Vehicle electronics assembly device with combinable electronic assemblies

Abstract

Vehicle electronics assembly device (1000) comprising: a first vehicle electronics assembly (100a) for a first printed circuit board (1a) carrying at least one first electronic component (2a) on the top and / or bottom side, which essentially extends in a first plane, wherein the first vehicle electronics assembly (100a) has a plate-like first cooling element (4a) extending at least partially in a second plane arranged parallel above the first plane; characterized by the fact that the vehicle electronics assembly device (1000) comprises a second vehicle electronics assembly (100b) identically designed to the first vehicle electronics assembly (100a), wherein the second The vehicle electronics assembly (100b) is arranged in a first position, rotated essentially by 180° about a longitudinal axis (X) of the vehicle electronics assembly device (1000) relative to the first vehicle electronics assembly (100a), parallel below the first plane.

Description

[0001] The invention relates to a vehicle electronics assembly comprising a first electronics assembly section and a second electronics assembly section and an integrated cooling device, according to the preamble of claim 1.

[0002] Due to the increasing miniaturization and performance of electronic components, more unwanted heat is generated, making efficient thermal management a crucial factor. Various cooling system options are available, differing in performance, cost, and application.

[0003] The heat generated by electronic components is a physical phenomenon and cannot be avoided; the heat to which the components are exposed significantly affects their function.

[0004] Electronic components mounted on printed circuit boards (PCBs) are typically cooled by direct thermal contact with a heat sink to dissipate heat generated during operation away from the PCB. For PCBs with electronic components on both sides, effective heat dissipation, according to current technology, can only be achieved by separately thermally contacting the components on the top and bottom surfaces, i.e., by installing heat sinks on both sides of the PCB. The disadvantage of this approach is that both sides of the PCB, and thus both the electronic assemblies mounted on them, must be equipped with a corresponding heat sink, resulting in increased space and material requirements.Furthermore, the arrangement of cooling elements on both sides of a printed circuit board significantly complicates the integration of multiple printed circuit boards with an effective, space-saving, and adaptable cooling system. Such electronic assemblies or cooling devices are known from the following patent applications: DE 10 2017 002 601 A1, US 8 867 210 B2, DE 20 2014 104 445 U1, DE 10 2016 109 078 A1, US 2018 / 0 092 255 A1, WO 2013 / 009 982 A1, US 2006 / 0 181 859 A1, and EP 3 457 824 A1.

[0005] Especially in vehicle manufacturing, the problem arises that the sheer number of different components that need to be arranged in or on the vehicle leaves very little available installation space. This is particularly relevant with regard to autonomous driving, as this requires a high degree of redundancy in both electronic components and cooling systems to reduce potential safety risks from system failures.

[0006] It is therefore an object of the present invention to provide a vehicle electronics assembly device by means of which the disadvantages of the prior art can be overcome.

[0007] The object of the invention is solved by a vehicle electronics assembly device comprising: A first vehicle electronics assembly for a first printed circuit board carrying at least one first electronic component on its upper and / or lower surface, which extends substantially in a first plane, wherein the first vehicle electronics assembly has a plate-like first cooling element extending at least partially in a second plane arranged parallel to the first plane above it, wherein the vehicle electronics assembly device comprises a second vehicle electronics assembly identically designed to the first vehicle electronics assembly, wherein the second vehicle electronics assembly is arranged in a first position, rotated substantially by 180° about a longitudinal axis of the vehicle electronics assembly device relative to the first vehicle electronics assembly, parallel to the first plane below it.

[0008] Furthermore, the problem is solved by a vehicle electronics assembly device comprising a first vehicle electronics assembly for a first printed circuit board which carries at least one first electronic component on its upper surface and at least one second electronic component on its lower surface and which extends substantially in a first plane, wherein the first vehicle electronics assembly has a plate-like first cooling element which extends at least partially in a second plane arranged parallel to the first plane above it, wherein the vehicle electronics assembly device comprises a second vehicle electronics assembly which is identical in design to the first vehicle electronics assembly, wherein the second vehicle electronics assembly is arranged in a second position in a second position, rotated substantially by 180° about a longitudinal axis (X) of the vehicle electronics assembly device relative to the first vehicle electronics assembly, and is arranged parallel to the second plane above it.wherein a third cooling device is formed which contacts the first vehicle electronics assembly on the top side and the second vehicle electronics assembly on the underside, wherein a cooling medium is passed through the third cooling device between the first and a third cooling element, contacting a top side of the first cooling element and a bottom side of the third cooling element, wherein a bottom side of the first cooling element facing the first circuit board has at least a first area which thermally contacts the first electronic component on the top side and at least a second area which thermally contacts the first circuit board on the top side,wherein the second electronic component is arranged opposite the at least one second area on the underside of the first printed circuit board and the at least one first area is arranged offset upwards in a vertical axis relative to the at least one second area and the first and the second area extend substantially along a longitudinal (X) and width (Y) axis, wherein the first and the second area of ​​the first cooling element is adapted to an extension of the at least one first and the at least one second electronic component in the vertical (Z), width (Y) and / or longitudinal (X) axis and to their positioning.

[0009] The vehicle electronics assembly extends along a vertical axis Z, a horizontal axis Y, and a longitudinal axis X, with each axis corresponding to two directions. The vertical axis Z comprises directions Z1 (upwards) and Z2 (downwards). The horizontal axis Y comprises directions Y1 (to the right) and Y2 (to the left). The longitudinal axis X comprises directions X1 (forwards) and X2 (backwards).

[0010] The planes one to eight each preferably extend along the longitudinal axis and the latitude axis essentially parallel to each other, with the planes arranged above or below each other along the vertical axis.

[0011] The term "essentially" should be interpreted to include even minor tolerance deviations. Thus, the deviation can be an angle of preferably less than 10°, more preferably less than 7.5°, and even more preferably less than 5°. This also applies to the terms "essentially" used in the following text.

[0012] According to the invention, a vehicle electronics assembly is understood to be an electronics assembly that is arranged in and / or on a vehicle, wherein the electronics assembly is required for the operation of the vehicle and / or vehicle components. A vehicle within the meaning of the invention is any vehicle that has and / or requires an electronics assembly, and may be a land, water, and / or air vehicle. A vehicle electronics assembly device is to be a common arrangement of at least two vehicle electronics assemblies, wherein a common arrangement is understood to be, in particular, a spatially close arrangement and, more preferably, a connected arrangement of at least two vehicle electronics assemblies.Individual vehicle electronics assemblies can preferably be used individually and connected to each other as needed, especially mechanically, which allows, for example, a particularly space-saving arrangement or the use of a common cooling device.

[0013] Preferably, the descriptions of the first vehicle electronics assembly, or of its elements and / or features, shall apply mutatis mutandis to the identically designed second vehicle electronics assembly. Preferably, the first and second vehicle electronics assemblies are designed to be identical.

[0014] Preferably, the second vehicle electronics assembly has a second printed circuit board for a top and / or bottom surface carrying at least one third electronic component, which extends substantially in a fifth plane, wherein the second vehicle electronics assembly has a plate-like third cooling element extending at least partially in a sixth plane arranged parallel below the fifth plane.

[0015] Preferably, the first and second vehicle electronics assemblies are arranged adjacent to one another and are particularly preferably mechanically connected. Particularly preferably, the first vehicle electronics assembly is arranged in the first position along the vertical axis above the second vehicle electronics assembly. More preferably, in the second position, the first vehicle electronics assembly is arranged along the vertical axis below the second vehicle electronics assembly.

[0016] An electronic component is any electronic or electrical component used in electronic circuits, such as transistors, diodes, resistors, capacitors, inductors, or similar devices. Furthermore, an electronic component can also refer to any type of integrated circuit (chip). Basically, any electronic or electrical component that is mounted on a printed circuit board (PCB) using state-of-the-art technology is considered an electronic component. This list is not exhaustive.

[0017] A plate-like element is understood here to be an element that essentially extends in a plane. For example, a plane can extend along the altitude and latitude axes, the altitude and longitude axes, or the longitude and latitude axes.

[0018] Due to the arrangement of the first and second vehicle electronics assemblies according to the invention, which is essentially rotated by 180° and in which the position of the second vehicle electronics assembly is possible in either the first or the second position, the vehicle electronics assembly device can be very easily adapted to a necessary or desired cooling concept without having to make extensive modifications to the components. Thus, only the arrangement of the first and second vehicle electronics assemblies relative to each other needs to be changed to implement a different cooling concept. Furthermore, the circuit boards or electronic components, which are spatially adjacent in this way, can be cooled independently or together. Moreover, the space requirement can be reduced because one side of the circuit board remains unused due to the cooling elements being located only on one side.

