SPÜLDÜSE

Abstract

A flushing nozzle is provided for rinsing an object by supplying liquid to the object while transmitting ultrasonic waves to the liquid. The flushing nozzle comprises a housing, a flat vibrating plate, and several transducers. The housing has an inner chamber containing the liquid, a feed port that supplies the liquid from the inner chamber to the object, and a connecting section that links a liquid supply source to the inner chamber. The vibrating plate is positioned within the inner chamber facing the feed port. The transducers apply ultrasonic waves to the vibrating plate. The propagation of the ultrasonic waves from the vibrating plate to the liquid can be controlled by modulating the transducers using phased array control.

Description

Technical background of the inventionField of the invention

[0001] The present invention relates to a rinsing nozzle for rinsing an object by supplying liquid to the object. Description of the technical background

[0002] Component chips containing components are manufactured by dividing a wafer on which the components are formed into individual chips. Furthermore, a packaging substrate is formed by attaching such component chips to a predetermined substrate and covering and sealing the attached component chips with a plastic layer (molded plastic). By dividing and singulating such a packaging substrate, packaged components are manufactured, each containing a plurality of the packaged components. Component chips and packaged components are incorporated into various types of electronic devices such as mobile phones and PCs.

[0003] When a workpiece such as a wafer or a packaging substrate is divided into chips, it is processed using various types of processing equipment. For example, a cutting device that cuts the workpiece with a ring-shaped cutting blade, a laser processing device that subjects the workpiece to laser processing, or the like can be used to divide the workpiece. Furthermore, by grinding and thinning the workpiece with a grinder before dividing, thin chips are obtained.

[0004] When the workpiece is machined with such a machining device as described above, dirt particles (machining dirt particles) generated during machining are scattered and deposited on the workpiece. Therefore, after machining the workpiece, a rinsing step is performed to rinse the workpiece using a rinsing device. The rinsing device supplies rinsing fluid to the workpiece, thereby flushing away dirt particles adhering to the workpiece and thus rinsing the workpiece.

[0005] When dirt particles are firmly deposited on the workpiece, simply supplying the rinsing fluid to the workpiece cannot completely remove the dirt particles, resulting in insufficient rinsing of the workpiece. Therefore, a rinsing device has been proposed that includes a rinsing nozzle that imparts ultrasonic vibrations to the rinsing fluid (see Japanese Patent Application Laid-Open No. 2022-28313). The rinsing nozzle includes, for example, a vibrating plate formed in a dome-shaped, depressed spherical shape, and the vibrating plate is vibrated to impart ultrasonic vibrations to the rinsing fluid. By supplying the rinsing fluid, to which the ultrasonic vibrations have been applied, to the workpiece, separation of the machining dirt particles from the workpiece is facilitated, thus effectively rinsing the workpiece. PRESENTATION OF THE INVENTION

[0006] When a vibrating plate that applies ultrasonic vibrations to a liquid for rinsing in a rinsing nozzle is formed in a dome-shaped, depressed spherical shape as described above, ultrasonic waves can be concentrated near a feed port of the rinsing nozzle and can be facilitated to reach a target object while maintaining high intensity. However, the use of a vibrating plate with a depressed spherical shape has been determined to be suitable for facilitating the accumulation of air near a depressed sphere of the vibrating plate. When air accumulates near the depressed sphere of the vibrating plate, an air layer is formed between the vibrating plate and the liquid, which inhibits the propagation of ultrasonic waves from the vibrating plate to the liquid.This makes it less likely that the ultrasonic waves will propagate adequately to the object, leading to the problem that the object's rinsing efficiency may be reduced.

[0007] In view of the above problem, it is an object of the present invention to provide a rinsing nozzle that enables efficient propagation of ultrasonic waves to an object via a rinsing liquid.

[0008] According to one aspect of the present invention, there is provided a rinsing nozzle for rinsing an object by supplying liquid to the object while transmitting ultrasonic waves to the liquid, comprising: a housing having an internal space for holding the liquid therein, a supply port for supplying the liquid from the internal space toward the object, and a connecting portion connecting a liquid supply source that supplies the liquid and the internal space; a planar vibrating plate disposed in the internal space so as to face the supply port; and a plurality of transducers that apply ultrasonic waves to the vibrating plate. Propagation of ultrasonic waves to be applied from the vibrating plate to the liquid can be controlled by controlling the transducers according to a phased array.

[0009] Preferably, the rinsing nozzle could be designed to allow the ultrasonic waves applied to the liquid by the vibrating plate to converge on a straight line perpendicular to the feed opening and passing through a center of the feed opening. Also preferably, the transducers could be arranged in a grid pattern. Also preferably, the transducers could be formed in a circular or annular shape and arranged concentrically.

[0010] The rinsing nozzle according to this aspect of the present invention is designed such that the propagation of the ultrasonic waves applied by the vibrating plate to the liquid to be rinsed can be controlled by the phased array of transducers. Consequently, the ultrasonic waves can be efficiently transmitted through the liquid to the object.

