Positioning and mounting structure for a chip module

Abstract

A positioning and fixing structure for a chip module (5) which positions and fixes a chip module (5) on a circuit board (4), in which a flow detection element (53) is sealed with a resin so that at least one detection section is exposed, wherein the chip module (5) comprises a soldering fixing section which fixes the chip module (5) to the circuit board (4) by soldering, and a positioning section which performs positioning on the circuit board (4), and the positioning section is provided closer to the flow detection element (53) than the soldering attachment section, wherein the chip module (5) comprises a module body (51) having a base end portion (512) on which the solder fixing portion is provided and a tip portion (511) on which the positioning portion is provided, the positioning portion has a convex portion (514) formed in the tip portion (511) of the module body (51), the solder fixing portion has a connecting terminal (52) protruding from the base end portion (512) of the module body (51), and the convex portion (514) and the connection terminal (52) are positioned on a virtual plane having a mounting surface of the circuit board (4), and wherein the convex portion (514) abuts against a waste substrate (11) supporting the circuit board (4).

Description

Technical area

[0001] The present invention relates to a positioning and fixing structure for chip modules. State of the art

[0002] PTL 1 discloses that "in a positioning structure of an electronic component in a reflow soldering step in which a printed circuit board 1 having a surface-mounted electronic component 2 temporarily placed on a pad 3 with solder paste 4 coated on the pad 3 is transported into a reflow oven by a transport conveyor, and the electronic component 2 is soldered to the printed circuit board 1, a module 7 made of an insulating resin in the electronic component 2 is provided with an engagement unit 9 that engages an engagement portion 5 formed at a location where the electronic component 2 is mounted on the printed circuit board 1 to prevent displacement of the electronic component 2 relative to the printed circuit board 1."

[0003] DE 11 2028 003 407 T5 describes a detection device for a physical quantity which detects, for example, a physical quantity of the intake air of an internal combustion engine. Citation listPatent literature

[0004] PTL 1: JP 2005-45110 A Summary of the inventionTECHNICAL PROBLEM

[0005] For example, in a case of a structure in which a chip module having a detection element is cantilevered from a circuit board, the chip module may be tilted or shifted with respect to the circuit board during solder reflow, resulting in variations in the characteristics of the detection element.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a positioning and fixing structure for chip modules capable of adjusting an inclination and a position of a chip module with respect to a circuit board and reducing mounting deviations. Solution to the problem

[0007] To solve the above problems, the present invention provides a chip module positioning and fixing structure that positions and fixes a chip module, in which a flow detection element is sealed with a resin, on a circuit board so that at least a detection portion is exposed. The chip module has a solder fixing portion that fixes the chip module to the circuit board by soldering, and a positioning portion that performs positioning on the circuit board, and the positioning portion is provided closer to the flow detection element than the solder fixing portion. Here, the chip module includes a module body having a base end portion where the solder fixing portion is provided, and a tip portion where the positioning portion is provided.The positioning portion includes a convex portion formed in the tip portion of the module body. The solder mounting portion includes a connection terminal protruding from the base end portion of the module body. The convex portion and the connection terminal are positioned on a virtual plane including a mounting surface of the circuit board. The convex portion abuts a scrap substrate supporting the circuit board. Advantageous effects of the invention

[0008] According to the present invention, it is possible to adjust the inclination of the chip module with respect to the circuit board and reduce the mounting variations.

[0009] Further features related to the present invention will become apparent from the description of the present application and the accompanying drawings. In addition, problems, configurations, and effects other than those described above will be clarified by the following description of embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a device for detecting physical quantities. Fig. 2 is a rear view of a housing. Fig. 3 is a right side view of a device for detecting physical quantities. Fig. 4 is a cross-sectional view along the line IV-IV in Fig. 1. Fig. 5 is a front view of the physical quantity detecting device showing the housing in perspective. Fig. 6 is a diagram illustrating a configuration of a cover assembly. Fig. Figure 7A is a front view of a printed circuit board on which a chip module and circuit components are mounted. Fig. Figure 7B is a cross-sectional view along line VIIB-VIIB in Fig. 7A. Fig. Figure 7C is a cross-sectional view along line VIIC-VIIC in Fig. 7A. Fig. 8A is a front view of a substrate plate. Fig. Figure 8B is a bottom view of the substrate plate. Fig. Figure 9 is a diagram showing an assembly process of the chip module. Fig. 10A is a front view of a printed circuit board in a second embodiment. Fig. 10B is a cross-sectional view taken along the line XB-XB in Fig. 10A. Fig. 11A is a front view of a printed circuit board according to a third embodiment. Fig. 11B is a cross-sectional view taken along line XIB-XIB in Fig. 11A. Fig. 12A is a front view of a printed circuit board according to a fourth embodiment. Fig. 12B is a cross-sectional view taken along line XIIB-XIIB in Fig. 12A. Fig. 13A is a front view of a printed circuit board according to a fifth embodiment. Fig. 13B is a cross-sectional view taken along line XIIIB-XIIIB in Fig. 13A. Fig. 13C is a cross-sectional view taken along line XIIIC-XIIIC in Fig. 13A. Fig. 14A is a cross-sectional view showing a modification of a Fig. 13B shown circuit board. Fig. 14B is a cross-sectional view showing a modification of a Fig. 13B shown circuit board. Fig. 15A is a perspective view for explaining a sixth embodiment. Fig. 15B is a perspective view for explaining the sixth embodiment. Fig. 16A is a front view of a printed circuit board according to a seventh embodiment. Fig. 16B is a view of the Fig. 16A shown circuit board from below. Fig. 16C is a right side view of the Fig. 16A shown circuit board. Description of embodiments

[0010] The description of the embodiments described below (hereinafter referred to as embodiments) solves various problems in use as a practical product, solves various problems in use as a detection device that detects a physical amount of intake air of a vehicle in particular, and can achieve various effects. One of the various problems addressed in the following embodiments is shown in "Technical Problem" as described above, and one of the various effects obtained by the following embodiments is described in "Advantageous Effects of the Invention." The various problems solved by the following embodiments and the various effects produced by the following embodiments are described in the description of the following embodiments.Therefore, the problems and effects described in the following examples are also described in contents other than the contents of the technical problem and the advantageous effects of the invention.

