Component mounting board

Abstract

A paper diaper is provided that has a structure such that the condition of a component mounting board being soaked in liquid can be detected more reliably. A component mounting board (100) comprises a layered moisture detection sensor (90). The moisture detection sensor (90) comprises: a board (10) having a base (11), a first conductive structure (30) formed on the base (11), and a mounting component (50) electrically connected to the first conductive structure (30); and a second conductive structure (40) which, together with the first conductive structure (30), forms a circuit (60) in a complementary manner. A section of the base (11) corresponding to the second conductive structure (40) is a missing section (12). The component mounting board (100) further comprises a water-absorbing expansion material (70).When the same expands by absorbing water, the water-absorbing expansion material (70) presses on the base (11) or the second conductive structure (40) in a direction perpendicular to the plane of the base (11) to break the second conductive structure (40).

Description

Technical area

[0001] The present invention relates to a component mounting board. Background technology

[0002] Patent Document 1 describes a component mounting board (sensor of this document) comprising a first circuit board and a tuned high-frequency resonant circuit supported by the first circuit board. The tuned high-frequency resonant circuit has a first conductive pattern, a first capacitor, and a jumper, all arranged on the same side of the first circuit board. The first capacitor includes a first capacitor plate, a second capacitor plate, and a first dielectric material disposed between the first capacitor plate and the second capacitor plate. The first dielectric material is liquid-soluble. Reference listPatent literature

[0003] Patent Literature 1: JP-T-2014-592732 Brief description of the inventionProblems to be solved by the invention

[0004] According to a study by the inventors of the present application, the component mounting board of Patent Document 1 still has room for improvement in the reliability of detecting a state that the component mounting board is soaked in liquid.

[0005] The present invention was made in consideration of the problems described above. The present invention provides a component mounting board with a structure capable of more reliably detecting a state that the component mounting board is soaked in liquid. Solving the problems

[0006] According to the present invention, a component mounting board including a sheet-type humidity detection sensor is provided. The humidity detection sensor includes: a board having a base, a first conductive pattern formed on the base, and a mounting component electrically connected to the first conductive pattern; and a second conductive pattern forming a circuit together with the first conductive pattern in a complementary manner. A portion of the base corresponding to the second conductive pattern is a missing portion. The component mounting board further includes a water-absorbing expansion material.When it expands by water absorption, the water absorption expansion material presses on the base or the second conductive structure in a direction perpendicular to a plane of the base to break the second conductive structure. Effects of the invention

[0007] According to the present invention, the state that the component mounting board is soaked in liquid can be detected more reliably. Short description of the drawings Fig. 1 is an end view of a component mounting board according to a first embodiment, wherein Fig. 1 shows a humidity detection sensor and a peripheral structure thereof; Fig. Figure 2 is an exploded end view of the component mounting board according to the first embodiment, wherein Fig. 2 shows the humidity detection sensor and its peripheral structure; Fig. 3 is an end view of the component mounting board according to the first embodiment, wherein Fig. 3 shows the moisture detection sensor and its peripheral structure; Fig. Figure 4 is a top view of the component mounting board according to the first embodiment; Fig. 5 is a partially disassembled view of section D, which is in Fig. 4 is shown; Fig. Figure 6 is a top view of the component mounting board according to the first embodiment, wherein Fig. 6 a water-absorbing expansion material selectively shows by a solid line; Fig. Figure 7 is a top view of circuit board 10 in the first embodiment; Fig. 8 is an end view along an AA line, which is in Fig. 4 is shown, where Fig. 8 shows a state in which the water-absorbing expansion material has expanded; Fig. 9 is an end view along a CC line, which is in Fig. 4 is shown, where Fig. 9 shows a state in which the water-absorbing expansion material has expanded; Fig. Figure 10 is a schematic development view of a paper diaper, comprising the component mounting board according to the first embodiment; and Fig. 11 is an end view of a component mounting board according to a second embodiment, wherein Fig. Figure 11 shows a moisture detection sensor and a peripheral structure thereof. Description of the embodiment examples (First embodiment example)

[0008] In the following, a first embodiment of the present invention is described using the Fig. 1 to 10. It should be noted that the same reference numerals are used throughout the drawings to represent similar components, and a description thereof is omitted where appropriate. Fig. 1 shows a cut surface along an AA line, which in Fig. 4 is shown, and Fig. Figure 2 is an exploded end view of a section corresponding to that shown in Fig. 1 is shown. It also shows Fig. 3 a cut surface along a BB line, which in Fig. 4 is shown.

[0009] As in Fig. 1 and Fig. As shown in Figure 2, a component mounting board 100 according to the present embodiment comprises a layered moisture detection sensor 90. The moisture detection sensor 90 comprises: a board 10 having a base 11, a first conductive structure 30 formed on the base 11, and a mounting component 50 electrically connected to the first conductive structure 30; and a second conductive structure 40 which, together with the first conductive structure 30, forms a circuit 60 in a complementary manner. As shown in Figure 2, the component mounting board 100 comprises a layered moisture detection sensor 90. Fig. As shown in Figure 4, a section of the base 11 corresponding to the second conductive structure 40 is a missing section 12. The component mounting board 100 further comprises a water-absorbing expansion material 70. When the latter expands by absorbing water, the water-absorbing expansion material 70 exerts pressure on the base 11 or the second conductive structure in a direction perpendicular to the plane of the base 11, thereby rupturing the second conductive structure 40. Here, the section of the base 11 corresponding to the second conductive structure 40 is a section which, in plan view, i.e., when viewed in a direction perpendicular to the plane of the component mounting board 100, corresponds to (or overlaps with) the second conductive structure 40.

[0010] According to the present embodiment, the component mounting board 100 includes the water-absorbing expansion material 70, which is expandable by water absorption. The expanded water-absorbing expansion material 70 presses the base 11 or the second conductive pattern 40 in the direction perpendicular to the plane of the base 11. Accordingly, an external force is applied to the second conductive pattern 40, and consequently, the second conductive pattern 40 is broken. A condition that the component mounting board 100 is soaked in liquid can be detected such that an occurrence of breakage of the second conductive pattern 40 is indirectly detected by detecting a change in the characteristics of the circuit 60 (mainly, loss of function of the circuit 60). In addition, the portion of the base 11 corresponding to the second conductive pattern 40 is the missing portion 12.That is, it is configured such that a part of the second conductive pattern 40 is not protected by the base 11. This allows the second conductive pattern 40 to be more reliably broken by the water-absorbing expansion material 70. Furthermore, liquid can be sufficiently supplied to the water-absorbing expansion material 70 via the missing portion 12, and thus, the water-absorbing expansion material 70 can sufficiently expand by absorbing water. As described above, according to the present embodiment, the state that the component mounting board 100 is soaked in liquid can be more reliably detected.

[0011] The component mounting board 100 is, for example, a laminate formed in layers. The planar shape of the component mounting board 100 may, for example, be substantially rectangular (e.g., a rectangular shape with rounded corners), as shown in Fig. Figure 3 shows, but is not limited to this. In the present embodiment, for example, the mounting component 50 is an RFID chip (also commonly called an IC chip) and the component mounting board 100 is an RFID transponder.