[0011] The above and other objects, features and advantages of the present invention, as well as the modes for carrying them into effect, will best become apparent and the invention itself will be best understood by studying the following description and appended claims, with reference to the accompanying drawings which illustrate a preferred embodiment of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically illustrating a flushing device; Fig. Figure 2 is a partial cross-sectional front view schematically illustrating the flushing device; Fig. 3 is a cross-sectional view illustrating a rinsing nozzle according to an embodiment of the present invention; Fig. Figure 4 is a schematic diagram showing how ultrasonic waves propagate in liquid; Fig. 5A is a contour figure illustrating a sound pressure of ultrasonic waves generated by control according to a phased field with a phase shift fixed at 0°; Fig. 5B is a contour figure illustrating the sound pressure of ultrasonic waves generated by control according to a phased field with a phase shift fixed at 45°; Fig. 5C is a contour figure illustrating the sound pressure of ultrasonic waves generated by control according to a phased field with a phase shift fixed at 90°; Fig. 5D is a contour figure representing the sound pressure of ultrasonic waves generated by control according to a phased field with a phase shift fixed at 135°; Fig. 6A is a plan view illustrating a first specific example of a vibration application unit; Fig. 6B is a plan view illustrating a second specific example of the vibration application unit; and Fig. 6C is a plan view showing a third specific example of the vibration application unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0012] With reference to the accompanying drawings, an embodiment according to one aspect of the present invention will be described below. First, an embodiment example of a flushing device to which a flushing nozzle according to this embodiment can be attached will be described. Fig. Figure 1 is a perspective view schematically illustrating a rinsing device 2 rinsing an object 11. It should be noted that in Fig. 1 An X-axis direction (left-to-right direction, first horizontal direction) and a Y-axis direction (front-to-back direction, second horizontal direction) are directions perpendicular to each other. It should also be noted that a Z-axis direction (top-to-bottom direction, height direction, vertical direction) is a direction perpendicular to both the X-axis and Y-axis directions.

[0013] The object 11 corresponds to an object to be rinsed by the rinsing device 2. Specifically, the object 11 is a workpiece that is subjected to processing such as cutting, grinding, polishing, and / or laser processing. After the object 11 has undergone a predetermined processing, the object 11 is rinsed by the rinsing device 2.

[0014] The object 11 is, for example, a disk-shaped wafer made of a semiconductor material such as single-crystal silicon, having a first surface 11a and a second surface 11b that are substantially parallel to each other. The object 11 is divided by a plurality of streets (scribe lines) into a plurality of rectangular regions arranged in a grid pattern so that they intersect. Components (not shown) such as integrated circuits (ICs), large-scale integration (LSIs), light-emitting diodes (LEDs), or microelectromechanical systems (MEMS) are formed in the regions defined by the streets. By dividing the object 11 along the streets by dicing, laser machining, or the like, a plurality of component chips of a similar type comprising the components are manufactured.Thin component chips are also obtained if the object 11 is made thin by grinding and / or polishing before it is divided.

[0015] However, there are no restrictions on the type, material, size, shape, construction, and the like of the object 11. The object 11 could, for example, be a wafer (substrate) made of a semiconductor (GaAs, InP, GaN, SiC, or the like) other than silicon, or of sapphire, glass, ceramic, plastic, metal, or the like. There are no restrictions on the type, number, shape, structure, size, arrangement, and the like of the components. No components may be formed on the object 11. Furthermore, the object 11 can also be a packaging substrate, such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-Leaded Package) substrate. The packaging substrate could, for example, be formed by a plurality of component chips mounted on a predetermined substrate, and the mounted component chips are covered and sealed with a resin layer (molding plastic).By dividing and separating the packaging substrate, package components are produced which have several packaged component chips of a similar type.

[0016] Various types of processing devices are used to process the object 11. Examples of such processing devices include a cutting device that cuts the object 11, a grinding device that grinds the object 11, a polishing device that polishes the object 11, a laser processing device that subjects the object 11 to laser processing, and the like.

[0017] The cutting device includes a processing unit (cutting unit) that cuts the object 11. The cutting unit includes a spindle, and an annular cutting blade is attached to a distal end portion of the spindle. By causing the cutting blade to cut into the object 11 while being kept rotating, the object 11 is cut.

[0018] The grinding device includes a processing unit (grinding unit) that grinds the object 11. The grinding unit includes a spindle, and an annular grinding wheel containing a plurality of grinding stones is attached to a distal end portion of the spindle. By bringing the grinding stones into contact with the object 11 while rotating them, the object 11 is ground.

[0019] The polishing device includes a processing unit (polishing unit) that polishes the object 11. The polishing unit includes a spindle, and a disc-shaped polishing pad is attached to a distal end portion of the spindle. By bringing the polishing pad into contact with the object 11 while rotating it, the object 11 is polished.

[0020] The laser processing device includes a processing unit (laser irradiation unit) that irradiates the object 11 with a laser beam. The laser irradiation unit includes, for example, a laser oscillator and a condenser that focuses the laser beam emitted by the laser oscillator. By converging the laser beam irradiated by the laser irradiation unit on or in the first surface 11a or the second surface 11b of the object 11, the object 11 is subjected to laser processing.

[0021] When the object 11 is processed by such a laser processing device as described above, dirt particles (processing residues) generated by the processing remain adhered to the object 11. Therefore, after the processing of the object 11 is completed, the object 11 is transferred to a rinsing device 2 and rinsed by the rinsing device 2. As a result, contaminants such as dirt particles adhering to the object 11 are rinsed away. Note that the rinsing device 2 may be attached to the processing device or installed independently of the processing device.

