Method for manufacturing a component

Abstract

A method for manufacturing a component comprises assembling a first component (102), a second component (104) and a reactive multilayer system (106) into a stack, wherein the reactive multilayer system (106) is arranged between the first component (102) and the second component (104), and applying a first voltage potential of an electrical activation voltage to one of the components (102, 104) to activate the reactive multilayer system (106), wherein the application step is carried out during the assembling step to cause the activation of the reactive multilayer system (106) by a current flow through the reactive multilayer system (106) caused by the electrical activation voltage before the first component (102), the second component (104) and the reactive multilayer system (106) are assembled into the stack.

Description

[0001] The present invention relates to a method and a device for producing a component using a reactive multilayer system.

[0002] A reactive multilayer system, such as a reactive multilayer film (RMS), can be used to bond elements.

[0003] The prior art is disclosed in DE 10 2012 110 549 A1 and in DE 10 2014 102 717 A1.

[0004] Against this background, the present invention provides an improved method and an improved device for producing a component according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0005] The energy required for activating a reactive multilayer system can be provided in the form of electrical energy. Advantageously, the electrical energy can be provided via at least one component to be connected by the reactive multilayer system before the individual parts of the component are assembled into a stack.

[0006] A method for manufacturing a component comprises the following steps: Combining a first component, a second component and a reactive multilayer system into a stack, wherein the reactive multilayer system is arranged between the first component and the second component;

[0007] Applying a first voltage potential of an electrical activation voltage for activating the reactive multilayer system to one of the components, wherein the step of applying is carried out during the step of combining in order to effect the activation of the reactive multilayer system by a current flow through the reactive multilayer system caused by the electrical activation voltage before the first component, the second component and the reactive multilayer system are combined to form the stack.

[0008] The component can be an assembly of components. The first component can be an electronic component or a sensor. For example, the first component can be a semiconductor component or a power semiconductor component, a chip, or a wafer. For example, the component can be embodied as a transistor or diode or as a force sensor. The second component can be a carrier for the first component. For example, the second component can be a carrier for electronic components, for example a circuit board, or a substrate, for example a copper substrate or ceramic substrate. The second component can also be a machine element, for example a connecting element or an element for transmitting forces or movements, for example a shaft.The reactive multilayer system can be a reactive multilayer film, or RMS for short, which can provide instant heat for a wide variety of applications across many industries. The reactive multilayer system can be fabricated by vapor deposition of thousands of alternating nanoscale layers, for example, of aluminum and nickel. The reactive multilayer system can be arranged as a film between the components or comprise reactive layers that have been sequentially applied directly to one or both of the components to form the reactive multilayer system. Thus, the components and the reactive multilayer system can be provided as pre-partially assembled parts in the assembling step or as individual parts that can be stacked in the assembling step.The reactive multilayer system can be used to effect a mechanical and electrically conductive connection between the first component and the second component in response to activation. The electrical energy used for activation can be generated in a suitable manner and transferred to the parts to be joined. Activation can also be referred to as ignition of the reactive multilayer system. The activation voltage can be applied to the parts to be joined in such a way that the current flow caused by the activation voltage is introduced into or discharged from the reactive multilayer system via at least one of the components. Thus, the current flow used for activation can be conducted via or through at least one of the components.The magnitude of the activation voltage can be selected such that the current flow in the region of the reactive multilayer system generates sufficient thermal energy to reach the temperature required to activate the reactive multilayer system. By applying the activation voltage at a time when at least one of the components is spaced from the reactive multilayer system, the current flow can cause a flashover in the form of an ignition spark that triggers activation. The component to which the first voltage potential is applied can be the first component or the second component, depending on the embodiment.Depending on the stack design and the introduction of electrical energy, activation can occur, for example, at one or more predefined positions, at a random position, or across a contact surface between the reactive multilayer system and one of the components. The mechanical and electrically conductive connection between the first component and the second component can represent a material connection, which can also be referred to as a multilayer bond, for example, or can be realized by multilayer bonding.

[0009] According to different embodiments, the activation voltage can be applied between the two components, whereby the current flow flows from one of the components into the reactive multilayer system and from the reactive multilayer system into the other of the components, or the activation voltage can be applied between one of the two components and the reactive multilayer system, whereby the current flow flows from the component into the reactive multilayer system, or vice versa.

[0010] For example, the first voltage potential of the activation voltage can be applied to one of the components and the second voltage potential of the activation voltage to the other. This is useful, for example, if the reactive multilayer system cannot be contacted or is difficult to contact.

