Electronic devices with electrically isolated load electrodes and related manufacturing processes

Abstract

Electronic device comprising: a semiconductor chip (16); an encapsulation material (24), wherein the semiconductor chip (16) is at least partially encapsulated by the encapsulation material (24); an electrically insulating material (2); a first load electrode (4A) arranged on a first surface (6A) of the electrically insulating material (2); and a second load electrode (4B) arranged on a second surface (6B) of the electrically insulating material (2) opposite the first surface (6A), wherein the first load electrode (4A) and the second load electrode (4B) are electrically connected to the semiconductor chip (16) and protrude at least partially from the encapsulation material (24), wherein the load electrodes (4A, 4B) are separated by the electrically insulating material (2) over the entire length (l) on which the load electrodes (4A, 4B) have opposite sections, wherein surfaces (8A, 8B) of the load electrodes facing away from the electrically insulating material (2) are uncovered by the electrically insulating material (2), wherein the electrically insulating material (2), when viewed in a direction perpendicular to the first surface or the second surface, extends beyond at least one side surface of at least one of the load electrodes (4A, 4B).

Description

Technical area

[0001] The present disclosure relates to electronic devices in general. More particularly, the present disclosure relates to electronic devices having electrically isolated load electrodes. Furthermore, the present disclosure relates to methods for fabricating such electronic devices. background

[0002] Electronic devices such as semiconductor devices can be manufactured in the form of a package. For example, semiconductor packages can be soldered to a printed circuit board (PCB) using solder joints. Particularly in high-voltage applications, all electrical contacts of the electronic devices may require large clearances and large creepage distances, which can lead to an undesirable increase in parasitic commutation inductances. Manufacturers of electronic devices are constantly striving to improve their products and processes for their manufacture. Therefore, it may be desirable to develop electronic devices with improved performance and, in particular, with reduced parasitic inductances, as well as processes for manufacturing such electronic devices.

[0003] The document JP H06 - 260 583 A relates to a semiconductor package and in particular to connecting conductor structures. The document DE 10 2016 119 078 A1 relates to a carrier, a circuit, and a semiconductor device package. The document US 2016 / 0 365 296 A1 relates to electronic devices with increased creepage distances. The document US 2017 / 0 098 598 A1 relates to a functionalized interface structure. The document EP 2 447 986 A1 relates to a resin molding method for encapsulation and a device for electrical switching components. The document DE 10 2008 058 936 A1 relates to a connector part, a plug connection, a device, and a method for manufacturing a device. The document DE 102 57 100 A1 relates to a circuit breaker. The document DE 42 22 474 A1 relates to an assembly unit for multilayer hybrid with power components. Brief description

[0004] One aspect of the present disclosure relates to an electronic device comprising: a semiconductor chip; an encapsulation material, wherein the semiconductor chip is at least partially encapsulated by the encapsulation material; an electrically insulating material; a first load electrode disposed on a first surface of the electrically insulating material;and a second load electrode arranged on a second surface of the electrically insulating material opposite the first surface, wherein the first load electrode and the second load electrode are electrically connected to the semiconductor chip and protrude at least partially from the encapsulation material, wherein the load electrodes are separated by the electrically insulating material over the entire length on which the load electrodes have opposing portions, wherein surfaces of the load electrodes facing away from the electrically insulating material are uncovered by the electrically insulating material, wherein the electrically insulating material, when viewed in a direction perpendicular to the first surface or the second surface, extends beyond at least one side surface of at least one of the load electrodes;

[0005] Another aspect of the present disclosure relates to a method for manufacturing an electronic device, the method comprising: arranging a chip carrier in an encapsulation tool, wherein a first lead of the chip carrier is configured as a first load electrode of the electronic device to be manufactured and wherein a second lead of the chip carrier is configured as a second load electrode of the electronic device to be manufactured; pressing a surface of the first lead against a first surface of the encapsulation tool by a first retractable pin; pressing a surface of the second lead of the chip carrier against a second surface of the encapsulation tool by a second retractable pin;Encapsulating the chip carrier and the first and second leads by disposing an encapsulation material in the encapsulation tool, wherein the pressed surface of the first lead and the pressed surface of the second lead are uncovered by the encapsulation material after encapsulating the chip carrier and the first and second leads; and wherein the load electrodes are separated by the encapsulation material over the entire length on which the load electrodes have opposing portions, wherein the encapsulation material extends over at least one side surface of at least one of the load electrodes when viewed in a direction perpendicular to the first surface or the second surface, and wherein the encapsulation material is electrically insulating. Short description of the drawings

