POWER MODULE TESTING DEVICE WITH INTEGRATED DC CURRENT TEST AND WITHSTAND VOLTAGE TEST AND TEST METHODS USING THE SAME

Abstract

A test apparatus for a power module comprises a first socket board comprising a first withstand voltage test pin, a second socket board comprising a second withstand voltage test pin and a DC test pin, a tester configured to generate a withstand voltage test signal and transmit the withstand voltage test signal to the first withstand voltage test pin and the second withstand voltage test pin, and to generate a DC test signal and transmit the DC test signal to the DC test pin, and a relay that closes or opens an electrical connection between the tester and at least one of the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a test apparatus for a power module with integrated direct current (DC) test and withstand voltage test functions and a test method using the same, and more particularly to a test apparatus and a test method for implementing a process in which a DC test and withstand voltage test of a power module are integrated. BACKGROUND

[0002] A power module is a device used to convert direct current to alternating current when driving motors of hybrid vehicles, electric vehicles, and the like. Typically, a power module may include a substrate, a power semiconductor device as a switching device connected to the substrate, a power line that supplies power to the power semiconductor device, a signal line that provides a control signal to the power semiconductor device, and the like.

[0003] After power modules are manufactured, they can be identified as good or defective products through electrical performance testing. Electrical performance testing of power modules can generally be performed in an end-of-line (EOL) evaluation process and may include direct current (DC) testing, alternating current (AC) testing, and voltage withstand testing.

[0004] In the current EOL evaluation process, a separate process is used to test each electrical property. Because both the testing process and the testing equipment are separate, the cycle time (C / T) of the process increases, and the space required for the equipment for the process increases, which can reduce the overall efficiency of the process and make it difficult to manage. SUMMARY

[0005] One aspect of the present disclosure is to provide a test apparatus for a power module that can perform both a DC test and a withstand voltage test during the electrical characteristic test to reduce a cycle time of a test process for testing the electrical characteristics of the power module and the space occupied by the test apparatus.

[0006] According to one aspect of the present disclosure, a test apparatus for a power module comprises a first socket board comprising a first withstand voltage test pin; a second socket board comprising a second withstand voltage test pin and a DC test pin; a tester configured to generate a withstand voltage test signal and transmit the withstand voltage test signal to the first withstand voltage test pin and the second withstand voltage test pin, and to generate a DC test signal and transmit the DC test signal to the DC test pin; and a relay that closes or opens an electrical connection between the tester and at least one of the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin.

[0007] The power module may include a lower substrate, an upper substrate arranged in parallel with the lower substrate, and a semiconductor device arranged between the lower substrate and the upper substrate, and the first socket board may include an upper socket board arranged to oppose the upper substrate and a lower socket board arranged to oppose the lower substrate.

[0008] The first withstand voltage test pin of the upper socket board may contact at least a portion of the upper substrate, and the first withstand voltage test pin of the lower socket board may contact at least a portion of the lower substrate.

[0009] The power module may further include a power line and a signal line, at least a portion of which is exposed to an outside of a housing of the power module, and the second socket board may be provided such that the second withstand voltage test pin and the DC test pin are in contact with the power line and the signal line, respectively.

[0010] The second socket board may consist of a power line socket board corresponding to the power line and a signal line socket board corresponding to the signal line. The power line socket board and the signal line socket board may be arranged on both sides of the lower socket board.

[0011] The second withstand voltage test pin and the DC test pin of the socket board for a power line can contact at least a portion of the power line, and the second withstand voltage test pin and the DC test pin of the socket board for a signal line can contact at least a portion of the signal line.

[0012] The first socket board may further comprise a first circuit board, and the first withstand voltage test pin may be arranged on the first circuit board to face the power module.

[0013] The second socket board may further comprise a second board, the DC test pin may be of a plurality and may be arranged on the second board to face the power module, and the second withstand voltage test pin may be arranged between the plurality of DC test pins to face the power module.

[0014] The test apparatus may be operable in a DC test mode or a withstand voltage test mode, and the relay may switch the test apparatus to the DC test mode or the withstand voltage test mode by controlling an electrical connection between the DC test pin and the tester and an electrical connection between the first and second withstand voltage test pins and the tester.

[0015] In DC test mode, the relay can electrically connect the tester to the DC test pin.

[0016] In withstand voltage test mode, the relay can electrically connect the tester to the first withstand voltage test pin and the second withstand voltage test pin.

[0017] The relay may comprise a plurality of relays connected between the first withstand voltage test pin and the tester, between the second withstand voltage test pin and the tester, and between the DC test pin and the tester.

[0018] In the DC test mode, the plurality of relays connected to the DC test pin may be closed, and the plurality of relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be open.

[0019] In the withstand voltage test mode, the plurality of relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be closed, and the plurality of relays connected to the DC test pin may be open.

