Assembly, as well as method for operating an optical system

The optical system assembly addresses thermal deformations and aberrations by using a fluid channel and valve system to dynamically control temperature and flow, enhancing performance by compensating for thermal changes.

DE102023212645A1Inactive Publication Date: 2024-12-19CARL ZEISS SMT GMBH
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Patent Information

Application Number
DE102023212645
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-13
Publication Date
2024-12-19
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Optical components in EUV and DUV ranges experience thermally induced deformations and aberrations due to heat input from electromagnetic radiation, which are difficult to correct and require quick and flexible cooling adjustments.

Method used

An optical system assembly with a fluid channel arrangement and a valve arrangement that allows for dynamic adjustment of the fluid flow path to control temperature and thermal state, using sensors and actuators to compensate for deformations and aberrations.

Benefits of technology

Effectively reduces undesirable optical aberrations and performance impairments by dynamically adjusting fluid flow to manage thermal states and deformations in optical components.

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Abstract

The invention relates to an assembly and a method for operating an optical system. The optical system can, in particular, be a projection lens (10, 1120) or an illumination device (2, 1110) of a microlithographic projection exposure system (1, 1100). An assembly according to the invention comprises at least one component (100, 200, 300, 500, 600, 700) in which a fluid channel arrangement (405, 905) with at least one fluid channel (503, 603, 703) through which a fluid can flow is provided, and a valve arrangement by which a flow path of the fluid in the fluid channel arrangement (405, 905) can be variably adjusted.
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Description

BACKGROUND OF THE INVENTION Area of ​​the invention

[0001] The invention relates to an assembly and a method for operating an optical system. The optical system can, in particular, be a projection lens or an illumination device of a microlithographic projection exposure system. State of the art

[0002] Microlithography is used to manufacture microstructured components, such as integrated circuits or LCDs. The microlithography process is carried out in a projection exposure system, which includes an illumination unit and a projection lens. The image of a mask (= reticulum) illuminated by the illumination unit is projected by the projection lens onto a substrate (e.g., a silicon wafer) coated with a photosensitive layer (photoresist) and positioned in the image plane of the projection lens. This transfers the mask structure onto the photosensitive coating of the substrate.

[0003] In projection lenses designed for the EUV range, i.e. at wavelengths of, for example, about 13 nm or about 7 nm, mirrors are used as optical components for the imaging process due to the lack of availability of suitable translucent refractive materials.

[0004] In a known design, the projection lens can have both a load-bearing support structure in the form of a support frame and an independently provided measuring structure in the form of a sensor frame, wherein both the support structure and the measuring structure are mechanically connected to a base of the optical system independently of each other via mechanical connections acting as dynamic decoupling.

[0005] A problem encountered in practice is that optical components (such as mirrors, lenses, or diffractive optical elements like CGHs) or structural components (such as support structures or measurement structures) in systems designed for both the EUV range (especially at a wavelength of 13.5 nm) and the DUV range (especially at wavelengths below 400 nm, and further specifically below 250 nm) experience heating and associated thermal expansion or deformation, due to absorption of radiation emitted by the light source. This, in turn, can impair the imaging properties of the optical system. For example, in the case of mirrors in the mirror substrate...Temperature profiles generated at the optical surface can – especially with comparatively highly localized heat inputs from the incident electromagnetic radiation – exhibit a pronounced inhomogeneity across the optically used area, with the consequence that the thermally induced deformation profiles resulting from the respective temperature profiles cause optical aberrations during operation of the optical system in question, which are difficult or impossible to correct.

[0006] As a result, the imaging properties of the optical system containing the respective mirror or structural components may be impaired.

[0007] To avoid surface deformations caused by heat input and the associated optical aberrations, various approaches are known, for example active cooling using fluid channels through which a (cooling) fluid can flow.

[0008] A problem that arises in practice is that the heat input from the electromagnetic radiation incident on the respective component, as described above, and the resulting thermal state of the component in question (e.g., one of the aforementioned optical components or structural components) change over time depending on the current operating scenario of the optical system. Against this background, sufficiently rapid and flexible adaptation of the aforementioned active cooling to prevent surface deformations caused by heat input and the associated optical aberrations presents a significant challenge.