[0012] For example, in the following, when describing a positional relationship between the components of the component mounting board 100, the upper side is Fig. 1 is referred to as an upper side or top, and the opposite side thereof is referred to, for example, as a lower side or bottom. Furthermore, a direction perpendicular to the top-bottom direction is described, for example, as a horizontal direction. However, these directions are defined for the sake of simplicity and are not intended to limit directions in the manufacture or use of the component mounting board 100. The right-left direction in Fig. 1 to 3 is referred to as an X-direction and the top-bottom direction in Fig. 3 is referred to as a Y direction. The X direction and the Y direction are directions (horizontal directions) parallel to the planar direction of the component mounting board 100, and are perpendicular to the up-down direction (direction perpendicular to the plane of the component mounting board 100) in Fig. 1.

[0013] As in Fig. As shown in Figures 1 to 3, the moisture detection sensor 90 further includes a soluble layer 21. The soluble layer 21 is disposed facing the base 11 and is liquid-soluble or weakened when wetted by liquid. The soluble layer 21 holds, for example, a part of the second conductive pattern 40. According to this configuration, the soluble layer 21 holding the second conductive pattern 40 is dissolved by sufficient contact with liquid. Thus, the second conductive pattern 40 can be easily broken such that the expanded water-absorbing expansion material 70 presses the base 11 or the second conductive pattern 40 in the direction perpendicular to the plane of the base 11. That is, the state that the component mounting board 100 is soaked in liquid can be detected more reliably.

[0014] As in Fig. 1 and Fig. As shown in Figure 2, the first conductive pattern 30 in the humidity detection sensor 90 is directly deposited on a surface 11a of the base 11. The second conductive pattern 40 is directly deposited on the first conductive pattern. Furthermore, the base 11 is directly deposited on the soluble layer 21.

[0015] As in Fig. 4 and Fig. 6, in the case of the present embodiment, the missing portion 12 is formed into a substantially H-shape in plan view. More specifically, the missing portion 12 includes, for example, a first extending portion 13a and a second extending portion 13b extending parallel to each other along the planar direction of the base 11, and a third extending portion 14. The third extending portion 14 extends from an intermediate portion of the first extending portion 13a in the extending direction thereof to an intermediate portion of the second extending portion 13b in the extending direction thereof. The first extending portion 13a and the second extending portion 13b have the same shape and are arranged symmetrically in the right-left direction.Specifically, each of the first extending portion 13a and the second extending portion 13b is formed, for example, in a substantially rectangular shape (e.g., a rectangular shape with rounded corners) elongated in the Y direction. The third extending portion 14 extends, for example, in the X direction. One end portion of the third extending portion 14 in the longitudinal direction thereof is connected to the intermediate portion of the first extending portion 13a in the extending direction thereof. The other end portion is connected to the intermediate portion of the second extending portion 13b in the extending direction thereof. Note that the shape of the missing portion 12 is not limited to the example described above. The missing portion 12 is an opening formed in the base 11.That is, the missing portion 12 penetrates the base 11 from the front side to the back side. In a region where the missing portion 12 is present, no first conductive pattern 30 is formed. The missing portion 12 may have a gap shape.

[0016] In the case of the present embodiment, for example, the first conductive pattern 30 includes, as described below, an antenna wiring portion and a component mounting wiring portion.

[0017] The antenna wiring section comprises a first antenna wiring section located on the left side in Fig. 4, and a second antenna wiring section located on the right side. The first antenna wiring section, for example, has a wide section 31a and a narrow section 32a, which is narrower than the wide section 31a and extends in the X direction. In plan view, the wide section 31a, for example, comprises a first section having a substantially rectangular shape in plan view and a second section. The second section extends from an upper end of a left-edge portion of the first section to a side (top in Fig. 4) in the Y-direction, and extends further to one side (right in Fig. 4) in the X direction. The narrow portion 32a is formed, for example, in such a shape that an intermediate portion of the narrow portion 32a in the plan view in the longitudinal direction thereof is bent in the Y direction. More specifically, each of the right and left end portions of the narrow portion 32a extends in the longitudinal direction thereof in the X direction. Furthermore, the intermediate portion of the narrow portion 32a extends in the longitudinal direction thereof in the Y direction from a right end of the left end portion to a left end of the right end portion. The left end of the narrow portion 32a is connected to the wide portion 31a, and the right end of the narrow portion 32a is connected to the component mounting wiring portion.The second antenna wiring portion is formed, for example, symmetrically to the first antenna wiring portion in the right-left direction and includes a wide portion 31b and a narrow portion 32b. A right end of the narrow portion 32b is connected to the wide portion 31b, and a left end of the narrow portion 32b is connected to the component mounting wiring portion.

[0018] The component mounting wiring section has annular structure forming sections (or annular structure forming sections) 34a, 36a, 38a, 39a, 34b, 36b, 37b, 38b, 39b and a coupling section 36. The annular structure forming section 39a is connected to the right end of the narrow section 32a. The annular structure forming section 39a is arranged in the Y direction from the right end of the narrow section 32a to one side (top in Fig. 4) inclined upwards. The ring-shaped structure formation section 38a extends in the Y-direction from one end of the ring-shaped structure formation section 39a to one side (above in Fig. 4) (i.e., extends in the y-direction). The annular structure forming portion 37a extends from one end of the annular structure forming portion 38a to the right (i.e., extends in the x-direction). The annular structure forming portion 34a is arranged on the extension of the annular structure forming portion 37a with the left first extending portion 13a interposed therebetween, and extends in the x-direction. The annular structure forming portion 39b is connected to the left end of the narrow portion 32b. The annular structure forming portion 39b is extended in the y-direction from the left end of the narrow portion 32b to one side (top in Fig. 4) is inclined upwards. The annular structure forming portion 38b extends in the Y direction from one end of the annular structure forming portion 39b to one side (top in Fig. 4) (i.e., extends in the y-direction). The annular structure forming portion 37b extends from one end of the annular structure forming portion 38b to the left (i.e., extends in the x-direction). The annular structure forming portion 34b is arranged on the extension of the annular structure forming portion 37b with the right second extending portion 13b interposed therebetween, and extends in the x-direction. The annular structure forming portion 34a is arranged on the extension of the annular structure forming portion 34b, and vice versa. The coupling portion 36 extends in the x-direction. More specifically, a left end of the coupling portion 36 is arranged on the extension of the boundary between the annular structure forming portion 39a and the narrow portion 32 with the left first extending portion 13a interposed therebetween.A right end of the coupling portion 35 is disposed at the extension of the boundary between the annular structure forming portion 39b and the narrow portion 32b, with the right second extending portion 13b interposed therebetween.

[0019] The soluble layer 21 contains, for example, polyvinyl alcohol (PVA). Since the soluble layer 21 contains PVA, a structure of the soluble layer 21 that is advantageously dissolved when the component mounting board 100 comes into contact with moisture can be achieved. Note that in a case where the soluble layer 21 is water-soluble, the material of the soluble layer 21 is not limited to PVA and may be polyvinylpyrrolidone, water-soluble polyester, water-soluble paper material, or a sheet material derived from a starch component. Furthermore, in the case of the present embodiment, the soluble layer 21 contains a resin having melting properties and is melt-attached to the base 11. That is, the soluble layer 21 is fusion-attached to the base 11.It should be noted that the present invention is not limited to this example, and the soluble layer 21 may be attached to the base 11 by a water-soluble adhesive (not shown).

