to the first substrate; and joining the second light-emitting element to the first adhesive unit. 12. The method according to Example 11, further comprising forming a bonding pad on the first substrate, wherein the bonding pad is covered by the first adhesive unit. 13. The method according to Example 11 or 12, further comprising forming a second adhesive unit on the first substrate. 14. The method according to Example 11, 12 or 13, further comprising forming a second projection for sliding the second light-emitting element towards the first substrate. 15. The method according to one of the preceding examples, further comprising forming a third light-emitting element on the second substrate. 16. The method according to Example 15, wherein the third light-emitting element is pushed through the first projection to the first substrate. 17. The method according to Example 15 or 16, further comprising forming a second projection for sliding the second light-emitting element and the third light-emitting element to the first substrate. 18. Method for manufacturing a light-emitting device, comprising: providing a first substrate; forming a first adhesive unit and a second adhesive unit on the first substrate; forming a first light-emitting element on the first substrate; providing a second substrate; forming a second light-emitting element on the second substrate; forming a first projection for sliding the second light-emitting element to the first substrate; and joining the second light-emitting element to the first adhesive unit and the second adhesive unit. 19. The method according to Example 18, further comprising forming a second projection for sliding the second light-emitting element to the first substrate. 20. The method according to Example 18 or 19, further comprising providing a first bonding pad and a second bonding pad on the first substrate, wherein the first bonding pad is covered by the first adhesive unit and the second bonding pad is covered by the second adhesive unit.

Claims

[1] Method for manufacturing a light-emitting device, comprising: - Providing a first substrate (201) with an intermediate layer (3); and a first light-emitting element (101) attached to the intermediate layer (3); - Providing a second substrate (202); and - Sliding the first light-emitting element (101) towards the second substrate (202) by means of at least two projections (30; 30A, 30B) formed on the intermediate layer (3), wherein, in a cross-sectional view, the at least two projections (30) overlap the first light-emitting element (101). [2] The method according to claim 1, wherein the second substrate (202) is provided with an adhesive unit (5) prior to sliding. [3] The method according to claim 1, wherein the first light-emitting element (101) is glued to the second substrate (202) after being slid. [4] The method according to claim 1, wherein together with the first light-emitting element (101) a second light-emitting element (102) is provided on the intermediate layer (3), wherein the second light-emitting element (102) remains on the first substrate (201) after being slid. [5] The method according to claim 4, wherein the second substrate (202) is provided together with a third light-emitting element (103) which overlaps with the second light-emitting element (102) during the sliding process. [6] The method according to claim 1, wherein the first substrate (201) is separated from the second substrate (202) by a distance which is more than twice as long as the height of the first light-emitting element (101) during the sliding. [7] The method according to claim 1, further comprising arranging a spacer (62) between the first substrate (201) and the second substrate (202). [8] The method according to claim 7, wherein the spacer (63a, 63b, 63c, 63d) is arranged on an edge (202ab, 202ac, 202bd, 202cd) of the second substrate (202). [9] The method according to claim 7, wherein the spacer (64a, 64b, 64c, 64d) is arranged around a geometric center (C) of the second substrate (202). [10] The method according to claim 1, wherein the first substrate (201) and an adhesive structure (50) are partially separated from each other after sliding.

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