[0019] According to a preferred embodiment, in the first position, a first cooling device is provided, contacting the top of the first vehicle electronics assembly, and a second cooling device is provided, contacting the underside of the second vehicle electronics assembly. In this way, the vehicle electronics assembly, or the first and second vehicle electronics assemblies, or the first and second circuit boards, or the at least one first electronic component and the at least one third electronic component, can be cooled / dissipated by two cooling devices, with heat being dissipated from the top side of the first cooling element by means of the first cooling device and heat being dissipated from the underside of the third cooling element by means of the second cooling device. Preferably, the first circuit board and the second circuit board are arranged opposite each other in the first position with respect to their sides facing away from the cooling element.Preferably, the underside of the first printed circuit board and the top side of the second printed circuit board are arranged facing each other. Such an arrangement is made possible by the one-sided cooling of the printed circuit boards and ensures a particularly space-saving arrangement. Preferably, the first cooling element is cooled / dissipated from the top by the first cooling device and from the bottom by the second cooling device, or each is contacted with a cooling medium.

[0020] Preferably, the first and second cooling units are designed independently of each other, meaning that a failure of one cooling unit does not affect the other. This arrangement is particularly relevant for redundant systems, e.g., in autonomous vehicles, since especially high demands are placed on the functionality of the electronic assemblies or components, even if one cooling unit should fail.

[0021] According to a preferred embodiment, a third cooling device is provided in the second position, contacting the first vehicle electronics assembly on its underside and the second vehicle electronics assembly on its upper side. This preferred arrangement of a third cooling device between the first and second vehicle electronics assemblies allows both assemblies to be cooled with a single cooling device in the second position. This saves on installation space and requires only the components of one cooling device. Preferably, the third cooling device cools / dissipates the first cooling element on its upper side and the third cooling element on its underside, or contacts it with a cooling medium.

[0022] Preferably, the first, second and third cooling device is a gas or liquid cooling system, which uses either a gaseous or liquid cooling medium.

[0023] According to a preferred embodiment, the first vehicle electronics assembly has a plate-like second cooling element that extends at least partially into a third plane arranged parallel above the second plane when the second vehicle electronics assembly is in the first position. Preferably, the first and second cooling elements are mechanically connected to each other, with the connection being, for example, by means of a screw connection, a rivet connection, a bolt connection, a plug connection, a weld connection, an adhesive connection, or the like. The second cooling element allows the top of the first cooling element to be covered, thereby simplifying contact between a cooling medium and the first cooling element.

[0024] Preferably, the second vehicle electronics assembly has a plate-like fourth cooling element extending at least partially into a seventh plane arranged parallel to and below the sixth plane when the second vehicle electronics assembly is in the first position. Preferably, the third and fourth cooling elements are mechanically connected to each other, with the connection being, for example, by means of a screw connection, a rivet connection, a bolt connection, a plug connection, a weld connection, an adhesive connection, or the like. The fourth cooling element allows the underside of the third cooling element to be covered, thereby simplifying contact between a cooling medium and the third cooling element.

[0025] Preferably, the second and fourth cooling elements are arranged when the second vehicle electronics assembly is positioned in the first position. Furthermore, it is conceivable that the second and / or fourth cooling element has openings on a side facing away from the first or second cooling element, respectively, in order to provide additional airflow if air cooling is used.

[0026] According to a preferred embodiment, the first vehicle electronics assembly has a plate-like first cover element extending substantially in a fourth plane arranged parallel to and below the first plane. This cover element is mechanically connected to the first cooling element when the second vehicle electronics assembly is in the second position. The first cooling element and the first cover element are designed and intended to enclose and seal the at least one first electronic component and the first printed circuit board. The cover element is preferably connected to the first cooling element by means of a screw, bolt, rivet, weld, solder, plug, adhesive connection, or the like. This arrangement protects the at least one first electronic component and the first printed circuit board from damage.Preferably, the first cover element is mechanically connected to a circumferential side wall of the first cooling element.

[0027] Preferably, the second vehicle electronics assembly has a plate-like second cover element extending substantially in an eighth plane arranged parallel to the fifth plane and arranged above it. This cover element is mechanically connected to the third cooling element when the second vehicle electronics assembly is in the second position. The third cooling element and the second cover element are designed and intended to enclose the at least one third electronic component and the second circuit board. The second cover element is preferably connected to the third cooling element by means of a screw, bolt, rivet, weld, solder, plug, adhesive connection, or the like. This arrangement protects the at least one third electronic component and the second circuit board from damage. Preferably, the second cover element is mechanically connected to a circumferential side wall of the third cooling element.

[0028] Preferably, the first and second cover elements are arranged when the second vehicle electronics assembly is positioned in the second position.

[0029] It is also conceivable that the first vehicle electronics assembly has a plate-like third cover element extending substantially parallel below the first plane between the first and second vehicle electronics assemblies, which is preferably mechanically connected to the first cooling element, and that the second vehicle electronics assembly has a plate-like fourth cover element extending substantially parallel above the fifth plane between the first and second vehicle electronics assemblies, which is preferably mechanically connected to the third cooling element when the second vehicle electronics assembly is in the second position. Preferably, the third and fourth cover elements can be arranged in contact with each other or spaced apart from each other along the vertical axis.In this way, each of the two vehicle electronics assemblies can be separately sealed off from the outside by the third or fourth cover element. Furthermore, it is possible to provide only a plate-like fifth cover element, extending essentially parallel below the first level and above the fifth level between the first and second vehicle electronics assemblies, which is designed and configured to seal both vehicle electronics assemblies off from the outside. Preferably, the first and second vehicle electronics assemblies are arranged adjacent to and in contact with the fifth cover element.

[0030] According to a preferred embodiment, the underside of the first cooling element, facing the first printed circuit board, has at least one first area that thermally contacts the at least one first electronic component arranged on its upper surface, and / or at least one second area that thermally contacts the upper surface of the first printed circuit board. The at least one first area is arranged offset upwards along a vertical axis relative to the at least one second area. By preferably arranging the first and second areas offset from each other along the vertical axis on the underside of the first cooling element, the printed circuit board itself and the electronic components arranged on its upper surface can be directly thermally contacted, thus ensuring effective heat dissipation. In contrast to known cooling elements, not only the electronic components but also the printed circuit board are thermally contacted.

[0031] For the arrangement of the second vehicle electronics assembly above the second level, an underside of the first cooling element facing the first circuit board has, according to the invention, at least one first area thermally contacting the at least one first electronic component arranged on the upper side and at least one second area thermally contacting the first circuit board on the upper side, wherein the at least one first area is arranged offset upwards in a vertical axis relative to the at least one second area.

[0032] Preferably, a top surface of the third cooling element facing the second circuit board has at least one third area that thermally contacts the at least one third electronic component arranged on the underside and / or at least one fourth area that thermally contacts the underside of the second circuit board, wherein the at least one third area is arranged offset downwards in a vertical axis relative to the at least one fourth area.

[0033] For the arrangement of the second vehicle electronics assembly above the second level, the at least one first area and the at least one second area extend, according to the invention, essentially along the longitudinal axis and the width axis, wherein the extension preferably corresponds to an extension of the top / bottom directly contacted or the bottom / top indirectly contacted electronic components.

[0034] Preferably, the at least one first / third region and the at least one second / fourth region extend substantially along the longitudinal axis and the width axis, the extension preferably corresponding to an extension of the top / bottom directly contacted or the bottom / top indirectly contacted electronic components.

[0035] According to a preferred embodiment, at least one second electronic component is arranged opposite the at least one second area on the underside of the first printed circuit board. This preferred arrangement allows an electronic component located on the underside of the first printed circuit board to be cooled / dissipated by the second area of ​​the first cooling element, which thermally contacts the top of the printed circuit board, without requiring an additional cooling element located on the underside of the first printed circuit board. The heat generated by the electronic components located on the underside of the first printed circuit board is transferred through the printed circuit board to the second area and thus dissipated by the second electronic component without direct contact.

[0036] For the arrangement of the second vehicle electronics assembly above the second level, at least one second electronic component is arranged opposite the at least one second area on the underside of the first circuit board according to the invention.