[0020] As in Fig. As shown in Figure 5, the component mounting board 100 includes, as the second conductive structure 40, bridge portions 41a, 41b, 42 extending, for example, in the X direction. That is, the component mounting board 100 includes, for example, a plurality of second conductive structures 40. As shown in Fig. As shown in Figure 3, bridge section 41a connects a right end section of the annular structure formation section 37a and a left end section of the annular structure formation section 34a. Bridge section 41b connects a left end section of the annular structure formation section 37b and a right end section of the annular structure formation section 34b. Accordingly, the annular structure formation section 37a, bridge section 41a, annular structure formation section 34a, annular structure formation section 34b, bridge section 41b, and annular structure formation section 37b connect the first antenna wiring section and the second antenna wiring section.The bridge portion 42 connects the boundary between the annular structure forming portion 39a and the narrow portion 32a, the annular structure forming portion 39b and the narrow portion 32b, and extends along the coupling portion 36. Accordingly, the annular structure forming portion 37a, the annular structure forming portion 37a, the bridge portion 41a, the annular structure forming portion 34a, the bridge portion 41b, the annular structure forming portion 37b, the annular structure forming portion 38b, the annular structure forming portion 39b, the bridge portion 42, and the annular structure forming portion 39b form an annular structure. The annular structure is formed in a substantially annular shape in plan view, for example.The ring-shaped structure is non-continuous between ring-shaped structure formation section 34a and ring-shaped structure formation section 34b. That is, the ring-shaped structure has a form (open ring-shaped form) with an opening. As for example in . Fig. 1 and Fig. 5, the fastening component 50 is arranged over a portion between the annular structure forming portion 34a and the annular structure forming portion 34b.

[0021] Bridge section 41a is located above the left first extending section 13a. Bridge section 41b is located above the left second extending section 13b. As in Fig. 1, the bridge portion 41a is bridged between the annular structure forming portion 38a and the annular structure forming portion 34a to electrically connect the annular structure forming portion 38a and the annular structure forming portion 34a. Similarly, the bridge portion 41b is bridged between the annular structure forming portion 38b and the annular structure forming portion 34b to electrically connect the annular structure forming portion 38a and the annular structure forming portion 34b. The bridge portion 42 is bridged between the left first extending portion 13a and the right second extending portion 13b. More specifically, a left end portion of the bridge portion 42 is located above the left first extending portion 13a.A right end portion of the bridge portion 42 is disposed above the right second extending portion 13b. The left end portion of the bridge portion 42 electrically connects the boundary between the annular structure forming portion 39a and the narrow portion 32a and the left end of the coupling portion 36. The right end portion of the bridge portion 42 electrically connects the boundary between the annular structure forming portion 39b and the narrow portion 32b and a right end of the coupling portion 36.

[0022] As described above, the second conductive pattern 40 (each of the bridge portions 41a, 41b, 42) is disposed over the missing portion 12 and is bridged between the first and second portions of the first conductive pattern 30 to electrically connect the first and second portions. The second portion is a portion of the first conductive pattern 30 separated from the first portion with the missing portion 12 interposed therebetween. That is, each second conductive pattern 40 is a bridge wiring. The second conductive patterns 40 extend, in side view, over part of a peripheral edge portion of the missing portion 12, part of an inner peripheral surface of the missing portion 12, a portion of a surface 21a of the soluble layer 21 corresponding to the missing portion 12, and other portions of the peripheral edge portion of the missing portion 12.

[0023] The component mounting board 100 may include, as the second conductive pattern 40, a portion other than the above-described bridge portions 41a to 42. Note that the bridge portions 41a to 42 are wiring portions that form the circuit 60. That is, a portion (bridge portions 41a to 42) of the second conductive pattern 40 corresponding to the missing portion 12 is not an electrode, etc., but is a wiring portion that forms the circuit 60.

[0024] The second conductive structure 40 (each of the bridge portions 41a, 41b, 42) is preferably formed thicker than a portion (annular pattern forming portions 34a, 34b, 37a, 37b, 39a, 39b) of the first conductive structure 30 that is connected to the second conductive structure 40. With this configuration, when the circuit board 10 and the soluble layer 21 are aligned and assembled together, and the second conductive structure 40 and the first conductive structure 30 are electrically connected to each other, the second conductive structure 40 can be connected to the first conductive structure 30 so as to be in proper alignment with the first conductive structure 30, even if the circuit board 10 and the soluble layer 21 are slightly misaligned in the planar direction.It should be noted that in a case where the first conductive pattern 30 is, for example, a pattern derived from a metal foil and its impedance is low, when the second conductive pattern 40 is a coating film formed by printing, the impedance of the second conductive pattern 40 is expected to have a higher value than the impedance of the above-described pattern made of metal foil. In this point, the second conductive pattern 40 is formed thicker than the portion of the first conductive pattern 30 connected to the second conductive pattern 40 as described above, and it is advantageous because impedance matching between the first conductive pattern 30 and the second conductive pattern 40 can be performed in a low-resistance state.It should be noted that the second conductive structure 40 may be formed with the same width as that of the portion of the first conductive structure 30 connected to the second conductive structure 40, or may be formed thinner than such a portion.

[0025] The length of the second conductive structure 40 is preferably longer than the width dimension of the section (ring-shaped structure-forming sections 34a, 34b, 37a, 37b, 39a, 39b, 37a, 37b, 39a, 39b, narrow sections 32a, 32b, coupling section 36) of the first conductive structure 30 which is connected to the second conductive structure 40, and preferably has a length that is twice as long as the width dimension or more preferably three times as long as the width dimension or more.In particular, the length (bridge length) of a portion of the second conductive structure 40 that is bridged over the first conductive structure 30 (between the first portion and the second portion) is preferably longer than the width dimension of the portion of the first conductive structure 30 that is connected to the second conductive structure 40, and preferably has a length that is twice as long as the width dimension or more, and more preferably three times as long as the width dimension or more.

[0026] In the present embodiment, the second conductive structure 40 is not liquid-soluble. The second conductive structure 40 is, for example, a coating film formed by printing or metal foil. More specifically, the second conductive structure 40 is, for example, a silver structure. The thickness of the second conductive structure 40 is preferably, for example, 10 µm or more and 50 µm or less, but is not specifically limited to this. Since the thickness of the second conductive structure 40 is 10 µm or more, stable properties of the circuit 60 can be maintained before the component mounting board 100 comes into contact with liquid. Since the thickness of the second conductive structure 40 is 50 µm or less, the second conductive structure 40 can be readily broken when the component mounting board 100 comes into contact with liquid.

[0027] It should be noted that the present invention is not limited to the example described above. For example, the second conductive pattern 40 may be liquid-soluble. In this case, it is expected that the initial properties of the circuit 60 may not be maintained due to dissolution or weakening and breakage of the second conductive pattern 40 due to sufficient contact of the second conductive pattern 40 with liquid. Accordingly, the condition that the component mounting board 100 is soaked in liquid can be detected.