[0009] Known approaches to preventing thermally induced deformations include, for example, targeted adjustment of the temperature and / or flow rate of the (cooling) fluid flowing through a fluid channel arrangement, particularly depending on the source power of a light source in the optical system. Other known approaches include targeted heating of an optical element within the optical system, for example, via IR emitters, to variably adjust different heating profiles.

[0010] For examples of the state of the art, reference is made only to DE 10 2022 200 532 A1, WO 2022 / 028710 A1 and DE 10 2019 219 289 A1. SUMMARY OF THE INVENTION

[0011] It is an object of the present invention to provide an assembly and a method for operating an optical system which enables efficient avoidance of thermally induced deformations and associated optical aberrations, even with time-varying heat inputs from electromagnetic radiation incident on a component.

[0012] This problem is solved according to the features of the dependent patent claims.

[0013] An assembly of an optical system according to the invention comprises: - at least one component in which a fluid channel arrangement with at least one fluid channel through which a fluid can flow is provided; and - a valve arrangement via which the flow path of the fluid in the fluid channel arrangement can be variably adjusted.

[0014] The invention is based in particular on the concept of achieving a dynamic, comparatively fast and particularly flexible modification of the temperature control or active cooling, and thus the thermal state of the component, in an assembly of an optical system comprising a fluid channel arrangement provided in a component with at least one fluid channel through which a fluid flows, by means of a variable adjustment of the fluid flow path in the fluid channel arrangement realized by a valve arrangement. This results in a further reduction of undesirable optical aberrations and the associated impairments of the performance of an optical system comprising the assembly according to the invention.

[0015] As described below, the component can be a structural component (in particular a supporting structure component) or an optical component (e.g. a mirror or a lens) of the optical system.

[0016] According to one embodiment, the fluid channel arrangement has at least one intersection area in which two fluid channel sections of the fluid channel arrangement intersect. Such an intersection can be in the same plane (so that the corresponding fluid channel sections are fluid-conductingly connected to each other) or it can be an intersection of fluid channel sections arranged in different planes (and not fluid-conductingly connected to each other).

[0017] According to one embodiment, a valve of the valve arrangement is arranged in this intersection area.

[0018] The invention further includes the principle of selectively increasing or decreasing the local fluid flow rate at the corresponding position in the fluid channel arrangement by varying the degree of opening of the valve in question. This variation of the valve's opening degree can be achieved manually or via a suitable actuator. Furthermore, in some embodiments, the valve's opening degree can be varied up to and including complete opening or closing to redirect the fluid flow within the fluid channel arrangement.

[0019] According to one embodiment, the fluid channel arrangement has a plurality of intersection areas in which two fluid channel sections of the fluid channel arrangement intersect.

[0020] According to one embodiment, these intersection areas are arranged in a grid structure.

[0021] According to one embodiment, the valve arrangement has a plurality of valves, each of which is arranged in one of the intersection areas.

[0022] According to one embodiment, the fluid in the fluid channel arrangement can be deflected via the valve arrangement.

[0023] According to one embodiment, the local flow rate of the fluid at at least one position in the fluid channel arrangement can be variably adjusted via the valve arrangement.

[0024] According to one embodiment, the assembly also includes a sensor arrangement for determining the current thermal state of the component.

[0025] According to one embodiment, the assembly further comprises at least one pressure sensor for determining a fluid pressure present in the fluid channel arrangement or in the at least one fluid channel.

[0026] According to one embodiment, the assembly further comprises at least one flow sensor for determining a flow velocity present in the at least one fluid channel.