[0011] For example, in such a case, the first voltage potential can be applied to a side of one of the components facing the reactive multilayer system, and the second voltage potential can be applied to a side of the other of the components facing away from the reactive multilayer system. In this way, the stack can be contacted from one side. Accordingly, the first voltage potential can be applied to a side of one of the components facing away from the reactive multilayer system, and the second voltage potential can also be applied to a side of the other of the components facing away from the reactive multilayer system. In this way, there is considerable freedom with regard to the type of electrical contacting of the stack.

[0012] Alternatively or additionally, the second voltage potential can be applied to the reactive multilayer system. This is advantageous if one of the components does not have a suitable contact area for applying a voltage potential or a suitable connection section for conducting the current flow intended for activation.

[0013] During the merging step, the first component and the second component can be moved relative to each other. Both components can be moved to bring the components closer together, or one of the components can be at rest while the other component is moved toward the stationary component. The reactive multilayer system can already be located on one of the components and thus be moved along with it if necessary. If only one of the components is moved, the merging device used for merging can be designed more simply.

[0014] During the joining step, the first component and / or the second component can be tilted relative to each other. This allows the activation position to be defined and the result of the joining process to be influenced using the reactive multilayer system.

[0015] The joining step can be continued after the activation of the reactive multilayer system. This allows the first component, the reactive multilayer system, and the second component to be pressed together. This can improve the quality of the connection between the components created by the activated reactive multilayer system.

[0016] For example, the activation voltage can be applied to the stack using at least one electrical contact tip. Such a contact tip enables contacting of very small contact surfaces. Furthermore, special connecting elements, such as connectors, on the stack side can be dispensed with.

[0017] In such a case, in the joining step, one of the components can be moved together with an electrical contact tip toward the other component. For example, the first component can be contacted by a first contact tip and moved together with the first contact tip toward the second component. Optionally, the component can be moved using the contact tip.

[0018] The first voltage potential can be applied in a suitable manner, for example simply using an electrical contact tip, to a contact region of one of the components. The contact region can be connected via an electrically conductive connecting section to a contact surface of one of the components facing the reactive multilayer system. In this way, the current flow within the component, i.e. the first component or the second component, can be conducted via the connecting section between the contact region and the contact surface. The contact surface can represent an interface for the flashover and thus for the current flow between the component and the reactive multilayer system. The connecting section can be suitably shaped and, for example, guided along a surface of the component or at least partially through an interior of the component.According to one embodiment, existing structures of the component can be used for the connecting section. The other component can have a corresponding contact region, which can be connected to a corresponding contact surface facing the reactive multilayer system via a corresponding electrically conductive connecting section.

[0019] The reactive multilayer system can be provided as a reactive multilayer film. Such a film can advantageously be prefabricated and suitably cut to size and placed between the components. Alternatively, the reactive multilayer system can be grown on one of the components. This allows for the use of differently shaped reactive multilayer systems.

[0020] A device for producing a said component has the following features: a merging device configured to combine a first component, a second component, and a reactive multilayer system into a stack, wherein the reactive multilayer system is arranged between the first component and the second component; and an application device configured to apply a first voltage potential of an electrical activation voltage for activating the reactive multilayer system to one of the components while the first component, the second component, and the reactive multilayer system are brought together, in order to effect the activation of the reactive multilayer system by a current flow through the reactive multilayer system caused by the electrical activation voltage, before the first component, the second component, and the reactive multilayer system are brought together to form the stack.

[0021] Using the device, the steps of the aforementioned method for manufacturing a component can be advantageously carried out. Known manufacturing devices can be used for the device's devices, with which, for example, components can be held and moved, and with which an electrical voltage can be applied. Accordingly, the joining device can be configured to hold the components and move them toward one another. The application device can optionally comprise a voltage source and, for example, contact tips for contacting at least one of the components.

[0022] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 shows an illustration of an embodiment of a method for producing a component; Fig. 2 shows an illustration of an embodiment of a method for producing a component; Fig. 3 shows an illustration of an embodiment of a method for producing a component; Fig. 4 shows an illustration of an embodiment of a method for producing a component; Fig. 5 shows an illustration of an embodiment of a method for producing a component; Fig. 6 shows an illustration of an embodiment of a method for producing a component; Fig. 7 shows an illustration of an embodiment of a first component; Fig. 8 shows an illustration of an embodiment of a first component; Fig. 9 shows an illustration of an embodiment of a second component; Fig. 10 shows an illustration of an embodiment of a second component; Fig. 11 shows an illustration of an embodiment of a method for producing a component; Fig. 11 shows an illustration of an embodiment of a method for producing a component; Fig. 13 shows an illustration of an embodiment of a method for producing a component; Fig. 14 is a representation of an activation of an embodiment of a reactive multilayer system; and Fig. 15 a flow diagram of an embodiment of a method for producing a component.

