Method for manufacturing a heat sink device and heat sink assembly

Abstract

A method for manufacturing a heat sink device (1) with a heat sink base plate (3) and a plurality of pin sections is presented and described, the method comprising the following steps: providing the heat sink base plate (3) with a plurality of holes, providing a plurality of solder sections, providing the plurality of pin sections, wherein each pin section (5) of the plurality of pin sections extends from a first end section (7) along a direction of extension (9) to a second end section (11), placing the plurality of solder sections into the plurality of holes such that a corresponding solder section (15) of the plurality of solder sections is arranged in each hole (13) of the plurality of holes, placing the plurality of pin sections into the plurality of holes,that in each bore (13) of the plurality of bores a corresponding pin section (5) of the plurality of pin sections is arranged such that each pin section (5) is in contact with the first end section (7) with a corresponding solder section (15), heating the plurality of solder sections so that each solder section (15) of the plurality of solder sections is liquefied, and cooling the plurality of solder sections so that each solder section (15) of the plurality of solder sections is solidified. A cooling sink device (1) is also shown and described.

Description

[0001] The present invention relates to a method for manufacturing a heat sink device and a heat sink device itself. Methods for manufacturing heat sink devices are known from the prior art.

[0002] In general, it is desirable for methods to manufacture heat sink devices that a heat sink device can be manufactured with a simply constructed tool and in a particularly material-saving manner.

[0003] It is therefore the object of the present invention that a cooling sink device can be manufactured with a simply constructed tool and in a particularly material-saving manner.

[0004] According to a first aspect of the invention, the aforementioned problem is solved by a method with the features of claim 1. The method is provided for manufacturing a heat sink device with a heat sink base plate and a plurality of pin sections. The method comprises the following steps: providing the heat sink base plate with a plurality of holes; providing a plurality of solder sections; providing the plurality of pin sections, wherein each pin section of the plurality of pin sections extends from a first end section along a direction of extension to a second end section; placing the plurality of solder sections into the plurality of holes such that a corresponding solder section of the plurality of solder sections is arranged in each hole of the plurality of holes;Moving the plurality of pin sections into the plurality of bores such that in each bore of the plurality of bores a corresponding pin section of the plurality of pin sections is arranged such that each pin section is in contact with a corresponding solder section at its first end; heating the plurality of solder sections so that each solder section of the plurality of solder sections is liquefied; and cooling the plurality of solder sections so that each solder section of the plurality of solder sections is solidified.

[0005] For the purposes of the invention, a solder section is understood to be a section onto which a solder, in particular a solder paste, has been applied.

[0006] The pins of the numerous pin sections preferably each have a uniform solder gap at their respective pin sections. This solder gap facilitates the use of a template. Without a gap, the pins could simply be positioned by inserting them into the holes.

[0007] As previously described, the method is for manufacturing a heat sink device comprising a heat sink base plate and a plurality of pin sections. The heat sink device is preferably used for high-performance electronics in electric and hybrid vehicles, which generate considerable waste heat, particularly when converting direct current from the battery into three-phase alternating current. This waste heat must be dissipated effectively. The waste heat can initially be conducted into the heat sink base plate of the device, then transferred via conduction to the plurality of pin sections, and finally by convection into a suitable cooling medium. The plurality of pin sections ensures that the surface area for heat dissipation is as large as possible, enabling particularly time-efficient heat transfer to the cooling medium.Preferably, the heat sink device is a prototype. Each pin section of the plurality of pin sections can also be referred to as a pin. Preferably, each pin section of the plurality of pin sections is cylindrical. The cylindrical shape of each pin section ensures that each pin section can be easily inserted into a corresponding bore in the heat sink base plate and that a particularly robust mechanical connection can be established between each pin section and the heat sink base plate using a corresponding solder section.

[0008] As previously described, the heat sink base plate is provided with a plurality of holes. This plurality of holes ensures that the heat sink base plate provides holes capable of accommodating the plurality of solder sections and the plurality of pin sections. Preferably, each hole in the plurality of holes is a blind hole. When each hole in the plurality of holes is a blind hole, it is ensured that each hole is bounded by a corresponding surface of a corresponding base section of the heat sink base plate, with the surface facing in the direction of extension of the corresponding hole and providing a bearing surface for both the corresponding solder section and the corresponding pin section.This contact surface significantly simplifies the insertion of the corresponding solder section and pin section into the corresponding bore. Preferably, the heat sink base plate is made of copper, thus providing particularly good thermal conductivity. Alternatively, preferably, the heat sink base plate is made of aluminum, which also provides good thermal conductivity.

[0009] As previously described, a plurality of solder sections is provided. Preferably, each solder section of the plurality of solder sections is a copper-phosphorus solder containing silver, thus ensuring high thermal conductivity between the heat sink base plate and each pin section. A copper-phosphorus solder containing silver is preferably a solder comprising copper, phosphorus, and silver. Preferably, each solder section of the plurality of solder sections has a liquidus temperature greater than 450 °C. The operating temperature of each solder section of the plurality of solder sections is preferably between -55 °C and +150 °C without any loss of strength in the respective solder section. Each solder section is preferably a hard solder. This embodiment is particularly suitable in conjunction with a copper heat sink base plate.

