Cooling device and vehicle-internal device

Abstract

A cooling device according to one embodiment cools several target components mounted on a support. The cooling device comprises a heat transfer element and a liquid cooling unit. The heat transfer element is designed as a single unit and has several height-adjustable sections, which are configured according to the heights and mounting positions of the multiple target components. The liquid cooling unit is thermally coupled to the heat transfer element. A liquid coolant is circulated through the liquid cooling unit.

Description

AREA

[0001] The present disclosure relates to a cooling device and a vehicle-internal device. BACKGROUND

[0002] Previously, a cooling device was proposed that is able to reduce thermal resistance and efficiently dissipate heat by closing a gap between a chip, which is a heat dissipation target, and a heat dissipation element, such as a heat sink, when the heat generated by the chip on a substrate on which a multitude of chips are mounted is dissipated using the heat dissipation element.

[0003] A similar technique is described in JP 2006-294699 A.

[0004] The chips, which serve as heat dissipation targets and are mounted on the substrate, do not necessarily have a uniform height, so it is necessary to thermally couple the heat dissipation element to the chips according to their height.

[0005] Therefore, in a related process for a metal-water cooling unit through which a coolant circulates, plate-shaped heat transfer elements of different heights are positioned at locations corresponding to the chips as heat dissipation targets and then soldered to compensate for the height differences between the chips.

[0006] In this case, with a large number of components acting as heat dissipation targets on the substrate, the number of plate-shaped heat transfer elements also increases, leading to an increase in the number of parts of the cooling device and an increase in the number of solder joints, which brings with it the problem that manufacturing processes increase and manufacturing costs rise.

[0007] In view of the problems mentioned above, an objective of the present disclosure is to provide a cooling device and a vehicle device that can efficiently dissipate heat by compensating for differences in height of heat dissipation target components, even when several heat dissipation target components of different heights are mounted on a carrier, and which are easy to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram of a carrier cooling system of one embodiment; Fig. Figure 2 is an exploded view of an example of an in-vehicle device containing a cooling unit of one embodiment; Fig. Figure 3 is a perspective external view of a cooling unit of a first embodiment; Fig. Figure 4 is a cross-sectional view along line AA of Fig. 3; Fig. Figure 5 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a second embodiment; Fig. Figure 6A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a third embodiment; Fig. 6B is a top view of the vicinity of a height adjustment section AD21 when viewed from a lower side in Fig. 6A; Fig. Figure 7 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fourth embodiment; Fig. Figure 8 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fifth embodiment; Fig. Figure 9 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a sixth embodiment; Fig. 10 is a perspective external view illustrating an assembly state of a heat transfer element of the sixth embodiment; Fig. Figure 11 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a seventh embodiment; Fig. 12A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of an eighth embodiment; Fig. 12B is a cross-sectional view along line AA of Fig. 12A; Fig. 13A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a ninth embodiment; Fig. 13B is a cross-sectional view along line AA of Fig. 13A; Fig. 14A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a tenth embodiment; Fig. 14B is a perspective exterior view of a spacer of the tenth embodiment; Fig. Figure 15 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of an eleventh embodiment; Fig. Figure 16 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a twelfth embodiment; Fig. Figure 17A is a cross-sectional view of a height adjustment section of a thirteenth embodiment; Fig. 17B is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of the thirteenth embodiment; Fig. Figure 18 is a schematic explanatory view illustrating an assembly state of a cooling unit of a fourteenth embodiment; Fig. Figure 19 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fifteenth embodiment; Fig. Figure 20A is a schematic explanatory cross-sectional view of a thick metal plate used in a sixteenth embodiment; Fig. Figure 20B is a schematic explanatory cross-sectional view of a height adjustment element of the sixteenth embodiment; Fig. Figure 20C is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of the sixteenth embodiment; Fig. 21A is a front view of a cooling unit 13F of a seventeenth embodiment; Fig. 21B is a (right) side view of the cooling unit 13F of the seventeenth embodiment; Fig. 21C is a rear view of the cooling unit 13F of the seventeenth embodiment; Fig. Figure 22 is a partial exploded view (part 1) of the cooling unit of the seventeenth embodiment; Fig. Figure 23 is a partial exploded view (part 2) of the cooling unit of the seventeenth embodiment; Fig. Figure 24 is a partially enlarged cross-sectional view of the cooling unit of the seventeenth embodiment; Fig. Figure 25 is an illustrative view of a flow of liquid coolant in the cooling unit of the seventeenth embodiment; Fig. 26A is a top view of a flow path protrusion 55F as another example of the shape of a flow path protrusion; Fig. 26B is a top view of a flow path protrusion 55G as another form example of the flow path protrusion; Fig. 26C is a top view of a flow path protrusion 55H as another form example of the flow path protrusion; Fig. 26D is a top view of a flow path protrusion 55J as another form example of the flow path protrusion; Fig. 27A is an explanatory view (part 1) of a flow of liquid coolant on an inlet side; Fig. Figure 27B is an explanatory view (part 2) of the flow of liquid coolant on the inlet side; Fig. 27C is an explanatory view (part 3) of the flow of liquid coolant on the inlet side; Fig. 28A is an explanatory view illustrating a case in which the distribution of a flow of liquid coolant on one outlet side is uneven; Fig. 28B is an explanatory view illustrating a case in which an installation position of the flow path protrusion is shifted to suppress uneven distribution of the liquid coolant flow when the distribution of the liquid coolant flow on the outlet side is uneven; Fig. 29A is a top view of a flow path protrusion 55K as another example of shape; Fig. 29B is a top view of a flow path projection 55L as another example of shape; Fig. 30 is an internal explanatory view of a cooling unit of an eighteenth embodiment; Fig. Figure 31A is a partial cross-sectional view of a liquid coolant flow path of a modified example of the eighteenth embodiment; Fig. Figure 31B is a cross-sectional view of the liquid coolant flow path of the modified example of the eighteenth embodiment; Fig. Figure 32 is a perspective exterior view of a cooling unit of a nineteenth embodiment, viewed from the rear; Fig. Figure 33 is an explanatory view of a twentieth embodiment; Fig. Figure 34 is a partial exploded view of a cooling unit of a twenty-first embodiment; Fig. 35 is a top view of a cooling unit of a twenty-second embodiment; Fig. 36 is a cross-sectional view of a section enclosed by a dashed line frame BA in Fig. 35 corresponds to; Fig. Figure 37 is a cross-sectional view of a cooling unit of a modified example of the twenty-second embodiment; Fig. Figure 38 is an explanatory view of a twenty-third embodiment; Fig. Figure 39 is an explanatory view of a twenty-fourth embodiment; Fig. 40A is a partial front view of a cooling unit 13N of a twenty-fifth embodiment; Fig. 40B is a front view of a slot element of the twenty-fifth embodiment; Fig. 40C is an illustrative view in a case in which the slot element is inserted into the cooling unit 13N of the twenty-fifth embodiment; Fig. 41A is a cross-sectional view along line BB of Fig. 40A; Fig. 41B is a view showing a cross-section along line BB of Fig. 40A after brazing a slotted element 122 corresponds to; Fig. Figure 42A is a partial front view of a cooling unit 13N of a first modified example of the twenty-fifth embodiment; Fig. Figure 42B is a front view of a slot element of the first modified example of the twenty-fifth embodiment; Fig. Figure 43 is an explanatory view of a second modified example of the twenty-fifth embodiment; Fig. Figure 44A is an explanatory view of a third modified example of the twenty-fifth embodiment; Fig. Figure 44B is an explanatory view of a fourth modified example of the twenty-fifth embodiment; Fig. Figure 45A is a top view of an inlet coupler 130 of a first aspect of a twenty-sixth embodiment; Fig. Figure 45B is a front view of the inlet coupler 130 of the first aspect of the twenty-sixth embodiment; Fig. Figure 45C is a side view of the inlet coupler 130 of the first aspect of the twenty-sixth embodiment; Fig. Figure 46A is a top view of an inlet coupler 130X of a second aspect of the twenty-sixth embodiment; Fig. Figure 46B is a front view of the inlet coupler 130X of the second aspect of the twenty-sixth embodiment; Fig. Figure 46C is a side view of the inlet coupler 130X of the second aspect of the twenty-sixth embodiment; Fig. Figure 47 is an explanatory perspective view showing an example of an enclosure in which a cooling unit is located between a housing and a front chassis; Fig. Figure 48 is a front view showing a housing in which the cooling unit is located between the housing and the front chassis; Fig. Figure 49 is a perspective exterior view of a cooling unit attached to a wall element for preventing the ingress of liquids of a twenty-seventh embodiment; Fig. Figure 50 is a view of the cooling unit attached to the wall element for preventing the ingress of liquids of the twenty-seventh embodiment, viewed from an inlet coupler and an outlet coupler; Fig. Figure 51 is a front view showing a case in which the cooling unit is located between a housing and a front chassis, and the wall element for preventing the ingress of liquids and an element for preventing the ingress of liquids of the twenty-seventh embodiment are provided; Fig. Figure 52 is an explanatory view of a twenty-eighth embodiment; Fig. 53 is a partially enlarged view of a housing of a twenty-ninth embodiment; Fig. Figure 54 is an explanatory view of a modified example of the twenty-ninth embodiment; Fig. 55 is an explanatory view of a thirtieth embodiment; Fig. Figure 56 is an explanatory view of a first modified example of the thirtieth embodiment; Fig. Figure 57 is an explanatory view of a second modified example of the thirtieth embodiment; Fig. Figure 58 is a perspective exterior view of a cooling unit of a thirty-first embodiment; Fig. Figure 59 is an exploded view of the cooling unit of the thirty-first embodiment; Fig. Figure 60 is a perspective exterior view of a cooling unit of a thirty-second embodiment; Fig. Figure 61 is an exploded view of the cooling unit of the thirty-second embodiment; Fig. Figure 62A is a perspective external view of a cooling unit body 173 in an assembled state; Fig. Figure 62B is a front view of the cooling unit body 173 in the assembled state; Fig. Figure 63 is an explanatory view illustrating one step of inserting a sealing element into the cooling unit; Fig. Figure 64 is an exploded view (part 1) of a cooling unit of a thirty-third embodiment at the time of assembly; Fig. Figure 65 is an exploded view (part 2) of the cooling unit of the thirty-third embodiment at the time of assembly; Fig. Figure 66 is an exploded view (part 3) of the cooling unit of the thirty-third embodiment at the time of assembly; and Fig. Figure 67 is a complete perspective view of the cooling unit of the thirty-third embodiment. DETAILED DESCRIPTION

[0008] A cooling device according to one embodiment cools a plurality of target components mounted on a support. The cooling device comprises a heat transfer element and a liquid cooling unit. The heat transfer element is designed as a single unit and has several height-adjustable sections, which are configured according to the heights and mounting positions of the multiple target components. The liquid cooling unit is thermally coupled to the heat transfer element. A liquid coolant is circulated through the liquid cooling unit.

[0009] According to the present disclosure, the number of heat transfer elements can be reduced, and the cooling performance for the heat dissipation target components can be maintained, while reducing the number of heat transfer elements and simplifying the manufacturing process.

[0010] Next, one embodiment will be described in detail with reference to the drawings.

[0011] Fig. Figure 1 is a schematic design block diagram of a carrier cooling system of one embodiment.

[0012] A carrier cooling system SYS comprises a cooling unit CU and a coolant cooling / circulation unit CCCU.

[0013] In Fig. 1 are actually a carrier SB1 and a carrier SB2, which are thermally (and mechanically) coupled to the cooling unit CU, shown in a separate state for easier understanding.

[0014] In this case, it is assumed that cooling target chips CP11 to CP15 are located on a backside (a bottom surface side in Fig. 1) of the carrier SB1 are mounted and cooling target chips CP21 to CP24 are on a front side (a top surface in Fig. 1) of the carrier SB2 are mounted.

[0015] The cooling unit CU comprises an inlet coupler CL1, into which a liquid coolant supplied by the coolant cooling / circulation unit CCCU is introduced, an outlet coupler CL2, from which the liquid coolant is discharged to the coolant cooling / circulation unit CCCU after cooling, and height adjustment sections (coupling position adjustment sections) AD11 to AD15, which are formed on a first surface SF1 of the cooling unit CU.

[0016] In the above embodiment, in an actual state of use, the height adjustment sections AD11 to AD15 are thermally coupled to the corresponding cooling target chips CP11 to CP15, which are mounted on the carrier SB1, and transfer heat generated in the chips CP11 to CP15 to the cooling unit CU to carry out a heat exchange, thereby cooling the chips CP11 to CP15.

[0017] In this case, thermal coupling includes not only direct coupling (direct contact) but also coupling via a thermally conductive material, such as thermal grease (the same applies below).

[0018] In the example of Fig. 1. Height adjustment section AD11 corresponds to chip CP11, which is mounted on carrier SB1. Similarly, height adjustment section AD12 corresponds to chip CP12, height adjustment section AD13 corresponds to chip CP13, height adjustment section AD14 corresponds to chip CP14, and height adjustment section AD15 corresponds to chip CP15.

[0019] The description above describes a case in which the height adjustment sections AD11 to AD15 are each intended for chips CP11 to CP15. However, in a case where there is a chip that can be thermally coupled directly to the first surface SF1 of the cooling unit, the chip can be thermally coupled directly to the cooling unit CU.

[0020] Although in Fig. Not shown, four height adjustment sections are also formed on a second surface SF2 of the cooling unit CU to match the cooling target chips CP21 to CP24, with the chips CP21 to CP24 being mounted on the carrier SB2.

[0021] Next, a schematic operation of the carrier cooling system SYS will be shown. Fig. 1 described.

[0022] The coolant cooling / circulation unit CCCU introduces the cooled liquid coolant into the cooling unit CU via the inlet coupler CL1.

[0023] As a result, the liquid coolant exchanges heat with the target cooling chips via the height adjustment sections AD11 to AD15 and the height adjustment sections on the second surface SF2 of the cooling unit CU to cool the target cooling chips.

[0024] Furthermore, after heat exchange, the liquid coolant returns via the outlet coupler CL2 to the coolant cooling / circulation unit CCCU, is cooled and is fed to the inlet coupler CL1.

[0025] By repeating the above process, the cooling target chips CP11 to CP15, mounted on carrier SB1, and the cooling target chips CP21 to CP24, mounted on carrier SB2, can be operated in a cooled state, reliably performing a predetermined processing operation without causing a reduction in processing speed due to heat generation, thus demonstrating the desired performance.

[0026] Fig. Figure 2 is an exploded view of an example of an in-vehicle device containing a cooling unit of one embodiment.

[0027] An internal vehicle device 10 includes a cover plate 11, a first support 12, a cooling unit 13, side chassis 14A and 14C, a side cover 14B, a central chassis 15, a second support 16 and a base plate 17.

[0028] The cover plate 11, for example, is made of an aluminum extrusion material and forms part of a housing of the vehicle-internal device 10.

[0029] The first carrier 12 is a printed circuit board (PCB) on which a large number of cooling target semiconductor chips are mounted.

[0030] A liquid coolant flow path is formed within the cooling unit 13, and the cooling unit 13 performs a heat exchange with the semiconductor chips mounted on the first support 12 and the second support 16 to perform cooling.

[0031] The side chassis 14A and 14C, for example, are made of aluminum extrusion materials and form part of the housing of the vehicle-internal device 10.

[0032] The side cover 14B, for example, is formed by two-component injection molding of resin and rubber and forms part of the housing of the vehicle-internal device 10.

[0033] The central chassis 15, for example, is a component made of die-cast aluminum. The first support 12, the cooling unit 13, and the second support 16 are attached to the central chassis 15, and the central chassis 15 supports the first support 12, the cooling unit 13, and the second support 16, while maintaining a state in which the first support 12 and the second support 16 are thermally coupled to the cooling unit 13.

[0034] Similar to the first carrier 12, the second carrier 16 is a printed circuit board (PCB) on which a large number of cooling target semiconductor chips are mounted.

[0035] The base plate 17, for example, is made of an aluminum extrusion material and forms part of the housing of the vehicle-internal device 10.

[0036] Next, more specific embodiments will be described with reference to the drawings. (1) First embodiment

[0037] Fig. Figure 3 is a perspective external view of a cooling unit of a first embodiment.

[0038] A cooling unit 13 comprises a heat transfer element 21, a cooling unit body 22, an inlet coupler 23A, an outlet coupler 23B, a screw fastening section 24A and a bolt 24B.

[0039] The heat transfer element 21 is implemented by a metal plate and the heat transfer element 21 is provided with height adjustment sections 21A1 and 21A2 which are compatible with a variety of cooling target semiconductor chips.

[0040] In this case, a shape, height and planar form of each of the height adjustment sections 21A1 and 21A2 are determined according to a planar form and height of the cooling target semiconductor chip and a mounting position of the semiconductor chip.

[0041] A liquid coolant flow path is formed within the cooling unit body 22 and the cooling unit body 22 performs a heat exchange with the cooling target semiconductor chip via the heat transfer element 21 to cool the semiconductor chip.

[0042] The inlet coupler 23A is connected to a coolant cooling / circulation unit (not shown) and a liquid coolant is introduced from the coolant cooling / circulation unit (not shown) into the cooling unit body 22.

[0043] The outlet coupler 23B is connected to the coolant cooling / circulation unit (not shown) and the liquid coolant is released to the coolant cooling / circulation unit (not shown) after heat exchange.

[0044] Screw fastening section 24A indicates a condition in which a screw is inserted into and secured to a through-hole provided in the cooling unit 13. Therefore, in a condition in which no fastening with the screw is achieved, each through-hole is provided in a position corresponding to screw fastening section 24A. Fig. 3. The screw mounting section 24A is used to attach a water cooling unit. However, the screw mounting section 24A does not necessarily have this function, and positioning pins can be provided in the required number of through holes as needed.

[0045] The bolt 24B is also provided on both an upper surface and a lower surface of the cooling unit 13, and each of a first support 12 and a second support 16 is fastened and supported by a screw or the like in a state in which the first support 12 and the second support 16 are separated from each other by a predetermined distance.