[0023] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0024] Fig. Figure 1 shows a schematic representation of an embodiment of a method for manufacturing a component. It shows a not yet fully assembled stack consisting of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104. The reactive multilayer system 106 has not yet been ignited.

[0025] By way of example, the reactive multilayer system 106 is arranged on a surface of the second component 104. The first component 102 is arranged at a distance from the reactive multilayer system 106 on a side of the reactive multilayer system 106 opposite the second component 104 and is moved toward the reactive multilayer system 106.

[0026] The shape and arrangement of the components 102, 104 is only exemplary and can also be interchanged here and in the embodiments described with reference to the following figures, so that, for example, the lower of the Fig. 1 shown components 102, 104 as the first component and the upper one of the in Fig. 1 could also be referred to as a second component.

[0027] According to one embodiment, the first component 102 is an electronic component, for example a semiconductor component, and the second component 104 is a carrier for the first component 102. For example, the second component 104 is a circuit board or a substrate, for example a copper substrate. For example, the first component 102 is a chip, purely by way of example a transistor or a diode. According to one embodiment, after ignition of the reactive multilayer system 106 and complete combination of the first component 102, the reactive multilayer system 106, and the second component into a stack, at least one electrical connection of the first component 102 is permanently electrically and mechanically connected to an electrical contact of the second component 104.

[0028] According to an alternative embodiment, the first component 102 is a sensor, and the second component 104 is a machine element, for example, a shaft for an electric drive or a transmission. For example, the first component 102 is a force sensor that, after the reactive multilayer system 106 has been ignited and the first component 102, the reactive multilayer system 106, and the second component have been fully combined into a stack, is firmly connected to the second component 104 in order to detect a deformation of the second component 104.

[0029] According to one embodiment, the reactive multilayer system 106 comprises a plurality of alternating nanoscale layers and is configured to react exothermically in response to ignition, thereby establishing a material connection between the components 102, 104. For example, the reactive multilayer system 106 is embodied as a reactive multilayer film placed between the components 102, 104. Alternatively, the layers of the reactive multilayer system 106 are grown, for example, on a surface of one of the components 102, 104.

[0030] The ignition temperature required for the activation of the reactive multilayer system 106 is determined according to the approach described here by applying an activation voltage U z to the not yet fully joined stack, whereby the activation voltage U znot between two contact areas of the reactive multilayer system 106, but for example between two contact areas of the components 102, 104 or between a contact area of ​​the reactive multilayer system 106 and a contact area of ​​one of the components 102, 104.

[0031] According to the embodiment shown here, the activation voltage U z between the first component 102 and the reactive multilayer system 106. For example, a positive potential of the activation voltage U z to the first component 102 and a negative potential of the activation voltage U zapplied to the reactive multilayer system 106. This is easily possible according to the exemplary embodiment shown, since the reactive multilayer system 106 has a projection beyond the first component 102. This is thus a reactive multilayer system 106 that protrudes from the first component 102 used as a conductive part. For example only, the second component 104 has a larger area than the first component 102.

[0032] According to one embodiment, the activation voltage U z using a voltage source 108. Alternatively, a current source can be used. The activation voltage U zis applied, for example, to the first component 102 using a first electrical contact tip 110 and to the reactive multilayer system 106 using a second electrical contact tip 112. Needles, for example, can be used as electrical contact tips 110, 112, which are used to apply the activation voltage U z can be placed on suitable contact surfaces of the stack.

[0033] When the electrical contact tips 110, 112 touch, for example, the first component 102 and the reactive multilayer system 106 and the voltage source 108 is active, the activation voltage U za current flow is generated. The corresponding electrical current flows, for example, from the voltage source 108 via the first electrical contact tip 110 into the first component 102, through the first component 102 into the reactive multilayer system 106, through the reactive multilayer system 106, and back to the voltage source 108 via the second electrical contact tip 112.

[0034] Since the first component 102 and the reactive multilayer system 106 are not yet in contact, the current flow only occurs when the first component 102 has approached the reactive multilayer system 106 to such an extent that a flashover in the form of an ignition spark 115 bridges a gap between the first component 102 and the reactive multilayer system 106.

