SYSTEMS FOR ALIGNMENT OF INTEGRATED OPTICAL CIRCUITS AND PRINTED OPTICAL BOARDS

Abstract

A system configured to redirect light between a connector (201; 702; 902; 1002) connected to a printed optical board (200; POB) via an optical waveguide and a package of an integrated optical circuit (202; 520; PIC) comprising:one or more two-dimensionally distributed waveplates (302, 303; 500; 801; 706; 901; TDWs), each of the one or more TDWs (302, 303; 500; 801; 706; 901) comprising a plurality of layers (411) of p-doped and n-doped silicon, the one or more TDWs (302, 303; 500; 801; 706; 901) are arranged to be driven to change a dielectric constant at a two-dimensional position on the one or more TDWs (302, 303; 500; 801; 706; 901) so that the dielectric constant applied to the one or more TDWs (302, 303; 500; 801; 706;901) is redirected at the two-dimensional position towards a vertical grating coupler (410; 703; 903);

Description

BACKGROUND area

[0001] The present disclosure relates generally to electronic systems having photonic integrated circuits (PICs) and components thereof, and more particularly to systems and methods for aligning the PIC with the printed optical board. State of the art

[0002] There have been recent developments regarding electrical printed circuit boards with embedded optical waveguides for converting light into electrical signals and vice versa. Such systems are known as printed optical circuit boards and are referred to here as printed optical boards (POBs).

[0003] In a system that features a PIC on a POB, referred to as a "PIC system," the optical connectors in PIC systems are crowded into the immediate vicinity of the system-on-chip (SoC) because the copper traces of the PIC systems are reduced to zero. Unfortunately, there are no standards regarding optical input / output (I / O) for such crowded bus environments. There are no candidate solutions, industry consensus, or standardization activities for the input and output of a PIC (equivalent to the I / O buffer and bond pad of electrical systems), also known as the optical off-chip bus. The lack of such solutions is one of the challenges for interconnect manufacturers working with PIC components in the near future.

[0004] There have been recent developments in the design of printed optical boards (POBs) to incorporate embedded waveguides into the circuit board. Fig. Figure 1 illustrates an exemplary POB system. In particular, Fig. 1 A core layer of an optical waveguide embedded in the material and process of a printed circuit board (PCB). The arrows indicate the directions of the light paths from the optical modules to the SoC. Because the optical layer and the electrical layer are aligned during manufacturing, there is no need for mounting housings to provide additional alignment. However, the material system requires a new lamination process, which increases costs and results in unknown reliability in the product field.

[0005] US 2016 / 0109659 A1 describes an optical coupler produced by a bonded photonic chip coupler for silicon-on-insulator (SOI) chip-to-fiber coupling. The optical coupler for coupling a photonic chip to an optical fiber comprises a photonic chip including a nano-sized photonic waveguide, a photonic optical diffraction surface grating, and a first cladding covering the photonic waveguide and the photonic grating, and an optical coupling chip including a micrometer-sized coupling waveguide and a coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, the first coupling cladding being connected to the first cladding. The optical coupling chip is configured to couple light transmitted between the photonic chip and an optical fiber.

[0006] US 2015 / 0086149 A1 describes a photonic integrated circuit (PIC) comprising a grating coupler for surface normal coupling, which has an alternating pattern of grating teeth and grating grooves, the grating grooves being filled with an electro-optical material. By applying an electrical voltage to the grating teeth, the refractive index of the electro-optical material can be changed. SUMMARY

[0007] In view of the foregoing, it is an object of the present disclosure to provide improved systems and / or components thereof for PIC systems and / or components thereof. According to the invention, a system according to claim 1 and a system according to claim 19 are proposed. Dependent claims relate to some preferred exemplary embodiments.

[0008] Some exemplary aspects of the present disclosure may include a system, preferably including an interface configured to redirect light from a connector enabling single-mode waveguide light from a printed optical board to a photonic integrated circuit (PIC), wherein the interface preferably comprises one or more two-dimensionally distributed waveplates (TDWs), which may be composed, for example, of multiple layers of p-doped and n-doped silicon. In general, the TDWs are preferably configured to be controlled to change a dielectric constant at each two-dimensional position, preferably such that light received through the waveguide from an internal functional IP block of the PIC is redirected at the two-dimensional position.

[0009] Some example aspects of the present disclosure may include a system configured to redirect light between a connector connected to a printed optical board (POB) via a waveguide and an integrated optical circuit (PIC) package that may include one or more two-dimensionally distributed waveplates (TDWs), wherein each of the one or more TDWs preferably includes multiple layers of p-doped and n-doped silicon, wherein the one or more TDWs are preferably configured to be controlled to change a dielectric constant at a two-dimensional location on the one or more TDWs, preferably such that light received at the one or more TDWs is redirected toward a vertical grating coupler at the two-dimensional location.

