Cooling arrangement

Abstract

The invention relates to a cooling arrangement. The cooling arrangement comprises a heat sink, particularly designed for conducting fluid. The heat sink has at least two, or only two mutually opposing, heat coupling surfaces for contacting at least one power component, particularly a power semiconductor or microprocessor. The cooling arrangement also comprises two circuit carriers that sandwich the heat sink. The circuit carriers each comprise at least one power component, wherein the power component is at least indirectly thermally conductively connected to a thermal contact surface of the heat sink. The heat sink has an opening for at least one signal line. The circuit carriers are connected to one another by means of the signal line passing through the opening for signal transmission, particularly electrically and / or optically.

Description

State of the art

[0001] The invention relates to a cooling arrangement. The cooling arrangement comprises a heat sink, particularly designed for fluid conduction. The heat sink has at least two, or only two, mutually opposing heat coupling surfaces for contacting at least one power component, in particular a power semiconductor or microprocessor. The cooling arrangement also comprises two circuit carriers that sandwich the heat sink. The circuit carriers each comprise at least one power component, wherein the power component is at least indirectly thermally conductively connected to a heat contact surface of the heat sink.

[0002] From DE10 2021 202 552 A1, an inverter with a heat sink and at least two semiconductor modules is known, wherein the heat sink has two thermal contact surfaces arranged parallel to one another, wherein at least one semiconductor module is thermally conductively connected to each thermal contact surface, so that the semiconductor modules enclose the heat sink between one another. Disclosure of the invention

[0003] According to the invention, the heat sink of the cooling arrangement of the type mentioned above has an opening for at least one signal line. The circuit carriers are connected to one another by means of the signal line for signal transmission, in particular electrically and / or optically. The signal line is preferably routed through the opening.

[0004] This advantageously allows for a high packing density of the cooling arrangement, so that a power module with a cooling arrangement of the type described above can be designed to be compact and enable rapid data exchange between the circuit boards. It has been recognized that the opening in the heat sink can create a particularly short conduction path between the circuit boards, so that at least a longitudinal section of the signal line is arranged in the opening.

[0005] In a preferred embodiment of the cooling arrangement, the signal line has a detachable plug connection, wherein the circuit boards are detachably connected to one another by means of the plug connection. Advantageously, the signal line can thus be joined between the circuit boards in a cost-effective manner during assembly of the cooling arrangement.

[0006] The circuit carrier is preferably a fiber-reinforced circuit board, more preferably an epoxy resin circuit board, or a ceramic circuit carrier. The ceramic circuit carrier is preferably a ceramic substrate. The substrate is, for example, a DCB substrate (DCB = Direct Copper Bonded), an AMB substrate (AMB = Active Metal Brazed), an IMS substrate (IMS = Insulated Metal Substrate), an LTCC substrate (LTCC = Low-Temperature Cofired Ceramic), or an HTCC substrate (HTCC = High-Temperature Cofired Ceramic). Advantageously, different circuit carriers can be easily connected to one another for signal transmission using the optical coupling elements or the plug connection.

[0007] In a preferred embodiment, the plug connection is arranged in the opening. This advantageously allows for a particularly short signal line to be formed between the two circuit boards. The plug connection preferably has two plug bodies, in particular plastic bodies, designed for interconnection, in each of which an end section of the signal line is held and / or accommodated.

[0008] In another embodiment, the plug connection is arranged outside the opening. This advantageously allows only the signal line to be arranged in the opening and routed through it. Further advantageously, the opening can have a diameter that corresponds to the diameter of the signal line, or 1.2 to 2 times the diameter of the signal line.

[0009] The plug connection preferably comprises two coupling elements, in particular optical ones, which can be coupled together—in particular by permanent magnets—by joining, in particular plugging or snapping together, to create a signal connection through the plug connection. After coupling, the signal connection between the coupling elements is created. The optical coupling elements are preferably each formed by one of the plug bodies, in particular plastic bodies, in each of which an end section of an optical connecting line is held for bringing them into contact with one another.

[0010] In a preferred embodiment of the cooling arrangement, the signal line is an electrical connecting line. The plug connection is more preferably an electrical plug connection, wherein the plug connection comprises two plug bodies, in particular plastic bodies, designed for plugging or snapping together. The plug contacts of the electrical plug connection can each be received and held in the plastic bodies.