[0011] In the following embodiments, although the drawing numbers are different from each other, the same reference numeral represents the same component, achieving the same operational effect. With respect to the components already described, only one reference numeral is given in the drawings, and a description thereof may be omitted. <Erste Ausführungsform>

[0012] Fig. 1 to 3 are views illustrating the appearance of a physical quantity detection device. Fig. 1 is a front view of the device for detecting physical quantities, Fig. 2 is a rear view of a housing and Fig. 3 is a right side view of the physical quantity detection device.

[0013] A physical quantity detecting device 1 of the present embodiment is a device for detecting a physical quantity of intake air sucked into an internal combustion engine of an automobile, and is mounted on an intake pipe of the internal combustion engine.

[0014] The physical quantity detection device 1 is used by inserting it into the inlet pipe from a mounting hole provided in a through wall of the inlet pipe. The physical quantity detection device 1 includes a housing 2 and a cover 3 attached to the housing 2. The housing 2 is formed by injection molding a synthetic resin material, and the cover 3 is a plate-shaped member made of a conductive material such as an aluminum alloy. The cover 3 is formed in a thin plate shape and has a wide and flat cooling surface.

[0015] The housing 2 includes a flange 21 for fixing the physical quantity detecting device 1 to the inlet pipe, a connector 23 protruding from the flange 21 and exposed to the outside from an inlet body for electrical connection with an external device, and a measuring portion 22 extending from the flange 21.

[0016] The measuring portion 22 has a thin and elongated shape extending straight from the flange 21, and has wide front and rear surfaces 221 and 222, and a pair of narrow side surfaces 223 and 224. The measuring portion 22 protrudes from an inner wall of the inlet pipe toward a center of the passage of the inlet pipe in a state where the physical quantity detection device 1 is attached to the inlet pipe. The front and rear surfaces 221 and 222 are arranged in parallel along a central axis of the inlet pipe, and among the narrow side surfaces 223 and 224 of the measuring section 22, the side surface 223 on one side of the measuring section 22 is arranged in a lateral direction opposite to an upstream direction of the inlet pipe, and the side surface 224 on the other side of the measuring section 22 is arranged in the lateral direction opposite to a downstream direction of the inlet pipe.When the physical quantity detecting device 1 is attached to the inlet pipe, a tip portion of the measuring portion 22 is a bottom surface 225.

[0017] The physical quantity detection device 1 is provided with a partial passage inlet 201 at the tip portion of the thin and elongated measuring section 22, which extends from the flange 21 to the center of the inlet pipe, so that a measurement error associated with a flow decrease near an inner wall surface can be reduced. In addition, the physical quantity detection device 1 is provided not only with the partial passage inlet 201 at the tip portion of the measuring section 22, which extends from the flange 21 to the center of the inlet pipe, but also with a first outlet 202 and a second outlet 203 of the partial passage at the tip portion of the measuring section 22, and thus the measurement error can be further reduced.

[0018] The physical quantity detecting device 1 has a shape in which the measuring section 22 extends along the axis from an outer wall toward the center of the inlet pipe, but as shown in Fig. As shown in Figure 3, the widths of the side surfaces 223 and 224 are narrow. As a result, the physical quantity detection device 1 can suppress fluid resistance to a measured gas to a small value.

[0019] The measuring section 22 of the physical quantity detection device 1 is inserted into the inlet pipe from the mounting hole provided in the inlet pipe, and the flange 21 of the physical quantity detection device 1 abuts against the inlet pipe and is fixed to the inlet pipe with a screw. The flange 21 has a substantially rectangular shape in plan view with a predetermined plate thickness.

[0020] As in the Fig. 4 and Fig. As shown in Figure 5, the connector 23 has an external terminal 231 provided therein. The external terminal 231 is a terminal for outputting physical quantities such as a flow rate and a temperature as the measurement result of the physical quantity detection device 1, and a power supply terminal for supplying direct current for driving the physical quantity detection device 1.

[0021] The housing 2 is provided with a partial passage groove 210 for forming the partial passage and a circuit chamber 213 for accommodating the circuit board 4. The circuit chamber 213 and the partial passage groove 210 are recessed into the rear surface 222 of the measuring section 22. The circuit chamber 213 is provided in a region located upstream of the inlet pipe in the flow direction of the measured gas on one side (side surface 223 side) in the lateral direction. The partial passage groove 210 is provided over a region on the side of the tip portion of the measuring section 22 in the longitudinal direction (side of the lower surface 225) of the circuit chamber 213 and a region located downstream of the inlet pipe in the flow direction of the measured gas on the other side (side surface 224 side) in the lateral direction of the circuit chamber 213.

[0022] The partial passage groove 210 forms a partial passage in cooperation with the cover 3. The partial passage extends along a protruding direction (longitudinal direction) of the measuring section 22. The partial passage groove 210 forming the partial passage includes a first partial passage groove 211 and a second partial passage groove 212 branching in the middle of the first partial passage groove 211. The first partial passage groove 211 is formed to extend along the lateral direction of the measuring section 22 between the partial passage inlet 201 opening onto the side surface 223 on one side of the measuring section 22 and the first outlet 202 opening onto the side surface 224 on the other side of the measuring section 22.The first partial passage groove 211 forms a first partial passage that receives the measured gas flowing into the inlet pipe from the partial passage inlet 201 and returns the received measurement gas to the inlet pipe from the first outlet 202. The first partial passage extends along the flow direction of the measured gas in the inlet pipe from the partial passage inlet 201 and leads to the first outlet 202.