[0027] The invention further includes the principle of selectively modifying the thermal state of the component, based on a determined current thermal state of the component or on sensor signals from the sensor arrangement, the at least one pressure sensor, and / or the at least one flow sensor, by varying the opening degree of one or more valves of the valve arrangement and the resulting variation in the local flow rate of the fluid and / or its deflection in the fluid channel arrangement. This is done, for example, to set a specific temperature profile desired in the current operating scenario (e.g., depending on a current stage of the lithography process). This can be done, for example, to at least partially compensate for thermally induced deformation of the component caused by electromagnetic radiation incident on the component during operation of the optical system (e.g., due to undesired temperature gradients).Setting a specific temperature profile desired in the current application scenario can also be done on the basis of permanent monitoring of the current thermal state of the component, particularly in a control loop, using the sensor arrangement.

[0028] Furthermore, in certain embodiments, pressure drops and associated deformation contributions can be taken into account by means of active fluid pressure control. In this way, for example, when applied to an optical component such as a mirror, the shape or geometry of the mirror surface can be adjusted, thereby also taking parasitic effects into account.

[0029] According to one embodiment, the assembly has an actuator arrangement for actuating the valve arrangement.

[0030] According to one embodiment, the assembly has a control unit for controlling the actuator arrangement depending on sensor signals from the sensor arrangement, the at least one pressure sensor and / or the at least one flow sensor.

[0031] In further embodiments, a device for spectral analysis of the fluid flowing through the at least one fluid channel can also be provided in order to actively monitor any corrosion residues and to diagnose any problems (e.g. the installation of incorrect components or the use of an improper fluid or one that does not meet the required criteria) at an early stage.

[0032] According to one embodiment, the component is a structural component, in particular a load-bearing structural component.

[0033] According to another embodiment, the component is an optical component, in particular a mirror.

[0034] According to one embodiment, the mirror is designed for a working wavelength of less than 30 nm, in particular less than 15 nm.

[0035] The invention further relates to an optical system comprising an assembly with the features described above.

[0036] According to one embodiment, the optical system is a projection lens or an illumination device of a microlithographic projection exposure system.

[0037] The invention further relates to a method for operating an optical system, wherein the optical system comprises an assembly with at least one component in which a fluid channel arrangement with at least one fluid channel through which a fluid can flow is provided, and a valve arrangement, wherein a flow path of the fluid in the fluid channel arrangement is variably adjusted via the valve arrangement.

[0038] According to one embodiment, the flow path of the fluid in the fluid channel arrangement is adjusted in such a way that a deformation of the component occurring during the operation of the optical system, induced by electromagnetic radiation incident on the component and / or by a fluid pressure of the fluid, is at least partially compensated.

[0039] According to one embodiment, parasitic effects or deformations caused by variations in fluid temperature can also be at least partially compensated by actively controlling the flow path of the fluid in the fluid channel arrangement.

[0040] The optical system can be designed in particular according to the features described above.

[0041] Further embodiments of the invention can be found in the description and the dependent claims.

[0042] The invention is explained in more detail below with reference to exemplary embodiments shown in the accompanying figures. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] They show: Fig. 1-3 schematic representations to illustrate exemplary thermal states of an optical component in the form of a mirror in an assembly according to the invention, corresponding to different application scenarios; Fig. 4a-4b schematic representations to illustrate the possible structure of a fluid channel arrangement provided in an assembly according to the invention ( Fig. 4a) or an exemplary thermal profile set in the corresponding component ( Fig. 4b); Fig. 5-7 schematic representations to illustrate exemplary embodiments of a valve provided in a valve arrangement according to the invention; Fig. 8 a schematic representation to illustrate an exemplary embodiment of a control loop for an assembly according to the invention; Fig. 9 a schematic representation to illustrate an exemplary arrangement of valves and sensors in an assembly according to the invention; Fig. 10 a schematic representation of the possible setup of a microlithographic projection exposure system designed for operation in the EUV; and Fig. 11 a schematic representation of the possible structure of a microlithographic projection exposure system designed for operation in DUV. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0044] Fig. Figures 1-3 initially show, in a purely schematic and highly simplified representation, exemplary thermal states adjustable in a component in the form of a mirror of an assembly 100 according to the invention, according to different application scenarios. The areas designated 101-103, 201-203 and 301-303 represent different temperature zones, wherein, in the example shown, areas 101, 201 and 301 each have a comparatively low temperature, areas 103, 203 and 303 a comparatively high temperature, and areas 102, 202 and 302 a medium temperature or a temperature between that of areas 101 and 103, 201 and 203, and 301 and 303. The aforementioned temperatures can only be in the range of 15°C to 45°C by way of example (and without limiting the invention thereto), whereby the temperatures in the individual zones can be designed according to cooling or heating requirements.