[0046] Here, an internal structure of the cooling unit 13 is described.

[0047] Fig. Figure 4 is a cross-sectional view along line AA of Fig. 3.

[0048] A liquid coolant flow path 31 is formed within the cooling unit body 22 of the cooling unit 13, and a rib (directing plate) 32 for directing a flow of the liquid coolant is arranged in the liquid coolant flow path 31.

[0049] Additionally, in the example of Fig. 4 The height adjustment section 21A2 of the heat transfer element 21 is formed by drawing a metal plate-shaped element using a press and has a protruding cross-sectional shape. As a result, a space is formed between the height adjustment section 21A2 and the cooling unit body 22.

[0050] As described above, in the first embodiment, the heat transfer element 21 is designed as a single element and has a plurality of height adjustment sections, which are formed according to the heights and mounting positions of the semiconductor chips. Therefore, it is possible to cool the semiconductor chips efficiently without increasing the number of components. (2) Second embodiment

[0051] Fig. Figure 5 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a second embodiment.

[0052] A heat transfer element 21 of the second embodiment is formed by forging.

[0053] In the heat transfer element 21, which is formed by forging, a gap is not formed as an air layer, unlike in a case where a height adjustment section is formed by drawing using a press between the heat transfer element and a cooling unit body 22, as a height adjustment section that is thermally coupled to a semiconductor chip. Therefore, thermal resistance can be reduced and heat dissipation efficiency can be improved.

[0054] Illustrated for easier understanding Fig. 5 a case in which the heat transfer element 21 is arranged only on a second surface 22SF2 of the cooling unit body 22.

[0055] A cooling unit 13 comprises the heat transfer element 21, which is formed by forging, and the cooling unit body 22.

[0056] In the example of Fig. 5 are a semiconductor chip CP1 with a first height and a semiconductor chip CP2 with a second height that is greater than the first height, mounted on a surface of the substrate SB2.

[0057] Therefore, the height of a height adjustment section AD1 formed in the heat transfer element 21 is smaller than the height of a height adjustment section AD2.

[0058] Additionally, a thermally conductive element TGR, such as thermal grease, is provided between the semiconductor chip CP1 and the height adjustment section AD1 and between the semiconductor chip CP2 and the height adjustment section AD2, so that the thermal resistance is reduced and cooling efficiency is improved compared to a case in which the thermally conductive element TGR is not provided.

[0059] As a result, heat generated by operations of the semiconductor chip CP1 and the semiconductor chip CP2 is transferred via the thermally conductive element TGR, a height adjustment element AD1 and a height adjustment element AD2 to the cooling unit body 22 and heat exchange is carried out with a coolant flowing in a liquid coolant flow path 31 in the cooling unit body 22.

[0060] Accordingly, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled and can therefore be operated normally continuously. (3) Third embodiment

[0061] Fig. Figure 6A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a third embodiment.

[0062] Fig. 6B is a top view of the surroundings of a height adjustment section AD21 when viewed from a lower side in Fig. 6A.

[0063] A heat transfer element 21, formed by forging, metal pressing or casting, is provided with a surface (a second surface 22SF2 in the example of the Fig. 6A and Fig. 6B) of a cooling unit body 22 connected by so-called brazing and thermally and physically coupled.

[0064] The heat transfer element 21 can be formed not only by forging, but also by metal pressing or casting. Additionally, thermal and physical coupling can be achieved by brazing instead of hard soldering.

[0065] In this case, the surfaces of the heat transfer element 21 and the cooling unit body 22 are coupled to each other with a relatively large area, as shown in the Fig. 6A and Fig. Figure 6B illustrates this, and thus brazing is difficult. There is a high probability that bubbles will form between the heat transfer element 21 and the cooling unit body 22 during brazing. This also applies to soldering.

[0066] In particular, since sections in which height adjustment elements AD1 and AD2 are provided serve as contact surfaces for semiconductor chips CP1 and CP2, if bubbles are formed at an interface between the heat transfer element 21 and the cooling unit body 22, the presence of an air layer due to the bubbles increases thermal resistance and reduces the heat transfer rate, and thus cooling cannot be carried out efficiently.

[0067] Therefore, it is desirable to be able to remove the bubbles, especially in sections where the height adjustment elements AD1 and AD2, which are protrusions, are provided.

[0068] Therefore, as in Fig. Figure 6B illustrates a multitude of holes HL provided near the height adjustment element AD21, which is a projection, so that the bubbles formed during brazing are released through the holes HL. As a result, the bubbles do not remain between the heat transfer element 21 and the cooling unit body 22, and surface tension acts to achieve uniform brazing (or soldering).

[0069] Therefore, according to the third embodiment, it is possible to design a carrier cooling system that does not reduce heat transfer efficiency. (4) Fourth embodiment

[0070] Fig. Figure 7 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fourth embodiment.

[0071] In each of the above embodiments, a height adjustment section is provided for each of the target semiconductor chips. However, in a case where the height of the target semiconductor chip is sufficiently high, an opening OHL can be provided as the height adjustment section, and the semiconductor chip can penetrate the opening OHL and be thermally coupled directly to a cooling unit body 22 via a thermally conductive element TGR.

[0072] Since a heat transfer element 21 of the fourth embodiment is also formed by forging, metal pressing, or casting, a gap is not formed as an air layer, unlike in a case where the height adjustment section is formed by drawing using a press between the heat transfer element and the cooling unit body 22. Therefore, thermal resistance can be reduced and heat dissipation efficiency can be improved.

[0073] Fig. Figure 7 also illustrates a case in which the heat transfer element 21 is arranged only on a second surface 22SF2 of the cooling unit body 22 for easier understanding.

[0074] A cooling unit 13 comprises the heat transfer element 21, which is formed by forging, and the cooling unit body 22.

[0075] In the example of Fig. 7 are a semiconductor chip CP1 with a first height and a semiconductor chip CP2 with a second height that is greater than the first height, mounted on a surface of a substrate SB2.

[0076] In this case, the height of semiconductor chip CP2 is relatively much greater than the height of semiconductor chip CP1. Therefore, the opening OHL is provided instead of a protruding form such as a height adjustment section AD1, and semiconductor chip CP2 is thermally coupled directly to the second surface 22SF2 of the cooling unit body 22 via the thermally conductive element TGR, such as thermal grease.

[0077] Therefore, the thermal resistance can be reliably reduced and the cooling efficiency can be improved compared to a case where the height adjustment section is provided with a protruding shape.

[0078] As a result, the heat generated by the operations of semiconductor chip CP1 and semiconductor chip CP2 is transferred to the cooling unit body 22 via the thermally conductive element TGR and a height-adjusting element AD1. Conversely, the heat generated by the operation of semiconductor chip CP2 is transferred to the cooling unit body 22 only via the thermally conductive element TGR.

[0079] Therefore, the semiconductor chip CP1 and the semiconductor chip CP2 have different heat exchange efficiencies and are subjected to heat exchange by a coolant flowing in a liquid coolant flow path 31 in the cooling unit body 22.

[0080] As a result, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled and can therefore be operated normally continuously.

[0081] As described above, according to such a design, the thermal resistance of a heat conduction path for the semiconductor chip CP2, corresponding to the opening OHL, can be further reduced, and the cooling effect can be improved. Furthermore, the weight of the heat transfer element 21 can be reduced, and manufacturing costs can also be lowered. (5) Fifth embodiment

[0082] Fig. Figure 8 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fifth embodiment.

[0083] In each of the above embodiments, a case was described in which a planar shape of a heat transfer element 21 is essentially the same as that of a cooling unit body 22. In the fifth embodiment, however, for example, an area of ​​the heat transfer element 21 in plan views of the cooling unit body 22 and the heat transfer element 21 is larger than an area of ​​the cooling unit body 22, and the stacked heat transfer element 21 is seen without being obscured by the cooling unit body 22 when viewed from above. Fig. 8.

[0084] Since the heat transfer element 21 of the fifth embodiment is also formed by forging, metal pressing, or casting, a gap is not formed as an air layer, unlike in a case where a height adjustment section is formed by drawing using a press between the heat transfer element and the cooling unit body 22. Therefore, thermal resistance can be reduced and heat dissipation efficiency can be improved.

[0085] Fig. Figure 8 also illustrates a case in which the heat transfer element 21 is arranged only on a second surface 22SF2 of the cooling unit body 22 for easier understanding.

[0086] A cooling unit 13 comprises the heat transfer element 21, which is formed by forging, and the cooling unit body 22.

[0087] In the example of Fig. 8 are a semiconductor chip CP1 with a first height, a semiconductor chip CP2 with a second height greater than the first height, a semiconductor chip CP3 with a third height greater than the first height and less than the second height, and a semiconductor chip CP4 with the same height as the first height mounted on a surface of a substrate SB2.

[0088] In this case, the heat transfer element 21 comprises a projecting height adjustment section AD1 with a height corresponding to the height of the semiconductor chip CP1, a projecting height adjustment section AD2 with a height corresponding to the height of the semiconductor chip CP2, a projecting height adjustment section AD3 with a height corresponding to the height of the semiconductor chip CP3, and a projecting height adjustment section AD4 with a height corresponding to the height of the semiconductor chip CP4.

[0089] Furthermore, the height adjustment section AD2 and the height adjustment section AD3, and furthermore the semiconductor chip CP2 and the semiconductor chip CP3, are provided at positions facing the second surface 22SF2 of the cooling unit body 22 and have a positional relationship similar to that of each of the above embodiments.

[0090] On the other hand, the height adjustment section AD1 and the height adjustment section AD4 and furthermore the semiconductor chip CP1 and the semiconductor chip CP4 are not provided in positions facing the second surface 22SF2 of the cooling unit body 22, except for sections thereof.

[0091] Therefore, although the thermal resistance of a heat transfer path, corresponding to height adjustment section AD1 and height adjustment section AD4, is higher than that of height adjustment section AD2 and height adjustment section AD3, heat exchange can be carried out through the heat transfer element 21.

[0092] Therefore, in the case of adopting such a configuration, a cooling efficiency can be effectively adjusted to a desired value by increasing a flow rate of a liquid coolant flowing in a liquid coolant flow path 31 of the cooling unit body 22, or by positioning a semiconductor chip that generates less heat than a semiconductor chip that is to be arranged at a location with a higher thermal resistance, such as the semiconductor chip CP1 and the semiconductor chip CP4.

[0093] According to the present embodiment, the size of the cooling unit body can be reduced while the actual arrangement area of ​​a cooling target is increased, thus reducing the design costs of the entire cooling system, easing the installation condition of the cooling unit body 22, and simplifying the design of the cooling system. (6) Sixth embodiment

[0094] Fig. Figure 9 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a sixth embodiment.

[0095] In each of the above embodiments, a height adjustment section is provided in a heat transfer element 21 which is mechanically supported on a cooling unit body 22, but the sixth embodiment is an embodiment in which the heat transfer element is provided on a carrier on which a cooling target semiconductor chip is mounted.

[0096] Although the heat transfer element 21 of the sixth embodiment can also be formed by forging, in the example of Fig. 9 describes a case in which the height adjustment section is formed by drawing using a press machine.

[0097] Fig. Figure 9 also illustrates a case in which a heat transfer element 41 is arranged only on a second surface 22SF2 of the cooling unit body 22 for easier understanding.

[0098] As in Fig. As illustrated in Figure 9, the heat transfer element 41 is supported on and attached to a carrier SB2.

[0099] A height adjustment section AD31, which corresponds to the height of a semiconductor chip CP1, is provided at a position facing the semiconductor chip CP1 on the heat transfer element 41 and is thermally coupled to the semiconductor chip CP1 via a thermally conductive element TGR, such as thermal grease.

[0100] Similarly, a height adjustment section AD32, which corresponds to the height of a semiconductor chip CP2, is provided at a position facing the semiconductor chip CP2 on the heat transfer element 41 and is thermally coupled to the semiconductor chip CP2 via the heat-conducting element TGR.

[0101] As a result, heat generated by operations of the semiconductor chip CP1 and the semiconductor chip CP2 is transferred via the thermally conductive element TGR, the height adjustment section AD31 and the height adjustment section AD32 to the cooling unit body 22 and heat exchange is carried out with a coolant flowing in a liquid coolant flow path 31 in the cooling unit body 22.

[0102] Accordingly, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled and can therefore be operated normally continuously.

[0103] Fig. Figure 10 is a perspective external view illustrating an assembly state of the heat transfer element of the sixth embodiment.

[0104] In Fig. 10. It is assumed that four cooling target semiconductor chips CP1 to CP4 are mounted on the carrier SB2.

[0105] In this case, four recesses (projections when viewed from the semiconductor chips CP1 to CP4) are formed in the heat transfer element 41 corresponding to the height adjustment sections AD31 to AD34.

[0106] Therefore, the semiconductor chips CP1 to CP4 on the substrate SB2 are covered with the heat transfer element 41.

[0107] According to the sixth embodiment, such a design allows a countermeasure to be taken against dew condensation by covering the carrier SB2 with the heat transfer element 41.

[0108] Additionally, it is possible to ensure the grounding of a large area by grounding the heat transfer element 41.

[0109] Since the heat transfer element 41 is made of a conductive material, such as an aluminum plate, is grounded and surrounds the entire target circuit, it is also possible to provide an electrical shielding property, to easily eliminate the influence of noise and the like, and to achieve highly reliable circuit operation. (7) Seventh embodiment

[0110] The first to sixth embodiments describe configurations in which a height adjustment section is provided in a heat transfer element that is separate from a cooling unit body 22. A seventh embodiment, however, is one in which the height adjustment section is provided in a cooling unit.

[0111] Fig. Figure 11 is a schematic explanatory cross-sectional view illustrating an assembly state of the cooling unit of the seventh embodiment.

[0112] A cooling unit 13A of the seventh embodiment comprises a first housing 13A1, a second housing 14A2, a liquid coolant flow path 31 and a fin 32.

[0113] In the first housing 13A1, a metal plate is drawn through a press device to form part of the liquid coolant flow path and a height adjustment section AD41.

[0114] In this case, in the example of Fig. 11 The height adjustment section AD41 is formed from a single element, like the first housing 13A1, to have a height corresponding to a position based on the height and arrangement of a semiconductor chip CP1 mounted on a carrier SB1. The height adjustment section AD41 is thermally coupled to the semiconductor chip CP1 via a thermally conductive element TGR, such as thermal grease.

[0115] Additionally, a semiconductor chip CP2, mounted on the carrier SB1, is connected via the thermally conductive element TGR to a top surface (a top surface in Fig. 11) of the first housing 13A1 thermally coupled.

[0116] In the example of Fig. Figure 11 shows only the height adjustment section AD41 as the height adjustment section. However, in a case where a multitude of heat target semiconductor chips are mounted on the carrier SB1, the height adjustment sections are formed as part of the first housing 13A1 at positions corresponding to the heat target semiconductor chips.

[0117] A second housing 13A2 is soldered to and integrated with the first housing 13A1 to form the liquid coolant flow path 31.

[0118] In the example of Fig. For ease of understanding, the height adjustment section is not formed in the second housing 13A2. However, in a case where the cooling target semiconductor chip is located on a second carrier SB2 positioned below the second housing 13A2, the height adjustment section may be formed at a position corresponding to the semiconductor chip on the second carrier SB2.

[0119] In such a configuration, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled by heat exchange via the thermally conductive element TGR using a coolant that flows in the liquid coolant flow path 31 from a back to a front in the drawing or from the front to the back in the drawing.

[0120] As described above, in the seventh embodiment, the first housing 13A1 of the cooling unit 13A is designed as a single element and has a height adjustment section that is formed according to the height of the semiconductor chip and its mounting position. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components. (8) Eighth embodiment

[0121] Fig. 12A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of an eighth embodiment.

[0122] Fig. 12B is a cross-sectional view along line AA of Fig. 12A.

[0123] In Fig. 12A and Fig. Sections 12B are those corresponding to the seventh embodiment in Fig. 11 similar items are designated with the same reference symbols.

[0124] A cooling unit 13A of the eighth embodiment comprises a first housing 13A1, a second housing 13A2, a liquid coolant flow path 31, a fin 32, a second fin 33 and a spacer 34.

[0125] In the first housing 13A1, a metal plate is formed by a pressing device to form part of the liquid coolant flow path and a height adjustment section AD41.

[0126] This section describes problems in the seventh embodiment.

[0127] In the seventh embodiment, because a gap exists between an upper surface of the height adjustment section AD41 and an upper surface of the fin 32 when the height is increased in an up-down direction, the smoothing effect of the fin 32 is reduced, and there is a possibility that the heat exchange efficiency may be reduced. Additionally, if the coolant pressure is increased, the height adjustment section AD41 is deformed, and unnecessary stress is generated in a semiconductor chip CP1, which can lead to a reduction in reliability.

[0128] Therefore, to ensure pressure resistance and a smoothing effect, and to improve the reliability of the cooling unit 13A, it is conceivable to include the second fin 33 in the height adjustment section AD41. However, in some configurations of fin 32 and the second fin 33, the fin tips overlap, and thus one configuration of the height adjustment section AD41 cannot be maintained, and the smoothing effect is also reduced, thereby decreasing the heat exchange efficiency.

[0129] Therefore, in the eighth embodiment, as in Fig. Figure 12A illustrates the plate-shaped spacer 34 being arranged between the rib 32 and the second rib 33, and the rib 32 and the second rib 33 being soldered to the spacer 34.

[0130] According to such a design, the tips of the rib 32 and the second rib 33 do not overlap each other, and thus the shape of the height adjustment section AD41 can be maintained and the smoothing effect is also maintained, so that the heat exchange efficiency is not reduced.

[0131] In this case, in the example of Fig. 12A The height adjustment section AD41 is formed from a single element, like the first housing 13A1, to have a height corresponding to a specific position based on the height and arrangement of the semiconductor chip CP1, which is mounted on a carrier SB1. The height adjustment section AD41 is thermally coupled to the semiconductor chip CP1 via a thermally conductive element TGR.