[0022] The rinsing device 2 includes a holding table (clamping table) 4 that holds the object 11, and a rinsing unit (rinsing mechanism) 14 that rinses the object 11. The holding table 4 has an upper surface that is a flat surface substantially parallel to the horizontal plane (XY plane) and forms a holding surface 4a on which the object 11 is held. The object 11 held on the holding surface 4a of the holding table 4 is rinsed by the rinsing unit 14.

[0023] The holding table 4 includes a cylindrical frame body (main body portion) 6 made of metal such as stainless steel (SUS), glass, ceramic, or plastic. A cylindrical recessed portion (recess) 6b is provided in a central portion on one side of an upper surface 6a of the frame body 6. Furthermore, a disc-shaped holding member 8 formed of a porous member made of porous ceramic is mounted in the recessed portion 6b. The holding member 8 has a number of pores (flow paths) therein, which communicate from an upper surface to a lower surface of the holding member 8.

[0024] The upper surface of the holding member 8 forms a circular suction surface 8a, which attracts the object 11. The recessed portion 6b has a depth substantially equal to the thickness of the holding member 8, so that the upper surface 6a of the frame body 6 and the suction surface 8a of the holding member 8 are arranged substantially in the same plane. The holding surface 4a of the holding table 4 is formed by the upper surface 6a of the frame body 6 and the suction surface 8a of the holding member 8. The holding surface 4a is connected to a suction source (not shown), such as an ejector, via the pores formed in the holding member 8, a flow channel 6c (see Fig. 2) formed by the frame body 6, a valve (not shown) and the like.

[0025] The frame body 6 is supported by a cylindrical support shaft 10. The support shaft 10 is arranged along the Z-axis direction, and the frame body 6 is fixed at a central portion on a lower surface side thereof to an upper end portion of the support shaft 10. In addition, a rotation drive source 12, such as a motor, which rotates the support shaft 10 is connected to a lower end side of the support shaft 10. When the rotation drive source 12 is driven, the support table 4 and the support shaft 10 are rotated about a rotation axis substantially parallel to the Z-axis direction.

[0026] The rinsing unit 14 is arranged to the side of the holding table 4. The rinsing unit 14 includes a cylindrical support shaft 16 arranged along the Z-axis direction. A rotation drive source 18, such as a motor, is connected to a proximal end portion (lower end portion) of the support shaft 16 to rotate the support shaft 16 about a rotation axis substantially parallel to the Z-axis direction. A cylindrical support arm 20 is attached to a distal end portion (upper end portion) of the support shaft 16. The support arm 20 is fixed to the support shaft 16 so as to extend substantially parallel to the XY plane. A rinsing nozzle 22 according to this embodiment is attached to a distal end portion of the support arm 20. The rinsing nozzle 22 rinses the object 11 by supplying a liquid while transmitting ultrasonic waves into the liquid.

[0027] When the rotation drive source 18 is actuated and the support shaft 16 is rotated, the rinsing nozzle 22 is caused to swing along the XY plane together with the support arm 20, centered around the rotation axis of the support shaft 16. This allows the rinsing nozzle 22 to be positioned at a position (feed position) where the rinsing nozzle 22 overlaps with the support surface 4a in the Z-axis direction, or at a position (retracted position) where the rinsing nozzle 22 does not overlap with the support surface 4a in the Z-axis direction. The rinsing nozzle 22 has a swing trajectory set, for example, to pass through a rotation axis of the support table 4.

[0028] Fig. Figure 2 is a partial cross-sectional front view schematically illustrating the rinsing device 2. The rinsing nozzle 22 rinses the object 11 by supplying a rinsing liquid (rinsing liquid) 24 to the object 11. For example, pure water is used as the liquid 24. Details of the configuration of the rinsing nozzle 22 will be described below.

[0029] The flushing nozzle 22 includes a housing (main body portion) 26 made of metal or the like. An internal space (accommodating portion) 26a is disposed inside the housing 26 to temporarily accommodate the liquid 24. For example, an upper portion of the internal space 26a is formed in a cylindrical shape, while a lower portion of the internal space 26a is formed in a tapered and truncated circular cone shape.

[0030] A supply port 26b is provided on a lower surface side of the housing 26 for supplying the liquid 24 from the inner space 26a toward the object 11. The supply port 26b corresponds to a circular area exposed on the lower surface side of the housing 26 and is connected to the inner space 26a. The liquid 24 contained in the inner space 26a can flow out of the supply port 26b at a predetermined flow rate.

[0031] A flow channel 26c is arranged on a side wall of the housing 26, through which the liquid 24 to be supplied to the rinsing nozzle 22 flows. One side of one end of the flow channel 26c is exposed on a side surface of the rinsing nozzle 22, while one side of the other end of the flow channel 26c is connected to the internal space 26a. However, there is no restriction on the position where the flow channel 26c is to be arranged.

[0032] The flushing nozzle 22 also includes a connecting portion 28 connected to a liquid supply source 30 that supplies the liquid 24. The connecting portion 28 consists of a conduit, such as a pipe or a hose, connected to the flow channel 26c of the flushing nozzle 22 and interconnecting the liquid supply source 30 and the internal space 26a via the flow channel 26c. Note that the connecting portion 28 may be provided with a valve or the like that adjusts the flow rate of the liquid 24 supplied to the flow channel 26c.