[0010] Alternatively, aluminum-silicon solders are preferably used for a heat sink base plate made of aluminum.

[0011] As previously described, a plurality of pin sections is provided, with each pin section extending from the first end section along the direction of extension to the second end section. Preferably, each pin section is made of copper, providing particularly good thermal conductivity. Alternatively, preferably, each pin section is made of aluminum, also providing good thermal conductivity. Preferably, each pin section is produced by, in particular, automated, cutting of the pin sections from copper bars, preferably on a bar turning machine or by shear cutting.

[0012] As previously described, the multitude of solder sections is placed into the multitude of bores, such that a corresponding solder section is arranged in each bore of the multitude of bores. By placing the multitude of solder sections into the multitude of bores, such that a corresponding solder section is arranged in each bore of the multitude of bores, it is ensured that the previously described multitude of pin sections can be placed into the multitude of bores in such a way that a corresponding pin section is arranged in each bore of the multitude of bores, such that each pin section is in contact with a corresponding solder section at its first end section.

[0013] As already described, the multitude of pin sections is placed into the multitude of bores in such a way that in each bore of the multitude of bores a corresponding pin section of the multitude of pin sections is arranged so that each pin section is in contact with the first end section with the corresponding solder section.

[0014] Here, the solder gap also plays a role. When the solder melts, it rises advantageously through capillary action up the solder gap, creating a bond across the entire insertion depth of the pin, which in turn promotes good strength and heat transfer. It is beneficial that not only the base of the pin is bonded.

[0015] By positioning the multitude of pin sections in the multitude of bores such that a corresponding pin section is arranged in each bore of the multitude of bores such that each pin section is in contact with a corresponding solder section at its first end section, it is ensured that the multitude of pin sections, in a connected state in which the multitude of pin sections are connected to the heat sink base plate after heating and subsequent cooling, extends from the multitude of bores such that each pin section extends with its second end section beyond a surface of the heat sink base plate in the direction of the corresponding extension.so that, with the help of the second end section, the aforementioned waste heat can be dissipated particularly efficiently into the corresponding cooling medium.

[0016] As previously described, the multitude of solder sections is heated until each section liquefies, and then cooled until each section solidifies. This heating process ensures that each pin section and the heat sink base plate can be joined using the solder sections. This joining of each pin section to the heat sink base plate can also be called soldering, specifically brazing.Preferably, the heat sink base plate, the plurality of solder sections, and the plurality of pin sections are placed in a heated chamber of an oven to heat the plurality of solder sections, the chamber being heated to a temperature such that each solder section of the plurality of solder sections is heated. Preferably, the heat sink base plate, the plurality of solder sections, and the plurality of pin sections are removed from the heated chamber of the oven to cool the plurality of solder sections.The process of placing the heat sink base plate, the multitude of solder sections, and the multitude of pin sections into a heated chamber of an oven to heat the multitude of solder sections, the chamber being heated to a temperature such that each solder section of the multitude of solder sections is heated, and the process of removing the heat sink base plate, the multitude of solder sections, and the multitude of pin sections from the heated chamber of the oven to cool the multitude of solder sections, can also be referred to as furnace brazing.

[0017] In particular, the method according to the invention is advantageous compared to methods in which pins are produced by extrusion and a base plate is subsequently milled to a final contour, because such methods, especially extrusion, require the production of complex tools and have particularly long cycle times. Therefore, the present invention is especially advantageous for early functional prototypes that do not need to be manufactured according to a series production process, due to lower tooling costs and shorter tool cycle times.Furthermore, the method according to the invention is particularly advantageous compared to methods in which heat sink devices are milled from a solid blank, especially when the individual pins are also milled from the blank, because the material usage can be significantly reduced with the present invention. For example, the blank volume can be significantly reduced due to a lower blank height. In one example, the blank height was reduced from 15 mm to 8 mm.

[0018] In summary, it can be stated that the present invention makes it possible to manufacture a cooling sink device with a simply constructed tool and in a particularly material-saving manner.

[0019] In one embodiment, the heat sink base plate extends along a principal extension plane, and the holes of the plurality of holes are provided in the heat sink base plate such that each hole of the plurality of holes extends perpendicular to the principal extension plane. By extending the heat sink base plate along the principal extension plane and providing the holes of the plurality of holes in the heat sink base plate such that each hole of the plurality of holes extends perpendicular to the principal extension plane, it is ensured that each pin segment of the plurality of pin segments, when the extension direction of the corresponding pin segment is along the extension direction of the corresponding hole, extends perpendicular to the principal extension plane.It has been found that when each pin section of the multitude of pin sections extends perpendicular to the main extension plane of the heat sink base plate, the waste heat from the multitude of pin sections can be dissipated particularly effectively into the corresponding cooling medium.

[0020] In principle, this method also allows the heat sink base plate to be drilled at an angle and the pins to be inserted at a corresponding angle. With the same overall height, a greater pin length and thus a larger heat transfer surface can be achieved. These advantages are not readily attainable with the previously known methods of extrusion and machining from solid material.