[0028] In the case of the present embodiment, the second conductive structures 40 are arranged as the bridge wirings at multiple locations on the circuit. Thus, the probability that one of the second conductive structures 40 will be broken when the component mounting board 100 comes into contact with liquid can be increased.

[0029] In the case of the present embodiment, the base 11 is not liquid-soluble. Thus, even if the component mounting board 100 accidentally contacts a liquid, for example, during storage, a probability that the characteristics of the circuit 60 will change due to breakage or cracking of the first conductive pattern 30 can be reduced by dissolving the base 11. The base 11, which is not liquid-soluble, can be made of, for example, paper or a resin film. Examples of a resin material constituting the resin film may include, but are not limited to, polyethylene terephthalate, polyethylene, polystyrene, polypropylene, and polyester. Note that the present invention is not limited to this example, and the base 11 may be liquid-soluble. The thickness dimension of the base 11 is preferably 10 μm or more and 100 μm or less, but is not limited to this.Since the thickness of the base 11 is 10 µm or more, the base 11 can stably support the first conductive structure 30, and the structural strength of the component mounting board 100 can be sufficiently maintained. Since the thickness of the base 11 is 100 µm or less, an advantageous flexibility of the component mounting board 100 is preserved.

[0030] In the case of the present embodiment, the first conductive pattern 30 is also not liquid-soluble. Thus, even if the component mounting board 100 accidentally contacts a liquid, for example, during storage, the probability that the characteristics of the circuit 60 will be changed due to dissolution of the first conductive pattern 30 can be reduced. In particular, more than half of the circuit 60 is preferably formed by the first conductive pattern 30 that is not liquid-soluble. Note that the present invention is not limited to this example, and the first conductive pattern 30 may be liquid-soluble. The first conductive pattern 30 is, for example, a coating film formed by printing or metal foil.The first conductive structure 30 is, for example, a coating film containing a conductive filler and a binder containing a thermoplastic resin. Examples of the conductive filler can include gold, silver, copper, and carbon. Examples of the thermoplastic resin can include polyester resin, acrylic resin, and urethane resin. The first conductive structure 30, which is the metal foil, can be formed, for example, by stamping or etching. The thickness dimension of the first conductive structure 30 is, for example, 5 µm or more and 30 µm or less, but is not specifically limited to this.

[0031] It should be noted that the outer shape of the circuit board 10 (base 11) and the outer shape of the soluble layer 21 may be identical to each other or different from each other. For example, in the case of the present embodiment, the circuit board 10 (base 11) is formed in a substantially rectangular shape elongated in the X direction, and the soluble layer 21 is formed in a substantially rectangular shape with an outer dimension smaller than that of the circuit board 10 (base 11). Specifically, the soluble layer 21 is arranged on a portion of the circuit board 10 (base 11) corresponding to the missing portion 12 in plan view, and the entirety of the missing portion 12 lies within the outline of the soluble layer 21.Furthermore, in the plan view, the entirety of the second conductive patterns 40 and the component mounting wiring portion (annular pattern forming portions 34a, 36a, 37a, 38a, 39a, 34b, 36b, 37b, 38b, 39b and coupling portion 36) are located within the outline of the soluble layer 21.

[0032] Although not shown in detail, the fastening component 50 includes, for example, a component body having a member formed by resin molding and a fastening terminal provided along a lower surface of the component body. The member and the fastening terminal are electrically connected to each other in the resin-molded body. The number of fastening terminals included in the fastening component 50 is not specifically limited. In the case of the present embodiment, the fastening component 50 includes two fastening terminals, and each fastening terminal is electrically connected to the first conductive pattern 30. More specifically, one fastening terminal of the fastening component 50 is electrically connected to a right end portion of the annular pattern forming portion 34a.The other fixing terminal of the fixing component 50 is electrically connected to a left end portion of the annular structure forming portion 34b. That is, the fixing component 50 is arranged above the annular structure forming portion 34a and the annular structure forming portion 34b. As described above, the fixing component 50 is fixed to the component fixing wiring portion.

[0033] The antenna wiring section exchanges a signal with, for example, an external device (not shown) (e.g., an RFID reader / writer). A signal or radio wave received from the external device by the antenna wiring section is input to the mounting component 50. The mounting component 50 transmits a signal to the external device via the component mounting wiring section and the antenna wiring section. Note that in some cases, part or all of the component mounting wiring section may function as an antenna in cooperation with the antenna wiring section. The mounting component 50 is, for example, of a passive type to be driven by power excited from the external device via the antenna wiring section.

[0034] In the case of the present embodiment, the communication function of the component mounting board 100 is disabled or degraded due to breakage (details will be explained later) of the second conductive pattern 40 due to contact of the component mounting board 100 with liquid. Disablement or degradation of the communication function is detected by the external device, so that contact of the component mounting board 100 with liquid can be detected.

[0035] As in Fig. 1 to 3, the water absorption expansion material 70 is arranged on the side of the other surface 21b of the soluble layer 21 in the case of the present embodiment. It should be noted that in Fig. 3. The water-absorbing expansion material 70 is indicated by a double-dashed catenary line. The water-absorbing expansion material 70 is, for example, formed in layers and is arranged along the other surface 21b of the soluble layer 21. In plan view, the water-absorbing expansion material 70 is formed in a substantially rectangular shape that is elongated in the Y direction. In plan view, the entirety of the water-absorbing expansion material 70 is arranged inside the outline of the soluble layer 21. The water-absorbing expansion material 70 is, for example, arranged at a location corresponding to a section between the first extending section 13a and the second extending section 13b on the base 11.In the case of the present embodiment, the “portion between the first extending portion 13a and the second extending portion 13b on the base 11” is, for example, a portion between a right edge of the first extending portion 13a and a left edge of the second extending portion 13b on the base 11. More specifically, as shown in FIG. Fig. 5, for example, a left edge of the water-absorbing expansion material 70 substantially coincides with the right edge of the left first extending portion 13a, and a right edge of the water-absorbing expansion material 70 substantially coincides with the left edge of the right second extending portion 13b. Moreover, in the plan view, the entirety of the third extending portion 14 is arranged inside the outline of the water-absorbing expansion material 70. More specifically, in the plan view, as shown in Fig. 6, the annular structure forming portion 34a, a portion of the bridge portion 41a corresponding to the annular structure forming portion 37a, the annular structure forming portion 4b, and a portion of the bridge portion 41b corresponding to the annular structure forming portion 34b are arranged inside the outline of the water-absorbing expansion material 70. Similarly, in the plan view, the coupling portion 36 and a portion of the bridge portion 42 corresponding to the coupling portion 36 are arranged inside the outline of the water-absorbing expansion material 70. According to this configuration, as explained later, the water-absorbing expansion material 70 expanded by water absorption can easily break the bridge portions 41a, 41b, 42 connecting the first antenna wiring portion and the second antenna wiring portion.Thus, contact of the component mounting board 100 with liquid can be detected more reliably. Note that, in the present invention, the component mounting board 100 may only need to be configured such that the water-absorbing expansion material 70, expanded by water absorption, breaks the bridge portion 41a and / or the bridge portion 41b. That is, in the present invention, the water-absorbing expansion material 70 may only need to be arranged in a region including the bridge portion 41a or the bridge portion 41b in a plan view. For example, an outer edge of the water-absorbing expansion material 70 may be located in a region overlapping the missing portion 12 in the plan view, beyond the portion between the first extending portion 13a and the second extending portion 13b on the base 11.