[0010] Some example aspects of the present disclosure may include a system including a connector configured to connect to a printed optical board (POB) via an optical waveguide; an integrated optical circuit (PIC) package; and / or one or more two-dimensional distributed waveplates (TDWs) configured to redirect light between the POB and the PIC package, wherein each of the one or more TDWs preferably comprises multiple layers of p-doped and n-doped silicon, wherein the one or more TDWs are preferably configured to be controlled to change a dielectric constant at a two-dimensional location on the one or more TDWs such that light received at the one or more TDWs is redirected at the two-dimensional location toward a vertical grating coupler.

[0011] Some example aspects of the present disclosure may relate to a system configured to redirect light between a connector connected to a printed optical board (POB) via a waveguide and an integrated optical circuit (PIC) package. In some example aspects, the system may comprise one or more two-dimensional distributed waveplates (TDWs), wherein each of the one or more TDWs may preferably comprise multiple layers of p-doped and n-doped silicon, and / or wherein the one or more TDWs may preferably be configured to be controlled to change a dielectric constant at a two-dimensional location on the one or more TDWs, preferably such that the light received at the one or more TDWs is redirected toward a vertical grating coupler at the two-dimensional location.

[0012] Some exemplary aspects of the present disclosure may relate to a system comprising: a connector configured to connect to a printed optical board (POB) via an optical waveguide; an integrated optical circuit (PIC) package; and / or one or more two-dimensional distributed waveplates (TDWs). The one or more two-dimensional distributed waveplates (or the system or portions thereof) may preferably be configured to redirect light between the connector and the PIC package. Further preferably, each of the one or more TDWs may comprise multiple layers of p-doped and n-doped silicon.Preferably, the one or more TDWs are configured to be controlled to change a dielectric constant at a two-dimensional position on the one or more TDWs, preferably such that the light received at the one or more TDWs is redirected towards a vertical grating coupler at the two-dimensional position.

[0013] It should be noted that all aspects described above may be combined in part or in whole with aspects described in dependent claims and / or aspects of the exemplary embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 illustrates an example system with a printed optical board (POB). Fig. 2 illustrates an exemplary system with PIC and POB according to one embodiment. Fig. 3(a) and Fig. 3(b) illustrate exemplary implementations of the PIC interface with multi-layer TDWs according to one embodiment. Fig. 4(a) and Fig. 4(b) illustrate an exemplary structure of a PIC interface with TDWs according to one embodiment. Fig. 5 illustrates an exemplary implementation for a MIMO-type implementation of the TDW with a lens according to one embodiment. Fig. 6(a) and Fig. 6(b) illustrate example configurations for determining the alignment between the PIC interface and the PIC according to one embodiment. Fig. 7(a) to 7(c) illustrate an exemplary structure of a TDW disk interface incorporated on the PIC as part of the PIC package, according to one embodiment. Fig. 8(a) to 8(c) illustrate an exemplary structure of an aspherical lens and a TDW plate interface incorporated on the PIC as part of the PIC package, according to one embodiment. Fig. 9(a) to 9(c) illustrate an exemplary structure of a TDW board interface mounted on the connector according to an embodiment. Fig. 10(a) to 10(c) illustrate an exemplary structure of an aspherical lens and a TDW plate interface mounted on the connector according to an embodiment. DETAILED DESCRIPTION

[0014] The following detailed description provides further exemplary details, along with the exemplary description of the drawings and corresponding embodiments of the present application. Redundant reference numerals and descriptions of recurring elements between different drawings are omitted for clarity. Terms used throughout this description are used for illustrative purposes and are not intended to be limiting. Embodiments and parts thereof described herein may be used alone or in combination with other embodiments and parts thereof described herein, or in any other desired configuration.

[0015] Example implementations described herein generally relate to electronic systems that may incorporate exemplary photonic integrated circuits (PICs) on a second-stage integration means, such as an electrical printed circuit board with an embedded optical waveguide, hereinafter referred to as a printed optical board (POB). In particular, example implementations are directed to such systems (hereinafter referred to as a 'PIC system') and methods for aligning the PIC with the printed optical board.

[0016] In PIC systems that incorporate POBs with embedded waveguides, optical connectors are required to provide the interfaces between the board and the PIC, or between the PIC and the board, depending on the desired offset of the vertical grating coupler. Since the copper trace length will eventually drop to zero, the optical-to-electrical system and interfaces will be designed such that the chiplet will ultimately be placed directly on the package, thus enabling the PIC to be implemented as a single chip capable of handling both the electronics and the optics with the overlying electrical and optical interfaces described herein.