[0020] The plurality of relays may include a cylinder relay.

[0021] According to another aspect of the present disclosure, a method for testing electrical characteristics of a power module includes attaching the power module to a test fixture; operating the test fixture in a DC test mode and performing a DC test of the power module; and operating the test fixture in a withstand voltage test mode and performing a withstand voltage test of the power module. The test fixture includes a first socket board including a first withstand voltage test pin; a second socket board including a second withstand voltage test pin and a DC test pin; a tester that generates a withstand voltage test signal and a DC test signal; and a relay that switches an operation mode of the test fixture to the DC test mode or the withstand voltage test mode.When mounting the power module on the test fixture, the power module may be configured to contact the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin.

[0022] When performing a DC test of the power module, the relay may be configured to electrically connect the tester to the DC test pin.

[0023] When performing a withstand voltage test of the power module, the relay may be configured to electrically connect the tester to the first withstand voltage test pin and the second withstand voltage test pin.

[0024] The relay may comprise a plurality of relays connected between the first withstand voltage test pin and the tester, between the second withstand voltage test pin and the tester, and between the DC test pin and the tester.

[0025] In DC test mode, the plurality of relays connected to the DC test pin may be closed, and the plurality of relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be open. In withstand voltage test mode, the plurality of relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be closed, and the plurality of relays connected to the DC test pin may be open. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other aspects, features and advantages of the present disclosure will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. Fig. 1 is a perspective view showing an example of a power module. Fig. 2 is a cross-sectional view showing an example of a power module. Fig. 3 is a diagram showing an example of a power module and a test fixture for a power module. Fig. 4 is a diagram showing an example of a first socket board of a power module test apparatus. Fig. 5 is a diagram showing an example of a second socket board of a power module test apparatus. Fig. 6 is a diagram showing example positions between a power module, a first socket board, and a second socket board when performing tests with a power module test jig. Fig. 7 is a diagram showing an example of an electrical connection path for a withstand voltage test of a power module in a power module test apparatus. Fig. 8A is a diagram showing an example of a DC test circuit of a test apparatus for a power module. Fig. 8B is a diagram showing an example of a withstand voltage test circuit of a test apparatus for a power module. DETAILED DESCRIPTION

[0027] Since the present disclosure is susceptible to various modifications and embodiments, some embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present disclosure to the embodiments, and should be understood to include all modifications, equivalents, and substitutes included within the spirit and scope of the present disclosure.

[0028] Terms such as "first" and "second" may be used to describe various components, but the components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the present disclosure. The term "and / or" encompasses a combination of a plurality of related listed elements or any one of a plurality of related listed elements.

[0029] The terms used in this application are used only to describe embodiments and are not intended to limit the present disclosure. Singular terms include plural terms unless the context clearly indicates otherwise. In this application, the terms "comprising," "having," and the like are intended to indicate a feature, number, step, operation, component, part, or combination thereof described in the specification, but it should be understood that this does not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0030] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms as defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the context of the relevant field, and unless expressly defined in this application, they should not be interpreted in an ideal or overly formal sense.

[0031] Embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0032] Fig. 1 is a perspective view of a power module 1. Fig. 2 is a cross-sectional view of the power module 1.

[0033] Fig. 2 is a diagram showing a cross section along the line AA' of the Fig. 1 shows the power module 1.

[0034] With reference to the Fig. 1 and Fig. 2, the power module 1 may include a housing 10, a lower substrate 20, an upper substrate 30, a semiconductor device 40, a power line 50, a signal line 60, a wire 70, a spacer 80, and a solder element 90.

[0035] The housing 10 may accommodate at least some of the components that form the power module 1 therein. For example, the housing 10 may surround components disposed between the lower substrate 20 and the upper substrate 30, such that at least portions of the lower substrate 20, the upper substrate 30, the power line 50, and the signal line 60 are exposed to the outside of the housing 10. The housing 10 may be a molded part made of an insulating material in which the components forming the power module 1 are molded.

[0036] The lower substrate 20 may include an insulating layer 22 and metal layers 21 and 23 disposed on both sides of the insulating layer 22. The metal layers 21 and 23 may include a first metal layer 21 connected to the upper surface of the insulating layer 22 and a second metal layer 23 connected to the lower surface of the insulating layer 22. The first metal layer 21 of the lower substrate 20 may be in electrical contact with the lower surface of the semiconductor device 40. At least a portion (e.g., a lower surface) of the second metal layer 23 of the lower substrate 20 may be exposed by being disposed outside the housing 10. In some examples, the second metal layer 23 of the lower substrate 20 may be in contact with a cooling channel for cooling the power module 1.