[0006] The accompanying drawings are included to provide a better understanding of aspects. The drawings illustrate aspects and, together with the description, serve to explain principles of aspects. Other aspects and many of the intended advantages of aspects will be readily appreciated as they become better understood from the following detailed description. Elements of the drawings are not necessarily to scale relative to one another. Like reference numerals may designate corresponding similar parts. Fig. 1 contains the Fig. 1A to 1C, which schematically illustrate cross-sectional views of an electronic device 100 according to the disclosure. Fig. 2 schematically illustrates a perspective view of an electronic device 200 according to the disclosure. Fig. 3 contains the Fig. 3A and Fig. 3B, which schematically illustrate perspective views of an electronic device 300 according to the disclosure. Fig. 4 contains the Fig. 4A and Fig. 4B, which schematically illustrate perspective views of an electronic device 400 according to the disclosure. Fig. 5 contains the Fig. 5A and Fig. 5B, which schematically illustrate perspective views of an electronic device 500 according to the disclosure. Fig. 6 contains the Fig. 6A and Fig. 6B, which schematically illustrate perspective views of an electronic device 600 according to the disclosure. Fig. 7 contains the Fig. 7A and Fig. 7B, schematically illustrating a top view and a cross-sectional side view of an electronic device 700 according to the disclosure. Fig. 8 contains the Fig. 8A and Fig. 8B, schematically illustrating a top view and a cross-sectional side view of an electronic device 800 according to the disclosure. Fig. 9 schematically illustrates a cross-sectional side view of a system including an electronic device 900 according to the disclosure mounted on a printed circuit board (PCB). Fig. 10 contains the Fig. 10A and Fig. 10B, which schematically illustrate perspective views of an electronic device 1000 according to the disclosure. Fig. 11 schematically illustrates a perspective view of an electronic device 1100 according to the disclosure. Fig. 12 illustrates a flowchart of a method of manufacturing an electronic device according to the disclosure. Fig. 13 contains the Fig. 13A to 13F, which schematically illustrate a cross-sectional side view of a method of manufacturing an electronic device according to the disclosure. Detailed description

[0007] In the following detailed description, reference is made to the accompanying drawings, in which, for the purpose of illustration, specific aspects in which the disclosure may be practiced are shown. In this context, directional terminology such as "top," "bottom," "front," "back," etc., may be used with reference to the orientation of the described figures. Since components of the described devices may be arranged in various orientations, the directional terminology may be used for the purpose of illustration and is in no way limiting. Other aspects may be utilized, and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.

[0008] Fig. 1 contains the Fig. 1A to 1C, which schematically illustrate cross-sectional views of an electronic device 100 according to the disclosure. Fig. 1B and Fig. 1C show the electronic device 100 of the Fig. 1A in the x- and y-direction. The electronic device 100 is generally illustrated to qualitatively describe aspects of the disclosure. The electronic device 100 may have further aspects that are not illustrated for simplicity. For example, the electronic device 100 may be expanded to include any of the aspects described in connection with other electronic devices and methods according to the disclosure. Comments related to the Fig. 1 may also apply to other electronic devices according to the disclosure.

[0009] The electronic device 100 may comprise an electrically insulating material 2. A first load electrode 4A may be arranged on a first surface 6A of the electrically insulating material 2. Furthermore, a second load electrode 4B may be arranged on a second surface 6B of the electrically insulating material 2 opposite the first surface 6A. The load electrodes 4A, 4B may be separated by the electrically insulating material 2 over the entire length 1, on which the load electrodes 4A, 4B have opposing sections. The surfaces 8A, 8B of the load electrodes 4A, 4B facing away from the electrically insulating material 2 may be uncovered by the electrically insulating material 2. The load electrodes 4A, 4B may be electrically connected to further components of the electronic device 100, which are not shown for the sake of simplicity.

[0010] The load electrodes 4A, 4B may extend in a substantially identical or parallel direction. In the example of Fig. 1, the load electrodes 4A, 4B can have different lengths l1, l2 and / or different widths w1, w2. In further examples, the load electrodes 4A, 4B can have the same length and / or the same width. In the illustrated example, the length l1 of the first load electrode 4A can correspond to the length l over which the load electrodes 4A, 4B have opposing sections. The load electrodes 4A, 4B can be separated by the electrically insulating material 2 by a distance d of less than about 2.0 mm, or less than about 1.0 mm, or less than about 0.5 mm, or less than about 0.4 mm, or less than about 0.3 mm, or less than about 0.2 mm, or less than about 0.1 mm, or even less than about 50 µm.

[0011] In conventional electronic devices, load electrodes of the devices may be separated by air, i.e., by air gaps. In this case, a clearance between the load electrodes may need to be above a minimum value. The clearance can be defined as the shortest distance through the air between two conductive elements. For example, a semiconductor package of a high-voltage class (e.g., 1200V) may require a clearance of approximately 4.5mm. In comparison, the clearance d of the electronic device 100 may have a reduced value. In a specific example, the required clearance can be reduced from approximately 4.5mm in a conventional device to a value of approximately 20µm if the electrically insulating material 2 consists of or comprises a polyimide.The reduced distance d may minimize an inductance of the electronic device 100 as well as an inductance of a system including the electronic device 100, for example, a circuit board with the electronic device 100 mounted thereon. In particular, parasitic inductances in commutation circuits of systems including electronic devices may be reduced according to the disclosure.

[0012] A creepage distance between the load electrodes 4A, 4B may extend along a surface of the electrically insulating material 2. A creepage distance may be defined as the shortest distance along the surface of a solid insulating material between two conductive parts. A creepage distance of the electronic device 100 may depend on the specific designs and dimensions of the electrically insulating material 2 and the load electrodes 4A, 4B. For example, a creepage distance may extend along paths formed in the Fig. 1A and Fig. 1B are shown as dashed lines.

[0013] When viewed in the y-direction (see e.g. Fig. 1C), the electrically insulating material 2 can extend over at least one side surface of at least one of the load electrodes 4A, 4B. In the example of Fig. 1, the electrically insulating material 2 can extend over both side surfaces of both load electrodes 4A, 4B. In a further example, the electrically insulating material 2 can extend over only one side surface of only one of the load electrodes 4A, 4B. In the example of Fig. 1, the electrically insulating material 2 does not necessarily have to cover or mechanically contact the respective side surface of the respective load electrode. In further examples, one or more of the side surfaces may be at least partially covered by the electrically insulating material 2. By extending the electrically insulating material 2 over one or more side surfaces of one or both load electrodes 4A, 4B, a creepage distance (see, for example, dashed line in the Fig. 1B) of the electronic device 100 can be enlarged.

