Manipulator for adjusting an optical element

Abstract

A manipulator (134) for adjusting an optical element (102) comprises a magnetic assembly (142) that can be coupled to the optical element (102), a coil assembly (152) that can be linearly displaced by means of the magnetic assembly (142) in order to adjust the optical element (102), a manipulator housing (140) to which the coil assembly (152) is connected and which serves to dissipate heat from the coil assembly (152), and a ground element (166). The coil assembly (152) is connected to the ground element (166) via a connecting section (168).

Description

[0001] The invention relates to a manipulator for adjusting an optical element with a magnet assembly that can be coupled to the optical element and with a coil assembly that can be linearly displaced by means of the magnet assembly in order to adjust the optical element.

[0002] The invention further relates to an optical system for a semiconductor technology system, a semiconductor technology system and an electronic component.

[0003] In the state of the art, semiconductor technology systems refer to systems used to manufacture or test microstructured devices or the components required for them. An example of such a system is a projection exposure system for photolithography.

[0004] Photolithography is used to manufacture microstructured components, such as integrated circuits. The projection exposure system used in this process comprises an illumination system and a projection system. The image of a mask (also called a reticle) illuminated by the illumination system is projected in a reduced size onto a substrate coated with a light-sensitive layer and arranged in the image plane of the projection system, for example, a silicon wafer, by means of the projection system. This transfers the mask structure to a light-sensitive coating on the substrate.

[0005] DE 10 2022 211 799 A1 discloses a manipulator for adjusting an optical element, comprising a manipulator housing, a magnet assembly, and a coil assembly. The coil assembly has a replaceable mass element with which the natural frequency of the manipulator can be adjusted. The manipulator, which operates according to the electromotive principle, i.e., with the Lorentz force, is capable of adjusting the optical element with extremely high precision. The coil assembly used to actuate the magnet assembly heats up with increasing force, which places very high demands on heat dissipation.

[0006] A further problem with the known solution may be that the individual components of the manipulator cannot be replaced in the event of defects in individual components or individual parts of the components, and instead a complete replacement of the manipulator is required.

[0007] It is an object of the present invention to provide a manipulator for adjusting an optical element that ensures improved heat dissipation and more reliable, consistent dynamic behavior.

[0008] According to the invention, this object is achieved by the features mentioned in claim 1.

[0009] The manipulator according to the invention for adjusting an optical element accordingly comprises a magnet assembly that can be coupled to the optical element, a coil assembly that can be linearly displaced by means of the magnet assembly for adjusting the optical element, a manipulator housing to which the coil assembly is connected and which serves to dissipate heat from the coil assembly, and a mass element that sets the desired dynamic behavior and causes a phase shift. The coil assembly is connected to the mass element via a connecting section.

[0010] The mass element is therefore not directly connected to the coil assembly, but only indirectly via the connecting section, thus preventing mutual interference between these two components. Rather, the mass element can perform its intended task, namely setting the desired dynamics, while the manipulator housing dissipates the heat generated in the coil assembly.

[0011] In a very advantageous development of the invention, the manipulator housing can be provided with the connecting section for connecting the coil assembly to the mass element. Integrating the connecting section for connecting the coil assembly to the mass element into the manipulator housing not only results in a very simple design but also ensures very reliable dissipation of the heat generated in the coil assembly into the manipulator housing.

[0012] In a further very advantageous embodiment of the invention, the coil assembly can be detachably connected to the connecting section. This allows the coil assembly to be very easily removed from the connecting section, allowing, for example, a defect in the coil assembly to be easily replaced. This not only saves costs but also enables faster repairs. Furthermore, this design eliminates the need for previously used adhesive joints, making the entire manipulator more thermally reliable.

[0013] A very simple design for the detachable connection of the coil assembly to the connecting section is achieved by connecting the coil assembly to the connecting section using screws. However, other connecting elements are also conceivable.

[0014] Furthermore, it can be provided that the coil assembly is accommodated in the connecting section via a fit. This results in a very precise connection between the coil assembly and the connecting section.

