DEVICE AND METHOD FOR THERMALLY CONNECTING AN ELECTRONIC COMPONENT TO ANOTHER COMPONENT

Abstract

The present invention relates to a device for thermally connecting an electronic component to another component, comprising a positioning element which is designed to position the electronic component and to position the component, and which has a receptacle for the electronic component and at least one channel opening into the receptacle and into a side surface of the positioning element, through which channel an air flow can be formed, and an adhesive layer for adhesively thermally connecting the electronic component to the component. Furthermore, the invention relates to a method for thermally connecting an electronic component to another component.

Description

FIELD OF THE INVENTION

[0001] The present invention relates to a device for thermally connecting an electronic component to another component. The invention further relates to a method for thermally connecting an electronic component to another component, in particular to a device according to the invention. TECHNICAL BACKGROUND

[0002] For cooling and / or temperature control of electronic components, they can be thermally coupled or connected to another component, particularly another electronic component. This can be done, for example, mechanically via a so-called heatsink or electrically via a thermoelectric cooling module such as a TEC (Thermo Electric Cooler).

[0003] For components connected in this way, permanent and sufficient heat transfer must be ensured. For this purpose, an adhesive bond can be used, for example. Common adhesive bonds include adhesives, particularly liquid adhesives, or adhesive tapes, which can be pre-applied, for example, to at least one of the components.

[0004] If an adhesive, especially a liquid adhesive, is used, the position of the two components to be joined can be subsequently adjusted to fix them together in a desired target position. However, in this configuration, the two components must be held in this target position and / or pressed together until the adhesive cures. Depending on the curing time, it may be necessary to hold the two components precisely against each other for an extended period of time before the adhesive has cured.

[0005] If adhesive tapes are used, subsequent repositioning or alignment of the components relative to each other is difficult or almost impossible. In such a design, a very precise arrangement of the two electronic components is therefore required to fix them together in the target position with sufficient accuracy. SUMMARY OF THE INVENTION

[0006] Against this background, the present invention is based on the object of providing an improved device and an improved method for positioning at least one electronic component and another component relative to one another and for thermally connecting them to one another.

[0007] According to the invention, this object is achieved by a device having the features of independent patent claim 1 and a method having the features of the further independent patent claim.

[0008] Accordingly, it is provided: A device for thermally connecting an electronic component to another component, comprising a positioning element which is designed to position the electronic component and to position the component, and which has a receptacle for the electronic component and at least one channel opening into the receptacle and into a side surface of the positioning element, through which channel an air flow can be formed, and an adhesive layer for adhesively thermally connecting the electronic component to the component. A method for thermally connecting an electronic component to another component, in particular to a device according to the invention, comprising the steps of: arranging the electronic component on a positioning element which is designed to position the electronic component and to position the component, sucking the electronic component into a receptacle of the positioning element, wherein an air flow is formed via at least one channel which opens at the receptacle and at a side surface of the positioning element, and forming an adhesive thermal connection between the electronic component and the component by means of an adhesive layer.

[0009] The finding underlying the present invention is that the electronic components can be positioned relative to one another by means of an auxiliary device, in particular for a period of time in which an adhesive component has not yet cured.

[0010] The idea underlying the present invention is to position or align an electronic component relative to another, particularly electronic, component using a positioning element. Furthermore, an air flow can be formed that presses the electronic component and the other component together or brings them into contact with each other, particularly through suction or negative pressure.

[0011] The electronic component and / or the further component can be a thermoelectric component, for example a thermoelectric cooling plate or a thermoelectric cooling module such as a TEC (Thermo Electric Cooler). Furthermore, the electronic component and / or the further component can be a section of a sensor housing or a sensor housing. In a preferred embodiment, the electronic component is designed as a thermoelectric cooling plate or thermoelectric cooling module, such as a TEC, and the further component is designed as a sensor housing.

[0012] The positioning element can have any geometric shape, in particular, it can be designed as a square or rectangular element. For example, the positioning element can be cuboid-shaped, rectangular, and / or shaped as a rectangular block.