[0021] In one embodiment, the plurality of pin sections is placed in the plurality of bores such that the direction of extension of each pin section is perpendicular to the principal extension plane. By placing the plurality of pin sections in the plurality of bores in such a way that the direction of extension of each pin section is perpendicular to the principal extension plane, it is ensured that when the plurality of pin sections are held in position during the heating and subsequent cooling of the plurality of solder sections, the plurality of pin sections, even in the connected state, are arranged in the plurality of bores such that the direction of extension of each pin section is perpendicular to the principal extension plane.If the multitude of pin sections in the connected state are arranged in the multitude of bores in such a way that the extension direction of each pin section is arranged perpendicular to the main extension plane, it is ensured that the aforementioned waste heat can be dissipated particularly efficiently into the corresponding cooling medium.

[0022] In one embodiment, the pin sections of the plurality of pin sections are connected to one another by means of a support structure. Connecting the pin sections of the plurality of pin sections to one another using the support structure ensures that the pin sections can be optimally positioned relative to each other. Preferably, the pin sections of the plurality of pin sections are connected to one another using the support structure before the plurality of pin sections are placed into the plurality of bores such that a corresponding pin section of the plurality of pin sections is arranged in each bore such that each pin section is in contact with a corresponding solder section at its first end section.By connecting the pin sections of the multitude of pin sections with the help of the support structure, it is ensured that the pin sections are optimally positioned relative to each other in order to be inserted into the multitude of bores.

[0023] The support structure can be removed after the soldering process, for example by machining.

[0024] In one embodiment, each pin segment of the plurality of pin segments is placed in a template device before the plurality of pin segments are placed into the plurality of holes. By placing each pin segment of the plurality of pin segments into the template device before the plurality of pin segments are placed into the plurality of holes, it is ensured that the pin segments of the plurality of pin segments are already positioned relative to each other before the plurality of pin segments are placed into the plurality of holes, which significantly simplifies the insertion of the plurality of pin segments into the plurality of holes. Preferably, the template device has a plurality of holes, with one pin segment of the plurality of pin segments being placed into each hole of the plurality of holes in the template device.The stencil assembly, with its multitude of bores, provides a particularly simple device for optimally positioning the pin sections relative to each other. These pin sections are then inserted into the bores of the heat sink base plate. Each bore of the stencil assembly is preferably a through bore. This through bore allows each pin section to be inserted into the stencil assembly from either a first side or a second side opposite the first, making the assembly particularly flexible. A stencil assembly with blind bores is also conceivable and preferred.Each pin section of the multitude of pin sections is preferably inserted into the template device, which can also be called a template, for later positioning of the template device on the heat sink base plate, which can also be called a base plate.

[0025] In one embodiment, the heat sink base plate is positioned relative to a receiving device such that a first contact surface of the heat sink base plate abuts a contact surface of the receiving device. By positioning the heat sink base plate relative to the receiving device in such a way that the first contact surface of the heat sink base plate abuts a contact surface of the receiving device, it is ensured that the heat sink base plate and the receiving device are optimally arranged relative to each other in a corresponding position predefined by the contact surfaces.

[0026] In one embodiment, the heat sink base plate is positioned relative to an alignment device connected to the receiving device such that a second contact surface of the heat sink base plate rests against a contact surface of the alignment device. By positioning the heat sink base plate relative to the alignment device connected to the receiving device in such a way that the second contact surface of the heat sink base plate rests against the contact surface of the alignment device, it is ensured that the heat sink base plate and the alignment device are optimally arranged relative to each other in a corresponding position predefined by the contact surfaces. Preferably, the alignment device has one or more alignment elements, wherein the alignment element or each of the multiple alignment elements is preferably connected to the receiving device.The alignment element, or each alignment element of the multiple alignment elements, is preferably arranged such that it provides a contact surface section of the alignment device extending along a plane perpendicular to a principal extension plane of the heat sink base plate. The heat sink base plate can be optimally positioned relative to the contact surface of the alignment device using the alignment device. Preferably, each alignment element is a bolt, ensuring a particularly simple design.

[0027] In one embodiment, each pin segment of the plurality of pin segments is first placed into the stencil device, and then the stencil device is connected to the receiving device. By first placing each pin segment of the plurality of pin segments into the stencil device and then connecting the stencil device to the receiving device, it is ensured that, once each pin segment of the plurality of pin segments has been placed into the stencil device, the stencil device can be aligned with the heat sink base plate in a particularly time-efficient manner. This ensures that the pin segments are optimally positioned for placing each pin segment into a corresponding bore in the heat sink base plate, especially with regard to a uniform solder gap.

[0028] In one embodiment, the template device is first connected to the receiving device, and then each pin segment of the plurality of pin segments is placed into the template device. By first connecting the template device to the receiving device and then placing each pin segment of the plurality of pin segments into the template device, it is ensured that, for example, the template device can first be connected to the receiving device, then each pin segment of the plurality of pin segments can be placed into the template device, and then the heat sink base plate can be positioned relative to the receiving device such that the first contact surface of the heat sink base plate rests against the contact surface of the receiving device.