[0017] Fig. 2 illustrates an exemplary system with a POB and PIC according to one embodiment. The POB 200 and the PIC 202 are connected via a connector 201 that enables chip-to-board connection. The PIC 202 is exemplary incorporated into an IC package that is connected to the POB 200 (e.g., by wire bonding, electrical connection). The connector 201 exemplary connects to the POB 200 via a POB interface 204 and exemplary connects to the PIC 202 via a PIC interface 203. In one example of the system, light is provided through the waveguides of the POB or through the waveguide of the PIC 202 if the signal flow is in the opposite direction from the PIC to the POB waveguides.

[0018] In the manufacture of such systems, the PIC 202 may be placed on the PIC interface 203. The bottom surface of the PIC 202 may include a coupler that may have absorbing portions and reflecting portions, where the absorbing portions may be configured to absorb light directed from the connector 201 to the PIC 202, and / or the reflecting portions may be configured to reflect light back to the connector 201. The signal flow may also be reversed, with light from the PIC 202 being directed to the POB 200, absorbed by the connector 201, and redirected to the POB through the single-mode waveguide.

[0019] However, during the manufacture of such systems, it can be difficult to determine the alignment of the absorbing portions of the PIC 202 with the PIC interface 203. In particular, light directed from the PIC interface 203 to the PIC may be lost if the alignment is improper. Furthermore, realigning the PIC 202 with the PIC interface 203 using mechanical adjustments may be difficult to achieve because it may be difficult to determine where the light is directed from the PIC interface 203 to the PIC 202 or where the light is directed from the PIC interface 203 to the connector 202.

[0020] Exemplary embodiments address the above issues by introducing a PIC interface 203 that includes, for example, one or more two-dimensionally distributed waveplates (TDWs) with multiple layers that shape and place the incident light beam between the different media to form the perpendicular output light beam.

[0021] In exemplary embodiments described herein, the proposed PIC interface 203 with the one or more TDWs is configured, for example, with an electrically controllable dielectric distribution function of a dielectric constant (d(x,y)), where (x,y) pixelated coordinates on the TDW plate are set with pixels depending on the desired implementation and through the use of 2D lattice structures or metasurfaces. In the examples provided herein, the pixelated (x,y) coordinates are configured, for example, in a checkerboard configuration based on n-doped and p-doped silicon, but other implementations may be used in accordance with the desired implementation.By means of such exemplary embodiments, incoming / outgoing light can interfere constructively to form a substantially orthogonal turn to an outgoing / incoming beam of the desired size and shape in a Gaussian waveform in free space or in the waveguide.

[0022] In the exemplary embodiments described herein, the TDWs may include a plurality of layers, each of which is separately characterized by the associated dielectric constant distribution function d n(x,y) (with n corresponding to the layer n=1, 2,...). This sandwich structure spatially interferes with the incoming light beam from the waveguide to fine-tune the location and shape of the outgoing light beam to the space so that the overall channel efficiency reaches the maximum target value, or with the incoming light beam from the space to fine-tune the location and shape of the outgoing light beam to the waveguide so that the overall channel efficiency reaches the maximum target value.

[0023] In exemplary embodiments, the bidirectionality between the PIC 202 and the PIC interface 203 is generally ensured by the reciprocity of the physical light path.

[0024] Fig. 3(a) and Fig. 3(b) illustrate exemplary implementations of the PIC interface with multi-layer TDWs according to one embodiment. As shown in Fig. 3(a) and Fig. As illustrated in Figure 3(b), the light is guided through a waveguide 300 to the TDW 302, 303, which is configured to redirect the light beam into the space 301.

[0025] In the example according to Fig. 3(a), the center of the outgoing beam can be moved to any desired position (x,y) on the PIC interface 302 by electrically controlling the 2D grating structures or metasurface of the TDW. In the example according to Fig. 3(b), the PIC interface 303 includes, by way of example, a multi-input and multi-output (MIMO) implementation and a lens 304 to compensate for the PIC interfaces having limited ranges for controlling the n(x,y), since MIMO beam-forming parameters incorporate azimuthal and polar angles rather than two-dimensional (x,y) coordinates. The angle control of the beam can locate the beam center at (d*sin(q)*cos(f),d*sin(q)*sin(f)), where d is the distance from the PIC interface to the aspherical lens. Thus, the center of the outgoing beam can be moved to any desired position (x,y) by electrical control and aligned in the desired direction. In such exemplary embodiments, the PIC interface 303 is exemplary configured to align the light beam with the steering angle (θ) and the angle (ϕ). The coverable area can be expanded linearly using d depending on the desired configuration.