[0132] Similarly, a semiconductor chip CP2, mounted on the substrate SB1, is connected via the thermally conductive element TGR to a top surface (a top surface in Fig. 12A) of the first housing 13A1 thermally coupled.

[0133] Even in the example of Fig. Figure 12A illustrates only the height adjustment section AD41. However, in a case where a large number of heat-target semiconductor chips are mounted on the carrier SB1, the height adjustment sections are formed as part of the first housing 13A1 at positions corresponding to the heat-target semiconductor chips.

[0134] The second housing 13A2 is soldered to and integrated with the first housing 13A1 to form the liquid coolant flow path 31.

[0135] In the example of Fig. 12A and Fig. For ease of understanding, the height adjustment section in 12B is not formed in the second housing 13A2. However, in a case where the cooling target semiconductor chip is located on a second carrier SB2 positioned below the second housing 13A2, the height adjustment section may be formed at a position corresponding to the semiconductor chip on the second carrier SB2.

[0136] As in Fig. As illustrated in 12B, there is a predetermined gap between a front end (a left end in Fig. 12B) and a rear end of the second rib 33 in a rib extension direction and an inner wall surface of the height adjustment section AD41. Therefore, a liquid coolant branches off from a rear end (a right end in Fig. 12B) of the fin 32 flows, slightly away, is directed to the rear end of the second fin 33, as indicated by a thin arrow, is directed through the interior of the second fin 33, is released from the front end of the second fin 33 and rejoins the liquid coolant flowing in the fin 32 without delay to carry out heat exchange.

[0137] In such a configuration, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled by a heat exchange with high efficiency via the thermally conductive element TGR using a coolant that flows in the liquid coolant flow path 31 from the back to the front in the drawing or from the front to the back in the drawing.

[0138] As described above, in the embodiment of the eighth configuration, the first housing 13A1 of the cooling unit 13A is designed as a single element and has the height adjustment section AD41, which is formed according to the height of the semiconductor chip and its mounting position. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0139] Additionally, because the plate-shaped spacer 34A is arranged between the rib 32 and the second rib 33 and brazing is carried out, the tips of the rib 32 and the second rib 33 do not overlap each other and thus the shape of the height adjustment section AD41 can be maintained and the smoothing effect is also maintained, so that the heat exchange efficiency is not reduced. (9) Ninth embodiment

[0140] In the eighth embodiment, a plate-shaped spacer 34 is arranged between a rib 32 and a second rib 33, and brazing is performed so that the rib 32 and the second rib 33 do not overlap, thus preventing the flow of coolant from being obstructed. However, brazing the rib 32 and the second rib 33 is necessary, and the manufacturing process becomes more complex.

[0141] Therefore, in the ninth embodiment, a cooling unit is provided which can maintain the shape of a height adjustment section AD41 without overlap between the tips of rib 32 and the second rib 33, while the manufacturing process is simplified by changing the shape of the spacer.

[0142] Fig. Figure 13A is a schematic explanatory cross-sectional view illustrating an assembly state of the cooling unit of the ninth embodiment.

[0143] Fig. 13B is a cross-sectional view along line AA of Fig. 13A.

[0144] In Fig. 13A and Fig. Sections 13B are those corresponding to the seventh embodiment in Fig. 11 similar items are designated with the same reference symbols.

[0145] A cooling unit 13A of the ninth embodiment comprises a first housing 13A1, a second housing 13A2, a liquid coolant flow path 31, the fin 32, the second fin 33 and a spacer 34A.

[0146] In the ninth embodiment, as in Fig. As illustrated in Figure 13A, the plate-shaped spacer 34A is arranged between the rib 32 and the second rib 33, and a curved section 34A1, which has a triangular shape in a front view of the spacer 34A, is arranged to fit into a valley section of the rib 32.

[0147] According to such a design, one side of the curved section 34A1 comes into contact with the rib 32, and as in Fig. As illustrated in Figure 13A, rising sections from the left and right ends of the spacer 34A come into contact with side walls of the height adjustment section AD41, so that the spacer 34A is fixed in a predetermined position without being lifted.

[0148] As a result, an arrangement relationship between the rib 32 and the second rib 33 is fixed, the tips of the rib 32 and the second rib 33 do not overlap each other and thus the shape of the height adjustment section AD41 can be maintained and a smoothing effect is also maintained, so that the heat exchange efficiency is not reduced.

[0149] In this case, in the example of Fig. 13A The height adjustment section AD41 is formed from a single element, like the first housing 13A1, to have a height corresponding to a position based on the height and arrangement of a semiconductor chip CP1 mounted on a carrier SB1. The height adjustment section AD41 is thermally coupled to the semiconductor chip CP1 via a thermally conductive element TGR.

[0150] Similarly, a semiconductor chip CP2, mounted on the substrate SB1, is connected via the thermally conductive element TGR to a top surface (a top surface in Fig. 13A) of the first housing 13A1 thermally coupled.

[0151] Even in the example of Fig. 13A only illustrates the height adjustment section AD41. However, in a case where a large number of heat-target semiconductor chips are mounted on the carrier SB1, the height adjustment sections are formed as part of the first housing 13A1 at positions corresponding to the heat-target semiconductor chips.

[0152] The second housing 13A2 is soldered to and integrated with the first housing 13A1 to form the liquid coolant flow path 31.

[0153] In the example of Fig. For ease of understanding, the height adjustment section in 13A is not formed in the second housing 13A2. However, in a case where the cooling target semiconductor chip is located on a second carrier SB2 positioned below the second housing 13A2, the height adjustment section can be formed at a position corresponding to the semiconductor chip on the second carrier SB2.

[0154] As in Fig. As illustrated in Figure 13B, there is a predetermined gap between a front end (a left end in Fig. 13B) and a rear end of the second rib 33 in a rib extension direction and an inner wall surface of the height adjustment section AD41. Therefore, a liquid coolant that is supplied from a rear end (a right end in Fig. 13B) of the rib 32, guided through the curved section 34A1 and branching off slightly, is directed to the rear end of the second rib 33 as indicated by a thin arrow, is directed through the interior of the second rib 33, is released from the front end of the second rib 33 and rejoins the liquid coolant flowing in the rib 32 without delay to carry out heat exchange.

[0155] In such a configuration, the semiconductor chip CP1 and the semiconductor chip CP2 are cooled by a heat exchange with high efficiency via the thermally conductive element TGR using a coolant that flows in the liquid coolant flow path 31 from the back to the front in the drawing or from the front to the back in the drawing.

[0156] As described above, in the embodiment of the ninth embodiment, the first housing 13A1 of the cooling unit 13A is designed as a single element and has the height adjustment section AD41, which is formed according to the height of the semiconductor chip and its mounting position. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0157] Additionally, because the plate-shaped spacer 34 is arranged between the rib 32 and the second rib 33 and brazing is carried out, the tips of the rib 32 and the second rib 33 do not overlap each other and thus the shape of the height adjustment section AD41 can be maintained and the smoothing effect is also maintained, so that the heat exchange efficiency is not reduced. (10) Tenth embodiment

[0158] Fig. Figure 14A is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a tenth embodiment.

[0159] Fig. Figure 14B is a perspective exterior view of a spacer of the tenth embodiment.

[0160] Similar to the ninth embodiment, the tenth embodiment provides a cooling unit that can maintain the shape of a height adjustment section AD41 without overlap between the tips of rib 32 and the second rib 33, while simplifying a manufacturing process by changing the shape of the spacer.

[0161] In Fig. 14A and Fig. Sections 14B are those corresponding to the seventh embodiment in Fig. 11 similar items are designated with the same reference symbols.

[0162] A cooling unit 13A of the tenth embodiment comprises a first housing 13A1, a second housing 13A2, a liquid coolant flow path 31, a fin 32, a second fin 33 and a spacer 34B.

[0163] In the tenth embodiment, as in Fig. As illustrated in Figure 14A, the plate-shaped spacer 34B is arranged between the rib 32 and the second rib 33, and curved projection sections 34B1 of the spacer 34B are located at four positions, which are in Fig. As illustrated in 14B, they come into contact with the side walls of the height adjustment section AD41, so that the spacer 34B is fixed in a predetermined position without being lifted.

[0164] As a result, an arrangement relationship between the rib 32 and the second rib 33 is fixed, the tips of the rib 32 and the second rib 33 do not overlap each other and thus the shape of the height adjustment section AD41 can be maintained and a smoothing effect is also maintained, so that the heat exchange efficiency is not reduced.

[0165] In the example of Fig. For ease of understanding, the height adjustment section in 14A is not formed in the second housing 13A2. However, in a case where the cooling target semiconductor chip is located on a second carrier SB2 positioned below the second housing 13A2, the height adjustment section may be formed at a position corresponding to the semiconductor chip on the second carrier SB2.

[0166] As described above, in the tenth embodiment, the first housing 13A1 of the cooling unit 13A is designed as a single element and has the height adjustment section AD41, which is formed according to the height of the semiconductor chip and its mounting position. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0167] Additionally, because the plate-shaped spacer 34B is arranged between the rib 32 and the second rib 33, the tips of the rib 32 and the second rib 33 do not overlap, and thus the shape of the height adjustment section AD41 can be maintained and the smoothing effect is also maintained, so that the heat exchange efficiency is not reduced. (11) Eleventh embodiment

[0168] Fig. Figure 15 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of an eleventh embodiment.

[0169] In the eighth to tenth embodiments, a second rib 33 and spacers 34, 34A and 34B are provided, but in the present eleventh embodiment, an extrusion rib 35 attached to the base plate is provided instead of the second rib 33 and the spacers 34, 34A and 34B.

[0170] According to the eleventh embodiment, a first housing 13A1 of a cooling unit 13A is designed as a single element and has a height adjustment section AD41, which is formed according to the height of a semiconductor chip and the mounting position of the semiconductor chip. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0171] Since there is no need to provide the second rib, a shape of the height adjustment section AD41 can be retained, while simplifying the manufacturing process, and a smoothing effect is also maintained, so that heat exchange efficiency is not reduced. (12) Twelfth embodiment

[0172] Fig. Figure 16 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a twelfth embodiment.

[0173] In the twelfth embodiment, an extrusion rib 35 attached to the base plate is provided instead of a second rib and spacers, and the twelfth embodiment is an embodiment in which a block-shaped element 36 with thermal conductivity is provided instead of the extrusion rib 35 attached to the base plate.

[0174] According to the eleventh embodiment, a first housing 13A1 of a cooling unit 13A is designed as a single element and has a height adjustment section AD41, the inside of which is supported by the block-shaped element 36 with thermal conductivity, wherein the height adjustment section AD41 is formed according to the height of a semiconductor chip and the mounting position of the semiconductor chip. Therefore, it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0175] Since there is no need to provide the second rib, a form of the height adjustment section AD41 can be retained, while simplifying the manufacturing process, so that heat exchange efficiency is not reduced. (13) Thirteenth embodiment

[0176] Fig. Figure 17A is a cross-sectional view of a height adjustment section of a thirteenth embodiment.

[0177] Fig. Figure 17B is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of the thirteenth embodiment.

[0178] In embodiments eight through twelve, a height adjustment section AD41 is provided as an element in a first housing 13A1 of a cooling unit 13A. Here, an embodiment is described in which a cylindrical ridge section is formed in the first housing 13A1 and a disc-shaped block element with thermal conductivity is used as a height adjustment section AD51, which is located in Fig. As illustrated in 17A, it is assumed that it is inserted into the burr section and brazed.

[0179] In such a configuration, a semiconductor chip CP1 is cooled by a heat exchange with high efficiency via the disk-shaped block element AD51 and a thermally conductive element TGR using a coolant that flows in a liquid coolant flow path 31 from the back to the front in the drawing or from the front to the back in the drawing.

[0180] Similarly, a CP2 semiconductor chip is cooled by highly efficient heat exchange via the thermally conductive element TGR.

[0181] As described above, in the design of the thirteenth embodiment, the disk-shaped block element AD51, which forms the height adjustment section, is provided in the ridge section of the first housing 13A1 of the cooling unit 13A. Therefore, it is possible to cool the semiconductor chip efficiently without significantly increasing the number of components. (14) Fourteenth embodiment

[0182] Fig. Figure 18 is a schematic explanatory view illustrating an assembly state of a cooling unit of a fourteenth embodiment.

[0183] In embodiments eight through twelve, a height adjustment section AD41 is provided as an element in a first housing 13A1 of a cooling unit 13A. Here, an embodiment is described in which a ridge section BR, whose diameter is reduced towards an upper section, is formed in the first housing 13A1, and a frustoconical block element with thermal conductivity is used as a height adjustment section AD52, which is located in Fig. As illustrated in 18, it is assumed that the burr section BR is inserted into the lower side of the first housing 13A1 and hard-soldered.

[0184] In such a configuration, a semiconductor chip CP1 is cooled by a heat exchange with high efficiency via the frustoconical block element AD51 and a thermally conductive element TGR using a coolant that flows in a liquid coolant flow path 31 from the back to the front in the drawing or from the front to the back in the drawing.

[0185] Similarly, a CP2 semiconductor chip is cooled by highly efficient heat exchange via the thermally conductive element TGR.

[0186] As described above, in the fourteenth embodiment, the frustoconical block element AD52, which forms the height adjustment section, is provided in the ridge section BR of the first housing 13A1 of the cooling unit 13A. Therefore, it is possible to cool the semiconductor chip efficiently without significantly increasing the number of components. (15) Fifteenth embodiment

[0187] Fig. Figure 19 is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of a fifteenth embodiment.

[0188] In Fig. 19 are sections corresponding to those of the seventh embodiment in Fig. 11 similar items are designated with the same reference symbols.

[0189] In embodiments eight through ten, types of a rib 32 and a second rib 33 have not been mentioned. In embodiment fifteen, in a case where a rib and a second rib are stacked, by specifying the shapes of the ribs, the second rib does not fit inside the first rib.

[0190] A cooling unit 13A of the fifteenth embodiment comprises a first housing 13A1, a second housing 13A2, a liquid coolant flow path 31, a straight fin 32S and a wave fin 32W.

[0191] In the first housing 13A1, a metal plate is formed by a pressing device to form part of the liquid coolant flow path and a height adjustment section AD41.

[0192] In the fifteenth embodiment, a combination of ribs is selected that have shapes in which peak sections or valley sections of the ribs do not overlap, even when the ribs are stacked.

[0193] More precisely, in the example of Fig. 19 the wave rib 32W, which has a zigzag wave shape, is stacked on the straight rib 32S, which has a straight shape, in the height adjustment section AD41.

[0194] In this case, in the example of Fig. 19 The height adjustment section AD41 is formed from a single element, like the first housing 13A1, to have a height corresponding to a position based on the height and arrangement of a semiconductor chip CP1 mounted on a carrier SB1. The height adjustment section AD41 is thermally coupled to the semiconductor chip CP1 via a thermally conductive element TGR.

[0195] Similarly, a semiconductor chip CP2, mounted on the substrate SB1, is connected via the thermally conductive element TGR to a top surface (a top surface in Fig. 19) of the first housing 13A1 thermally coupled.

[0196] Even in the example of Fig. Figure 19 illustrates only the height adjustment section AD41. However, in a case where a large number of heat-target semiconductor chips are mounted on the carrier SB1, the height adjustment sections are formed as part of the first housing 13A1 at positions corresponding to the heat-target semiconductor chips.

[0197] The second housing 13A2 is soldered to and integrated with the first housing 13A1 to form the liquid coolant flow path 31.

[0198] Even in the example of Fig. For ease of understanding, the height adjustment section is not formed in the second housing 13A2. However, in a case where the cooling target semiconductor chip is located on a second carrier SB2 positioned below the second housing 13A2, the height adjustment section may be formed at a position corresponding to the semiconductor chip on the second carrier SB2.

[0199] As described above, in the fifteenth embodiment, the peaks or valleys of the straight rib 32S and the wave rib 32W do not overlap. Therefore, the shape of the height adjustment section AD41 can be retained, and a smoothing effect is also maintained, so that heat exchange efficiency is not reduced.

[0200] In the description above, a combination of the straight rib and the wavy rib was described as a combination of rib shapes in which the peaks or valleys of the ribs do not overlap when the ribs are stacked. However, the following combinations, for example, can also be used in addition to such a combination. (1) A combination of the wave rib and an offset rib

[0201] Here, the offset rib refers to a rib in which short straight ribs are successively offset in a direction that intersects a flow direction of the liquid coolant.

[0202] (2) A combination of the straight rib and the offset rib.

[0203] (3) A combination of the offset ribs. (16) Sixteenth embodiment

[0204] Fig. Figure 20A is a schematic explanatory cross-sectional view of a thick metal plate used in a sixteenth embodiment.

[0205] Fig. Figure 20B is a schematic explanatory cross-sectional view of a height adjustment element of the sixteenth embodiment.

[0206] Fig. Figure 20C is a schematic explanatory cross-sectional view illustrating an assembly state of a cooling unit of the sixteenth embodiment.

[0207] In Fig. 20A, Fig. 20B and Fig. Sections 20B are those corresponding to the seventh embodiment in Fig. 11 similar items are designated with the same reference symbols.

[0208] In the sixteenth embodiment, a height adjustment section AD61 is formed by pressing the thermally conductive thick metal plate using a press machine, while a section is left to form a projection.

[0209] In particular, a thermally conductive thick metal plate AD60, which is in Fig. Figure 20A illustrates the pressing process, and the height adjustment element AD61 is formed by pressing using the press, while leaving a section where the projection is actually formed.

[0210] According to the sixteenth embodiment, in all cases where a combination of a first housing 13D1 and a second housing 13D2 of a cooling unit 13D is the same (completely common), only one of the first housing 13D1 and the second housing 13D2 is the same (partially common), and the combination of the first housing 13D1 and the second housing 13D2 is completely different, since the shapes of the coupling surfaces of the cooling unit and the height adjustment element are standardized (the shapes do not have to be completely identical and are sufficient for thermal coupling), it is possible to support different carriers by forming the height adjustment element AD61 according to a mounting position and height of a semiconductor chip on a carrier SB1, even in a case where different cooling units are used, and it is possible to cool the semiconductor chip efficiently without increasing the number of components.

