Method for operating a machining device with at least one machining unit, in particular a laser drilling unit

Abstract

The invention relates to a method for operating a processing device (10a; 10b; 10c; 10d) with at least one processing unit (12a; 12b; 12c; 12d), in particular a laser drilling unit, wherein in at least one processing step (20a; 20b; 20c; 20d) at least one through-hole (14a; 14b; 14c; 14d) is created in the substrate for an electrochemical cell (16a; 16b; 16c; 16d) by means of the processing unit (12a; 12b; 12c; 12d) by means of a laser pulse (22a; 22b; 22c; 22d). It is proposed that in at least one processing step (20a; 20b; 20c; 20d) using the processing unit (12a; 12b; 12c; 12d) to generate a single through-hole (14a; 14b; 14c; 14d), at least one further laser pulse (24a; 24b; 24c; 24d) is generated, wherein the at least one further laser pulse (24a; 24b; 24c; 24d) is used for processing using the processing unit (12a; 12b; 12c; 12d) at least substantially partially overlapping in time with the first laser pulse (22a; 22b; 22c; 22d).

Description

State of the art

[0001] A method for operating a processing device having at least one processing unit, in particular a laser drilling unit, wherein in at least one processing step at least one single through-hole is introduced into the substrate for an electrochemical cell by means of a laser pulse by means of the processing unit has already been proposed. Disclosure of the invention

[0002] The invention is based on a method for operating a processing device having at least one processing unit, in particular a laser drilling unit, wherein in at least one processing step, at least one single through-hole is introduced into the substrate for an electrochemical cell by means of the processing unit by means of a laser pulse.

[0003] It is proposed that in the at least one processing step, at least one further laser pulse is generated by means of the processing unit for producing the individual through-hole, wherein the at least one further laser pulse is used for processing by means of the processing unit, at least substantially partially overlapping in time with the first laser pulse.

[0004] In this context, a “processing device” should be understood to mean, in particular, a device that is configured to process a substrate. In particular, the processing device is configured to process a substrate for an electrochemical cell. The processing device is preferably designed in several parts. Preferably, a non-cutting machining process is carried out with the processing device. Furthermore, the processing device preferably has a holder for the substrate for an electrochemical cell. Preferably, direct processing of the substrate is carried out in one processing step. Alternatively, indirect processing of the substrate by the processing device is also conceivable. Particularly preferably, the processing device is configured to carry out all necessary steps, for example a process gas supply and / or a processing step.The fact that an object is configured for a specific function should be understood in particular to mean that the object fulfils and / or executes this specific function in at least one application and / or operating state.

[0005] In this context, a “substrate for an electrochemical cell” should preferably be understood to mean a substrate that is intended for use in a fuel cell. Preferably, the substrate for an electrochemical cell is in the form of a sheet metal. Preferably, the substrate is intended for use in an electrolytic cell. Particularly preferably, the substrate for an electrochemical cell is used in a solid oxide fuel cell. Furthermore, a substrate made of a pre-sintered ceramic is conceivable. Furthermore, other materials that appear appropriate to a person skilled in the art are also conceivable. In this context, a non-shrinking material should be understood to mean materials that do not shrink further during a shrinking process, for example a sintering process, and / or that have already been shrunk beforehand, for example by a sintering process.

[0006] In this context, a “processing unit” should be understood to mean, in particular, a unit that is configured to process a substrate. The processing unit is preferably provided for creating recesses, in particular through-holes, in the substrate. Preferably, a plurality of through-holes are created in a substrate for an electrochemical cell by the processing unit. In particular, the substrate for an electrochemical cell absorbs the thermal energy introduced by the processing unit. In particular, the creation of multiple through-holes leads to an accumulation of thermal energy in the substrate for an electrochemical cell. The processing unit preferably has, in particular, at least one non-cutting tool for creating recesses. The processing unit is preferably designed in several parts.The processing unit is preferably configured to generate at least one laser beam. The processing unit is preferably configured to generate a laser pulse. The processing unit is preferably configured to generate a single laser pulse and / or a plurality of consecutive laser pulses. The processing unit is particularly preferably configured to generate a plurality of laser pulses at least substantially simultaneously and / or superimposed in time. In this context, "at least substantially" is to be understood in particular to mean that a deviation from a predetermined value deviates by, in particular, less than 25%, preferably less than 10%, and particularly preferably less than 5% of the predetermined value.

[0007] Particularly preferably, the processing unit is designed as a laser drill. In particular, the processing unit is configured to process at least one surface of the substrate for an electrochemical cell. Preferably, energy is introduced locally by the laser pulse generated by the processing unit. Particularly preferably, the energy is locally so great that the surface of the substrate is at least substantially partially, preferably largely, particularly preferably completely melted and / or evaporated. Alternatively, melting, in particular complete, with evaporation, in particular at least substantially partial, is also conceivable. Preferably, by processing the surface of the substrate for an electrochemical cell, at least one recess is created in the substrate for an electrochemical cell.Particularly preferably, a through-hole is formed in the substrate for an electrochemical cell by machining the surface of the substrate for an electrochemical cell. In particular, through-holes with a diameter of preferably a maximum of 100 µm, preferably a maximum of 50 µm, and particularly preferably less than 25 µm are conceivable.