[0033] A vibration application unit (ultrasonic wave application unit) 32 is arranged in the inner space 26a of the rinsing nozzle 22. The vibration application unit 32 applies ultrasonic waves to the liquid 24 held in the inner space 26a, thereby applying ultrasonic vibrations (vibrations with a frequency belonging to the ultrasonic band) to the liquid 24. An ultrasonic generation unit 34 is connected to the vibration application unit 32 to control the application of the ultrasonic vibrations from the vibration application unit 32 to the liquid 24. The configuration and operation of the vibration application unit 32 and the ultrasonic generation unit 34 will be described later (see Fig. 3).

[0034] The rinsing device 2 also includes a control device (control unit, control section, control system) 36 that controls the rinsing device 2. The control device 36 is connected to individual elements (the support table 4, the rotary drive source 12, the rotary drive source 18, the rinsing nozzle 22, the liquid supply source 30, the vibration application unit 32, the ultrasonic generation unit 34, etc.) that constitute the rinsing device 2. The control device 36 enables the operation of the rinsing device 2 by outputting control signals to the individual elements of the rinsing device 2.

[0035] The control device 36 is formed, for example, by a computer. Specifically, the control device 36 includes a processing section that executes processing such as arithmetic processing required for the operation of the flushing device 2, and a storage section that stores various types of information (data, programs, etc.) to be used for the operation of the flushing device 2. The processing section is configured to include a processor such as a central processing unit (CPU). The storage section is configured to include a memory such as a read-only memory (ROM) and / or a random access memory (RAM). Note that when the flushing device 2 is attached to a processing device, a control device of the processing device may also have the functions of the control device 36.

[0036] When the object 11 is to be rinsed by the rinsing device 2, the object 11 is first held on the holding table 4. When the object 11 is rinsed on the first surface 11a side, for example, the object 11 is placed on the holding table 4 so that the first surface 11a side (the surface to be rinsed) is exposed upward and the second surface 11b side faces the holding surface 4a. When a suction force (negative pressure) of the suction source is caused to act on the holding surface 4a in this state, the object 11 is held under suction on the holding table 4. When the second surface 11b of the object 11 is rinsed, the object 11 is held on the holding table 4 so that, for example, the second surface 11b is exposed upward.

[0037] Next, the rotary drive source 18 is actuated to pivot the rinsing nozzle 22, and the rinsing nozzle 22 is positioned to overlap the object 11 in the Z-axis direction. While the holding table 4 is kept rotating by the operation of the rotary drive source 12, the liquid 24 is supplied from the supply port 26b of the rinsing nozzle 22 toward the object 11. As a result, the liquid 24 is supplied to the first surface 11a side of the object 11. At this time, the liquid 24 could be supplied to the object 11 while the rinsing nozzle 22 is reciprocally movable over the object 11.

[0038] The liquid 24 supplied to the object 11 spreads radially toward one side of an outer peripheral edge of the object 11 due to the centrifugal force acting on the rotating object 11. As a result, the liquid 24 flows along the first surface 11a of the object 11, so that contaminants such as dirt particles that adhere to the side of the first surface 11a of the object 11 during processing are washed away. The washing of the object 11 by the washing device 2 is performed in this way.

[0039] Note that when the liquid 24 is supplied from the rinsing nozzle 22 to the object 11, ultrasonic vibrations are applied to the liquid 24 by the vibration application unit 32. With the liquid 24 as a medium, the ultrasonic vibrations are then transmitted to the first surface 11a side of the object 11, causing the contaminants adhering to the first surface 11a side to vibrate. This facilitates the removal of contaminants firmly deposited on the object 11. Details of the vibration application unit 32 are described below.

[0040] Fig. 3 is a cross-sectional view illustrating the rinsing nozzle 22 with the vibration application unit 32 housed in the internal space 26a of the housing 26. The vibration application unit 32 includes a flat vibration plate 40 and a plurality of transducers 42 that apply ultrasonic vibrations to the vibration plate 40.

[0041] The vibration plate 40 is, for example, a plate-shaped member made of metal such as SUS and has a flat first surface (upper surface) 40a and a flat second surface (lower surface) 40b that are substantially parallel to each other. The vibration plate 40 is arranged in a region of the inner space 26a, the region being located above the flow channel 26c, so that it faces the supply opening 26b.

[0042] An annular support member 44 is arranged on the housing 26. The annular support member 44 is formed, for example, along a side wall of the inner space 26a. The support member 44 is arranged to protrude from the side wall of the inner space 26a toward a center of the inner space 26a and has an inner diameter smaller than a diameter of the vibrating plate 40. The vibrating plate 40 is arranged on the support member 44, such that the first surface 40a faces upward and the second surface 40b faces downward. Thus, the vibrating plate 40 is supported at an outer peripheral portion thereof by the support member 44. Further, the first surface 40a and the second surface 40b are arranged substantially parallel to the supply opening 26b, and the second surface 40b faces the supply opening 26b.

[0043] The transducers 42 are connected to one side of the first surface 40a of the vibrating plate 40. Each transducer 42 is, for example, a piezoelectric element that vibrates when a voltage is applied. This piezoelectric element is configured to include a piezoelectric ceramic, such as lead zirconate titanate (PZT), and electrodes through which the voltage is applied to the piezoelectric ceramic. The transducers 42 are arranged such that their distances from the center of the vibrating plate 40 are different.