[0014] When viewed in the y-direction (see e.g. Fig. 1A and Fig. 1C), the electrically insulating material 2 may extend over at least one of the end portions 10A, 10B of at least one of the load electrodes 4A, 4B. In the example of Fig. 1, the electrically insulating material 2 may extend over the end portion 10A of the load electrode 4A. In a further example, the electrically insulating material 2 may extend over the end portions 10A, 10B of both load electrodes 4A, 4B. In the example of Fig. 1, the electrically insulating material 2 does not necessarily have to cover or mechanically contact the side surface of the end section 10A. In further examples, the side surface of the end section 10A may be at least partially covered by the electrically insulating material 2. By extending the electrically insulating material 2 over one or both of the end sections 10A, 10B, a creepage distance (see, for example, dashed line in the Fig. 1A) of the electronic device 100 can be enlarged.

[0015] When viewed in the y-direction (see e.g. Fig. 1B and Fig. 1C), the load electrodes 4A, 4B can at least partially overlap. In the Fig. 1B, the width w2 of the second load electrode 4B may lie entirely within the width w1 of the first load electrode 4A. In further examples, the load electrodes 4A, 4B do not necessarily have to overlap when viewed in the y-direction. In this case, however, the electrically insulating material 2 may still provide electrical insulation between the load electrodes 4A, 4B.

[0016] The electrically insulating material 2 may comprise at least one of the following materials: dielectric circuit board material, ceramic material, polyimide, plastic, or epoxy. This means that the electrically insulating material 2 may be a solid material. Compared to conventional electronic devices with air gaps between the load electrodes, electronic devices according to the disclosure offer increased mechanical robustness of the load electrodes 4A, 4B due to the solid consistency of the electrically insulating material 2.

[0017] The electronic device 100 may be configured to operate with a maximum voltage of more than about 600V, or more than about 1200V, or even more than about 1700V. For example, high maximum voltages may have a value of about 2000V or even up to about 3.3kV. It is understood that electronic devices according to the disclosure and suitable for future applications may be configured to operate with even higher maximum voltages. It should be noted that an actual applied voltage during operation of the electronic device 100 may, for example, have a value that is about 30% to about 40% below the maximum voltage value. The electronic device 100 may be configured to operate with a frequency (or a switching frequency) of more than about 30kHz or more than about 100kHz.

[0018] For example, the electronic device 100 can be used in a high-voltage power module. In particular, semiconductor chips included in such high-voltage power modules can be made, for example, from a wide-bandgap semiconductor material or a compound semiconductor material (e.g., SiC, GaN, SiGe, GaAs). The electronic device 100 can be used in any type of power module, such as MOSFETs, half-bridge circuits, power modules with a gate driver, etc. The power modules can be used in automotive, consumer, and industrial applications. In particular, the power modules can be used in electromobility applications, such as charging stations, (electric) motor control circuits, etc.

[0019] Fig. Figure 2 schematically illustrates a perspective view of an electronic device 200 according to the disclosure. It should be noted that Fig. 2 shows a transparent view to illustrate an internal structure of the electronic device 200. The electronic device 200 may include a chip carrier, which may be formed, for example, by a leadframe. The leadframe may include a diepad 12 and a plurality of leads 14A to 14C. For example, one or more components of the leadframe may be made of metals and / or metal alloys, in particular copper, copper alloys, nickel, iron-nickel, aluminum, aluminum alloys, steel, stainless steel, etc. Furthermore, one or more of the components of the leadframe may be coated with at least one of the following metals or alloys thereof: tin, silver, gold, palladium, nickel.

[0020] A semiconductor chip 16 may be arranged on the die pad 12. For example, the semiconductor chip 16 may be a compound semiconductor chip, which may be made of, for example, SiC. In the example of the Fig. 2, the semiconductor chip 16 may include a transistor, such as a MOSFET, with a gate contact 18 and a source contact 20 arranged on the top side of the semiconductor chip 16 facing away from the diepad 12. Furthermore, the semiconductor chip 16 may include a drain contact (not shown) arranged on the bottom side of the semiconductor chip 16 facing the diepad 12. In another example, the semiconductor chip 16 may be or include a bipolar transistor having an emitter contact, a collector contact, and a base contact.

[0021] The source contact 20 of the semiconductor chip 16 may be electrically connected to the first connecting conductor 14A via a first electrical connecting element 22A. The first connecting conductor 14A may thus form a source load electrode 4A of the electronic device 200. An end portion of the first connecting conductor 14A, which is encapsulated by a molding material (or a molding compound) 24 of the electronic device 200, may be formed in an L-shape to increase a surface area to which the first electrical connecting element 22A can be connected. In the example of Fig. 2, the first electrical connection element 22A may be formed by a ribbon. In further examples, the first electrical connection element 22A may be formed by a bond wire or a clip.

[0022] The gate contact 18 of the semiconductor chip 16 may be electrically connected to the third connecting conductor 14C via a second electrical connecting element 22B. An end portion of the third connecting conductor 14C, which is encapsulated by the molding material 24, may have an enlarged surface to which the second electrical connecting element 22B may be connected. In the example of Fig. 2, the second electrical connection element 22B may be formed by a bonding wire. In further examples, the second electrical connection element 22B may be formed by a ribbon or a terminal. The third connection conductor 14C may thus form a gate electrode of the electronic device 200.

[0023] Diepad 12 and second lead 14B can be electrically connected and, for example, formed as a single piece. The drain electrode of semiconductor chip 16 can be electrically connected to second lead 14B via diepad 12. Second lead 14B can thus form a drain load electrode 4B of electronic device 200.