[0008] The through-holes are preferably formed in a defined grid. The through-holes are preferably formed in the substrate for an electrochemical cell with a defined drilling rate of preferably at least 1000 holes / s, more preferably at least 5000 holes / s, and particularly preferably at least 10,000 holes / s. The through-hole is preferably arranged perpendicular to a main extension plane of the substrate for an electrochemical cell. A "main extension plane" of a structural unit is to be understood in particular as a plane which is parallel to a largest side surface of a smallest imaginary cuboid which just completely encloses the structural unit and in particular runs through the center of the cuboid. The processing unit preferably focuses the laser pulse.

[0009] In this context, a "processing step" is understood to mean, in particular, a method step in which processing is carried out by means of the processing unit. Preferably, thermal energy is introduced into the substrate for an electrochemical cell in the processing step. Particularly preferably, a recess is introduced into the substrate for an electrochemical cell in the at least one processing step. Particularly preferably, a through-hole is introduced into the substrate for an electrochemical cell in the at least one processing step.

[0010] The processing step preferably consists of at least two sub-steps. Preferably, in a first sub-step, the material on the surface of the substrate for an electrochemical cell is heated and / or melted. Preferably, in a further sub-step, the heated and molten material of the substrate for an electrochemical cell is vaporized and / or expelled. Preferably, in the first sub-step, the largest possible amount of melt is generated, with this melt being vaporized and expelled from the borehole in a further sub-step. In particular, the first sub-step and the second sub-step require different process parameters to fulfill their respective tasks. In particular, the process parameters are to be understood as the time scales, the laser power, the laser energy, and the laser intensity.Preferably, a moderate laser power and a longer beam time are required in a first sub-step. Preferably, a high intensity and a short time are required in a further sub-step to generate a high vapor pressure to expel the melt from the drilled channel. Preferably, the first sub-step and the second sub-step are carried out at least partially overlapping in a single processing step. Particularly preferably, a first sub-step is carried out superimposed with several further sub-steps.

[0011] The inventive design of the machining device makes it possible to provide advantageous properties with regard to the drilling rate. In particular, by adapting the process strategy and the process parameters, an advantageous increase in the drilling rate is enabled compared to the prior art. In particular, advantageous properties with regard to thermal accumulation can be provided. This makes it possible to achieve particularly advantageous properties with regard to thermal distortion. This makes it possible to provide particularly advantageous properties with regard to process quality. In particular, advantageous properties with regard to cost efficiency can be provided.

[0012] Furthermore, it is proposed that the first laser pulse and the further laser pulse be used in a superimposed manner in at least one processing step. Preferably, a first laser pulse is used in a first sub-step. Preferably, a further laser pulse is used in a further sub-step. Preferably, the first laser pulse and the further laser pulse overlap at least partially, particularly preferably at least substantially completely, in one processing step. In this context, “at least substantially partially” is to be understood in particular as an overlap between a first laser pulse and a further laser pulse of preferably at least 50%, preferably at least 65%, and particularly preferably at least 80%.In this context, "at least substantially" should be understood to mean, in particular, that a deviation from a predetermined value deviates by less than 15%, preferably less than 10%, and particularly preferably less than 5% of the predetermined value. This can provide particularly advantageous properties with regard to process control and process quality. In particular, advantageous properties with regard to thermal accumulation and thermal distortion can be provided.

[0013] According to a further exemplary embodiment, it is proposed that in at least one processing step the further laser pulse is formed from a plurality of individual pulses. Preferably, the further laser pulse in the processing step is composed of at least two individual pulses. Preferably, the individual pulses are generated individually in the processing step. Preferably, the individual pulses in the processing step are spaced apart on a time axis. Alternatively, it is conceivable for the individual pulses to at least substantially partially overlap in the processing step. Preferably, a first laser pulse is superimposed with a plurality of further individual pulses of the further laser pulse. In particular, it is conceivable for a second laser pulse to be at least substantially completely superimposed with the first laser pulse and for a further second individual pulse of the further laser pulse to be at least substantially partially superimposed.This makes it possible to provide particularly advantageous properties with regard to expulsion and evaporation of the melt of the substrate for an electrochemical cell. This makes it possible to provide particularly advantageous properties with regard to process quality.

[0014] Furthermore, it is proposed that in at least one processing step, the pulse intervals and / or pulse parameters of the individual pulses of the further laser pulse are varied from pulse to pulse. Preferably, the individual pulses in the processing step are designed to be variable in their process parameters. In particular, it is conceivable for each individual pulse to be designed identically. Preferably, the time interval or the pulse interval between two individual pulses is variably adjustable in the processing step. Preferably, the pulse parameters of the individual pulses are variably adjusted in a processing step by means of a control and regulation unit. A “control and / or regulation unit” is to be understood in particular as a unit with at least one control electronics unit."Control electronics" is understood in particular to mean a unit with a processor unit and a memory unit, as well as with an operating program stored in the memory unit. The control and regulation unit is preferably configured to regulate all parameters of the processing device in a single processing step. In this context, "pulse parameters" is understood to mean, in particular, the pulse intensity, the pulse duration, the pulse power, and the pulse spacing. Preferably, all pulse parameters are variably adjustable simultaneously in the processing step. This makes it possible to provide particularly advantageous properties with regard to process quality. Advantageous properties with regard to process control and production efficiency can be provided.