[0023] The second partial through-groove 212 branches at a position in the middle of the first partial through-groove 211, is bent to a base end portion (flange side) side of the measuring portion 22, and extends along the longitudinal direction of the measuring portion 22. Then, the second partial through-groove 212 is bent in the lateral direction at the base end portion of the measuring portion 22 to the other side (side surface 224 side) of the measuring portion 22, and makes a U-bend at the tip portion of the measuring portion 22 and extends again along the longitudinal direction of the measuring portion 22. Then, it is provided that the second partial through-groove 212 is bent in the lateral direction in front of the first outlet 202 to the other side of the measuring portion 22 and connected to the second outlet 203 opening to the side surface 224 on the other side of the measuring portion 22.The second outlet 203 is arranged opposite the downstream direction of the inlet pipe in the flow direction of the measured gas. The second outlet 203 has an opening area substantially equal to or slightly larger than that of the first outlet 202 and is formed at a position adjacent to the base end portion side of the measuring section 22 in the longitudinal direction of the first outlet 202.

[0024] The second partial passage groove 212 forms a second partial passage, allowing the measured gas branching and flowing from the first partial passage to flow therethrough and returning the measured gas from the second outlet 203 to the inlet pipe. The second partial passage has a reciprocating path along the longitudinal direction of the measuring section 22. That is, the second partial passage has a path that branches in the middle of the first partial passage, extends toward the base end portion side of the measuring portion 22, is folded on the base end portion side of the measuring portion 22 so as to extend toward the tip portion side of the measuring portion 22, and leads to the second outlet 203 arranged opposite to the downstream side of the inlet pipe in the flow direction of the measured gas from the downstream side of the inlet pipe in the flow direction of the measured gas from the partial passage inlet 201.A flow detection element 53 is arranged at an intermediate position of the second partial passage groove 212. The second partial passage groove 212 can ensure a longer length of the second partial passage and can reduce an influence on the flow detection element 53 when pulsation occurs in the intake pipe.

[0025] With the above configuration, it is possible to form the partial passage along an extension direction of the measuring section 22 and ensure a sufficiently long partial passage. As a result, the physical quantity detection device 1 can be provided with a partial passage of a sufficient length. Therefore, the physical quantity detection device 1 can suppress the fluid resistance to a small value and measure a physical quantity of the measured gas with high accuracy.

[0026] Since the first partial passage groove 211 extends along the lateral direction of the measuring section 22 from the partial passage inlet 201 to the first outlet 202, foreign matter such as dust that has entered the first partial passage from the partial passage inlet 201 can be discharged from the first outlet 202 as it is. Therefore, it is possible to prevent foreign matter from entering the second partial passage and to prevent the flow detection element 53 in the second partial passage from being affected.

[0027] Of the partial passage inlet 201 and the first outlet 202 of the first partial passage groove 211, the partial passage inlet 201 has a larger opening area than the first outlet 202. By making the opening area of ​​the partial passage inlet 201 larger than that of the first outlet 202, the measured gas that has flowed through the first partial passage is surely guided to the second partial passage branched in the middle of the first partial passage.

[0028] Fig. 6 is a diagram illustrating a configuration of a cover assembly.

[0029] The cover assembly includes the cover 3 and the circuit board 4 on which the chip module 5 is mounted. The cover 3 is made of a conductive metal material such as an aluminum alloy or a stainless alloy. The cover 3 is composed of a flat plate member sized to cover the back surface 222 of the sensing section 22 and is fixed to the sensing section 22 with an adhesive. The cover 3 covers the circuit chamber 213 of the sensing section 22 and forms a partial passage in cooperation with the first partial through groove 211 and the second partial through groove 212 of the sensing section 22. The cover 3 is electrically connected to a ground by interposing a conductive intermediary member between the cover 3 and a predetermined connector terminal, and has an antistatic function.

[0030] The circuit board 4 on which the chip module 5 is mounted is fixed to a back surface of the cover 3. The circuit board 4 includes, for example, a substrate body 41 of a circuit board. The substrate body 41 has a rectangular shape extending along the longitudinal direction of the measuring section 22. The chip module 5 is fixed to the circuit board 4 at a central position in the longitudinal direction of the circuit board 4 in a state where the chip module 5 protrudes laterally from one end of the circuit board 4 along the lateral direction of the circuit board 4. A module body 51 of the chip module 5 includes a base end portion 512, at least a part of which is received in a receiving portion 412 of the circuit board 4 in the thickness direction of the circuit board 4, and a tip portion 511 protruding laterally from the end of the circuit board 4 along the lateral direction of the circuit board 4.

[0031] In the cover assembly, the circuit board 4 is accommodated in the circuit chamber 213 by attaching the cover 3 to the rear surface 222 of the housing 2, and the chip module 5 is extended between the partial passage and the circuit chamber 213, allowing the tip portion 511 of the module body 51 to be disposed in the partial passage. The flow detection element 53 is provided at the tip portion 511 of the module body 51, and a detection portion of the flow detection portion is exposed and disposed in the second partial passage groove 212.

[0032] Fig. 7A is a front view of a printed circuit board on which a chip module and circuit components are mounted, Fig. Figure 7B is a cross-sectional view along line VIIB-VIIB in Fig. 7A and Fig. Figure 7C is a cross-sectional view along line VIIC-VIIC in Fig. 7A.

[0033] The circuit board 4 is provided with the receiving portion 412 for receiving a part of the chip module 5. As shown in Fig. 7A, the receiving portion 412 is formed by partially cutting out a portion offset at the center of the substrate body 41 in the longitudinal direction and on one side of the substrate body 41 in the lateral direction (cutout portion), and the substrate body 41 has a substantially U-shape in a plan view.