[0037] The upper substrate 30 may include an insulating layer 32 and metal layers 31 and 33 disposed on both sides of the insulating layer 32. The metal layers 31 and 33 may include a first metal layer 33 connected to the lower surface of the insulating layer 32 and a second metal layer 31 connected to the upper surface of the insulating layer 32. The first metal layer 33 of the upper substrate 30 may be in electrical contact with the upper surface of the semiconductor device 40 through a first spacer 81. At least a portion (e.g., an upper surface) of the second metal layer 31 of the upper substrate 30 may be exposed by being disposed outside the housing 10. In some examples, the second metal layer 31 of the upper substrate 30 may be in contact with a cooling channel for cooling the power module 1.

[0038] The lower substrate 20 and the upper substrate 30 may be double bonded copper (DBC) substrates. For example, the upper substrate 30 and the lower substrate 20 may include, but are not limited to, insulating layers 22 and 32 made of a ceramic material and metal layers 21, 23, 31, and 33 made of a copper material.

[0039] The lower substrate 20 and the upper substrate 30 may be electrically connected by the spacer 80. For example, the first metal layer 21 of the lower substrate 20 and the first metal layer 33 of the upper substrate 30 may be electrically connected by a second spacer 82. A portion of the first metal layer 21 of the lower substrate 20 that is electrically connected to the lower surface of the semiconductor device 40 may be configured to be electrically insulated from a portion of the first metal layer 21 of the lower substrate 20 that is electrically connected to the first metal layer 33 of the upper substrate 30 by the second spacer 82.

[0040] The semiconductor device (or a semiconductor chip) 40 may be disposed between the lower substrate 20 and the upper substrate 30. For example, the semiconductor device 40 may be connected to the first metal layer 21 of the lower substrate 20 and disposed between the lower substrate 20 and the upper substrate 30. The semiconductor device 40 may be electrically connected to the upper substrate 30 and the lower substrate 20. For example, the semiconductor device 40 may have power terminals formed on each of the upper and lower surfaces through which power is input and output for power conversion. The power terminal formed on the lower surface may be electrically connected to the lower substrate 20, and the power terminal formed on the upper surface may be electrically connected to the upper substrate 30.The semiconductor device 40 may consist of, but is not limited to, an insulated gate bipolar transistor (IGBT) and a diode.

[0041] The lower surface of the semiconductor device 40 may be connected to the first metal layer 21 of the lower substrate 20 by the solder element 90. The upper surface of the semiconductor device 40 may be connected to the first spacer 81 by the solder element 90. For example, the semiconductor device 40 may be electrically connected to the first metal layer 33 of the upper substrate 30 by the first spacer 81. The semiconductor device 40 may be electrically connected to the signal line 60 by the wire 70.

[0042] The power line 50 is connected to the semiconductor device 40 and can transmit and receive high-voltage power. The power line 50 can be electrically connected to the semiconductor device 40 and can consist of a plurality of power lines. At least a portion of the power line 50 can be electrically connected to the first metal layer 21 of the lower substrate 20 through the solder element 90. For example, the power line 50 can be connected together with the semiconductor device 40 to the upper surface of the first metal layer 21 of the lower substrate 20. A portion of the power line 50 can be exposed to the outside of the housing 10 to transmit power to and receive power from the outside of the power module 1. The power line 50 can extend from the inside of the housing 10 to the outside of the housing 10 such that at least a portion is exposed to the outside of the housing 10.

[0043] The signal line 60 may receive a control signal for controlling the semiconductor device 40 from the outside of the power module 1 and may consist of a plurality of signal lines. The signal line 60 may extend from the inside of the housing 10 to the outside of the housing 10, such that at least a portion is exposed to the outside of the housing 10. The signal line 60 may be electrically connected to the semiconductor device 40 by the wire 70.

[0044] The spacer 80 may include the first spacer 81 disposed between the upper substrate 30 and the semiconductor device 40 and the second spacer 82 disposed between the upper substrate 30 and the lower substrate 20.

[0045] The first spacer 81 is connected with its upper surface to the first metal layer 33 of the upper substrate 30 and with its lower surface to the semiconductor device 40, thereby forming an electrical connection between the upper substrate 30 and the semiconductor device 40. For example, the upper and lower surfaces of the first spacer 81 can electrically and physically contact the first metal layer 33 of the upper substrate 30 and the upper surface of the semiconductor device 40 through the solder element 90.

[0046] In the case of the second spacer 82, an upper surface may be connected to the first metal layer 33 of the upper substrate 30, and a lower surface may be connected to the first metal layer 21 of the lower substrate 20, thereby forming an electrical connection between the upper substrate 30 and the lower substrate 20. For example, the upper and lower surfaces of the second spacer 82 may electrically and physically contact the first metal layer 33 of the upper substrate 30 (e.g., the lower surface of the first metal layer 33) and the first metal layer 21 of the lower substrate 20 (e.g., the upper surface of the first metal layer 21) through the solder element 90.