[0015] In a further advantageous embodiment of the invention, the ground element can be detachably connected to the connecting section. This allows the ground element, similar to the coil assembly, to be very easily removed from the connecting section in the event of a defect and replaced with another ground element.

[0016] In this context, the grounding element can be connected to the connecting section by means of screws. This allows for very simple attachment and removal of the grounding element from the connecting section. Other connecting elements are also conceivable here.

[0017] A further very advantageous embodiment of the invention can consist in the mass element having a first component connected to the manipulator housing and a second component connected to the first component connected to the manipulator housing. In this way, the mass of the mass element, which significantly influences the dynamic behavior, can be very easily adapted to the respective requirements.

[0018] Claim 9 specifies an optical system for a system for semiconductor technology with an optical element and with a manipulator according to the invention, in which the magnet assembly is coupled to the optical element.

[0019] Such an optical system may, for example, contain a mirror as an optical element, which is adjusted by means of the manipulator.

[0020] A system for semiconductor technology with at least one manipulator according to the invention and / or one optical system according to the invention is specified in claim 10.

[0021] In the context of the present invention, "system for semiconductor technology" refers to any system that can be used to manufacture or inspect microstructured devices or the components required for them. In addition to projection exposure systems for photolithography, this also includes, in particular, inspection systems, especially for masks or wafers, as well as metrology systems with which masks, wafers, or other optical elements, such as mirrors, can be measured. Increased variability in illumination can improve measurement results.

[0022] Claim 11 specifies an electronic component produced with the aid of such a semiconductor technology system, which preferably has structures in the micro- and / or nanometer range.

[0023] Features described in connection with one of the subject matters of the invention, specifically the method according to the invention, the device according to the invention, or the EUV projection exposure system according to the invention, can also be advantageously implemented for the other subject matters of the invention. Likewise, advantages mentioned in connection with one of the subject matters of the invention can also be understood to relate to the other subject matters of the invention.

[0024] It should also be noted that terms such as "comprising," "having," or "with" do not exclude other features or steps. Furthermore, terms such as "a" or "the," which refer to a singular number of steps or features, do not exclude a plurality of features or steps—and vice versa.

[0025] In a purist embodiment of the invention, however, it may also be provided that the features introduced in the invention with the terms "comprising," "having," or "with" are listed exhaustively. Accordingly, one or more lists of features may be considered complete within the scope of the invention, for example, for each claim. The invention may, for example, consist exclusively of the features mentioned in claim 1.

[0026] In the following, embodiments of the invention are described in more detail with reference to the drawing.

[0027] The figures each show preferred embodiments in which individual features of the present invention are illustrated in combination with one another. Features of one embodiment can also be implemented independently of the other features of the same embodiment and can therefore be readily combined by a person skilled in the art with features of other embodiments to form further useful combinations and subcombinations.

[0028] They show: Fig. 1 a schematic meridional section of a projection exposure system for EUV projection lithography; Fig. 2 a schematic view of an embodiment of an optical system for the projection exposure apparatus according to Fig. 1; Fig. 3 a schematic plan view of the optical system according to Fig. 2; and Fig. 4 a schematic sectional view of a manipulator for the optical system according to Fig. 2.

[0029] In the figures, identical or functionally equivalent elements are provided with the same reference numerals unless otherwise indicated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

[0030] Fig. 1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the illumination system 2 does not include the light source 3.

[0031] A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.

[0032] In Fig. For illustrative purposes, Figure 1 shows a Cartesian coordinate system with an x-direction x, a y-direction y, and a z-direction z. The x-direction x runs perpendicular to the plane of the drawing. The y-direction y runs horizontally, and the z-direction z runs vertically. The scanning direction runs in Fig. 1 along the y-direction y. The z-direction z runs perpendicular to the object plane 6.