[0211] Since it is sufficient if the height adjustment element corresponding to the carrier is designed for the common combination of the first housing 13D1 and the second housing 13D2, a manufacturing process can also be simplified. (17) Seventeenth embodiment

[0212] Fig. 21A is a front view of a cooling unit 13F of a seventeenth embodiment.

[0213] Fig. 21B is a (right) side view of the cooling unit 13F of the seventeenth embodiment.

[0214] Fig. 21C is a rear view of the cooling unit 13F of the seventeenth embodiment.

[0215] The cooling unit 13F comprises heat transfer elements 51F and 51B, a cooling unit body 52, an inlet coupler 53A, an outlet coupler 53B, a screw fastening section 54A, bolts 54B and flow path projections 55A to 55D.

[0216] Each of the heat transfer elements 51F and 51B is implemented by a metal plate and is shown in the examples of Fig. 21A to Fig. In 21C, the heat transfer element 51B is provided with a height adjustment section 51B1 that corresponds to a cooling target semiconductor chip. The height adjustment section is provided as required, and one or more height adjustment sections can be provided in each of the heat transfer elements 51F and 51B.

[0217] In this case, a shape, a height and a planar shape of the height adjustment section 51B1 are determined according to a planar shape and a height of the cooling target semiconductor chip and a mounting position of the semiconductor chip.

[0218] A liquid coolant flow path is formed within the cooling unit body 52 and the cooling unit body 52 performs a heat exchange with the cooling target semiconductor chip via the heat transfer elements 51F and 51B to cool the semiconductor chip.

[0219] The inlet coupler 53A is connected to a coolant cooling / circulation unit (not shown) and a liquid coolant is introduced from the coolant cooling / circulation unit (not shown) into the cooling unit body 52.

[0220] The outlet coupler 53B is connected to the coolant cooling / circulation unit (not shown) and the liquid coolant is released to the coolant cooling / circulation unit (not shown) after heat exchange.

[0221] The screw fastening section 54A is formed as a through hole, and a screw is inserted into the through hole and fastened to it. Fig. 21A and Fig. In section 21B, screw mounting section 54A is used to secure a water cooling unit. However, screw mounting section 54A does not necessarily have this function, and positioning pins may be provided in a required number of through holes as needed.

[0222] The bolts 24B are provided on both of the heat transfer elements 51F and 51B and a corresponding support (not shown) is attached and supported in a state in which it is separated by a predetermined distance.

[0223] This section describes the internal structure of cooling unit 13F.

[0224] Fig. Figure 22 is a partial exploded view (part 1) of the cooling unit of the seventeenth embodiment.

[0225] Fig. Figure 23 is a partial exploded view (part 2) of the cooling unit of the seventeenth embodiment.

[0226] A liquid coolant flow path 61 is formed within the cooling unit body 52 of the cooling unit 13F, and two ribs (guide plates) 62A and 63B for directing a flow of the liquid coolant are arranged in the liquid coolant flow path 61, which has a U-shape in the top view.

[0227] The cooling unit body 52 further comprises a first cooling unit body section 52F, which is provided with the inlet coupler 53A and the outlet coupler 53B, and a second cooling unit body section 52B, which is provided such that it faces the first cooling unit body section 52F and together they form the liquid coolant flow path 61.

[0228] Here, the first cooling unit body section 52F and the second cooling unit body section 52B are joined by brazing, welding or the like.

[0229] The first cooling unit body section 52F is designed such that the elliptical, track-shaped flow path projection 55A, which projects into the liquid coolant flow path 61 in the top view, extends in an X-axis direction in Fig. 22 extends near the inlet coupler 53A.

[0230] Similarly, the first cooling unit body section 52F is designed such that the elliptical, track-shaped flow path projection 55B, which projects into the liquid coolant flow path 61 in the top view, is oriented in the X-axis direction in Fig. 22 extends near the outlet coupler 53B.

[0231] The second cooling unit body section 52B is designed such that the elliptical, track-shaped flow path projection 55C, which projects into the liquid coolant flow path 61 in the top view, is oriented in the X-axis direction in Fig. 22 extends near a position that is partially facing the inlet coupler 53A.

[0232] Similarly, the second cooling unit body section 52B is designed such that the elliptical, track-shaped flow path projection 55D, which projects into the liquid coolant flow path 61 in the top view, is oriented in the X-axis direction in Fig. 22 extends near a position that is partially facing the outlet coupler 53B.

[0233] In the above embodiment, it is assumed that the lengths of the flow path projection 55A and the flow path projection 55B are equal in the X-axis direction and that the lengths of the flow path projection 55C and the flow path projection 55D are equal in the X-axis direction.

[0234] Furthermore, the lengths of flow path extension 55C and flow path extension 55D in the X-axis direction are greater than the lengths of flow path extension 55A and flow path extension 55B in the X-axis direction.

[0235] Fig. Figure 24 is a partially enlarged cross-sectional view of the cooling unit of the seventeenth embodiment.

[0236] As in Fig. As shown in Figure 24, the flow path projection 55A and the flow path projection 55C are joined by brazing, welding or the like on surfaces facing each other to form a connecting section 57.

[0237] Similarly, the flow path projection 55B and the flow path projection 55D are joined by welding or the like on surfaces facing each other to form a connecting section.

[0238] The reason why the flow path projection 55A and the flow path projection 55C are connected, and the flow path projection 55B and the flow path projection 55D are connected in this way, is to ensure the stability of the first cooling unit body section 52F and the second cooling unit body section 52B, and to prevent the cooling unit body 52 from being deformed by liquid coolant pressure.

[0239] Fig. Figure 25 is an illustrative view of a flow of liquid coolant in the cooling unit of the seventeenth embodiment.

[0240] As a result, when the liquid coolant is introduced from the inlet coupler 53A into the liquid coolant flow path 61, the flow of the liquid coolant is directed in a lateral direction of the fin 62A, i.e. in a Y-axis direction. Fig. 22, as indicated by arrows in Fig. 25 displayed, distributed and evenly expanded to provide a uniform flow rate of the liquid coolant, thereby improving heat exchange efficiency.

[0241] When the liquid coolant is expelled from the liquid coolant flow path 61 to the outlet coupler 53B, a vortex is generated to expel the liquid coolant more quickly, thereby suppressing an increase in flow path resistance.

[0242] The foregoing description described a case in which the flow path projections 55A to 55D exhibit track shapes in plan view, but the shapes of the flow path projections are not limited to this.

[0243] The preceding description described a case in which the lengths of flow path protrusion 55C and flow path protrusion 55D are greater than the lengths of flow path protrusion 55A and flow path protrusion 55B, but the lengths of the flow path protrusions may be the same.

[0244] A more specific description is given below.

[0245] Fig. 26A to Fig. Figures 26D are illustrative views of other examples of the flow path protrusion.

[0246] In Fig. 26A to Fig. For ease of understanding, 26D only illustrates the flow path protrusion that is formed adjacent to the rib 62A on the second cooling unit body section 52B.

[0247] Fig. 26A is a top view of a flow path protrusion 55F as another example of the shape of the flow path protrusion.

[0248] The flow path projection 55F extends into the liquid coolant flow path 61, has a triangular shape in plan view and is arranged such that a vertex section faces an upstream side.

[0249] As a result, the liquid coolant introduced by the inlet coupler 53A (not shown) diffuses through the flow path projection 55F towards the fin 62A.

[0250] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55F and can have a shape that is elongated in the X-axis direction or a shape that is shortened in the X-axis direction, as shown in Fig. Figure 22 illustrates this. In short, it is sufficient for the flow path protrusion to be formed in order to achieve a desired diffusion state.

[0251] Even in this case, the flow path projection 55F and the flow path projection that protrudes on the first cooling unit body section 52F are connected by brazing, welding or the like, so that stability can be ensured and deformation of the cooling unit body 52 can be suppressed.

[0252] Fig. 26B is a top view of a flow path protrusion 55G as another form example of the flow path protrusion.

[0253] The flow path projection 55G extends into the liquid coolant flow path 61, has a rounded triangular shape in plan view and is arranged such that a vertex section faces the upstream side.

[0254] Fig. Figure 27A is an explanatory view (part 1) of a flow of liquid coolant on an inlet side.

[0255] As a result, the liquid coolant introduced by the inlet coupler 53A flows along the flow path projection 55G towards the fin 62A, as indicated by arrows in Fig. 27A displayed, diffused.

[0256] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55G and can have a shape that is elongated in the X-axis direction or a shape that is shortened in the X-axis direction, as shown in Fig. Figure 22 illustrates this. In short, it is sufficient for the flow path protrusion to be formed in order to achieve a desired diffusion state.

[0257] Even in this case, the flow path projection 55G and the flow path projection that protrudes on the first cooling unit body section 52F are joined by brazing, welding or the like.

[0258] Fig. 26C is a top view of a flow path protrusion 55H as another example of the shape of the flow path protrusion.

[0259] The flow path projection 55H protrudes into the liquid coolant flow path 61, has an elliptical shape in plan view and is arranged such that a longitudinal direction of it runs along a direction from the upstream side to a downstream side.

[0260] Fig. Figure 27B is an explanatory view (part 2) of a flow of liquid coolant on the inlet side.

[0261] As a result, the liquid coolant introduced by the inlet coupler 53A diffuses through the flow path projection 55H, and some of the liquid coolant recombines to flow towards the fin 62A, as indicated by arrows in Fig. 27B is displayed.

[0262] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55H and can have a shape that is elongated in the X-axis direction or a shape that is shortened in the X-axis direction, as shown in Fig. Figure 22 illustrates this. In short, it is sufficient for the flow path protrusion to be formed in order to achieve a desired diffusion state.

[0263] Even in these cases, the flow path projection 55H and the flow path projection that protrudes on the first cooling unit body section 52F are joined by brazing, welding or the like.

[0264] Fig. 26D is a top view of a flow path protrusion 55J as another form example of the flow path protrusion.

[0265] The flow path projection 55J extends into the liquid coolant flow path 61, has a rounded rhombus shape in the top view and is arranged such that a vertex section faces the upstream side in the longitudinal direction.

[0266] Fig. 27C is an explanatory view (part 3) of a flow of liquid coolant on the inlet side.

[0267] As a result, the liquid coolant introduced by the inlet coupler 53A diffuses through the flow path projection 55J, and some of the liquid coolant recombines to flow towards the fin 62A, as indicated by arrows in Fig. 27°C displayed.

[0268] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55J and can have a shape that is elongated in the X-axis direction or a shape that is shortened in the X-axis direction, as shown in Fig. Figure 22 illustrates this. In short, it is sufficient for the flow path protrusion to be formed in order to achieve a desired diffusion state.

[0269] Even in these cases, the flow path projection 55J and the flow path projection that protrudes on the first cooling unit body section 52F are joined by brazing, welding or the like.

[0270] Fig. 28A is an explanatory view illustrating a case in which the distribution of a flow of liquid coolant on one outlet side is uneven.

[0271] In a case where the distribution of the liquid coolant flow is uneven, as in Fig. Figure 28A illustrates that a vortex is created in the liquid coolant that is discharged by the outlet coupler 53B, reducing the effective discharge velocity and decreasing the heat exchange efficiency.

[0272] Fig. 28B is an explanatory view illustrating a case in which an installation position of the flow path protrusion is shifted to suppress uneven distribution of the liquid coolant flow when the distribution of the liquid coolant flow on the outlet side is uneven.

[0273] If the distribution of the liquid coolant flow is uneven, as for example in Fig. 28B illustrates the flow path protrusion (the flow path protrusion 55J in the example of Fig. 28B) arranged on a side where the liquid coolant flows more (a right side in Fig. 28B), instead of the center of the liquid coolant flow path 61 (indicated by a dashed line CL in Fig. 28B), so that the distribution of the liquid coolant flow is made uniform and the liquid coolant is gently discharged without creating a vortex when it is discharged from the outlet coupler 53B.

[0274] As a result, it is possible to suppress a reduction in the effective outlet velocity and to maintain the heat exchange efficiency at a predetermined value.

[0275] Fig. 29A and Fig. Figure 29B shows illustrative views of other examples of the flow path protrusion.

[0276] Also in Fig. 29A and Fig. 29B illustrates, for easier understanding, only the flow path protrusion that is formed adjacent to the rib 62A on the second cooling unit body section 52B.

[0277] The flow path protrusions in Fig. 29A and Fig. 29B differ from the flow path protrusions in Fig. 26A to Fig. 26D by combining a multitude of protrusions to form the flow path protrusion.

[0278] Fig. 29A is a top view of a flow path protrusion 55K as another example of shape.

[0279] The flow path protrusion 55K is arranged such that a pair of rod-shaped protrusions projecting into the liquid coolant flow path 61 form an inverted V-shape and face the upstream side.

[0280] As a result, when the liquid coolant introduced by the inlet coupler 53A (not shown) passes near the flow path protrusion 55K, the flow path resistance gradually decreases, and the liquid coolant diffuses towards the fin 62A.

[0281] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55K and can have a shape that is elongated in the X-axis direction or a shape that is shortened in the X-axis direction, as shown in Fig. Figure 22 illustrates this. In short, it is sufficient for the flow path protrusion to be formed in order to achieve a desired diffusion state.

[0282] Even in this case, the flow path projection 55F and the flow path projection that protrudes on the first cooling unit body section 52F are connected by brazing, welding or the like, so that stability can be ensured and deformation of the cooling unit body 52 can be suppressed.

[0283] Fig. Figure 29B is a top view of a flow path projection 55L as another example of form.

[0284] The flow path projection 55L is arranged such that pins on a plurality of cylinders projecting into the liquid coolant flow path 61 are arranged in a triangular shape in plan view, and a vertex section of the triangular shape faces the upstream side.

[0285] As a result, the liquid coolant introduced by the inlet coupler 53A (not shown) is gradually diffused towards the fin 62A through the multitude of pins forming the flow path protrusion 55L.

[0286] In this case, a flow path protrusion projecting onto the first cooling unit body section 52F can have the same shape as the flow path protrusion 55L and can have a shape in which the diameter of each pin is enlarged, as in Fig. Figure 22 illustrates this, or a shape in which the diameter of each pin is reduced. In short, it is sufficient for the flow path protrusion to be formed to achieve a desired diffusion state.

[0287] Even in this case, the flow path projection 55L and the flow path projection extending from the first cooling unit body section 52F are joined by brazing, welding or the like.

[0288] As described above, according to the seventeenth embodiment it is possible to suppress a reduction in the effective outlet velocity of the liquid coolant, and finally it is possible to maintain the heat exchange efficiency at a predetermined value, and it is possible to increase the mounting density of the components or to reduce the size of the device.

[0289] Furthermore, it is possible to suppress fluctuations in heat exchange efficiency (heat dissipation efficiency) due to fluctuations in flow velocity at points in the liquid coolant flow path, thereby achieving uniform cooling efficiency and high efficiency.

[0290] Furthermore, by connecting the flow path projection that protrudes on the first cooling unit body section 52F and the flow path projection that protrudes on the second cooling unit body section 52B by brazing, welding or the like, it is possible to improve mechanical stability, improve resistance to liquid coolant pressure, suppress deformation of the cooling unit body section and suppress unnecessary stress on a cooling target component.

[0291] Since pressure loss can be reduced and the output of a pump or similar device for circulating the liquid coolant can be kept low, power consumption can also be reduced and the device can be made smaller.

[0292] In the preceding description, flow path protrusions of the same shape are provided on the liquid coolant inlet side (inlet coupler 53A) and the liquid coolant outlet side (outlet coupler 53B). The flow path protrusion with a shape that prioritizes suppressing flow velocity variations across different locations in the liquid coolant flow path and achieving uniformity can be provided on the liquid coolant inlet side. The flow path protrusion with a shape that prioritizes reducing pressure loss and maintaining a high outlet velocity, while ensuring stability to suppress deformation of the cooling unit body section, can be provided on the liquid coolant outlet side.

[0293] If there is no problem from the point of view of the coolant pressure or the stability of the cooling unit body section (pressure resistance performance during pressurization or pressure relief), a design in which the flow path projection is not provided on the outlet side can be assumed. (18) Eighteenth embodiment

[0294] Fig. Figure 30 is an internal explanatory view of a cooling unit of an eighteenth embodiment.

[0295] A cooling unit 13G comprises a cooling unit body 71, an inlet coupler 72A, an outlet coupler 72B, a screw mounting section 73A and flow path projections 74A and 74B.

[0296] The inlet coupler 72A is connected to a coolant cooling / circulation unit (not shown) and a liquid coolant is introduced from the coolant cooling / circulation unit (not shown) into the cooling unit body 71.

[0297] The outlet coupler 72B is connected to the coolant cooling / circulation unit (not shown) and the liquid coolant is released to the coolant cooling / circulation unit (not shown) after heat exchange.

[0298] The screw fastening section 73A is formed as a through hole, and a screw is inserted into the through hole and fastened to it. Fig. 30. The screw mounting section 73A is used to attach a water cooling unit. However, the screw mounting section 73A does not necessarily have this function, and positioning pins can be provided in a required number of through holes as needed.

[0299] A liquid coolant flow path 75 is formed within the cooling unit body 71 of the cooling unit 13G, and four ribs (directing plates) 76A to 76D for directing a flow of the liquid coolant and a flow path projection 77 are arranged in the liquid coolant flow path 75, which has a U-shape in the top view.

[0300] As in Fig. As shown in Figure 30, in the U-shaped liquid coolant flow path 75, the liquid coolant introduced by the inlet coupler 72A flows through the fin 76A and the fin 76B in a state in which it diffuses through the flow path projection 74A and reverses in a U-shape towards the outlet coupler 72B.

[0301] If the liquid coolant reverses in this way according to a U-shape, a distribution of the liquid coolant flow towards the outside of the liquid coolant flow path 75 (a left side of fin 76C and fin 76D in the example of Fig. 30) postponed.