[0029] According to a second aspect of the invention, the aforementioned problem is solved by a heat sink device with the features of claim 10. The heat sink device comprises a heat sink base plate and a plurality of pin sections. The heat sink device is manufactured using a method according to the first aspect. In particular, the heat sink device can be manufactured with a simply constructed tool and in a particularly material-saving manner. The features, technical effects, and / or advantages described in connection with the method according to the first aspect of the invention also apply, at least analogously, to the heat sink device according to the second aspect of the invention, so that a corresponding repetition is omitted here.Likewise, the features, technical effects and / or advantages described in connection with the cooling device according to the second aspect of the invention also apply, at least analogously, to the method according to the first aspect of the invention, so that a corresponding repetition is omitted here.

[0030] Even though the process steps are described in a specific sequence, the present invention is not limited to this sequence. Rather, the individual process steps can be carried out in any meaningful order, and in particular, at least partially in parallel with one another.

[0031] Further features, advantages, and applications of the present invention will become apparent from the following description of the exemplary embodiments and the figures. All features described and / or illustrated, individually and in any combination, constitute the subject matter of the invention, irrespective of their composition in the individual claims or their cross-references. In the figures, the same reference numerals denote identical or similar objects. Fig. 1, Fig. 2 and Fig. Figure 3 each shows a schematic representation of a section of a first embodiment of a heat sink device according to the invention. Fig. Figure 4 shows a schematic representation of a section of a second embodiment of the cooling sink device according to the invention. Fig. Figure 5 shows a schematic representation of a section of a third embodiment of the cooling sink device according to the invention, and Fig. Figure 6 shows a schematic representation of an embodiment of a method according to the invention.

[0032] Fig. 1, Fig. 2 and Fig. Figures 3 each show a schematic representation of a section of a first embodiment of a cooling sink device 1 according to the invention. Fig. Figure 4 shows a schematic representation of a section of a second embodiment of the cooling sink device 1 according to the invention. Fig. Figure 5 shows a schematic representation of a section of a third embodiment of the cooling sink device 1 according to the invention, and Fig. Figure 6 shows a schematic representation of an embodiment of a method according to the invention.

[0033] The heat sink device 1 comprises a heat sink base plate 3 and a plurality of pin sections. Each pin section 5 of the plurality of pin sections extends from a first end section 7 along a direction of extension 9 to a second end section 11. The heat sink base plate 3 has a plurality of holes. In each hole 13 of the plurality of holes, a corresponding solder section 15 of a plurality of solder sections is arranged. In each hole 13 of the plurality of holes, a corresponding pin section 5 of the plurality of pin sections is arranged such that each pin section 5 is in contact with the first end section 7 by means of a corresponding solder section 15. The plurality of pin sections is connected to the heat sink base plate 3 by means of the plurality of solder sections. The heat sink base plate 3 extends along a principal plane of extension.Each bore 13 of the plurality of bores extends perpendicular to the principal extension plane. The extension direction 9 of each pin section 5 is arranged perpendicular to the principal extension plane.

[0034] High-performance electronics in electric and hybrid vehicles generate considerable waste heat, especially when converting direct current from the battery into three-phase alternating current. This heat must be dissipated effectively. The waste heat can initially be transferred via thermal conduction to the heat sink base plate 3 of the heat sink device 1, from there via thermal conduction to the multiple pin sections of the heat sink device 1, and from there via convection into a suitable cooling medium. The multiple pin sections of the heat sink device 1 ensure that the surface area for heat dissipation is as large as possible, allowing the waste heat to be transferred to the cooling medium with maximum efficiency.

[0035] The in Fig. 6. Schematically illustrated embodiment of the method according to the invention is for producing the in the Fig. 1, Fig. 2 and Fig. Figure 3 schematically illustrates the first embodiment of the cooling sink device 1 according to the invention, comprising the cooling sink base plate 3 and the plurality of pin sections. Correspondingly, alternative embodiments of the method according to the invention are used to produce the... Fig. 4 schematically illustrated section by section second embodiment of the cooling sink device 1 according to the invention and for producing the in Fig. 5 section by section schematically depicted third embodiment of the cooling sink device 1 according to the invention, wherein the embodiments of the method according to the invention and the embodiments of the cooling sinks according to the invention are the same, unless differences are explicitly pointed out.

[0036] At the in Fig. In the schematically illustrated embodiment of the method according to the invention, the heat sink base plate 3 with the plurality of bores is provided in a first process step 101. By providing the heat sink base plate 3 with the plurality of bores in the first process step 101, it is ensured that bores are provided in the heat sink base plate 3 that can accommodate the aforementioned plurality of solder sections and the aforementioned plurality of pin sections. Each bore 13 of the plurality of bores is a blind hole.Because each bore 13 of the plurality of bores is a blind hole, it is ensured that each bore 13 is bounded by a corresponding surface of a corresponding base section of the heat sink base plate 3, the surface facing in the direction of extension of the corresponding bore 13 and providing a bearing surface for both the corresponding solder section 15 and the corresponding pin section 5. This bearing surface significantly simplifies the insertion of the corresponding solder section 15 and the corresponding pin section 5 into the corresponding bore 13. The heat sink base plate 3 is made of copper, thus providing particularly good thermal conductivity.

