Component for a semiconductor technology system and process for manufacturing a component for a semiconductor technology system

Abstract

A component (36,Mi) for a semiconductor technology system (1) is provided with at least one electronic component (50) for contactless data exchange, which contains information about the component (36,Mi). The electronic component for contactless data exchange (50) is reversibly attached to the component (36,Mi).

Description

The invention relates to a component for a system of semiconductor technology, wherein the component is provided with at least one electronic component for contactless data exchange, which electronic component has information relating to the component.The invention also relates to a method for producing a component for a system of semiconductor technology, wherein the component is provided with an electronic component for contactless data exchange, which electronic component has information relating to the component.In the prior art, systems for semiconductor technology are systems which are used for producing or checking microstructured components or the components required for them. An example of such an apparatus is a projection exposure apparatus for photolithography.Photolithography is used to produce microstructured devices, such as integrated circuits. The projection exposure apparatus used in this case comprises an illumination system and a projection system. The image of a mask illuminated by the illumination system (also referred to as reticle) is projected in a reducing manner by means of the projection system onto a substrate, for example a silicon wafer, coated with a photosensitive layer and arranged in the image plane of the projection system, in order to transfer the mask structure to a photosensitive coating situated on the substrate.DE 10 2020 201 264 A1 discloses a method for tracking and identifying components of lithography systems and a corresponding lithography system. In this case, the components are provided with a transponder which has a data memory on which data relating to the respective component are stored. The transponder is configured to receive wirelessly incoming signals from a reading device and to respond with data from the data memory. The data memory of the transponder can store a wide variety of information relating to the component.The method described can be used in principle in the field of systems of semiconductor technology and improves the component tracking carried out up to then in paper form, but it still has certain deficiencies, such as the fact that the transponder could be considered disruptive during the later use of the component.It is therefore an object of the present invention to provide a component for a semiconductor technology system and a method for producing such a component, in which monitoring of the component is possible, but interference in the use of the component is avoided.According to the invention, this object is achieved by the features mentioned in claim 1.The component according to the invention for a semiconductor lithography system is provided with at least one electronic component for contactless data exchange, which electronic component has information relating to the component. The electronic component for contactless data exchange is reversibly attached to the component.The electronic component for contactless data exchange, which can be designed, for example, as a transponder, enables the exchange of data, which contain information relating to the component, with different receivers, in order to be able to read out, forward or electronically process data relating to the component in this way.A particular advantage of the solution according to the invention is that the information relating to the component can be obtained from the electronic component for contactless data exchange in a wide variety of ways and with a wide variety of devices, in particular also without the need to approach the component to a specific distance or to keep a reading device or the like at the same. Rather, the location at which the component is located can be determined in a very simple manner by means of suitable devices.For example, this can also easily enable the component to be localized within a factory site. For this purpose, sensors can be mounted on the factory site, for example covering the surface, which sensors come into contact with the electronic component for contactless data exchange and acquire information from the latter.Furthermore, such electronic components for contactless data exchange usually have a data memory on which all relevant information can be stored directly, so that information, for example regarding maintenance, repair or specific processing steps, can be called up directly and on site, in particular without the need to leave a clean room and / or a vacuum environment.Due to the fact that, according to the present invention, the electronic component for contactless data exchange is reversibly attached to the component, it can be removed from the component, for example, before the component is delivered to a customer. This is advantageous, for example, when the information contained on the electronic component for contactless data exchange is internal information, which is not provided for forwarding to third parties. Furthermore, this solution prevents any interference which may occur during the later use of the component on a customer, since the electronic component can already be separated from the component at this time for contactless data exchange.In a very advantageous development of the invention, it can be provided that the component consists of a glass ceramic, in particular of Zerodur®. It is precisely in the case of a component made of a glass ceramic, in particular of Zerodur, that the solution according to the invention can be used very advantageously, since a particularly high exchange of information can be required in the case of such components.A further advantageous embodiment of the invention can consist in the electronic component for contactless data exchange being arranged in a recess of the component and / or in a recess of a receiving element which receives the electronic