[0037] Preferably, at least one fourth electronic component is arranged opposite the at least one fourth area on the upper side of the second printed circuit board. This preferred arrangement allows an electronic component located on the upper side of the printed circuit board to be cooled / dissipated by the fourth area of ​​the third cooling element, which thermally contacts the underside of the printed circuit board, without requiring an additional cooling element located on the upper side of the second printed circuit board. The heat generated by the electronic components located on the upper side of the second printed circuit board is transferred through the printed circuit board to the fourth area and thus dissipated by the fourth electronic component without direct contact.

[0038] It is particularly preferred if no electronic component is arranged opposite the at least one second electronic component on the top side of the first printed circuit board and / or opposite the at least one fourth electronic component on the underside of the second printed circuit board, in order to ensure advantageous contact between the at least one second area or the at least one fourth area and the first or second printed circuit board, respectively. It is further conceivable that the first and / or second printed circuit board has high thermal conductivity or low thermal resistance between the at least one second area or the at least one fourth area and the at least one second or the at least one fourth electronic component, respectively, in order to facilitate advantageous heat conduction from the electronic component to the oppositely arranged second area or fourth area of ​​the first cooling element.To enable the third cooling element to pass through the first or second circuit board. The preferred high thermal conductivity of the circuit board can be achieved, for example, by mechanically drilled vias (so-called "thermovias"), which preferably have an increased copper layer thickness in the sleeve and run along the height axis Z, within the circuit board.

[0039] Preferably, the at least one first and at least one second electronic component are configured and designed to have a heat dissipation with a preferred direction extending upwards along the vertical axis.

[0040] Preferably, at least one third and at least one fourth electronic component are configured and designed to have a heat dissipation with a preferred direction running downwards along the vertical axis.

[0041] Preferably, each electronic component has a preferred surface for mounting to a heat sink, wherein the preferred surface can be arranged facing the circuit board (PCB) or facing away from it. A preferred surface is understood here to be the surface of the electronic component through which the heat generated during operation is preferentially dissipated (preferred direction of heat dissipation), or which preferably heats up the most, or which exhibits the lowest thermal resistance compared to the other surfaces of the electronic component. Thus, it is evident that the electronic components arranged on the upper side of the first PCB are attached to the PCB by means of a surface opposite the preferred surface, since in this way the heat is dissipated upwards along the vertical axis, away from the PCB and towards the first heat sink.Furthermore, it is evident that the electronic components arranged on the underside of the first circuit board are attached to the circuit board by means of the preferred surface area, whereby heat dissipation preferably occurs upwards along the vertical axis towards the first circuit board, thus heating the circuit board. Consequently, the electronic components arranged on the top and bottom sides of the first circuit board exhibit a preferred direction for heat dissipation upwards along the vertical axis. This arrangement advantageously enables one-sided heat dissipation / cooling of the first circuit board.of the electronic components arranged thereon, since the first cooling element is arranged in thermal contact with the upper surface of the first printed circuit board and the electronic components arranged thereon, and thus the electronic components arranged thereon are thermally contacted and (directly) cooled by means of the first areas at the preferred surface, and the first printed circuit board is thermally contacted by means of the second areas, wherein the electronic components arranged on the underside of the first printed circuit board are opposite the second areas and can thus be (indirectly) cooled via the first printed circuit board. Consequently, it is preferred that all electronic components attached to the upper surface (with respect to the height axis Z) of the first printed circuit board have a preferred direction of heat dissipation upwards Z1 in the direction of the first cooling element.The electronic components are arranged on the upper side of the first printed circuit board such that their preferred surface is oriented upwards Z1, or the electronic components arranged on the upper side are thermally connected to the first printed circuit board via a surface opposite the preferred surface, wherein the connection between an electronic component on the upper side and the printed circuit board is preferably made by solder (metal), particularly preferably by solder balls. Furthermore, it is preferred that the electronic components attached to the underside (with respect to the height axis Z) of the first printed circuit board have a preferred direction of heat dissipation upwards Z1 towards the first printed circuit board, or are arranged on the underside of the first printed circuit board such that their preferred surface is oriented upwards Z1.The electronic components arranged on the underside are thermally connected to the first printed circuit board via the preferred surface, wherein a copper plate / layer is preferably arranged between the preferred surface of the electronic component and the first printed circuit board, particularly preferably within the electronic component.

[0042] Furthermore, it is evident that the electronic components arranged on the underside of the second circuit board are attached to the board by means of a surface opposite the preferred area, as this allows the heat to be dissipated downwards along the vertical axis, away from the circuit board and towards the third cooling element. It is also evident that the electronic components arranged on the top side of the second circuit board are attached to the circuit board by means of the preferred area, which preferentially dissipates heat downwards along the vertical axis towards the second circuit board, thus heating the circuit board. Consequently, the electronic components arranged on both the top and bottom sides of the first circuit board exhibit a preferred direction for heat dissipation downwards along the vertical axis. This arrangement advantageously enables one-sided heat dissipation / cooling of the second circuit board.The third cooling element is arranged to thermally contact the underside of the second circuit board and the electronic components located thereon, thus thermally contacting the electronic components located thereon at the preferred surface via the third area and (directly) dissipating heat. The second circuit board is thermally contacted via the fourth area, with the electronic components located on the upper side of the second circuit board facing the fourth area and thus being (indirectly) cooled via the second circuit board. Consequently, it is preferred that all electronic components located on the underside (with respect to the height axis Z) of the second circuit board have a preferred direction of heat dissipation downwards Z2 in the direction of the third cooling element.The electronic components are arranged on the underside of the second printed circuit board in such a way that their preferred surface is oriented downwards Z2, or the electronic components arranged on the underside are thermally connected to the second printed circuit board via a surface opposite the preferred surface, wherein the connection between an electronic component on the underside and the printed circuit board is preferably made by solder (metal), particularly preferably by solder balls. Furthermore, it is preferred that the electronic components attached to the upper side (with respect to the height axis Z) of the second printed circuit board have a preferred direction of heat dissipation downwards Z2 in the direction of the first printed circuit board, or are arranged on the upper side of the second printed circuit board in such a way that their preferred surface is oriented downwards Z2.The electronic components arranged on the upper side are thermally connected to the second circuit board via the preferred surface, wherein a copper plate / layer is preferably arranged between the preferred surface of the electronic component and the second circuit board, particularly preferably within the electronic component.

[0043] Therefore, the arrangement of the electronic components on the first and second circuit boards can be described as cooling direction oriented, since the preferably advantageous one-sided cooling of the first circuit board by means of the first cooling element and the second circuit board by means of the third cooling element is achieved by the common alignment of the preferred direction of heat dissipation or the preferred surface of the electronic components in the direction of the first / third cooling element that thermally contacts the circuit board.

[0044] Preferably, thermal conductivity is understood here as a material property and describes the transport of energy – in the form of heat – through a body / in a medium without mass transport. The higher the thermal conductivity, the better / faster heat can be transported through the body or in the medium. Preferably, the reciprocal of thermal conductivity is thermal resistance, where thermal resistance is a measure of the temperature difference that arises when a heat flow passes through a body / medium.

[0045] Preferably, the preferred area or direction of heat dissipation of the electronic components is determined by their layout or architecture. Consequently, it is conceivable that the preferred area or direction of heat dissipation can be found in a datasheet provided by a manufacturer of the electronic component. Furthermore, it is preferably possible for a copper plate / copper layer ("exposed pad") to be arranged on the preferred area of ​​the electronic components, particularly preferably within the electronic components, thereby further improving heat dissipation via the preferred area or in the preferred direction.

[0046] Preferably, the arrangement of the at least one first region on the underside of the first cooling element can correspond to the arrangement of the at least one first electronic component located on the top side of the first printed circuit board, and the arrangement of the at least one second region on the underside of the first cooling element can correspond to the arrangement of the at least one second electronic component located on the underside of the first printed circuit board. In this way, the first cooling element, or the at least one first and second region, can preferably be adapted to the extent of the electronic components in the height, width, and / or length axes, as well as to the positioning of the electronic components on the printed circuit board. Planning the layout of a printed circuit board with the electronic components arranged on it is very complex and time-consuming.In most cases, the layout cannot be modified afterward to accommodate a specific cooling element. Therefore, it is advantageous if the cooling element is adaptable to the circuit board layout.

[0047] For the arrangement of the second vehicle electronics assembly above the second level, the at least one first and second areas are adapted according to the invention to an extension of the electronic components in the height, width and / or length axis as well as to a positioning of the electronic components on the circuit board.