[0302] Therefore, in the eighteenth embodiment, the flow path projection 77 is provided at a location to which a distribution of a flow of the liquid coolant between the fin 76C and the fin 76D is shifted, as in Fig. Figure 30 shows that the flow of liquid coolant is forced to diffuse and is returned to a side where less liquid coolant flows, so that the flow introduced into fin 76D is again less displaced and flows towards the outlet coupler 72B, as indicated by arrows in Fig. 30 displayed.

[0303] As described above, by providing the flow path projection 77, the distribution of the liquid coolant flow is made uniform and the liquid coolant that is discharged from the outlet coupler 72B is discharged gently.

[0304] As a result, it is possible to suppress a reduction in the effective outlet velocity and to maintain the heat exchange efficiency at a predetermined value.

[0305] Fig. 31A and Fig. Figure 31B are explanatory views of a modified example of the eighteenth embodiment.

[0306] Fig. Figure 31A is a partial cross-sectional view of a liquid coolant flow path of the modified example of the eighteenth embodiment.

[0307] Fig. Figure 31B is a cross-sectional view of the liquid coolant flow path of the modified example of the eighteenth embodiment.

[0308] For example, in the eighteenth embodiment, in a case where a CP30 semiconductor chip, the height of which must be adjusted at a section corresponding to rib 76A, is mounted on a carrier (not illustrated) that is located at the top in Fig. 31A and Fig. 31B is positioned, the liquid coolant flow path is bent upwards in a zigzag shape without providing a height adjustment section, so that the height in the liquid coolant flow path 75 becomes uniform.

[0309] By forming rib 76A further using three ribs 76A1 to 76A3 which have the same height, the cooling unit body 71 can be brought into direct contact with the semiconductor chip CP30, and the semiconductor chip CP30 can be cooled more efficiently.

[0310] The above description described the modified example of the eighteenth embodiment, but such a modified example can be similarly applied to other embodiments.

[0311] As described above, the fins that have the same height can be used as the fin, and thus it is possible to reduce manufacturing costs and to carry out highly efficient cooling compared to a case in which the height of the liquid coolant flow path is partially changed and fins that have different heights are used. (19) Nineteenth embodiment

[0312] Fig. Figure 32 is a perspective exterior view of a cooling unit of a nineteenth embodiment, viewed from the rear.

[0313] In Fig. 32 are sections that correspond to those in Fig. 21A and Fig. 21B are similar, designated with the same reference symbols.

[0314] A cooling unit 13H comprises a cooling unit body 81, an inlet coupler 53A, a screw fastening section 54A and flow path projections 55C and 55D.

[0315] In this case, a heat-insulating projection 85 is provided in a flow path on one side of the outlet coupler 53B on a rear side of the cooling unit body 81.

[0316] This section describes the reason why the heat-insulating projection 85 is provided.

[0317] In a case where a semiconductor chip CP31 and a semiconductor chip CP32 are arranged without providing the heat-insulating projection 85, there is a possibility that heat transferred from the semiconductor chip CP31 to a liquid coolant via a thermally conductive element TGR and a height adjustment section AD81, and heat transferred from the semiconductor chip CP32 to the liquid coolant via the thermally conductive element TGR, will overlap and cooling will not be carried out normally.

[0318] Therefore, in the nineteenth embodiment, the heat-insulating projection 85 is provided, a space through which the liquid coolant can pass is provided under the heat-insulating projection, and heat transferred from the semiconductor chip via the thermally conductive element to the liquid coolant is immediately moved by causing the liquid coolant to flow in a space 85X to prevent thermal degradation.

[0319] As a result, in the nineteenth embodiment, even the liquid coolant can be cooled with high efficiency immediately before it is released, and a highly reliable device can be implemented. (20) Twentieth embodiment

[0320] Fig. Figure 33 is an explanatory view of a twentieth embodiment.

[0321] As in Fig. Figure 33 shows that a semiconductor chip CP31 and a semiconductor chip CP32, which are the cooling target heat sources, are positioned facing each other, with a cooling unit body 81 arranged between them.

[0322] In such a situation, if the semiconductor chip CP31 and the semiconductor chip CP32 are arranged without providing a heat-insulating projection 85, there is a possibility that heat transferred from the semiconductor chip CP31 to a liquid coolant via a thermally conductive element TGR and a height adjustment section AD81, and heat transferred from the semiconductor chip CP32 to the liquid coolant via the thermally conductive element TGR, will overlap and cooling will not be carried out normally.

[0323] Therefore, in the twentieth embodiment, the heat-insulating projection 85 is provided, a space 85X through which the liquid coolant can pass is provided below the heat-insulating projection 85, and heat transferred from the semiconductor chip CP32 via the thermally conductive element TGR to the liquid coolant is immediately moved by causing the liquid coolant to flow in the space 85X to prevent thermal degradation.

[0324] As a result, in the embodiment of the twentieth embodiment, even when heat sources are located at positions facing each other via a cooling unit 13H, cooling can be carried out with high efficiency and a highly reliable device can be implemented. (21) Twenty-first embodiment

[0325] Fig. Figure 34 is a partial exploded view of a cooling unit of a twenty-first embodiment.

[0326] In Fig. 34 are sections corresponding to those of the cooling unit of the seventeenth embodiment in Fig. 23 similar items are designated with the same reference symbols.

[0327] A liquid coolant flow path 61 is formed within a cooling unit body 52 of a cooling unit 13J, and two ribs (directing plates) 62C and 62B for directing a flow of liquid coolant are arranged in the liquid coolant flow path 61, which has a U-shape in the top view.

[0328] The cooling unit body 52 further comprises a first cooling unit body section 52A, which is provided with an inlet coupler 53A and an outlet coupler 53B, and a second cooling unit body section 52B, which is provided such that it faces the first cooling unit body section 52A and together they form the liquid coolant flow path 61.

[0329] Here, the first cooling unit body section 52A and the second cooling unit body section 52B are connected by brazing, welding or the like.

[0330] The first cooling unit body section 52A is designed such that an elliptical, track-shaped flow path projection 55A, which projects into the liquid coolant flow path 61 in the top view, extends in the X-axis direction in Fig. 22 extends near the inlet coupler 53A.

[0331] Similarly, the first cooling unit body section 52A is designed such that an elliptical, track-shaped flow path projection 55B, which projects into the liquid coolant flow path 61 in the top view, extends in the X-axis direction in Fig. 22 extends near the outlet coupler 53B.

[0332] The second cooling unit body section 52B is designed such that an elliptical, track-shaped flow path projection 55C, which projects into the liquid coolant flow path 61 in the top view, extends in the X-axis direction in Fig. 22 extends near a position that is partially facing the inlet coupler 53A.

[0333] Similarly, the second cooling unit body section 52B is provided such that an elliptical, track-shaped flow path projection 55D, which projects into the liquid coolant flow path 61 in the top view, extends in the X-axis direction in Fig. 22 extends near a position that is partially facing the outlet coupler 53B.

[0334] In the above embodiment, in contrast to rib 62B, a tip of rib 62C, which is adjacent to the inlet coupler 53A, is cut obliquely.

[0335] This is because the liquid coolant supplied by the inlet coupler 53A has a high flow velocity in a central section, thus increasing flow path resistance, and a low flow velocity in both end sections, thus reducing flow path resistance, resulting in a uniform flow as a whole.

[0336] As a result, by providing the fin 62C, whose tip is cut at an angle, a uniform distribution of the liquid coolant flow is achieved and the liquid coolant discharged by the outlet coupler 72B is gently discharged, making it possible to suppress a reduction in the effective outlet velocity and to maintain the heat exchange efficiency at a predetermined value. (22) Twenty-second embodiment

[0337] Fig. Figure 35 is a top view of a cooling unit of a twenty-second embodiment.

[0338] Fig. 35 represents a state in which a cooling unit 13K is housed in a casing 80.

[0339] The cooling unit 13K of the twenty-second embodiment comprises a cooling unit body 71, an inlet coupler 72A, an outlet coupler 72B and a cooling block CB.

[0340] A liquid coolant flow path 73 is provided in the cooling unit body 71, as shown by a thick dashed line in Fig. 35 displayed.

[0341] The cooling unit body 71 further comprises a first cooling unit body section 72BF, which is provided with the inlet coupler 72A and the outlet coupler 72B, and a second cooling unit body section 72BB, which is provided such that it faces the first cooling unit body section 72BF and together they form the liquid coolant flow path 73.

[0342] As can be seen from a design of the liquid coolant flow path 73, the cooling unit 13K only cools one semiconductor chip CP41 as a heat source via the cooling block CB.

[0343] Fig. 36 is a cross-sectional view of a section enclosed by a dashed line frame BA in Fig. 35 corresponds to this.

[0344] As in Fig. As shown in Figure 36, a heat transfer section CB12, which projects from a cover section CB11 and which in plan view has a track shape for closing an opening 72H, which is provided in a watertight condition in the first cooling unit body section 72BF, is inserted into the opening 72H in the cooling block CB.

[0345] Then, in a state in which an O-ring 83 is inserted into a groove provided in the cover section CB11 and a groove provided in the first cooling unit body section 72BF, a screw 82 is inserted through a screw hole provided in the cover section CB11 and screwed into a screw groove provided in the first cooling unit body section 72BF, and the heat transfer section CB12 is arranged in the liquid coolant flow path 73 in a watertight state.

[0346] As a result, a flow occurs, as if through arrows in Fig. 36 indicates a liquid coolant in the liquid coolant flow path 73, whereby heat generated by the semiconductor chip CP41 as a heat source is transferred via a thermally conductive element TGR and the cooling block CB to the liquid coolant in order to dissipate heat.

[0347] Therefore, as in each of the above embodiments, the heat can be transferred directly to and dissipated by the liquid coolant without passing through the cooling unit body, thus further improving cooling efficiency.

[0348] Therefore, according to the twenty-second embodiment, cooling can even be efficiently carried out with a heat source that generates a large amount of heat than the CP41 semiconductor chip, such as a power semiconductor of a power system.

[0349] Fig. Figure 37 is a cross-sectional view of a cooling unit of a modified example of the twenty-second embodiment.

[0350] In Fig. 36 the heat transfer section CB12 is inserted into the opening 72H, but in the present modified example the liquid coolant flow path branches off to the cooling block.

[0351] In particular, as in Fig. Figure 37 illustrates that the liquid coolant flow path 73 is divided into two flow paths, one liquid coolant flow path leading to an opening 72H1 provided in the first cooling unit body section 72BF, and one liquid coolant flow path leading from an opening 72H2 provided in the first cooling unit body section 72BF.

[0352] Furthermore, an opening CB1H1 of a cooling block CB1, which is provided at a position corresponding to the opening 72H1, and an opening CB1H2 of the cooling block CB1, which is provided at a position corresponding to the opening 72H2, are arranged at corresponding positions.

[0353] The O-ring 83 is then inserted into a groove provided in a cover section CB21 and a groove provided in the first cooling unit body section 72BF.

[0354] In parallel, an O-ring 84 is inserted into a groove provided in a heat transfer section CB22 and a groove provided in the first cooling unit body section 72BF.

[0355] Then the screw 82 is inserted through a screw hole provided in the cover section CB21 and screwed into a screw groove provided in the first cooling unit body section 72BF, and the cooling block CB1 is attached to the first cooling unit body section 72BF in a watertight condition.

[0356] Consequently, the liquid coolant flow path leading to the opening 72H1 provided in the first cooling unit body section 72BF and the liquid coolant flow path leading from the opening 72H2 provided in the first cooling unit body section 72BF are connected to each other in the cooling block CB1, so that an integrated liquid coolant flow path is formed.

[0357] As a result, a flow occurs, as if through arrows in Fig. As indicated in Figure 37, the liquid coolant flows simultaneously with the flow in the liquid coolant flow path 73 into the cooling block CB1, and heat generated by the semiconductor chip CP41 as a heat source is transferred via the thermally conductive element TGR and the cooling block CB1 to the liquid coolant to dissipate heat.

[0358] If, according to such an embodiment, the opening CB1H1 is provided in the position corresponding to the opening 72H1 in the cooling block CB1, and the opening CB1H2 is provided in the position corresponding to the opening 72H2 in the cooling block CB1, the shape of the cooling block CB1 can be easily modified. Therefore, the degree of design freedom is further improved by forming the cooling block CB1 in a shape corresponding to a target heat source.

[0359] Therefore, according to the present modified example, as in each of the above embodiments, heat can be transferred directly to and dissipated from the liquid coolant without passing through the cooling unit body, while further improving the degree of design freedom, so that cooling efficiency can be further improved and even a heat source that generates a large amount of heat can be efficiently cooled. (23) Twenty-third embodiment

[0360] Fig. Figure 38 is an explanatory view of a twenty-third embodiment.

[0361] Fig. Figure 38 illustrates an embodiment in which semiconductor chips CP41 to CP43, each mounted on three carriers SB21 to SB23, are cooled by a cooling unit as heat sources.

[0362] As in Fig. As illustrated in Figure 38, a cooling unit 13L of the twenty-third embodiment is designed to provide cooling not only via a first cooling unit body section 91F and a second cooling unit body section 91B, which are contained in a cooling unit 91 comprising a liquid coolant flow path 92, but also via a frame section 91C and a heat transfer element 101.

[0363] In the example of Fig. 38 The semiconductor chip CP41 is mounted as a heat source on the carrier SB21, the semiconductor chip CP42 is mounted as a heat source on the carrier SB22 and the semiconductor chips CP43 to CP44 are mounted as heat sources on the carrier SB23.

[0364] Additionally, it is assumed that the semiconductor chips CP41 to CP43 generate a large amount of heat, and that the semiconductor chip CP44 generates less heat than the semiconductor chips CP41 to CP43 and therefore does not require significant cooling.

[0365] In the above embodiment, the semiconductor chip CP41 is thermally coupled to the first cooling unit body section 91F of the cooling unit 13L via a thermally conductive element TGR and a height adjustment section AD81.

[0366] The semiconductor chip CP42 is thermally coupled to the second cooling unit body section 91B of the cooling unit 13L via the thermally conductive element TGR and a height adjustment section AD82.

[0367] Since the semiconductor chip CP43 is positioned on a rear side of the carrier SB22 with respect to the cooling unit 13L, the semiconductor chip CP43 is further thermally coupled to the second cooling unit body section 91B of the cooling unit 13L via the thermally conductive element TGR and a height adjustment section AD83 through an opening SB22H provided in the carrier SB22.

[0368] Since the CP44 semiconductor chip generates relatively less heat, the CP44 semiconductor chip is thermally coupled to the heat transfer element 101 via the heat-conducting element TGR and a height adjustment section AD84, and is thermally coupled to the cooling unit 13L via the heat transfer element 101 and the frame section 91C.

[0369] As described above, according to the twenty-third embodiment, even in a case where three or more carriers are provided, the mounted semiconductor chips can be cooled as long as the cooling capacity of the cooling unit 13L allows, and it is not necessary to provide a plurality of cooling units, so that the device can be miniaturized.

[0370] In the description above, the heat transfer element 101 is arranged on a surface of the frame section 91C, which is adjacent to the first cooling unit body section 91F. However, the heat transfer element 101 can also be arranged on a surface of the frame section 91C, which is adjacent to the second cooling unit body section 91B, so that the height of the height adjustment section AD84 can be reduced to further improve cooling efficiency. (24) Twenty-fourth embodiment

[0371] Fig. Figure 39 is an explanatory view of a twenty-fourth embodiment.

[0372] The twenty-fourth embodiment is an embodiment for carrying a heat-generating component contained in a so-called system-in-package (SiP).

[0373] In the case of a SiP mounted on a substrate, it is difficult to implement efficient cooling because a large number of semiconductor chips of varying heights are mounted on the SiP itself.

[0374] Therefore, in the twenty-fourth embodiment, openings are provided in a heat transfer element, and heat transfer blocks with different plate thicknesses are installed in the respective openings and brazed or welded to accommodate a height difference between the respective heat-generating components in the SiP, thereby optimizing the thickness of a thermally conductive element TGR (gap filler or thermal interface material (TIM)).

[0375] More precisely, as in Fig. Figure 39 illustrates that semiconductor chips CP51 to CP53 of different heights are mounted on a SiP 110, which is mounted on a carrier SB31.

[0376] Meanwhile, in a cooling unit 13M of the twenty-fourth embodiment, a liquid coolant path 112 is provided in a cooling unit body 111, and a heat transfer element 113 with a plurality of openings is provided on a surface of the cooling unit 13M by brazing or welding.

[0377] Metal blocks MB1 to MB3, serving as thermal interface materials (TIMs) that match the heights of the semiconductor chips CP51 to CP53, are attached to the respective openings of the heat transfer element 113 by brazing.

[0378] As a result, the thicknesses of gap fillers GF1 to GF3 as thermally conductive elements TGR can be optimized to more suitable thicknesses.

[0379] As a result, according to the twenty-fourth embodiment, even in a case where the semiconductor chips with different heights are mounted in a narrow area such as the SiP 110, it is possible to easily accommodate such a difference.

[0380] Since the shape of the heat transfer element 113 can be easily changed, the cooling unit body 111 can be standardized to easily accommodate specification variations. (25) Twenty-fifth embodiment

[0381] Fig. 40A to Fig. 40C are explanatory views of a twenty-fifth embodiment.

[0382] In the preceding description, a flow path protrusion is provided in the liquid coolant flow path to eliminate any unevenness in the distribution of the liquid coolant flow. However, in the twenty-fifth embodiment, a slot element is provided in the liquid coolant flow path to eliminate the unevenness in the distribution of the liquid coolant flow.

[0383] Fig. Figure 40A is a partial front view of a cooling unit 13N of the twenty-fifth embodiment.

[0384] Fig. Figure 40B is a front view of the slot element of the twenty-fifth embodiment.

[0385] Fig. 40C is an illustrative view in a case where the slot element is inserted into the cooling unit 13N of the twenty-fifth embodiment.

[0386] In the cooling unit 13N of the twenty-fifth embodiment, as in Fig. 40A and Fig. Figure 40C shows a cooling unit body 121 with a slot-shaped insertion hole 121C, which extends from a first cooling unit body section 121F to a second cooling unit body section 121B.

[0387] The cooling unit 13N is equipped with an inlet coupler 123A and an outlet coupler 123B.