[0033] The projection exposure system 1 comprises a projection optics 10. The projection optics 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0034] A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the image plane 12 in the region of the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced, in particular along the y-direction y, via a wafer displacement drive 15. The displacement of the reticle 7, on the one hand, via the reticle displacement drive 9, and the displacement of the wafer 13, on the other hand, via the wafer displacement drive 15, can be synchronized with each other.

[0035] The light source 3 is an EUV radiation source. The light source 3 emits, in particular, EUV radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The useful radiation 16 has, in particular, a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example, an LPP source (Laser Produced Plasma) or a DPP source (Gas Discharged Produced Plasma). It can also be a synchrotron-based radiation source. The light source 3 can be a free-electron laser (FEL).

[0036] The illumination radiation 16 emanating from the light source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 at grazing incidence (GI), i.e., at angles of incidence greater than 45°, or at normal incidence (NI), i.e., at angles of incidence less than 45°. The collector 17 can be structured and / or coated, on the one hand, to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.

[0037] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4.

[0038] The illumination optics 4 comprises a deflecting mirror 19 and, downstream of this in the beam path, a first facet mirror 20. The deflecting mirror 19 can be a flat deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first facet mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugated to the object plane 6 as the field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Of these first facets 21, Fig. 1 shows some examples.

[0039] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour. The first facets 21 can be designed as flat facets or, alternatively, as convexly or concavely curved facets.

[0040] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 themselves can also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can, in particular, be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0041] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction y.

[0042] In the beam path of the illumination optics 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US Pat. No. 6,573,978.

[0043] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0044] The second facets 23 can also be macroscopic facets, which can, for example, be round, rectangular, or hexagonal, or alternatively facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0045] The second facets 23 can have planar or alternatively convex or concave curved reflection surfaces.

[0046] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a fly's-eye integrator.

[0047] It may be advantageous to arrange the second facet mirror 22 not exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0048] With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path before the object field 5.

[0049] In a further embodiment of the illumination optics 4 (not shown), a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which transmission optics contributes in particular to the imaging of the first facets 21 into the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optics can in particular comprise one or two mirrors for normal incidence (NI mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors).

[0050] The illumination optics 4 has in the version shown in Fig. 1, after the collector 17 there are exactly three mirrors, namely the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.

[0051] In a further embodiment of the illumination optics 4, the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

[0052] The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics into the object plane 6 is usually only an approximate imaging.

[0053] The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0054] In the Fig. In the example shown in Figure 1, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or a different number of mirrors M1 are also possible. The projection optics 10 is a doubly obscured optic. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0055] Reflection surfaces of the mirrors Mi can be designed as freeform surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0056] The projection optics 10 has a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0057] The projection optics 10 can, in particular, be anamorphic. It has, in particular, different magnifications βx, By in the x and y directions x, y. The two magnifications βx, By of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive magnification β means imaging without image inversion. A negative sign for the magnification β means imaging with image inversion.

[0058] The projection optics 10 thus leads to a reduction in the ratio 4:1 in the x-direction x, i.e. in the direction perpendicular to the scanning direction.

[0059] The projection optics 10 leads to a reduction of 8:1 in the y-direction y, i.e. in the scanning direction.

[0060] Other magnifications are also possible. Magnifications with the same sign and absolutely identical in the x and y directions (x, y), for example, with absolute values ​​of 0.125 or 0.25, are also possible.

[0061] The number of intermediate image planes in the x- and y-directions x, y in the beam path between the object field 5 and the image field 11 can be the same or can be different, depending on the design of the projection optics 10. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions x, y are known from US 2018 / 0074303 A1.

[0062] Each of the second facets 23 is assigned to exactly one of the first facets 21 to form a respective illumination channel for illuminating the object field 5. This can, in particular, result in illumination according to the Köhler principle. The far field is divided into a plurality of object fields 5 using the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them.

[0063] The first facets 21 are each imaged onto the reticle 7 by an associated second facet 23, superimposed on one another, to illuminate the object field 5. The illumination of the object field 5 is, in particular, as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0064] By arranging the second facets 23, the illumination of the entrance pupil of the projection optics 10 can be geometrically defined. By selecting the illumination channels, in particular the subset of the second facets 23 that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting or illumination pupil fill.