[0035] As an alternative to the embodiment shown, the activation voltage U zbetween the second component 104 and the reactive multilayer system 106. For this purpose, for example, the first electrical contact tip 110 is applied to the second component 104.

[0036] The polarity of voltage source 108 is chosen here and in the following embodiments only as an example and can also be reversed. As an alternative to a direct voltage, an alternating voltage can also be used.

[0037] For example only, the activation voltage U z on the one hand, to a surface of the reactive multilayer system 106 opposite the second component 104, and on the other hand, to a surface of the first component 102 facing away from the reactive multilayer system 106. For example, the reactive multilayer system 106 protrudes beyond the first component 102, thus being larger in area than the first component.

[0038] The reactive multilayer film (RMS), which can be used as a reactive multilayer system 106 according to one embodiment, is a film that provides instant heat for a wide variety of applications in many industries. This reactive multilayer film is produced by vapor deposition of thousands of alternating nanoscale layers, for example, made of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source, thus eliminating the need for additional optical or thermal sources. Such sources can optionally be used additionally. The reactive multilayer system 106 reacts exothermically and releases precise local heat up to 1500°C in fractions of a second.

[0039] Because the reactive multilayer system 106 is not activated by applying an activation voltage only to the reactive multilayer system 106, by a special laser, or by applying a direct heat source to the reactive multilayer system 106, it is not necessary for the reactive multilayer system 106 to be accessible for ignition. Thus, the reactive multilayer system 106, for example, the foil, can be located inside or smaller than the components to be connected, here the components 102, 104. It is also not necessary for the reactive multilayer system 106 to require excess material or ignition tabs through which the energy can be introduced. Furthermore, it is not harmful if surrounding components or geometries block access to the reactive multilayer system 106 for ignition, for example, by means of a laser beam.As a result, the design of the component arrangement and thus of the component to be manufactured is subject to only minor restrictions.

[0040] The described approach provides, for example, a small local energy pulse to trigger the activation of the reactive multilayer system 106 by means of a current through an approaching conductive part, here, for example, the first component 102, which is part of the stack in the form of an RMS composite system. This current can flow between an electrically conductive part, for example, the first electrical contact tip 110 as the positive pole, and another electrical part, for example, the second electrical contact tip 112 as the negative pole. The current can flow within the stack, for example, between the first component 102 and the second component 104, or through only one electrically conductive component of the stack, for example, through the first component 102 and the reactive multilayer system 106, as in Fig. 1. The energy introduced into the reactive multilayer system 106 by the current can be used during the approach to trigger the reactive multilayer system 106, for example, to ignite the RMS foil. This allows the reactive multilayer system 106 to be activated without the usual design limitations that arise from other activation methods.

[0041] By using the current conducted through at least one of the components 102, 104 to activate the reactive multilayer system 106, it is also not necessary for the reactive multilayer system 106 to be accessible and thus larger than the actual area to be connected in order to activate the reactive multilayer system 106. This avoids additional material costs, since the method described here for activating the reactive multilayer system 106 by current through an approaching conductive part does not require additional material. This allows the required reactive multilayer film material to be kept to a minimum.

[0042] Since the reactive multilayer system 106 does not require the reactive multilayer system 106 to be accessible and thus larger than the surface to be bonded, it is possible to prevent protruding reactive material from the reactive multilayer system 106 from splashing or otherwise contaminating surrounding components during the reaction of the reactive multilayer system 106. This prevents contamination of surrounding components by protruding material from the reactive multilayer system 106.

[0043] According to one embodiment, the first component 102 represents, for example, a bare chip, i.e., an unpackaged chip, which is connected to the reactive multilayer system 106, for example, an RMS film, with the second component 104, for example, a substrate. For example, a small local energy pulse is provided to activate the reactive multilayer film by means of a current through an approaching conductive component that is part of the RMS composite system. The approach speed of the approaching conductive component and the subsequent contact pressure represent suitably selected parameters of the manufacturing process.

[0044] Instead of generating the small local energy pulse for activating the reactive multilayer system 106 by a current flowing only through this reactive multilayer system 106, the approach described here has a number of advantages. For example, the reactive multilayer system 106, for example, an RMS foil, can be the same size as or smaller than the components to be connected, here the devices 102, 104, so that no excess material or ignition tabs are required. Multiple internal RMS bonds, for example, the gate and source pads of a transistor, can be produced. The required reactive material for the reactive multilayer system 106 can be kept to a minimum. Contamination of surrounding components by excess material of the reactive multilayer system 106 can be avoided. Such an RMS activation method is well suited for series production due to its good ability to provide RMS ignition energy.