[0034] As in the Fig. 7A, Fig. 7B and Fig. 7C, at least a part of the module body 51 in the thickness direction of the chip module 5 enters the receiving portion 412 of the circuit board 4 and is received there.

[0035] Specifically, a module front surface portion, which is the base end portion 512 of the module body 51, and a surface on which the flow detection element 53 of the module body 51 is provided, is received while entering the receiving portion 412 of the circuit board 4.

[0036] In the present embodiment, the thickness direction part of the module body 51 is accommodated in the accommodation portion 412 of the circuit board 4, so that a mounting height including a thickness of the chip module 5 and a height of the terminals can be controlled. As a result, for example, the mounting height can be reduced to the same height as a compact pressure sensor mounted together with the chip module 5 on the circuit board 4. Further, a mounting height of the mounted components can be controlled to be lower than that of the chip module 5 mounted by stacking on the circuit board 4. Therefore, it is possible to reduce the height of the measuring portion 22, reduce the thickness of the physical quantity detection device 1, and reduce the flow resistance of the main passage in the inlet pipe.

[0037] In the present embodiment, a case where the thickness-direction part of the module body 51 is accommodated in the accommodation portion 412 of the circuit board 4 was described as an example, but the entire module body 51 may be accommodated in the thickness-direction in the accommodation portion 412 of the circuit board 4. With such a configuration, it is possible to further promote the reduction in the height of the measuring portion 22 and reduce the thickness of the physical quantity detection device 1.

[0038] As in Fig. As shown in Fig. 7A, the chip module 5 and an electronic component such as a pressure sensor 42 are mounted on a front side of the circuit board 4. The chip module 5 is provided with a plurality of connection terminals 52 protruding from the base end portion 512 of the module body 51, and the connection terminals 52 are connected to a pad 43 of the circuit board 4 by soldering and integrally fixed to the circuit board 4. The chip module 5 is mounted with the flow detection element 53 and an LSI, which is an electronic component for driving the flow detection element 53.

[0039] The base end portion 512 of the chip module 5 has a plurality of connection terminals 52 projecting in a direction in which the plurality of connection terminals 52 are spaced apart from each other along a lateral direction of the module body 51. On the mounting surface 411 of the substrate body 41 of the circuit board 4, a plurality of pads 43 are provided to be separated from one side and the other side in the longitudinal direction of the circuit board 4, the one side and the other side constituting mutually facing portions with the receiving portion 412 interposed therebetween, and the plurality of connection terminals 52 of the chip module 5 are respectively soldered to the pads 43.

[0040] The plurality of connection terminals 52 consist of a solder fixing portion that fixes the chip module 5 to the circuit board 4 by soldering.

[0041] The chip module 5 is configured by mounting an LSI 54 and the flow detection element 53 on a lead frame 521, and sealing the LSI 54 and the flow detection element 53 with a thermosetting resin. The chip module 5 includes a module body 51 resin-molded into a substantially flat plate shape. The module body 51 has a rectangular shape, extends along the lateral direction of the sensing section 22, and is arranged such that the base end portion 512 on one side of the module body 51 is longitudinally received in the receiving portion 412 of the circuit board 4, and the tip portion 511 on the other side of the module body 51 protrudes longitudinally from the circuit board 4.

[0042] The flow detection element 53 of the chip module 5 is provided so that the detection portion is exposed in a through groove 513 formed in a surface of the module body 51. The through groove 513 is formed over the entire width from one end of the module body 51 in the lateral direction to the other end thereof in the lateral direction, so as to extend along the second partial through groove 212 in the second partial through groove 212. The flow detection element 53 has a diaphragm structure. When the chip module 5 is molded with the resin, the resin molding is performed by applying an introduction nozzle so that the resin does not flow into the surface (detection portion) of the flow detection element 53. In the chip module 5, the flow detection element 53 is sealed with a resin, so that the surface of the flow detection element 53 is exposed.

[0043] The connection terminal 52 of the chip module 5 protrudes from the center in the thickness direction of the module body 51 in the lateral direction of the module body 51. The connection terminal 52 has an opposing surface facing the pad 43 of the circuit board 4, and the opposing surface is set to be positioned at the same height as the mounting surface of the lead frame 521.

[0044] The chip module 5 is electrically and integrally fixed to the circuit board 4 by soldering the plurality of connection terminals 52 provided at the base end portion 512 of the module body 51 to the plurality of pads 43 of the circuit board 4, respectively. The base end portion 512 is fixed to the circuit board 4, and the tip portion 511 protrudes from the circuit board 4, so that the chip module 5 is supported by the circuit board 4 in a so-called cantilevered manner.

[0045] Next, a method of mounting the chip module 5 on the circuit board 4 and attaching the circuit board 4 on which the chip module 5 is mounted to the package will be described.

[0046] Fig. 8A is a front view of a substrate plate, and Fig. Figure 8B is a bottom view of the substrate plate. The chip module 5 is mounted on the circuit board 4 by solder reflow. As shown in the Fig. 8A and Fig. As shown in Fig. 8B, the chip module 5 is transported to a reflow oven while being placed on a substrate plate 10, and solder reflow is performed in the reflow oven.

[0047] As in Fig. As shown in Fig. 8A, the substrate board 10 includes a plurality of circuit boards 4 arranged side by side in a plane, and a scrap substrate 11 supporting the plurality of circuit boards 4. The scrap substrate 11 has a gap 13 with each circuit board 4 and supports each circuit board 4 via a gate 12. In the scrap substrate 11, a cutout portion 14 is provided along the circuit board 4, and the tip portion 511 of the chip module 5 is accommodated when the chip module 5 is placed on the substrate board 10.

[0048] Fig. 9 is a diagram illustrating an assembly process of the chip module. The chip module 5 is placed on the substrate board 10 and arranged at a predetermined position in a posture in which a module front surface portion and a module rear surface portion of the chip module 5 are positioned downward and upward. When the chip module 5 is inserted into the substrate board 10, the base end portion 512 is received in the receiving portion 412 of the circuit board 4, and the tip portion 511 is received in the cutout portion 14 of the scrap substrate 11.