[0047] In some embodiments, as in Fig. 1 and Fig. 2, the power module 1 may be a double-side cooling (DSC) power module configured such that the semiconductor device 40 is disposed between the upper substrate 30 and the lower substrate 20. However, the structure of the power module 1 is not limited to the illustrated embodiment and may be modified in various ways within the scope of the embodiment of the structure in which the semiconductor device 40 is disposed between the upper and lower substrates 20, and the heat generated by the semiconductor device 40 is cooled by a cooler attached to the outside of the two substrates.

[0048] Fig. 3 is a diagram schematically showing the power module 1 and a power module test apparatus 100. Fig. 4 is a diagram showing a first socket board 120 of the power module testing apparatus 100. Fig. 5 is a diagram showing a second socket board 130 of the power module test apparatus 100. Fig. 6 is a diagram showing the positional relationship between the power module 1, the first socket board 120, and the second socket board 130 when inspected with the power module test apparatus 100.

[0049] Fig. 3 is a diagram schematically illustrating a process in which the power module 1 is attached to the power module testing apparatus 100 for testing the power module 1. Fig. 4 is a diagram showing a detailed form of the Fig. 3 shows the first socket board 120. Fig. 5 is a diagram showing a detailed form of the Fig. 3 shows the second socket board 130. Fig. 6 is a diagram showing the positional relationship between the power module 1, the first socket board 120, and the second socket board 130 when the power module 1 is attached to the power module testing apparatus 100.

[0050] In some embodiments, referring to the Fig. 3 to 6, the power module test apparatus 100 can contact the power module 1 while covering at least a portion of the power module 1 from above and below. The power module test apparatus 100 is configured to perform both a DC current test and a withstand voltage test for the power module 1. For example, the power module 1 can perform a DC current test and a withstand voltage test together through the socket boards 120 and 130 included in the power module test apparatus 100, without a transfer operation, while the power module is seated or attached to the power module test apparatus 100.

[0051] The power module testing apparatus 100 may include a motherboard 110, the first socket board 120, the second socket board 130, a relay 140, and a tester 150.

[0052] The first socket board 120 and the second socket board 130 may sit on a surface of the base board 110. For example, the base board 110 may support the first socket board 120 and the second socket board 130. In some examples, the base board 110 may be disposed on an upper portion of a test head, in which case the test head may be electrically connected to the first socket board 120, the second socket board 130, and the relay 140, generate a test control signal, and provide the test control signal to the tester 150, and generate a relay control signal and provide the relay control signal to the relay 140. According to various embodiments, the base board 110 may be part of the test head.

[0053] The first socket board 120 may be a test board for testing the withstand voltage of the power module 1. The first socket board 120 may include a first circuit board 121 and a first withstand voltage test pin 123 arranged in a portion of the first circuit board 121. For example, the first withstand voltage test pin 123 may be arranged in the central portion of one side of the first circuit board 121. The first withstand voltage test pin 123 may comprise a pogo pin. The location and number of the first withstand voltage test pins 123 are not limited to the illustrated embodiment.

[0054] The first socket board 120 is configured to be electrically connected to the power module 1 through the first withstand voltage test pin 123. For example, when the first withstand voltage test pin 123 contacts the power module 1, an electrical connection can be formed between the power module 1, the first socket board 120, and the tester 150.

[0055] The first withstand voltage test pin 123 of the first socket board 120 receives a test signal (e.g., an electrical signal for a withstand voltage test) from the tester 150 and is connected to the power module 1 to transmit the withstand voltage test signal to the power module 1. The first withstand voltage test pin 123 may be electrically connected to at least a portion of the plurality of relays included in the relay 140. The first withstand voltage test pin 123 of the first socket board 120 may be electrically connected to or disconnected from the tester 150 based on the switching operation of the relay 140.

[0056] The first socket board 120 may be composed of two parts to respectively contact the upper and lower portions of the power module 1. For example, the first socket board 120 may include a lower socket board 120a and an upper socket board 120b having the same shape. In the power module testing apparatus 100, the lower socket board 120a and the upper socket board 120b may be mounted so that the respective first withstand voltage test pins 123 face the power module 1.

[0057] The lower socket board 120a may be arranged on the base board 110 such that the first withstand voltage test pin 123 faces the power module 1, and the upper socket board 120b may be arranged on an upper portion of the power module 1 such that the first withstand voltage test pin 123 faces the power module 1 in a state where the power module 1 is attached to the test apparatus 100.

[0058] For example, in testing the power module 1, the first withstand voltage test pin 123 of the lower socket board 120a is arranged to face the lower substrate 20 of the power module 1 and can contact the lower substrate 20, and the first withstand voltage test pin 123 of the upper socket board 120b is arranged to face the upper substrate 30 of the power module 1 and can contact the upper substrate 30.