[0015] According to a further exemplary embodiment, it is proposed that in at least one processing step, an individual pulse of the further laser pulse is generated outside the first laser pulse. The individual pulse of the further laser pulse is preferably generated outside the melting phase of the first laser pulse. Preferably, in the processing step, at least one individual pulse of the further laser pulse is formed to at least substantially completely overlap with the first laser pulse, and at least one further individual pulse of the further laser pulse is generated outside the melting phase of the first laser pulse. Preferably, it is conceivable that in the processing step, at least two individual pulses of the further laser pulse are generated outside the melting phase of the first laser pulse.Furthermore, it is conceivable that, in the processing step, at least one individual pulse of the further laser pulse is designed to at least substantially partially overlap with the first laser pulse, and that at least one further individual pulse of the further laser pulse is generated outside the melting phase of the first laser pulse. This can provide particularly advantageous properties with regard to process quality. It can provide particularly advantageous properties when forming through-holes with a low residual melt.

[0016] Furthermore, it is proposed that in at least one control step, synchronization is established between the laser pulse and the further laser pulse by means of a control and regulating unit. Preferably, in a control step, the temporal power distribution of the pulse of the first laser pulse and of the further laser pulse is adjusted. Preferably, in a control step, the pulse parameters of the first laser pulse and of the further laser pulse are adjusted. Preferably, in a control step, the intensity profile over the focal area of ​​the first laser pulse and of the further laser pulse is adjusted. Preferably, the control step takes place at least substantially parallel to a processing step. Preferably, it is conceivable that in a control step, a variable adjustment takes place in real time simultaneously with a processing step.It is also conceivable for a control step to be carried out between two processing steps, wherein process data from the first processing step is evaluated within the control step in order to optimize the subsequent processing step. The control and regulation unit is preferably designed to coordinate a first laser pulse and a further laser pulse with one another. A further laser pulse is preferably carried out in a processing step as soon as the control and regulation unit detects a defined amount of melt generated by the first laser pulse in a control step. In a control step, the regulation of the first laser pulse and the further laser pulse is preferably controlled based on a previously determined process sequence. The process sequence is preferably determined experimentally in advance. Alternatively, it is conceivable for the process sequence to be determined mathematically.Alternatively, it is conceivable for the control and regulation unit to comprise a sensor element, wherein the sensor element monitors melting by means of the first laser pulse. Preferably, a further laser pulse is generated in a processing step as soon as sufficient melt has been detected by the sensor element in a control step. This can provide advantageous properties with regard to process quality and process quantity. In particular, advantageous properties with regard to process time can be achieved.

[0017] Furthermore, the invention is based on a processing device for carrying out a method according to the invention, comprising at least one processing unit, in particular a laser drilling unit, wherein the processing unit is configured to create a through-hole in the substrate for an electrochemical cell by means of a laser pulse in at least one processing step. It is proposed that the processing unit generates at least one further laser pulse. Preferably, the further laser pulse is generated simultaneously with a first laser pulse. Preferably, the first laser pulse and the second laser pulse are generated by the processing unit to form a through-hole. Preferably, the processing unit focuses a first laser pulse and a further laser pulse onto a through-hole. Preferably, the processing unit is designed at a distance from a substrate for an electrochemical cell.This makes it possible to provide particularly advantageous properties with regard to processing the substrate for an electrochemical cell by means of a processing device.

[0018] It is further proposed that the processing unit has a first radiation source element and at least one further radiation source element. Preferably, the first radiation source element and the further radiation source element are configured to generate a laser pulse. Preferably, the first radiation source element is configured to generate a first laser pulse. Preferably, the further radiation source element is configured to generate a plurality of individual pulses of the further laser pulse. Preferably, the further radiation source element is configured to generate a further laser pulse. Preferably, the first radiation source element and the further radiation source element are designed differently. Preferably, the first radiation source element and the further radiation source element are designed to be focused on a through-hole.Preferably, in one processing step, a first laser pulse is generated simultaneously by the first radiation source element and a further laser pulse is generated by the further radiation source element. Preferably, the laser pulses generated by the first radiation source element and the further radiation source element are combined and impinge on the surface of the substrate for an electrochemical cell to create a through-hole. "Combined" in this context refers to a superposition of at least two laser pulses. This makes it possible to provide particularly advantageous properties with regard to processing the substrate for an electrochemical cell using a processing device. It is possible to provide particularly advantageous properties with regard to process control and production efficiency.

[0019] Furthermore, it is proposed that the first radiation source element be designed as a cw laser, by means of which a first laser pulse is generated. The cw laser is preferably arranged in a processing unit. The cw laser is preferably configured to emit a first laser pulse with a homogeneous beam profile. The cw laser is preferably designed as a pump laser. The laser pulse generated by the cw laser is preferably further operated during a jump from a first through-hole to a further through-hole, since the jump times are so short that the cw laser can continuously emit laser power without damaging the surface during this time. In this context, a "cw laser" or continuous wave laser is to be understood in particular as a laser which has an undamped, i.e. temporally constant, emitted wave.Alternatively, the first radiation source element could be a laser with long laser pulses in the range of a few hundred ns to several hundred µs. Preferably, the laser power is limited per throughput. This makes it possible to provide, in particular, an advantageous design of the first radiation source element. Advantageous properties with regard to process control and production efficiency can be achieved.