[0049] Then, the connection terminals 52 of the chip module 5 are arranged on the pads 43 provided on the mounting surface 411 of the circuit board 4, and the base end portion 512 of the module body 51 is supported by the circuit board 4. Since the chip module 5 is arranged so that the tip portion 511 of the module body 51 protrudes from the circuit board 4, the center of gravity of the chip module 5 is positioned closer to the tip portion 511 than the base end portion 512. Therefore, by only placing the connection terminals 52 of the module body 51 on the pads 43 of the circuit board 4 and supporting the connection terminals 52, the balance of the chip module 5 may deteriorate, and the chip module 5 may be tilted so that the tip portion 511 of the module body 51 falls off.

[0050] In the present embodiment, a positioning portion for positioning the chip module 5 on the circuit board 4 is provided. The positioning portion is provided at a position closer to the flow detection element 53 than to the connection terminal 52 of the chip module 5. The positioning portion has a convex portion 514 formed to protrude from the center of an edge of the tip portion 511 of the module body 51. The convex portion 514 is formed of a molding resin and is integrally formed when molding is performed on the module body 51.

[0051] The convex portion 514 has a placement surface disposed on the waste substrate 11. The placement surface of the convex portion 514 has the same height as the opposite surface of the connection terminal 52 and is positioned on the virtual plane Pva including the mounting surface 411 of the circuit board 4 when the chip module 5 is placed on the circuit board 4.

[0052] As in (2) of Fig. As shown in Fig. 9, the convex portion 514 is disposed on the scrap substrate 11 and supports the tip portion 511 of the module body 51 on the circuit board 4. As a result, in the chip module 5, the base end portion 512 of the module body 51 is supported by the circuit board 4, and the tip portion 511 is supported by the scrap substrate 11. Therefore, it is possible to prevent the chip module 5 from tilting so that the tip portion 511 of the module body 51 falls off the substrate board 10.

[0053] Then, the chip module 5 is transported to the reflow oven while being placed on the substrate board 10, and the solder reflow is performed in the reflow oven to fix the chip module 5 to the circuit board 4 by soldering. When the chip module 5 is fixed to the circuit board 4 by soldering through the solder return, the sprue 12 is cut off, and the circuit board 4 is separated from the waste substrate 11, as shown in (3) of Fig. 9. Then, the circuit board 4 is attached to the cover 3 to form a cover assembly, and as shown in (4) of Fig. As shown in Figure 9, the housing 2 is attached to the cover assembly.

[0054] When the circuit board 4 on which the chip module 5 is mounted is attached to the cover 3, an adhesive 6 is applied between a protrusion 32 of the cover 3 and the convex portion 514. As a result, the tip portion 511 of the module body 51 can be fixed to the cover 3, and the chip module 5 can be stably supported by the cover 3. Therefore, it is possible to prevent a ratio between a cross-sectional area D1 of the partial passage on the flow detection element 53 side and a cross-sectional area D2 of the partial passage on the back surface portion side of the module from changing due to displacement or vibration of the chip module 5, thereby achieving high mounting accuracy.

[0055] According to the present embodiment, the convex portion 514 is provided at the center of the edge of the tip portion 511 of the module body 51 and is arranged on the scrap substrate 11 when the chip module 5 is placed on the substrate board 10. Therefore, the chip module 5 can be reliably positioned on the circuit board 4 and stably held in a preset posture. Therefore, the position and attitude of the chip module 5 can be prevented from changing during solder reflow, the chip module 5 can be attached to the circuit board 4 by soldering in the preset position and attitude, and variation of the mounted chip module 5 on the circuit board 4 can be reduced. Therefore, the inclination of the chip module 5 cantilevered from the circuit board 4 can be adjusted, and high mounting accuracy during solder reflow and mounting accuracy including variation in solder thickness can be easily ensured.

[0056] The flow characteristics of the physical quantity detection device 1 depend on a relationship between the cross-sectional area D1 of the partial passage on the front surface portion of the module and the cross-sectional area D2 of the partial passage on the rear surface portion of the module. In the present embodiment, the convex portion 514 is provided at a position where flatness of the mounting surface 411 of the circuit board 4 and the flow detection element 53 is established, that is, closer to the flow detection element 53 than the connection terminal 52. The placement surface of the convex portion 514 arranged on the waste substrate 11 has the same height as the opposite surface of the connection terminal 52, and when the chip module 5 is placed on the circuit board 4, the convex portion 514 is positioned on the virtual plane Pva including the mounting surface 411 of the circuit board 4.Therefore, the chip module 5 can be easily arranged parallel to the circuit board 4 by simply placing the chip module 5 on the substrate board 10. Therefore, in the physical quantity detection device 1, the cross-sectional area of ​​the partial passage on the exposed side of the flow detection element 53 is made constant, so that the flow detection accuracy can be stabilized. <Zweite Ausführungsform>

[0057] Fig. 10A is a front view of a printed circuit board according to a second embodiment, and Fig. 10B is a cross-sectional view taken along the line XB-XB in Fig. 10A.

[0058] A feature of the present embodiment is that the positioning portion is formed by a convex portion 522 extending a part of the lead frame 521 and protruding from the module body 51 of the chip module 5. As shown in Fig. As shown in Figure 10A, the chip module 5 includes the lead frame 521 in the module body 51. The lead frame 521 is provided between the base end portion 512 and the tip portion 511 of the module body 51, the connection terminal 52 protrudes from the base end portion 512, and the convex portion 522 protrudes from the tip portion 511 as the positioning portion. The convex portion 522 is formed by a connecting rod of the lead frame 521 protruding from the edge of the tip portion 511 of the module body 51.