[0036] The water-absorbing expansion material 70 is, for example, a compressed cellulose sponge. It should be noted that the present invention is not limited to this example. The water-absorbing expansion material 70 can, for example, be a different component that is expandable by a different water absorption mechanism than the compressed cellulose sponge, such as a water-absorbing polymer.

[0037] Furthermore, the component mounting board comprises 100, as shown in Fig. 1 and Fig. 2, for example, a water-conducting layer 86. The water-conducting layer 86 is arranged on the side of the water-absorbing expansion material 70 opposite the humidity detection sensor 90. With this configuration, the water-conducting layer 86 can absorb a liquid (e.g., water), and thereby liquid can be sufficiently supplied to the water-absorbing expansion material 70. The water-conducting layer 86 is preferably arranged at least in a region that includes the water-absorbing expansion material 70 in plan view. The water-conducting layer 86 may be arranged over the entire surface of the component mounting board 100 or may be selectively arranged in a partial region of the component mounting board 100. In the present embodiment, the water-conducting layer 86 is arranged, for example, in a region that includes the entirety of the first conductive structure 30 in plan view.

[0038] The component mounting board 100 includes, for example, a first restriction layer (first water-permeable layer 85, described later, in the case of the present embodiment) and a second restriction layer (second water-permeable layer 87, described later, in the case of the present embodiment). The first restriction layer is disposed on one side of one surface (one surface 11a in the case of the present embodiment) of the humidity detection sensor 90, and the second restriction layer is disposed on one side of the other surface (other surface 21b in the case of the present embodiment). In the humidity detection sensor 90, the first restriction layer and the second restriction layer restrict the periphery of a region where the second conductive pattern 40 is disposed.In the case of the present embodiment, for example, the first restriction layer and the second restriction layer in the humidity detection sensor 90 restrict at least the periphery of a region where the first conductive pattern 30 is arranged. Note that the periphery of the region where the second conductive pattern 40 is arranged is the periphery of a region that includes the entirety of the missing portion 12.

[0039] More specifically, in the case of the present embodiment, the base 11 comprises, as shown in Fig. 7, for example, a body portion 111a having a substantially rectangular shape elongated in the X direction in plan view, and a plurality of attachment parts 111b. The plurality of attachment parts 111b protrude to the outside of a peripheral edge of the body portion 111a and are arranged separately from each other. A part of the first restriction layer is directly or indirectly attached to surfaces on one side of the plurality of attachment parts 111b. A part of the second restriction layer is directly or indirectly attached to the surfaces on the other side of the plurality of attachment parts 111b. At a portion between the plurality of attachment parts 111b in the planar direction of the base 11, the first restriction layer and the second restriction layer are directly or indirectly connected (or bonded) to each other without the attachment parts 111b.In this configuration, a peripheral edge portion of the humidity detection sensor 90 is restricted by the first restriction layer and the second restriction layer. The plurality of attachment parts 111b include those where the body portion 111a is sandwiched in the X direction and those where the body portion 111a is sandwiched in the Y direction. Thus, the first restriction layer and the second restriction layer can restrict the base 11 at both end portions of the base 11 in the X direction and both end portions of the base 11 in the Y direction.

[0040] In the case of the present embodiment, for example, the component mounting board 100 includes the first water-permeable layer 85 as the first restriction layer and the second water-permeable layer 87 as the second restriction layer. It should be noted that in Fig. 4, each of the first water-permeable layer 85 and the second water-permeable layer 87 is indicated by a double-dashed chain line. With this configuration, the first water-permeable layer 85 or the second water-permeable layer 87 can quickly supply liquid to the water-absorbing expansion material 70. More specifically, the first water-permeable layer 85 or the second water-permeable layer 87 can supply liquid to the water-absorbing expansion material both in a case where the surface of the component mounting board 100 on the side where the first water-permeable layer 85 is disposed is mostly soaked in liquid and in a case where the surface of the component mounting board 100 on the side where the second water-permeable layer 87 is disposed is mostly soaked in liquid.

[0041] More specifically, in the case of the present embodiment, the moisture detection sensor 90, the water absorption expansion material 70 and the water-conducting layer 86 are arranged in this order from the top between the first water-permeable layer 85 and the second water-permeable layer 87, as shown in Fig. Figure 1 shows the following. Furthermore, a double-sided tape 91 is arranged between the other surface (other surface 21b of the soluble layer 21) of the moisture detection sensor 90 and a surface (upper surface) of the water-absorbing expansion material 70. Similarly, a double-sided tape 92 is arranged between the other surface (lower surface) of the water-absorbing expansion material 70 and a surface (upper surface) of the water-conducting layer 86. In this way, the water-absorbing expansion material 70 is positioned between the other surface (other surface 21b) of the moisture detection sensor 90 and a surface (upper surface) of the water-conducting layer 86.

[0042] In the case of the present embodiment, for example, the outer shape of the first water-permeable layer 85 and the outer shape of the second water-permeable layer 87 are identical and coincide with each other in plan view. Moreover, a part of the peripheral edge portion of the first water-permeable layer 85 and a part of a peripheral edge portion of the second water-permeable layer 87 are joined to each other (e.g., by heat-pressing). More specifically, at the peripheral edge portion of the first water-permeable layer 85 and the peripheral edge portion of the second water-permeable layer 87, the first water-permeable layer 85 and the second water-permeable layer 87 are directly joined to each other, without the attachment parts 111b between the plurality of attachment parts 111b in the planar direction of the base 11.Furthermore, portions of the peripheral edge region of the first water-permeable sheet 85 corresponding to the plurality of attachment parts 111b are attached to the one-side surfaces of the attachment parts 111b. Portions of the peripheral edge region of the second water-permeable sheet 87 corresponding to the plurality of attachment parts 111b are attached to the other-side surfaces of the attachment parts 111b. With this configuration, the peripheral edge portion of the humidity detection sensor 90 is confined by the first water-permeable sheet 85 and the second water-permeable sheet 87.

[0043] The water-conducting layer 86, for example, consists of viscose nonwoven fabric with high water absorption (water-retaining), but is not specifically limited, and its weight is, for example, 40 g / m². 2 or more and 80 g / m 2 or less and preferably 50 g / m 2or more and 70 g / m 2 or less. It should be noted that the water-conducting layer 86 may be, for example, cellulose, cotton, or hemp. Each of the first water-permeable layer 85 and the second water-permeable layer 87 is a nonwoven fabric made of, but not specifically limited to, polyester, polypropylene, or polyethylene terephthalate, and has, for example, a weight of 5 g / m 2 or more and 100 g / m 2 or less and preferably 10 g / m 2 or more and 50 g / m 2 or less. With this configuration, the water permeability of each of the first water-permeable layer 85 and the second water-permeable layer 87 can be advantageously ensured.