[0044] The transducers 42 are all connected to the ultrasonic generating unit 34. The ultrasonic generating unit 34 generates ultrasonic waves and supplies the transducers 42 with high-frequency energy. Consequently, the transducers 42 each vibrate at a frequency (20 kHz or higher) belonging to the ultrasonic band. Note that the high-frequency power to be delivered from the ultrasonic generating unit 34 to the transducers 42 could be determined by controlling the ultrasonic generating unit 34 through the controller 36, or could be determined autonomously by the ultrasonic generating unit 34.

[0045] When the liquid 24 from the liquid supply source 30 (see Fig. 2) via the connecting section 28 (see Fig. 2) and the flow channel 26c into the inner space 26a and the inner space 26a is filled with the liquid 24, the liquid 24 comes into contact with the vibrating plate 40. In this state, when high-frequency energy is supplied from the ultrasonic generating unit 34 to the transducers 42, the transducers 42 vibrate at the frequency belonging to the ultrasonic band, and the ultrasonic vibrations emitted from the transducers 42 all propagate to the vibrating plate 40 and reach the liquid 24. As a result, ultrasonic waves are applied to the liquid 24 and can propagate in the liquid 24, so that ultrasonic vibrations are applied to the liquid 24.

[0046] In the rinsing nozzle 22 according to this embodiment, the flat vibration plate 40 is used, and the flat second surface 40b comes into contact with the liquid 24. Compared with the case where a vibration plate formed into a dome-shaped, depressed spherical shape is used, air is less likely to remain between the vibration plate 40 and the liquid 24, thereby preventing the air layer from inhibiting the transmission of ultrasonic vibrations from the vibration plate 40 to the liquid 24. In addition, the rinsing nozzle 22 according to this embodiment is configured to control the propagation of ultrasonic vibrations to be applied from the vibration plate 40 to the liquid 24 by controlling the phased array of the transducers 42.Despite the flat shape of the vibration plate 40, the ultrasonic waves can efficiently reach the object 11 using the liquid as a medium, thereby facilitating the removal of contaminants adhering to the object 11.

[0047] Fig. Figure 4 is a schematic diagram showing how ultrasonic waves propagate in the liquid 24. Fig. Figure 4 schematically shows the liquid 24 contained in the inner space 26a of the housing 26, the vibrating plate 40 and the transducers 42. Fig. 4 also shows a reference line 50 extending through the center of the inner space 26a. The reference line 50 is a hypothetical straight line perpendicular to the feed opening 26b and passing through a center of the feed opening 26b and the center of the vibrating plate 40.

[0048] When high-frequency power is supplied from the ultrasonic generating unit 34 to the transducers 42, the transducers 42 vibrate and impart ultrasonic vibrations to the vibrating plate 40. The ultrasonic vibrations then propagate to the liquid 24 via the vibrating plate 40, and a plurality of ultrasonic waves 52 are imparted from the vibrating plate 40 to the liquid 24.

[0049] Here, the ultrasonic generation unit 34 controls the propagation of ultrasonic waves in the liquid 24 by phased array control of the transducers 42. The term "phased array control" refers to a means for independently adjusting the propagation directions, convergence positions, and the like of ultrasonic waves by controlling the phases of the ultrasonic vibrations generated by the transducers 42. The ultrasonic generation unit 34 supplies high-frequency power, for example, to the transducers 42, so that the ultrasonic vibrations to be emitted by each transducer 42 are more phase-delayed the closer the transducer 42 is to the center of the vibrating plate 40 (the reference line 50). The ultrasonic wave 52 generated at a position closer to the center of the vibrating plate 40 is therefore phase-delayed.The individual ultrasonic waves 52 generated by the respective transducers 42 are then combined to produce an ultrasonic wave (the resultant wave) 54, which converges as it propagates within the liquid 24 toward the feed opening 26b. These ultrasonic waves 54 propagate using the liquid 24 as a medium, thereby imparting ultrasonic vibrations to the liquid 24.

[0050] When the transducers 42 are controlled as described above, the ultrasonic waves 54 propagating in the liquid 24 converge on the reference line 50. The ultrasonic waves 54 converge, for example, at a convergence position (focal point) 56 located in or near the feed opening 26b. As a result, it is easier for the ultrasonic vibrations that have passed through the feed opening 26b to reach the object 11 (see Fig. 2) while maintaining high intensity.

[0051] The convergence position 56 of the ultrasonic waves 54 can be adjusted accordingly by controlling the phase shifts of the ultrasonic vibrations emitted by the transducers 42. For example, the phase shifts of the ultrasonic vibrations to be emitted by the transducers 42 could be adjusted as shown in Fig. 4 so that the ultrasonic waves 54 converge at the convergence position 56 located on an outer side of the feed opening 26b (on a side closer to the object 11 than the feed opening 26b).

[0052] This allows the ultrasonic waves 54 to be converged at the location closer to the object 11, thereby facilitating the application of high-intensity ultrasonic vibrations to contaminants adhering to the object 11.

[0053] With reference to the Fig. Next, a description will be given of examples of controlling the propagation of ultrasonic waves by phased-field control, referring to FIGS. 5A to 5D. Here, the sound pressure of ultrasonic waves propagating in a liquid will be described when phased-field control is performed with the five transducers 42 arranged on the vibrating plate 40.