[0013] The positioning element is designed in particular as an auxiliary device for positioning the electronic component and for positioning the component. For this purpose, at least one receptacle is provided for positioning the electronic component and / or the component. The receptacle is formed, for example, on a side surface of the positioning element, in particular on a side surface of a square or rectangular element. The receptacle can, for example, be a recess in which the electronic component can be held and positioned. In particular, the size of the receptacle is adapted to the size of the electronic component. In such a received position, the electronic component preferably projects laterally beyond the positioning element so that it can be connected to the other component at a free underside.

[0014] Furthermore, at least one channel is provided, which runs in particular from the receptacle to a side surface of the positioning element. The channel can, for example, run at an angle or in a straight line through the positioning element. The channel is designed in particular to generate an air flow from the receptacle through the interior of the positioning element, for example using a vacuum pump, such that the electronic component can be held by a negative pressure created in the receptacle or by another physical effect, in particular by the contact surfaces of the receptacle and the electronic component being pressed together due to the negative pressure.

[0015] The channel opens, in particular, at the receptacle and at a side surface of the positioning element. This allows suction or negative pressure to be generated in the receptacle if a pump or similar device is arranged at the opening on the side surface to generate an air flow through the channel.

[0016] In particular, the receptacle is designed with a shallower depth than the electronic component, so that the electronic component can protrude beyond the receptacle when accommodated in the receptacle. In other words, the electronic component can protrude beyond the receptacle. This allows the electronic component to be contacted or thermally connected to the other component, for example, via its underside.

[0017] In particular, the positioning element has sufficient weight to exert a contact force on the electronic part and / or component. The contact force is particularly adapted to the weight of the electronic component. Preferably, the weight of the positioning element is greater than the weight of the electronic component.

[0018] The positioning element can contain a brass material and, in particular, be formed as a brass block. Other materials, in particular those with sufficient density to achieve a corresponding dead weight, are also conceivable.

[0019] The positioning element is specifically molded from a heat-resistant material so that it can be heated together with the electronic component and the other components. This can shorten the curing time of the adhesive layer.

[0020] The adhesive layer is, in particular, a liquid adhesive. The adhesive layer can be pre-assembled and applied to at least one of the components, i.e., the electronic component and / or the additional component. Because the positioning element positions the electronic component and the additional component relative to each other, displacement of the electronic component relative to the component is prevented. The positioning element can therefore ensure sufficient positioning until the adhesive cures.

[0021] With the device according to the invention and with the method, the components to be connected, i.e., the at least one electronic component and the at least one further component, can be positioned relative to one another. In particular, the components to be connected can be mechanically positioned relative to one another by mechanically aligning them using the positioning element.

[0022] The device and method enable fast and precise work, which is particularly designed for a partially manual workflow. In a further embodiment, the device and method can be integrated into an automated workflow.

[0023] Advantageous embodiments and further developments emerge from the further subclaims and from the description with reference to the figures of the drawing.

[0024] According to an advantageous embodiment, the at least one channel can be connected to a vacuum device, so that the electronic component can be held in the receptacle by a negative pressure. For example, a vacuum pump can be used to generate an air flow through the channel in such a way that a negative pressure is created in the receptacle. The electronic component can be held in the receptacle by the negative pressure or another physical effect. In particular, contact surfaces of the receptacle and the electronic component are pressed together.

[0025] According to an advantageous embodiment, at least one alignment element can be formed on the positioning element, which serves to position the further component relative to the electronic component. The alignment element can be formed as a projection or as a recess. The alignment element can be arranged, in particular, on a side surface of the positioning element.

[0026] The alignment element is particularly configured with a length shorter than the depth of the electronic component when the electronic component is received in the receptacle, so that the electronic component can project beyond the at least one alignment element when received in the receptacle. In other words, the electronic component can project beyond the at least one alignment element. This ensures that the at least one alignment element does not impede thermal connection of the electronic component to the component.

[0027] According to an advantageous embodiment, the at least one alignment element can be arranged on the side surface of the positioning element on which the receptacle is also arranged. In one possible embodiment, the alignment element is formed as part of the receptacle, so that the electronic component can be held in the receptacle and the component can be positioned by the alignment elements. The receptacle can, for example, be adapted to the size of the electronic component by the alignment element. The alignment element can, for example, also form a lateral boundary of the receptacle, so that displacement of the electronic component in the receptacle can be prevented.

[0028] According to an advantageous embodiment, the at least one alignment element can be arranged outside the receptacle. The electronic component can be securely positioned in the receptacle independently of the at least one alignment element.