[0011] The signal line is, for example, a component of an Ethernet interface, in particular an N-Base-X interface, wherein the interface is a component of the circuit carrier. The Ethernet interface is preferably a gigabit interface designed to transmit a data stream of up to 10 gigabits per second, or more than 10 gigabits per second. The circuit carriers are preferably designed to exchange data or a control signal with each other via the interface. Advantageously, the data signal can thus be transmitted via the interface at several gigabits per second.

[0012] In a preferred embodiment, the signal line is part of a data bus that can be implemented on the circuit boards. The data bus is, for example, a LIN bus (LIN = Local Area Network) or a CAN bus (CAN = Controller Area Network).

[0013] The plug contacts of the electrical plug connection described above are designed, for example, as a plug socket and plug pin, or as a plug pin and quick-clamp contact.

[0014] In a preferred embodiment of the cooling arrangement, the signal line is an optical connection line. The optical connection line is preferably a fiber optic line or a polymer optical fiber.

[0015] In a preferred embodiment of the cooling arrangement, the circuit carriers each have an optical interface configured to generate and transmit an optical data signal representing the electrical signal in response to an electrical signal, to receive an optical data signal, and to generate an electrical data signal representing the received optical data signal in response to the received optical data signal. Advantageously, the circuit carriers can thus be connected to one another by means of a signal line, in particular an optical connecting line, routed through the heat sink for fast data transmission.

[0016] The optical interface, in particular, is preferably an SFP interface (SFP = Small Form Factor Pluggable). This advantageously enables fast data transmission between the circuit boards, which can be designed to be EMC-immune even with a large distance between the circuit boards. The optical interface is preferably designed to transmit a data stream of up to 10 gigabits per second, or more than 10 gigabits per second.

[0017] In a preferred embodiment, the heat sink has a cavity and is designed to conduct a fluid within the cavity. The fluid is, for example, water or a refrigerant designed for boiling and recondensing, in particular a hydrocarbon.

[0018] Advantageously, the circuit boards can be cooled by the heat sink in a space-saving and efficient manner.

[0019] In a preferred embodiment, the heat sink is a heat pipe, particularly designed for pulsation. The fluid of the heat pipe, which is designed for boiling and recondensing, is preferably a refrigerant, for example a hydrocarbon, especially butane, or a particularly polar refrigerant, for example water or an alcohol, especially isopropanol. Advantageously, the heat sink can thus be designed efficiently and cost-effectively.

[0020] In a preferred embodiment, the heat sink has a mounting dome for connecting to the circuit carrier. The mounting dome is preferably molded onto the heat sink.

[0021] The heat sink preferably comprises a housing body, in particular a metal body. The metal body encloses the cavity designed for fluid conduction and has a thermal contact surface on two opposing surface areas for contacting the power component.

[0022] The heat sink is preferably flat. For this purpose, a vertical dimension of the heat sink is preferably smaller than a flat dimension—in particular a width dimension and / or a length dimension—of the heat sink. This advantageously allows for a space-saving and cost-effective cooling arrangement.

[0023] In a preferred embodiment of the cooling arrangement, the heat sink has a tube in the region of the aperture, which encloses a cavity forming the aperture. The tube preferably has a cylindrical or wedge shape, so that the wedge shape minimizes flow resistance for a fluid flowing in the heat sink.

[0024] The heat sink preferably has at least one flow channel in which a fluid can be guided to cool the power components.

[0025] The invention also relates to a method for producing a cooling arrangement, in particular a cooling arrangement of the type described above. In the method, a circuit carrier is connected to a further circuit carrier signal. In the method, a part of a separable plug connection connected to the circuit carrier is preferably guided through an opening in a heat sink arranged between the circuit carriers and coupled there to another part of a plug connection connected to the further circuit carrier, so that the circuit carriers are separably signal-connected to one another through the opening. The cooling arrangement can thus advantageously be produced with low cost.

