Electrical component, in particular transformer

Abstract

For an electrical component, in particular a transformer, for mounting on a conductor substrate (2), wherein the electrical component (1) comprises at least a housing (20) and contacting elements (10), wherein the contacting elements (10) are provided for electrical contacting the electrical component (1) with conductor tracks of the conductor substrate (2), it is proposed that a metallic surface (22) for soldering the electrical component (1) to the conductor substrate (2) is arranged on the housing (20) of the electrical component (1).

Description

Prior ArtThe invention relates to an electrical component, in particular a transformer for fastening to a conductor substrate and to an assembly comprising such an electrical component.Electrical components, such as transformers, are frequently used for transforming electrical voltage in the field of power electronics. These transformers are frequently designed in SMD (surface-mounted device) construction and can be soldered cost-effectively onto a conductor substrate, for example a printed circuit board (PCB). Electrical assemblies having transformers soldered to printed circuit boards, such as control units of power electronics, are frequently installed in electric vehicles, for example in e-axles.Disclosure of the InventionAccording to the invention, an electrical component, in particular a transformer, is proposed for fastening to a conductor substrate. The electrical component comprises at least one housing and contacting elements, wherein the contacting elements are provided for electrically contacting the electrical component with conductor tracks of the conductor substrate. According to the invention, a metallic surface for soldering the electrical component to the conductor substrate is arranged on the housing of the electrical component.Advantages of the InventionCompared to the prior art, the electrical component having the features of the independent claim has the advantage that not only can the contacting elements of the electrical component be fastened on a conductor substrate, for example a printed circuit board, but also the housing of the electrical component itself can be fastened on the conductor substrate. In order to obtain a better connection of the large electrical component, for example of a transformer, an additional planar solder location, the metallic surface, is created below the electrical component. Both the contacting elements and the housing of the electrical component can be fastened on the conductor substrate by means of SMD technology. Thus, the housing of the electrical component is firmly fastened to the conductor substrate by the metallic surface. Thus, the housing of the electrical component itself is fastened on the conductor substrate. The housing can be bonded directly to the conductor substrate via the metallic surface on the housing.The electrical component can thus be used advantageously in electric vehicles, for example in e-axes. Here, electrical components, for example transformers, are subjected to heavy loads due to vibrations. In addition to the road excitation, these also result in particular in a periodic excitation by the electric machine and the transmission of the electric vehicle. These high vibrational loads have a strong effect on the contacting elements of the electrical components, by means of which the electrical components are connected to conductor substrates. The metal surface on the housing now allows the heavy housing to be fastened directly to the conductor substrate. The load on the contacting elements is thus reduced, since the vibrational excitation of the electrical component is reduced by the better connection to the conductor substrate. Furthermore, the mechanical forces occurring are divided onto a larger connecting surface, whereby the load on the individual contacting elements is reduced. In addition, planar soldering of the housing to the conductor substrate leads to local stiffening of the conductor substrate and thus to a further reduction in the vibration load. Thus, the metallic surface on the housing of the electrical component prevents damage to the electrical component and in particular to the contacting elements of the electrical component due to high mechanical loads.The thermal connection of the electrical component is also improved by the metallic surface which is soldered onto the conductor substrate, since the heat emitted by the electrical component is realized via the flat solder location.Further advantageous embodiments and developments of the invention are made possible by the features specified in the dependent claims.According to an advantageous exemplary embodiment, it is provided that the metallic surface is electrically insulated from the remaining electrically conductive parts of the electrical component, in particular by the housing of the electrical component. The metallic surface is electrically insulated in particular from the contacting elements of the electrical component. The metallic surface is thus electrically insulated from the other electrically conductive parts of the electrical component. The metallic surface does not serve for the electrical contacting of the electrical component. The metallic surface serves exclusively as a soldering location at which the electrical component can be soldered onto the conductor substrate and thus mechanically fastened.According to an advantageous exemplary embodiment, it is provided that the metallic surface is formed on a connecting element, wherein the connecting element is fastened to the housing. The connection element can be designed, for example, as a metal plate.According to an advantageous exemplary embodiment, it is provided that the connection element is glued to the housing or the connection element is injected into the housing. If the connection element is adhesively bonded to the housing, the metallic surface can also be provided in a simple manner subsequently without changing the basic design of the electrical component. If the connection element is injected into the housing of the electrical component, the connection element is connected to the housing particularly well, in particular also thermally. Thus, the electrical component can not only be bonded stably to the conductor substrate via the metallic surface, but heat can additionally also be dissipated from the electrical component to the conductor substrate via the metallic surface.According to an advantageous exemplary embodiment, it is provided that the contacting elements are designed as soldering feet, which are provided to be soldered to conductor tracks of the conductor substrate. Thus, the electrical component can be soldered onto conductor tracks of the conductor substrate, for example by means of SMD technology.According to an advantageous exemplary embodiment, it is provided that the contacting