[0020] It is further proposed that the further radiation source element be designed as a pulsed laser, by means of which a further laser pulse is generated. Preferably, in one processing step, a laser beam with multiple laser pulses is generated by means of the further radiation source element. Preferably, a pulsed laser is configured to emit a laser pulse with a temporally defined pulse. In particular, processing by means of a pulsed laser is divided into short-pulse or ultrashort-pulse lasers depending on the pulse length. For physical reasons, a pulsed laser preferably emits a pulsed laser beam. In particular, it is conceivable that the pulsed laser be designed as a ruby ​​laser. Preferably, the pulse duration, the pulse energy, and the pulse intensity of the pulsed laser are controlled via the power supply.In a pulsed laser, the energy stored in the population inversion is preferably removed from a pulse faster than the pump source can pump new energy into the upper laser level. "Removed" in this context refers to the discharging or emission of the laser pulse. This can, in particular, provide an advantageous design of the additional radiation source element. In particular, advantageous properties with regard to process control and production efficiency can be provided.

[0021] Furthermore, it is proposed that the first radiation source element and the further radiation source element have different focus diameters. The focus diameter is preferably configured differently on the surface of the substrate for an electrochemical cell. The focus diameter of the first radiation source element is preferably configured larger than the focus diameter of the further radiation source element. The focus diameter of the first radiation source element is preferably configured larger than the focus diameter of the further radiation source element on the surface of the substrate for an electrochemical cell. This makes it possible to provide particularly advantageous properties with regard to the evaporation rate of the melt.

[0022] According to a further embodiment, it is proposed that the processing unit has a radiation source element, wherein the radiation source element generates a laser pulse and a further laser pulse. Preferably, a laser pulse is generated by means of the radiation source element, divided into a first laser pulse and a further laser pulse. Preferably, the radiation source element is designed as a pump laser. Particularly preferably, the radiation source element is designed as a cw laser. Preferably, the first laser pulse is taken from parts of the cw pump laser light. Preferably, the further laser pulse is taken from the cw pump stroke as a pulsed laser pulse. In particular, it is conceivable that the cw or pulsed radiation is taken, for example, from the pump laser (cw if it is continuously pumped) for the pulsed laser.This can provide particularly advantageous properties in terms of process efficiency and cost savings.

[0023] Furthermore, it is proposed that the processing device have a control and regulation unit which is configured for synchronization between the laser pulse and the further laser pulse. Preferably, the control and regulation unit is configured to regulate and / or control the process parameters of the processing device in a control step. Preferably, the control and regulation unit is configured to coordinate a first laser pulse and a further laser pulse with one another. Furthermore, it is conceivable that the control and regulation unit is configured to determine a position of the through-hole and to focus the processing unit on the position. Preferably, the control and regulation unit is configured to adapt pulse parameters of the laser pulses generated by the first radiation source element and the further radiation source element.Preferably, a further laser pulse is generated in a processing step as soon as the control and regulation unit detects a defined amount of melt generated by the first laser pulse in a control step. Preferably, in a control step, regulation of the first laser pulse and the further laser pulse is controlled based on a previously determined process sequence. Preferably, the process sequence is determined experimentally in advance. Alternatively, it is conceivable for the process sequence to be determined mathematically. Alternatively, it is conceivable for the control and regulation unit to comprise a sensor element, wherein melting by means of the first laser pulse is monitored by means of the sensor element. Preferably, a further laser pulse is generated in a processing step as soon as sufficient melt has been detected by the sensor element in a control step.This makes it possible to provide particularly advantageous properties with regard to process quality. It makes it possible to provide particularly advantageous properties with regard to process control and production efficiency.

[0024] Furthermore, a solid fuel cell with a substrate for an electrochemical cell, produced by means of a method according to the invention and / or a device according to the invention, is proposed. The solid fuel cell preferably has an anode and a cathode. In particular, an electrolyte is arranged between the anode and the cathode. The substrate for an electrochemical cell is preferably designed to provide a base for the electrolyte. The solid fuel cell is preferably designed to convert chemical reaction energy of a continuously supplied fuel and an oxidizing agent into electrical energy. For example, hydrogen is used as the fuel and oxygen as the oxidizing agent. Alternatively, other fuels that would be deemed appropriate by a person skilled in the art, for example methanol, butane, and / or natural gas, are also conceivable.Preferably, in one process step in the solid-state fuel cell, electrical energy is generated between the anode and the cathode. Preferably, the anode splits the electrons from the fuel. Preferably, the electrons are conducted to the cathode via a connecting element. In particular, the electrical energy is generated by this movement of electrons from anode to cathode. Preferably, the electrons are transferred to the oxidizing agent in the cathode and split the oxidizing agent. The negatively charged oxidizing agent is attracted to the positively charged protons of the fuel, particularly through the substrate for an electrochemical cell. Preferably, the end products of the chemical reaction are, in particular, water and exhaust air. This makes it possible to provide, in particular, an advantageous solid-state fuel cell.In particular, advantageous properties with regard to mechanical stability of the electrolyte can be provided.

[0025] The method according to the invention for operating a processing device is not intended to be limited to the application and embodiment described above. In particular, the method according to the invention for operating a processing device may comprise a number of individual elements, components, units, and method steps that differs from the number stated herein in order to fulfill a functionality described herein. Furthermore, in the value ranges specified in this disclosure, values ​​within the stated limits are also to be considered disclosed and can be used arbitrarily. drawing

[0026] Further advantages will become apparent from the following description of the drawings. The drawings illustrate four exemplary embodiments of the invention. The drawings, the description, and the claims contain numerous features in combination. Those skilled in the art will also expediently consider the features individually and combine them into useful further combinations.