[0024] In the non-limiting example of Fig. 2, the electronic device 200 may, for example, comprise (exactly) three leads (or pins), namely a source lead, a gate lead, and a drain lead. In further examples, an electronic device according to the disclosure may comprise one or more further leads. These further leads may be configured to provide one or more sensing signals. The sensing signal(s) may be based on or depend on a physical parameter (or physical quantity or physical strength) of an electronic component included in the electronic device under consideration, for example, an integrated semiconductor chip. The sensing signal may thus represent or comprise information about a physical property of the electronic component that can be quantified by a measurement.For example, the sensing signal may correspond to one or more of a measured voltage, an electric current, a temperature, etc. In one example, an electronic device according to the disclosure may have (exactly) four terminal conductors (or pins), namely a source terminal conductor, a gate terminal conductor, a sense terminal conductor (or sense terminal conductor), and a drain terminal conductor. In another example, an electronic device according to the disclosure may have (exactly) five terminal conductors (or pins), namely a source terminal conductor, a gate terminal conductor, a first sense terminal conductor, a second sense terminal conductor, and a drain terminal conductor. In these two examples, the source terminal conductor, the gate terminal conductor, and the drain terminal conductor may be arranged as shown, for example, in FIG. Fig. 2. The sensing lead(s) may be arranged on the top and / or bottom of an electrically insulating material 2.

[0025] Similar to the Fig. 1, the load electrodes 4A, 4B may be arranged on the top and bottom of an electrically insulating material 2. Furthermore, the gate electrode 14C may be arranged on the top of the electrically insulating material 2. In the example of Fig. 2, the load electrodes 4A, 4B may at least partially overlap when viewed in a direction perpendicular to the top or bottom of the electrically insulating material 2. In the transparent view of the Fig. 2, the second load electrode 14B is visible, although it is arranged on the underside of the electrically insulating material 2. It should be noted that in a real view, the second load electrode 14B may be concealed behind an opaque electrically insulating material 2.

[0026] The semiconductor chip 16, the die pad 12 and the electrodes 14A to 14C may be at least partially encapsulated by the molding material 24. In the example of Fig. 2, the electrically insulating material 2 can be formed by the molding material 24 or be a part thereof. In this context, the electrically insulating material 2 and the molding material 24 can be formed as one piece. The molding material 24 can comprise at least one of the following materials: epoxy, filled epoxy, glass fiber-filled epoxy, imide, thermoplastic, thermosetting polymer, polymer blend. The electrodes 14A to 14C can protrude at least partially from the molding material 24, so that the electrical contacts of the semiconductor chip 16 can be electronically accessible from outside the package body. In the example of Fig. 2, the electrodes 14A to 14C may protrude from a single side surface of the molding material 24. In further examples of an electronic device according to the disclosure, the electrodes may protrude from multiple side surfaces of the molding material 24. In this context, the electrodes may protrude, for example, from two opposite side surfaces or from all four side surfaces of the molding material 24.

[0027] Fig. 3 contains the Fig. 3A and Fig. 3B, which schematically illustrate perspective views of an electronic device 300 according to the disclosure. The electronic device 300 may be similar to the electronic device 200 of the Fig. 2. In contrast to the Fig. 2 are the views of the Fig. 3 is not transparent, so that an internal structure of the electronic device 300 is not shown. The electrically insulating material 2 can be formed by the molding material 24 or can be a part thereof. The top side of the electrically insulating material 2 and the top side of the electrodes 14A, 14C can be arranged in a common plane, i.e., flush. Similarly, the bottom side of the electrically insulating material 2 can be flush with the bottom side of the electrode 14B. Furthermore, the bottom side of the molding material 24 can be flush with the bottom side of the diepad 12. The bottom side of the diepad 12 can be uncovered by the molding material 24, so that a heat sink (not shown) can be arranged over the uncovered surface. Thermal paste can be arranged between the exposed surface of the diepad 12 and the heat sink. During operation of the electronic device 300, heat, e.g.generated by the semiconductor chip 16, are dissipated on a path from the semiconductor chip 16 to the heat sink.

[0028] Fig. 4 contains the Fig. 4A and Fig. 4B, which schematically illustrate perspective views of an electronic device 400 according to the disclosure. Fig. Fig. 4B is a transparent view to illustrate an internal structure of the electronic device 400. In contrast to the Fig. 2 or Fig. 3, the electrically insulating material 2 and the molding material 24 of the Fig. 4 may be made of different materials and formed from two parts that may be mechanically connected. In one example, the electrically insulating material 2 may comprise or consist of a dielectric circuit board material, for example an epoxy material that may be filled with a glass fabric (e.g., FR-4). The electrically insulating material 2 with the electrodes 4A to 4C arranged thereon may extend at least partially into the molding material 24. In the example of Fig. 4, the electrodes 14A to 14C are shown with a linear shape. In further examples, the electrodes 14A to 14C may be formed as shown in Fig. 2 shown.

[0029] Fig. 5 contains the Fig. 5A and Fig. 5B, which schematically illustrate perspective views of an electronic device 500 according to the disclosure. Fig. 5B is a transparent view to illustrate an internal structure of the electronic device 500. The electronic device 500 may be at least partially similar to the electronic device 400 of the Fig. 4. Similar to the Fig. 4, the electrically insulating material 2 and the molding material 24 can be made of different materials and formed as two parts that can be mechanically connected. In the example of Fig. 5, the electrically insulating material 2 may comprise or be made from a ceramic material or a mixed material that primarily contains ceramic particles. The ceramic particles may comprise more than about 50 percent, or more than about 60 percent, or more than about 70 percent, or more than about 80 percent, or more than about 90 percent of the mixed material. For example, the mixed material may be epoxy-based. In contrast to Fig. 4, the electrodes 14A, 14B can be arranged closer to the side edges of the electrically insulating material 2.