[0059] The first circuit board 121 of the first socket board 120 may include a heat source that can apply heat to the power module 1 to test the power module 1 under high-temperature conditions. For example, the first socket board 120 may be a heater block in which a heating wire or heater is arranged.

[0060] The second socket board 130 may be a test board for withstand voltage tests and DC tests of the power module 1. The second socket board 130 may include a second circuit board 131, DC test pins 133 arranged at portions of the second circuit board 131, and second withstand voltage test pins 135 arranged between the DC test pins 133. The DC test pin 133 and the second withstand voltage test pin 135 may be arranged alternately.

[0061] For example, the plurality of DC test pins 133 may be formed over the entire area of ​​a surface of the second circuit board 131, and the plurality of second withstand voltage test pins 135 may be arranged between the plurality of DC test pins 133. The DC test pin 133 and the second withstand voltage test pin 135 may comprise a pogo pin. The positions and number of the DC test pins 133 and the second withstand voltage test pins 135 are not limited to the illustrated embodiment.

[0062] The second socket board 130 is configured to be electrically connected to the power module 1 through the DC test pin 133 and the second withstand voltage test pin 135. For example, since the DC test pin 133 and the second withstand voltage test pin 135 are in contact with the power module 1, an electrical connection can be formed between the power module 1, the second socket board 130, and the tester 150.

[0063] The DC test pin 133 and the second withstand voltage test pin 135 of the second socket board 130 may receive a test signal (e.g., an electrical signal for a withstand voltage test or an electrical signal for a DC voltage test) from the tester 150 and may be connected to the power module 1 and transmit the withstand voltage test signal or the DC test signal to the power module 1. The respective DC test pins 133 and the respective second withstand voltage test pins 135 may be electrically connected to at least portions of the plurality of relays included in the relay 140.

[0064] The DC test pins 133 and the second withstand voltage test pins 135 may each be electrically connected in parallel to a plurality of relays. The respective DC test pins 133 and the respective second withstand voltage test pins 135 of the second socket board 130 may be electrically connected to or disconnected from the tester 150 based on the switching operation of the relay 140.

[0065] The DC test pin 133 and the second withstand voltage test pin 135 of the second socket board 130 may be selectively electrically connected to the tester 150 through the relay 140. For example, when a DC test is performed on the power module 1, the DC test pin 133 of the second socket board 130 is electrically connected to the tester 150 to transmit an electrical signal for a DC test on the power module 1 to the power module 1, and the second withstand voltage test pin 135 is not electrically connected to the tester 150.

[0066] In some examples, when performing a withstand voltage test on the power module 1, the second withstand voltage test pin 135 of the second socket board 130 is electrically connected to the tester 150 to transmit an electrical signal for a withstand voltage test to the power module 1, and the DC test pin 133 is not electrically connected to the tester 150.

[0067] The second socket board 130 may be configured to contact the power line 50 and the signal line 60 of the power module 1. For example, the second socket board 130 may be arranged at a position corresponding to the power line 50 and the signal line 60, and may consist of a plurality of second socket boards to contact the power line 50 and the signal line 60. The second socket board 130 may be arranged on the base board 110 to be arranged on both sides of the lower socket board 120a in the short side direction to correspond to the positions of the power line 50 and the signal line 60. For example, the second socket board 130 may include a socket board 130a for a power line corresponding to the power line 50 and a socket board 130b for a signal line corresponding to the signal line 60.For example, in a state where the power module 1 is attached to the test apparatus 100 to test the power module 1, at least portions of the plurality of DC test pins 133 and the plurality of second withstand voltage test pins 135 of the second socket board 130 may contact the power line 50 and the signal line 60 of the power module 1. However, the location and / or number of the second socket boards 130 are not limited to the illustrated embodiment.

[0068] The power line socket board 130a may be configured so that a plurality of power lines 50 respectively contact the DC test pins 133 and the second withstand voltage test pins 135 when the power module 1 is seated or attached to the power module testing apparatus 100. For example, the DC test pins 133 and the second withstand voltage test pins 135 may be arranged in a position where a plurality of power lines 50 simultaneously contact the DC test pins 133 and the second withstand voltage test pins 135 when the power module 1 is seated in the power module testing apparatus 100.

[0069] The signal line socket board 130b may be configured so that the plurality of signal lines 60 each contact the DC test pin 133 and the second withstand voltage test pin 135 when the power module 1 is seated or attached to the power module testing apparatus 100. For example, the DC test pin 133 and the second withstand voltage test pin 135 may be arranged in a position where the plurality of signal lines 60 each simultaneously contact the DC test pins 133 and the second withstand voltage test pins 135 when the power module 1 is seated in the power module testing apparatus 100.