[0027] They show: Fig. 1 a solid fuel cell with a substrate for an electrochemical cell, produced by a method according to the invention and / or a device according to the invention, in a schematic representation, Fig. 2 a processing device in a schematic representation, Fig. 3 a schematic performance diagram of a processing step, Fig. 4 a schematic flow diagram of a method for operating a processing device according to the invention, Fig. 5 an alternative embodiment of a processing device in a schematic representation, Fig. 6 an alternative embodiment of a schematic performance diagram of a processing step and Fig. 7 an alternative embodiment of a schematic performance diagram of a processing step. Description of the embodiments

[0028] Fig. 1 shows a solid fuel cell 26a with a substrate for an electrochemical cell 16a, produced by a method according to the invention and / or a processing device 10a according to the invention. The solid fuel cell 26a has an anode 28a and a cathode 30a. An electrolyte 70a is arranged between the anode 28a and the cathode 30a. The substrate for an electrochemical cell 16a is configured to provide a base for the electrolyte 70a. The solid fuel cell 26a is configured to convert chemical reaction energy of a continuously supplied fuel 32a and an oxidizing agent 34a into electrical energy. Hydrogen is used as the fuel 32a and oxygen as the oxidizing agent 34a. Alternatively, other fuels 32a that would be deemed appropriate by a person skilled in the art, such as methanol, butane, and / or natural gas, are also conceivable.In one process step of the solid-state fuel cell 26a, electrical energy is generated between the anode 28a and the cathode 30a. The anode 28a splits off an electron 36a from the fuel 32a. The electrons 36a are conducted to the cathode 30a via a connecting element 38a. This movement of the electrons 36a from the anode 28a to the cathode 30a generates the electrical energy. The electrons 36a in the cathode 30a are transferred to the oxidant 34a and split the oxidant 34a. The negatively charged oxidant 34a is attracted to a positively charged proton 40a of the fuel 32a through the substrate for an electrochemical cell 16a. The end products of the chemical reaction include, for example, water 42a and exhaust air 44a.

[0029] Fig. 2 shows a processing device 10a in a schematic representation for carrying out a method according to the invention, comprising at least one processing unit 12a, in particular a laser drilling unit, wherein the processing unit 12a is configured to create a single through-hole 14a in the substrate for an electrochemical cell 16a by means of a laser pulse 22a in at least one processing step 20a. The processing unit 12a is configured to generate at least one further laser pulse 24a. The processing device 10a is configured to process a substrate for an electrochemical cell 16a. The processing device 10a is designed in several parts. A non-cutting machining process is carried out with the processing device 10a. Furthermore, the processing device 10a has a holder for the substrate for an electrochemical cell 16a.In a processing step 20a, the substrate 16a is directly processed. Alternatively, indirect processing of the substrate 16a by the processing device 10a is also conceivable. The processing device 10a is configured to perform all necessary steps, for example, a control step 48a and / or a processing step 20a. The substrate for an electrochemical cell 16a is used for an electrochemical cell in the solid oxide fuel cell 26a. Alternatively, the substrate 16a is intended for use in an electrolytic cell. For an electrochemical cell, the substrate 16a forms the basis for an electrolyte 70a of a solid-state fuel cell 26a. Furthermore, a substrate 16a made of a pre-sintered ceramic is conceivable.

[0030] The processing device 10a has a processing unit 12a, which transfers thermal energy into the substrate for an electrochemical cell 16a during processing. The processing unit 12a has a non-cutting tool. The processing unit 12a is designed in several parts. The processing unit 12a is configured to generate a laser pulse 22a. The processing unit 12a is configured to generate a single laser pulse 22a and / or multiple consecutive laser pulses 22a. The processing unit 12a is configured to generate multiple laser pulses 22a, 24a at least substantially simultaneously and / or superimposed in time. The further laser pulse 24a is generated simultaneously with a first laser pulse 22a. The first laser pulse 22a and the second laser pulse 24a are generated by the processing unit 12a to form a through-hole 14a.The processing unit 12a focuses a first laser pulse 22a and a further laser pulse 24a onto a through-hole 14a. The processing unit 12a is designed at a distance from a substrate for an electrochemical cell 16a. The processing unit 12a is designed as a laser drill. The processing unit 12a is configured to process at least one surface 54a of the substrate for an electrochemical cell 16a. The processing unit 12a is configured to create a through-hole 14a in a substrate for an electrochemical cell 16a. The laser pulse 20a generated by the processing unit 12a locally introduces energy into the substrate for an electrochemical cell 16a. The processing unit 12a creates a through-hole 14a in the surface 54 of the substrate for an electrochemical cell 16a.The through-hole 14a is arranged perpendicular to a main extension plane of the substrate for an electrochemical cell 16a. The processing unit 12a focuses the laser pulse 20a. By processing the surface 54a of the substrate for an electrochemical cell 16a, a through-hole 14a is formed in the substrate for an electrochemical cell 16a. The through-hole 14a has a maximum diameter of 15 µm. The through-holes 16a are formed in a defined grid. The processing unit 12a generates a first laser pulse 22a and a further laser pulse 24a.