[0059] As in (2) of Fig. 9, in the first embodiment, when the chip module 5 is placed on the substrate board 10, the convex portion 522 can be placed on the scrap substrate 11 and support the tip portion 511 of the module body 51 through the substrate board 10. Therefore, as in the first embodiment, the chip module 5 can be reliably positioned on the circuit board 4 and stably held in a preset posture. Therefore, the position and posture of the chip module 5 can be prevented from changing during solder reflow, the chip module 5 can be mounted by soldering to the circuit board 4 in the preset position and posture, and variation of the mounted chip module 5 can be reduced.

[0060] The placement surface of the convex portion 522 has the same height as the opposite surface of the connection terminal 52 and is positioned on the virtual plane Pva that the mounting surface 411 of the circuit board 4 has when the chip module 5 is placed on the circuit board 4. Therefore, the chip module 5 can be easily arranged parallel to the circuit board 4 by simply placing the chip module 5 on the substrate board 10. Therefore, the cross-sectional area of ​​the partial passage on the exposed side of the flow detection element 53 is made constant, so that the detection accuracy can be stabilized.

[0061] According to the present embodiment, since the convex portion 522 is formed by protruding the part of the lead frame 521 from the module body 51 of the chip module 5, the positioning portion can be simply shaped and easily implemented in the chip module 5. <Dritte Ausführungsform>

[0062] Fig. 11A is a front view of a printed circuit board according to a third embodiment, and Fig. 11B is a cross-sectional view taken along line XIB-XIB in Fig. 11A.

[0063] In the present embodiment, the positioning portion is formed by a convex portion 523, the part of the lead frame 521 protruding from the module body 51. A tip portion of the convex portion 523 is bent, and when the chip module 5 is placed on the substrate board 10, the convex portion 523 is preliminarily inserted into an insertion hole 15 provided in the waste substrate 11.

[0064] The convex portion 523 is formed in an L-shape, protruding from the module body 51 of the chip module 5, bent at the tip portion, and protruding toward the opposite surface of the connection terminal 52. The insertion hole 15, into which a tip portion of the convex portion 523 is inserted, is provided in the waste substrate 11 when the chip module 5 is placed on the substrate board 10.

[0065] According to the present embodiment, when the chip module 5 is placed on the substrate board 10, the convex portion 523 is placed on the scrap substrate 11, and the tip portion of the convex portion 523 is inserted into the insertion hole 15. Therefore, the chip module 5 is arranged parallel to the mounting surface 411 of the circuit board 4, and the movement of the chip module 5 in a direction along the mounting surface 411 of the circuit board 4 is limited. Therefore, the chip module 5 can be reliably positioned on the circuit board 4 and stably held in a preset posture. Therefore, the position and posture of the chip module 5 can be prevented from changing during solder reflow, the chip module 5 can be mounted by soldering to the circuit board 4 in the preset position and posture, and variation of the mounted chip module 5 can be reduced.Therefore, the inclination of the chip module 5 cantilevered from the circuit board 4 can be adjusted, and high mounting accuracy during solder reflow and mounting accuracy including variation of solder thickness can be easily ensured. <Vierte Ausführungsform>

[0066] Fig. 12A is a front view of a printed circuit board according to a fourth embodiment, and Fig. 12B is a cross-sectional view taken along line XIIB-XIIB in Fig. 12A.

[0067] In the present embodiment, instead of the convex portion 514 of the first embodiment, a convex portion 515 is provided extending along the edge of the tip portion 511 of the module body 51. The convex portion 515 is formed of a molding resin and is integrally formed when molding is performed on the module body 51.

[0068] As in Fig. As shown in Figure 12B, the convex portion 515 is formed by protruding the module rear surface portion side from the module front surface portion side to form a step between the module front surface portion and the module rear surface portion. The placement surface of the convex portion 515 has the same height as the opposite surface of the connection terminal 52, and when the chip module 5 is placed on the circuit board 4, the convex portion 515 is positioned on the virtual plane Pva including the mounting surface 411 of the circuit board 4.

[0069] As in each embodiment described above, the convex portion 515 can be arranged on the waste substrate 11 to position the chip module 5 on a circuit board 207 during solder reflow. Therefore, the chip module 5 can be easily arranged parallel to the circuit board 4 by simply placing the chip module 5 on the substrate board 10. Therefore, in the physical quantity detection device 1, the cross-sectional area of ​​the partial passage on the exposed side of the flow detection element 53 is made constant, so that the flow detection accuracy can be stabilized.

[0070] Then, as in (4) of Fig. 9 of the first embodiment, the adhesive 6 is applied between the convex portion 514 and the protrusion 32 of the cover 3 to fix the tip portion 511 of the module body 51 to the cover 3. In the first embodiment, since the adhesive 6 is applied along the edge of the tip portion 511 of the module body 51, it can adhere over a longer distance than the convex portion 514. Therefore, the tip portion 511 of the module body 51 can be securely fixed to the protrusion 32 of the cover 3, and the partial passage can be sealed so that the front surface portion side of the module and the rear surface portion side of the module are completely separated.

[0071] Furthermore, according to the present embodiment, the convex portion 515 has a configuration in which the step is formed between the module front surface portion and the module rear surface portion, with the module rear surface portion side protruding from the module front surface portion side. Thus, the position of the edge of the tip portion 511 of the module body 51 on the module front surface portion side can be located closer to the flow detection element 53 than the position of the edge of the tip portion 511 of the module body 51 on the module rear surface portion side, and the through groove 513 can be secured sufficiently wide even if the second partial passage is narrow. <Fünfte Ausführungsform>

[0072] Fig. 13A is a front view of a printed circuit board according to a fifth embodiment, Fig. 13B is a cross-sectional view taken along line XIIIB-XIIIB in Fig. 13A and Fig. 13C is a cross-sectional view taken along line XIIIC-XIIIC in Fig. 13A.