[0044] The following describes an example of an operation when the water absorption expansion material 70, which is expanded by water absorption, presses the base 11 or the second conductive structure 40 in the direction perpendicular to the plane of the base 11 and breaks the second conductive structure 40. As shown in Fig. 8 and Fig. As shown in Figure 9, the water absorption expansion material 70 absorbs the liquid and expands when the component mounting board 100 is soaked in liquid. It should be noted that due to contact with the liquid, the soluble layer 21 may be completely dissolved or only a part of the soluble layer 21 may be dissolved. Fig. In the example shown in Figure 8, a portion of the soluble layer 21 corresponding to the water absorption expansion material 70 is not dissolved but retains its shape. Fig. In the example shown in Figure 9, the soluble layer 21 is completely dissolved. The extended water-absorbing expansion material 70 exerts pressure in the direction perpendicular to the plane of the base 11 (above in Figure 9). Fig. 8 in the case of the present embodiment) to a portion of the base 11 between the first extending portion 13a and the second extending portion 13b, and a portion of the second conductive pattern 40 between the first extending portion 13a and the second extending portion 13b. Accordingly, two portions of the base 11 sandwiching the missing portion 12 shift relative to each other. More specifically, the peripheral edge portion of the leakage detection sensor 90 is constrained by the first water-permeable layer 85 and the second water-permeable layer 87 as described above.Thus, a portion of the base 11 between the right edge of the first extending portion 13a and the left edge of the second extending portion 13b shifts upward with respect to a left portion of the base 11 with respect to a left edge of the first extending portion 13a and a right portion of the base 11 with respect to a right edge of the second extending portion 13b. Moreover, a right portion of the bridge portion 41a shifts upward with respect to the right edge of the first extending portion 13a with respect to a left portion of the bridge portion 41a with respect to the left edge of the first extending portion 13a.Similarly, a left portion of the bridge portion 41b shifts upward with respect to the left edge of the second extending portion 13b with respect to a right portion of the bridge portion 41b with respect to the right edge of the second extending portion 13b. A portion of the bridge portion 42 between the right edge of the first extending portion 13a and the left edge of the second extending portion 13b shifts upward with respect to a left portion of the bridge portion 42 with respect to the left edge of the first extending portion 13a and a right portion of the bridge portion 42 with respect to the right edge of the second extending portion 13b.Accordingly, the bridge portion 41a, which is arranged in a bridging manner over the right and left edges of the first extending portion 13a, the bridge portion 41b, which is arranged in a bridging manner over the right and left edges of the second extending portion 13b, and the bridge portion 42, which is arranged in a bridging manner over the left edge of the first extending portion 13a and the right edge of the second extending portion 13b, are broken.

[0045] As described above, in the present embodiment, the missing section 12 comprises the third extending section 14. The third extending section 14 extends from the intermediate section of the first extending section 13a in the same direction of extension to the intermediate section of the second extending section 13b in the same direction of extension. In plan view, essentially the entirety of the third extending section 14 is located within the outline of the water-absorbing expansion material 70. Thus, the extended water-absorbing expansion material 70 exerts pressure on the third extending section 14, and consequently, the section of the base 11 between the first extending section 13a and the second extending section 13b can displace upwards with a smaller moment.This means that the two sections of the base 11 sandwiching the missing section 12 can move smoothly relative to each other. Furthermore, as shown in . Fig. As shown in FIG. 9, the third extending portion 14 and its periphery in the base 11 can be displaced upward relative to other portions by pressing the water-absorbing expansion material 70. Accordingly, the bridge portions 41a, 41b, which are arranged with the third extending portion 14 sandwiched therebetween, can be more reliably broken in the Y direction.

[0046] Further, for example, the expansion of the water-absorbing expansion material 70 in a first direction (thickness direction of the water-absorbing expansion material 70 in the case of the present embodiment) is greater than the expansion in a second direction (width direction of the water-absorbing expansion material 70 in the case of the present embodiment) perpendicular to the first direction. Furthermore, the water-absorbing expansion material 70 is arranged such that the first direction coincides with the direction perpendicular to the plane of the base 11. With this configuration, the two portions of the base 11 sandwiching the missing portion 12 can be sufficiently displaced relative to the direction perpendicular to the plane of the base 11 (up-down direction). Thus, the second conductive pattern 40 (bridge portions 41a, 41b, 42) can be broken more reliably.

[0047] For example, the thickness of the water-absorbing expansion material 70 before expansion is preferably 0.2 m or more and 3 mm or less, and more preferably 0.5 m or more and 2 mm or less. Furthermore, the thickness of the water-absorbing expansion material 70 after expansion is preferably 1 mm or more and 20 mm or less, and more preferably 5 mm or more and 15 mm or less.

[0048] As described above, the water-absorbing expansion material 70 presses on a part of the base 11, thereby displacing the two portions of the base 11 sandwiching the missing portion 12 relative to each other. The missing portion 12 includes, for example, the first extending portion 13a and the second extending portion 13b, which extend parallel to each other along the planar direction of the base 11. The water-absorbing expansion material 70 is disposed at the portion of the base between the first extending portion 13a and the second extending portion 13b and presses such a portion of the base 11. Furthermore, the water-absorbing expansion material 70 is formed in a sheet-like manner, and the first direction is the thickness direction of the water-absorbing expansion material 70.

[0049] The component mounting board 100 according to the present embodiment is, for example, attached to a water-absorbing product (e.g., a Fig. 10 shown paper diaper 300) is attached, which is capable of absorbing liquid. It should be noted that Fig. 10 shows the surface of the paper diaper 300 on the side of contact with the skin of a wearer. Fig. 1, Fig. 3, Fig. 8 and Fig. For example, FIGS. 9 and 10 show a state in which the component attachment board 100 is attached to the paper diaper 300. When the wearer urinates into the paper diaper 300 and the water absorption expansion material 70 expands due to the urine, such a state is detected, so that the wearer's urination can be detected. That is, the component attachment board 100 is used as a urination sensor that notifies a caregiver of the timing of changing the paper diaper 300.

[0050] A paper diaper body 301 includes, for example, a rear portion 310 arranged on the back of the user, a front portion 320 arranged on the abdominal side of the user, a coupling portion 330 coupling the rear portion 310 and the front portion 320 together, and a plurality of hook and loop fastener portions 340 arranged on side portions of the rear portion 310 as shown in Fig. Figure 10 shows the following: Both side sections of the posterior section 310 and both side sections of the anterior section 320 are coupled to each other via the hook-and-loop fastener sections 340, enabling the user to wear the paper diaper 300. An absorber 350, capable of absorbing liquid, is formed on the surface of the paper diaper 300 on the side that contacts the user's skin. The absorber 350 extends, for example, in a front-to-back direction over the posterior section 310, the anterior section 320, and the coupling section 330. When the user is wearing the paper diaper 300, the absorber 350 is positioned where it contacts the external opening of the user's urethra. When the user urinates, the urine is absorbed by the absorber 350.