[0026] Fig. 4(a) and Fig. 4(b) illustrate an exemplary structure of a PIC interface with TDWs according to one embodiment. As in Fig. As illustrated in Figure 4(a), the multiple layers of the TDW are arranged in an exemplary pixel-like manner to enable a broadened and dispersed perpendicular upward Gaussian beam 402 to be centered among the TDW pixels by adjusting the dielectric constant at any position. In exemplary embodiments, the reciprocity of the light path also holds for the reverse direction.

[0027] As in Fig. As illustrated in Figure 4(a), the TDW is connected to the PIC interface circuitry by an optical waveguide 401, which provides single-mode light 400 from the PIC interface circuitry to the TDW layers. The optical waveguide 401 can allow light entering the TDW with or without a taper, depending on the desired design. Depending on the desired design, the optical waveguide 401 can be configured as a single-mode waveguide or a multi-mode waveguide.

[0028] To control the dielectric constant in each layer, the TDW is set up as an example, as in Fig. Figure 4(a) illustrates the voltage control along the rows and columns of the layers. By adjusting the voltage across each row and column, the voltage at specific pixels can be controlled, and the dielectric constant at a specific position (x,y) can be adjusted depending on the desired design. By adjusting the dielectric constant, the light entering the TDW can be directed to either pass through the neighboring pixels of the TDW or be redirected substantially orthogonally upward, depending on the desired design.

[0029] Depending on the desired implementation, the TDW can be configured to be controlled using methods other than voltage. For example, ultrasonic signals can also be used to adjust the dielectric constant. In other examples, the adjustments can also be made using surface plasmon polaritons on an optical-electronic graphene structure, depending on any desired implementation according to the prior art. Other methods for changing the dielectric constant can also be used, depending on the desired implementation, and the present disclosure is not limited in this regard.

[0030] Fig. Figure 4(b) illustrates an exemplary cross-sectional view of the TDW according to an exemplary embodiment. The exemplary cross-section according to Fig. 4(b) includes vertical grating couplers (VGCs) 410, which are, for example, fixed to the PCB and, for example, have an optical path to the vertical line. Such VGCs can be composed of silicon dioxide or a cladding, depending on the desired design, and can be any type of VGC known in the art.

[0031] The middle layer 411, for example, enables optical light to reach the silicon surfaces and can be formed from silicon, thereby enabling electrical connections (e.g., chip to electrical circuit board), and can also have a core to enable an optical path for connection to the POB. The middle layer 411, for example, further comprises a layer of n-doped and p-doped silicon in a pixelated arrangement, as well as an underlying silicon layer that is either p-doped or n-doped.

[0032] Fig. Figure 5 illustrates an exemplary embodiment for a MIMO-type TDW with a lens 501 according to one embodiment. In the embodiment according to Fig. 5, the TDW 500 receives light through a single-mode waveguide 530 from the PIC 520 and functions, by way of example, as a coherent optical MIMO that is, by way of example, broadened and configured to form a Gaussian beam 510 with an arbitrary angular direction (θ, ϕ) based on the dielectric constant d(x,y). Based on the desired angle, the beam 510 is directed by the collimator lens 501 to the desired position (x,y) on a remote plane.

[0033] Depending on the desired design, the lens 501 may be an aspherical lens made of glass or plastic. The lens 501 is, for example, configured to direct angled light to the desired position at a substantially orthogonal orientation. As shown in Fig. 5, the lens 501 may be embedded in a package 502.

[0034] Furthermore, the signal flow can also be guided back to the PIC 520 and the single-mode waveguide 530 via the lens 501 into the TDWs 500. In such a situation, the light flow is guided, for example, perpendicularly into the aspherical lens 510 from the PIC and is guided back at an angle towards the TDWs 500 (e.g., in the return direction of the arrows 510, 511 as shown in Fig. 5).

[0035] Fig. 6(a) and Fig. 6(b) illustrate example configurations for determining the alignment between the PIC interface and the PIC according to a desired implementation.

[0036] In exemplary implementations, there are a variety of feedback mechanism types that can be applied depending on the sensor positioning in the light path. One example of a feedback mechanism is the reflective method, in which the sensor is positioned on the light source side, so that the magnitude of the reflected signal indicates the magnitude of the misalignment between the PIC and the interface. On the other hand, another example of a feedback mechanism involves the transmissive method, in which the sensor(s) are positioned on the far side of the signal to be aligned, so that the source-sensor pair is used to actively align the optical components until maximum performance is achieved at the receiving element. Fig. Figure 6(a) illustrates example configurations for use with the reflective method and Figure 6(b) illustrates example configurations for use with the transmissive method.

[0037] In the example according to Fig. 6(a), the target waveguide / PIC may include reflective sections 601 disposed adjacent to the target coupler 602. The target coupler 602 exemplarily absorbs the light directed toward it, whereas the reflective sections 602 exemplarily reflect the light directed toward it, as shown by the arrows. The reflected light is used to serve as a reflection feedback signal, with the goal of obtaining the minimum value of the feedback signal. The reflection is exemplarily monitored by a waveguide tap monitor with a photodiode sensor 600 mounted on the PIC connector side. The reflective sections may be made of any material or may be any type of coating that has reflective properties, but is not limited to this.