[0073] In the present embodiment, a direction of the chip module 5 is opposite to that of the circuit board 4 in each embodiment described above. Specifically, the chip module 5 is arranged in a direction in which an exposed surface of the flow detection element 53 and the opposite surface of the connection terminal 52 are spaced apart from each other.

[0074] A convex portion 516 is provided at the center of the edge of the tip portion 511 of the module body 51. The convex portion 516 is formed of a molding resin and is integrally formed when molding is performed on the module body 51. The convex portion 516 has a placement surface located on the waste substrate 11 when the chip module 5 is placed on the substrate board 10.

[0075] The placement surface of the convex portion 516 has the same height as the opposite surface of the connection terminal 52 and is positioned on the virtual plane Pva including the mounting surface 411 of the circuit board 4 when the chip module 5 is placed on the circuit board 4. Therefore, the chip module 5 can be easily arranged parallel to the circuit board 4 by simply placing the chip module 5 on the substrate board 10. Therefore, in the physical quantity detection device 1, the cross-sectional area of ​​the partial passage on the exposed side of the flow detection element 53 is made constant, so that the flow detection accuracy can be stabilized.

[0076] Fig. 14A and Fig. 14B are cross-sectional views showing a modification of the Fig. 13B shown circuit board.

[0077] In the Fig. 14A, instead of the convex portion 516, the convex portion 524 is bonded to the part of the lead frame 521 protruding from the module body 51 of the chip module 5 by applying a Fig. 10A and Fig. 10B is provided in the second embodiment. In addition, in the configuration shown in Fig. 14B, instead of the convex portion 516, the convex portion 525 with the curved tip portion is provided by inserting a Fig. 11A and Fig. 11B in the third embodiment is applied. When the chip module 5 is placed on the substrate plate 10, the convex portion 525 with the bent tip portion is inserted in advance into the insertion hole 15 provided in the waste substrate 11. In the respective modifications shown in the Fig. 14A and Fig. 14B, the same effect as in the second and third embodiments can be obtained. <Sechste Ausführungsform>

[0078] Fig. 15A and Fig. 15B are perspective views for explaining a sixth embodiment.

[0079] The positioning portion of the present embodiment includes a concave module portion 517 or a convex module portion 518 formed in the chip module, and a convex substrate portion 413 formed in the circuit board 4 and fitted into the concave module portion 517, or a concave substrate portion 414 fitted into the convex module portion 518.

[0080] In a case involving Fig. In the embodiment shown in FIG. 15A, the module concave portion 517 is recessed into the module front surface portion of the module body 51. The module convex portions 517 are provided in pairs at a position between the base end portion 512 and the tip portion 511 of the module body 51, and at a position where the module convex portions 517 are spaced apart from one side and the other side of the module body 51 in the lateral direction. On the other hand, the substrate convex portion 413 is formed to protrude in a direction approaching the inlet part of the receiving portion 412 of the substrate body 41, and is pressed into the module concave portion 517 by placing the chip module 5 on the circuit board 4.

[0081] The convex substrate portion 413 is pressed into the concave portion 517 of the module, so that the chip module 5 is positioned and fixed to the circuit board 4, and the connection terminal 52 of the chip module 5 abuts the pads 43 of the circuit board 4. Therefore, the chip module 5 is transported in a reflow oven in a state where the connection terminal 52 of the chip module 5 abuts the pad 43 of the circuit board 4, so that the connection terminal 52 of the chip module 5 can be soldered to the pad 43 of the circuit board 4, and the chip module 5 can be fixed to the circuit board 4 by soldering.

[0082] In a case involving Fig. In the embodiment shown in FIG. 15B, the module convex portion 518 is recessed into the module front surface portion of the module body 51. The module convex portions 518 are provided in pairs at a position between the base end portion 512 and the tip portion 511 of the module body 51, and at a position where the module convex portions 518 are spaced apart from one side and the other side of the module body 51 in the lateral direction. On the other hand, the substrate concave portions 414 are formed in a concave shape in one direction to be spaced apart from each other at the inlet part of the receiving portion 412 of the substrate body 41, and are pressed into the module convex portions 518 by placing the chip module 5 on the circuit board 4.

[0083] The convex module portion 518 is pressed into the concave substrate portions 414, so that the chip module 5 is positioned and fixed to the circuit board 4, and the connection terminal 52 of the chip module 5 abuts the pads 43 of the circuit board 4. Therefore, the chip module 5 is transported in a reflow oven in a state where the connection terminal 52 of the chip module 5 abuts the pad 43 of the circuit board 4, so that the connection terminal 52 of the chip module 5 can be soldered to the pad 43 of the circuit board 4, and the chip module 5 can be fixed to the circuit board 4 by soldering.

[0084] According to the Fig. 15A and Fig. In the embodiment shown in FIG. 15B, the concave housing portions 517 or the convex housing portions 518 are provided in the chip module 5, and the convex substrate portions 413 or the concave substrate portions 414 are provided in the circuit board 4. When the chip module 5 is assembled on the circuit board 4, the convex substrate portions 413 are pressed into the concave module portions 517, or the convex module portions 518 are pressed into the concave substrate portions 414.

[0085] Therefore, the chip module 5 can be reliably positioned on the circuit board 4 and stably held in a preset position. Therefore, the position and attitude of the chip module 5 can be prevented from changing during solder reflow, the chip module 5 can be soldered to the circuit board 4 in the preset position and attitude, and variation of the mounted chip module 5 can be reduced. Therefore, the inclination of the chip module 5, which is cantilevered from the circuit board 4, can be adjusted, and high mounting accuracy during solder reflow and mounting accuracy including variations in solder thickness can be easily ensured.