[0037] As previously described, the heat sink base plate 3 extends along the main extension plane. The multiple holes are arranged in the heat sink base plate 3 such that each hole 13 of the multiple holes extends perpendicular to the main extension plane. By arranging the multiple holes in the heat sink base plate 3 such that each hole 13 of the multiple holes extends perpendicular to the main extension plane, it is ensured that each pin section 5 of the multiple pin sections, when the extension direction 9 of the corresponding pin section 5 runs along the extension direction of the corresponding hole 13, extends perpendicular to the main extension plane.It has been found that when each pin section 5 of the plurality of pin sections extends perpendicular to the main extension plane of the heat sink base plate 3, the waste heat from the plurality of pin sections can be dissipated particularly effectively into the corresponding cooling medium.

[0038] The heat sink base plate 3 is positioned relative to a receiving device 17 such that a first contact surface of the heat sink base plate 3 abuts a contact surface of the receiving device 17. By positioning the heat sink base plate 3 relative to the receiving device 17 in such a way that the first contact surface of the heat sink base plate 3 abuts a contact surface of the receiving device 17, it is ensured that the heat sink base plate 3 and the receiving device 17 are optimally arranged relative to each other in a corresponding position predefined by the contact surfaces. Furthermore, the heat sink base plate 3 is positioned relative to an alignment device 19 connected to the receiving device 17 such that a second contact surface of the heat sink base plate 3 abuts a contact surface of the alignment device 19.By positioning the heat sink base plate 3 relative to the alignment device 19 connected to the receiving device 17 such that the second contact surface of the heat sink base plate 3 rests against the contact surface of the alignment device 19, it is ensured that the heat sink base plate 3 and the alignment device 19 are optimally arranged relative to each other in a corresponding position predefined by the contact surfaces. The alignment device 19 has four alignment elements connected to the receiving device 17. The four alignment elements are arranged such that two alignment elements of each of the four alignment elements provide contact surface sections of the contact surface of the alignment device 19 extending along a plane perpendicular to the main extension plane.A first alignment element of the four alignment elements has a first contact surface section of the contact surface of the alignment device 19, a second alignment element of the four alignment elements has a second contact surface section of the contact surface of the alignment device 19, a third alignment element of the four alignment elements has a third contact surface section of the contact surface of the alignment device 19, and a fourth alignment element of the four alignment elements has a fourth contact surface section of the contact surface of the alignment device 19. The first contact surface section and the second contact surface section extend along a first plane. The third contact surface section and the fourth contact surface section extend along a second plane. Both the first plane and the second plane are perpendicular to the main extension plane, and the first plane is perpendicular to the second plane.The heat sink base plate 3 can be optimally positioned relative to the first and second levels using the alignment device 19. Each alignment element is a bolt, ensuring particularly simple assembly.

[0039] Furthermore, in the first process step 101, the plurality of solder sections is provided. Each solder section 15 of the plurality of solder sections is a copper-phosphorus solder with a silver content, thus providing high thermal conductivity between the heat sink base plate 3 and each pin section 5. A copper-phosphorus solder with a silver content is a solder that contains copper, phosphorus, and silver. Each solder section 15 of the plurality of solder sections has a liquidus temperature greater than 450 °C. The operating temperature of each solder section 15 of the plurality of solder sections is between -55 °C and +150 °C without any loss of strength of the corresponding solder section 15. Each solder section 15 is a hard solder. Furthermore, in the first process step 101, the plurality of pin sections is provided.Each pin section 5 of the plurality of pin sections is made of copper, so that the pin sections also provide particularly good thermal conductivity. Each pin section 5 of the plurality of pin sections is produced by, in particular, automated, cutting of the pin sections from copper bars, preferably on a bar turning machine or by shear cutting. As already described, each pin section 5 of the plurality of pin sections extends from the first end section 7 along the corresponding extension direction 9 to the second end section 11.

[0040] Furthermore, at the in Fig. In a second process step 102, as shown schematically in Figure 6, the previously described plurality of solder sections is placed into the plurality of bores, such that a corresponding solder section 15 of the plurality of solder sections is arranged in each bore 13 of the plurality of bores. By placing the plurality of solder sections into the plurality of bores, such that a corresponding solder section 15 of the plurality of solder sections is arranged in each bore 13 of the plurality of bores, it is ensured that the previously described plurality of pin sections can subsequently be placed into the plurality of bores in such a way that a corresponding pin section 5 of the plurality of pin sections is arranged in each bore 13 of the plurality of bores, such that each pin section 5 is in contact with the first end section 7 with a corresponding solder section 15.