[0045] Fig. Figures 4a-4b show schematic representations to illustrate the possible structure of a fluid channel arrangement 405 provided in an assembly according to the invention ( Fig. 4a) or an exemplary thermal profile set in the corresponding component ( Fig. 4b).

[0046] According to the in Fig. In the embodiment shown in Figure 4a, the fluid channel arrangement 405 has a plurality of intersection regions in which two fluid channel sections of the fluid channel arrangement 405 intersect. In the illustrated embodiment (though the invention is not limited thereto), these intersection regions are arranged in a grid structure, wherein the fluid channel arrangement 405 (again, though the invention is not limited thereto) is composed of mutually perpendicular fluid channel sections 410, 420.

[0047] Furthermore, the assembly according to the invention has a valve arrangement (in Fig. 4a (not shown) with a plurality of valves, wherein a valve is arranged in each of the intersection areas. The valve arrangement allows for the deflection of the fluid in the fluid channel arrangement or for a variable adjustment of the local flow rate of the fluid at at least one position in the fluid channel arrangement 405. Exemplary possible embodiments of valves of the valve arrangement present in an assembly according to the invention are described below with reference to Fig. Described in sections 5-7.

[0048] Furthermore, the assembly according to the invention preferably has a (in Fig. 4a (not shown) sensor arrangement for determining the current thermal state of the component. In further embodiments, the assembly can also include at least one pressure sensor for determining the fluid pressure present in the fluid channel arrangement or in the at least one fluid channel. Furthermore, the assembly can also include at least one flow sensor for determining the flow velocity present in the at least one fluid channel.

[0049] The assembly according to the invention preferably further comprises an actuator arrangement for actuating the valve arrangement and a control unit for controlling the actuator arrangement depending on sensor signals from the sensor arrangement described above, the at least one pressure sensor and / or the at least one flow sensor.

[0050] Starting from a determined current thermal state of the component or based on sensor signals from the sensor arrangement, the thermal state and / or the deformation state of the component can be specifically modified by varying the opening degree of one or more valves of the valve arrangement—and the resulting variation in the local flow rate of the fluid and / or its deflection in the fluid channel arrangement—in order to set a specific temperature profile and / or deformation profile of the component comprising the fluid channel arrangement 405, as desired in the respective current operating scenario (e.g., depending on a currently progressing stage of the lithography process). This can be done, for example, to at least partially compensate for thermally induced deformation of the component in question due to undesired temperature gradients occurring during the operation of the associated optical system. Furthermore, e.g.Additional cooling can also be implemented during breaks in exposure or dark phases of the lighting, in which turbulence in the fluid flow is less disruptive.

[0051] In the thermal profile shown in the corresponding component, which is merely an example and includes the fluid channel arrangement 405, according to Fig. 4b, areas 401 have a comparatively low temperature, areas 403 have a comparatively high temperature, and areas 402 have a medium temperature or a temperature between the temperatures of areas 401 and 403.

[0052] In some embodiments, a specific temperature profile desired in the current operating scenario can be set based on continuous monitoring of the component's current thermal state, particularly within a control loop, using the aforementioned sensor arrangement. Furthermore, in some embodiments, pressure drops and associated deformation contributions can also be taken into account by actively controlling the fluid pressure.

[0053] Fig. Figure 8 shows a schematic representation illustrating an exemplary embodiment of a control loop for a valve arrangement according to the invention. Here, “800” denotes an assembly according to the invention (comprising a valve arrangement and an actuator for its actuation), “801” is a feedforward controller, and “802” is a feedback controller. “803” denotes an input signal of the control loop, and “804” denotes an output signal of the control loop.