elements protrude from the housing of the electrical component.According to an advantageous exemplary embodiment, it is provided that each of the contact-making elements has a flat connecting foot, wherein the connecting feet extend in the same plane as the metallic surface. The electrical component can thus be placed on the conductor substrate and the connecting feet and the metallic surface soldered onto the conductor substrate, for example by means of SMD technology.According to an advantageous exemplary embodiment, it is provided that the surface has a greater surface extension than the individual connecting feet by a factor of five, in particular by a factor of ten, preferably in particular by a factor of twenty. This ensures that the mechanical fastening of the electrical component is effected mainly by soldering the metallic surface to the conductor substrate, whereas the contacting elements bear a very small part of the mechanical load and are thus relieved.According to an advantageous exemplary embodiment, it is provided that the electrical component is designed as an inductive component, in particular as a transformer. Transformers represent particularly heavy components, so that the fastening of the electrical component via the metallic surface proves to be particularly advantageous, particularly in the case of electrical components designed as transformers.Furthermore, a module comprising an electrical component is proposed, wherein the module further comprises a conductor substrate, wherein the contact-making elements are electrically connected, in particular soldered, to conductor tracks of the conductor substrate, and the metallic surface is soldered to the conductor substrate.Brief Description of the DrawingsAn exemplary embodiment of the invention is illustrated in the drawing and is explained in more detail in the following description. It shows FIG. 1 shows a side view of a first exemplary embodiment of a module having an electrical component and a conductor substrate, FIG. 2 shows a plan view of the electrical component from FIG. 1.Embodiments of the InventionFIG. 1 shows an assembly 100 comprising an electrical component 1 and a conductor substrate 2. The electrical component 1 is fastened to the conductor substrate 2. The electrical component 1 is soldered to the conductor substrate 2.The conductive substrate 2 may be a power substrate, for example, a DBC substrate. The conductor substrate 2 is, for example, a circuit carrier. In this exemplary embodiment, the conductor substrate 2 is designed as a printed circuit board (PCB). However, the conductor substrate can also be, for example, a DBC (Direct Bonded Copper) substrate, an AMB (Active Metal Bonded) substrate, an IMS (Insulated Metal Substrate) or another suitable substrate. Various electrical and / or electronic components such as, for example, power semiconductors such as, for example, field effect transistors such as MIS-FETs (metal insulated semiconductor field effect transistors), IGBTs (insulated gate bipolar transistors), power MOSFETs (metal oxide semiconductor field effect transistors) and / or diodes, for example rectifier diodes, can be arranged on the conductor substrate 2. Furthermore, passive components such as, for example, resistors or capacitors can also be arranged as electrical and / or electronic components on the conductor substrate 2. The conductor substrate 2 comprises conductor tracks, not shown in the figures. The conductor tracks of the carrier substrate can be designed, for example, as conductor surfaces which can carry high currents. Electrical and / or electronic components can be electrically connected to one another or to further electrical and / or electronic elements arranged outside the conductor substrate 2 via the conductor tracks.An electrical component 1 is arranged on the conductor substrate 2. The electrical component 1 can be, for example, an inductive component, for example a choke or a transformer. In the exemplary embodiment shown in the figures, the electrical component 1 is designed as a transformer.The electrical component 1 comprises a housing 20, the housing 20 serving as a carrier for the electrical component 1. The housing 20 is formed from plastic, for example.Furthermore, the electrical component 1 comprises contacting elements 10. Thus, the electrical component 1 can be electrically connected to further conductors, for example to the conductor tracks of the conductor substrate 2, or to further electrical components via the contact-making elements 10. The contact-making elements 10 can be soldered, for example, by means of SMD technology. The contact-making elements 10 have solder points at which they can be soldered, for example, to the conductor tracks of the conductor substrate 2.In the assembly 100, the electrical component 1 is electrically connected to conductor tracks of the conductor substrate 2 by means of the contact elements 10. The contact-making elements 10 are soldered to conductor tracks of the conductor substrate 2. In this exemplary embodiment, the contact-making elements 10 protrude from the housing 20 of the electrical component 1. The contact-making elements 10 are designed as soldering feet 11. Each of the contacting elements 10 has a respective connecting foot 12. Each connecting foot 12 forms a soldering location for the contacting elements 10.A metallic surface 22 is formed on the housing 20 of the electrical component 1. The metallic surface 22 is provided for soldering the electrical component on the conductor substrate 2. The metallic surface 22 forms a soldering location of the electrical component 1. The metallic surface 22 is electrically insulated from the remaining electrically conductive parts of the electrical component 1, for example by a plastic piece which forms part of the housing 20 of the electrical component 1, for example. The metallic surface 22 is formed of a metal, for example, copper. In the exemplary embodiment shown in the figures, the metallic surface 22 is formed on a connecting element 21. The connecting element 21 is fastened to the housing 20. The connection element 21 can be a metal plate, for example, wherein one side of the metal plate forms the metallic surface 22. The connection element 21 can be glued to the housing 20, for example. However, the connecting element 21 can also be injected into the housing 20, for example. The metallic surface 22 can, however, also be formed, for example, as a coating on the housing 20. The metallic surface 22 forms an outer side of the electrical component 1. the metallic surface 22 has a surface extension which is greater than the surface extension of each individual connecting foot 12 by at least a factor of five, in particular by at least a factor of 10, preferably in particular by at least a factor of 20.Of course, further exemplary embodiments and mixed forms of the exemplary embodiments shown are also possible.