[0054] The Fig. 5A to 5D show, by way of example, the contour figures 60A to 60D of the sound pressure [MPa] of the ultrasonic waves propagating in the liquid when four different types of control were performed according to a phased field. In each of the contour figures 60A to 60D, the maximum value (positive value) of the sound pressure of the ultrasonic waves is shown in white, while the minimum value (negative value) of the sound pressure of the ultrasonic waves is shown in black. In each of the Fig. 5A to 5D, the numerical value attached to each transducer 42 represents a phase shift (phase delay) of the corresponding ultrasonic waves of 0° as a reference. Further, a reference line 62 is a hypothetical straight line perpendicular to the vibration plate 40 and passing through the center of the vibration plate 40 and corresponding to the reference line 50 (see Fig. 4). The contour figures 60B to 60D ( Fig. 5B to 5D) represent the sound pressures of ultrasonic waves when the control of the phased array was performed such that the ultrasonic vibrations are delayed more when the transducers 42 are arranged closer to the reference line 62.

[0055] Fig. 5A is contour figure 60A, which represents the sound pressure of ultrasonic waves generated by controlling a phased field with a phase shift set to 0°. When there is no phase shift between the ultrasonic vibrations emitted by the transducers 42, the ultrasonic wave (resultant wave) propagates along the reference line 62 in the liquid, but does not converge on the reference line 62. Therefore, the sound pressure of the ultrasonic wave is unlikely to increase or decrease on the reference line 62, so the intensity of the ultrasonic wave propagating in the liquid is low.

[0056] Fig. Figure 5B is the contour figure 60B, which represents the sound pressure of ultrasonic waves generated by controlling according to a phased field with a phase shift set at 45°. Furthermore, Fig. 5C shows the contour figure 60C, which shows the sound pressure of ultrasonic waves generated by a phased field control with a phase shift of 90°. When the phase shift of the ultrasonic vibrations to be emitted by the transducers 42 is set to 45° or 90°, the ultrasonic wave (resultant wave) converges on or near the reference line 62. As a result, the sound pressure on or near the reference line 62 increases or decreases significantly to assume a maximum or minimum value, so that the ultrasonic wave propagates in the liquid while maintaining a high intensity.

[0057] Fig. 5D is the contour figure 60D, which represents the sound pressure of ultrasonic waves generated by phased field control with a phase shift of 135°. The ultrasonic wave (resultant wave) also converges on or near the reference line 62 when the phase shift of the ultrasonic vibrations to be emitted by the transducers 42 is set to 135°. However, compared to the case where the phase shift is 45° or 90°, the ultrasonic wave converges at a position closer to the vibrating plate 40, so the intensity of the ultrasonic wave becomes weak at positions away from the vibrating plate 40.

[0058] By the propagation direction, the convergence position and the like of the ultrasonic waves 54 in the liquid 24, which are controlled by the control of a control according to a phased field as described above (see Fig. 4), it is easier for the ultrasonic waves 54 to reach the object 11 via the feed opening 26b, so that ultrasonic vibrations can be efficiently applied to the object 11. It should be noted that the case where the ultrasonic waves 54 propagate along the reference line 50 and converge at the convergence position 56 on the reference line 50, with reference to Fig. 4, but the propagation control of the ultrasonic waves 54 is not limited to such propagation control. For example, the propagation direction of the ultrasonic waves 54 could be inclined with respect to the reference line 50. Furthermore, the convergence position 56 of the ultrasonic waves 54 can also be determined according to the distance between the object 11 and the rinsing nozzle 22.

[0059] Next, specific examples of the arrangement of the transducers 42 are described. The Fig. The vibration application units 32A, 32B and 32C shown in Figures 6A to 6C each correspond to specific examples of the vibration application unit 32 and each comprise a plate-shaped vibration plate 40. It should be noted that in each of the Fig. 6A and Fig. 6B, a pattern is applied to a first surface 40a of the vibrating plate 40 to clarify the distinction between the vibrating plate 40 and other elements.

[0060] Fig. 6A is a plan view illustrating the vibration application unit 32A. The vibration application unit 32A includes annular dividing members 70A, 70B, and 70C disposed on one side of the first surface 40a of the vibrating plate 40. The annular dividing members 70A, 70B, and 70C are annular members made of the same or a different material as the vibrating plate 40 and arranged to protrude upward from the first surface 40a of the vibrating plate 40. The dividing member 70B has an inner diameter larger than an outer diameter of the dividing member 70A, and the dividing member 70C has an inner diameter larger than an outer diameter of the dividing member 70B. Furthermore, the dividing devices 70A, 70B and 70C are arranged concentrically so that their centers overlap with a center of the vibration plate 40.In addition, the dividing device 70C is arranged along an outer peripheral edge of the vibration plate 40.

[0061] The vibrating plate 40 is divided by the dividing means 70A, 70B, and 70C into regions 80A, 80B, and 80C. The region 80A corresponds to a circular region within the dividing means 70A and includes the center of the vibrating plate 40. The region 80B corresponds to an annular region between the dividing means 70A and the dividing means 70B. The region 80C corresponds to an annular region between the dividing means 70B and the dividing means 70C. Therefore, the regions 80A, 80B, and 80C correspond to a plurality of regions of similar type and different distances from the center of the vibrating plate 40, and in the regions 80A, 80B, and 80C, the first surface 40a of the vibrating plate 40 is exposed.