[0038] In the example according to Fig. 6(b), the transmitted light serves as feedback for the maximum value of the light signal. The signal is monitored, for example, by a waveguide tap monitor with a photodiode sensor 603 mounted on the target waveguide / PIC side. This waveguide tap monitor allows the maximum signal value of the transmitted light from the PIC connector to the target waveguide / PIC side to be known after alignment. Thus, using the Fig. 6(a) and Fig. 6(b), the alignment calibration based on the reflected light measurements must be known, and the TDWs can therefore be controlled to change the dielectric constant accordingly, even when the PIC package is already connected to the connector.

[0039] By using the example designs described herein, the PIC and the interface to the POB can be correctly aligned by adjusting the dielectric constant on the TDWs of the interface. Thus, light can be redirected from the desired 2D coordinate position on the TDW in accordance with the desired design, even if the alignment was not optimal at the time the PIC was placed on the interface.

[0040] Furthermore, due to the use of photodiode sensors for measuring reflected light as described herein, alignment can be determined based on the reflected light measurement. Thus, even if the alignment changes after assembly and alignment are completed, the measurements provided by the one or more photodiode sensors can be used to appropriately change the dielectric constant of the TDWs after assembly and alignment to realign the PIC package with the connector.

[0041] Furthermore, the use of a waveguide tap monitor with one or more photodiode sensors allows the measurement of the signal received from either the connector or the PIC package, depending on the desired design. Thus, since the maximum signal value is known, even if the alignment is changed after assembly and alignment are completed, the measurement by the waveguide tap monitor can be used to adjust the dielectric constant of the TDWs accordingly after assembly and alignment to realign the PIC package with the connector.

[0042] Although exemplary embodiments described herein are directed to the TDWs interface provided on the connector or POB, the TDWs interface may also be placed in the PIC to direct light to the desired position on the surface of the POB. In such an exemplary embodiment, the lens may be Fig. 5 be configured to focus the light beam to the desired position on the surface of the POB, wherein the beam angle normal to the TDWs is configured to be controlled to change the dielectric constant at the two-dimensional position, so that the light received by the connector is redirected at an angle from the interface to the lens at the two-dimensional position. Thus, the design of the TDWs can be accommodated in the connector or in the PIC package according to the desired design, with the other structural elements being modified accordingly to enable such a design.

[0043] Fig. 7(a) to 7(c) illustrate an exemplary structure of a TDW disk interface incorporated on the PIC as part of the PIC package, according to one embodiment. In Fig. 7(a), the PIC package 705 is initially mounted on the PIC connector 702 and is connected by way of example with solder balls 704. For initial assembly, the TDW 706 portion of the PIC package 705 is placed over the VGC 703 of the PIC connector 702 for later alignment.

[0044] In Fig. 7(b), light is transmitted through the waveguide / PIC 707 to the TDW 706. Based on the configuration of the TDW described in embodiments herein, light is directed substantially orthogonally 708 to the PIC connector 702 at an (x,y) pixel coordinate(s) in the TDW. The PIC connector 702 is aligned with reflective portions according to the description of Fig. 6(a) (not shown), so that light that does not reach the VGC 703 is reflected from the surface of the PIC connector 702 and received by a photodiode sensor attached to the PIC package 705 (not shown), as in Fig. 6(a).

[0045] In Fig. 7(c), once the reflected light is measured by the photodiode sensor, the TDW can be adjusted to redirect the light at various (x,y) coordinates based on the photodiode sensor measurements. The light is adjusted until it is aligned with the VGC 703. Once the light is aligned 709, the light can thus propagate through the VGC 703 to be redirected by the waveguide 701 to the POB, or otherwise, depending on the desired design.

[0046] Fig. Figures 8(a) to 8(c) illustrate an exemplary structure of an aspherical lens and a TDW plate interface incorporated as part of the PIC package on the PIC, according to one embodiment. The structure and layout of the Fig. 8(a) is similar to that of the Fig. 7(a), except that the TDW 801 portion of the PIC package 705 is exemplarily provided over a position of the lens 800 opposite to the VGC 703, and the PIC package 705 is exemplarily positioned such that the lens 800 is positioned over the VGC 703. The TDW 801 portion of the PIC package 705 is configured as a coherent optical MIMO to guide light at an arbitrary angular (θ, ϕ) direction to the lens 800 based on the configuration.