[0041] At the in Fig. In a third process step 103, as schematically illustrated in Figure 6, the already described plurality of pin sections is placed into the plurality of bores such that a corresponding pin section 5 of the plurality of pin sections is arranged in each bore 13 of the plurality of bores such that each pin section 5 is in contact with the first end section 7 and a corresponding solder section 15. By placing the plurality of pin sections into the plurality of bores such that a corresponding pin section 5 of the plurality of pin sections is arranged in each bore 13 of the plurality of bores such that each pin section 5 is in contact with the first end section 7 and a corresponding solder section 15, it is ensured that the plurality of pin sections are in a connected state.in which the plurality of pin sections, after heating and subsequent cooling, are connected to the heat sink base plate 3, extend from the plurality of bores such that each pin section 5 of the plurality of pin sections extends with its second end section 11 beyond a surface 21 of the heat sink base plate 3 extending parallel to the main extension plane in the direction of the corresponding extension direction 9, so that the aforementioned waste heat can be dissipated particularly efficiently into the corresponding cooling medium by means of the second end section 11. The plurality of pin sections are placed in the plurality of bores such that the extension direction 9 of each pin section 5 is arranged perpendicular to the main extension plane. By placing the plurality of pin sections in the plurality of bores in this way,By ensuring that the extension direction 9 of each pin section 5 is arranged perpendicular to the main extension plane, it is ensured that when the plurality of pin sections are held in position during the heating and subsequent cooling of the plurality of solder sections, the plurality of pin sections are also arranged in the plurality of bores in the connected state such that the extension direction 9 of each pin section 5 is arranged perpendicular to the main extension plane. When the plurality of pin sections are arranged in the connected state in the plurality of bores such that the extension direction 9 of each pin section 5 is arranged perpendicular to the main extension plane, it is ensured that the aforementioned waste heat can be dissipated particularly efficiently into the corresponding cooling medium. Fig. Figure 2 shows the multitude of pin sections inserted into the multitude of holes. Fig. Figure 3 also shows the multitude of pin sections being inserted into the multitude of holes, and in addition, for each hole 13 of the multitude of holes, a corresponding solder section 15 being inserted into the hole 13 is shown.

[0042] Both in Fig. 6 schematically illustrated embodiment of the inventive method for producing the in the Fig. 1, Fig. 2 and Fig. 3 schematically illustrated first embodiment of the cooling sink device 1 according to the invention as well as in one that is related to the in Fig. 6 schematically illustrated embodiment of the method according to the invention alternative embodiment of the method according to the invention for producing the in Fig. In the schematically illustrated second embodiment of the cooling sink device 1 according to the invention, each pin section 5 of the plurality of pin sections is placed in a template device 23 before the plurality of pin sections are placed in the plurality of bores. By placing each pin section 5 of the plurality of pin sections in the template device 23 before the plurality of pin sections are placed in the plurality of bores, it is ensured that the pin sections of the plurality of pin sections are already positioned relative to each other before the plurality of pin sections are placed in the plurality of bores, which significantly simplifies the insertion of the plurality of pin sections into the plurality of bores.Each pin section 5 of the plurality of pin sections is inserted into the template device 23, which can also be referred to as a template, for subsequent positioning of the template device 23 on the heat sink base plate 3, which can also be referred to as a base plate. The template device 23 has a plurality of bores, and one pin section 5 of the plurality of pin sections is inserted into each bore of the plurality of bores of the template device 23. The plurality of bores of the template device 23 provides a particularly simple device with which the pin sections of the plurality of pin sections can be optimally positioned relative to each other in order to then insert the pin sections into the bores of the plurality of bores of the heat sink base plate 3. Each bore of the plurality of bores of the template device 23 is a through bore.The through-hole makes it possible to bring each pin section 5 of the plurality of pin sections into the template device 23 from both a first side of the template device 23 and from a second side of the template device 23 opposite the first side.

[0043] Both in Fig. 6 schematically illustrated embodiment of the inventive method for producing the in the Fig. 1, Fig. 2 and Fig. 3 schematically illustrated first embodiment of the cooling sink device 1 according to the invention as well as in one that is related to the in Fig. 6 schematically illustrated embodiment of the method according to the invention alternative embodiment of the method according to the invention for producing the in Fig. In the schematically illustrated second embodiment of the heat sink device 1 according to the invention, each pin section 5 of the plurality of pin sections is first placed into the template device 23, and then the template device 23 is connected to the receiving device 17. By first placing each pin section 5 of the plurality of pin sections into the template device 23 and then connecting the template device 23 to the receiving device 17, it is ensured that, once each pin section 5 of the plurality of pin sections has been placed into the template device 23, the template device 23 can be aligned with the heat sink base plate 3 in a particularly time-efficient manner, so that the pin sections are optimally positioned for placing each pin section 5 into a corresponding bore 13 in the heat sink base plate 3.In an alternative embodiment of the method according to the invention, the template device 23 is first connected to the receiving device 17, and then each pin section 5 of the plurality of pin sections is placed into the template device 23. For example, the template device 23 can first be connected to the receiving device 17, then each pin section 5 of the plurality of pin sections is placed into the template device 23, and then the heat sink base plate 3 is positioned relative to the receiving device 17 such that the first contact surface of the heat sink base plate 3 rests against the contact surface of the receiving device 17.