[0054] Fig. Figure 9 shows a schematic representation to illustrate an exemplary arrangement of valves 901 and sensors 902 in an assembly according to the invention. A fluid channel arrangement 905 is shown analogous to the embodiment of Fig. 4 (and again without the invention being limited thereto) is constructed from mutually perpendicular fluid channel sections 910, 920. The sensors can be temperature sensors, pressure sensors for determining the fluid pressure, or flow sensors for determining a flow velocity present in the respective fluid channel section.

[0055] Fig. Figures 5-7 show schematic representations to explain the structure and function of a valve provided in a valve arrangement according to the invention in exemplary embodiments.

[0056] The valves of the valve assembly can be designed in any suitable manner, for example as a needle valve, diaphragm valve, or gate valve. Furthermore, the valves of the valve assembly can be integrated into the assembly according to the invention from the outset (e.g., by means of additive manufacturing), in particular monolithically, or subsequently installed (in the form of commercially available or specially manufactured valves) and fixed in the assembly in any suitable manner (e.g., via screw connections). Suitable seals (which can be, for example, O-ring seals or designed in another suitable manner) are used in each case to ensure the required tightness.The actuators for actuating the valve arrangement can be designed in any suitable way, in particular as hydraulic actuators, pneumatic actuators, electrostatic actuators, piezoelectric actuators or electromagnetic actuators (e.g. “voice coil actuators” or reluctance actuators).

[0057] Fig. Figure 5 schematically shows a possible realization of a valve as a needle valve, where the component in question (in the example, a mirror with a mirror substrate 501 and a layer system 502 forming an optically effective surface 500a) is designated by "500". The open position of the valve, allowing fluid flow through a fluid channel located in component 500 and designated by "503", is shown with a solid line, and the closed position, blocking fluid flow through the fluid channel 503, is shown with a dashed line. Here, "504" denotes the needle valve, "505" an actuator associated with the needle valve 504, and "506" a bushing provided on component 500.

[0058] Fig. Figure 6 schematically shows, as a further embodiment, a possible realization of a valve as a diaphragm valve, wherein in comparison to Fig. Five analogous and essentially functionally identical components are designated with reference numerals increased by 100. Here, "604" represents a diaphragm of the diaphragm valve, with the open position, which allows fluid flow through the fluid channel 603, and the closed position, which blocks fluid flow through the fluid channel 603, indicated by a dashed line. "607" designates a recess in component 600 for receiving the actuator 605.

[0059] Fig. Figure 7 schematically shows, as a further embodiment, another possible realization of a valve as a diaphragm valve, wherein in comparison to Fig. Six analogous and essentially functionally identical components are designated with reference numerals increased by 100. Here, "604" represents a diaphragm, with the open position of the valve, which allows fluid flow through fluid channel 703, indicated by a dashed line, in addition to the closed position. The actuator 705 associated with the diaphragm valve can be designed as an electrostatic actuator or in any other way.

[0060] The invention is particularly feasible in a lighting device or a projection lens of a microlithographic projection exposure system. Fig. Figure 10 schematically shows, in meridional section, the possible setup of a microlithographic projection exposure system designed for operation in EUV. According to Fig. The projection exposure system 1 comprises a lighting device 2 and a projection lens 10. In one embodiment of the lighting device 2 of the projection exposure system 1, in addition to a light or radiation source 3, there is a lighting optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the lighting device. In this case, the lighting device does not include the light source 3. Here, a reticule 7 arranged in the object field 5 is exposed. The reticule 7 is held by a reticule holder 8. The reticule holder 8 can be moved, particularly in a scanning direction, via a reticule displacement drive 9. Fig. Figure 10 shows a Cartesian xyz coordinate system for illustrative purposes. The x-direction runs perpendicular to the plane of the drawing. The y-direction runs horizontally, and the z-direction runs vertically. The scan direction runs in Fig. 10 along the y-direction. The z-direction runs perpendicular to the object plane 6.

[0061] The projection lens 10 serves to image the object field 5 onto an image field 11 in an image plane 12. A structure on the reticulum 7 is imaged onto a light-sensitive layer of a wafer 13 located in the image field 11 within the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, particularly along the y-direction, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized.