[0048] Preferably, the arrangement of the at least one third area on the top side of the third cooling element is adapted to an arrangement of the at least one third electronic component arranged on the underside of the second circuit board, and the arrangement of the at least one fourth area on the top side of the third cooling element is adapted to an arrangement of the at least one fourth electronic component arranged on the top side of the second circuit board.

[0049] Preferably, the first cooling element and the first circuit board as well as the second cooling element and the second circuit board are mechanically connected to each other, wherein a screw connection, a plug connection, a rivet connection, a bolt connection, a weld connection, a solder connection, an adhesive connection or the like is considered for a corresponding connection.

[0050] Preferably, a thermally conductive material is arranged between the top surface of the first printed circuit board and the at least one second area and / or between the bottom surface of the second printed circuit board and the at least one fourth area. This arrangement allows sufficient thermal contact between the printed circuit board and the at least one second / fourth area, even if, for example, electronic components are located at this position that do not themselves require direct thermal contact through a first / third area. The thermally conductive material is preferably a so-called gap filler, which is known from the prior art.Preferably, the thermally conductive material can be compressible, with the compressible material being compressed in the area of ​​the electronic component located between the printed circuit board and the second / fourth area, while allowing the surrounding material to maintain unimpeded thermal contact with the printed circuit board. Furthermore, the material has sufficient thermal conductivity to effectively transport heat. Preferably, the thermally conductive, compressible material is a film, such as a foam or gel film, for example, a graphite film, a polyimide film, an acrylic or acrylate-based film, a silicone-based film, or a paste. This list is merely an example. Other materials with the aforementioned characteristics, which are known from the prior art and are used accordingly, are also suitable.The thermally conductive material is preferably adaptable to the extension of the second / fourth region along the longitudinal and lateral axes. Likewise, the extension of the thermally conductive, compressible material along the vertical axis is variable and adaptable to the specific conditions.

[0051] Preferably, the first cooling element has a coolant on its upper surface facing away from the first circuit board and / or the third cooling element has a coolant on its lower surface facing away from the second circuit board, preferably in the form of fins, channels, pins, or the like. This preferred design allows the heat absorbed by the cooling element to be distributed and dissipated particularly effectively. Preferably, the coolant is arranged uniformly on the upper surface of the first cooling element and / or the lower surface of the third cooling element.

[0052] Preferably, a cooling medium in contact with the coolant can be circulated via the cooling device between the first and second cooling elements and / or between the third and fourth cooling elements. In this way, the heat dissipated from the electronic components by means of the first / third cooling element can be effectively removed from the top of the first cooling element and / or the bottom of the third cooling element.

[0053] Preferably, the underside of the first cooling element and / or the top side of the third cooling element each have a receiving area spaced apart from the side surfaces along a vertical axis of the vehicle electronics assembly, offset upwards from the underside of the first cooling element and downwards from the top side of the third cooling element, respectively, so that a side wall extending at least partially circumferentially is formed, wherein the first and / or the second circuit board and the electronic components arranged thereon are located at least partially, preferably completely, within the receiving area. The design of the receiving area mechanically protects the at least one first and second electronic component and the first and second circuit board from damage by means of the circumferentially extending side wall along the longitudinal and lateral axes.Thus, in addition to cooling the at least one first and second electronic component and / or the first and second printed circuit board, the first and third cooling elements also provide partial enclosure and therefore mechanical protection for them. Preferably, the side wall has bores extending along the vertical axis to ensure a mechanical connection with the second and fourth cooling elements and / or the first or second cover element.

[0054] Preferably, the first, second and / or third cooling device has a first connection point for introducing a gaseous first cooling medium into the vehicle electronics assembly device or a second connection point for introducing a liquid second cooling medium into the vehicle electronics assembly device, wherein the first and second connection points are interchangeable, so that the first, second and / or third cooling device can be operated with either the first or the second cooling medium.

[0055] Preferably, a connection point comprises any elements designed and intended to introduce, discharge, or convey a cooling medium into and / or through the vehicle electronics assembly. Furthermore, the connection point ensures the connection of the vehicle electronics assembly to a connecting element. Depending on whether the cooling medium is gaseous or liquid, this element may be, for example, a turbomachine / fan, a liquid supply connection, a liquid discharge connection, and / or a liquid line. This list is not exhaustive but also includes all connection points and their elements / components that must be arranged on the vehicle electronics assembly to introduce / discharge the corresponding gaseous or liquid cooling medium.

[0056] Preferably, the first cooling device comprises the first cooling element, the second cooling element and the first connection point or the second connection point, the second cooling device comprises the third cooling element, the fourth cooling element and, accordingly, the first connection point or the second connection point, and the third cooling device comprises the first cooling element, the third cooling element and, accordingly, the first connection point or the second connection point.

[0057] A cooling medium is preferably understood to be any medium that transports heat from an area of ​​higher temperature to an area of ​​lower temperature. The first cooling medium, in a gaseous state, could be, for example, air. The second cooling medium, in a liquid state, could be, for example, water, an alcohol-water mixture, thermal oil, molten salt, or a liquid metal. The above list is not exhaustive and is intended only as an example.

[0058] Preferably, a simple change between a gaseous and a liquid cooling medium is ensured by exchanging the first connection point with the second connection point, or vice versa, without requiring the replacement of any other elements / components of the vehicle electronics assembly. In this way, the vehicle electronics assembly requires essentially the same installation space regardless of the cooling medium used, which simplifies the design and construction of any vehicle, and largely allows the use of the same elements / components, thus reducing manufacturing costs. Furthermore, the type of cooling system (gas or liquid cooling) of the vehicle electronics assembly can be changed and adapted quickly in the event of altered conditions, without causing delays due to redesign or manufacturing processes.

[0059] Preferably, the vehicle electronics assembly has at least one first connection element connectable to the first connection point or at least one second connection element connectable to the second connection point. Preferably, the connection elements ensure the transport of the first or second cooling medium into the vehicle electronics assembly via the first or second connection point. The first connection element is preferably a turbomachine or a fan element for conveying the gaseous first cooling medium, and the second connection element is preferably a liquid line (inlet and outlet).

[0060] Preferably, the first cooling element on a top surface and / or the third cooling element on a bottom surface is equipped with a first coolant if the cooling device has the first connection point, or with a second coolant if the cooling device has the second connection point. The first / third cooling element can thus be further adapted to the intended cooling device or the cooling medium, as this ensures improved heat exchange between the first / third cooling element and the first or second cooling medium. Preferably, the first coolant and / or the second coolant can be fins, channels, pins, or the like.It is particularly advantageous if the first or second coolant is evenly distributed on the top surface of the first cooling element and / or on the underside of the third cooling element to achieve the largest possible contact area between the cooling element / coolant and the cooling medium. The orientation of the first or second coolant on the top surface of the cooling element and / or the underside of the third cooling element is preferably variable and adaptable to specific requirements.

[0061] Preferably, the first cooling medium contacting the first coolant or the second cooling medium contacting the second coolant can be passed through the first cooling device between the first and second cooling elements, wherein the first and second cooling elements are preferably mechanically connected to each other. Preferably, the first cooling medium contacting the first coolant or the second cooling medium contacting the second coolant can be passed through the second cooling device between the third and fourth cooling elements, wherein the third and fourth cooling elements are preferably mechanically connected to each other.Preferably, the first cooling medium contacting the first coolant or the second cooling medium contacting the second coolant can be conveyed between the first and third cooling elements by means of the third cooling device, wherein the first and third cooling elements are preferably mechanically connected to each other. It is understood that the first / third cooling element and the second / fourth cooling element are connected to each other according to the cooling medium used, and when using a liquid second cooling medium, the first / third cooling element and the second / fourth cooling element are connected to each other in a liquid-tight manner – excluding the connection point – thus preventing liquid leakage.Furthermore, it is preferred that, when using the gaseous first cooling medium, the connection between the first / third cooling element and the second / fourth cooling element has at least one opening in addition to the first connection point to ensure an outflow of the introduced gas, wherein the opening is variably selected according to the prevailing conditions.

[0062] Preferably, the first or second connection point is located on the first / third cooling element and / or on the second / fourth cooling element, preferably on a first side surface of the first / third cooling element and / or on a front surface of the second / fourth cooling element. This allows the first or second cooling medium to be introduced and transported particularly easily between the first / third and the second / fourth cooling elements. Preferably, the exchange of the first and second connection points is simplified because, for example, if the first or second connection point is located on the second / fourth cooling element, the connection points can be exchanged by simply replacing the second cooling element, which has the required connection point.It would therefore be advantageous to be able to switch from the first to the second cooling medium, or vice versa, simply by replacing the second / fourth cooling element, which has the first or second connection point. Furthermore, it would be conceivable that the first and second connection points could be arranged or removed separately from the first / third and / or the second / fourth cooling element on the vehicle electronics assembly. Preferably, the front surface of the second / fourth cooling element can be any surface of the second / fourth cooling element that is arranged perpendicular to a top surface of the second / fourth cooling element, and particularly preferably adjacent to a side surface of the first / fourth cooling element.