[0065] A likewise preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels.

[0066] Further aspects and details of the illumination of the object field 5 and in particular of the entrance pupil of the projection optics 10 are described below.

[0067] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0068] The entrance pupil of the projection optics 10 cannot usually be precisely illuminated with the second facet mirror 22. When imaging the projection optics 10, which images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the pairwise determined distance of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in spatial space. In particular, this surface exhibits a finite curvature.

[0069] The projection optics 10 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. This optical element can be used to account for the different positions of the tangential entrance pupil and the sagittal entrance pupil.

[0070] At the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the second facet mirror 22 is arranged in a surface conjugate to the entrance pupil of the projection optics 10. The first facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the deflection mirror 19. The first facet mirror 20 is arranged tilted relative to an arrangement plane defined by the second facet mirror 22.

[0071] Fig. 2 shows a schematic view of an embodiment of an optical system 100 for the projection exposure apparatus 1. Fig. 3 shows a schematic plan view of the optical system 100. The following refers to the Fig. 2 and Fig. 3 simultaneously referred to.

[0072] The optical system 100 can be a projection optics unit 4 as explained above or part of such a projection optics unit 4. Therefore, the optical system 100 can also be referred to as a projection optics unit. However, the optical system 100 can also be an illumination system 2 as explained above or part of such an illumination system 2. Therefore, the optical system 100 can alternatively also be referred to as an illumination system. However, it is assumed below that the optical system 100 is a projection optics unit 4 or part of such a projection optics unit 4. The optical system 100 is suitable for EUV lithography. However, the optical system 100 can also be suitable for DUV lithography.

[0073] The optical system 100 may comprise a plurality of optical elements 102, of which Fig. 2 and Fig. 3, however, only one is shown. Therefore, only one optical element 102 will be discussed below. The optical element 102 can be one of the mirrors M1 to M6. The optical element 102 comprises a substrate 104 and an optically effective surface 106, for example, a mirror surface. The substrate 104 can also be referred to as a mirror substrate. The substrate 104 can comprise glass, ceramic, glass-ceramic, or other suitable materials.

[0074] The optically effective surface 106 is provided on a front side 108 of the substrate 104. The optically effective surface 106 can be realized by means of a coating applied to the front side 108. The optically effective surface 106 is a mirror surface. The optically effective surface 106 is suitable for reflecting illumination radiation 16, in particular EUV radiation, during operation of the optical system 100. The optically effective surface 106 can be shown in plan view according to Fig. 3 may have an oval or elliptical geometry. The optical element 102 or the substrate 104 may have a triangular geometry. In principle, however, the geometry is arbitrary.

[0075] Facing away from the optically effective surface 106 or the front side 108, the optical element 102 has a rear side 110. The rear side 110 has no defined optical properties. This means, in particular, that the rear side 110 is not a mirror surface and therefore does not have any reflective properties.

[0076] On the rear side 110, a plurality of mirror bushings 112, 114, 116 are provided. A first mirror bushing 112, a second mirror bushing 114, and a third mirror bushing 116 are provided. In other words, the optical element 102 comprises exactly three mirror bushings 112, 114, 116. The mirror bushings 112, 114, 116 can be geometrically identical. The mirror bushings 112, 114, 116 are cylindrical and extend in the orientation of the Fig. 2 protrudes from the underside of the rear panel 110. The mirror sockets 112, 114, 116 form the corners of an imaginary triangle.

[0077] The optical element 102 or the optically effective surface 106 has six degrees of freedom, namely three translational degrees of freedom along the first spatial direction or x-direction x, the second spatial direction or y-direction y, and the third spatial direction or z-direction z, as well as three rotational degrees of freedom about the x-direction x, the y-direction y, and the z-direction z. This means that a position and an orientation of the optical element 102 or the optically effective surface 106 can be determined or described using the six degrees of freedom.