[0388] In actual use, the cooling unit 13N is fixed by inserting a slotted element 122 into the slotted insertion hole 121C, causing the slotted element 122 to protrude from the second cooling unit body section 121B, and brazing the slotted element 122 to the cooling unit body 121.

[0389] Fig. 41A and Fig. Figure 41B are explanatory views showing a state in which the slot element of the twenty-fifth embodiment is inserted and brazed.

[0390] Fig. 41A is a cross-sectional view along line BB of Fig. 40A.

[0391] Fig. 41B is a view showing a cross-section along line BB of Fig. 40A after hard soldering of the slot element 122.

[0392] As a result, a slot group 122A, comprising a plurality of slots (holes), is positioned in the liquid coolant flow path adjacent to the inlet coupler 123A in the cooling unit body 121, and all liquid coolant flows through the slot group 122A and flows to the liquid coolant flow path adjacent to the outlet coupler 123B.

[0393] Similarly, a slot group 122B, comprising a plurality of slots (holes), is positioned in the liquid coolant flow path adjacent to the outlet coupler 123B in the cooling unit body 121, and all liquid coolant flows through the slot group 122B and flows to the outlet coupler 123B.

[0394] In this case, the liquid coolant flowing through the slot group 122A is diffused due to a flow path resistance corresponding to the shape of each slot contained in the slot group 122A, so that the distribution of the liquid coolant flow is uniform, and the liquid coolant flows smoothly to the liquid coolant flow path adjacent to the outlet coupler 123B.

[0395] Furthermore, the liquid coolant flows through the slot group 122B, and the liquid coolant is diffused due to a flow path resistance corresponding to the shape of each slot contained in the slot group 122B, so that the distribution of the flow of the liquid coolant is further uniformly designed, and the liquid coolant gently reaches the outlet coupler 123B.

[0396] As a result, the flow of liquid coolant passing through the interior of the outlet coupler 123B is gently released from the outlet coupler 123B without creating a vortex.

[0397] Therefore, it is also possible to suppress a reduction in the effective outlet velocity by the cooling unit 13N of the twenty-fifth embodiment and to maintain the heat exchange efficiency at a predetermined value.

[0398] In this case, since the slot formed in the slot element 122 can be modified in different ways according to an application, the slot can be applied to various applications.

[0399] Fig. Figure 42A is a partial front view of a cooling unit 13N of a first modified example of the twenty-fifth embodiment.

[0400] Fig. Figure 42B is a front view of a slot element of the first modified example of the twenty-fifth embodiment.

[0401] In Fig. 42A and Fig. 42B are sections that correspond to those in Fig. 40A and Fig. 40B are similar, designated with the same reference symbols.

[0402] Fig. 42A and Fig. 42B differ from Fig. 40A and Fig. 40B by providing a through hole 121D with a large width in a slot element 125 instead of the slot-shaped insertion hole 121C, by having a different number of slots, and by having a slot width of a slot that is included in the slot groups 125A and 125B and is positioned in the middle, larger than slot widths of slots that are positioned on both sides.

[0403] As described above, since the slot formed in the slot element 125 can be modified in different ways according to an application, the slot can be applied to various applications.

[0404] Fig. Figure 43 is an explanatory view of a second modified example of the twenty-fifth embodiment.

[0405] Fig. 43 differs from Fig. 40B by the fact that in a slot element 127 a slot group 127A adjacent to the inlet coupler 123A and a slot group 127B adjacent to the outlet coupler 123B are different from each other.

[0406] This means that in the slot group 127A adjacent to the inlet coupler 123A, since the flow rate of the liquid coolant introduced by the inlet coupler 123A is high in a central section, causing fluctuations in the flow rate, no slot is provided in the central section to increase the flow path resistance and to diffuse the liquid coolant.

[0407] On the other hand, since the slot group 127B adjacent to the outlet coupler 123B must gently expel the liquid coolant, the slot width in the middle is increased to reduce the flow path resistance and to gently expel the liquid coolant.

[0408] As a result, it is possible to suppress a reduction in the effective outlet velocity, and finally, it is possible to maintain the heat exchange efficiency at a predetermined value, and efficient cooling can be carried out.

[0409] Fig. Figure 44A is an explanatory view of a third modified example of the twenty-fifth embodiment.

[0410] Fig. Figure 44B is an explanatory view of a fourth modified example of the twenty-fifth embodiment.

[0411] Fig. 44A differs from Fig. 43 by the fact that in a slot element 129 an embodiment of a slot group 129A adjacent to the inlet coupler 123A and an embodiment of a slot group 129B adjacent to the outlet coupler 123B are different from each other.

[0412] This means that in slot group 129A adjacent to the inlet coupler 123A, since the flow rate of the liquid coolant introduced by the inlet coupler 123A is high in a central section, causing fluctuations in the flow rate, a slot with a small width is provided in the central section to increase the flow path resistance and diffuse the liquid coolant. Since slot group 129B adjacent to the outlet coupler 123B must discharge the liquid coolant gently, the slot width is increased in a central section to reduce the flow path resistance and discharge the liquid coolant gently.

[0413] As a result, it is possible to suppress a reduction in the effective outlet velocity, and finally, it is possible to maintain the heat exchange efficiency at a predetermined value, and efficient cooling can be carried out.

[0414] Fig. 44B differs from Fig. 43 by the fact that in a slot element 131, a configuration of a slot group 131A adjacent to the inlet coupler 123A and a configuration of a slot group 131B adjacent to the outlet coupler 123B are different from each other.

[0415] This means that in the slot group 131A adjacent to the inlet coupler 123A, the slot opening ratio is larger than in the third modified example in order to reduce the flow path resistance.

[0416] Similarly, in slot group 131 B adjacent to outlet coupler 123B, the slot opening ratio is larger than in the third modified example in order to further reduce flow path resistance, so that cooling can be carried out efficiently not only when the liquid coolant inlet pressure is high, but also when the liquid coolant inlet pressure is low.

[0417] Since the flow rate of the liquid coolant introduced by the inlet coupler 123A is high in a central section, causing fluctuations in the flow rate, a slot with a small slot width is provided in the central section to increase the flow path resistance and diffuse the liquid coolant. Since the slot group 129B adjacent to the outlet coupler 123B must discharge the liquid coolant gently, the slot width is increased in a central section to reduce the flow path resistance and discharge the liquid coolant gently.

[0418] As a result, it is possible to suppress a reduction in the effective outlet velocity, and finally, it is possible to maintain the heat exchange efficiency at a predetermined value, and efficient cooling can be carried out. (26) Twenty-sixth embodiment

[0419] In each of the foregoing embodiments, an inlet coupler has a substantially cylindrical shape, and a liquid coolant is diffused through a flow path projection or slot element.

[0420] In a twenty-sixth embodiment, a form of the inlet coupler is modified such that the liquid coolant is diffused at a time when the liquid coolant is introduced into a cooling unit body, thus eliminating any unevenness of flow in a liquid coolant flow path in order to achieve a uniform flow.

[0421] Fig. Figure 45A is a top view of an inlet coupler 130 of a first aspect of the twenty-sixth embodiment.

[0422] Fig. Figure 45B is a front view of the inlet coupler 130 of the first aspect of the twenty-sixth embodiment.

[0423] Fig. Figure 45C is a side view of the inlet coupler 130 of the first aspect of the twenty-sixth embodiment.

[0424] As in the Fig. 45A to Fig. As illustrated in Figure 45C, the inlet coupler 130 of the first aspect comprises a bulging section 131, an inlet coupler body section 132 and a flange section 133.

[0425] The curved section 131 functions as a connector section to which a coolant supply pipe of an external coolant cooling / circulation unit, as in Fig. 1 illustrates, is connected, and is provided on a section that is preceded by a cooling unit in the present application.

[0426] The curved section 131 has a substantially cylindrical shape, is formed by curved processing and has a shape that is partially extended in diameter.

[0427] The inlet coupler body section 132 has a shape in which a funnel shape, corresponding to a side face of a so-called truncated cone, is partially compressed. As in Fig. As illustrated in Figure 45B, an aperture section 132A at one tip has an appearance like an infinity symbol, where the apertures of both end sections 132AT are large when viewed from the front, and the aperture of a middle section 132AC is small.

[0428] The flange section 133 has a shape that protrudes in a flange shape and is designed to come into contact with an inner surface of the cooling unit.

[0429] Therefore, when the liquid coolant flows through the interior of the inlet coupler body section 132, the central section 132AC exhibits a higher flow path resistance and is less likely to allow the liquid coolant to flow, so that the liquid coolant is discharged into the liquid coolant flow path in the cooling unit body in a state in which it flows along a fan shape in the top view, which is shown in Fig. 45A illustrates how diffusion occurs.

[0430] As a result, the liquid coolant flows evenly to fins located downstream, and the liquid coolant flows gently to the outlet coupler.

[0431] As a result, it is possible to suppress a reduction in the effective outlet velocity, and finally, it is possible to maintain the heat exchange efficiency at a predetermined value, and efficient cooling can be carried out.

[0432] Fig. Figure 46A is a top view of an inlet coupler 130X of a second aspect of the twenty-sixth embodiment.

[0433] Fig. Figure 46B is a front view of the inlet coupler 130X of the second aspect of the twenty-sixth embodiment.

[0434] Fig. Figure 46C is a side view of the inlet coupler 130X of the second aspect of the twenty-sixth embodiment.

[0435] In Fig. 46A to Fig. Sections 46C are those that are in Fig. 45A to Fig. 45C are similar and are designated with the same reference symbols.

[0436] As in Fig. 46A to Fig. As illustrated in Figure 46C, the inlet coupler 130X comprises a bulging section 131, an inlet coupler body section 132X and a flange section 133.

[0437] The curved section 131 functions as a connector section to which the coolant supply pipe of the external coolant cooling / circulation unit is connected, as shown in Fig. 1 illustrates, is connected, and is provided on a section that is preceded by a cooling unit in the present application.

[0438] The curved section 131 has a substantially cylindrical shape, is formed by curved processing and has a shape that is partially extended in diameter.

[0439] The inlet coupler body section 132X has a shape in which a funnel shape corresponding to a side face of a so-called truncated cone is squashed, and as in Fig. As illustrated in Figure 46B, an opening section 132B has a so-called track shape at one tip, in which the opening width of both end sections 132BT and the opening width of a middle section 132BC are essentially the same when viewed from the front.

[0440] The flange section 133 has a shape that protrudes in a flange shape and is designed to come into contact with the inner surface of the cooling unit.

[0441] Therefore, when the liquid coolant flows through the inlet coupler body section 132X, the liquid coolant is discharged into the liquid coolant flow path in the cooling unit body in a state in which it flows along a fan shape in the top view, which is shown in Fig. 46A illustrates that it diffuses easily.

[0442] As a result, the liquid coolant flows evenly to fins located downstream, and the liquid coolant flows gently to the outlet coupler.

[0443] Additionally, the flow path resistance can be reduced to be lower than that of the inlet coupler 130 of the first aspect.

[0444] As a result, it is possible to suppress a reduction in the effective outlet velocity, and finally, it is possible to maintain the heat exchange efficiency at a predetermined value, and efficient cooling can be carried out. (27) Twenty-seventh embodiment

[0445] As in Fig. As illustrated in Figure 1, a cooling unit, as described in each of the embodiments above, is connected to an external coolant cooling / circulation unit, and a liquid coolant is supplied naturally. Therefore, there is a possibility that the liquid coolant may leak.

[0446] As described above, a cooling unit body has a structure with many irregularities, and even if the cooling unit body is received in a housing, an inlet coupler and an outlet coupler must protrude from the housing, and it is assumed that a fluid enters through a gap formed between the cooling unit body and the housing.

[0447] Furthermore, since the cooling unit body is a cooling device, there is a very high probability that moisture in the air will condense inside the housing, depending on the ambient temperature and humidity.

[0448] Furthermore, since various sensors, such as a temperature sensor and a pressure sensor, a control circuit for controlling the sensors, and an electronic circuit, such as a communication port for communication with the outside, are also contained in the housing, it is desirable to prevent the ingress of liquid from the outside, condensation, or the like as far as possible, and to promote the release of liquid to the outside in a case where ingress of liquid from the outside or condensation occurs, thereby reducing its influence as much as possible.

[0449] Therefore, in view of the above problems, an objective of a twenty-seventh embodiment is to provide a cooling unit having a structure capable of preventing, as far as possible, the ingress of liquid from the outside, condensation, and the like, and, where such ingress or condensation does occur, of reducing the effect of liquid ingress from the outside or condensation as much as possible.

[0450] The problems to be solved are described below before the embodiment is described.

[0451] Fig. Figure 47 is an explanatory perspective view of an example of an enclosure in which the cooling unit is located between the enclosure and a front chassis.

[0452] Fig. Figure 48 is a front view showing a housing in which the cooling unit is located between the housing and the front chassis.

[0453] As in Fig. As shown in Figure 47, if a cooling unit body 133 is located between a front chassis 131 and a housing 132, an inlet coupler 133A and an outlet coupler 133B of the cooling unit body 133 must protrude from the housing 132.

[0454] As a result, as in Fig. Figure 48 illustrates a gap SP formed between the front chassis 131 and an upper surface of the cooling unit body 133.

[0455] Therefore, in order to prevent the ingress of liquid from the outside through such a section, it is necessary to provide an element as a separate component that fills the gap SP.

[0456] Since the cooling unit body 133 of the cooling unit exhibits irregularities caused by drawing or similar processes, its dimensional accuracy is not necessarily high, and thus it is difficult to achieve the desired level of accuracy by using an element as a separate component. Additionally, if the liquid coolant escapes from the inlet coupler 133A or the outlet coupler 133B, there is a possibility that the liquid coolant will penetrate the housing 132.

[0457] Fig. Figure 49 is a perspective external view of the cooling unit attached to a wall element to prevent the ingress of liquids of the twenty-seventh embodiment.

[0458] Fig. Figure 50 is a view of the cooling unit attached to the wall element for preventing the ingress of liquids of the twenty-seventh embodiment, as seen from the inlet coupler and the outlet coupler.

[0459] Fig. Figure 51 is a front view showing a housing in which the cooling unit is located between the housing and the front chassis, and the wall element for preventing the ingress of liquids and an element for preventing the ingress of liquids of the twenty-seventh embodiment are provided.

[0460] A wall element 135 for preventing the ingress of liquids is provided vertically in an up-down direction of the cooling unit body 133 near the inlet coupler 133A and the outlet coupler 133B of the cooling unit body 133, as shown in Fig. Figure 49 illustrates how the gap SP can be filled by pressing an anti-ingress element 136, located between the front chassis 131 and the cooling unit body 133, against a surface 135A of the anti-ingress wall element 135, as shown in Fig. 51 illustrated.

[0461] In the above embodiment, it is sufficient if the wall element 135 is used to prevent the ingress of liquids into openings, which are each provided at positions opposite each other in the top-bottom direction of the cooling unit body 133 in order to penetrate the cooling unit body 133, and is then assembled by brazing.

[0462] Alternatively, to prevent the ingress of liquids, the wall element 135 can be vertically divided into two elements, as shown in Fig. 50, and can be assembled by brazing to the cooling unit body 133 from above and below the cooling unit body 133. (28) Twenty-eighth embodiment

[0463] Next, a twenty-eighth embodiment will be described.

[0464] The twenty-eighth embodiment is an embodiment for preventing the ingress of liquid from the outside.

[0465] Fig. Figure 52 is an explanatory view of the twenty-eighth embodiment.

[0466] In the twenty-eighth embodiment, a gap SP is defined between a Fig. Figure 48 illustrated a fluid guide element 141, which is chamfered in a left-right direction when viewed from one side, arranged in front of a wall element 135 to prevent the ingress of fluids in order to cover the gap SP, on a front chassis 131 and an upper surface of a cooling unit body 133.

[0467] As a result, according to the twenty-eighth embodiment, even if the fluid moves from the outside in a direction indicated by an arrow AR1 from above into Fig. As indicated in 49, a path of the liquid through the liquid guide element 141 is blocked, and the liquid flows in a direction indicated by an arrow AR2, so that it is possible to prevent the liquid from penetrating from the outside. (29) Twenty-ninth embodiment

[0468] Next, a twenty-ninth embodiment is described.

[0469] Fig. Figure 53 is a partially enlarged view of a housing of the twenty-ninth embodiment.

[0470] The twenty-ninth embodiment is an embodiment that corresponds to a countermeasure for a housing in which a liquid from the outside penetrates between a housing 132 and a cooling unit body 133 or between the cooling unit body 133 and a front chassis 131, or a housing in which the liquid is generated due to dew condensation.

[0471] Therefore, the housing 132 of the twenty-ninth embodiment is provided with a fluid outlet hole 151, which is positioned on a lower side when the housing 132 is actually installed in a vehicle or the like.

[0472] In this case, the liquid outlet hole 151 is preferably provided in the housing on a side where no electronic component, such as a semiconductor chip, or electrical component, such as a connector terminal, is located.

[0473] According to such a design, even if the liquid penetrates from the outside between the housing 132 and the cooling unit body 133 or between the cooling unit body 133 and the front chassis 131, or even if the liquid is generated due to dew condensation, it is possible to immediately release the liquid to the outside, and it is possible to avoid any adverse effect caused by the ingress of the liquid or the like.

[0474] Fig. Figure 54 is an explanatory view of a modified example of the twenty-ninth embodiment.

[0475] In the example of Fig. 54 Liquid outlet holes 151A and 151B are provided on a lower side when the housing 132 is actually installed in a vehicle or the like.

[0476] Furthermore, tilting elements 152A to 152C are provided in the housing 132 and are designed to act in the Fig. 54 To direct the liquid falling from above to the liquid outlet hole 151A or the liquid outlet hole 151B and to quickly discharge the liquid to the outside.

[0477] Consequently, even if the liquid penetrates from the outside between the housing 132 and the cooling unit body 133 or between the cooling unit body 133 and the front chassis 131, or even if the liquid is generated due to dew condensation, it is possible to immediately drain the liquid to the outside, and it is possible to avoid any adverse effect caused by the ingress of the liquid or the like. (30) Thirtieth embodiment

[0478] Next, a thirtieth embodiment is described.