[0047] In Fig. 8(b) the execution is similar to that in Fig. 7(b), the light not absorbed by the VGC 703 is reflected, for example, by the reflective portions (not shown) of the PIC connector 702, which is measured by the photodiode sensor. Light projected through the lens 800 is, for example, directed substantially orthogonally toward the PIC connector 702 in the same manner as that of Fig. 7(b) and as shown at 802. Based on the measurements of the photodiode sensor, the TDW 706 is then controlled to transmit the light at a different angle to the lens 800 until the light is aligned 803, as shown in Fig. 8(c).

[0048] Fig. 9(a) to 9(c) illustrate an exemplary structure of a TDW board interface mounted on the connector according to an embodiment. In the exemplary structure according to Fig. 9(a) the structure is similar to that of Fig. 7(a), except that the PIC connector 902 has a TDW 901 connected to the waveguide 701, and the PIC package 905 has a VGC 903 connected to the waveguide / PIC 907. Light is guided from the waveguide 701 to the TDW 901 to be guided substantially orthogonally toward the VGC 903.

[0049] As in Fig. 9(b) and similar to the execution of the Fig. 7(b), the light 904 is directed substantially orthogonally toward the PIC package 905, which is provided with reflective portions (not shown) that reflect light back to a photodiode sensor on the PIC connector 902. Based on the measurements of the photodiode sensor, the TDW 901 is then controlled to transmit the light from a different (x,y) pixel coordinate of the TDW 901 until the light is aligned 908, as in Fig. 9(c).

[0050] Fig. 10(a) to 10(c) illustrate an exemplary structure of an aspherical lens and a TDW plate interface mounted on the connector according to an embodiment. In the exemplary structure according to Fig. 10(a) the structure is similar to those of Fig. 8(a) and Fig. 9(a), except that the PIC connector 1002 exemplarily comprises a coherent optical MIMO TDW 1001 connected to the waveguide 701 as well as to the lens 1000. Light is exemplarily guided from the waveguide 701 to the TDW 1001 to be guided through the lens 1000 substantially orthogonally toward the VGC 903.

[0051] As in Fig. 10(b) and similar to the statements of the Fig. 8(b), light 1003 is directed from the TDW 1001 to the lens 1000 based on the configuration with an arbitrary angle (θ, ϕ) direction, after which the lens 1000 is exemplarily directed substantially orthogonally toward the PIC package 905, which is exemplarily provided with reflective portions (not shown) that reflect light back to a photodiode sensor on the PIC connector 1002. Based on the measurements of the photodiode sensor, the TDW 1001 is then controlled to transmit the light at a different angle to the lens 1000 until the light is aligned 1004, as in Fig. 10(c).

[0052] Consequently, illustrate Fig. 7(a), Fig. 8(a), Fig. 9(a) and Fig. 10(a) exemplary initial completion of the assemblies in which the PIC and the connector are misaligned to some degree. Fig. 7(b), Fig. 8(b), Fig. 9(b) and Fig. 10(b) illustrate the execution of the alignment process as it relates to Fig. 6(a) and Fig. 6(b). That is, the TDWs are driven to modify the dielectric constant as in the example embodiments until a final alignment setup is achieved, as illustrated in FIGS. 7(c), 8(c), 9(c), and 10(c). Once the TDW configuration alignment process is complete, the configuration set (of values) is saved and used during the actual operation of each signal direction path (i.e., bidirectional) for reciprocity. Consequently, bidirectional signals can be enabled by aligning and assembling in accordance with the example embodiments described herein.

[0053] As described herein, embodiments may include a system configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide and a photonic integrated circuit (PIC) package, the system including one or more two-dimensionally distributed waveplates (TDWs), each of the one or more TDWs comprising multiple layers of p-doped and n-doped silicon, the one or more TDWs configured to be controlled to change a dielectric constant at a two-dimensional location on the one or more TDWs such that light received at one or more TDWs is redirected at the two-dimensional location toward a vertical grating coupler.The vertical grating coupler can be attached either to the connector or to the PIC package.

[0054] As described herein, the one or more TDWs may be configured to be driven with a voltage change, an ultrasonic signal, and / or an electro-optical surface plasmon polariton to change the dielectric constant at a desired two-dimensional position on the one or more TDWs. Changing the dielectric constant may cause the received light from the TDWs to be substantially orthogonally redirected or may be used to form an angled Gaussian beam for alignment toward a lens, depending on the desired implementation.

[0055] As described herein, the one or more TDWs may be disposed in the connector and connected to the single-mode waveguide. In such an example embodiment, the one or more TDWs are configured to be controlled to change the dielectric constant at the two-dimensional position such that the light received from the single-mode waveguide is redirected substantially orthogonally at the two-dimensional position toward the vertical grating coupler disposed in the PIC package. In such an example embodiment, one or more photodiode sensors may be disposed on the connector and may be positioned to receive light reflected away from the PIC package among the redirected light transmitted by the one or more TDWs to determine the alignment calibration.Depending on the desired design, a waveguide tap monitor with one or more photodiode sensors may be configured to measure the light received by the PIC package to determine the maximum signal value once the appropriate alignment is determined.