[0026] The invention will now be described below with reference to figures and further exemplary embodiments. Further advantageous embodiments will become apparent from a combination of the features described in the dependent claims and in the figures. Fig. 1 shows an embodiment of a cooling arrangement comprising a heat sink designed to conduct fluid and two circuit carriers enclosing the heat sink between each other, wherein an optical and separable signal connection between the circuit carriers is formed in an opening of the heat sink; Fig. 2 shows a variant of a cooling arrangement in which the signal connection between two circuit carriers is designed as an electrical plug connection in an opening in the heat sink; Fig. 3 shows a heat sink for one of the Fig. 1 or Fig. 2 shown cooling arrangements in a plan view, whereby the opening in the heat sink can be either circular or elliptical in cross section.

[0027] Fig. 1 shows - schematically - an embodiment of a cooling arrangement 1. The cooling arrangement 1 has a heat sink 2 and two circuit carriers, namely a circuit carrier 3 and a circuit carrier 4, wherein the circuit carriers 3 and 4 enclose the heat sink 2 between each other - in particular in the manner of a sandwich.

[0028] In this embodiment, the heat sink 2 is designed to conduct fluid and has a flat extension. The heat sink 2 encloses a cavity 22, in which, in this embodiment, a fluid 5 is accommodated.

[0029] The heat sink 2 has a vertical extension 23 that extends transversely to the flat extension of the heat sink 2. In this exemplary embodiment, the vertical extension 23 is smaller than the flat extension. The heat sink 2 has an opening 20 that is formed along the vertical extension 23 and, in this exemplary embodiment, completely penetrates the heat sink 2.

[0030] The opening 20 is designed to accommodate at least one signal line and / or a plug connection.

[0031] The cooling arrangement also includes electronic components to be cooled, each of which is connected to one of the circuit carriers and thermally coupled to the heat sink 2. In this exemplary embodiment, a power component 6, in particular a microprocessor, a microcontroller, or a power semiconductor switch, is connected to the circuit carrier 3. In this exemplary embodiment, a power component 7, in particular a microprocessor, microcontroller, and a power semiconductor switch, is connected to the circuit carrier 4.

[0032] In this exemplary embodiment, circuit carriers 3 and 4 extend parallel to each other. The power components connected to circuit carrier 3 are thermally connected to a thermal coupling surface 24 for thermally conductive coupling of the power components.

[0033] The heat sink 2 has the already mentioned heat coupling surface 24, which in this embodiment points towards the circuit carrier 3, so that the power components connected to the circuit carrier 3 can couple with their heat contact surface to the heat coupling surface.

[0034] In this exemplary embodiment, the power component 6 has a thermal contact surface 26, which is thermally conductively connected to the thermal coupling surface 24 by means of a thermally conductive agent 21, in particular a thermally conductive paste or a thermally conductive adhesive. In this way, waste heat from the power component 6 can be dissipated to the heat sink 2, and thus to a fluid, in particular a coolant or refrigerant, contained in the heat sink 2.

[0035] In this exemplary embodiment, the power component 7 has a thermal contact surface 27 which faces the thermal coupling surface 25, so that after connecting the circuit carrier 4 to the heat sink 2, the thermal contact surface 27 can couple to the thermal coupling surface 25 by means of a thermal conduction means 21.

[0036] The circuit carriers 3 and 4, which in this embodiment each form a signal processing unit, are signal-connected to one another by means of a signal line and can thus be connected to one another for signal exchange, in particular data exchange, or control signal transmission.

[0037] For this purpose, the cooling arrangement 1 has a detachable coupling connection or plug connection, wherein in this exemplary embodiment, a coupling element 10 is connected to the circuit carrier 3, and a further coupling element 11 is connected to the circuit carrier 4. The coupling elements 10 and 11 each protrude into the opening 20 after the circuit carriers 3 and 4, respectively, have been joined to the heat sink 2, and can generate a signal connection between the circuit carriers 3 and 4 there after coupling together.

[0038] In this exemplary embodiment, the circuit carrier 3 has an optical interface unit 8, in particular an optical transceiver, which is connected to the coupling element 10 by means of an optical connecting line 12. The optical connecting line 12, in particular a glass fiber or a polymer optical fiber, projects into the coupling element 10, in particular a plastic element, and faces the coupling element 11 with an end face for beam exit and / or beam reception.

[0039] In this exemplary embodiment, the coupling element 11 is connected to an optical interface unit 9 by means of an optical connecting line 13, in particular a glass fiber or polymer optical fiber. The optical interface unit 9 is connected to the circuit carrier 4, so that signals, in particular data signals or control signals, can be exchanged and / or transmitted between the circuit carriers 3 and 4 by means of the interface units 8 and 9 and the optical connecting lines 12 and 13 in the region of the aperture 20, and there by means of the interconnected coupling elements 10 and 11.