[0029] According to an advantageous embodiment, at least two alignment elements can be formed on the positioning element, which are designed as projections or lugs and are positioned in at least two opposite areas with respect to the receptacle. This can prevent, in particular, displacement of the component. The alignment elements can, for example, be formed as projections or lugs arranged parallel to one another, wherein the component can be aligned in a desired position by the projections or lugs. For example, the projections or lugs can also form a type of frame for positioning the component, and in particular also the electronic component.

[0030] According to an advantageous embodiment, the receptacle can be designed as a recess in a side surface of the positioning element. For example, the receptacle can be shaped as a rectangular or square recess or cutout. The size is particularly adapted to the size of the electronic component, so that, in particular, displacement of the electronic component within the receptacle, especially parallel to the side surface of the positioning element, can be prevented.

[0031] According to an advantageous embodiment, the component can be U-shaped at least in sections, wherein, in a contacted state, the device can be at least partially enclosed by the component. In particular, the positioning element can be at least partially enclosed by the component. Enclosed means, in particular, that the component can at least partially encompass the positioning element or the device due to the U-shaped design. If the component is U-shaped at least in sections, it can be a sensor housing, for example. The electronic component can be positioned in the sensor housing by the positioning element.

[0032] In a further embodiment, the at least one alignment element can position the electronic component on the one hand and the further component on the other. This is achieved in particular by the electronic component and the further component contacting the at least one alignment element on two opposite side surfaces. Thus, the component can be aligned on an outer side of the at least one alignment element, and the electronic component can be aligned on an inner side of the at least one alignment element.

[0033] If the further component is U-shaped at least in sections, in a further embodiment several alignment elements, or also a frame-shaped section of the positioning element, can position the further component through an outer side and the electronic component through an inner side.

[0034] The at least one alignment element can form a stop or a stop surface for the electronic component or for the additional component on two opposite side surfaces. This allows the device to be designed very compactly.

[0035] According to an advantageous embodiment, the adhesive layer on the electronic component or on the further component can be prefabricated and, in particular, can be designed as a liquid adhesive. For example, a layer of liquid adhesive can be arranged on the further component before the further component is connected to the electronic component. In a further embodiment, a layer of liquid adhesive can be arranged on the electronic component before the electronic component is connected to the further component. Likewise, an additive layer, in particular a liquid adhesive, can be provided on the electronic component and on the further component, at least in sections, before they are connected to one another.

[0036] According to an advantageous embodiment, a contact force can be exerted on the electronic component and on the further component by the dead weight of the positioning element when the device is connected to the electronic component and the further component. This can be achieved in particular by designing the positioning element as a solid block. For example, the positioning element can be designed as a rectangular block or a cuboid cube, with the electronic component and the further component being arranged below the positioning element when they are connected to one another. The positioning element can, for example, contain a brass material or be formed from a brass block. Other materials are also conceivable.

[0037] According to an advantageous embodiment, the device can further be provided with an adapter that can be connected to the channel on the side surface and to the vacuum device. The adapter can, for example, be provided for connecting a pump to the channel. This allows the air flow from the channel to be guided through the adapter to the pump, such as a vacuum pump or vacuum device.

[0038] According to an advantageous embodiment, the adapter can have a valve that allows a vacuum to be maintained in the receptacle after the vacuum device has been disconnected. This allows the electronic component to be held against the positioning element for a desired period of time. As long as the vacuum is maintained, the electronic component can be sucked onto the positioning element.

[0039] According to an advantageous embodiment of the method, the at least one channel can be connected to a vacuum device for sucking in the electronic component, so that the electronic component is held in the receptacle by negative pressure. Thus, in particular, by applying a negative pressure in the at least one channel, the electronic component can be held in a mechanically predetermined position on the positioning element, in particular in the receptacle. The alignment is determined by mechanical elements, such as in particular the at least one alignment element.

[0040] According to an advantageous embodiment of the method, the positioning element can be arranged above the component, wherein the component is positioned relative to the electronic component by at least one alignment element on the positioning element, and in particular the electronic component is pressed against the component by the positioning element's own weight. In other words, the positioning element's own weight can act on the electronic component and on the further component to thermally connect them to one another. The positioning element can remain in this position for a desired period of time, thus preventing any relative displacement of the electronic component relative to the component as long as the adhesive layer is not fully cured.