[0031] The processing unit 12a has a first radiation source element 56a and at least one further radiation source element 58a. The first radiation source element 56a and the further radiation source element 58a are configured to generate a laser pulse 22a, 24a. The first radiation source element 56a is configured to generate a first laser pulse 22a. The further radiation source element 58a is configured to generate a further laser pulse 24a. The further radiation source element 58a is configured to generate a plurality of individual pulses 46a of the further laser pulse 24a. The first radiation source element 56a and the further radiation source element 58a are configured differently. The first radiation source element 56a and the further radiation source element 58a are designed to be focused on a through-hole 14a.In a processing step 20a, a first laser pulse 22a is generated simultaneously by the first radiation source element 56a, and a further laser pulse 24a is generated by the further radiation source element 58a. The laser pulses 22a, 24a generated by the first radiation source element 56a and the further radiation source element 58a combine to impinge on a surface 54a of the substrate for an electrochemical cell 16a to create a through-hole 14a.

[0032] The first radiation source element 56a is designed as a cw laser, by means of which a first laser pulse 22a is generated. The cw laser is configured to emit a first laser pulse 22a with a homogeneous beam profile. The cw laser is designed as a pump laser. The laser pulse 22a generated by the cw laser continues to operate during a jump from a first through-hole 14a to another through-hole 52a, since the jump times are so short that the cw laser can continuously emit laser power without damaging the surface 54a during this time. Alternatively, the first radiation source element 56a can be configured as a laser with a long laser pulse in the range of a few 100 ns to several 100 µs. The laser power is limited depending on the through-hole power. The further radiation source element 58a is designed as a pulsed laser, by means of which a further laser pulse 24a is generated.In a processing step 20a, a laser beam 60a with multiple laser pulses 24a is generated by the additional beam source element 56a. A pulsed laser is configured to emit a laser pulse 24a with a temporally defined pulse. Processing using a pulsed laser is divided into short-pulse or ultrashort-pulse lasers depending on the pulse length. A pulsed laser emits a pulsed laser beam 60a for physical reasons. In particular, it is conceivable that the pulsed laser is designed as a ruby ​​laser. The pulse duration, pulse energy, and pulse intensity of the pulsed laser are controlled via the power supply. In a pulsed laser, the energy stored in the population inversion is removed by a pulse faster than the pump source can pump new energy into the upper laser level.

[0033] The first radiation source element 56a and the further radiation source element 58a have different focal diameters. The focal diameters are formed differently on the surface 54a of the substrate for an electrochemical cell 16a. The focal diameter of the first radiation source element 56a is larger than the focal diameter of the further radiation source element 58a. The focal diameter of the first radiation source element 56a is larger than the focal diameter of the further radiation source element 58a on the surface 54a of the substrate for an electrochemical cell 16a.

[0034] The processing device has a control and regulation unit 50a, which is configured to synchronize the first laser pulse 22a and the further laser pulse 24a. The control and regulation unit 50a is configured to regulate and / or control the process parameters of the processing device 10a in a control step 48a. The control and regulation unit 50a is configured to coordinate a first laser pulse 22a and a further laser pulse 24a with one another. Furthermore, it is conceivable that the control and regulation unit 50a is configured to determine a position of the through-hole 14a and to focus the processing unit 12a on the position. The control and regulation unit 50a is configured to adapt pulse parameters of the laser pulses 22a, 24a generated by the first radiation source element 56a and the further radiation source element 58a.In a processing step 20a, a further laser pulse 24a is generated as soon as the control and regulation unit 50a detects a defined amount of melt generated by the first laser pulse 22a in a control step 48a. In a control step 48a, the first laser pulse 22a and the further laser pulse 24a are regulated based on a previously determined process sequence. The process sequence is determined experimentally in advance. Alternatively, it is conceivable for the process sequence to be determined mathematically. Alternatively, it is conceivable for the control and regulation unit 50a to comprise a sensor element, wherein melting by means of the first laser pulse 22a is monitored by means of the sensor element. In a processing step 20a, a further laser pulse 24a is generated as soon as sufficient melt has been detected by the sensor element in a control step 48a.