[0078] The "position" of the optical element 102 or the optically effective surface 106 is to be understood in particular as its coordinates or the coordinates of a measuring point provided on the optical element 102 with respect to the x-direction x, the y-direction y, and the z-direction z. The "orientation" of the optical element 102 or the optically effective surface 106 is to be understood in particular as its tilt with respect to the three spatial directions x, y, z. This means that the optical element 102 or the optically effective surface 106 can be tilted about the x-direction x, the y-direction y, and / or the z-direction z.

[0079] This results in six degrees of freedom for the position and / or orientation of the optical element 102 or the optically effective surface 106. A "position" of the optical element 102 or the optically effective surface 106 includes both its position and its orientation. The term "position" can therefore be replaced by the phrase "position and orientation" and vice versa.

[0080] In Fig. 2, solid lines indicate an actual position IL of the optical element 102 or the optically effective surface 106, and dashed lines and the reference symbols 102' or 106' indicate a desired position SL of the optical element 102 or the optically effective surface 106. The optical element 102 can be moved from its actual position IL to the desired position SL and vice versa. For example, the optical element 102 in the desired position SL meets certain optical specifications or requirements that the optical element 102 in the actual position IL does not meet.

[0081] In order to move the optical element 102 from the actual position IL to the desired position SL, the optical system 100 comprises an adjustment device 118. The adjustment device 118 is configured to adjust the optical element 102. In the present case, "adjusting" or "aligning" is understood to mean, in particular, changing the position of the optical element 102. For example, the optical element 102 can be moved from the actual position IL to the desired position SL and vice versa with the aid of the adjustment device 118. The adjustment or alignment of the optical element 102 can thus be carried out with the aid of the adjustment device 118 in all six aforementioned degrees of freedom.

[0082] The adjustment device 118 comprises several manipulator arrangements 120, 122, 124, which are Fig. 2 are shown only very schematically. The manipulator arrangements 120, 122, 124 can also be referred to as actuator arrangements. Each mirror bushing 112, 114, 116 is assigned a manipulator arrangement 120, 122, 124. This means, in particular, that exactly three manipulator arrangements 120, 122, 124 are provided. Each manipulator arrangement 120, 122, 124 can be assigned two of the aforementioned degrees of freedom. With the three manipulator arrangements 120, 122, 124, an adjustment of the optical element 102 in all six degrees of freedom is thus possible.

[0083] A first manipulator assembly 120 is assigned to the first mirror bushing 112. A second manipulator assembly 122 is assigned to the second mirror bushing 114. A third manipulator assembly 124 is assigned to the third mirror bushing 116. The manipulator assemblies 120, 122, and 124 are constructed identically. Therefore, only the first manipulator assembly 120 and the first mirror bushing 112 will be discussed below, which will be referred to simply as the manipulator assembly 120 and the mirror bushing 112, respectively. All subsequent statements regarding the manipulator assembly 120 apply to the manipulator assemblies 122, 124, and vice versa.

[0084] The manipulator assembly 120 is coupled to the mirror socket 112 via a connection point 126. Furthermore, the manipulator assembly 120 is coupled to a fixed world 132 via two additional connection points 128, 130. The fixed world 132 can be a support frame (force frame) or another immovable structure.

[0085] The manipulator arrangement 120 has two manipulators 134, 136, in particular a first manipulator 134 and a second manipulator 136. With the help of all manipulators 134, 136 of all manipulator arrangements 120, 122, 124, the six degrees of freedom of the optical element 102 can be adjusted. The manipulators 134, 136 can also be referred to as actuators.

[0086] In particular, the manipulators 134, 136 are so-called voice coil manipulators (VCM) or voice coil actuators (VCA) or can be referred to as such.