[0062] Radiation source 3 is an EUV radiation source. Specifically, radiation source 3 emits EUV radiation, which is also referred to as useful radiation or illumination radiation. This useful radiation has a wavelength in the range between 5 nm and 30 nm. Radiation source 3 could be, for example, a plasma source, a synchrotron-based radiation source, or a free-electron laser (FEL). The illumination radiation 16, emanating from the radiation source 3, is focused by a collector 17 and propagated through an intermediate focus in an intermediate focal plane 18 into the illumination optics 4. The illumination optics 4 has a deflecting mirror 19 and, downstream in the beam path, a first faceted mirror 20 (with schematically indicated facets 21) and a second faceted mirror 22 (with schematically indicated facets 23).

[0063] The projection lens 10 has a plurality of mirrors Mi (i = 1, 2, ...) which are numbered according to their arrangement in the beam path of the projection exposure system 1. In the case of the Fig. In the example shown, the projection lens 10 has six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 16. The projection lens 10 is a double-obscured optical system. The projection lens 10 has an image-side numerical aperture greater than 0.5, and which can also be greater than 0.6, for example, 0.7 or 0.75.

[0064] During operation of the microlithographic projection exposure system 1, the electromagnetic radiation incident on the optical surface of the mirrors is partially absorbed and, as explained above, leads to heating and a concomitant thermal expansion or deformation, which in turn can impair the imaging properties of the optical system. The concept according to the invention can therefore also be advantageously applied to any mirror of the microlithographic projection exposure system 1. Fig. 10 are applied.

[0065] The invention can also be advantageously implemented in a projection exposure system designed for operation in the DUV (i.e. at wavelengths smaller than 250 nm, in particular smaller than 200 nm) or in another optical system.

[0066] Fig. Figure 11 shows a possible basic structure of a microlithographic projection exposure system 1100 designed for operation in DUV.

[0067] The projection exposure system 1100 according to Fig. 11 comprises a lighting device 1110 and a projection lens 1120. The lighting device 1110 serves to illuminate a structure-bearing mask (reticule) 1115 with light from a light source unit 1105, which includes a laser light source, for example in the form of an ArF excimer laser for a working wavelength of 193 nm (or also in the form of a KrF excimer laser for a working wavelength of 248 nm or a mercury vapor lamp for a working wavelength of 365 nm) and a beam shaping optic that generates a parallel light beam.

[0068] The lighting device 1110 has an optical unit 1111, which, in the illustrated example, includes a deflecting mirror 1112. The optical unit 1111 can, for example, include a diffractive optical element (DOE) and a zoom-axicon system to generate different lighting settings (i.e., intensity distributions in a pupil plane of the lighting device 1110). Downstream of the optical unit 1111, a light mixing device (not shown) is located in the beam path, which, for example,The device may, in a manner known per se, have an arrangement of micro-optical elements suitable for achieving light mixing, as well as a lens group 1113, behind which a field plane with a reticle masking system (REMA) is located. This system is imaged by a REMA lens 1114, which follows in the direction of light propagation, onto the structure-bearing mask (reticle) 1115 arranged in a further field plane, thereby limiting the illuminated area on the reticle. The structure-bearing mask 1115 is imaged by the projection lens 1120 onto a lens substrate or a wafer 1130 provided with a photosensitive layer (photoresist). The projection lens 1120 can be designed, in particular, for immersion operation, in which case an immersion medium is located in front of the wafer or its photosensitive layer with respect to the direction of light propagation. Furthermore, it can, for example, have a numerical aperture NA greater than 0.85, especially greater than 1.1.