[0070] The relay 140 can switch the operating mode of the power module test apparatus 100 depending on the subject (or electrical characteristics) for evaluating the power module 1. For example, the relay 140 controls the electrical connection between the tester 150 and the test pins (withstand voltage test pins 123, 135 and DC test pins 133) through a switching operation, thereby switching the operating mode of the power module test apparatus 100 to a withstand voltage test mode and a DC test mode. The relay 140 may include a cylindrical relay, which can reduce the influence of electrical noise. However, the type of the relay 140 is not limited to the examples described above. According to various embodiments, the relay 140 may be referred to as a switching unit.

[0071] Relay 140 may be electrically connected to socket boards 120 and 130 and tester 150. Relay 140 may be configured to include a plurality of relays, and the plurality of relays are connected between a plurality of test pins 123, 133, 135 formed on socket boards 120 and 130 and tester 150, and are configured to partially connect or block the electrical path between the plurality of test pins 123, 133, and 135 and tester 150.For example, parts of the plurality of relays are connected between the first withstand voltage test pin 123 of the first socket board 120 and the tester 150 to control (block or allow) the electrical connection therebetween, another part thereof may be connected between the second withstand voltage test pin 135 of the second socket board 130 and the tester 150 to control (block or allow) the electrical connection therebetween, and still others thereof may be connected between the DC test pin 133 of the second socket board 130 and the tester 150 to control (block or allow) the electrical connection therebetween.

[0072] The connection between the plurality of relays included in relay 140 and test pins 123, 133, and 135 can be implemented in various ways. For example, the first withstand voltage test pin 123 and the second withstand voltage test pin 135 can be connected to the tester 150 through a relay, or can each be connected to the tester 150 through a separate relay. Furthermore, the plurality of DC test pins 133 are divided into a plurality of groups, and the pins in a group are connected to the tester 150 through a relay, or a plurality of DC test pins 133 can each be connected to the tester 150 through separate relays.However, the above explanations are only exemplary, and the electrical connections between the withstand voltage test pins 123 and 135 and the tester 150 and between the DC test pin 133 and the tester 150 and their positions can be provided in various ways using the relay 140 in the selective control area.

[0073] The relay 140 is configured such that, in the DC test mode, the relay connected to the withstand voltage test pins 123 and 135 is open (off state) and the relay connected to the DC test pin 133 is closed (on state), and thus the DC test pin 133 is operated so that the electrical signal for the DC test generated in the tester 150 can be transmitted to the power module 1. Furthermore, the relay 140 is configured such that, in the withstand voltage test mode, the relay connected to the DC test pin 133 is open (off state) and the relay connected to the withstand voltage test pins 123 and 135 is closed (on state), and thus the withstand voltage test pins 123 and 135 are operated so that the electrical signal for the withstand voltage test generated in the tester 150 can be transmitted to the power module 1.

[0074] The tester 150 may generate a test signal (or electrical signal) to test the electrical characteristics of the power module 1 and transmit the test signal to the power module 1. The tester 150 may generate an electrical signal for a DC current test of the power module 1 and an electrical signal for a withstand voltage test. The DC current test may be a test that judges whether the semiconductor device 40 in the power module 1 is functioning properly by applying a preset voltage to the power module 1 to measure DC characteristics such as open / short circuit, input current, output voltage, power current, and the like. The withstand voltage test may be a test that evaluates the electrical insulation state by applying a high voltage to the power module 1 and checking whether the leakage current is a specified value or less.However, the testing procedure is not limited to the examples mentioned above.

[0075] In some examples, tester 150 may include a DC current tester that generates a test signal for performing a DC current test and a withstand voltage tester that generates a test signal for a withstand voltage test. According to various embodiments, tester 150 may be included in a test head.

[0076] The tester 150 can check whether the power module 1 is in normal contact with the withstand voltage test pins 123 and 135 and the DC test pin 133 while supplying current or voltage, e.g., whether the power module 1 is properly connected to the socket boards 120 and 130.

[0077] Fig. 7 is a diagram showing an electrical connection path for a withstand voltage test of the power module 1 in the power module test apparatus 100.

[0078] When describing Fig. 7 will also refer to the above-described Fig. 3 to 6.

[0079] With reference to Fig. 7, in the case of the power module 1, the upper substrate 30 and the lower substrate 20 are electrically connected to the tester 150 through a common node, and the signal line 60 and the power line 50 are electrically connected to the tester 150 through a common node, thereby performing a withstand voltage test. For example, the Fig. 7 may be referred to as a withstand voltage tester (or withstand voltage tester) for performing a withstand voltage test.

[0080] The upper substrate 30 and the lower substrate 20 of the power module 1 may be electrically connected to the tester 150 through the first withstand voltage test pins 123 of the upper socket board 120b and the lower socket board 120a, and the power line 50 and the signal line 60 of the power module 1 may be electrically connected to the tester 150 through the second withstand voltage test pins 135 of the second socket board 130.