[0041] According to an advantageous embodiment of the method, after positioning the component, curing can take place in an oven. The positioning element is preferably formed from a heat-resistant material so that it can remain in the oven during curing.

[0042] In one embodiment, after curing of the additive layer, in particular in an oven, the positioning element can be removed so that it can be reused as an auxiliary device for a further work step.

[0043] According to an advantageous embodiment of the method, prior to curing in the furnace, the at least one channel can be separated from the vacuum device while maintaining the negative pressure in the receptacle. The vacuum device, such as in particular a vacuum pump, can therefore be separated from the device prior to heating in the furnace. In such an embodiment, a valve is provided, in particular in the channel and / or at the mouth of the channel, to maintain the desired negative pressure over a certain period of time. Furthermore, in such an embodiment, the negative pressure can be removed as soon as the vacuum device is removed.

[0044] The same features and advantages continue to apply to the method as described with regard to the device.

[0045] The above embodiments and further developments can be combined with one another as desired, where appropriate. Further possible embodiments, further developments, and implementations of the invention also include combinations of features of the invention not explicitly mentioned above or described below with regard to the exemplary embodiments. In particular, those skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the present invention. TABLE OF CONTENTS OF THE DRAWING

[0046] The present invention will be explained in more detail below with reference to the exemplary embodiments shown in the schematic figures of the drawing. In the drawings: Fig. 1 a device for thermally connecting an electronic component to another component in a possible method step; Fig. 2 shows a further possible arrangement of the device in a further method step; Fig. 3 shows another possible arrangement of the device in a further method step; Fig. 4 another possible arrangement of the device in a further process step.

[0047] The accompanying drawing figures are intended to provide a further understanding of embodiments of the invention. They illustrate embodiments and, in conjunction with the description, serve to explain principles and concepts of the invention. Other embodiments and many of the noted advantages will become apparent upon review of the drawings. Elements of the drawings are not necessarily shown to scale relative to one another.

[0048] In the figures of the drawing, identical, functionally identical and acting elements, features and components are provided with the same reference symbols, unless otherwise stated. DESCRIPTION OF EMBODIMENTS

[0049] In Fig. 1 is a device 1 for thermally connecting an electronic component 2 with another component 3, see Fig. 3. This comprises a positioning element 4, which is designed in particular in the form of an auxiliary device for positioning the electronic component 2 and for positioning the component 3. The electronic component 2 and / or the further component 3 can be a thermoelectric component, for example a thermoelectric cooling plate or a thermoelectric cooling module. Furthermore, the electronic component 2 and / or the further component 3 can be a section of a sensor housing or a sensor housing. In the illustrated embodiment, the electronic component 2 is designed as a thermoelectric cooling plate or thermoelectric cooling module, such as a TEC. The further component 3 is in the illustrated embodiment, see Fig. 3, designed as a sensor housing.

[0050] The positioning element 4 is shown as a rectangular block, but can have any desired geometric shape. The positioning element 4 has a receptacle 5 for the electronic component 2 and at least one channel 6 opening into the receptacle 5 and into a side surface 7 of the positioning element 4, through which channel an air flow 8 can be guided. In the embodiment shown, the receptacle 5 is formed on a lower side surface of the positioning element 4. The receptacle 5 is shaped as a type of recess in which the electronic component 2 can be held in position. In particular, the size, i.e. in particular a width and length, of the receptacle 5 is adapted to the size, i.e. in particular a width and length, of the electronic component 2, such that the electronic component 2 cannot be displaced parallel to the side surface.The electronic component 2 further preferably has a greater depth than the receptacle 5, so that it projects beyond the side surface, as in . Fig. 2 shown.

[0051] The at least one channel 6 can be connected to a vacuum device 10 so that the electronic component 2 is held in the receptacle 5 by a negative pressure or other physical effects. The at least one channel 6 can run straight or at an angle in the positioning element 4. In the illustrated embodiment, the channel 6 is arranged at an angle so that it opens at two adjacent side surfaces of the positioning element 4. The receptacle 5 is provided on the side surface of the positioning element 4, which is aligned horizontally in the illustration, with the channel 6 opening centrally in the receptacle 5, then running at an angle through the positioning element 4, and opening at the right-hand side surface 7 in the illustration to be guided to the vacuum device 10. The air flow 8 can thus, for example, generate a negative pressure in the receptacle 5, whereby the electronic component 2 can be held in the receptacle 5.