[0040] After coupling of the coupling elements 10 and 11, the end faces of the in particular fiber-optic connecting lines 12 and 13 are located opposite one another in such a way that an optical data signal generated by the interface unit 8 and sent via the optical connecting line 12 can be received by the interface unit 9 by means of the optical connecting line 13.

[0041] The optical interface unit 8 can - in reverse - receive an optical data signal generated by the optical interface 9 via the optical coupling connection formed by the coupling elements 10 and 11.

[0042] In this exemplary embodiment, the optical interfaces 8 and 9 are connected to the heat sink 2 in a thermally conductive manner, in particular by means of a heat conducting means 21, and can thus dissipate waste heat to the heat sink 2.

[0043] In this exemplary embodiment, the heat sink 2 has mounting domes formed integrally with the heat sink 2, to which the circuit carriers can be firmly connected to the heat sink on mutually facing sides of the heat sink. For this purpose, the heat sink 2 has a mounting dome 18 formed integrally with the heat sink 2, to which the circuit carrier 3 is firmly, in particular detachably, connected by means of a mounting element 16, in particular a screw or a plug-in element.

[0044] A fastening dome 19 is also connected to the heat sink 2 on the side opposite the circuit carrier 3, in particular the side with the heat coupling surface 25, which is designed for connection, in particular screw or plug connection, to the circuit carrier 4. The circuit carrier 4 can - as shown by the arrows - be connected, in particular screwed, to the heat sink 2 by means of a fastening element 17, so that after the circuit carrier 4 is connected to the heat sink 2, the thermal contact surface 27 of the power component 7 couples - by means of the thermal conductivity medium 21 - to the heat coupling surface 25 of the heat sink 2.During the connection of the circuit carrier 4 to the heat sink 2, the coupling elements 10 and 11 are also coupled to one another, in particular plug-connected or snap-connected, so that during the assembly of the circuit carrier 4 to the heat sink 2, both a thermally conductive connection between the power component 7 and the heat sink and the signal connection between the optical interfaces 8 and 9 can be created.

[0045] The coupling elements 10 and 11 are each connected to the respective circuit carrier by means of at least one fastening element, in this exemplary embodiment by means of at least one spring strut. In this exemplary embodiment, the coupling element 10 is connected to the circuit carrier 2 by means of two spring struts, in particular plug-connected, solder-connected, or adhesively connected, of which a spring strut 14 is designated by way of example. The coupling element 11 is firmly connected to the circuit carrier 4 by means of two spring struts, of which a spring strut 15 is designated by way of example.

[0046] The spring legs 14 and 15 can each be integrally formed on the coupling element 10 and 11, respectively. The spring legs 14 and 15 can each be formed by a wire, in particular a metal wire, or by a plastic element.

[0047] By means of the spring legs 14 and 15 as fastening means of the coupling elements 10 and 11 respectively to the respective circuit carriers, a tolerance compensation of the coupling connection for manufacturing tolerances can be formed.

[0048] The coupling elements 10 and 11 can each - in Fig. 1 not shown - permanent magnets, in particular ferrites, so that when the coupling elements 10 and 11 are joined together, they can attract each other and snap together.

[0049] Instead of the Fig. 1, and the optical interface 8 and the optical interface 9, the circuit carriers 3 and 4 can be separably connected to one another by means of an electrical, in particular separable, plug connection.

[0050] The power component 6, in particular a microprocessor, is electrically signal-connected to the optical interface unit 8 by means of the circuit carrier, in particular by means of conductor tracks of the circuit carrier 3. The power component 7, in particular a microprocessor, is electrically signal-connected to the optical interface 9 by means of the circuit carrier 4, in particular by means of conductor tracks connected to the circuit carrier 4. In this way, signals, in particular data signals and / or control signals, can be transmitted and / or exchanged between the power components 6 and 7, in particular the microprocessors, by means of the optical interface units 8 and 9.

[0051] The cooling arrangement 1 can be a component of a control unit for a motor vehicle, in particular an electric vehicle.

[0052] The control unit can, for example, be designed to support autonomous driving of the vehicle.