component for contactless data exchange and is attached to the component. This results in particularly good protection for the electronic component for contactless data exchange, which is accommodated in a kind of pocket, so that in particular no damage to the electronic component for contactless data exchange is to be expected even during production. In particular, if the electronic component for contactless data exchange is arranged in a recess of a receiving element, which receives the electronic component for contactless data exchange and is attached to the component, a fast and simple attachment of the electronic component for contactless data exchange to the component can be achieved with little effort and without leaving any residue.The protection of the electronic component for contactless data exchange can be further increased if the recess with the electronic component arranged therein for contactless data exchange is sealingly closed by means of a cover element. In particular, this results in protection of the electronic component for contactless data exchange from external influences that may occur during production, such as grinding, lapping or washing processes carried out on the component or paint systems or processing chemicals applied to the component.Furthermore, in an advantageous embodiment of the invention, it can be provided that a cavity within the recess that is not occupied by the electronic component for contactless data exchange is filled with a sealant. This prevents movements, vibrations and the like of the electronic component for contactless data exchange during transport processes or the like. Air inclusions are also prevented as a result. Air inclusions can also be avoided by the electronic component being attached to the component in an evacuated environment for contactless data exchange.In order not to impede both the production method of the component and its subsequent use, it can furthermore be provided that the electronic component is attached outside an optically relevant region of the component for contactless data exchange.The solution according to the invention can be used particularly advantageously if the component is designed as an optical element, in particular a lens, a mirror or a diffractive optical element, or a mechanical element, in particular a mount, a frame or a holding element for an element to be processed by means of the installation of semiconductor technology.Claim 8 specifies a method for producing a component of a semiconductor technology system.In this method, the component is provided with an electronic component for contactless data exchange, which electronic component has information relating to the component. The electronic component for contactless data exchange is reversibly attached to the component during the method.With the method according to the invention, the component can be produced in a very simple manner, wherein, due to the reversion of the process, it is particularly advantageous that the electronic component can be removed from the component for contactless data exchange, as a result of which it no longer has to be present on the component in situations in which it is considered disruptive.In a very advantageous development of the method, it can be provided that the component consists of a glass ceramic, in particular of Zerodur. In the case of a component made of a glass ceramic, in particular made of Zerodur, it is particularly complicated to reversibly attach such electronic components to the component for contactless data exchange, which can be achieved, however, with the method according to the invention.A further advantageous embodiment of the method can consist in connecting the electronic component to the component for contactless data exchange by means of additive manufacturing, adhesive bonding, laser welding in such a way that the electronic component can be separated from the component for contactless data exchange. In a further embodiment of the method, the electronic component is fixed to the component by means of magnetic force, but without being connected to the component by creating chemical bonds. A connection of the electronic component for contactless exchange with the component by means of additive manufacturing, adhesive bonding, magnetic force or laser welding is advantageous in particular when the component consists of a glass ceramic, in particular of Zerodur, since this results in a connection, which is secure on the one hand and reversible on the other hand, between the electronic component for contactless data exchange and the component. In this context, it is also possible for the electronic component to be pre-fixed for contactless data exchange before the connection to the component. The prefixing can be effected, for example, by means of one or more magnets.Furthermore, an advantageous embodiment of the method can consist in arranging the electronic component for contactless data exchange in a recess of the component and / or in a recess of a receiving element mounted on the component receiving the electronic component for contactless data exchange, wherein the recess is sealingly closed with the electronic component arranged therein for contactless data exchange by means of a cover element, and wherein the cover element or the receiving element mounted on the component is connected to the component by means of adhesive bonding or laser welding. This enables particularly reliable protection of the electronic component for contactless data exchange. The advantage of using a laser is, among other things, that no additional material is required, whereby contaminants are prevented, and that only a minimal effect on the component is given.In order to reliably prevent interference by the electronic component for contactless data exchange, it can furthermore be provided that the cover element is separated from the recess and / or the electronic component is removed from the recess for contactless data exchange.Furthermore, it can be provided that the electronic component for contactless data exchange is separated from the component by means of laser cutting after its use. This method provides for a particularly simple separation of