[0479] Fig. Figure 55 is an explanatory view of the thirtieth embodiment.

[0480] The thirtieth embodiment is an embodiment that corresponds to a countermeasure in a case in which a liquid is generated due to dew condensation on a cooling unit body 133.

[0481] Therefore, a liquid absorption element 155, which absorbs the liquid produced by dew condensation, is arranged to adhere to a surface of the cooling unit body 133 of the thirtieth embodiment.

[0482] For example, a nonwoven fabric or the like is used as the liquid absorption element 155.

[0483] As a result, even if condensation occurs, the liquid does not drip off immediately, making it possible to reduce the impact on an electronic carrier or similar component installed in a housing and to further improve reliability.

[0484] Fig. Figure 56 is an explanatory view of a first modified example of the thirtieth embodiment.

[0485] In the first modified example of the thirtieth embodiment, a liquid outlet hole 151 is provided on a lower side when a housing 132 is actually installed in a vehicle or the like.

[0486] In this case, the liquid outlet hole 151 is preferably provided in the housing on a side where no electronic component, such as a semiconductor chip, a carrier, or an electrical component, such as a connector terminal, is located.

[0487] For example, a liquid absorption element 155A, having a starting plate shape, is arranged to adhere to a surface of the cooling unit body 133 of the first modified example of the thirtieth embodiment.

[0488] For example, a nonwoven fabric or the like is used as the liquid absorption element 155A.

[0489] As a result, if dew condensation occurs, the generated liquid is absorbed by the liquid absorption element 155A and does not drip off immediately.

[0490] Furthermore, if a large amount of dew condensation occurs, the liquid produced by dew condensation gradually shifts due to gravity to a pointed section at the lower end of the liquid absorption element 155A. If the liquid cannot be retained by the liquid absorption element 155A, it drips due to gravity from the pointed section at the lower end to the liquid outlet hole 151 and is discharged from the housing 132.

[0491] Therefore, the influence on the electronic carrier or the like installed in the housing 132 can be reduced and the reliability can be further improved.

[0492] Fig. Figure 57 is an explanatory view of a second modified example of the thirtieth embodiment.

[0493] In the second modified example of the thirtieth embodiment, fluid outlet holes 151A and 151B are provided on a lower side when the housing 132 is actually installed in a vehicle or the like.

[0494] In this case, the liquid outlet holes 151A and 151B in the housing 132 are preferably provided on a side where an electronic component, such as a semiconductor chip, a carrier, or an electrical component, such as a connector terminal, is not arranged.

[0495] For example, a W-shaped liquid absorption element 155B is arranged to adhere to the surface of the cooling unit body 133 of the modified example of the thirtieth embodiment.

[0496] For example, a nonwoven fabric or the like is used as the liquid absorption element 155B.

[0497] As a result, if dew condensation occurs, the generated liquid is absorbed by the liquid absorption element 155B and does not drip off immediately.

[0498] Furthermore, if a large amount of dew condensation occurs, the liquid gradually shifts to a pointed section 156A at a lower end of the liquid absorption element 155B or a pointed section 156B at the lower end of the liquid absorption element 155B, as indicated by arrows due to gravity.

[0499] Then, due to gravity, the liquid that has accumulated on the pointed section 156A at the lower end drips to the liquid outlet hole 151A and is released from the housing 132 when the amount of liquid exceeds the absorption capacity of the liquid absorption element 155A.

[0500] Similarly, the liquid that has accumulated on the pointed section 156B at the lower end drips due to gravity to the liquid outlet hole 151B and is released from the housing 132.

[0501] Therefore, the influence on the electronic carrier or the like installed in the housing 132 can be reduced and the reliability can be further improved. (31) Thirty-first embodiment

[0502] Next, a thirty-first embodiment is described.

[0503] Fig. Figure 58 is a perspective exterior view of a cooling unit of a thirty-first embodiment.

[0504] A cooling unit 160 of the thirty-first embodiment can accommodate an electronic circuit board, a terminal plate and the like, and includes a front chassis 161, a housing 162, a cooling unit body 163 and a sealing element 164.

[0505] For ease of understanding, the electronic circuit board, the connection plate, and the like are not illustrated in the following description, but in an actual device, the electronic circuit board, the connection plate, and the like are arranged between the front chassis 161 and the cooling unit body 163 or between the housing 162 and the cooling unit body 163. The same applies to the following embodiments.

[0506] Fig. Figure 59 is an exploded view of the cooling unit of the thirty-first embodiment.

[0507] In Fig. The front chassis 161 is not illustrated in Figure 59 for easier understanding.

[0508] As in Fig. As illustrated in Figure 59, the sealing element 164 comprises a first sealing element 164A and a second sealing element 164B.

[0509] By using two elements, the first sealing element 164A and the second sealing element 164B, sealing capability is ensured and assembly ease is improved.

[0510] Then a notch 164A1 of the first sealing element 164A is placed on a contact surface 162B of the housing 162 in a state in which an engagement projection section 162A of the housing 162 is inserted into the notch 164A1.

[0511] In this state, the cooling unit body 163 is arranged in the housing 162 such that the first sealing element 164A comes into contact with a predetermined position on the cooling unit body 163.

[0512] Then the second sealing element 164B is inserted from above onto the cooling unit body 163 and the second sealing element 164B is attached to the housing 162.

[0513] Then the (not illustrated) front chassis 161 is superimposed and attached from above, with the assembly taking place in a Fig. The illustrated state is complete in 59.

[0514] In the embodiment of the thirty-first embodiment, it is possible to reliably ensure a sealing condition between the cooling unit body 163 and the front chassis 161 and the housing 162 using a simple process, and it is possible to guarantee the operation of an electronic device located between the housing 162 and the front chassis 161 and to maintain a high level of reliability. (32) Thirty-second embodiment

[0515] Next, a thirty-second embodiment is described.

[0516] Fig. Figure 60 is a perspective exterior view of a cooling unit of the thirty-second embodiment.

[0517] A cooling unit 170 of the thirty-second embodiment comprises a front chassis 171, a housing 172, a cooling unit body 173 and a sealing element 174.

[0518] Fig. Figure 61 is an exploded view of the cooling unit of the thirty-second embodiment.

[0519] Also in Fig. The front chassis 171 is not illustrated in Figure 61 for easier understanding.

[0520] As in Fig. 60 and Fig. As illustrated in Figure 61, the sealing element 174 is made of rubber and has a C-shape comprising a first arm section 174A and a second arm section 174B.

[0521] Fig. Figure 62A is a perspective external view of the cooling unit body 173 in an assembled state.

[0522] Fig. Figure 62B is a front view of the cooling unit body 173 in the assembled state.

[0523] Since the sealing element 174 has a C-shape that includes the first arm section 174A and the second arm section 174B, assembly is improved.

[0524] Fig. Figure 63 is an illustrative view of one step in the insertion of the sealing element into the cooling unit.

[0525] As in Fig. Figure 63 illustrates that when the sealing element 174 is inserted into the cooling unit body 173, the first arm section 174A and the second arm section 174B of the sealing element 174, which is made of rubber, open to a position 174AX and a position 174BX, as shown by the dashed lines in Fig. 63 is displayed, and inserted at predetermined positions on the cooling unit body 173.

[0526] When the first arm section 174A and the second arm section 174B are returned to their original positions in this state, the Fig. 62B illustrated condition preserved.

[0527] Then the (not illustrated) front chassis 171 is superimposed and attached from above, with the assembly taking place in a Fig. The illustrated state 60 is complete.

[0528] In the embodiment of the thirty-second embodiment, it is possible to reliably ensure a sealing condition between the cooling unit body 173 and the front chassis 171 and the housing 172 using a simple process, and it is possible to guarantee the operation of an electronic device that is arranged either on the housing 172 or the front chassis 171 and to maintain a high level of reliability. (33) Thirty-third embodiment

[0529] Next, a thirty-third embodiment is described.

[0530] Fig. Figure 64 is an exploded view (part 1) of a cooling unit of the thirty-third embodiment at the time of assembly.

[0531] A cooling unit 180 of the thirty-third embodiment comprises a cooling unit body housing section 181 and a coupling plate 182.

[0532] The cooling unit body housing section 181 is formed by integrally forming a main part of a cooling unit body and a housing in the embodiments described above and can reduce a liquid penetration path and further improve reliability compared to a case in which the cooling unit body and the housing are formed separately.

[0533] As in Fig. As illustrated in Figure 64, the cooling unit body housing section 181 comprises a liquid coolant flow path formation section 181A1, which forms a liquid coolant flow path, and a fin formation section 181A2, in which fins are formed.

[0534] The liquid coolant flow path formation section 181A1 forms the liquid coolant flow path in conjunction with the coupling plate in a state in which the coupling plate 182 is attached.

[0535] Meanwhile, the coupling plate 182 includes an inlet coupler 182A and an outlet coupler 182B at one end.

[0536] Fig. Figure 65 is an exploded view (part 2) of the cooling unit of the thirty-third embodiment at the time of assembly.

[0537] Fig. Figure 65 represents a state in which the coupling plate 182 is attached to the cooling unit body housing section 181.

[0538] In this case, the cooling unit body housing section 181 and the coupling plate 182 are connected, for example, by FSW processing.

[0539] Fig. Figure 66 is an exploded view (part 3) of the cooling unit of the thirty-third embodiment at the time of assembly.

[0540] In Fig. 66 is a sealing element 183 for blocking a gap between the coupling plate 182 and a front chassis, as described below, and for preventing the fluid from entering the cooling unit 180. It is attached at predetermined positions on the cooling unit body housing section 181 and the coupling plate 182. The sealing element 183 is made of plastic resin or rubber.

[0541] Fig. Figure 67 is a complete perspective view of the cooling unit of the thirty-third embodiment.

[0542] Fig. Figure 67 represents a state in which a front chassis 184 is attached to the cooling unit body housing section 181 to cover the coupling plate 182 and the sealing element 183.

[0543] In this case, for example, the cooling unit body housing section 181 and the front chassis 184 are screwed together.

[0544] According to the thirty-third embodiment, the cooling unit housing section 181 integrally forms the main part of the cooling unit body and the housing in the embodiments described above. Therefore, it is possible to further reduce the probability of fluid ingress from the outside compared to a case in which the main part and the housing are formed separately, and it is possible to guarantee the operation and maintain high reliability of an electronic device arranged between the cooling unit housing section 181 and the front chassis 184. (17) Modified example of embodiment

[0545] The above description did not address the shared use of components, except in the description of the sixteenth embodiment. However, by designing components that incorporate the height-adjustment section, such as the first housing and the second housing of the cooling unit or the height-adjustment element, it is possible to support various supports and efficiently cool a semiconductor chip, which is a target component for cooling, without increasing the number of components.

[0546] The above description primarily described a case where the height adjustment section (the height adjustment element) has a protruding shape. However, depending on the mounting state of the semiconductor chip, which is the cooling target component, the height adjustment section can be designed as a recessed shape, an open shape, or a notched shape.

[0547] In the above description, the semiconductor chip was described as the cooling target component, but the present disclosure is not limited to this, and any component requiring cooling can be applied similarly. For example, the present disclosure can be applied similarly to a storage battery, a transformer, a capacitor, an inductor, a resistive element, a crystal oscillator, a Peltier element, and the like. (18) Summary

[0548] As described above, according to each embodiment, it is possible to easily construct the cooling system according to the mounting state of the cooling target semiconductor chip on the carrier on which the semiconductor chips of different heights are mounted, without a complicated manufacturing process or without increasing the number of components.

[0549] While certain embodiments have been described, these embodiments are presented only as examples and are not intended to limit the scope of the inventions. In fact, the novel methods and systems described herein can be implemented in a multitude of other forms; furthermore, various omissions, substitutions, and modifications can be made to the form of the methods and systems described herein without departing from the spirit of the inventions. The appended claims and their equivalents are intended to cover such forms or modifications that would fall within the scope and spirit of the inventions.

[0550] Furthermore, the effects of the embodiments described in the present description are merely examples and are not limited, and other effects can be provided. Additional note

[0551] The present embodiment may also have the following aspects.

[0552] A cooling device according to a first other aspect is a cooling device that cools a plurality of cooling target chips mounted on a carrier, wherein the cooling device comprises: a heat transfer element designed as a single element and having a plurality of height adjustment sections formed according to the heights of the chips and the mounting positions of the chips; and a liquid cooling unit that is thermally coupled to the heat transfer element and through which a liquid coolant circulates.

[0553] According to the present aspect, the number of components of the heat transfer element can be reduced and the cooling efficiency can be maintained, while simplifying the manufacturing process.

[0554] According to a second other aspect, in the cooling device according to the first other aspect, the liquid cooling unit has a plate shape with two flat cooling surfaces, and The heat transfer element is thermally coupled to at least one of the cooling surfaces.

[0555] According to the present aspect, it is possible to implement a cooling device that is capable of supporting a variety of carrier types while sharing a liquid cooling unit.

[0556] According to a third other aspect, in the cooling device of the first other aspect, the height adjustment section is designed as a projection, a recess, a notch or an opening in the heat transfer element.

[0557] According to the present aspect, the heat transfer elements of various aspects can be formed based on a mounting state (a position, a height and a relationship to other components on the carrier) of the cooling target chip.

[0558] According to a fourth other aspect, the cooling device is in accordance with the first other aspect.

[0559] In the heat transfer element, the height adjustment section is formed by pressing a metal plate.

[0560] According to the present aspect, it is possible to easily form the height adjustment sections according to the mounting conditions of the multitude of cooling target chips.

[0561] According to a fifth other aspect, the cooling device is in accordance with the first other aspect. In the heat transfer element, the height adjustment section is formed by forging a metal plate.

[0562] According to the present aspect, it is possible to easily form the height adjustment sections according to the mounting conditions of the multitude of cooling target chips.

[0563] According to a sixth other aspect, the cooling device is in accordance with the first other aspect. The heat transfer element is hard-soldered to the liquid cooling unit.

[0564] According to the present aspect, it is possible to reliably carry out cooling without changing the mounting position of the heat transfer element on the liquid cooling unit.

[0565] According to a seventh other aspect, the cooling device is according to the sixth other aspect. the height adjustment section is designed as a projection, and The heat transfer element has a hole around the height adjustment section.

[0566] According to the present aspect, if the heat transfer element is brazed to the liquid cooling unit, no bubbles will enter the brazed section, thus reducing thermal resistance and making cooling easier.

[0567] According to an eighth other aspect, in the cooling device according to the first other aspect the heat transfer element is provided on the carrier.

[0568] According to the present aspect, the design of the liquid cooling unit can be simplified and shielding or grounding can be carried out through the heat transfer element.

[0569] A cooling device according to a ninth other aspect is a cooling device that cools a plurality of cooling target chips mounted on a carrier, the cooling device comprising: a liquid cooling unit having a multitude of height adjustment sections arranged according to the heights of the chips and the mounting positions of the chips, and designed as a single element through which a liquid coolant circulates.

[0570] According to the present aspect, the number of components of the heat transfer element can be reduced and the cooling efficiency can be maintained, while simplifying the manufacturing process.

[0571] According to a tenth other aspect, the liquid cooling unit in the cooling device comprises, according to the ninth other aspect: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and the height adjustment section is formed as one element in the first housing and / or the second housing.

[0572] According to the present aspect, cooling efficiency can be maintained with a simple design.

[0573] According to an eleventh other aspect, the liquid cooling unit in the cooling device comprises, according to the tenth other aspect: the height adjustment section is formed as a protrusion with a height corresponding to the relevant cooling target chip.

[0574] According to the present aspect, it is possible to reliably thermally couple the cooling target chip, and cooling efficiency can be improved.

[0575] According to a twelfth other aspect, the liquid cooling unit in the cooling device comprises, according to the eleventh other aspect: a second rib element, arranged between the housing and the first rib element on one side of the flow path space in the projection.

[0576] According to the present aspect, it is possible to avoid a reduction in the stability of the cooling device due to the formation of the height adjustment section and to improve reliability.

[0577] According to a thirteenth other aspect, the liquid cooling unit in the cooling device comprises, according to the twelfth other aspect: a separator for arranging the second rib element separately from the first rib element, provided between the first rib element and the second rib element.

[0578] According to the present aspect, it is possible to maintain a desired flow of liquid coolant by eliminating an overlap between the first fin element and the second fin element at the time of stacking.

[0579] According to a fourteenth other aspect, the liquid cooling unit in the cooling device shows, according to the thirteenth other aspect: The separator has a flat plate shape and is attached to both the first rib element and the second rib element.

[0580] According to the present aspect, a positional relationship between the first fin element and the second fin element can be stabilized to form a stable liquid coolant flow path.

[0581] According to a fifteenth other aspect, the liquid cooling unit in the cooling device includes, according to the thirteenth other aspect: The separator comprises a separator body and a movement limiting element that is bent between ribs of the first rib element of the separator body to come into contact with the ribs of the first rib element in order to limit movement of the separator.

[0582] According to the present aspect, a positional relationship between the first fin element and the second fin element can be stabilized to form a stable liquid coolant flow path.

[0583] According to a sixteenth other aspect, the liquid cooling unit in the cooling device includes, according to the thirteenth other aspect: the separator a separator body; and a movement limiting element that is bent from the separator body into the height adjustment section and comes into contact with a wall of the height adjustment section to limit movement of the separator.

[0584] According to the present aspect, a positional relationship between the first fin element and the second fin element can be stabilized to form a stable liquid coolant flow path.

[0585] According to a seventeenth other aspect, in the liquid cooling unit in the cooling device, according to the thirteenth other aspect: On the flow path space side, in the projection, an extrusion rib attached to the base plate is arranged in a state in which it is in contact with both the housing and the first rib element and its movement is limited.

[0586] According to the present aspect, a stable liquid coolant flow path can be formed.

[0587] According to an eighteenth other aspect, the liquid cooling unit in the cooling device according to the eleventh other aspect is: On the flow path space side, a block-shaped height adjustment section retaining element is arranged in the projection in a state in which it is in contact with both the housing and the first rib element and its movement is limited.