[0030] Fig. 6 contains the Fig. 6A and Fig. 6B, which schematically illustrate perspective views of an electronic device 600 according to the disclosure. Fig. 6B is a transparent view to illustrate an internal structure of the electronic device 600. The electronic device 600 may be at least partially similar to the electronic device 500 of the Fig. 5. For example, the electrically insulating material 2 of the Fig. 6 the same as in the Fig. 4 or Fig. 5. In contrast to the Fig. 5, an end portion of the first connecting conductor 14A, which is encapsulated by the molding material 24, may be L-shaped in order to enlarge an area to which the first electrical connection element 22A may be connected. At least one trench 26 may be formed in a surface of the molding material 24. The at least one trench 26 may be configured to enlarge a creepage distance between electrically conductive components, in particular electrodes, of the electronic device 600. In the example of Fig. 6, a trench 26 may extend along an edge of the bottom side of the package body. The trench 26 may, for example, be configured to increase a creepage distance to the exposed surface of the die pad 12 arranged on the bottom side of the electronic device 600.

[0031] Fig. 7 contains the Fig. 7A and Fig. 7B, which schematically illustrate a top view and a cross-sectional side view of an electronic device 700 according to the disclosure. It should be noted that, for illustrative purposes, an optional molding material of the electronic device 700 is not shown. In the side view of the Fig. 7B, the gate electrode 14C may be hidden behind the load electrode 4A. Similarly, the first electrical connection element 22A may be hidden behind the second electrical connection elements 22B. In the example of Fig. 7, an electrical connection between the load electrode 4A and the source contact 20 of the semiconductor chip 16 can be established via several bond wires. In contrast to, for example, Fig. 2, the load electrodes 4A, 4B can be wide and flat to increase current carrying capacity and reduce effective parasitic inductance. In the top view of the Fig. 7A, the surface areas of the load electrodes 4A, 4B can be many times larger than the surface area of ​​the gate electrode 14C.

[0032] Fig. 8 contains the Fig. 8A and Fig. 8B, schematically illustrating a top view and a cross-sectional side view of an electronic device 800 according to the disclosure. Similar to Fig. 7, an optional molding material of the electronic device 800 is not shown, and in the side view of the Fig. 8B, some components may be hidden behind other components. At least one of the load electrodes 4A, 4B may be comb-shaped. In particular, each of the load electrodes 4A, 4B may be formed by any number of connecting conductors of a lead frame. In this context, the number of connecting conductors forming the source load electrode 4A and the number of connecting conductors forming the drain load electrode 4B may be the same or different. In the example of Fig. 8, the source load electrode 4A and the drain load electrode 4B can each be formed by four connecting conductors. Furthermore, a width of the connecting conductors forming the source load electrode 4A can be less than or equal to a width of the connecting conductors forming the drain load electrode 4B. In the example of Fig. 8, the connecting conductor 14C forming the gate electrode may be arranged between the connecting conductors of the load electrodes 4A, 4B. In further examples, the position of the connecting conductor forming the gate electrode 14C may be interchanged with a position of one of the connecting conductors forming the load electrodes 4A, 4B.

[0033] Fig. 9 schematically illustrates a cross-sectional side view of a system including an electronic device 900 according to the disclosure. The electronic device 900 may be mounted on a printed circuit board (PCB) 28. The printed circuit board 28 may or may not be considered part of the electronic device 900. The electronic device 900 may be electrically and mechanically connected to the printed circuit board 28 by any suitable technique. In particular, the electronic device 900 may be soldered to the printed circuit board 28. The electrodes 4A, 4B of the electronic device 900 may be inserted into a through-hole of the printed circuit board 28 and secured to the printed circuit board 28 with a solder material 32. The package body 24 of the mounted electronic device 900 and the solder material 32 may be disposed on opposite surfaces of the printed circuit board 28.The circuit board 28 may have a first metallization 30A and a second metallization 30B. The source load electrode 4A and the drain load electrode 4B may be in contact with the first metallization 30A and the second metallization 30B, respectively, and may be electrically connected.

[0034] Fig. 10 contains the Fig. 10A and Fig. 10B, which schematically illustrate perspective views of an electronic device 1000 according to the disclosure. The electronic device 1000 may be similar to the electronic device 300 of the Fig. 3. In contrast to the Fig. 3, the electrodes 14A to 14C or portions thereof may be substantially perpendicular to the diepad 12. Generally, the electrodes 14A to 14C and the diepad 12 may form an angle of more than about 70 degrees, or more than about 80 degrees, or more than about 85 degrees. In the example of Fig. 10, the electrodes 14A to 14C and the electrically insulating material 2 may be curved or extend in a direction away from the exposed bottom surface of the diepad 12. Thus, when the electronic device 1000 is mounted on a circuit board, the exposed bottom surface of the diepad 12 may face away from the circuit board so that a heat sink may be arranged over the exposed surface for cooling purposes. In another example, the electrodes 14A to 14C and the electrically insulating material 2 may be curved or extend in the opposite direction so that the exposed bottom surface of the diepad 12 may face the circuit board when mounted thereon. In this case, the exposed bottom surface may be in contact with the circuit board so that the electronic device 1000 may be cooled via the circuit board.