[0044] In one of the Fig. In the schematically illustrated embodiment of the method according to the invention, the pin sections of the plurality of pin sections are connected using a Fig. The multiple pin sections are interconnected by a schematically represented support structure 25 before the multiple pin sections are placed into the multiple bores in the third process step 103 such that a corresponding pin section 5 of the multiple pin sections is arranged in each bore 13 of the multiple bores such that each pin section 5 is in contact with the first end section 7 with a corresponding solder section 15. Connecting the pin sections of the multiple pin sections with the help of the support structure 25 ensures that the pin sections are optimally positioned relative to each other for placement into the multiple bores in the third process step 103. Initially, each pin section 5 of the multiple pin sections, together with the support structure 25, is manufactured in one piece by selective laser melting (metallic 3D printing based on powder).Using the unit thus produced, the pin sections can be handled like a single component and inserted accordingly into the bores of the heat sink base plate 3. The structure, printed by selective laser melting, can also include auxiliary elements for aligning the multitude of pin sections relative to the heat sink base plate 3 and / or the receiving device 17 and / or the template device 23.

[0045] Furthermore, at the in Fig. In a schematically illustrated embodiment of the method according to the invention, in a fourth process step 104, the plurality of solder sections is heated such that each solder section 15 of the plurality of solder sections is liquefied. Furthermore, in the Fig. In the schematic embodiment of the method according to the invention, shown in Figure 6, the plurality of solder sections is cooled in a fifth process step 105 such that each solder section 15 of the plurality of solder sections is solidified. By heating the plurality of solder sections in the fourth process step 104 so that each solder section 15 of the plurality of solder sections is liquefied, and by cooling the plurality of solder sections in the fifth process step 105 so that each solder section 15 of the plurality of solder sections is solidified, it is ensured that each pin section 5 of the plurality of pin sections and the heat sink base plate 3 are connected to each other by means of the solder sections. The connecting of each pin section 5 of the plurality of pin sections and the heat sink base plate 3 by means of the solder sections can also be referred to as soldering, in particular as brazing.In particular, the method according to the invention is advantageous compared to methods in which pins are produced by extrusion and a base plate is subsequently brought into a final contour by milling, because in particular in extrusion, complex tools have to be produced and the cycle times of these tools are particularly long.Furthermore, the method according to the invention is particularly advantageous compared to methods in which heat sink devices are milled from a solid blank, especially when the individual pins are also milled from the blank, because the material usage can be significantly reduced with the present invention. For example, the blank volume can be significantly reduced with the present invention due to a lower blank height 27. In one example, the blank height 27 could be reduced from 15 mm to 8 mm.

[0046] To manufacture the heat sink base plate 3, a blank is first provided. The blank is machined on a first side, which can also be referred to as the bottom, and on a second side opposite the first side, which can also be referred to as the top, using milling to produce the heat sink base plate 3. The blank height 27 is 8 mm in the first embodiment. Each bore 13 of the plurality of bores in the heat sink base plate 3 is then produced by drilling. The depth of each bore 13 corresponds to the diameter of the pin section 5 provided for the corresponding bore. The bore diameter is selected such that a solder gap of 0.1 to 0.2 mm is ensured around each pin section 5. The dimensions of the blank and of the heat sink base plate 3 produced by milling and drilling are shown in Fig. 1 shown.

[0047] Before the plurality of solder segments is placed into the plurality of holes, the sections of the heat sink base plate 3 that define at least one section of a corresponding hole 13 and that will come into contact with the corresponding solder segment 15 are cleaned. Each of these sections can also be referred to as a solder joint. The subsequent placement of the plurality of solder segments into the plurality of holes, such that a corresponding solder segment 15 is arranged in each hole 13 of the plurality of holes, can also be referred to as applying the solder into each hole 13.

[0048] As already described, the heat sink base plate 3 can be optimally positioned using the alignment device 19. Likewise, the template device 23 can be optimally positioned relative to the heat sink base plate 3 using the alignment device 19, so that when the template device 23 is optimally positioned relative to the heat sink base plate 3 using the alignment device 19, the multitude of pin sections are placed into the multitude of holes.

[0049] As already described, in the fourth process step 104, the plurality of solder sections is heated so that each solder section 15 of the plurality of solder sections is liquefied. For this purpose, the heat sink base plate 3, the plurality of solder sections, and the plurality of pin sections are placed in a heatable chamber of an oven, the chamber being heated to a temperature of 650 to 700 °C, so that each solder section 15 of the plurality of solder sections is heated. To prevent oxide formation, a protective gas is provided in the oven, which surrounds each solder section 15 during heating.

[0050] As already described, in the fifth process step 105 the plurality of solder sections is cooled so that each solder section 15 of the plurality of solder sections is solidified. For this purpose, the cooling sink base plate 3, the plurality of solder sections and the plurality of pin sections are removed from the heated chamber of the oven and cooled in air.