[0588] According to the present aspect, a stable liquid coolant flow path can be formed.

[0589] According to a nineteenth other aspect, the liquid cooling unit in the cooling device includes, according to the ninth other aspect: the liquid cooling unit: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in the first housing and / or the second housing a burr section and a block-shaped element that is inserted and connected into an opening section of the ridge section from one side opposite a side on which the first rib element is positioned, forming the height adjustment section integral with the housing.

[0590] According to the present aspect, a stable liquid coolant flow path can be formed without increasing the number of components.

[0591] According to a twentieth other aspect, the liquid cooling unit in the cooling device includes, according to the ninth other aspect: the liquid cooling unit: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in the first housing and / or the second housing a burr section and a block-shaped element that is inserted into an opening section of the ridge section from one side, on which the first rib element is positioned and connected, as the height adjustment section, which are integrally formed with the housing.

[0592] According to the present aspect, a stable liquid coolant flow path can be formed without increasing the number of components.

[0593] According to a twenty-first other aspect, the liquid cooling unit in the cooling device comprises, according to the eleventh other aspect: a second rib element, arranged on the flow path space side in the projection and between the housing and the first rib element, wherein the rib arrangements of the first rib element and the second rib element are a straight arrangement, a wave arrangement or an offset arrangement and not both are the straight arrangement.

[0594] According to the present aspect, a positional relationship between the first fin element and the second fin element can be stabilized to form a stable liquid coolant flow path.

[0595] According to a twenty-second other aspect, the liquid cooling unit in the cooling device includes, according to the ninth other aspect: the liquid cooling unit: a first casing that forms a casing; a second housing that is integrated with the first housing to form the housing; one or more height adjustment sections formed in the first housing and / or the second housing; and a three-dimensional rib element in which a flow path space through which the liquid coolant flows is formed within the housing which includes the height adjustment section, and a liquid coolant flow path through which the liquid coolant flows in a three-dimensional direction in the flow path space are stacked three-dimensionally.

[0596] According to the present aspect, it is possible to form a stable liquid coolant flow path while maintaining heat exchange efficiency.

[0597] According to a twenty-third other aspect, in the liquid cooling unit in the cooling device according to the twenty-second other aspect: The three-dimensional rib element is formed by stacking a large number of three-dimensional sub-rib elements.

[0598] According to the present aspect, a stable liquid coolant flow path can be ensured and heat exchange can be carried out stably.

[0599] According to a twenty-fourth other aspect, the liquid cooling unit in the cooling device includes, according to the twenty-second other aspect: the liquid cooling unit: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; a multitude of first rib elements stacked in the flow path space, each with the liquid coolant flowing in a zigzag pattern in a direction orthogonal to an overall flow direction; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in at least one of the first housing and the second housing an opening section and a height adjustment element in which one or more height adjustment sections are provided by pressing a thick, plate-shaped metal element and which is connected in such a way that it closes the opening section.

[0600] According to the present aspect, it is possible to obtain a cooling device that is able to support various assembly states with a simple manufacturing process.

[0601] A cooling device according to a twenty-fifth other aspect is: a cooling device that cools a variety of target components mounted on a support, the cooling device comprising: a liquid cooling unit having a plurality of height adjustment sections arranged according to the heights and mounting positions of the cooling target components, and designed as a single element through which a liquid coolant circulates, wherein The liquid cooling unit includes: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and A flow path protrusion that reduces and makes more uniform the uneven distribution of a flow of liquid coolant, provided downstream of the inlet opening or upstream of the outlet opening in the flow path space.

[0602] According to the present aspect, effective cooling efficiency can be improved.

[0603] According to a twenty-sixth other aspect, the cooling device is, according to the twenty-fifth other aspect the flow path protrusion is formed in at least one of the first housing and the second housing.

[0604] According to the present aspect, it is possible to reduce the unevenness of the liquid coolant flow and improve the effective cooling efficiency.

[0605] According to a twenty-seventh other aspect, the cooling device is, according to the twenty-fifth other aspect The flow path projections are provided at both positions facing each other in the first housing and the second housing and are connected at the positions facing each other.

[0606] According to the present aspect, cooling efficiency can be improved, while the stability of the housing is increased and housing deformation is reduced.

[0607] According to a twenty-eighth other aspect, the cooling device exhibits the following characteristics according to the twenty-seventh other aspect: The flow path projections at the positions facing each other have different lengths in one direction of extension of the flow path space.

[0608] According to the present aspect, further diffusion of the liquid coolant can be promoted.

[0609] According to a twenty-ninth other aspect, the cooling device is, according to the twenty-fifth other aspect: a form of flow path protrusion provided downstream of the inlet opening, the same as a form of flow path protrusion provided upstream of the outlet opening.

[0610] According to the present aspect, it is possible to reduce the unevenness of the liquid coolant flow at positions downstream of the inlet opening and upstream of the outlet opening, and to improve the effective cooling efficiency.

[0611] According to one thirtieth other aspect, the cooling device is, according to the twenty-fifth other aspect: a form of flow path protrusion provided downstream of the inlet opening, different from a form of flow path protrusion provided upstream of the outlet opening.

[0612] According to the present aspect, it is possible to appropriately reduce the unevenness of the flow of the liquid coolant at each of the positions downstream of the inlet opening and upstream of the outlet opening, and to improve the effective cooling efficiency.

[0613] According to the thirtieth other aspect, the cooling device exhibits the following according to the twenty-fifth other aspect: the flow path protrusion provided downstream of the inlet opening has a shape designed for the diffusion of the liquid coolant, and The flow path protrusion, provided upstream of the outlet opening, has a shape that suppresses the generation of a vortex.

[0614] According to the present aspect, it is possible to reduce the amount of liquid coolant remaining in the cooling device and to improve heat exchange efficiency.

[0615] According to a thirty-first other aspect, the cooling device is, according to the twenty-fifth other aspect: a large number of rib elements are provided between the inlet opening and the outlet opening, and The flow path projection between the rib element at an upstream position and the rib element at a downstream position is provided.

[0616] According to the present aspect, cooling with reduced unevenness of the liquid coolant flow and further improved heat exchange efficiency can even be carried out in the middle of the flow path space.

[0617] A cooling device according to a thirty-second other aspect is: a cooling device that cools a variety of target components mounted on a support, the cooling device comprising: a liquid cooling unit that is thermally coupled to the cooling target components and causes a liquid coolant to flow into a liquid coolant flow path to cool the cooling target components; an inlet opening that introduces the liquid coolant into the liquid coolant flow path; an outlet opening that expels the liquid coolant from the liquid coolant flow path; and a housing that accommodates the liquid cooling unit in a state in which the inlet opening and the outlet opening protrude, wherein The housing includes a guide element that directs a liquid to be removed in a predetermined direction.

[0618] According to the present aspect, it is possible to prevent the fluid to be removed from reaching the cooling target components, thus making it possible to improve reliability.

[0619] According to a thirty-third other aspect, the cooling device is, according to the thirty-second other aspect The liquid to be removed is a liquid that has entered the housing or a liquid generated within the housing.

[0620] According to the present aspect, it is possible to manage both the fluid to be removed that has penetrated from the outside and the fluid to be removed that is generated in the housing, and it is possible to prevent an influence on the multitude of cooling target components that are mounted on the carrier and to carry out cooling reliably.

[0621] According to a thirty-fourth other aspect, the cooling device is, according to the thirty-second other aspect the housing is provided with one or more outlet holes through which the fluid to be removed is released from the housing, and The guide element directs the fluid to be removed to the outlet hole.

[0622] Since the fluid to be removed is routed out of the housing through the outlet hole, it is possible, according to the present aspect, to prevent the influence on the multitude of cooling target components mounted on the carrier and to reliably carry out cooling.

[0623] According to a thirty-fifth other aspect, the cooling device exhibits, according to the thirty-second other aspect The guide element creates an incline and directs the liquid to be removed in a predetermined direction.

[0624] Since the fluid to be removed is guided in the predetermined direction by the inclination, it is possible, according to the present aspect, to prevent the influence on the multitude of cooling target components mounted on the carrier and to reliably carry out cooling.

[0625] According to a thirty-sixth other aspect, the cooling device is, according to the thirty-fifth other aspect The guide element is provided on an upper surface of the housing, and the liquid coming from above is guided by the inclination to a side surface of the housing.

[0626] Since the guide element directs the fluid coming from above towards the side surface of the housing by means of the inclination, it is possible, according to the present aspect, to prevent the influence on the multitude of cooling target components mounted on the carrier and to reliably carry out cooling.

[0627] According to a thirty-seventh other aspect, the cooling device is according to the thirty-second other aspect. The guide element is made of a material that is able to absorb and retain a predetermined amount of the liquid to be removed.

[0628] According to the present aspect, the movement of the fluid to be removed is limited, and thus it is possible to prevent the influence on the multitude of cooling target components mounted on the carrier and to carry out cooling reliably.

[0629] According to a thirty-eighth other aspect, the cooling device is according to the thirty-sixth other aspect. The guide element is designed to adhere to a surface of the liquid cooling unit.

[0630] According to the present aspect, the guide element can reliably guide the liquid to be removed across the surface of the liquid cooling unit, thus making it possible to reliably carry out cooling while preventing any influence on the multitude of cooling target components mounted on the carrier.

[0631] According to a thirty-ninth other aspect, the cooling device is, according to the thirty-seventh other aspect The guide element is designed such that a tip gradually narrows in a direction of gravity, and the fluid to be removed, which is no longer held, is released from the tip in the direction of gravity due to the weight of the fluid to be removed.

[0632] Since the fluid to be removed, which is no longer held, is released from the tip of the guide element in the direction of gravity due to its weight, the fluid to be removed can be reliably guided without any control, and thus it is possible to reliably carry out cooling while preventing any influence on the multitude of cooling target components mounted on the carrier.

[0633] According to a fortieth other aspect, the cooling device is according to the thirty-ninth other aspect. An outlet hole is provided below the tip for releasing the liquid to be removed from the housing in the direction of gravity.

[0634] According to the present aspect, the liquid to be removed can be reliably drained from the housing.

[0635] According to a forty-first other aspect, the cooling device is according to the thirty-ninth other aspect. The guide element is made from a non-woven fabric.

[0636] According to the present aspect, the liquid to be removed can be reliably guided with a simple design.

[0637] A cooling device according to one forty-second other aspect is: a cooling device that cools a variety of target components mounted on a support, the cooling device comprising: a housing that is integrated with a liquid cooling unit which is thermally coupled to the cooling target components and causes a liquid coolant to flow into a liquid coolant flow path to cool the cooling target components; an inlet opening that projects from the liquid cooling unit and introduces the liquid coolant into the liquid coolant flow path; and an outlet opening that protrudes from the liquid cooling unit and expels the liquid coolant from the liquid coolant flow path.

[0638] Since the housing is integrated with the liquid cooling unit, it is possible, according to the present aspect, to prevent the liquid to be removed from being generated and to prevent the liquid to be removed from reaching the cooling target components, thus improving reliability.

[0639] According to a forty-third other aspect, the cooling device is according to the thirty-second other aspect, or the cooling device is according to the forty-second other aspect. The carrier on which a cooling target component is mounted is designed to be accommodated in the housing.

[0640] According to the present aspect, cooling can be carried out more efficiently.

[0641] A vehicle-internal device according to one forty-fourth other aspect includes: the cooling device according to one of the thirty-second to forty-second other aspects; and the carrier on which the multitude of cooling target components are mounted.

[0642] According to the present aspect, it is possible to prevent the fluid to be removed from reaching the cooling target components, thus making it possible to improve the reliability of the vehicle's internal device.

[0643] According to a forty-fifth other aspect, in the vehicle's internal device, according to the forty-fourth other aspect the cooling device and the support are housed in the casing.

[0644] According to the present aspect, the cooling efficiency for the carrier can be improved and the reliability of the vehicle's internal device can be improved.

[0645] According to a forty-sixth other aspect, in the vehicle's internal device, according to the forty-fourth other aspect... The cooling device and a variety of supports are housed within the casing.

[0646] According to the present aspect, cooling efficiency for the multitude of carriers can be improved and the reliability of the vehicle's internal device can be improved.

[0647] A vehicle-internal device according to one forty-seventh other aspect includes: the cooling device according to the forty-second other aspect; and the carrier on which the multitude of cooling target components are mounted.

[0648] Since the housing is integrated with the liquid cooling unit, it is possible, according to the present aspect, to prevent the generation of the liquid to be removed and to prevent the liquid to be removed from reaching the cooling target components of the carrier, thus improving reliability.

[0649] According to a forty-eighth other aspect, the vehicle-internal device is according to the forty-seventh other aspect. The carrier on which the cooling target components are mounted is designed to be accommodated in the housing.

[0650] Since the number of components can be reduced, reliability can be further improved in accordance with the present aspect.

[0651] While certain embodiments have been described, these embodiments are presented only as examples and are not intended to limit the scope of the inventions. In fact, the novel methods and systems described herein can be implemented in a multitude of other forms; furthermore, various omissions, substitutions, and modifications can be made to the form of the methods and systems described herein without departing from the spirit of the inventions. The appended claims and their equivalents are intended to cover such forms or modifications that would fall within the scope and spirit of the inventions. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 2006-294699 A

[0003]

Claims

[1] Cooling device for cooling a plurality of target components mounted on a support, the cooling device comprising: a heat transfer element designed as a single element and having a plurality of height adjustment sections designed according to the heights of the plurality of cooling target components and the mounting positions of the plurality of cooling target components; and a liquid cooling unit that is thermally coupled to the heat transfer element and through which a liquid coolant circulates. [2] Cooling device according to claim 1, wherein the liquid cooling unit has a plate shape with two flat cooling surfaces and The heat transfer element is thermally coupled to at least one of the cooling surfaces. [3] Cooling device according to claim 1, wherein the heat transfer element is hard-soldered or soldered to the liquid cooling unit, the height adjustment section is designed as a projection and The heat transfer element has a hole around the height adjustment section. [4] Vehicle equipment comprising: the cooling device according to claim 1 and the carrier on which the multiple cooling target components are mounted. [5] Cooling device for cooling a plurality of cooling target components mounted on a support, the cooling device comprising: a liquid cooling unit comprising a plurality of height adjustment sections arranged according to the heights of the plurality of cooling target components and the mounting positions of the plurality of cooling target components, and formed as one element, through which a liquid coolant is circulated. [6] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and the multiple height adjustment sections, designed as the one element in at least one of the first housing and the second housing. [7] Cooling device according to claim 6, wherein the height adjustment section is designed as a projection with a height corresponding to the respective cooling target components. [8] Cooling device according to claim 7, wherein a second fin element is arranged closer to the flow path space in the projection and between the housing and the first fin element. [9] Cooling device according to claim 8, further comprising a separator provided between the first rib element and the second rib element for arranging the second rib element separately from the first rib element, wherein The separator has a flat plate shape and is attached to both the first rib element and the second rib element. [10] Cooling device according to claim 8, further comprising a separator provided between the first rib element and the second rib element to arrange the second rib element separately from the first rib element, wherein The separator includes: a separator body; and a movement limiting element that is bent between ribs of the first rib element of the separator body to be in contact with the ribs of the first rib element in order to limit the movement of the separator. [11] The cooling device according to claim 8, further comprising a separator provided between the first rib element and the second rib element to arrange the second rib element separately from the first rib element, wherein The separator includes: a separator body; and a movement limiting element that is bent from the separator body into the height adjustment section to be in contact with a wall of the height adjustment section in order to limit the movement of the separator. [12] Cooling device according to claim 7, wherein an extrusion rib attached to the base plate is arranged closer to the flow path space in the projection in a state in which it is in contact with both the housing and the first rib element and its movement is restricted. [13] Cooling device according to claim 7, wherein a block-shaped height adjustment section retaining element is arranged closer to the flow path space in the projection in a state in which it is in contact with both the housing and the first rib element and its movement is restricted. [14] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in at least one of the first housing and the second housing a burr section and a block-shaped element that is inserted and connected into an opening section of the ridge section from one side opposite a side where the first rib element is positioned, which are integrally formed with the housing as a height adjustment section. [15] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more first rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in at least one of the first housing and the second housing a burr section and a block-shaped element that is inserted into an opening section of the ridge section from a side where the first rib element is positioned, and on which connecting sections are integrally formed with the housing as height adjustment. [16] Cooling device according to claim 7, wherein a second rib element is arranged closer to the flow path space in the projection and between the housing and the first rib element, The rib arrangements of the first rib element and the second rib element are a straight arrangement, a wave arrangement, or an offset arrangement, and not both are the straight arrangement. [17] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that is integrated with the first housing to form the housing; one or more height adjustment sections formed in at least one of the first housing and the second housing; and a three-dimensional rib element in which a flow path space through which the liquid coolant flows is formed within the housing which includes the height adjustment section, and a liquid coolant flow path through which the liquid coolant flows in a three-dimensional direction in the flow path space are stacked three-dimensionally. [18] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that is integrated with the first housing to form the housing; a multitude of first rib elements stacked in the flow path space, in which the liquid coolant flows in a zigzag pattern in one direction orthogonal to an overall flow direction; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and in at least one of the first housing and the second housing an opening section and a height adjustment element in which one or more height adjustment sections are provided by pressing a thick, plate-shaped metal element and which is connected in such a way that it closes the opening section. [19] Cooling device according to claim 5, wherein the liquid cooling unit comprises: a first casing that forms a casing; a second housing that forms the housing and is integrated with the first housing to form a flow path space through which the liquid coolant flows; one or more rib elements arranged in the flow path space; an inlet opening that introduces the liquid coolant into the flow path space; and an outlet opening that expels the liquid coolant from the flow path space, and A flow path protrusion that reduces and makes more uniform the uneven distribution of a flow of liquid coolant, provided downstream of the inlet or upstream of the outlet in the flow path space. [20] Vehicle internal device, comprising: the cooling device according to claim 5; and the carrier on which the multiple cooling target components are mounted.

Images