[0086] In addition, according to the present embodiment, since the chip module 5 can be positioned only by assembling the chip module 5 on the circuit board 4, the waste substrate 11 of the above-described embodiments can be omitted. <Siebte Ausführungsform>

[0087] Fig. 16A is a front view of a printed circuit board according to a seventh embodiment, Fig. 16B is a bottom view of the Fig. 16A shown circuit board and Fig. 16C is a right side view of the Fig. 16A shown circuit board.

[0088] A feature of the present embodiment is that the chip module 5 is arranged on the mounting surface 411 of the substrate body 41.

[0089] In contrast to the other embodiments, the circuit board 4 has a substantially rectangular shape, and the receiving portion 412 is omitted from the substrate body 41. The chip module 5 is arranged on the mounting surface 411 of the circuit board 4 in such a position that the module rear surface portion of the chip module 5 faces the mounting surface 411 of the circuit board 4.

[0090] As in Fig. As shown in Fig. 16B, the connection terminal 52 of the chip module 5 has an opposing surface disposed at a position where it protrudes from the module rear surface portion in a thickness direction of the module body 51. A positioning portion for positioning and fixing the chip module 5 is provided on the module rear surface portion of the chip module 5. As shown in Fig. As shown in Fig. 16B, the positioning portion is provided at a position closer to the tip portion 511 than the base end portion 512 of the chip module 5 and has convex portions 519 and 520. The convex portions 519 and 520 are formed of a molding resin and are integrally formed when molding is performed on the module body 51.

[0091] As in Fig. As shown in Fig. 16A, the convex portions 519 and 520 are individually provided at the center position in the lateral direction of the module body 51. The convex portion 519 is arranged at a position opposite to the mounting surface 411 of the circuit board 4, and the convex portion 520 is arranged at a position opposite to the waste substrate 11 (see Fig. 8). The convex portions 519 and 520 have the same height as the opposite surface of the connection terminal 52 and are positioned on the virtual plane Pva including the mounting surface 411 of the circuit board 5 when the chip module 5 is placed on the circuit board 4.

[0092] Therefore, the chip module 5 can be easily arranged parallel to the circuit board 4 by simply placing the chip module 5 on the substrate board 10. Therefore, in the physical quantity detection device 1, the cross-sectional area of ​​the partial passage on the exposed side of the flow detection element 53 is made constant, so that the flow detection accuracy can be stabilized.

[0093] According to the present embodiment, the convex portions 519 and 520 are provided on the module back surface portion of the tip portion 511 of the module body 51 and are supported on the circuit board 4 and the waste substrate 11 when the chip module 5 is mounted on the substrate board 10. Therefore, the chip module 5 can be reliably positioned on the circuit board 4 and stably held in a preset posture. Therefore, the position and posture of the chip module 5 can be prevented from changing during solder reflow, the chip module 5 can be mounted by soldering to the circuit board 4 in the preset position and posture, and variation of the mounted chip module 5 can be reduced.Therefore, the inclination of the chip module 5 cantilevered from the circuit board 4 can be adjusted, and high mounting accuracy during solder reflow and mounting accuracy including variation of solder thickness can be easily ensured.

[0094] Although the embodiments of the present invention have been described in detail above, the present invention is not limited thereto. Various modifications and variations are possible within the scope of the appended claims of the present invention. For example, the aforementioned embodiment has been described in detail in order to explain the invention in an easy-to-understand manner, and is not necessarily limited to the embodiment having all the configurations explained above. Furthermore, part of the configuration of a certain embodiment may be replaced with the configuration of another embodiment, and the configuration of another embodiment may be added to the configuration of a certain embodiment.Furthermore, with respect to a part of the configuration of each embodiment, the configuration of another configuration may be added to, deleted from, or replaced by the above-mentioned part of the configuration. List of reference symbols 1 Device for detecting physical quantities 4 circuit board 5 chip module 43 Pads 51 module bodies 52 Connection terminal (solder fixing section) 53 Flow detection element 413 convex section of the substrate 414 concave section of the substrate 514, 515, 516, 522, 523, 524, 525 convex section (positioning section) 517 concave section of the module (positioning section) 518 convex section of the module (positioning section)

Claims

[1] Positioning and fixing structure for a chip module (5), which positions and fixes a chip module (5) on a circuit board (4), in which a flow detection element (53) is sealed with a resin so that at least one detection section is exposed, wherein the chip module (5) comprises a soldering fixing section which fixes the chip module (5) to the circuit board (4) by soldering, and a positioning section which performs positioning on the circuit board (4), and the positioning section is provided closer to the flow detection element (53) than the soldering attachment section, wherein the chip module (5) comprises a module body (51) having a base end portion (512) on which the solder fixing portion is provided and a tip portion (511) on which the positioning portion is provided, the positioning portion has a convex portion (514) formed in the tip portion (511) of the module body (51), the solder fixing portion has a connecting terminal (52) protruding from the base end portion (512) of the module body (51), and the convex portion (514) and the connection terminal (52) are positioned on a virtual plane having a mounting surface of the circuit board (4), and wherein the convex portion (514) abuts against a waste substrate (11) supporting the circuit board (4). [2] A positioning and fixing structure for a chip module (5) according to claim 1, wherein the convex portion (514) is formed of the resin. [3] A positioning and fixing structure for a chip module (5) according to claim 1, wherein the chip module (5) has a lead frame on which the flow detection element (53) is mounted, and the convex portion (514) is formed by protruding a part of the lead frame from the module body (51). [4] The positioning and fixing structure for a chip module (5) according to claim 3, wherein the convex portion (514) has an L-shape in which the convex portion (514) protrudes from the module body (51) along a frame surface of the lead frame, is bent at the tip portion (511), and protrudes toward a connecting surface side of the connecting terminal (52), and an insertion hole into which the tip portion (511) of the convex portion (514) is inserted is provided in the waste substrate (11). [5] A positioning and fixing structure for a chip module (5) according to claim 1, wherein the convex portion (514) adheres to a case of a physical quantity detecting device (1) when the circuit board (4) is attached to the case.

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