[0052] In an embodiment not shown, several channels 6, in particular running parallel to one another, can be provided in order to hold, for example, a larger electronic component 2 in the receptacle 5.

[0053] In one embodiment, the vacuum device 10 can be connected to the positioning element 3 via an adapter 12. The channel 6 is extended through the adapter 12 to the vacuum device 10.

[0054] At least one alignment element 11 can be formed on the positioning element 4 in order to position the further component 3 relative to the electronic component 2. The alignment element 11 can be arranged on the same side surface of the positioning element 4 on which the receptacle 5 is also arranged. In the illustrated embodiment, two alignment elements 11 are arranged outside the receptacle 5. A modified arrangement is also conceivable. For example, the at least one alignment element 11 can be provided as a type of nose or projection, which is also shaped for positioning the electronic component 2 and forms part of the receptacle 5. In an embodiment not shown, for example, a receptacle 5 can be formed as a type of recess in a side surface of the positioning element 4, wherein the opposing projections delimit the receptacle 5.

[0055] As in the Fig. 1 to 4, two alignment elements 11 in the form of projections or lugs can be positioned at two opposite areas relative to the receptacle 5. The illustrated alignment elements 11 can also form a circumferential frame that serves to align the component 3. In the illustrated embodiment, the alignment elements 11 are arranged at a distance from the receptacle 5.

[0056] Furthermore, an adhesive layer 9 is included for the adhesive thermal connection of the electronic component 2 to the component 3. The adhesive layer 9 can be arranged prefabricated on the electronic component 2 and / or on the component 3. Fig. 3 shows the adhesive layer 9 pre-assembled on the further component 3. In a further embodiment, the adhesive layer 9 can be pre-assembled on the electronic component 2 or on the electronic component 2 and on the further component 3. In particular, the adhesive layer 9 is designed as a liquid adhesive.

[0057] The component 3 can be U-shaped at least in sections, wherein in a contacted state the device 1 can be at least partially enclosed by the component 3, as shown in Figure 4.

[0058] By means of the weight of the positioning element 4, a contact force can be exerted on the electronic component 2 and on the further component 3 when the device 1 is connected to the electronic component 2 and the further component 3, as in Fig. 4. The positioning element 4 is therefore preferably designed with a sufficient dead weight, for example, from a brass material.

[0059] To form the thermal connection between the electronic component 2 and the further component 3, the positioning element 4 can first be placed above the electronic component 2, as shown in Fig. 1. At this point in time, the vacuum device 10, in particular a vacuum pump, is preferably already connected to the positioning element 4. This can be done, for example, via an adapter 12. Subsequently or simultaneously, the air flow 8 can be generated via the vacuum device 10, so that the electronic component 2 is sucked onto the positioning element 4 and held in the desired position, ie in the receptacle 5, as shown in Fig. 2 shown.

[0060] According to Fig.3, the positioning element 4 with the electronic component 2 sucked onto it can be arranged above a further component 3. The additive layer 9 can already be prefabricated on the further component 3. If the positioning element 4 is now moved in the direction of the further component 3, the alignment elements 11 align the further component 3 relative to the positioning element 4, and thus also relative to the electronic component 2. The alignment elements 11 can in particular prevent tilting or incorrect positioning of the electronic component 2 in relation to the further component 3. After the positioning element 4 has been placed on the further component 3, the entire structure can be placed in an oven for curing. In this case, a contact force is generated from the electronic component 2 onto the further component 3 via the dead weight of the positioning element 4.

[0061] Before curing in an oven, the vacuum device 10 is removed. For example, a valve is provided, which is arranged on the side surface 7 in the channel 6 or in the adapter 12. The valve allows the negative pressure to be maintained even after the vacuum device 10 has been removed. In a further embodiment, the negative pressure can be removed as soon as the positioned position of the component 3 relative to the electronic component 2 has been reached.