[0035] Fig. Figure 11 schematically illustrates a perspective view of an electronic device 1100 according to the disclosure. The electronic device 1100 may be similar to the electronic device 1000 of the Fig. 10. In contrast to the Fig. 10, one or more holes or recesses 34 may extend into the molding material 24 of the electronic device 1100. For example, the holes 34 may be formed by the use of retractable pins (not shown) during the manufacture of the electronic device 1100. In particular, the holes 34 may be designed to prevent or reduce flashing of the molding material 24. An exemplary method for manufacturing an electronic device according to the disclosure with an optional use of retractable pins is described in connection with the Fig. 12 and Fig. 13 discussed.

[0036] Fig. 12 illustrates a flowchart of a method of manufacturing an electronic device according to the disclosure. The method is described generally to qualitatively describe aspects of the disclosure. The method of Fig. 12 may have further aspects. For example, the procedure of Fig. 12 to any of the information relating to the procedure of Fig. 13 aspects described.

[0037] At 46, a chip carrier is placed in an encapsulation tool, wherein a first lead of the chip carrier is configured as a contact electrode of the manufactured electronic device. At 48, a surface of the first lead is pressed against a first surface of the encapsulation tool by a first retractable pin. At 50, the chip carrier and the first lead are encapsulated by placing an encapsulation material in the encapsulation tool, wherein the surface of the first lead is uncovered by the encapsulation material after encapsulation of the chip carrier and the first lead.In an optional further action (not shown), a surface of a second lead of the chip carrier may be pressed against a second surface of the encapsulation tool by a second retractable pin, wherein the surface of the second lead is uncovered by the encapsulation material after encapsulating the chip carrier and the second lead.

[0038] Fig. 13 contains the Fig. 13A to 13F, which schematically illustrate a cross-sectional side view of a method of manufacturing an electronic device according to the disclosure. The method of Fig. 13 can be seen as a more detailed version of the procedure of Fig. 12 can be viewed.

[0039] In the Fig. 13A, a chip carrier may be provided with a die pad 12 and one or more connecting leads 14. For example, the chip carrier may be a lead frame made of a metal and / or a metal alloy. Due to the perspective of the Fig. 13A, further connecting conductors may be concealed behind the illustrated connecting conductor 14. A semiconductor chip may be arranged above the die pad 12, wherein the semiconductor chip may be electrically connected to the connecting conductor 14 via one or more electrical connecting elements. For the sake of simplicity, such further components are not shown in the example of Fig. 13 is not shown. Exemplary arrangements with a semiconductor chip and electrical connecting elements are described in connection with the preceding figures. The connecting conductor 14 can be designed as a contact electrode, in particular as a load electrode, of the electronic device to be manufactured.

[0040] In the Fig. 13B, the die pad 12 and the lead 14 may be arranged in an encapsulation tool 36. For example, the encapsulation tool 36 may be a molding tool designed for use in a molding process. The shape of the encapsulation tool 36 may correspond to a shape of an encapsulation material or a package body of the electronic device to be manufactured. For example, the shape of the encapsulation tool 36 in the Fig. 13 may be similar to the shape of the molding material 24 of electronic devices described in connection with previous figures. In the example of Fig. 13B, the connecting conductor 14 and the die pad 12 can be arranged on the (inner) surfaces 38 and 40 of the encapsulation tool 36.

[0041] In the Fig. 13C, the top side of the connecting conductor 14 can be pressed against the surface 38 of the encapsulation tool 36 by one or more retractable pins 42. In the example of Fig. 13C, multiple (e.g., two) retractable pins 42 may be used to provide uniform and increased contact between the top surface of the lead 14 and the surface 38 of the encapsulation tool 36.

[0042] In the Fig. 13D, the cavity of the encapsulation tool 36 may be filled with an encapsulation material, such as a molding material (or molding compound) 24. For example, a transfer molding process may be used to at least partially encapsulate the lead 14, the die pad 12, and other components (not shown) that may be arranged in the encapsulation tool 36. Due to the contact between the top surface of the lead 14 and the inner surface of the encapsulation tool 36, the top surface of the lead 14 may remain uncovered by the molding material 24.

[0043] In the Fig. 13E, the retractable pins 42 can be at least partially retracted or pushed back downward (see arrows), whereby cavities 44 can be formed between the retractable pins 42 and the lead 14. The contact between the top of the lead 14 and the inner surface 38 of the encapsulation tool 36 can be provided by the molding material 24.

[0044] In the Fig. 13F, the cavities 44 may be filled with molding material 24 during the application of a final pressure. In further optional actions (not shown), the molding material 24 may be cured, the packaged electronic device may be ejected from the cavity of the encapsulation tool 36 by an ejection pin, and / or the retractable pin(s) 42 may be (completely) removed. After ejecting the packaged electronic device from the cavity, the top surface of the lead 14 may be uncovered by the molding material 24.

[0045] In the example of Fig.13, the top surface of the lead 14 can be pressed against the top surface of the inner surface of the encapsulation tool 36, so that the top surface of the lead 14 can be uncovered by the molding material 24 after the molding process. Furthermore, a surface of a second lead (not shown) can be pressed against a second (inner) surface of the encapsulation tool 36 with one or more second retractable pins (not shown). In particular, a bottom surface of the second lead can be pressed against a lower inner surface of the encapsulation tool 36, so that the bottom surface of the second lead can be uncovered by the molding material 24 after the molding process.In this way, electronic devices according to the disclosure as described in connection with previous figures can be manufactured, wherein load electrodes are separated by the molding material 24 over the entire length on which the load electrodes have opposing portions, and wherein surfaces of the load electrodes facing away from the molding material 24 are uncovered by the molding material 24. Examples

[0046] In the following, electronic devices with electrically isolated load electrodes are explained using examples.