[0056] As described herein, the one or more TDWs may be disposed within the PIC package. In such an example embodiment, the one or more TDWs are configured to be controlled to change the dielectric constant at the two-dimensional position such that the light received by the PIC package is redirected substantially orthogonally at the two-dimensional position toward the vertical grating coupler disposed within the connector. In such an example embodiment, one or more photodiode sensors may be disposed on the PIC package and may be positioned to receive light reflected away from the connector among the redirected light transmitted by the one or more TDWs to determine the alignment calibration.Depending on the desired design, a waveguide tap monitor with one or more photodiode sensors may be configured to measure the light received by the connector to determine the maximum signal value once the proper alignment is determined.

[0057] As described herein, example implementations may include a lens disposed between the PIC package and the connector, wherein the lens is configured to focus the redirected light from the one or more TDWs toward the vertical grating coupler (either disposed in the connector or in the PIC package); wherein the one or more TDWs are configured to be controlled to change the dielectric constant at the two-dimensional location such that the light received at the one or more TDWs is redirected as an angled Gaussian beam at the two-dimensional location toward the lens.

[0058] As described herein, the one or more TDWs may be disposed in the connector and connected to the single-mode waveguide. In such an example embodiment, the one or more TDWs may be configured to be controlled to change the dielectric constant at the two-dimensional position such that the light received from the single-mode waveguide is redirected as the angled Gaussian beam at the two-dimensional position toward the lens, such that the lens redirects the angled Gaussian beam to the vertical grating coupler disposed in the PIC package to be substantially orthogonal to the light received from the single-mode waveguide.In such an example implementation, one or more photodiode sensors may be disposed on the connector and positioned to receive light reflected from the PIC package, among the redirected light transmitted by the one or more TDWs, to determine the alignment calibration. Depending on the desired implementation, a waveguide tap monitor with one or more photodiode sensors may be configured to measure the light received by the PIC package to determine the maximum signal value.

[0059] As described herein, the one or more TDWs may be disposed within the PIC package. In such an example embodiment, the one or more TDWs may be configured to be controlled to change the dielectric constant at the two-dimensional position such that the light received by the PIC package is redirected as the angled Gaussian beam at the two-dimensional position toward the lens such that the lens redirects the angled Gaussian beam to the vertical grating coupler disposed in the connector to be substantially orthogonal to the light received by the PIC package. In such an example embodiment, one or more photodiode sensors may be disposed on the PIC package and may be positioned to receive light reflected off the connector among the redirected light transmitted by the one or more TDWs to determine the alignment calibration.Depending on the desired design, a waveguide tap monitor with one or more photodiode sensors may be configured to measure the light received by the connector to determine the maximum signal value.

[0060] As described herein, the plurality of layers of p-doped and n-doped silicon may be arranged in a checkerboard arrangement indicating possible two-dimensional positions.

[0061] Furthermore, other implementations of the present application will be apparent to those skilled in the art based on consideration of the specification and practice of the teachings of the present application. Many aspects and / or components of the described embodiments may be used alone or in any combination. It is intended that the specification and embodiments be considered merely as non-limiting examples, but it is possible to provide other example implementations consistent with the present disclosure and consistent with the present application, at least to the extent indicated by the following claims.