[0035] Fig. 3 shows a schematic flow diagram of a method for operating a processing device 10a according to the invention. The processing device 10a has at least one processing unit 12a, in particular a laser drilling unit, wherein in at least one processing step 20a, at least one through-hole 14a is introduced into the substrate for an electrochemical cell 16a by means of the processing unit 12a using a laser pulse 22a. In the at least one processing step 20a, at least one further laser pulse 24a is generated by the processing unit 12a to create a single through-hole 14a, wherein the at least one further laser pulse 24a is used for processing by means of the processing unit 12a, at least substantially partially overlapping in time with the first laser pulse 22a. In the processing step 20a, thermal energy is introduced into the substrate for an electrochemical cell 16a.In the at least one processing step 20a, a recess is formed in the substrate for an electrochemical cell 16a. In the at least one processing step 20a, a through-hole 14a is formed in the substrate for an electrochemical cell 16a. In a processing step 20a, a first laser pulse 22a and a further laser pulse 24a are generated (see . Fig. 4). Fig. Figure 4 shows a time profile of the first laser pulse 22a and the subsequent laser pulse 24a. Time is plotted on the abscissa 66a. The pulse intensity and / or pulse energy is plotted on the ordinate 68. In Fig. 4 shows the temporal overlap of the first laser pulse 22a and the further laser pulse 24a. The processing step 20a consists of at least two sub-steps 62a, 64a. In a first sub-step 62a, the material on the surface 54a of the substrate for an electrochemical cell 16a is heated and / or melted. In a further sub-step 64a, the heated and melted material of the substrate for an electrochemical cell 16a is vaporized and / or expelled. In the first sub-step 62a, the largest possible amount of melt is generated, with this melt being vaporized and expelled from the borehole in a further sub-step 64a. The first sub-step 62a and the second sub-step 64a require different process parameters to fulfill their respective tasks. In the first sub-step 62a, a moderate laser power and a longer beam time are required.In a further sub-step 64a, a high intensity and a short time are required to generate a high steam pressure to expel the melt from the bore channel. The first sub-step 62a and the second sub-step 64a occur at least partially overlapping in a processing step 20a. A first sub-step 62a occurs superimposed with several further sub-steps 64a. In at least one processing step 20a, the first laser pulse 22a and the further laser pulse 24a are superimposed (see Fig. 4). In a first sub-step 62a, a first laser pulse 22a is generated. In a further sub-step 64a, a further laser pulse 24a is generated. The first laser pulse 22a and the further laser pulse 24 are emitted at least partially, particularly preferably at least substantially completely, overlapping in a processing step 20a.

[0036] In at least one control step 48a, synchronization between the first laser pulse 22a and the further laser pulse 24a is established by means of a control and regulation unit 50a. In a control step 48a, the temporal power distribution of the pulse of the first laser pulse 22a and the further laser pulse 24a is adjusted. In a control step 48a, the pulse parameters of the first laser pulse 22a and the further laser pulse 24a are adjusted. In a control step 48a, the intensity profile over the focal area of ​​the first laser pulse 22a and the further laser pulse 24a is adjusted. The control step 48a takes place at least substantially parallel to a processing step 20a. It is conceivable that in a control step 48a, a variable adjustment takes place in real time simultaneously with a processing step 20a.Furthermore, it is conceivable that a control step 48a is carried out between two processing steps 20a, wherein within the control step 44a, process data from the first processing step 20a are evaluated in order to optimize the further processing step 20a. The control and regulation unit 50a is configured to coordinate a first laser pulse 22a and a further laser pulse 24a with one another. In a processing step 20a, a further laser pulse 24a is generated as soon as the control and regulation unit 50a detects a defined amount of melt generated by the first laser pulse 22a in a control step 48a. In a control step 48a, regulation of the first laser pulse 22a and the further laser pulse 24a is controlled based on a previously determined process sequence. The process sequence is determined experimentally in advance. Alternatively, it is conceivable that the process sequence is determined computationally.Alternatively, it is conceivable for the control and regulation unit 50a to comprise a sensor element, wherein the sensor element monitors melting by means of the first laser pulse 22a. In a processing step 20a, a further laser pulse 24a is generated as soon as sufficient melt has been detected by the sensor element in a control step 48a.

[0037] In the Fig. Three further embodiments of the invention are shown in Figures 5 to 7. The following descriptions and the drawings are essentially limited to the differences between the embodiments, whereby with regard to components with the same designation, in particular with regard to components with the same reference numerals, reference is also made to the drawings and / or the description of the other embodiments, in particular to the Fig. 1 to 4. To distinguish the embodiments, the letter a is added to the reference numerals of the embodiment in the Fig. 1 to 4. In the examples of the Fig. In paragraphs 5 to 7, the letter a is replaced by the letters b to d.

[0038] Fig. 5 shows an alternative embodiment of a processing device in a schematic representation. A further laser pulse 24b is formed from a plurality of individual pulses 46b. The further laser pulse 24b is composed of at least two individual pulses 46b in the processing step 20b. In the processing step 20b, the individual pulses 46b are generated individually. The individual pulses 46b are formed spaced apart on the time axis in the processing step 20b. Alternatively, it is conceivable that the individual pulses 46b at least substantially partially overlap in the processing step 20b. A first laser pulse 22b is superimposed with a plurality of further individual pulses 46b of the further laser pulse 24b.In particular, it is conceivable for a first individual pulse 46b of the further laser pulse 24b to be at least substantially completely superimposed on the first laser pulse 22b, and for a further second individual pulse 46b of the further laser pulse 24b to be at least substantially partially superimposed on the first laser pulse 22b. In at least one processing step 20b, the pulse intervals and / or pulse parameters of the individual pulses 46b of the further laser pulse 24b are varied from pulse to pulse. The individual individual pulses 46b are variably configured in their process parameters in the processing step 20b. In particular, it is conceivable for each individual pulse 46b to be identically configured. In the processing step 20b, the time interval or pulse interval between two individual pulses 46b can be variably adjusted. The pulse parameters of the individual pulses 46b are variably adjusted in a processing step 20b by means of a control and regulation unit 50b.The control and regulation unit 50b is configured to regulate all parameters of the processing device 10b in a processing step 20b.