[0047] Example 1 is an electronic device comprising: an electrically insulating material; a first load electrode disposed on a first surface of the electrically insulating material; and a second load electrode disposed on a second surface of the electrically insulating material opposite the first surface, wherein the load electrodes are separated by the electrically insulating material over the entire length on which the load electrodes have opposing portions, wherein surfaces of the load electrodes facing away from the electrically insulating material are uncovered by the electrically insulating material.

[0048] Example 2 is an electronic device according to Example 1, wherein the load electrodes are separated by the electrically insulating material by a distance of less than 2.0 mm.

[0049] Example 3 is an electronic device according to Example 1 or 2, wherein the electrically insulating material extends over at least one side surface of at least one of the load electrodes when viewed in a direction perpendicular to the first surface or the second surface.

[0050] Example 4 is an electronic device according to any one of the preceding examples, wherein the electrically insulating material extends over at least one end portion of at least one of the load electrodes when viewed in a direction perpendicular to the first surface or the second surface.

[0051] Example 5 is an electronic device according to any one of the preceding examples, wherein the load electrodes at least partially overlap when viewed in a direction perpendicular to the first surface or the second surface.

[0052] Example 6 is an electronic device according to any one of the preceding examples, wherein a surface of the electrically insulating material and at least one of the uncovered surfaces of the load electrodes are arranged in a common plane.

[0053] Example 7 is an electronic device according to any one of the preceding examples, further comprising: a chip carrier comprising a diepad and a plurality of leads, wherein the load electrodes are formed by the leads of the chip carrier; and a semiconductor chip arranged on the diepad, wherein the load electrodes are electrically connected to the semiconductor chip.

[0054] Example 8 is an electronic device according to Example 7, wherein at least one of the load electrodes and the diepad form an angle of more than 70 degrees.

[0055] Example 9 is an electronic device according to example 7 or 8, further comprising: a molding material, wherein the semiconductor chip and the chip carrier are at least partially encapsulated by the molding material, wherein the electrically insulating material is formed by the molding material.

[0056] Example 10 is an electronic device according to Example 9, wherein the molding material comprises at least one of the following materials: epoxy, filled epoxy, glass fiber filled epoxy, imide, thermoplastic, thermosetting polymer, polymer blend.

[0057] Example 11 is an electronic device according to example 9 or 10, further comprising: at least one trench formed in a surface of the molding material, wherein the at least one trench is configured to increase a creepage distance between electrodes of the electronic device.

[0058] Example 12 is an electronic device according to any one of Examples 1 to 8, wherein the electrically insulating material comprises at least one of the following materials: dielectric circuit material, ceramic material, polyimide, plastic, epoxy.

[0059] Example 13 is an electronic device according to any one of the preceding examples, wherein at least one of the load electrodes is comb-shaped.

[0060] Example 14 is an electronic device according to any one of the preceding examples, wherein at least one of the load electrodes is coated with at least one of the following metals or alloys thereof: tin, silver, gold, palladium, nickel.

[0061] Example 15 is an electronic device according to any one of the preceding examples, wherein the electronic device is configured to operate at a frequency greater than 30 kHz.

[0062] Example 16 is an electronic device according to any one of the preceding examples, wherein the electronic device is configured to operate at a maximum voltage of more than 600V.

[0063] Example 17 is an electronic device according to any one of Examples 7 to 16, wherein: the semiconductor chip comprises a transistor, and the load electrodes form a drain and a source of the transistor or form an emitter and a collector of the transistor.

[0064] Example 18 is an electronic device according to any of the preceding examples, further comprising: a circuit board, wherein the electronic device is electrically and mechanically connected to the circuit board.

[0065] Example 19 is a method of manufacturing an electronic device, the method comprising: disposing a chip carrier in an encapsulation tool, wherein a first lead of the chip carrier is configured as a contact electrode of the manufactured electronic device; pressing a surface of the first lead against a first surface of the encapsulation tool by a first retractable pin; and encapsulating the chip carrier and the first lead by disposing an encapsulation material in the encapsulation tool, wherein the surface of the first lead is uncovered by the encapsulation material after encapsulating the chip carrier and the first lead.

[0066] Example 20 is a method according to Example 19, further comprising: pressing a surface of a second lead of the chip carrier against a second surface of the encapsulation tool by a second retractable pin, wherein the surface of the second lead is uncovered by the encapsulation material after encapsulating the chip carrier and the second lead.

[0067] As used in this description, the terms "connected," "coupled," "electrically connected," and / or "electrically coupled" do not necessarily imply that elements must be directly connected or coupled to each other. Intermediate elements may be provided between the "connected," "coupled," "electrically connected," or "electrically coupled" elements.

[0068] Furthermore, the words "over" or "on", used in relation to, for example, a material layer formed or arranged "over" or "on" a surface of an object, may be used herein to mean that the material layer may be arranged "directly on", e.g., in direct contact with the implied surface (e.g., formed, deposited, etc.). The words "over" or "on", used in relation to, for example, a material layer formed or arranged "over" or "on" a surface, may also be used herein to mean that the material layer may be arranged "indirectly" on the implied surface (e.g., formed, deposited, etc.), e.g., with one or more additional layers arranged between the implied surface and the material layer.