[0062] The vibration application unit 32A further includes a plurality of transducers 42A, a plurality of transducers 42B, and a plurality of transducers 42C. The transducers 42A, 42B, and 42C are all connected to the first surface 40a side of the vibration plate 40. It should be noted that the transducers 42A, 42B, and 42C are similar in design, function, and the like to the above-mentioned transducers 42 (see Fig. 3, etc.). Transducers 42A are arranged in region 80A, transducers 42B are arranged in region 80B, and transducers 42C are arranged in region 80C. Transducers 42A, 42B, and 42C are therefore arranged such that their distances from the center of vibrating plate 40 differ from each other in any common radial direction.

[0063] It should be noted that there are no restrictions on the number and arrangement of the transducers 42A, 42B, or 42C in each of the regions 80A, 80B, and 80C. For example, as shown in Fig. 6A, a first group of transducers 42A having an equal distance from the center of the vibrating plate 40 and a second group of transducers 42A having a distance equal to each other from the center of the vibrating plate 40, but different from that of the first group of transducers 42A, could be mixed in the region 80A. Furthermore, a first group of transducers 42B having an equal distance from the center of the vibrating plate 40 and a second group of transducers 42B having a distance equal to each other from the center of the vibrating plate 40, but different from that of the first group of transducers 42B, could be mixed in the region 80B.Furthermore, a first group of transducers 42C having an equal distance from the center of the vibrating plate 40 and a second group of transducers 42C having a distance equal to each other from the center of the vibrating plate 40, but different from the first group of transducers 42C, could be mixed in the area 80C.

[0064] The transducers 42A, 42B and 42C are connected to the ultrasonic generating unit 34 (see Fig. 2, etc.). When the transducers 42A, 42B, and 42C are supplied with high-frequency power from the ultrasonic generating unit 34, the transducers 42A, 42B, and 42C apply ultrasonic vibrations to the regions 80A, 80B, and 80C, respectively, of the vibrating plate 40. When the control is performed according to a phased field of the transducers 42A, 42B, and 42C, the high-frequency power to be supplied from the ultrasonic generating unit 34 to the transducers 42A, 42B, and 42C is controlled so that phase shifts occur in the ultrasonic vibrations to be emitted by the transducers 42A, 42B, and 42C. Additionally, a phase shift could be caused to occur in ultrasonic vibrations between the first group and the second group of transducers 42A, between the first group and the second group of transducers 42B, and / or between the first group and the second group of transducers 42C.

[0065] Fig. 6B is a plan view illustrating the vibration application unit 32B. Unlike the vibration application unit 32A (see FIG. 6A), no annular dividing device is disposed on the vibration plate 40 of the vibration application unit 32B. However, the vibration plate 40 of the vibration application unit 32B is divided into regions 80A, 80B, and 80C by annular boundaries 72A and 72B. The boundaries 72A and 72B correspond to hypothetical dividing lines dividing the vibration plate 40. The boundary 72A has a smaller diameter than the boundary 72B, and the boundaries 72A and 72B are concentrically arranged so that their centers overlap with a center of the vibration plate 40. The region 80A corresponds to a circular region within the boundary 72A and includes the center of the vibration plate 40. The region 80B corresponds to an annular region between the boundary 72A and the boundary 72B.The region 80C corresponds to an annular region outside the boundary 72B and has an outer peripheral edge of the vibration plate 40.

[0066] The vibration application unit 32B further includes a plurality of transducers 42A, a plurality of transducers 42B, and a plurality of transducers 42C. The transducers 42A, 42B, and 42C are arranged in a grid pattern and connected to one side of a first surface 40a of the vibration plate 40. Specifically, the transducers 42A, 42B, and 42C are arranged at predetermined intervals along two mutually perpendicular directions (the top-down direction and the left-right direction in Fig. 6B). It should be noted that in Fig. 6B shows an example in which the converters 42A, 42B and 42C are arranged in 14 rows × 14 columns, wherein the number of rows and the number of columns of the converters 42A, 42B and 42C are not limited.

[0067] Transducers 42A are arranged in region 80A, transducers 42B are arranged in region 80B, and transducers 42C are arranged in region 80C. Transducers 42A, 42B, and 42C are therefore arranged such that their distances from the center of vibrating plate 40 differ from each other in any common radial direction. Note that in Figure 6B, the transducers arranged at boundary 72A could be considered transducers 42A or transducers 42B. Note also that the transducers arranged at boundary 72B could be considered transducers 42B or transducers 42C.

[0068] The transducers 42A, 42B and 42C are all connected to the ultrasonic generating unit 34 (see Fig. 2, etc.). When the transducers 42A, 42B, and 42C are supplied with high-frequency power from the ultrasonic generating unit 34, the transducers 42A, 42B, and 42C apply ultrasonic vibrations in the ranges 80A, 80B, and 80C, respectively. When the control is performed according to a phased field of the transducers 42A, 42B, and 42C, the high-frequency power to be supplied from the ultrasonic generating unit 34 to the transducers 42A, 42B, and 42C is controlled so that phase shifts occur in the ultrasonic vibrations to be emitted by the transducers 42A, 42B, and 42C. In addition, a phase shift in ultrasonic vibrations could be induced between the transducers 42A with different distances from the center of the vibrating plate 40, between the transducers 42B with different distances from the center of the vibrating plate 40 and / or between the transducers 42C with different distances from the center of the vibrating plate 40.