[0051] The component mounting board 100 is preferably arranged, for example, on the surface of the paper diaper body 301 on the side of contact with the user's skin. In the case of the present embodiment, the component mounting board 100 is connected to the paper diaper body 301, for example, by a double-sided tape 88 or a hook-and-loop fastener (not shown). The component mounting board 100 is connected to the paper diaper body 301 in such a position that, for example, one side of one surface (one surface 11a) of the moisture detection sensor 90 is arranged on the side of contact with the user's skin, and the other surface (other surface 21b) of the moisture detection sensor 90 is arranged on the side (i.e., the side of the diaper body 301) opposite to the side of contact with the user's skin. In the Fig. In the example shown, the second water-permeable layer 87 is applied to the surface of the paper diaper body 301 on the side of contact with the user's skin by the double-sided tape 88.

[0052] The component fixing board 100 is provided, for example, on the receiver 350 of the paper diaper body 301. As long as the component fixing board 100 is located within the range of a portion 302 of the receiver 350 corresponding to the external opening of the urethra, the component fixing board 100 may be provided at a portion corresponding to the coupling portion 330 or at a portion corresponding to the front portion 320. That is, the arrangement location of the component fixing board 100 may be changed as needed within the range of the portion 320 corresponding to the external opening of the urethra. Thus, the component fixing board 100 is applicable regardless of the gender of the user. Fig. In the example shown in Fig. 10, the component mounting board 100 is arranged in such a position that the longitudinal direction of the component mounting board 100 is the front-to-rear direction.

[0053] It should be noted that, in the present invention, the location of the component mounting plate 100 on the paper diaper 300 is not limited to the example described above. For example, the component mounting plate 100 can be arranged along a peripheral edge (e.g., the upper edge 310a of the rear section 310 or the lower edge of the front section 220) of a section of the paper diaper body 301 that is not the section 302 corresponding to the external opening of the urethra. In this configuration, urine that has leaked from the paper diaper body 301 can be detected more reliably by the component mounting plate 100. In the present invention, the shape, orientation, arrangement, position, and the like of the component mounting plate 100 are not specifically limited and can be adjusted as needed, for example, according to the size and intended use of the paper diaper body 301.In the present invention, the number of component fixing boards 100 arranged on the paper diaper 300 is not specifically limited. The number of component fixing boards 100 arranged on the paper diaper 300 may be two or more. In this case, the component fixing boards 100 may be arranged respectively on the portion 302 corresponding to the external urethral opening and the peripheral edge of the portion other than the portion 302 corresponding to the external urethral opening.

[0054] Next, a method for manufacturing the component mounting board 100 in the present embodiment will be described. The method for manufacturing the component mounting board in the present embodiment includes a step of preparing the board 10, a step of assembling the board 10 and the soluble layer 21, a step of printing and forming the second conductive pattern 40 on the board and the soluble layer 21, and a step of joining the first water-permeable layer 85 and the second water-permeable layer 87. In the step of preparing the board 10, the board 10 (see Fig. 7) prepared, comprising the base 11, the first conductive structure 30 formed on the base 11, and the fastening component 50 electrically connected to the first conductive structure 30. In the assembly step of the circuit board 10 and the soluble layer 21, the circuit board 10 and the soluble layer 21 are assembled such that the soluble layer 21 is positioned in the region which, in the top view, encompasses the missing section 12. That is, the circuit board 10 and the soluble layer 21 are facing each other, aligned with each other, and connected to each other. In the step of printing and forming the second conductive pattern 40 on the circuit board 10 and the soluble layer 21, the first conductive pattern 30 and the second conductive pattern 40 complementarily form the circuit 60, and the second conductive pattern 40 is disposed over the corresponding missing portion 12.In this way, the humidity detection sensor 90 is obtained. In the step of joining the first water-permeable layer 85 and the second water-permeable layer 87, the first water-permeable layer 85, the water-conductive layer 86, the humidity detection sensor 90, the first double-sided tape 91, the water-absorbing expansion material 70, the second double-sided tape 92, and the second water-permeable layer 87 are stacked in this order from the top. A part of the peripheral edge portion of the first water-permeable layer 85 and a part of the peripheral edge portion of the second water-permeable layer 87 are joined together. In this way, the component mounting board 100 is obtained in the present embodiment.

[0055] The circuit board 10 and the soluble layer 21 can be joined by thermally compressing (thermally laminating) them together. For example, the thermal compression step is preferably carried out at 80 °C or more and 150 °C or less, and more preferably at 100 °C or more and 120 °C or less. The heating time can be, for example, about 5 to 10 seconds. Furthermore, the thermal compression step is preferably carried out under a pressure of 0.3 MPa or more and 3.0 MPa or less, and more preferably under a pressure of 1.0 MPa or more and 2.0 MPa or less. The circuit board 10 and the soluble layer 21 are connected as described above, so that the second conductive structure 40 can advantageously be electrically connected to the first conductive structure 30.

[0056] Similarly, the first water-permeable layer 85 and the second water-permeable layer 87 may be bonded such that the first water-permeable layer 85 and the second water-permeable layer 87 are thermocompressed (thermally laminated) together.

[0057] A method for forming the missing portion 12 in the circuit board 10 is not specifically limited. For example, a technique of forming the missing portion by punching, mainly applying a blade or a punch, is a representative method. Note that the present invention is not limited to this example. For example, laser processing can be applied. Second embodiment

[0058] Next, a second embodiment using Fig. 11. It should be noted that Fig. 11 shows a cut end surface of a section corresponding Fig. 1. A component mounting board 100 according to the present embodiment differs from the component mounting board 100 according to the first embodiment described above in the following points and is configured similarly to the component mounting board according to the first embodiment described above in the other points.

[0059] In the case of the present embodiment, a water absorption expansion material 70 is arranged at a position corresponding to a second conductive pattern 40 and presses the second conductive pattern 40 in a missing portion 12. Also in this configuration, the expanded water absorption expansion material 70 can break the second conductive pattern 40, and a state that the component mounting board 100 is soaked in liquid can be detected more reliably.

[0060] As in Fig. As shown in Figure 11, the component mounting board 100 includes a plurality of water absorption expansion materials 70. The plurality of water absorption expansion materials 70 are arranged on the opposite side of a base from one side of the soluble layer 21. More specifically, the component mounting board 100 includes, as shown in Fig. 11, a pair of right and left water absorption expansion materials 71, 72 are provided. The left water absorption expansion material 71 is disposed inside a first extending portion 13a. The right water absorption expansion material 72 is disposed inside a second extending portion 13b. Moreover, the left water absorption expansion material 71 is directly stacked on a portion of a bridge portion 41a corresponding to the first extending portion 13a. The right water absorption expansion material 70 is directly stacked on a portion of a bridge portion 41b corresponding to the second extending portion 13b. For example, double-sided tapes 91 are provided at end portions of the pair of right and left water absorption expansion materials 71 and 72, respectively, on one side of the first water-permeable sheet 85.The pair of right and left water-absorbing expansion materials 71, 72 are attached to the first water-permeable layer 85 by the double-sided tapes 91. When the component mounting board 100 is saturated with liquid, the expanded water-absorbing expansion materials 71, 72 exert pressure directly in a direction perpendicular to the plane of the base 11 (below in . Fig. 11 in the case of the present embodiment) onto the corresponding bridge portions 41a, 41b, thereby breaking the bridge portions 41a, 41b. That is, even with this configuration, the state that the component mounting board 100 is soaked in liquid can be detected more reliably.