[0045] The energized approach creates an electrical arc to the reactive multilayer system 106, which supports the activation of the reactive multilayer system 106. This improves, among other things, the activation of large-area RMS connections.

[0046] According to one embodiment, the following steps are carried out to produce a component and thus to activate the reactive multilayer system 106 by means of an approach of a conductive part through which a current is passed: First, an RMS foil used for the reactive multilayer system 106 is cut.

[0047] Subsequently, the second component 104, for example a substrate, and the reactive multilayer system 106 in the form of the cut RMS foil are placed on top of each other.

[0048] The first component 102, for example in the form of a part, is contacted, for example, with the first electrical contact tip 110, which optionally represents a positive pole, and the second component 104 is contacted, for example, with the second electrical contact tip 112, which optionally represents a negative pole.

[0049] The activation voltage U z is supplied via the electrical contact tips 110, 112.

[0050] The reactive multilayer system 106 is activated, i.e. ignited, by bringing the first component 102 closer to the reactive multilayer system 106 while the activation voltage U z is present.

[0051] The first electrical contact tip 110 is connected to the first component 102, and the second electrical contact tip 112 is connected to the reactive multilayer system 106. Upon approach and during activation of the reactive multilayer system 106, the current flows directly from the first component 102 to the reactive multilayer system 106.

[0052] The position of the electrical arcing, i.e., the ignition spark 115, and thus the position of activation of the reactive multilayer system 106, can be manipulated by mutually tilting the first component 102 or the reactive multilayer system 106, for example, the contacted part or substrate and the RMS foil. The electrical arcing then occurs at the closest location. This allows the bonding result to be influenced.

[0053] To provide the activation voltage U zor the small local energy pulse to trigger the activation of the reactive multilayer system 106 by means of a current through an approaching conductive part, which is part of the RMS composite system, are, in addition to the Fig. 1, in which both the first component 102 and the reactive multilayer system 106 are contacted, further possibilities can be realized, as shown by way of example in the following figures.

[0054] Fig. Figure 2 shows a schematic representation of an embodiment of a method for manufacturing a component. Shown is Fig. 1 shows a not yet fully assembled stack of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104. The reactive multilayer system 106 has not yet been ignited.

[0055] In contrast to the one based on Fig. 1, contact was made between both the first component 102 and the second component 104. Thus, the activation voltage U z between the first component 102 and the second component 104. For example, a positive potential of the activation voltage U z to the first component 102 and a negative potential of the activation voltage U z to the second component 106. Thus, for example, the first electrical contact tip 110 is applied to the first component 102 and the second electrical contact tip 112 is applied to the second component 104.

[0056] Thus, the first electrical contact tip 110 is connected to the first component 102, and the second electrical contact tip 112 is connected to the second component 104. Upon approach and during activation of the reactive multilayer system 106, the current flows from the first component 102 through the reactive multilayer system 106 to the second component 104.

[0057] For example only, the activation voltage U z on the one hand, to a surface of the second component 104 facing the reactive multilayer system 106, and on the other hand, to a surface of the first component 102 facing away from the reactive multilayer system 106. For example, the reactive multilayer system 106 protrudes beyond the first component 102, thus being larger in area than the first component 102.

[0058] Fig. 3 shows a schematic representation of an embodiment of a method for manufacturing a component. In contrast to the method described with reference to Fig. In the embodiment described in Figure 2, the reactive multilayer system 106 has no overhang beyond the first component 102. Instead, it is a matching reactive multilayer system 106. For example, the reactive multilayer system 106 is flush with the peripheral edge of the first component 102 as soon as the first component 102 is completely close to the reactive multilayer system 106.

[0059] Fig. 4 shows a schematic representation of an embodiment of a method for manufacturing a component. In contrast to the method described with reference to Fig. 2, the reactive multilayer system 106 is designed to be smaller in area than the first component 102, whereby the first component 102 has a projection over the reactive multilayer system 106 as soon as the first component 102 is completely approached to the reactive multilayer system 106.

[0060] Fig. Figure 5 shows a schematic representation of an embodiment of a method for manufacturing a component. As in the previous figures, it shows a not yet fully assembled stack consisting of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104. The reactive multilayer system 106 has not yet been ignited.