[0069] Fig. 6C is a plan view illustrating the vibration application unit 32C. Similar to the vibration application unit 32A (see Fig. 6A), the vibration application unit 32C includes annular dividing devices 70A, 70B, and 70C disposed on one side of a first surface 40a of a vibrating plate 40. The vibrating plate 40 of the vibration application unit 32C is divided into regions 80A, 80B, and 80C by the dividing devices 70A, 70B, and 70C.

[0070] Furthermore, the vibration application unit 32C includes a transducer 42A', a transducer 42B', and a transducer 42C'. The transducers 42A', 42B', and 42C' are similar in design, function, and the like to the above-mentioned transducers 42 (see Fig. 3 etc.). However, the converters 42A', 42B' and 42C' differ in their shape from those shown in the Fig. 6A and Fig. 6B. Specifically, the transducer 42A' is formed in a circular shape corresponding to the region 80A and is connected to the region 80A. Further, the transducer 42B' is formed in an annular shape corresponding to the region 80B and is connected to the region 80B. Moreover, the transducer 42C' is formed in an annular shape corresponding to the region 80C and is connected to the region 80C. Therefore, the transducer 42A' is arranged within the dividing device 70A, the transducer 42B' is arranged between the dividing device 70A and the dividing device 70B, and the transducer 42C' is arranged between the dividing device 70B and the dividing device 70C.

[0071] When the transducers 42A', 42B', and 42C' are connected to the vibrating plate 40 as described above, the transducers 42A', 42B', and 42C' are arranged concentrically so that their centers overlap with a center of the vibrating plate 40. The transducers 42A', 42B', and 42C' are also arranged so that their distances from the center of the vibrating plate 40 are different.

[0072] Note that in the vibration application unit 32C, the first surface 40a of the vibration plate 40 is covered by the transducers 42A', 42B', and 42C' and the dividing devices 70A, 70B, and 70C. Thus, the first surface 40a of the vibration plate 40 is not exposed. However, there may be gaps between the transducers 42A', 42B', and 42C' and the dividing devices 70A, 70B, and 70C. Furthermore, the dividing devices 70A, 70B, and 70C may be omitted from the vibration application unit 32C.

[0073] The transducers 42A', 42B' and 42C' are connected to the ultrasound generating unit 34 (see Fig. 2, etc.). When the high-frequency power is supplied from the ultrasonic generating unit 34 to the transducers 42A', 42B', and 42C', the transducers 42A', 42B', and 42C' apply ultrasonic vibrations to the regions 80A, 80B, and 80C, respectively, of the vibrating plate 40. When the control is performed according to a phased field of the transducers 42A', 42B', and 42C', the high-frequency power to be supplied from the ultrasonic generating unit 34 to the transducers 42A', 42B', and 42C' is controlled so that phase shifts occur in the ultrasonic vibrations to be emitted by the transducers 42A', 42B', and 42C'.

[0074] By connecting the transducers to a plurality of regions at different distances from the center of the vibrating plate 40, as described above, the vibration application unit 32 is configured to enable control according to a phased field. Note that the examples in which the vibrating plate 40 is divided into three regions (regions 80A, 80B, and 80C) are described with reference to FIG. Fig. 6A to 6C, however, the vibrating plate 40 could be divided into four or more regions at different distances from the center of the vibrating plate 40. If this is the case, the transducers are connected to each of the regions.

[0075] As described above, the rinsing nozzle 22 according to this embodiment is configured to control the propagation of ultrasonic waves to be applied to the liquid 24 by the planar vibration plate 40 by controlling the phased array of the transducers 42. Due to this configuration, ultrasonic waves can efficiently propagate through the liquid 24 to the object 11. In the above-described embodiment, the case where the vibration application unit 32 includes the plate-shaped vibration plate 40 is described. However, the vibration plate 40 may be composed of multiple independent vibration plates. For example, the vibration plate 40 may include a disc-shaped first vibration plate corresponding to the region 80A, an annular second vibration plate corresponding to the region 80B, and an annular third vibration plate corresponding to the region 80C. In this case, the first vibration plate, the second vibration plate, and the third vibration plate may be arranged separately from each other.

[0076] Furthermore, the structure, method and the like according to the embodiment described above can be carried out with changes or modifications as long as this does not deviate from the subject matter of the present invention.

[0077] The present invention is not limited to the details of the preferred embodiment described above. The scope of the invention is defined by the appended claims, and all changes and modifications that fall within the equivalent scope of the claims are therefore included in the invention. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2022-28313

[0005]

Claims

[1] A rinsing nozzle for rinsing an object by supplying liquid to the object while transmitting ultrasonic waves to the liquid, comprising: a housing having an inner space holding the liquid therein, a supply port supplying the liquid from the inner space toward the object, and a connecting portion connecting a liquid supply source supplying the liquid and the inner space; a flat vibrating plate arranged in the inner space so as to face the feed opening; and several transducers that apply ultrasonic waves to the vibration plate, wherein a propagation of ultrasonic waves to be applied from the vibration plate to the liquid can be controlled by controlling the transducers according to a phased array control. [2] The rinsing nozzle according to claim 1, wherein the rinsing nozzle is configured to allow the ultrasonic waves applied to the liquid by the vibration plate to converge on a straight line perpendicular to the supply opening and passing through a center of the supply opening. [3] Flushing nozzle according to claim 1 or 2, wherein the transducers are arranged in a grid pattern. [4] Flushing nozzle according to claim 1 or 2, wherein the transducers are formed in a circular or annular shape and arranged concentrically.

Images