[0069] Even though the invention has been described with reference to specific embodiments, numerous variations and alternative embodiments are apparent to the person skilled in the art, for example, through the combination and / or exchange of features of individual embodiments. Accordingly, it is understood to the person skilled in the art that such variations and alternative embodiments are included in the present invention, and that the scope of the invention is limited only to the extent of the appended claims and their equivalents. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2022 200 532 A1

[0010] WO 2022 / 028710 A1

[0010] DE 10 2019 219 289 A1

[0010]

Claims

[1] Assembly of an optical system, with • at least one component (100, 200, 300, 500, 600, 700) in which a fluid channel arrangement (405) with at least one fluid channel (503, 603, 703) through which a fluid can flow is provided; and • a valve arrangement via which a flow path of the fluid in the fluid channel arrangement (405, 905) can be variably adjusted. [2] Assembly according to claim 1, characterized by that the fluid channel arrangement (405, 905) has at least one crossing region in which two fluid channel sections (410, 420, 910, 920) of the fluid channel arrangement (405, 905) cross each other. [3] Assembly according to claim 2, characterized by that a valve of the valve arrangement is arranged in this intersection area. [4] Assembly according to one of claims 1 to 3, characterized bythat the fluid channel arrangement (405, 905) has a plurality of crossing regions in which two fluid channel sections (410, 420, 910, 920) of the fluid channel arrangement (405, 905) cross each other. [5] Assembly according to claim 4, characterized by that these intersection areas are arranged in a grid structure. [6] Assembly according to claim 4 or 5, characterized by that the valve arrangement has a plurality of valves which are each arranged in one of the crossing regions. [7] Assembly according to one of the preceding claims, characterized by that the fluid in the fluid channel arrangement (405, 905) can be deflected via the valve arrangement. [8] Assembly according to one of the preceding claims, characterized by that a local flow rate of the fluid at at least one position in the fluid channel arrangement (405, 905) can be variably adjusted via the valve arrangement. [9] Assembly according to one of the preceding claims, characterized by that it further comprises a sensor arrangement for determining a current thermal state of the component. [10] Assembly according to one of the preceding claims, characterized by that it further comprises at least one pressure sensor for determining a fluid pressure present in the at least one fluid channel. [11] Assembly according to one of the preceding claims, characterized by that it further comprises at least one flow sensor for determining a flow velocity present in the at least one fluid channel. [12] Assembly according to one of the preceding claims, characterized by that it further comprises an actuator arrangement for actuating the valve arrangement. [13] Assembly according to claim 12 and one of claims 9 to 11, characterized bythat it further comprises a control unit for controlling the actuator arrangement as a function of sensor signals of the sensor arrangement, the at least one pressure sensor and / or the at least one flow sensor. [14] Assembly according to one of claims 1 to 13, characterized by that the component (100, 200, 300, 500, 600, 700) is a structural component, in particular a supporting structure component. [15] Assembly according to one of claims 1 to 13, characterized by that the component (100, 200, 300, 500, 600, 700) is an optical component, in particular a mirror. [16] Assembly according to claim 15, characterized by that the optical component is designed for an operating wavelength of less than 250 nm, in particular less than 200 nm. [17] Assembly according to claim 15, characterized by that the optical component is designed for an operating wavelength of less than 30 nm, in particular less than 15 nm. [18] Optical system comprising an assembly according to any one of the preceding claims. [19] Optical system according to claim 18, characterized by that this is a projection lens (10, 1120) or an illumination device (2, 1110) of a microlithographic projection exposure apparatus (1, 1100). [20] Method for operating an optical system, wherein the optical system comprises an assembly with at least one component (100, 200, 300, 500, 600, 700), in which a fluid channel arrangement (405, 905) with at least one fluid channel (503, 603, 703) through which a fluid can flow is provided, and a valve arrangement, wherein a flow path of the fluid in the fluid channel arrangement (405, 905) is variably adjusted via the valve arrangement. [21] Method according to claim 20, characterized bythat the adjustment of a flow path of the fluid in the fluid channel arrangement (405, 905) is carried out in such a way that a deformation of the component (100, 200, 300, 500, 600, 700) occurring during operation of the optical system and induced by electromagnetic radiation impinging on the component (100, 200, 300, 500, 600, 700) and / or by a fluid pressure of the fluid is at least partially compensated. [22] Method according to claim 20 or 21, characterized by that the optical system is designed according to claim 18 or 19.

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