[0061] In contrast to the exemplary embodiments described with reference to the preceding figures, the reactive multilayer system 106 is arranged on the first component 102. The composite of the reactive multilayer system 106 and the first component 102 performs a relative movement to bring the composite closer to the second component 104. For example, the second component 104 is at rest, and the composite is moved toward the second component 102.

[0062] Contact is made both on the reactive multilayer system 106 and on the second component 104. Thus, the activation voltage U z between the reactive multilayer system 106 and the second component 104. For example, a positive potential of the activation voltage U z to the reactive multilayer system 106 and a negative potential of the activation voltage U zapplied to the second component 106. Thus, for example, the first electrical contact tip 110 is applied to the reactive multilayer system 106 and the second electrical contact tip 112 is applied to the second component 104.

[0063] Thus, the first electrical contact tip 110 is connected to the reactive multilayer system 106, and the second electrical contact tip 112 is connected to the second component 104. Upon approach and during activation of the reactive multilayer system 106, the current from the reactive multilayer system 106 flows directly to the second component 104.

[0064] In this as well as in the other embodiments, the electrical contact tips 110, 112 can be interchanged.

[0065] For example only, the activation voltage U zon the one hand, to a surface of the reactive multilayer system 106 facing the first component 102, and on the other hand, to a surface of the second component 104 facing the reactive multilayer system 106. For example, the reactive multilayer system 106 protrudes beyond the first component 102, thus being larger in area than the first component 102.

[0066] Fig. 6 shows a schematic representation of an embodiment of a method for manufacturing a component. According to the method described with reference to Fig. In the embodiment described in Figure 5, the first component 102 and the reactive multilayer system 106 represent a composite which is brought closer to the second component 104.

[0067] In contrast to the one based on Fig. 5, the first electrical measuring tip 110 does not contact the reactive multilayer system 106, but the first component 102, as can be seen, for example, from Fig. 2. The reactive multilayer system 106 has no overhang beyond the first component 102 and optionally terminates flush with the first component 102.

[0068] According to one embodiment, the reactive multilayer system 106 is grown on the first component 102.

[0069] The approach described here for activating the reactive multilayer system 106 by current through a conductive part is therefore also suitable for the reactive multilayer system 106 in the form of a directly grown reactive multilayer system on one of the components 102, 104, for example on an electrically conductive part, e.g., a bare chip, or on a substrate.

[0070] The described approach enables subsequent electrical testing, e.g., via conductance measurement, of the bond connection produced by activating the reactive multilayer system 106 without attaching additional measuring tips, since the electrical contacts for activation, e.g., the electrical contact tips 110, 112 of the reactive multilayer system 106, are already present.

[0071] Fig. Figure 7 shows an illustration of an embodiment of a first component 102, as described, for example, with reference to the preceding figures. The first component 102 can be made entirely of an electrically conductive or electrically conducting material, or as in Fig. 7 have at least one electrically conductive region 740 and at least one electrically non-conductive region 742.

[0072] By way of example, the first component 102 has only a single electrically conductive region 740, which is surrounded by electrically non-conductive regions 742 and extends over the entire height of the first component 102, such that a current flow is possible via the electrically conductive region 740 from a surface facing away from the reactive multilayer system to a side of the first component 102 facing or capable of facing the reactive multilayer system.

[0073] The electrically conductive region 740 forms, for example, a connecting section 750 through which a current caused by the activation voltage can flow. For example, a first voltage potential of the activation voltage is applied, for example using an electrical contact tip or another contacting device, to a contact region 752 of the first component 102 formed by the conductive region 740 or electrically conductively connected to the conductive region 740. The connecting section 750 electrically conductively connects the contact region 752 to a contacting area 754 of the first component. The contacting area 754 represents an interface to the reactive multilayer system for the current caused by the activation voltage.

[0074] Fig. Fig. 8 shows an illustration of an embodiment of a first component 102, as it is illustrated, for example, by Fig. 7, but with the difference that the first component 102 has a plurality of electrically conductive regions 740 that are spaced apart from one another and each electrically insulated from one another by electrically non-conductive regions 742. For example, two of the electrically conductive regions 740 are embedded in electrically non-conductive regions 742, and one electrically conductive region 740 extends along an edge of the first component 102. In this way, three separate current flows through the first component 102 are possible, so that, for example, three separate reactive multilayer systems can be activated.

[0075] Fig. 9 shows an illustration of an embodiment of a second component 104. The second component 104 is designed in accordance with the embodiment described with reference to Fig. 7 described first component with only one electrically conductive region 740.