the electronic component for contactless data exchange and the component.The invention further relates to a system for semiconductor technology having at least one component according to the invention. The invention also extends to an electronic component which has been produced with the aid of a corresponding system of semiconductor technology, wherein the component preferably has structures in the micrometer and / or nanometer range.In connection with the present invention, "installation for semiconductor technology" refers to any installation which can be used for the production or inspection of microstructured components or the components required for this purpose. In addition to projection exposure apparatuses for photolithography, this also includes inspection apparatuses, in particular for masks or wafers, and metrology systems with which masks, wafers or other other optical elements, such as mirrors in particular, can be measured, wherein an increased variability in the illumination can improve the measurement results.Features which have been described in connection with one of the subject matters of the invention, namely given by the component according to the invention, the method according to the invention, the system according to the invention for semiconductor technology or the electronic component, can also be advantageously implemented for the other subject matters of the invention. Likewise, advantages which have been mentioned in connection with one of the subject matters of the invention can also be understood to relate to the other subject matters of the invention.In addition, it should be pointed out that terms such as "comprising", "having" or "having" do not exclude other features or steps. Further, terms such as "a" or "the" that indicate a singular number of steps or features do not exclude a plurality of features or steps - and vice versa.In a heuristic embodiment of the invention, however, it can also be provided that the features introduced in the invention with the terms "comprising", "having" or "with" are listed in the end. Accordingly, one or more enumerations of features within the scope of the invention may be considered as completed, for example considered for each claim. The invention can consist, for example, exclusively of the features mentioned in claim 1.Exemplary embodiments of the invention are described in more detail below with reference to the drawings.The figures each show preferred exemplary embodiments in which individual features of the present invention are shown in combination with one another. Features of an exemplary embodiment can also be implemented separately from the other features of the same exemplary embodiment and can accordingly be easily combined with features of other exemplary embodiments by a person skilled in the art to form further meaningful combinations and sub-combinations.In the figures, functionally identical elements are provided with the same reference numerals.The following are shown: FIG. 1 shows a schematic illustration of a projection exposure apparatus for photolithography with a component according to the invention; FIG. 2 shows a side view of a first embodiment of a component according to the invention in a first state; FIG. 3 shows the component according to the invention from FIG. 2 in a second state; FIG. 4 shows a plan view of a second embodiment of the component according to the invention; and FIG. 5 shows a side view of a third embodiment of the component according to the invention.FIG. 1 shows a projection exposure apparatus 1 for photolithography as an example of an apparatus for semiconductor technology in a schematic meridional section. The projection exposure apparatus 1 comprises an illumination system 10 and a projection system 20.With the aid of the illumination system 10, an object field 11 is illuminated in an object plane or reticle plane 12. For this purpose, the illumination system 10 comprises an exposure radiation source 13 which, in the exemplary embodiment shown, emits illumination radiation at least comprising useful light in the EUV range, that is to say in particular with a wavelength between 5 nm and 30 nm. The exposure radiation source 13 may be a plasma source, for example, an LPP (Laser Produced Plasma) source or a DPP (Gas Discharge Produced Plasma) source. It can also be a synchrotron-based radiation source. The exposure radiation source 13 can also be a free electron laser (FEL).The illumination radiation emanating from the exposure radiation source 13 is initially focused in a collector 14. The collector 14 can be a collector having one or more ellipsoidal and / or hyperbolic reflection surfaces. The illumination radiation can be applied to the at least one reflection surface of the collector 14 in the grazing incidence (Grazing Incidence, GI), that is to say with angles of incidence greater than 45°, or in the normal incidence (Normal Incidence, NI), that is to say with angles of incidence less than 45°. The collector 14 can be structured and / or coated on the one hand for optimizing its reflectivity for the useful radiation and on the other hand for suppressing false light. If the illumination system 10 is constructed in modular construction, the illumination radiation propagates through an intermediate focus in an intermediate focus plane 15, the intermediate focus plane 15 can be used in principle for the-also structural-separation of the illumination system 10 into a radiation source module comprising the illumination radiation source 13 and the collector 14 and the illumination optics 16 described below.In the case of a corresponding separation, the radiation source module and the illumination optical unit 16 then together form a modular illumination system 10.The illumination optical unit 16 comprises a deflecting mirror 17. the deflecting mirror 17 can be a planar deflecting mirror or alternatively a mirror having an effect influencing the beam beyond the pure deflecting effect. Alternatively or additionally, the deflecting mirror 17 can be designed as a spectral filter which separates a used light wavelength of the illumination radiation from false light of a wavelength deviating therefrom.The radiation originating from