OPTOELECTRONIC SEMICONDUCTOR COMPONENT

Abstract

An optoelectronic semiconductor component (100) is specified, comprising:- an optoelectronic semiconductor chip (10) comprising- a semiconductor body (1) and- an electrical connection region (5) of the first polarity arranged on the semiconductor body (1),- an electrical connection region (11) of the first polarity arranged laterally of the optoelectronic semiconductor chip (10),- at least two connection elements (12), each of which electrically conductively connects the electrical connection region (5) of the first polarity to the electrical connection region (11) of the first polarity,- an enclosure (13) in which the optoelectronic semiconductor chip (10) and the at least two connection elements (12) are embedded, wherein the connection elements (12) do not protrude beyond the enclosure (13) on a front side (100A) of the optoelectronic semiconductor component (100).

Claims

[1] Optoelectronic semiconductor component (100) comprising - an optoelectronic semiconductor chip (10) comprising - a semiconductor body (1) and - an electrical connection region (5) of first polarity arranged on the semiconductor body (1), - an electrical connection region (11) of first polarity arranged laterally of the optoelectronic semiconductor chip (10), - at least two connecting elements (12), each of which electrically connects the electrical connection area (5) of the first polarity to the electrical connection area (11) of the first polarity, - an encapsulation (13) in which the optoelectronic semiconductor chip (10) and the at least two connecting elements (12) are embedded, wherein the connecting elements (12) do not protrude beyond the encapsulation (13) on a front side (100A) of the optoelectronic semiconductor component (100). [2] Optoelectronic semiconductor component (100) according to the preceding claim, wherein first ends (12A) of the connecting elements (12) are arranged next to one another on the electrical connection region (11) of first polarity. [3] Optoelectronic semiconductor component (100) according to claim 1, wherein first ends (12A) of the connecting elements (12) are arranged on top of one another on the electrical connection region (11) of first polarity. [4] Optoelectronic semiconductor component (100) according to claim 1, wherein first ends (12A) of the connecting elements (12) on the electrical connection region (11) of first polarity are arranged partly on top of one another and partly next to one another. [5] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein second ends (12B) of the connecting elements (12) are arranged next to one another and / or on one another on the electrical connection region (5) of first polarity. [6] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein the encapsulation (13) on the front side (100A) of the optoelectronic semiconductor component (100) is formed step-free. [7] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein the optoelectronic semiconductor chip (10) has a conversion element (7) arranged on a front side (1A) of the semiconductor body (1), and the connecting elements (12) on the front side (100A) of the optoelectronic semiconductor component (100) do not protrude beyond the conversion element (7). [8] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein each connecting element (12) is a bonding wire. [9] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein the connecting elements (12) each have a thickness (s1) which is less than a thickness (s2) of a single connecting element (12) which has a current-carrying capacity sufficient for operation of the optoelectronic semiconductor chip (10), wherein a number of the connecting elements (12) is selected such that the total current-carrying capacity of the single connecting element (12) is achieved. [10] Optoelectronic semiconductor component (100) according to the preceding claim, comprising a redundant connecting element (12). [11] Optoelectronic semiconductor component (100) according to one of the preceding claims, wherein the encapsulation (13) contains a potting material. [12] Optoelectronic semiconductor component (100) according to the preceding claim, wherein the encapsulation (13) comprises reflective particles embedded in the encapsulation material. [13] Optoelectronic semiconductor component (100) according to one of the preceding claims, which has an electrical connection region (14) of second polarity, on which the optoelectronic semiconductor chip (10) is arranged and which can be electrically contacted from the outside on a rear side (100B) of the optoelectronic semiconductor component (100). [14] Optoelectronic semiconductor component (100) according to the preceding claim, which has a further semiconductor chip (16), wherein the further semiconductor chip (16) is arranged on the electrical connection region (11) of first polarity or on a further connection region (15) of second polarity. [15] Optoelectronic semiconductor component (100) according to one of the two preceding claims, wherein the electrical connection regions (11, 14, 15) are embedded in the enclosure (13) or a housing frame (18).

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