[0063] Preferably, several first connection points or several second connection points are arranged on the first / third cooling element and / or on the second / fourth cooling element, preferably on the first side surface of the first / third cooling element and / or on the front surface of the second / fourth cooling element. The cooling performance can be improved by using several first or second connection points. In particular, the several first connection points are preferably arranged in such a way that the first cooling medium can make uniform and substantially complete contact with the top surface of the first cooling element or the bottom surface of the third cooling element.

[0064] Preferably, the vehicle electronics assembly further comprises at least one electrical connector element arranged on a second side surface of the first and / or third cooling element opposite the first side surface, for connecting additional external components, wherein the at least one connector element is electrically conductively connected to the first / second circuit board. In this way, the vehicle electronics assembly can be connected to the corresponding vehicle components via signals. By arranging the at least one electrical connector element on the second side surface opposite the first side surface on which the first or second connection point is located, sufficient installation space is available on the respective side surfaces without the connection points and the connector elements interfering with each other.

[0065] Preferably, a plate-like sixth cover element is formed on the second side surface of the first and / or third cooling element, on which at least one electrical connector element is arranged if no third, fourth, or fifth cover element is provided. This sixth cover element extends substantially perpendicularly to the first, second, third, fourth, fifth, sixth, seventh, and eighth planes and seals off an interior space of the vehicle electronics assembly from the outside. Preferably, the shape of the sixth cover element is adapted to the connector elements arranged on the second side surface of the first and / or third cooling element and is positioned, in particular, in the area between the connector elements to ensure a tight seal.

[0066] Preferably, the first vehicle electronics assembly and / or the second vehicle electronics assembly each have a first or second connector element on the second side surface of the first and / or third cooling element, respectively. The first connector element is arranged centrally with respect to the width axis on the second side surface of the first vehicle electronics assembly, and the second connector element is arranged centrally with respect to the width axis on the second side surface of the second vehicle electronics assembly. The first connector element is preferably connected to the first circuit board, and the second connector element is preferably connected to the second circuit board for signal transmission. The first and second connector elements allow the first and second vehicle electronics assemblies, or the first and second circuit boards, to be interconnected for signal transmission.Furthermore, due to their arrangement, the first and second connector elements are always positioned adjacent to each other in the vertical axis, centered on the second side surface in the width axis, regardless of a rotation of the second vehicle electronics assembly and whether it is in the first or second position.

[0067] Preferably, the first / third cooling element is formed by a one-piece or multi-piece molded part made of a thermally conductive material, preferably a metal such as aluminum or copper, an alloy, a ceramic, a plastic, and / or a composite material. Consequently, the manufacture of the first / third cooling element is particularly simple, cost-effective, and time-saving. A material with sufficient thermal conductivity is preferably used for its manufacture to dissipate the heat generated during operation of the first / second vehicle electronics assembly from the at least one first / second electronic component and / or the first / second circuit board.

[0068] Further objectives, advantages and expediencies of the present invention can be found in the following description in conjunction with the drawing. The drawings show: Fig. 1 Perspective top view from the front of a vehicle electronics assembly according to a preferred embodiment; Fig. 2 Exploded view of a vehicle electronics assembly from a rear oblique angle according to the diagram in Fig. 1 embodiment shown; Fig. 3. Perspective view from a low angle of an isolated first cooling element according to the in Fig. 1 embodiment shown; Fig. 4 Schematic cross-sectional representation of a vehicle electronics assembly device with a second vehicle electronics assembly in the first position according to a preferred embodiment; Fig. 5 Schematic cross-sectional representation of a vehicle electronics assembly device with a second vehicle electronics assembly in the second position according to a preferred embodiment.

[0069] The following explanations and descriptions concerning a vehicle electronics assembly 100 or its components / elements shall apply to the first vehicle electronics assembly 100a and in a corresponding manner to the identically designed second vehicle electronics assembly 100b and its components / elements.

[0070] The Fig. Figure 1 shows a single arranged first vehicle electronics assembly 100a according to a preferred embodiment of the present invention.

[0071] The vehicle electronics assembly device 1000, or the first and second vehicle electronics assemblies 100a and 100b, extends along a vertical axis Z, a horizontal axis Y, and a longitudinal axis X, with each axis corresponding to two directions. The vertical axis Z comprises the directions Z1 (upwards) and Z2 (downwards). The horizontal axis Y comprises the directions Y1 (to the right) and Y2 (to the left). The longitudinal axis X comprises the directions X1 (forwards) and X2 (backwards).

[0072] The vehicle electronics assembly 100 comprises a printed circuit board 1 with at least one first / second electronic component 2a, 2b (not shown here) arranged on the top and / or bottom, a cooling device 3, which consists of a first cooling element 4, a second cooling element 5 and two first connection points 6a, 6a' (not shown), several electrical connector elements 7a-e and a cover element 20.

[0073] The vehicle electronics assembly 100 according to the in Fig. The embodiment shown in Figure 1 has two first connection points 6a, 6a' for introducing a first gaseous cooling medium into the vehicle electronics assembly 100, wherein the first cooling medium in this case is air.

[0074] The first cooling element 4 comprises a top surface 8, a bottom surface 9 (not shown here) arranged substantially parallel to the top surface 8, wherein the top surface 8 and the bottom surface 9 each extend substantially along the longitudinal axis X and the lateral axis Y, and a first side surface 15, second side surface 16, third side surface 17a and fourth side surface 17b arranged perpendicular to the top surface 8 and the bottom surface 9.

[0075] On the first side surface 15 of the first cooling element 4, a first connection point 6a and a second connection point 6a', at each of which a first connection element 27a, 27a' is arranged, are spaced apart from each other along the width axis Y.

[0076] The electrical connector elements 7a-e are arranged on the second side surface 16 and are electrically connected to the circuit board 1, with the connector elements 7a-e oriented rearward X2 along the longitudinal axis X. The connections are arranged according to the diagram in Fig. The electrical connector elements 7a-7e shown in Figure 1 are only examples. It is also conceivable that other connector elements are provided and / or that the position of the connector elements differs, depending on the application of the vehicle electronics assembly and thus being variable. Here, the first cooling element 4 has three raised sections 21a, 21b, 21c on its upper surface 8 adjacent to the second side surface 16. These sections extend upwards from the upper surface 8 along the vertical axis Z to Z1, increasing the area of ​​the second side surface 16 and thus advantageously enabling an arrangement of the electrical connector elements 7a-7e.

[0077] Furthermore, two fastening elements 22 are arranged on each of the third 17a and fourth side surfaces 17b. These fastening elements 22 enable the vehicle electronics assembly 100 to be mounted in or on the vehicle. The fastening elements 22 are flush with the lower edge of the side surfaces 17a and 17b in the vertical direction Z2.

[0078] The second cooling element 5 has a top surface 10 extending substantially parallel to the top surface 8 of the first cooling element along the longitudinal axis X and the lateral axis Y, and a front surface 18 extending perpendicularly to the top surface 10. The top surface 10 comprises lower sections 23a, 23b, 23c along the lateral axis Y (right Y1 and left Y2) and at the front along the longitudinal axis X (front X1), and an upper section 24 offset upwards Z1 along the vertical axis Z. The lower sections 23a-c are each connected to the upper section 24 by connecting sections 25a, 25b, 25c, with an angle 19a, 19b, 19c, preferably between 45° and 90°, being formed between the lower sections 23a-c and the connecting sections 25a, 25b, 25c.The lower sections 23a-c extend parallel to the upper surface 8 of the first cooling element and also have bores designed to mechanically connect the first cooling element 4 to the second cooling element 5. According to the illustrated embodiment, the connection is made by means of screw connections. The upper section 24 can also have screw connections to mechanically connect the first cooling element 4 to the second cooling element 5.

[0079] Furthermore, the front surface 18 of the second cooling element 5 has two recesses 26, which are designed to partially receive the connecting element 27a, 27a' and to ensure their arrangement on the first cooling element 4. The recesses 26 extend forward from the front surface 18 along the longitudinal axis X to X1.