[0076] Fig. 10 shows an illustration of an embodiment of a second component 104 which, in contrast to the one shown in Fig. 9 has a plurality of, for example, two electrically conductive regions 740. For example, one of the two electrically conductive regions 740 is significantly larger, for example, at least five times as large as the other electrically conductive region 740.

[0077] As shown by the Fig. As shown in Figures 7 to 10, the first component and, additionally or alternatively, the second component can be partially electrically conductive and electrically non-conductive. Several separate electrically conductive segments are also possible, e.g., gate and source pads of a transistor or a specially developed separate electrically conductive segment for activating the reactive multilayer system or multiple reactive multilayer systems. Several separate electrically conductive segments enable the activation of several separate reactive multilayer systems, e.g., to connect separate electrical contacts such as the gate and source.

[0078] Thus, the contacting surfaces of the first component represent, for example, electrical connections of the first component and the contacting surfaces of the second component represent, for example, connection surfaces of the second component for electrically contacting the connections of the first component. Alternatively, the contacting surfaces are, for example, only sections of surfaces of the components.

[0079] Fig. 11 shows an illustration of an embodiment of a method for manufacturing a component. It shows a second component 104, for example a substrate, on whose surface a reactive multilayer system 106 is already placed, as is shown, for example, in FIG. Fig. 2 is described.

[0080] A first component 102 is already contacted by a first electrical contact tip 110. Optionally, the first electrical contact tip 110 is soldered to the first component 102. The first component 102 is arranged adjacent to the composite of the second component 104 and the reactive multilayer system 106.

[0081] Fig. 12 shows an illustration of an embodiment of a method for manufacturing a component. It shows the method already described with reference to Fig. 11 described composite of the second component 104 and the reactive multilayer system 106.

[0082] The second component 104 is contacted via a second electrical contact tip 112.

[0083] The first component 102 contacted by the first electrical contact tip 110 is held by a joining device 1260 and moved toward the reactive multilayer system 106. For example, the joining device 1260 comprises a movable rod, to the end of which a suction cup is attached for holding the first component 102.

[0084] According to one embodiment, the activation voltage is already present between the first component 102 and the second component 104. However, no current flow occurs yet, since the first component 102 is still too far away from the reactive multilayer system 106. The current flow, and thus the activation of the reactive multilayer system 106, occurs as soon as the first component 102 and the reactive multilayer system 106 have approached sufficiently close to enable a flashover.

[0085] Fig. 13 shows an illustration of an embodiment of a method for producing a component 1300. After the Fig. Once the first component 102 shown in Figure 12 was brought sufficiently close to the reactive multilayer system, the reactive multilayer system was activated by an ignition spark. Subsequently, the first component 102 was moved completely toward the reactive multilayer system using the joining device 1260 and pressed against the second component 104. Due to the reaction of the reactive multilayer system following the activation, the components 102, 104 were integrally bonded to form the component 1300.

[0086] Fig. 14 shows a schematic representation of a reaction of an embodiment of a reactive multi-layer system 106 to a reacted reactive multi-layer system 1406, as used, for example, to produce a component as shown in Fig. 13. The reactive multilayer system 106 is constructed, for example, from a plurality of first layers 1430 and a plurality of second layers 1432 arranged alternately, with optionally intermixed regions 1434 being located between adjacent layers 1430, 1432.

[0087] A position of an activation is shown schematically, exemplified in the form of an ignition spark 115. Starting from the position of activation, the material of the reactive multilayer system 106 reacts to form reacted material of the reacted reactive multilayer system 1406. A corresponding propagation direction 1436 is indicated by an arrow.

[0088] The reactive multilayer system 106, according to one embodiment, is a reactive multilayer film. This is a film that provides instant heat for a variety of applications in many industries. This reactive multilayer film is manufactured by vapor deposition of thousands of alternating nanoscale layers, which are Fig. 11 are schematically represented by the layers 1430, 1432 and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source, as described in Fig. 11 is schematically represented by the ignition spark 422. The reactive multi-layer system 106 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second.

[0089] In this way, a connection that is both electrically and thermally conductive can be made, e.g. between a bare chip in electronics and a leadframe, a packaged chip and a printed circuit board, etc. - ie generally a connection between two parts, which are referred to here as components by way of example.

[0090] Fig. 15 shows a flow diagram of an embodiment of a method for manufacturing a component. The component, for example, the component illustrated in Fig. The component shown in Figure 13 can be manufactured using a not yet assembled stack of a first component, a second component and a reactive multilayer system, as shown in the preceding figures.