[0087] Both manipulators 134, 136 are connected to the mirror socket 112 at the connection point 126. Furthermore, the manipulators 134, 136 are connected to the fixed world 132 via the connection points 128, 130. The manipulators 134, 136 can be controlled by a control and regulation unit 138 of the adjustment device 118 to adjust the optical element 102. All manipulators 134, 136 of all manipulator arrangements 120, 122, 124 are operatively connected to the control and regulation unit 138, so that the control and regulation unit 138 can adjust the optical element 102 in all six degrees of freedom by appropriately controlling the manipulators 134, 136. This can be done based on sensor signals from a sensor system (not shown), which can detect the actual position IL and the desired position SL of the optical element 102.

[0088] Fig. 4 shows a schematic sectional view of an embodiment of a first manipulator 134 as mentioned above. The second manipulator 136 can be designed identically to the first manipulator 134, but this is not mandatory.

[0089] The first manipulator 134 has a manipulator housing 140 that is connected to the fixed world 132. For example, the manipulator housing 140 can be connected to the fixed world 132 at the connection point 128. A magnet assembly 142 is coupled to the manipulator housing 140 via two spring elements 144, 146. The spring elements 144, 146 can be designed, for example, as leaf springs. The magnet assembly 142 has a tubular magnet assembly housing and a magnet attached to the outside of the magnet assembly housing. The magnet can be designed, for example, as a permanent magnet. The magnet assembly housing is connected to the manipulator housing 140 by means of the spring elements 144, 146. The optical element 102 is coupled to the magnet assembly 142 by means of a spring element 148.

[0090] An annular coil assembly 152 runs around the magnet assembly housing. The magnet assembly housing is thus guided through the coil assembly 152. The coil assembly 152 has a coil and a reaction mass, as will be explained later. The coil assembly 152 can move relative to the magnet assembly housing or vice versa. A manipulator pin is connected to the magnet assembly housing, which in turn is coupled to the mirror bushing 112 via the connection point 126. The manipulator pin lies obliquely in a plane spanned by the y-direction y and the z-direction z. In particular, the manipulator pin is inclined obliquely to the y-direction y and the z-direction z. The manipulator pin is inclined, in particular, at an inclination angle α relative to the z-direction z. The inclination angle α can be 60°.

[0091] The coil assembly 152 is connected to the manipulator housing 140 by means of a spring element 156. Furthermore, the coil assembly 152 is coupled to the manipulator housing 140 by means of a damper 158. The damper 158 can be implemented as an eddy current brake. The coil assembly 152, the spring element 156, and the damper 158 form a spring-mass-damper system 160 of the first manipulator 134.

[0092] The coil assembly 152 is therefore connected to the manipulator housing 140, wherein the manipulator housing 140 serves to dissipate heat from the coil assembly.

[0093] Furthermore, the manipulator 134 has a mass element 166, which serves to adjust or vary the dynamic decoupling. The mass element 166 is connected to the coil assembly 152 via a connecting section 168. Fig.4 further shows that the mass element 166 has a first component 166a connected to the manipulator housing 140 via the connecting section 168, and a second component 166b connected to the first component 166a connected to the manipulator housing 140. In this way, the mass element 166 can be very flexibly adapted to the respective requirements, for example, to adjust the mass m of the spring-mass-damper system 160 and thus its natural frequency ω or its dynamic behavior. For this purpose, the second component 166b connected to the first component 166a of the mass element 166 can be replaced.

[0094] The manipulator housing 140 has the connecting section 168 serving to connect the coil assembly 152 to the mass element 166.

[0095] Preferably, the coil assembly 152 is detachably connected to the connecting portion 168. This connection of the coil assembly 152 to the connecting portion 168 can be realized by screwing the coil assembly 152 to the connecting portion 168 using screws (not shown).

[0096] Furthermore, the coil assembly 152 may be received on the connecting portion 168 via a fit.

[0097] The mass element 166 is also preferably detachably connected to the connecting section 168. The connection of the mass element 166 to the connecting section 168 can also be realized by means of screws.

[0098] The damper 158 is preferably also arranged by means of a detachable or non-permanent connection between the manipulator housing 140 and the coil assembly 152.