the exposure radiation source 13 is deflected to a first facet mirror 18 by means of the deflection mirror 17. If the first facet mirror 18 is arranged in a plane of the illumination optical unit 16, as in the present case, which plane is optically conjugate to the reticle plane 12 as a field plane, this is also referred to as a field facet mirror.The first facet mirror 18 comprises a multiplicity of micromirrors 18' which can be individually pivoted about in each case two axes running perpendicular to one another for the controllable formation of facets, which micromirrors are in each case preferably configured with an orientation sensor (not illustrated) for determining the orientation of the micromirror 18'. The first facet mirror 18 is thus a microelectromechanical system (MEMS system), as is also described, for example, in DE 10 2008 009 600 A1.In the beam path of the illumination optical unit 16, a second facet mirror 19 is arranged downstream of the first facet mirror 18, resulting in a double-faceted system, the basic principle of which is also referred to as a honeycomb condenser (fly's eye integrator). If the second facet mirror 19 is arranged-as in the illustrated exemplary embodiment-in a pupil plane of the illumination optical unit 16, this is also referred to as a pupil facet mirror. The second facet mirror 19 can, however, also be arranged at a distance from a pupil plane of the illumination optical unit 16, as a result of which a specular reflector is obtained from the combination of the first and the second facet mirror 18, 19, as is described, for example, in US 2006 / 0132747 A1, EP 1 614 008 B1 and U.S. Pat. No. 6,573,978.The second facet mirror 19 does not fundamentally have to be constructed from pivotable micromirrors, but rather can comprise individual facets formed from one or a manageable number of mirrors which are significantly larger in relation to micromirrors and which are either fixed or can only be tilted between two defined end positions. However, as illustrated, it is likewise possible to provide a microelectromechanical system with the second facet mirror 19 with a plurality of micromirrors 19' which can be individually pivoted about in each case two axes running perpendicular to one another, in each case preferably comprising an orientation sensor.With the aid of the second facet mirror 19, the individual facets of the first facet mirror 18 are imaged into the object field 11, wherein regularly only an approximate image is involved. The second facet mirror 19 can be the last beam-forming mirror or indeed the last mirror for the illumination radiation in the beam path in front of the object field 11.In each case, one of the facets of the second facet mirror 19 is assigned exactly to one of the facets of the first facet mirror 18 for forming an illumination channel for illuminating the object field 11. This can result in particular in illumination according to the Kohler principle.The facets of the first facet mirror 18 are imaged in each case by an associated facet of the second facet mirror 19 in a manner overlapping one another in order to illuminate the object field 11. The illumination of the object field 11 is as homogeneous as possible. It preferably has a uniformity error of less than 2%. The field uniformity can be achieved by superimposing different illumination channels.By selecting the illumination channels used, which is possible without problems by suitable setting of the micromirrors 18' of the first facet mirror 18, the intensity distribution in the entrance pupil of the projection system 20 described below can furthermore be set. This intensity distribution is also referred to as illumination setting. It may be otherwise advantageous to arrange the second facet mirror 19 not exactly in a plane which is optically conjugate to a pupil plane of the projection system 20. In particular, the pupil facet mirror 19 can be arranged tilted with respect to a pupil plane of the projection system 20, as is described, for example, in DE 10 2017 220 586 A1.In the arrangement of the components of the illumination optical unit 16 illustrated in FIG. 1, the second facet mirror 19 is arranged, however, in a surface conjugate to the entry pupil of the projection system 20. Deflecting mirrors 17 and the two facet mirrors 18, 19 are arranged both with respect to the object plane 12 and tilted with respect to one another.In an alternative embodiment of the illumination optics 16, not shown, a transmission optics comprising one or more mirrors can also be provided in the beam path between the second facet mirror 19 and the object field 11. The transmission optics can comprise in particular one or two mirrors for perpendicular incidence (NI mirror, Normal Incidence mirror) and / or one or two mirrors for fringe incidence (GI mirror, Growing Incidence mirror). With an additional transmission optics, in particular different positions of the entrance pupil for the tangential and for the sagittal beam path of the projection system 20 described below can be taken into account.It is alternatively possible for the deflecting mirror 17 shown in FIG. 1 to be dispensed with, for which purpose the facet mirrors 18, 19 can then be arranged suitably with respect to the radiation source 13 and the collector 14.With the aid of the projection system 20, the object field 11 in the reticle plane 12 is transferred to the image field 21 in the image plane 22.For this purpose, the projection system 20 comprises a plurality of mirrors M i, which are numbered in accordance with their arrangement in the beam path of the projection exposure apparatus 1.In the example shown in FIG. 1, the projection system 20 includes six mirrors M 1 to M 6. Alternatives with four, eight, ten, twelve or another number of mirrors M i are also possible. The next to last mirror M 5 and the last mirror M 6 each have a passage opening for the illumination radiation, whereby the projection system 20 shown is a double-obscured optical unit. The projection system 20 has an image-side numerical aperture which is greater than 0.3 and which may also be greater than 0.6 and which may be, for example, 0.7 or 0.75.The reflection surfaces of the mirrors M i can be designed