Claims

Electrical component, in particular a transformer, for fastening to a conductor substrate (2), wherein the electrical component (1) comprises at least one housing (20) and contact-making elements (10), wherein the contact-making elements (10) are provided for electrically contacting the electrical component (1) with conductor tracks of the conductor substrate (2), characterized in that a metallic surface (22) for soldering the electrical component (1) to the conductor substrate (2) is arranged on the housing (20) of the electrical component (1).Electrical component according to Claim 1, characterized in that the metallic surface (22), in particular by the housing (20) of the electrical component (1), is electrically insulated from the remaining electrically conductive parts of the electrical component (1).Electrical component according to one of the preceding claims, characterized in that the metallic surface (22) is formed on a connecting element (21), wherein the connecting element (21) is fastened to the housing (20).Electrical component according to Claim 3, characterized in that the connection element (21) is adhesively bonded to the housing (20) or the connection element (21) is injected into the housing (20).Electrical component according to one of the preceding claims, characterized in that the contact-making elements (10) are designed as soldering feet (11) which are provided for being soldered to conductor tracks of the conductor substrate (2).Electrical component according to one of the preceding claims, characterized in that the contact-making elements (10) project from the housing (20) of the electrical component (1).Electrical component according to one of the preceding claims, characterized in that each of the contact-making elements (10) has a connection foot (12) which is of planar configuration, the connection feet (12) extending in the same plane as the metallic surface (22).Electrical component according to Claim 7, characterized in that the surface (22) has a greater surface extent than the individual connecting feet (12) by at least a factor of five, in particular by at least a factor of 10, preferably in particular by at least a factor of 20.Electrical component according to one of the preceding claims, characterized in that the electrical component (1) is designed as an inductive component, in particular as a transformer.Assembly comprising an electrical component (1) according to one of the preceding claims, wherein the assembly (100) further comprises a conductor substrate (2), wherein the contact-making elements (10) are electrically connected, in particular soldered, to conductor tracks of the conductor substrate (2), and the metallic surface (22) is soldered to the conductor substrate (3).

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