[0061] As in Fig. As shown in FIG. 11, in the case of the present embodiment, the component mounting board 100 further includes a spacer 76 arranged along the other surface 21b of the soluble layer 21. Portions of the spacer 76 corresponding to the first extending portion 13a and the second extending portion 13b are second missing portions 77. With this configuration, a space where each of the pair of right and left water-absorbing expansion materials 71, 72 expands in the direction perpendicular to the plane of the base 11 (thickness direction of the water-absorbing expansion materials 71, 72) can be sufficiently secured. Thereby, the expanded water-absorbing expansion materials 71, 72 can break the second conductive pattern 40 more reliably.

[0062] It should be noted that, in the case of the present embodiment, a non-soluble sheet material (not shown) may be disposed instead of the soluble layer 21. In this case, the sheet material is preferably configured such that the water-absorbing expansion materials 71, 72 also break the sheet material when the expanded water-absorbing expansion materials 71, 72 break the second conductive structure 40.

[0063] The embodiments have been described above with reference to the drawings. These embodiments are examples of the present invention. Other configurations different from those described above may also be used.

[0064] For example, in the examples described above, the attachment component 50 is the RFID chip. However, the present invention is not limited to these examples. The attachment component 50 may be other electronic components such as a capacitor or a resistor.

[0065] In the examples described above, the second conductive structure 40 is arranged in a bridge manner between the first portion of the first conductive structure 30 and the second portion, which is the portion of the first conductive structure 30 separated from the first portion, with the missing portion 12 interposed therebetween. However, the present invention is not limited to these examples. The second conductive structure 40 is not necessarily arranged in a bridge manner over the first conductive structure 30 and may merely be connected to the first conductive structure 30. As a simple example, the left half of the circuit 60 shown in Fig. 1 is formed by the first conductive structure 30 and the right half is formed by the second conductive structure 40.

[0066] In the examples described above, the circuit board 10 has one missing section 12. However, the number of missing sections 12 included in the circuit board 10 is not specifically limited and may be, for example, two or more.

[0067] The present embodiments include the following technical ideas. (1) A component mounting board comprising: a layered humidity detection sensor, wherein the humidity detection sensor comprises: a circuit board having a base, a first conductive structure formed on the base, and a mounting component electrically connected to the first conductive structure; and a second conductive structure which, together with the first conductive structure, forms a circuit in a complementary manner, where a section of the base corresponding to the second conductive structure is a missing section, wherein the component mounting board further comprises a water-absorbing expansion material, and when expanded by water absorption, the water absorption expansion material presses the base or the second conductive structure in a direction perpendicular to a plane of the base to break the second conductive structure. (2) The component mounting board according to technical concept (1), in which The water-absorbing expansion material presses on part of the base to displace two sections of the base that sandwich the missing section relative to each other. (3) The component mounting board according to technical concept (2), in which the missing portion comprises a first extending portion and a second extending portion extending parallel to each other along a planar direction of the base, and the water absorption expansion material is arranged at a position corresponding to a portion of the base between the first extending portion and the second extending portion, and presses on the portion of the base. (4) The component mounting board according to the technical idea (3), wherein the missing portion includes a third extending portion extending from an intermediate portion of the first extending portion in an extending direction thereof to an intermediate portion of the second extending portion in an extending direction thereof. (5) The component mounting board according to technical idea (1) wherein the water absorption expansion material is arranged at a location corresponding to the second conductive structure and presses on the second conductive structure in the missing section. (6) The component mounting board according to any one of the technical ideas (1) to (5), in which an expansion of the water-absorbing expansion material in a first direction is greater than an expansion in a second direction perpendicular to the first direction, and the water-absorbing expansion material is arranged such that the first direction coincides with the direction perpendicular to the plane of the base. (7) The component mounting board according to (6), in which the water absorption expansion material is formed in a layered manner and the first direction is a thickness direction of the water absorption expansion material. (8) The component mounting board according to any one of the technical ideas (1) to (7), further comprising: a water-conducting layer disposed on an opposite side of the water absorption-expansion material from the humidity detection sensor. List of reference symbols 10 circuit boards 11 Base 11a A surface 11b Other surface 111a Body section 111b Attachment part 12 Missing section 13a First extending section 13b Second extending section 14 Third extending section 21 Soluble layer 21a A surface 21b Other surface 30 First conductive structure 31a, 31b Wide section 32a, 32b Narrow section 34a, 34b, 36a, 36b, 37a, 37b, 38a, 38b, 39a, 39a Ring-shaped structure formation section 36 Coupling section 40 Second conductive structure 41a, 41b, 42 bridge section 50 fastening components 60 circuit 70, 71, 72 Water absorption expansion material 76 spacers 77 Second missing section 88 Double-sided tape 85 First water-permeable layer 86 Water-conducting layer 87 Second water-permeable layer 90 Humidity detection sensor 91, 92 Double-sided tape 100 component mounting board 300 paper diapers 301 paper diaper body 302 Section corresponding to an external opening of the urethra 310 Rear Section 310a Upper edge 320 Front section 330 coupling section 340 Velcro section 350 sensors QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-T-2014-592732

[0003]

Claims

[1] A component mounting board having the following features: a layered moisture detection sensor, wherein the humidity detection sensor comprises: a circuit board having a base, a first conductive structure formed on the base, and a mounting component electrically connected to the first conductive structure; and a second conductive structure which, together with the first conductive structure, forms a circuit in a complementary manner, a portion of the base corresponding to the second conductive structure is a missing portion, the component mounting board further comprises a water absorption expansion material, and when expanded by water absorption, the water absorption expansion material presses the base or the second conductive structure in a direction perpendicular to a plane of the base to break the second conductive structure. [2] The component mounting board according to claim 1, wherein the water absorption expansion material presses on a part of the base to displace two portions of the base sandwiching the missing portion relative to each other. [3] The component mounting board according to claim 2, wherein the missing portion includes a first extending portion and a second extending portion extending in parallel to each other along a planar direction of the base, and the water absorption expansion material is arranged at a position corresponding to a portion of the base between the first extending portion and the second extending portion and presses the portion of the base. [4] The component mounting board according to claim 3, wherein the missing portion comprises a third extending portion extending from an intermediate portion of the first extending portion in an extending direction thereof to an intermediate portion of the second extending portion in an extending direction thereof. [5] The component mounting board according to claim 1, wherein the water absorption expansion material is arranged at a position corresponding to the second conductive pattern and presses the second conductive pattern in the missing portion. [6] The component mounting board according to any one of claims 1 to 5, wherein an extension of the water absorption expansion material in a first direction is larger than an extension in a second direction perpendicular to the first direction, and the water absorption expansion material is arranged such that the first direction coincides with the direction perpendicular to the plane of the base. [7] The component mounting board according to claim 6, wherein the water absorption expansion material is formed in a layered manner and the first direction is a thickness direction of the water absorption expansion material. [8] The component mounting board according to any one of claims 1 to 7, further comprising: a water-conducting layer disposed on an opposite side of the water absorption-expansion material from the humidity detection sensor.

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