as free-form surfaces without a rotational axis of symmetry. Alternatively, the reflection surfaces of the mirrors M can be designed in i but also as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. The mirrors M i can, like the mirrors of the illumination optical unit 16, have high reflection coatings for the illumination radiation. These reflective coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.The projection system 20 has a large object image offset in the y direction between a y coordinate of a center of the object field 11 and a y coordinate of the center of the image field 21.The projection system 20 can be designed in particular anamorphically, i.e. it has in particular different imaging scales β x, β y in the x and y directions. The two imaging scales β x, β y of the projection system 20 are preferably (β x, β y) = (+ / - 0,25, / +- 0,125). An imaging scale β of 0.25 corresponds to a reduction in the ratio 4:1, while an imaging scale β of 0.125 results in a reduction in the ratio 8:1. A positive sign at the imaging scale β means an imaging without image reversal, a negative sign means an imaging with image reversal.Other imaging scales are also possible. Identical-sign and absolutely identical imaging scales β x, β y in the x and y directions are also possible.The number of intermediate image planes in the x- and y-direction in the beam path between the object field 11 and the image field 21 can be the same or different, depending on the embodiment of the projection system 20. Examples of projection systems 20 with different numbers of such intermediate images in the x and y directions are known from US 2018 / 0074303 A1.The projection system 20 can have, in particular, a homocentre entry pupil. This can be accessible. However, it may also be inaccessible.A reticle 30 (also called a mask) arranged in the object field 11 is exposed by the illumination system 10 and transferred to the image plane 21 by the projection system 20. The reticle 30 is held by a reticle holder 31. The reticle holder 31 is displaceable in particular in a scanning direction via a reticle displacement drive 32. In the exemplary embodiment shown, the scanning direction runs in the y direction.A structure on the reticle 30 is imaged onto a photosensitive layer of a wafer 35 arranged in the region of the image field 21 in the image plane 22, the wafer 35 being held by a wafer holder 36. The wafer holder 36 is displaceable in particular along the y-direction via a wafer displacement drive 37. The displacement of the reticle 30 via the reticle displacement drive 32 on the one hand and of the wafer 35 via the wafer displacement drive 37 on the other hand can take place in synchronization with one another.FIG. 2 shows a component for the installation of semiconductor technology, in the present case embodied as the wafer holder 36 described above, in the present case the projection exposure installation 1. Component 36 or M i preferably consists of a glass ceramic, in particular of Zerodur.The component 36 is provided with at least one electronic component for contactless data exchange 50 having information relating to the component 36. The electronic component for contactless data exchange 50 is reversibly attached to the component 36. As a result, the electronic component for contactless data exchange 50 can be removed from the component 36 at any desired point in time and with little effort.The electronic component for contactless data exchange 50 can be designed, for example, as a transponder, in particular as an RFID or NFC transponder, and it can have a data memory in which complex or detailed data of the component 36 and optionally also its subcomponents can also be stored, in particular also with regard to individualization of the component 36 and / or customer-specific features. A wide variety of data can be stored in the data memory, in particular: data for identifying the type of component 36; ACTUAL data for the production of component 36; data relating to an individualization and / or a customized adaptation of component 36; data relating to the membership of component 36 in a specific lithography system, in particular an individualized and / or a customized lithography system; data relating to properties of component 36 with which it deviates from other components of the same type within the specifications; measurement data of component 36; data relating to a general search, an improvement, a modification, a rehabilitation, or a retrofitting of component 36; data relating to the service, the commissioning, the repair and / or the maintenance of component 36; Data relating to specific production steps of the component 36, such as, for example, specific production methods of individual or all method steps; data relating to the process history; data relating to the material or materials of the component 36; data relating to the calibration of the component 36; data relating to the processing of the component 36; data relating to production features; data relating to product features; data relating to subcomponents of the component 36; data relating to the hardware of the component 36 and / or the type, configuration, arrangement, processing or state of the subcomponents of the component 36; data relating to suppliers; data relating to customers; data relating to additional information; the number of component 36 assigned in a inventory management system. one, a plurality or all of the aforementioned data can also be stored on the data memory for a sub-component, a plurality of sub-components, a group of sub-components or all of the sub-components of component 36.Preferably, the electronic component for contactless data exchange 50 is mounted outside an optically relevant region of the component 36. In the illustrated embodiment, in which the component is the wafer holder 36, the electronic component for contactless data exchange 50 can be attached in an edge or corner region of the wafer holder 36.In the embodiment of the component 36 illustrated in FIGS. 2 and 3, the electronic component for contactless data exchange 50 is arranged in a recess 51 of the component 36, which can be previously produced by means of milling or another suitable