Claims

[1] A system adapted to redirect light between a connector (201; 702; 902; 1002) connected to a printed optical board (200; POB for "Printed Optical Board") via an optical waveguide and a package of an integrated optical circuit (202; 520; PIC for "Photonic Integrated Circuit"), the system comprising: one or more two-dimensionally distributed waveplates (302, 303; 500; 801; 706; 901; TDWs), wherein each of the one or more TDWs (302, 303; 500; 801; 706; 901) comprises a plurality of layers (411) of p-doped and n-doped silicon, wherein the one or more TDWs (302, 303; 500; 801; 706; 901) are configured to be driven to change a dielectric constant at a two-dimensional position on the one or more TDWs (302, 303; 500; 801; 706; 901) such that the waveguide applied to the one or more TDWs (302, 303; 500; 801; 706; 901) is redirected at the two-dimensional position towards a vertical grating coupler (410; 703; 903). [2] The system of claim 1, wherein the one or more TDWs (302, 303; 500; 801; 706; 901) are arranged to be driven by a change in voltage. [3] The system of claim 1, wherein the one or more TDWs (302, 303; 500; 801; 706; 901) are configured to be driven by an ultrasonic signal. [4] The system of claim 1, wherein the one or more TDWs (302, 303; 500; 801; 706; 901) are configured to be driven by an electro-optic surface plasmon polariton. [5] The system according to at least one of claims 1 to 4, wherein the one or more TDWs (302, 303) are housed in the connector and connected to the single-mode waveguide (401; 530); wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional position such that the light received by the single-mode waveguide at the two-dimensional position is redirected substantially orthogonally toward the vertical grating coupler (410; 703; 903); wherein the vertical grating coupler is housed in the package of the PIC. [6] The system of claim 5, further comprising one or more photodiode sensors (600) disposed on the connector, wherein the one or more photodiode sensors are positioned to receive light reflected away from the package of the PIC from the redirected light transmitted by the one or more TDWs. [7] The system of claim 5 or 6, further comprising a waveguide tap monitor having one or more photodiode sensors, wherein the waveguide tap monitor is configured to measure light received by the package of the PIC. [8] The system according to at least one of claims 1 to 4, wherein the one or more TDWs (302, 303; 500; 801; 706) are housed in the package of the PIC; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional position such that the light received by the package of the PIC at the two-dimensional position is redirected substantially orthogonally toward the vertical grating coupler (410; 703); wherein the vertical grating coupler is housed in the connector. [9] The system of claim 8, further comprising one or more photodiode sensors (603) disposed on packaging of the PIC, wherein the one or more photodiode sensors are positioned to receive light reflected away from the connector from the redirected light transmitted by the one or more TDWs. [10] The system of claim 8 or 9, further comprising a waveguide tap monitor having one or more photodiode sensors, wherein the waveguide tap monitor is configured to measure light received from the connector. [11] The system according to at least one of claims 1 to 10, further comprising: a lens (501; 1000) disposed between the package of the PIC and the connector, the lens being configured to focus the redirected light from the one or more TDWs toward the vertical grating coupler; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional position such that the light received at the one or more TDWs at the two-dimensional position is redirected toward the lens as an angled Gaussian beam. [12] The system of claim 11, wherein the one or more TDWs (901) are housed in the connector and connected to the single-mode waveguide; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional position such that the light received from the single-mode waveguide is redirected as the angled Gaussian beam at the two-dimensional position towards the lens such that the lens redirects the angled Gaussian beam towards the vertical grating coupler (903) such that it is substantially orthogonal to the light received from the single-mode waveguide; The vertical grating coupler is housed in the PIC package. [13] The system of claim 12, further comprising one or more photodiode sensors disposed on the connector, wherein the one or more photodiode sensors are positioned to receive light reflected away from the package of the PIC from the redirected light transmitted by the one or more TDWs. [14] The system of claim 12 or 13, further comprising a waveguide tap monitor having one or more photodiode sensors, wherein the waveguide tap monitor is configured to measure light received by the package of the PIC. [15] The system of claim 11, wherein the one or more TDWs (302, 303; 500; 801; 706) are housed in the package of the PIC; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional position such that the light received by the package of the PIC is redirected as the angled Gaussian beam at the two-dimensional position towards the lens such that the lens redirects the angled Gaussian beam towards the vertical grating coupler such that it is substantially orthogonal to the light received by the package of the PIC; wherein the vertical grating coupler is housed in the connector. [16] The system of claim 15, further comprising one or more photodiode sensors disposed on the package of the PIC, wherein the one or more photodiode sensors are positioned to receive light reflected away from the connector from the redirected light transmitted by the one or more TDWs. [17] The system of claim 12, 15 or 16, further comprising a waveguide tap monitor having one or more photodiode sensors, the waveguide tap monitor being configured to measure light received from the connector. [18] The system according to at least one of claims 1 to 17, wherein the plurality of layers of p-doped and n-doped silicon are arranged in a checkerboard configuration indicating possible two-dimensional positions. [19] A system comprising: a connector (201; 702; 902; 1002) configured to be connected to a printed optical board (200; POB for “Printed Optical Board”) via an optical waveguide; a package of an integrated optical circuit (202; 520; PIC for “Photonic Integrated Circuit”); and one or more two-dimensionally distributed waveplates (302, 303; 500; 801; 706; 901; TDWs) configured to redirect light between the connector and the package of the PIC, wherein each of the one or more TDWs (302, 303; 500; 801; 706; 901) comprises a plurality of layers (411) of p-doped and n-doped silicon, wherein the one or more TDWs (302, 303; 500; 801; 706; 901) are configured to be driven to change a dielectric constant at a two-dimensional position on the one or more TDWs (302, 303; 500; 801; 706; 901), such that the light received at the one or more TDWs (302, 303; 500; 801; 706; 901) is redirected at the two-dimensional position towards a vertical grating coupler (410; 703; 903).

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