[0081] The tester 150 may apply a high voltage to the power module 1 to evaluate the insulation condition and dielectric strength of the power module 1. For example, the withstand voltage test may be performed by applying a high-voltage alternating current (AC) voltage waveform of approximately 3300 V to the power module 1. By using the AC voltage waveform, the withstand voltage can be evaluated for both the + and - directions. However, the withstand voltage test method is not limited to the above examples.

[0082] Fig. 8A is a diagram showing a DC test circuit of the power module test apparatus 100. Fig. 8B is a diagram showing a circuit for a withstand voltage test of the power module tester 100.

[0083] Fig. 8A and Fig. 8B are diagrams illustrating circuit connections for a DC current test and a withstand voltage test using the power module test apparatus 100.

[0084] Fig. 8A shows a circuit connection state when the power module test apparatus 100 is in a DC test mode to perform a DC test on the power module 1, and Fig. Fig. 8B shows a circuit connection state when the power module test apparatus 100 is in a withstand voltage test mode to perform a withstand voltage test on the power module 1. In describing the Fig. 8A and Fig. 8B is based on the above-described Fig. 3 to 7 are referred to together.

[0085] With reference to Fig. 8A and Fig. 8B, the power module test apparatus 100 operates such that the DC test circuit is configured as a closed loop in the DC test mode and the withstand voltage test circuit is open, and the withstand voltage test circuit is configured as a closed loop in the withstand voltage test mode and the DC test circuit is open.

[0086] As in Fig. As shown in FIG. 8A, when the power module tester 100 is in the DC test mode, the cylinder relay 141 connected to the DC test pin 133 is closed, and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is open, and thus the DC test circuit is configured as a closed circuit. Accordingly, only the DC test pin 133 is operated, and the withstand voltage test pins 123 and 135 are not operated. The DC test signal generated by the tester 150 can be applied to the power module 1 (specifically, to the power line 50 and the signal line 60) through the DC test pin 133.

[0087] As in Fig.As shown in Figure 8B, when the power module tester 100 is in the withstand voltage test mode, the cylinder relay 141 connected to the DC test pin 133 is open, and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is closed, so that the withstand voltage test circuit forms a closed circuit. Accordingly, only the withstand voltage test pins 123 and 135 are operated, and the DC test pin 133 is not operated, and the withstand voltage test signal generated in the tester 150 can be applied to the power module 1 (specifically, the upper substrate 30, the lower substrate 20, the power line 50, and the signal line 60) through the withstand voltage test pins 123 and 135.

[0088] A method for testing the electrical characteristics of the power module 1 using the power module testing apparatus 100 will be described below.

[0089] To test the power module 1, the power module 1 is first attached to the power module test jig 100. When the power module 1 is attached to the power module test jig 100, the power module 1 may be arranged on the upper socket board 120b and the lower socket board 120a. Furthermore, when the power module 1 is attached to the power module test jig 100, it may be arranged such that the upper substrate 30 and the lower substrate 20 contact the first withstand voltage test pin 123 of the first socket board 120, and the power line 50 and the signal line 60 contact the second withstand voltage test pin 135 and the DC test pin 133 of the second socket board 130.

[0090] After attaching the power module 1, a small current may be applied to check whether the power module 1 is electrically connected to the first socket board 120 and the second socket board 130.

[0091] After checking the installation and electrical connection status of the power module 1, the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is opened, and the cylinder relay 141 connected to the DC test pin 133 is closed, thereby performing a DC test on the power module 1.

[0092] After the DC test is completed, the cylinder relay 141 connected to the DC test pin 133 is opened and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is closed to perform a withstand voltage test on the power module 1.

[0093] For example, according to the power module test apparatus 100, the DC current test and the withstand voltage test for the power module 1 are performed in one device or process, and therefore, process and equipment costs can be reduced because separate processes and equipment are not required. Since it is not necessary to transport the power module 1 between the DC current test and the withstand voltage test, the process can be simplified and mass production can be improved.

[0094] As explained above, the cycle time of a test process and the space occupied by the test equipment can be reduced by performing a DC test and a withstand voltage test for the power module in one fixture.

[0095] In addition, DC test and voltage withstand test are integrated and performed in one process, reducing equipment costs and increasing product mass productivity.

[0096] Although exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined in the appended claims.