method. The recess 51 with the electronic component for contactless data exchange 50 arranged therein is closed, preferably hermetically sealed, by means of a cover element 52. The cover member 52 is preferably joined to the component 36 by adhesive bonding or laser welding. Furthermore, a cavity 53 formed in the recess 51 due to the fact that the electronic contactless communication component 50 is smaller than the recess 51 is filled with a sealant 54, whereby the electronic contactless communication component 50 is poured into the recess 51.In addition to the procedure described above, the electronic component for contactless data exchange 50 can be connected to the component 36 for example by means of additive manufacturing, adhesive bonding, laser welding or another suitable method. This connection is such that the electronic component for contactless data exchange 50 can be separated from the component 36. This separation or separation can take place in particular after the use of the electronic component for contactless data exchange 50, in particular before delivery to a customer, for example by means of laser cutting. Both in laser welding and in laser cutting, an ultra-short pulse laser can be used, for example. Removal by means of breaking out is also possible. For this purpose, in the region of the attachment of the electronic component for contactless data exchange 50 to the component 36, a predetermined breaking point can be provided, which can be separated mechanically or thermally, for example, or the like. Furthermore, it is also possible to remove the electronic component for contactless data exchange 50 from the component 36 in such a way that the electronic component for contactless data exchange 50 is subsequently no longer functional or is destroyed. For example, this could be realized by removing the electronic component for contactless data exchange 50 from the component 36 by means of grinding out, lasering or in a similar manner. Furthermore, it is possible to establish a functionality of the electronic component for contactless data exchange 50, for example by making it non-functional by means of force action, heat, acid or in some other way. These options are also included in the "reversible attachment" of the electronic component for contactless data exchange 50 to the component 36. It is of course to be ensured in this case that the component 36 is not damaged.If the use of the electronic component for contactless data exchange 50 also comprises a use during delivery or a use by the customer, a later separation is also conceivable. FIG. 3 shows the state in which the electronic component for contactless data exchange 50 is separated from the component 36; when the electronic component for contactless data exchange 50 is separated from the component 36, the cover element 52 can be separated from the recess 51, for example.In the embodiment of the component again embodied as the wafer holder 36 illustrated in FIG. 4, a receiving element 55 is provided, which has a recess 56, which corresponds substantially with respect to its function to the recess 51 according to FIGS. 2 and 3. Accordingly, the electronic component for contactless data exchange 50 is arranged in the recess 56 of the receiving element 55. In this embodiment, the receiving element 55 has a similar function to the covering element 52: the receiving element 55 is attached to the component 36 with the electronic component 50 for contactless data exchange, which electronic component is arranged in the recess 56 of the receiving element 55, wherein the recess 56 is sealingly closed by this connection. The connection of the receiving element 55 to the component 36 can in turn be effected by means of laser welding. The use of the sealing means or the casting compound 54 described above is also possible.When separating the electronic component for contactless data exchange 50 from the component 36, for example, the receiving element 55 can be separated from the component 36 in order in this way to remove the electronic component for contactless data exchange 50 from the recess 56 and thereby separate it from the component 36. The receiving element 55 can be separated from the component 36 for example by means of laser cutting.Both the cover element 52 and the receiving element 55, like the component 36, are preferably made of Zerodur. If the component 36 is not made of Zerodur, the cover member 52 and the receiving member 55 should be made of a material having a same or at least similar coefficient of expansion as that of the material of the component 36.FIG. 5 shows a further embodiment of the component 36, in which the reversible attachment of the electronic component for contactless data exchange 50 to the component 36 takes place by means of magnetic force. In this case, the electronic component for contactless data exchange 50 is connected to a magnetic component 57 and enclosed in a receiving element 58. The receiving element 58 in the present case consists of two half shells which are connected to one another by means of laser welding and which preferably consist of glass or another suitable material. The receiving element 58 with the electronic component for contactless data exchange 50 enclosed therein and the magnetic component 57 is attached to the component 36 by abutting it and a further magnetic component 57 being arranged on the opposite side. Here, one of the magnetic members 57 is a magnet.List of reference characters1 Projection exposure apparatus 10 Illumination system 11 Object field 12 Object plane or reticle plane 13 Exposure radiation source 14 Collector 15 Intermediate focus plane 16 Illumination optical unit 17 Deflection mirror 18 First facet mirror 18' Micromirror 19 Second facet mirror 19' Micromirror 20 Projection system 21 Image field 22 Image plane 30 Reticle 31 Reticle holder 32 Reticle displacement drive 35 Wafer 36 Wafer holder 37 Wafer displacement drive 50 Electronic component for contactless data exchange 51 Recess 52 Cover element 53 Cavity 54 Sealing means 55 Receiving element 56 Recess 57 Magnetic component 58 Receiving elementReferences included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 10 2020 201 264 A1