[0080] The first cooling element 4 and the second cooling element 5 are partially complementary in order to simplify a connection between the two elements 4, 5 and to improve the flow of the cooling medium 1, 2 between them.

[0081] The first connection elements 27a, 27a' are designed as fans or turbomachines according to the embodiment shown.

[0082] The Fig. 2 shows an exploded view of the Fig. 1 shows the vehicle electronics assembly.

[0083] According to the representation in Fig. Figure 2 shows the layer arrangement of the circuit board 1, which carries several electronic components 2a on its upper side, the first cooling element 4, the second cooling element 5 and the cover element 20.

[0084] The printed circuit board 1 has several electronic components 2a, represented as chips, on a top surface 12 extending along the longitudinal axis X and the width axis Y, with only one of these components being designated by reference numeral 2a as an example. Furthermore, the printed circuit board 1 has a bottom surface 13 arranged parallel to the top surface 12. Electronic components 2b can also be arranged on the bottom surface 13.

[0085] The circuit board 1 is mechanically connected to the first cooling element 4 by means of screw connections, with the underside 9 of the first cooling element 4 thermally contacting the top surface 12 of the circuit board and / or a top surface 28 of the electronic components 2a on the top surface. The top surface 28 of the electronic components 2a on the top surface represents their preferred surface, from which a major amount of heat is dissipated or which heats up the most. Furthermore, the cover element 20 is arranged such that it does not contact the circuit board 1 or the electronic components 2b on the underside and is mechanically connected only to the first cooling element 4 by means of screw connections. Thus, the circuit board 1 and the electronic components 2a and 2b arranged on it are enclosed by the first cooling element 4 and the second cooling element 5 – in the sense of a housing.

[0086] Furthermore, the first cooling element 4 has a second first connection point 6a' arranged on the first side surface 15 (first first connection point 6a not shown). The connection point 6a' extends along the first side surface 15 in the vertical direction Z upwards Z1 beyond the top surface 8 and is essentially complementary to the first connection element 27a' in order to be connected to it and to ensure the introduction of the first cooling medium.

[0087] The cover element 20 is essentially plate-like, extending along the longitudinal axis X and the width axis Y, and has, on a top surface 29 facing the circuit board 1, areas (concave and convex areas) offset upwards Z1 and downwards Z2 along the height axis Z to prevent contact with the circuit board 1 arranged above it and the electronic components 2b arranged on the underside. Furthermore, the cover element 20 comprises a side surface 30, which extends perpendicularly to the top surface 29 along the height axis Z and the width axis Y. The side surface 30 is designed to be complementary to the electrical connector elements 7.

[0088] Similarly, the second side surface 16 of the first cooling element 4 is designed to be complementary to the electrical connector elements 7, which are firmly and electrically conductively connected to the circuit board 1. Due to the complementary design of the second side surface 16 of the first cooling element 4 and the side surface 30 of the cover element 20 to the connector elements 7 of the circuit board 1, a complete and closed enclosure of the circuit board 1 or the electronic components 2a, 2b is possible.

[0089] The first cooling element 4 has a first coolant 14a on its upper surface 8. The coolant 14a is formed in the form of cooling fins, which preferably extend along the longitudinal axis and are arranged essentially uniformly over the upper surface 8. This arrangement ensures the transport of the first cooling medium along the longitudinal axis X from front X1 to rear X2.

[0090] In Fig. 3 is the first cooling element 4 of the in the Fig. 1. Vehicle electronics assembly 100 shown in detail and isolated without the other components.

[0091] The Fig. Figure 3 shows several first areas 31 and second areas 36, whereby for the sake of clarity only some of the areas are provided with the corresponding reference symbols.

[0092] It can be seen that the underside 9 of the first cooling element 4 has a receiving area 32, spaced apart from the side surfaces 15, 16, 17a, 17b along a height axis Z of the vehicle electronics assembly 100 and offset upwards Z1 relative to the underside 9. This receiving area 32 allows the top surface 12 of the circuit board 1 to be thermally contacted with the underside 9, with the circuit board 1 and the electronic components 2a, 2b arranged on it being located within the receiving area 32. Thus, a side wall 33 is formed that extends at least partially circumferentially and further downwards Z2 along the height axis Z than the circuit board 1 contacting the underside 9 of the first cooling element 4.The electronic components 2a, 2b, whereby the circuit board 1 carrying the electronic components 2a, 2b can be enclosed by the first 4 and the second cooling element 5 without the second cooling element 5 contacting the circuit board 1 or the electronic components 2a, 2b. Furthermore, the at least one first area 31 and the at least one second area 36 are also arranged within the receiving area 32 on the underside 9 of the first cooling element 4.

[0093] Furthermore, the underside 9 and the side wall 33 each have a cable guide 34a, 34a' that is offset upwards along the vertical axis relative to the underside 9 and the side wall 33, respectively. A connecting cable, which electrically and signal-wise connects each of the first connection elements 27a, 27a' to the circuit board 1, can be routed through the cable guide 34a, 34a' from the first connection element 27a, 27a' to the circuit board 1, and the first cooling element 4 can be flush with the cover element 20 along the vertical axis Z. The first cable guide 34a extends from a recess 35, in which the electrical and signal-wise contact of the first connection elements 27a, 27a' with the circuit board 1 takes place, along the horizontal axis Y to the left Y2 towards the first connection element 27a.The second cable guide 34a' extends from the recess 35 along the width axis Y to the right Y1 towards the second first connection element 27a'. The contact between the first connection elements 27a, 27a' and the circuit board 1 is preferably made by means of an electrical connector element.

[0094] The underside 9 of the first cooling element 4 has a plurality of first areas 31, offset upwards along the vertical axis relative to the second areas, and a plurality of second areas 36, which are distributed on the underside 9 within the receiving area 3. It is possible that the second areas 36 are arranged flush with the underside 9 or the receiving area 32 along the vertical axis Z, or offset downwards Z2 relative to the underside 9 or the receiving area 32 along the vertical axis Z. The first areas 31 and the second areas 36 are preferably cuboidal, with the shape of the areas being based on the shape of the electronic components 2a, 2b.

[0095] Furthermore, threaded elements 37 are formed on the underside 9 within the receiving area 32 and extend downwards Z2 along the height axis Z relative to the underside 9. These enable a mechanical connection of the first cooling element 4 to the circuit board 1.

[0096] In the Fig. Figure 4 shows a schematic representation of a vehicle electronics assembly device 1000 with a first vehicle electronics assembly 100a and a second vehicle electronics assembly 100b, wherein the second vehicle electronics assembly 100b is arranged in a first position.

[0097] The first vehicle electronics assembly 100a comprises a first printed circuit board 1a with a top surface 12a and a bottom surface 13a, a first cooling element 4a with a top surface 8a and a bottom surface 9a, and a second cooling element 5a with a top surface 10a and a bottom surface 11a. The first printed circuit board 1a has an electrical connector element 7f arranged along the longitudinal axis X behind X2, which is electrically connected to the first printed circuit board 1a. Furthermore, first electronic components 2a are provided on the top surface 12a of the first printed circuit board 1a, and second electronic components 2b are provided on the bottom surface 13a.

[0098] The second vehicle electronics assembly 100b comprises a second printed circuit board 1b with a top surface 12b and a bottom surface 13b, a first cooling element 4b with a top surface 8b and a bottom surface 9b, and a second cooling element 5b with a top surface 10b and a bottom surface 11b. The second printed circuit board 1b has an electrical connector element 7g arranged along the longitudinal axis X behind X2, which is electrically connected to the second printed circuit board 1b. Fourth electronic components 2d are arranged on the top surface 12b of the second printed circuit board 1b, and third electronic components 2c are arranged on the bottom surface 13b.

[0099] The electrical connector elements 7f, 7g can be configured such that a separate connection of the first 1a and second circuit board 1b to external components is ensured and / or that a common connection to external components is possible. Preferably, the electrical connector elements 7f, 7g are arranged together along the longitudinal axis X at the front X1 or rear X2 of the vehicle electronics assembly device or the vehicle electronics assembly 100a, 100b. However, it is also conceivable that one connector element 7f, 7g is arranged at the front X1 and one at the rear X2.