Claims

[1] Test device for a power module, comprising: a first socket board having a first withstand voltage test pin; a second socket board having a second withstand voltage test pin and a direct current (DC) test pin; a verifier that is configured: to generate a withstand voltage test signal, the withstand voltage test signal to the first withstand voltage test pin and the second Withstand voltage test pin to transfer, to generate a DC test signal, and the DC test signal to the DC test pin; and a relay configured to close and open an electrical connection between the tester and at least one of the first withstand voltage test pin, the second withstand voltage test pin, or the DC test pin. [2] The test apparatus according to claim 1, wherein the power module comprises (i) a lower substrate, (ii) an upper substrate arranged in parallel with the lower substrate, and (iii) a semiconductor device arranged between the lower substrate and the upper substrate, and wherein the first socket board comprises (i) an upper socket board configured to oppose the upper substrate and (ii) a lower socket board configured to oppose the lower substrate. [3] The test apparatus of claim 2, wherein the first withstand voltage test pin of the upper socket board is configured to contact at least a portion of the upper substrate, and wherein the first withstand voltage test pin of the lower socket board is configured to contact at least a portion of the lower substrate. [4] The test apparatus according to claim 3, wherein the power module further comprises a power line and a signal line, at least a portion of each of the power line and the signal line being exposed to an outside of a casing of the power module, and wherein the second withstand voltage test pin and the DC test pin are configured to be in contact with the power line and the signal line, respectively. [5] The test apparatus according to claim 4, wherein the second socket board comprises (i) a power socket board configured to contact the power line and (ii) a signal socket board configured to contact the signal line, the power socket board and the signal socket board being arranged on sides of the lower socket board, respectively. [6] The test apparatus of claim 5, wherein the second withstand voltage test pin and the DC test pin of the power jack board are configured to contact at least a portion of the power line, and wherein the second withstand voltage test pin and the DC test pin of the signal jack board are configured to contact at least a portion of the signal line. [7] The test apparatus according to claim 1, wherein the first socket board further comprises a first circuit board, and wherein the first withstand voltage test pin is arranged on the first circuit board and is configured to oppose the power module. [8] The testing apparatus according to claim 1, wherein the second socket board further comprises a second board, wherein the DC test pin is one of a plurality of DC test pins arranged on the second board and configured to face the power module, and wherein the second withstand voltage test pin is arranged between the plurality of DC test pins and is configured to oppose the power module. [9] The test apparatus of claim 1, wherein the test apparatus is configured to operate in a DC test mode or a withstand voltage test mode, and wherein the relay is configured to switch the test apparatus to the DC test mode or the withstand voltage test mode by controlling (i) an electrical connection between the DC test pin and the tester and (ii) an electrical connection between the tester and each of the first and second withstand voltage test pins. [10] The test apparatus of claim 9, wherein the relay is configured to electrically connect the tester to the DC test pin in the DC test mode. [11] The test apparatus according to claim 9, wherein the relay is configured to electrically connect the tester to the first withstand voltage test pin and the second withstand voltage test pin in the withstand voltage test mode. [12] The test apparatus according to claim 9, wherein the relay is one of a plurality of relays connected (i) between the first withstand voltage test pin and the tester, (ii) between the second withstand voltage test pin and the tester, and (iii) between the DC test pin and the tester. [13] The testing apparatus of claim 12, wherein the plurality of relays comprise: a first relay configured to be closed in the DC test mode and connected to the DC test pin, and a second relay configured to be open in DC test mode and connected to the first withstand voltage test pin and the second withstand voltage test pin. [14] The testing apparatus of claim 12, wherein the plurality of relays comprise: a first relay configured to be closed in the withstand voltage test mode and connected to the first withstand voltage test pin and the second withstand voltage test pin; and a second relay configured to be open in withstand voltage test mode and connected to the DC test pin. [15] The testing apparatus of claim 12, wherein the plurality of relays comprise a cylinder relay. [16] A method for testing a power module, comprising: Attaching the power module to a test fixture; Performing a direct current (DC) test of the power module by operating the test fixture in a DC test mode; and Performing a withstand voltage test of the power module by operating the test fixture in a withstand voltage test mode, wherein the test device comprises: a first socket board having a first withstand voltage test pin, a second socket board having a second withstand voltage test pin and a DC test pin, a tester configured to generate a withstand voltage test signal and a DC test signal, and a relay configured to switch an operating mode of the test device to the DC test mode or the withstand voltage test mode, and wherein attaching the power module to the test fixture comprises contacting the power module with the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin. [17] The method of claim 16, wherein performing the DC test of the power module comprises electrically connecting the tester to the DC test pin through the relay. [18] The method of claim 16, wherein performing the withstand voltage test of the power module comprises electrically connecting the tester to the first withstand voltage test pin and the second withstand voltage test pin through the relay. [19] The method of claim 16, wherein the relay comprises a plurality of relays connected (i) between the first withstand voltage test pin and the tester, (ii) between the second withstand voltage test pin and the tester, and (iii) between the DC test pin and the tester. [20] The method of claim 19, wherein the plurality of relays comprise: a first relay configured to be closed in the DC test mode and connected to the DC test pin; a second relay configured to be open in the DC test mode and connected to the first withstand voltage test pin and the second withstand voltage test pin; a third relay configured to be closed in the withstand voltage test mode and connected to the first withstand voltage test pin and the second withstand voltage test pin; and a fourth relay configured to be open in withstand voltage test mode and connected to the DC test pin.

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