[0099] During operation of the first manipulator 134, Lorentz forces act between the coil assembly 152 and the magnet assembly 142, as indicated by an arrow 162. The manipulator pin connected to the magnet assembly housing thereby moves in a first direction of movement 164. The first direction of movement 164 is arranged in the plane spanned by the y-direction y and the z-direction z and is oriented obliquely to the y-direction y and the z-direction z. The first direction of movement 164 runs along the manipulator pin. List of reference symbols 1 projection exposure system 2 Lighting system 3 Light source 4 Lighting optics 5 Object field 6 Object level 7 reticles 8 reticle holders 9 Reticle displacement drive 10 Projection optics 11 Image field 12 Image plane 13 wafers 14 wafer holders 15 Wafer relocation drive 16 Illumination radiation 17 Collector 18 Intermediate focal plane 19 Deflecting mirrors 20 first facet mirror 21 first facet 22 second facet mirror 23 second facet 100 optical system 102 optical element 102' optical element 104 Substrat 106 optically effective area 106' optically effective area 108 Front 110 Back 112 Mirror socket 114 Mirror socket 116 Mirror socket 118 Adjustment device 120 Manipulator arrangement 122 Manipulator arrangement 124 Manipulator arrangement 126 connection point 128 connection point 130 connection point 132 solid world 134 Manipulator 136 Manipulator 138 Control and regulation unit 140 Manipulator housing 142 Magnet assembly 144 spring element 146 spring element 148 spring element 152 Coil assembly 156 spring element 158 dampers 160 spring-mass-damper system 162 Arrow 164 Direction of movement 166 mass element 166a first component 166b second component 168 connecting section IL Current situation M1 mirror M2 mirror M3 mirror M4 mirror M5 mirror M6 mirror SL target position x x-direction y y-direction z z-direction α angle of inclination ω natural frequency QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2022 211 799 A1

[0005] DE 10 2008 009 600 A1 [0040, 0044] US 2006 / 0132747 A1

[0042] EP 1 614 008 B1

[0042] US 6,573,978

[0042] DE 10 2017 220 586 A1

[0047] US 2018 / 0074303 A1

[0061]

Claims

[1] Manipulator (134) for adjusting an optical element (102), with a magnet assembly (142) which can be coupled to the optical element (102), with a coil assembly (152) which can be linearly displaced by means of the magnet assembly (142) in order to adjust the optical element (102), with a manipulator housing (140) to which the coil assembly (152) is connected and which serves to dissipate heat from the coil assembly (152), and with a mass element (166), wherein the coil assembly (152) is connected to the mass element (166) via a connecting section (168). [2] Manipulator (134) according to claim 1, characterized by that the manipulator housing (140) has the connecting section (168) for connecting the coil assembly (152) to the mass element (166). [3] Manipulator (134) according to claim 1 or 2, characterized by that the coil assembly (152) is detachably connected to the connecting portion (168). [4] Manipulator (134) according to claim 3, characterized by that the coil assembly (152) is connected to the connecting section (168) by means of screws. [5] Manipulator (134) according to one of claims 1 to 4, characterized by that the coil assembly (152) is received on the connecting portion (168) via a fit. [6] Manipulator (134) according to one of claims 1 to 5, characterized by that the mass element (166) is detachably connected to the connecting section (168). [7] Manipulator (134) according to claim 6, characterized by that the mass element (166) is connected to the connecting section (168) by means of screws. [8] Manipulator (134) according to one of claims 1 to 7, characterized by that the mass element (166) has a first component (166a) connected to the manipulator housing (140) and a second component (166b) connected to the first component (166a) connected to the manipulator housing (140). [9] Optical system (100) for a semiconductor technology system (1), comprising an optical element (102) and a manipulator (134) according to one of claims 1 to 8, wherein the magnet assembly (142) is coupled to the optical element (102). [10] System for semiconductor technology (1) with at least one manipulator (134) according to one of claims 1 to 8 and / or an optical system (100) according to claim 9. [11] Electronic component, characterized by that the component is manufactured using a semiconductor technology system (1) according to claim 10, wherein the component preferably has structures in the micrometer and / or nanometer range.

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