[0091] For this purpose, in a step 1501, the first component, the second component, and the reactive multilayer system are combined to form a stack. During the combining process, i.e., before all individual parts are actually stacked on top of one another, in a step 1503, an electrical activation voltage is applied between at least two of the approaching individual parts. These approaching individual parts perform a relative movement to one another, with either both individual parts moving or only one of the individual parts moving and the other remaining stationary. A first voltage potential of the electrical activation voltage is applied to one of the components. A second voltage potential of the electrical activation voltage is applied to the other of the components or to the reactive multilayer system.When the individual parts between which the electrical activation voltage is applied are brought very close together, a current flow induced by the electrical activation voltage can flow between them, despite an air gap. This current flow activates the reactive multilayer system.

[0092] While the individual parts are brought together in step 1501, the individual parts are aligned parallel to each other or tilted relative to each other. Accordingly, according to one embodiment, in step 1501, at least one of the individual parts is tilted during the merging.

[0093] After activation of the reactive multilayer system, the first component, the reacting or already reacted reactive multilayer system and the second component are pressed together according to one embodiment, for example by continuing a movement started in step 1501 of bringing them together. Reference symbol 102 first component 104 second component 106 reactive multilayer system 108 Voltage source 110 first contact tip 112 second contact tip 115 Ignition spark 740 electrically conductive area 742 electrically insulating area 750 connecting section 752 Contact area 754 contact surface 1260 merging device 1300 components 1406 activated reactive multilayer system 1430 first layer 1432 second layer 1434 mixed regions 1436 Propagation direction 1501 Merge step 1503 Step of creating

Claims

[1] A method for manufacturing a component (1300), the method comprising the following steps: Combining (1501) a first component (102), a second component (104) and a reactive multilayer system (106) into a stack, wherein the reactive multilayer system (106) is arranged between the first component (102) and the second component (104); and Applying (1503) a first voltage potential of an electrical activation voltage for activating the reactive multilayer system (106) to one of the components (102, 104), wherein the first voltage potential of the electrical activation voltage is applied to the one of the components (102, 104) before the one of the components (102, 104) touches the reactive multilayer system (106), wherein the step of applying (1503) is carried out during the step (1501) of merging in order to effect the activation of the reactive multilayer system (106) by a current flow through the reactive multilayer system (106) brought about by means of the electrical activation voltage, before the first component (102), the second component (104) and the reactive multilayer system (106) are brought together to form the stack. [2] The method of claim 1, wherein in the step (1503) of applying, a second voltage potential of the activation voltage is applied to the other of the devices (102, 104). [3] Method according to claim 2, wherein in the step (1503) of applying, the first voltage potential is applied to a side of one of the components (102, 104) facing away from the reactive multilayer system (106) and wherein the second voltage potential is applied to a side of the other of the components (102, 104) facing the reactive multilayer system (106). [4] The method of claim 1, wherein in the step (1503) of applying, a second voltage potential is applied to the reactive multilayer system (106). [5] Method according to one of the preceding claims, wherein in the step (1501) of bringing together the first component (102) and the second component (104) are moved relative to each other. [6] Method according to one of the preceding claims, wherein in the step of bringing together the first component (102) and / or the second component (104) are tilted relative to one another. [7] Method according to one of the preceding claims, wherein the step (1501) of merging is continued after the activation of the reactive multilayer system (106) in order to press the first component (102), the reactive multilayer system (106) and the second component (104) together. [8] A method according to any one of the preceding claims, wherein in the step (1503) of applying, the activation voltage is applied to the stack using at least one electrical contact tip (110, 112). [9] Method according to claim 8, wherein in the step of bringing together, one of the components (102, 104) is moved together with the electrical contact tip (110) in the direction of the other of the components (102, 104). [10] Method according to one of the preceding claims, wherein in the step (1503) of applying the first voltage potential is applied to a contact region (752) of one of the components (102, 104), wherein the contact region (752) is connected via an electrically conductive connecting section (750) to a contacting surface (754) of one of the components (102, 104) contacting the reactive multilayer system (106). [11] Method according to one of the preceding claims, wherein in the step (1501) of merging, the first component (102) is provided as an electronic component or as a sensor and the second component (104) is provided as a carrier for electronic components or as a machine element. [12] Method according to one of the preceding claims, wherein in the step (1501) of merging the reactive multilayer system (106) is provided as a reactive multilayer film.

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