[0100] The underside 9a of the first cooling element 4a is thermally contacted with the top side 12a of the first printed circuit board 1a or a top side of the first electronic components 2a, wherein the top side 8b of the third cooling element 4b is thermally contacted with the underside 13b of the second printed circuit board 1b or a bottom side of the third electronic components 2c. According to the embodiment, a thermally conductive material 42 is arranged between the first 4a or third cooling element 4b and the first 1a or second printed circuit board 1b, as well as the first 2a or third electronic components 2c, wherein the thermally conductive material 42 may preferably be, for example, the aforementioned films, foams, pastes, or a copper plate. The thermally conductive material 42 can, among other things, provide the thermal contact between the printed circuit board 1a, 1b and the electronic components 2a-d to the first 4a or third cooling element 4b.Improve the third cooling element 4b and compensate for any height differences in the height axis Z.

[0101] The first 100a and second vehicle electronics assembly 100b, the first 1a and the second printed circuit board 1b, as well as the first cooling element 4a and the third cooling element 4b, extend substantially parallel to one another. Preferably, the first 100a and the second vehicle electronics assembly 100b are mechanically connected to one another, the connection being made via the fastening elements 22 and / or the bores on the underside 9a of the first cooling element 4a or its lower sections 23a-c and / or on the top side 8b of the third cooling element 4b or its corresponding lower sections. Furthermore, a connecting element 39 can be used for this purpose, which, in addition to connecting the first 100a and the second vehicle electronics assembly 100b, also provides a tight seal at the front X2 of the vehicle electronics assembly device 1000.

[0102] The first vehicle electronics assembly 100a is arranged along the height axis Z above the second vehicle electronics assembly 100b.

[0103] The first circuit board 1a is arranged with its underside 13a facing the top side 12b of the second circuit board 1b, the first 1a and the second circuit board 1b being spatially adjacent but not in contact. Furthermore, the first cooling element 4a is arranged with its underside 9a facing the top side 8b of the third cooling element 4b.

[0104] A first cooling device 3a comprises the first cooling element 4a and the second cooling element 5a, wherein the first cooling device 3a transports a cooling medium between the top 8a of the first cooling element 4a and the bottom 11a of the second cooling element 5a, in particular contacting the top 8a of the first cooling element 4a.

[0105] A second cooling device 3b comprises the third cooling element 4b and the fourth cooling element 5b, wherein the second cooling device 3b transports a cooling medium between the bottom 9b of the third cooling element 4b and the top 10b of the fourth cooling element 5b, in particular contacting the bottom 9b of the third cooling element 4b.

[0106] The first 3a and the second cooling device 3b can further comprise connection points and elements (not shown here), such as a fan for gas cooling, which are preferably arranged along the longitudinal axis X at the front X1 or rear X2 of the first 4a and / or the second cooling element 5a or the third 4b and / or the fourth cooling element 5b, respectively. The connection points are preferably arranged on a first side surface 15a of the first cooling element 4a and / or a front surface 18a of the second cooling element 5a, as well as on a first side surface 15b of the third cooling element 4b and / or a front surface 18b of the fourth cooling element 5a. A cooling medium can be transported by means of the first 3a and the second cooling device 3b from front X1 to rear X2 or from rear X2 to front X1. According to the Fig. In the embodiment shown in Figure 4, the cooling medium is transported by the first cooling device 3a and the second cooling device 3b along the direction indicated by arrows 40 from front X1 to rear X2. Furthermore, it is conceivable that the first cooling device 3a transports a gaseous cooling medium and the second cooling device 3b a liquid cooling medium, or vice versa, or that both cooling devices 3a and 3b transport a gaseous or a liquid cooling medium. Preferably, the first cooling device 3a and the second cooling device 3b are configured independently of each other, with the first 3a and the second cooling device 3b being operated and controlled separately. However, it is also conceivable that the first 3a and the second cooling device 3b are operated and controlled together.

[0107] The first circuit board 1a has first areas 31a and second areas 36a, which are distributed along the underside 9a. The second circuit board 1b has third areas 31b and fourth areas 36b, which are distributed along the top side 8b. The third areas 31b of the second circuit board 1b are offset downwards Z2 along the vertical axis Z relative to the fourth areas 36b. The first areas 31a correspond in function to the third areas 31b, and the second areas 36a correspond to the fourth areas 36b.

[0108] Furthermore, the first cooling element 4a has first recesses 38a offset upwards Z1 relative to the underside 9a, and the third cooling element 4b has second recesses 38a offset downwards Z2 relative to the top side 8b. The first 38a and second recesses 38b can be located on the first 4a and / or the third cooling element 4b where no thermal contact with the circuit board 1a, 1b or the electronic assemblies 2a, 2b, 2c, 2d is necessary. This allows for material savings.

[0109] The in Fig. The arrows 41 shown in Figure 4 indicate the preferred direction of heat dissipation of the electronic components 2a, 2b, 2c, and 2d. The preferred direction of the first 2a and second 2b electronic components extends upwards Z1 along the vertical axis Z towards the first cooling element 4a, while the preferred direction of the third 2c and fourth 2d electronic components extends downwards Z2 along the vertical axis Z towards the third cooling element 4b. Thus, the preferred direction of heat dissipation of the first 2a and second 2b electronic components is opposite to the preferred direction of heat dissipation of the third 2c and fourth 2d electronic components.

[0110] Furthermore, the first vehicle electronics assembly 100a and the second vehicle electronics assembly 100b have EMC shielding 43, which effectively ensures the electromagnetic compatibility (EMC) of the assemblies, so that the vehicle electronics assemblies 100a, 100b do not interfere with each other or with other external electronic components through electrical or electromagnetic effects.

[0111] The Fig. Figure 5 shows a schematic representation of a vehicle electronics assembly device 1000 with the first vehicle electronics assembly 100a and the second vehicle electronics assembly 100b, wherein the second vehicle electronics assembly 100b is arranged in a second position.

[0112] The first vehicle electronics assembly 100a is arranged along the height axis Z below the second vehicle electronics assembly 100b.

[0113] The top surface 8a of the first cooling element 4a and the bottom surface 9b of the third cooling element 4b are arranged facing each other and spaced apart.

[0114] A third cooling device 3c comprises the first cooling element 4a and the third cooling element 4b, wherein a cooling medium is circulated between the first 4a and the second cooling element 4b by means of the third cooling device 3c, in particular contacting the upper surface 8a of the first cooling element 4a and the lower surface 9b of the third cooling element 4b. In this way, the vehicle electronics assembly 1000 or the vehicle electronics assemblies 100a, 100b can be cooled by a common cooling device 3c. The third cooling device is preferably a gas or liquid cooling system, wherein a gaseous or liquid cooling medium is transported accordingly. The cooling medium can be transported along the longitudinal axis from front X1 to rear X2 or vice versa. According to the embodiment, which is described in Fig. As shown in Figure 5, the arrows 40 represent the transport direction of a cooling medium from front X1 to rear X2.

[0115] The third cooling device 3c can further have at least one connection point (not shown here) for introducing and removing a cooling medium into the vehicle electronics assembly device 1000. The inlet and outlet of the cooling medium at the connection point can be located together on a first side surface 15a of the first cooling element 4a and / or on a first side surface 15b of the third cooling element 4b, wherein a cooling channel running between the first 4a and the second cooling element 4b is preferably U-shaped, or on the first side surface 15a of the first cooling element 4a and / or on a first side surface 15b of the third cooling element 4b as well as the opposite second side surface 16a of the first cooling element 4a and / or the opposite second side surface 16b of the third cooling element 4b.

[0116] The first vehicle electronics assembly 100a has a first cover element 20a, which is arranged parallel along the height axis Z below the first circuit board 1a or the first layer in a fourth layer. The first cover element 20a, together with the first cooling element 4a, ensures the enclosure of the first circuit board 1a or the first 2a and the second electronic components 2b, wherein the first cover element 20a covers the underside 13a of the circuit board 1a and is electrically insulated from the circuit board 1a.

[0117] The second vehicle electronics assembly 100a has a second cover element 20b, which is arranged parallel along the height axis Z above the second circuit board 1b, or the fifth layer, in an eighth layer. The second cover element 20b, together with the third cooling element 4b, provides an enclosure for the second circuit board 1b, or the third 2c and fourth electronic components 2d, wherein the second cover element 20b covers the top surface 12b of the circuit board 1b and is electrically insulated from the circuit board 1b.

[0118] The in Fig.The arrows 41 shown in Figure 5 indicate the preferred direction of heat dissipation of the electronic components 2a, 2b, 2c, and 2d. The preferred direction of heat dissipation for the first 2a and second 2b extends upwards Z1 along the vertical axis Z towards the first cooling element 4a, while the preferred direction of heat dissipation for the third 2c and fourth 2d extends downwards Z2 along the vertical axis Z towards the third cooling element 4b. Thus, the preferred direction of heat dissipation for the first 2a and second 2b is opposite to the preferred direction of heat dissipation for the third 2c and fourth 2d.