[0051] In the Fig. Figure 4 shows by way of example that the template device 23 can be attached to the receiving device 17 by means of two screws. Each screw 29 of the two screws extends through a bore in the template device 23 and engages with the receiving device 17. For this purpose, the template device 23 has a first fastening section 31 and a second fastening section 33, which are located in the Fig. In the assembled state shown in Figure 4, the first mounting section 31 and the second mounting section 33 are arranged on sides of the template assembly 23 opposite the main extension direction of the heat sink base plate 3. Both the first mounting section 31 and the second mounting section 33 have a corresponding bore through which one of the two screws extends. Because the first mounting section 31 and the second mounting section 33 are arranged on sides of the template assembly 23 opposite the main extension direction of the heat sink base plate 3 in the assembled state, a particularly robust mechanical connection is provided between the template assembly 23 and the receiving device 17, so that even during the heating and cooling in the oven described above, each pin section 5 can be held in its optimal position.Furthermore, a washer or washers are provided between the heat sink base plate 3 and the template device 23 in order to adjust the distance between the heat sink base plate 3 and the template device 23.

[0052] As already described, in Fig. 5 a support structure 25 is shown. After the multitude of solder sections has been cooled as already described, so that each solder section 15 of the multitude of solder sections has been solidified, the support structure 25 projecting beyond the pin sections is milled off the pin sections, so that the second end sections of the pin sections are free ends.

[0053] The features, technical effects, and / or advantages described in connection with the method also apply, at least analogously, to the heat sink device 1, so a corresponding repetition is omitted here. Likewise, the features, technical effects, and / or advantages described in connection with the heat sink device 1 also apply, at least analogously, to the method, so a corresponding repetition is omitted here.

[0054] Even though the process steps are described in a specific sequence, the present invention is not limited to this sequence. Rather, the individual process steps can be carried out in any meaningful order, and in particular, at least partially in parallel with one another.

[0055] It should be further noted that "having" does not exclude any other elements or steps, and "a" or "an" does not exclude a plurality. It should also be noted that features described with reference to one of the above embodiments may also be used in combination with other features of other embodiments described above. Reference numerals in the claims are not to be considered as a limitation. Reference sign 1 Heat sink device 3 Heat sink base plate 5 pen section 7 first end section 9. Direction of extension 11 second final section 13 bore 15 Plumb line section 17 Reception facility 19 Alignment device 21 Surface of the heat sink base plate 23 Template setup 25 Support structure 27 blank height 29 screw 31 First fastening section of the template device 33 Second fastening section of the template device 101 First procedural step 102 second procedural step 103 third procedural step 104 fourth procedural step 105 fifth procedural step

Claims

[1] Method for manufacturing a heat sink device (1) with a heat sink base plate (3) and a plurality of pin sections, the method comprising the following steps: Providing the heat sink base plate (3) with a multitude of holes, Providing a large number of plumb sections, Providing the plurality of pen sections, wherein each pen section (5) of the plurality of pen sections extends from a first end section (7) along a direction of extension (9) to a second end section (11), Transferring the plurality of solder sections into the plurality of bores, such that in each bore (13) of the plurality of bores a corresponding solder section (15) of the plurality of solder sections is arranged, Bringing the plurality of pin sections into the plurality of bores such that in each bore (13) of the plurality of bores a corresponding pin section (5) of the plurality of pin sections is arranged such that each pin section (5) is in contact with the first end section (7) with a corresponding solder section (15), Heating the plurality of solder sections so that each solder section (15) of the plurality of solder sections is liquefied, and Cooling the plurality of solder sections so that each solder section (15) of the plurality of solder sections is solidified. [2] Method according to the preceding claim, wherein the heat sink base plate (3) extends along a principal extension plane and the bores of the plurality of bores are provided in the heat sink base plate (3) such that each bore (13) of the plurality of bores extends perpendicular to the principal extension plane. [3] Method according to one of the preceding claims, wherein the plurality of pin sections is placed into the plurality of bores such that the extension direction (9) of each pin section (5) is arranged perpendicular to the main extension plane. [4] Method according to one of the preceding claims, wherein the pin sections of the plurality of pin sections are connected to each other by means of a support structure (25). [5] Method according to one of the preceding claims, wherein each pin section (5) of the plurality of pin sections is placed in a template device (23) before the plurality of pin sections are placed in the plurality of bores. [6] Method according to one of the preceding claims, wherein the heat sink base plate (3) is positioned relative to a receiving device (17) such that a first contact surface of the heat sink base plate (3) rests against a contact surface of the receiving device (17). [7] Method according to claim 6, wherein the heat sink base plate (3) is positioned relative to an alignment device (19) connected to the receiving device (17) such that a second contact surface of the heat sink base plate (3) rests against a contact surface of the alignment device (19). [8] Method according to claim 5 and claim 6 and one of the preceding claims, wherein each pin section (5) of the plurality of pin sections is first placed into the template device (23) and then the template device (23) is connected to the receiving device (17). [9] Method according to claim 5 and claim 6 and one of the preceding claims 1, 2, 3, 4 or 7, wherein first the template device (23) is connected to the receiving device (17) and then each pin section (5) of the plurality of pin sections is placed into the template device (23). [10] Heat sink device (1) comprising a heat sink base plate (3) and a plurality of pin sections, wherein the heat sink device (1) is manufactured by a method according to one of the preceding claims.

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