[0053] The power component 6 can, for example, be a component of a driver assistance system, in particular a lane keeping assistant, and thus form at least part of the control unit for supporting autonomous driving.

[0054] The power component 7 can be designed, for example, for signal processing of vehicle-related signals, in particular a steering angle signal generated by a steering angle sensor, and / or a control signal for the electrical drive of the vehicle.

[0055] By means of the cooling arrangement 1, different control unit components, each having a circuit carrier, can be thermally conductively coupled to the same heat sink. A signal connection between the circuit carriers can be formed in an opening in the heat sink by means of the separable interface, in particular a plug connection or coupling connection, so that signals, in particular data signals, can be exchanged between the circuit carriers through the opening.

[0056] The Fig. The opening 20 shown in Figure 1 is enclosed by a tube 28 formed in the heat sink 2. In this embodiment, the tube is filled with air, so that the coupling elements 10 and 11 are insulated from the fluid 22, in particular water or a coolant, carried in the heat sink 2.

[0057] Fig. 2 schematically shows an embodiment of a cooling arrangement 30. The cooling arrangement 30 comprises a circuit carrier 31 and a circuit carrier 32, which in this embodiment are arranged particularly parallel to one another and enclose a heat sink 33 between them. In this embodiment, the heat sink 33 is designed to conduct fluid and encloses a cavity 34 for receiving a cooling fluid. An opening 41 is formed in the heat sink 33, in which a plug connection is at least partially arranged. In this embodiment, the plug connection comprises a plug 36, which is connected to the circuit carrier 32, and a mating plug 35, which is connected to the circuit carrier 31. The plug and the mating plug each have a plug body, in particular a plastic body, in which electrical contacts are held or accommodated.In this exemplary embodiment, the mating connector 35 comprises a plurality of electrical mating contacts, of which two mating contacts 37 and 38 are shown. The plug 36 comprises a plurality of electrical plug contacts in this exemplary embodiment, of which two plug contacts 39 and 40 are shown as examples.

[0058] When joining the circuit carriers 31 and 32, the plug 36 can be inserted into the opening 41, and the mating plug 35 can be inserted from an opposite side of the heat sink 33 into the same opening 41, so that the plug 36 can be plugged into the mating plug 35 in the opening 41. In this way, electrical signals, in particular, can be transmitted and / or exchanged between the circuit carriers 31 and 32 by means of the plug connection thus created in the opening 41, using the contacts of the plug connection.

[0059] The Fig. The plug connection of the cooling arrangement 30 shown in Figure 2 can be used instead of the Fig. 1 coupling elements 10 and 11 shown in Fig. 1. For this purpose, in the variant with the electrical plug connection, the mating connector 35 is connected to the circuit carrier 3, and the connector 36 is connected to the circuit carrier 4. The optical interfaces 8 and 9 can be omitted in this embodiment.

[0060] In this way, between the circuit carriers 3 and 4 instead of the optical interfaces 8 and 9 by means of the Fig. Electrical signals are transmitted and / or exchanged via the electrical plug connection shown in Figure 2 between the power components 6 and 7.

[0061] Fig. 3 shows - schematically - an embodiment of a heat sink 50, which instead of the Fig. 1 shown heat sink 2, or instead of the heat sink 2 shown in Fig. 2. The heat sink 50 is designed to conduct a fluid 51, in particular for the fluid 51, in particular cooling water, to flow through, and has an opening 52 for signal transmission.

[0062] In the opening 52, for example, the Fig. 1 shown optical signal connection by means of the coupling elements 10 and 11, or the one in Fig. 2 can be arranged by means of the electrical plug connection comprising the mating plug 35 and the plug 36.

[0063] In this embodiment, the opening 52 is insulated from the cavity of the heat sink 50, which is designed for fluid conduction and in which the fluid 51 can be accommodated. For this purpose, the heat sink 50 has a tube 53, which in this embodiment is designed as a hollow cylinder. The cavity enclosed by the hollow cylinder 53 forms the opening 52.

[0064] In this embodiment, the aperture 52 is filled with air. In another embodiment, the aperture 52 can be sealed with a potting compound or filling compound after the coupling elements or the plug connection have been connected.