[0039] Fig. 6 shows an alternative embodiment of a schematic performance diagram of a processing step 20c. In at least one processing step 20c, an individual pulse of a further laser pulse 24c is generated outside of a first laser pulse 22c. The individual pulse 46c of the further laser pulse 24c is generated outside of the melting phase of the first laser pulse 22c. In the processing step 20c, at least one individual pulse 46c of the further laser pulse 24c is formed to at least substantially completely overlap with the first laser pulse 22c, and at least one further individual pulse 46c of the further laser pulse 24c is generated outside of the melting phase of the first laser pulse 22c. It is conceivable that in the processing step 20c, at least two individual pulses 46c of the further laser pulse 24c are generated outside of the melting phase of the first laser pulse 22c.Furthermore, it is conceivable that in the processing step 20c at least one individual pulse 46c of the further laser pulse 24c is formed so as to at least substantially partially overlap with the first laser pulse 22c and at least one further individual pulse 46c of the further laser pulse 24c is generated outside the melting phase of the first laser pulse 22c.

[0040] Fig.7 shows an alternative embodiment of a schematic performance diagram of a processing step. A processing unit 12d has a radiation source element 56d, wherein the radiation source element 56d generates a first laser pulse 22d and a further laser pulse 24d. By means of the radiation source element 56d, a laser pulse is split into a first laser pulse 22d and a further laser pulse 24d. The radiation source element 56d is designed as a pump laser. The radiation source element 56d is designed as a cw laser. The first laser pulse 22d is taken from portions of the cw pump laser light. The further laser pulse 24d is taken from the cw pump pulse as a pulsed laser pulse. In particular, it is conceivable that the cw or pulsed radiation, for example, is taken from the pump laser (cw if it is continuously pumped) for the pulsed laser.

Claims

[1] Method for operating a processing device (10a; 10b; 10c; 10d) with at least one processing unit (12a; 12b; 12c; 12d), in particular a laser drilling unit, wherein in at least one processing step (20a; 20b; 20c; 20d) by means of the processing unit (12a; 12b; 12c; 12d) at least one single through-cut (14a; 14b; 14c; 14d) is introduced into the substrate for an electrochemical cell (16a; 16b; 16c; 16d) by means of a laser pulse (22a; 22b; 22c; 22d), characterized byin that in the at least one processing step (20a; 20b; 20c; 20d) by means of the processing unit (12a; 12b; 12c; 12d) for producing the individual through-hole (14a; 14b; 14c; 14d) at least one further laser pulse (24a; 24b; 24c; 24d) is generated, wherein the at least one further laser pulse (24a; 24b; 24c; 24d) is used for processing by means of the processing unit (12a; 12b; 12c; 12d), at least substantially partially overlapping in time with the first laser pulse (22a; 22b; 22c; 22d). [2] Method according to claim 1, characterized by that in at least one processing step (20a; 20b; 20c; 20d) the first laser pulse (22a; 22b; 22c; 22d) and the further laser pulse (24a; 24b; 24c; 24d) are used in a superimposed manner. [3] Method according to one of the preceding claims, characterized by that in at least one processing step (20b) the further laser pulse (24b) is formed from several individual pulses (46b). [4] Method according to one of the preceding claims, characterized by that in at least one processing step (20b) the individual pulses (46b) of the further laser pulse (24b) are changed in their pulse intervals and / or pulse parameters from pulse to pulse. [5] Method according to one of the preceding claims, characterized by that in at least one processing step (20c) a single pulse of the further laser pulse (24c) is generated outside the first laser pulse (22c). [6] Method according to one of the preceding claims, characterized by that in at least one control step (44a; 44b; 44c; 44d) a synchronization between the first laser pulse (22a; 22b; 22c; 22d) and the further laser pulse (24a; 24b; 24c; 24d) is established by means of a control and regulating unit (50a; 50b; 50c; 50d). [7] Processing device (10a; 10b) for carrying out a method according to one of the preceding claims, with at least one processing unit (12a; 12b), in particular a laser drilling unit, wherein the processing unit (12a; 12b) is designed to introduce a through-cut (14a; 14b) into the substrate for an electrochemical cell (16a; 16b) by means of a laser pulse (22a; 22b) in at least one processing step (20a; 20b), characterized by that the processing unit (12a; 12b) generates at least one further laser pulse (24a; 24a). [8] Processing device (10a) according to claim 7, characterized by that the processing unit (12a) has a first radiation source element (56a) and at least one further radiation source element (58a). [9] Processing device (10a) according to claim 7 or 8, characterized bythat the first radiation source element (56a) is designed as a cw laser, by means of which a first laser pulse (22a) is generated. [10] Processing device (10a) according to one of claims 7 to 9, characterized by that the further radiation source element (58a) is designed as a pulsed laser, by means of which a further laser pulse (24a) is generated. [11] Processing device (10a) according to one of claims 7 to 10, characterized by that the first radiation source element (56a) and the further radiation source element (58a) have a different focus diameter [12] Processing device (10d) according to claim 7, characterized by that the processing unit (12d) has a radiation source element (56d), wherein the radiation source element (56d) generates a first laser pulse (22d) and a further laser pulse (24d). [13] Processing device (10a; 10b) according to one of claims 7 to 12, characterized bya control and regulation unit (50a; 50b) which is arranged for synchronization between the first laser pulse (22a; 22b) and the further laser pulse (24a; 24b). [14] Solid fuel cell (26a) with a substrate for an electrochemical cell (16a) produced by means of a method according to one of claims 1 to 6 and / or a device according to one of claims 7 to 13.

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