[0069] To the extent the terms "having," "including," "comprising," "with," or variations thereof are used in either the detailed description or the claims, these terms are intended to be inclusive in a similar manner to the term "comprising." That is, as used herein, the terms "having," "including," "comprising," "with," "comprising," and the like are open-ended terms that indicate the presence of specified elements or features, but do not preclude additional elements or features.

[0070] Furthermore, the word "exemplary" is used herein to serve as an example, instance, or illustration. Any aspect or design described herein as "exemplary" should not necessarily be interpreted as being advantageous over other aspects or designs. Rather, the use of the word exemplary is intended to concretely illustrate concepts.

[0071] Devices and methods for manufacturing devices are described herein. Statements made in connection with a described device may also apply to a corresponding method, and vice versa. For example, if a specific component of a device is described, a corresponding method for manufacturing the device may include an act of providing the component in a suitable manner, even if this act is not explicitly described or illustrated in the figures.

Claims

[1] Electronic device comprising: a semiconductor chip (16); an encapsulation material (24), wherein the semiconductor chip (16) is at least partially encapsulated by the encapsulation material (24); an electrically insulating material (2); a first load electrode (4A) arranged on a first surface (6A) of the electrically insulating material (2); and a second load electrode (4B) arranged on a second surface (6B) of the electrically insulating material (2) opposite the first surface (6A), wherein the first load electrode (4A) and the second load electrode (4B) are electrically connected to the semiconductor chip (16) and protrude at least partially from the encapsulation material (24), wherein the load electrodes (4A, 4B) are separated by the electrically insulating material (2) over the entire length (l) on which the load electrodes (4A, 4B) have opposite sections, wherein surfaces (8A, 8B) of the load electrodes facing away from the electrically insulating material (2) are uncovered by the electrically insulating material (2), wherein the electrically insulating material (2), when viewed in a direction perpendicular to the first surface or the second surface, extends beyond at least one side surface of at least one of the load electrodes (4A, 4B). [2] An electronic device according to claim 1, wherein the load electrodes (4A, 4B) are separated by the electrically insulating material (2) by a distance of less than 2.0 mm. [3] An electronic device according to any one of the preceding claims, wherein the electrically insulating material (2), when viewed in a direction perpendicular to the first surface or the second surface, extends over at least one end portion of at least one of the load electrodes (4A, 4B). [4] An electronic device according to any one of the preceding claims, wherein the load electrodes (4A, 4B) at least partially overlap when viewed in a direction perpendicular to the first surface or the second surface. [5] Electronic device according to one of the preceding claims, wherein a surface of the electrically insulating material (2) and at least one of the uncovered surfaces of the load electrodes are arranged in a common plane. [6] Electronic device according to one of the preceding claims, further comprising: a chip carrier comprising a diepad (12) and a plurality of connecting conductors (14A, 14B, 14C), wherein the load electrodes (4A, 4B) are formed by the connecting conductors (14A, 14B) of the chip carrier, and wherein the semiconductor chip (16) is arranged on the diepad (12). [7] The electronic device according to claim 6, wherein at least one of the load electrodes (4A, 4B) and the die pad (12) form an angle of more than 70 degrees. [8] Electronic device according to one of the preceding claims, wherein the encapsulation material (24) and the electrically insulating material (2) are the same material. [9] Electronic device according to one of the preceding claims, wherein the encapsulation material (24) comprises at least one of the following materials: epoxy, filled epoxy, glass fiber filled epoxy, imide, thermoplastic, thermosetting polymer, polymer blend. [10] Electronic device according to one of the preceding claims, further comprising: at least one trench (26) formed in a surface of the encapsulation material (24), wherein the at least one trench (26) is configured to increase a creepage distance between the electrodes of the electronic device. [11] Electronic device according to one of claims 1 to 7, wherein the electrically insulating material (2) comprises at least one of the following materials: dielectric circuit board material, ceramic material, polyimide, plastic, epoxy. [12] Electronic device according to one of the preceding claims, wherein at least one of the load electrodes (4A, 4B) is comb-shaped. [13] Electronic device according to one of the preceding claims, wherein at least one of the load electrodes (4A, 4B) is coated with at least one of the following metals or alloys thereof: tin, silver, gold, palladium, nickel. [14] An electronic device according to any preceding claim, wherein the electronic device is adapted to operate at a frequency of more than 30 kHz. [15] Electronic device according to one of the preceding claims, wherein: the semiconductor chip (16) comprises a transistor, and the load electrodes (4A, 4B) form a drain and a source of the transistor or form an emitter and a collector of the transistor. [16] A method of manufacturing an electronic device, the method comprising: Arranging a chip carrier in an encapsulation tool, wherein a first connection conductor of the chip carrier is designed as a first load electrode (4A) of the electronic device to be manufactured and wherein a second connection conductor of the chip carrier is designed as a second load electrode (4B) of the electronic device to be manufactured; pressing a surface (8A) of the first lead against a first surface of the encapsulation tool by a first retractable pin; pressing a surface (8B) of the second lead of the chip carrier against a second surface of the encapsulation tool by a second retractable pin; Encapsulating the chip carrier and the first and second leads by arranging an encapsulation material in the encapsulation tool, wherein the pressed surface (8A) of the first lead and the pressed surface (8B) of the second lead are uncovered by the encapsulation material after encapsulating the chip carrier and the first and second leads; and wherein the load electrodes (4A, 4B) are separated by the encapsulation material over the entire length (l) on which the load electrodes (4A, 4B) have opposing sections, wherein the encapsulation material, when viewed in a direction perpendicular to the first surface or the second surface, extends over at least one side surface of at least one of the load electrodes (4A, 4B), and wherein the encapsulation material is electrically insulating.

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