[0005] DE 10 2008 009 600 A1

[0044] US 2006 / 0132747 A1

[0045] EP 1 614 008 B1

[0045] U.S. Pat. No. 6,573,978

[0045] DE 10 2017 220 586 A1

[0050] US 2018 / 0074303 A1

[0061]

Claims

Component (36, M i) for a semiconductor technology installation (1), wherein the component (36, M i) is provided with at least one electronic component for contactless data exchange (50), which has information relating to the component (36, M i) characterized in that the electronic component for contactless data exchange (50) is reversibly attached to the component (36, M i).Component (36, M i) according to Claim 1, characterized in that the component (36, M i) consists of a glass ceramic, in particular of Zerodur.Component (36, M i) according to Claim 1 or 2, characterized in that the electronic component for contactless data exchange (50) is arranged in a recess (51) of the component (36, M i) and / or in a recess (56) of a receiving element (55) which receives the electronic component for contactless data exchange (50) and is attached to the component (36, M i).Component (36, M i) according to Claim 3, characterized in that the recess (51) with the electronic component for contactless data exchange (50) arranged therein is sealingly closed by means of a cover element (52).Component (36, M i) according to Claim 3 or 4, characterized in that a cavity (53) within the recess (51, 56), which cavity is not occupied by the electronic component for contactless data exchange (50), is filled with a sealant (54).Component (36, M i) according to one of Claims 1 to 5, characterized in that the electronic component for contactless data exchange (50) is mounted outside an optically relevant region of the component (36, M i).Component (36, M i) according to one of Claims 1 to 6, characterized in that the component (36, M i) is designed as an optical element, in particular a lens, a mirror or a diffractive optical element, or a mechanical element, in particular a mount, a frame or a holding element for an element to be processed by means of the installation of the semiconductor technology (1).Method for producing a component (36, M i) for a semiconductor technology installation (1), wherein the component (36, M i) is provided with an electronic component for contactless data exchange (50), which has information relating to the component (36, M i) characterized in that the electronic component for contactless data exchange (50) is reversibly attached to the component (36, M i).Method according to claim 8, characterised in that the component (36, M i) consists of a glass ceramic, in particular of Zerodur.Method according to Claim 8 or 9, characterized in that the electronic component for contactless data exchange (50) is connected to the component (36, M i) by means of additive manufacturing, adhesive bonding, laser welding or magnetic force in such a way that the electronic component for contactless data exchange (50) can be separated from the component (36, M i).Method according to one of Claims 8 to 10, characterized in that the electronic component for contactless data exchange (50) is arranged in a recess (51) of the component (36, M i) and / or in a recess (56) of a receiving element (55) which receives the electronic component for contactless data exchange (50) and is attached to the component (36, M i) wherein the recess (51) with the electronic component for contactless data exchange (50) arranged therein is sealingly closed by means of a cover element (52), and wherein the cover element (52) or the receiving element (55) attached to the component (36, M i) is connected to the component (36, M i) by means of adhesive bonding or laser welding.Method according to Claim 11, characterized in that the cover element (52) is separated from the recess (51) and / or the electronic component for contactless data exchange (50) is removed from the recess (51).Method according to one of Claims 8 to 12, characterized in that the electronic component for contactless data exchange (50) is separated from the component (36, M i) by means of laser cutting after use.Installation for semiconductor technology (1) comprising at least one component (36, M i) according to any one of Claims 1 to 7.Electronic component, characterized in that the component is produced using a semiconductor technology system (1) according to Claim 14, the component preferably having structures in the micrometer and / or nanometer range.

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