[0062] The device 1 according to the invention or the method according to the invention can provide stable positioning between the electronic component 2 and the component 3. This is achieved in particular by a sufficiently high weight of the positioning element 4 and the air flow 8. Pressing the electronic component 2 against the positioning element 4 is achieved in particular by negative pressure or other physical effects.

[0063] The device 1 according to the invention or the method according to the invention can be used for precise work, which can be integrated in particular into a partially manual or even an automated workflow. LIST OF REFERENCE SYMBOLS 1 device 2 electronic component 3 Component 4 Positioning element 5 Recording 6 channel 7 Side surface 8 Airflow 9 adhesive layer 10 Vacuum device 11 Alignment element 12 adapters

Claims

[1] Device (1) for thermally connecting an electronic component (2) to another component (3), comprising: a positioning element (4) which is designed for positioning the electronic component (2) and for positioning the component (3), and which has a receptacle (5) for the electronic component (2) and at least one channel (6) opening into the receptacle (5) and into a side surface (7) of the positioning element (4), through which an air flow (8) can be formed; and an adhesive layer (9) for the adhesive thermal connection of the electronic component (2) to the component (3). [2] Device (1) according to claim 1, wherein the at least one channel (6) is connectable to a vacuum device (10) so that the electronic component (2) can be held in the receptacle (5) by a negative pressure. [3] Device (1) according to one of claims 1 and 2, wherein at least one alignment element (11) is formed on the positioning element (4), which serves to position the further component (3) relative to the electronic component (2). [4] Device (1) according to claim 3, wherein the at least one alignment element (11) is arranged on that side surface of the positioning element (4) on which the receptacle (5) is also arranged. [5] Device (1) according to one of claims 3 or 4, wherein the at least one alignment element (11) is arranged outside the receptacle (5). [6] Device (1) according to one of claims 3 to 5, wherein at least two alignment elements (11) are formed on the positioning element (4), which are designed as projections or noses and are positioned in at least two opposite areas with respect to the receptacle (5). [7] Device (1) according to one of claims 1 to 6, wherein the receptacle (5) is formed as a recess in a side surface of the positioning element (4). [8] Device (1) according to one of claims 1 to 7, wherein the component (3) is at least partially U-shaped, wherein in a contacted state the device (1) can be at least partially enclosed by the component (3). [9] Device (1) according to one of claims 1 to 8, wherein the adhesive layer (9) on the electronic component (2) or on the further component (3) can be prefabricated, and in particular is designed as a liquid adhesive. [10] Device (1) according to one of claims 1 to 9, wherein a contact force can be exerted on the electronic component (2) and on the further component (3) by a dead weight of the positioning element (4) when the device (1) is connected to the electronic component (2) and the further component (3). [11] Device (1) according to one of claims 1 to 10, further comprising an adapter (12) which is connectable to the channel (6) on the side surface (7) and the vacuum device (10). [12] Device (1) according to claim 11, wherein the adapter (12) has a valve with which a built-up negative pressure in the receptacle (5) can be maintained after the vacuum device (10) has been disconnected. [13] Method for thermally connecting an electronic component (2) to another component (3), in particular to a device (1) according to one of the preceding claims, comprising the steps: Arranging the electronic component (2) on a positioning element (4) which is designed to position the electronic component (2) and to position the component (3); Sucking the electronic component (2) into a receptacle (5) of the positioning element (4), wherein an air flow (8) is formed via at least one channel (6) which opens into the receptacle (5) and into a side surface (7) of the positioning element (4); and Forming an adhesive thermal connection of the electronic component (2) with the component (3) by means of an adhesive layer (10). [14] Method (1) according to claim 13, wherein for sucking in the electronic component (2) the at least one channel (6) is connected to a vacuum device (10) so that the electronic component (2) is held in the receptacle (5) by negative pressure. [15] Method (1) according to one of claims 13 or 14, wherein the positioning element (4) is arranged above the component (3), wherein the component (3) is positioned relative to the electronic component (2) by at least one alignment element (11) on the positioning element (4), and in particular the electronic component (2) is pressed against the component (3) by a dead weight of the positioning element (4). [16] Method (1) according to claim 15, wherein after positioning the component (3) curing takes place in an oven. [17] Method (1) according to claim 16, when dependent on claim 14, wherein, prior to curing in the oven, the at least one channel (6) is separated from the vacuum device (10) while maintaining the negative pressure in the receptacle (5).

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