[0119] The arrangement of the areas 31, 31a, 31b, 36, 36a, 36b on the underside 9a of the first cooling element 4a or the top side 8b of the third cooling element 4b, which are shown in the figures, are only exemplary according to the embodiment shown and can be arranged variably according to the circuit board 1, 1a, 1b or the electronic components 2, 2a, 2b, 2c, 2d.

[0120] For the sake of clarity, the electronic components 2, 2a, 2b, 2c, 2d, the areas 31, 31a, 31d, 36, 36a, 36b and the arrows 40, 41 in the figures are only partially provided with the corresponding reference symbols.

[0121] For the sake of clarity, only the relevant features in each figure are labelled with reference symbols. The explanations and descriptions of features shown in one figure also apply, mutatis mutandis, to the corresponding feature if it is shown in another figure.

[0122] It is understood that the embodiments described above represent only a first embodiment of the vehicle electronics assembly device according to the invention. Therefore, the embodiment of the invention is not limited to these exemplary embodiments.

[0123] All features disclosed in the application documents are claimed to be essential to the invention, provided that they are novel individually or in combination compared to the prior art. Reference symbol list 1000 vehicle electronics assembly devices 100 vehicle electronics assembly 100a first vehicle electronics assembly 100b second vehicle electronics assembly 1 circuit board 1a, 1b first, second circuit board 2a Top-side electronic component of the first circuit board 2b Underside electronic component of the first circuit board 2c top-side electronic component of the second circuit board 2D underside electronic component of the second circuit board 3 Cooling unit 3a first cooling device 3b second cooling unit 3c third cooling unit 4, 4a first cooling element 5, 5a second cooling element 4b third cooling element 5b fourth cooling element 6a, 6a' first junction 7a-g electrical connector element 8, 8a Top side of the first cooling element 9, 9a Underside of the first cooling element 10, 10a Top of the second cooling element 11, 11a Underside of the second cooling element 12, 12a Top side of the first circuit board 13, 13a Underside of the first circuit board 8b Top of the third cooling element 9b Underside of the third cooling element 10b Top of the fourth cooling element 11b Underside of the fourth cooling element 12b Top side of the second circuit board 13b Underside of the second circuit board 14 Coolant 14a first coolant 14b second coolant 15, 15a first side surface of the first cooling element 15b first side surface of the third cooling element 16, 16a second side surface of the first cooling element 16b second side surface of the third cooling element 17a third side surface of the first cooling element 17b fourth side surface of the first cooling element 18, 18a Front surface of the second cooling element 18b Front surface of the fourth cooling element 19a-c angle 20 cover element 20a, 20b first, second cover element 21a-c raised sections 22 Fastening element 23a-c lower section 24 upper section 25a-c connection section 26 Exclusion 27a, 27a' first connection element 27b second connection element 28 Top side of the electronic components 29 Top of the cover element 30 Side surface of the cover element 31, 31a first section 31b third area 32 Recording area 33 Side wall 34a, 34a' Cable routing 35 recess 36, 36a second area 36b fourth area 37 Threaded element 38a, 38b first, second recess 39 Connecting element 40 Arrow, transport direction of cooling medium 41 Arrow, preferred direction of heat dissipation 42 thermally conductive material 43 EMC shielding Z-axis height axis Z1 direction upwards Z2 downward direction X longitudinal axis X1 direction forward X2 direction backwards Y-axis latitude Y1 direction right Y2 direction left

Claims

[1] Vehicle electronics assembly device (1000) comprising: a first vehicle electronics assembly (100a) for a first printed circuit board (1a) carrying at least one first electronic component (2a) on the top and / or bottom side, which essentially extends in a first plane, wherein the first vehicle electronics assembly (100a) has a plate-like first cooling element (4a) extending at least partially in a second plane arranged parallel above the first plane; characterized by , that the vehicle electronics assembly device (1000) comprises a second vehicle electronics assembly (100b) identically designed to the first vehicle electronics assembly (100a), wherein the second The vehicle electronics assembly (100b) is arranged in a first position, rotated essentially by 180° about a longitudinal axis (X) of the vehicle electronics assembly device (1000) relative to the first vehicle electronics assembly (100a), parallel below the first plane. [2] Vehicle electronics assembly device (1000) comprising: a first vehicle electronics assembly (100a) for a first printed circuit board (1a) which carries at least one first electronic component (2a) on its upper side and at least one second electronic component (2b) on its lower side, and which extends substantially in a first plane, wherein the first vehicle electronics assembly (100a) has a plate-like first cooling element (4a) which extends at least partially in a second plane arranged parallel above the first plane; characterized by , that The vehicle electronics assembly device (1000) comprises a second vehicle electronics assembly (100b) identically designed to the first vehicle electronics assembly (100a), wherein the second vehicle electronics assembly (100b) is arranged in a second position, rotated substantially by 180° about a longitudinal axis (X) of the vehicle electronics assembly device (1000) relative to the first vehicle electronics assembly (100a), and is arranged parallel above the second plane in a second position, wherein one of the first The vehicle electronics assembly (100a) is formed on the upper side and the second vehicle electronics assembly (100b) is formed on the lower side, a third cooling device (3c) is formed. wherein a cooling medium is passed between the first (4a) and a third cooling element (4b) by means of the third cooling device (3c), contacting a top (8a) of the first cooling element (4a) and a bottom (9b) of the third cooling element (4b), wherein a bottom (9a) of the first cooling element (4a) facing the first circuit board (1a) has at least one first area (31a) thermally contacting the first electronic component (2a) on its top side and at least one second area (36a) thermally contacting the first circuit board (1a) on its top side,wherein the second electronic component (2b) is arranged opposite the at least one second area (36a) on the underside of the first printed circuit board (1a) and the at least one first area (31a) is arranged offset upwards (Z2) in a vertical axis (Z) relative to the at least one second area (36a) and the first (31a) and the second area (36a) extend substantially along a longitudinal (X) and a horizontal (Y) axis, wherein the first (31a) and the second area (36a) of the first cooling element (4a) are adapted to an extension of the at least one first (2a) and the at least one second electronic component (2b) in the vertical (Z), horizontal (Y) and / or longitudinal (X) axis and to their positioning. [3] Vehicle electronics assembly device (1000) according to claim 1, characterized by, that a first cooling device (3a) contacting the top of the first vehicle electronics assembly (100a) and a second cooling device (3b) contacting the bottom of the second vehicle electronics assembly (100b) is formed. [4] Vehicle electronics assembly device (1000) according to claim 3, characterized by , that the first vehicle electronics assembly (100a) has a plate-like second cooling element (5a) extending at least partially into a third level arranged parallel above the second level. [5] Vehicle electronics assembly device (1000) according to claim 2, characterized by , that the first vehicle electronics assembly (100a) has a plate-like first cover element (20a) extending essentially in a fourth level arranged parallel below the first level and mechanically connected to the first cooling element (4a). [6] Vehicle electronics assembly device (1000) according to one of claims 1, 3, 4 and 5, characterized by , that a bottom surface (9a) of the first cooling element (4a) facing the first circuit board (1a) has at least one first area (31a) thermally contacting the at least one first electronic component (2a) arranged on the top and / or at least one second area (36a) thermally contacting the first circuit board (1a) on the top, wherein the at least one first area (31a) is arranged offset upwards (Z2) in a height axis (Z) relative to the at least one second area (36a). [7] Vehicle electronics assembly device (1000) according to claim 6, characterized by , that at least one second electronic component (2b) is arranged opposite the at least one second area (36a) on the underside of the first circuit board (1a). [8] Vehicle electronics assembly device (1000) according to claim 7, characterized by, that the at least one first (2a) and the at least one second electronic component (2b) are configured and designed to have a preferred direction of heat dissipation with a direction of heat dissipation extending upwards (Z1) in the vertical axis (Z). [9] Vehicle electronics assembly device (1000) according to one of claims 7 or 8, characterized by , that an arrangement of the at least one first area (31a) on the underside (9a) of the first cooling element (4a) is adaptable to an arrangement of the at least one first electronic component (2a) arranged on the top side of the first circuit board (1a) and an arrangement of the at least one second area (36a) on the underside (9a) of the first cooling element (4a) is adaptable to an arrangement of the at least second electronic component (2b) arranged on the underside of the first circuit board (1a).

Images