[0065] Fig. 3 also shows—shown in dashed lines—a tube 54 having an elliptical cross-section. The tube 54 can thus enclose the elliptical aperture, thus isolating the plug connection accommodated in the aperture from the fluid contained in the heat sink. In another embodiment, the aperture has a drop-shaped cross-section.

[0066] The elliptical tube 54 is oriented in the heat sink 50 such that a longitudinal extension of the elliptical tube shape is aligned in the direction of flow of a fluid stream formed by the fluid 51. In this way, the tubular opening can be designed to be aerodynamically favorable for the fluid 51.

[0067] The Fig. 3 or the pipe 53 shown in Fig. 3 shown tube 54 can be used instead of the one shown in Fig. 1 shown pipe 28 on the heat sink 2.

[0068] The heat sink 2 is designed, for example, as a hollow aluminum or copper body. The tube 28 thus forms part of a housing wall of the heat sink 2 that encloses the cavity 22. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2021 202 552 A1

[0002]

Claims

[1] Cooling arrangement (1, 30) with a heat sink (2, 31, 50) designed in particular for fluid guidance, wherein the heat sink (2, 31, 50) has two mutually repelling thermal coupling surfaces (24, 25) for contacting a power component (6, 7, 8, 9), in particular a power semiconductor or microprocessor, and the cooling arrangement (1, 30) has two circuit carriers (3, 4, 31, 32) which enclose the heat sink (2, 32, 50) between them, and the circuit carriers (3, 4, 31, 32) each have at least one power component (6, 7, 8, 9) which is at least indirectly thermally connected to a thermal contact surface (24, 25) of the heat sink (2, 31, 50), characterized by, that the heat sink (2, 31, 50) has a breakthrough (20, 41, 52) for at least one signal line (10, 11, 37, 38, 39, 40), and the circuit carriers (3, 4, 31, 32) are connected to each other by means of the signal line (10, 11, 37, 38, 39, 40) passing through the breakthrough, in particular electrically and / or optically, for signal transmission. [2] Cooling arrangement (1, 30) according to claim 1, characterized by , that the signal line (10, 11, 37, 38, 39, 40) has a separable plug connection (10, 11, 35, 36), and the circuit carriers (3, 4, 31, 32) are separably connected by means of the plug connection (10, 11, 35, 36). [3] Cooling arrangement (1, 30) according to claim 1 or 2, characterized by , that the plug connection (10, 11, 35, 36) is arranged in the opening (20, 41, 52). [4] Cooling arrangement (1, 30) according to one of the preceding claims, characterized by , that the signal line (10, 11, 35, 36) is an electrical connecting line (37, 38, 39, 40). [5] Cooling arrangement (1, 30) according to one of the preceding claims, characterized by , that the signal line (10, 11, 35, 36) is an optical connection line (12, 13). [6] Cooling arrangement (1, 30) according to claim 5, characterized by , that the circuit carriers (3, 4) each have an optical interface (8, 9) which is configured to generate and transmit an optical data signal representing the electrical signal depending on an electrical signal and to receive an optical data signal and to generate an electrical data signal representing the received optical data signal depending on the received optical data signal. [7] Cooling arrangement (1, 30) according to one of the preceding claims, characterized by , that the heat sink (2, 31, 50) has a cavity (22) and is designed to carry a fluid (5) in the cavity. [8] Cooling arrangement (1, 30) according to one of the preceding claims, characterized by , that the heat sink (2, 31, 50) is a heat pipe specifically designed for pulsing. [9] Cooling arrangement (1, 30) according to one of the preceding claims, characterized by , that the heat sink (2, 31, 50) has a mounting dome for connecting to the circuit carrier. [10] Method for generating a cooling arrangement (1, 30), in particular a cooling arrangement (1, 30) according to one of the preceding claims, in which a circuit carrier (3, 4, 31, 32) is signal-connected to a further circuit carrier (3, 4, 31, 32), wherein a part of a separably designed plug connection (10, 11, 35, 36) connected to the circuit carrier (3, 4, 31, 32) is guided through an opening (20, 41, 52) in a heat sink (2, 31, 50) arranged between the circuit carriers (3, 4, 31, 32) and is coupled there to a further part of a plug connection (10, 11, 35, 36) connected to the further circuit carrier (3, 4, 31, 32), so that the circuit carriers (3, 4, 31, 32) are interconnected by signals that can be separated through the breakthrough (20, 41, 52).

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