Thermally induced power generation module

The thermally induced power generation module addresses structural complexity and efficiency issues by integrating a thermal conductivity and semiconductor materials to provide a stable electron flow and long service life, enabling efficient power generation for small devices.

DE202025105543U1Active Publication Date: 2025-12-11LIU HAILONG
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Patent Information

Application Number
DE202025105543
Authority / Receiving Office
DE · DE
Patent Type
Utility models
Current Assignee / Owner
Filing Date
2025-09-17
Publication Date
2025-12-11
Estimated Expiration
2035-09-30

AI Technical Summary

Technical Problem

Existing thermally induced power generation modules have complex structures, limited application scenarios, poor thermal conductivity, low efficiency, and high production costs, making them unsuitable for miniaturized and modular applications.

Method used

A thermally induced power generation module comprising a thermal interface material and semiconductor material, with a cavity for the semiconductor, symmetric mounting holes, and specific pole materials for stable electron transfer, ensuring high thermal conductivity and efficient power conversion.

Benefits of technology

The module achieves high power generation efficiency, simple structure, and wide application range with stable electron flow and long service life, suitable for small electronic devices and portable appliances.

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Abstract

Thermally induced current generation module, characterized in that it comprises a module body comprising a thermally conductive material (1), a semiconductor material (2), a cavity is provided on a central part of the thermally conductive material (1) into which the semiconductor material (2) is filled, the thermally conductive material (1) and the semiconductor material (2) are combined and pressed or shaped, two mounting holes are symmetrically provided on a head part of the module body, which penetrate the thermally conductive material (1) and contact the semiconductor material (2), and a positive pole (3) and a negative pole (4) are provided on each of the two mounting holes.
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Description

Technical field

[0001] The present utility model relates to the technical field of electricity generation, specifically a thermally induced electricity generation module. State of the art

[0002] In the field of energy use, thermal energy is a widespread form of energy, such as residual heat in industrial production, heat generated during the operation of an electronic system, natural heat in the daily environment, etc.However, there are obvious shortcomings in the existing technology for utilizing thermal energy: On the one hand, a conventional thermoelectric conversion device (such as part of thermal coupling devices) has a complex structure, requires complex auxiliary components, has a large volume, its application scenarios are limited, and it is difficult to achieve a miniaturized and modular application; on the other hand, the material used for part of the thermally induced power generation device has poor thermal conductivity and low heat energy transfer efficiency, resulting in low power generation efficiency, and the positive and negative poles and the core material of the power generation have a lack of connection stability, which easily leads to poor contact and affects the power output.

[0003] Furthermore, the production process of existing thermally induced power generation modules is cumbersome, production costs are high, and widespread distribution and use are difficult. The demand for miniaturized, high-performance power generation modules for small electronic devices, portable appliances, and other applications cannot be met. Therefore, the development of a thermally induced power generation module with a simple structure, good thermal conductivity, high power generation efficiency, and ease of manufacture is a pressing problem in the field of power generation technology. Content of the present utility model

[0004] The objective of this utility model is to solve the aforementioned problem of providing a thermally induced power generation module. To achieve this objective, the following technical solution is employed in this utility model: Thermally induced current generation module comprising a module body which includes a thermal interface material and a semiconductor material, a cavity is provided in a central part of the thermal interface material into which the semiconductor material is filled, the thermal interface material and the semiconductor material are combined and pressed or shaped, two mounting holes are symmetrically provided in a head part of the module body which penetrate the thermal interface material and contact the semiconductor material, a positive pole and a negative pole are provided at each of the two mounting holes.

[0005] An improvement is to ensure a distance between the mounting holes greater than 2 mm.

[0006] As an improvement, the thermal conductivity material can be one or more of thermally conductive silicone, thermally conductive resin, or aluminum trioxide.

[0007] An improvement is the use of one or more materials such as lead, copper, or stainless steel as the positive pole.

[0008] An improvement is the negative pole of one or more magnesium or lithium.

[0009] The advantage of the present utility model is that: 1. The present utility model has a high power generation efficiency and a good heat energy utilization rate: the material with high thermal conductivity is chosen, which quickly absorbs and transfers heat to reduce heat energy loss; the electrons move quickly at the material of the negative pole, the stability of the material of the positive pole is good, the two fit together and form a significant potential difference, can efficiently convert heat energy into electrical energy during temperature changes, the power generation efficiency is better than that of conventional small power generation modules. 2. The present utility model has a simple structure and a small volume: The module body consists only of the thermal conductivity material, the semiconductor material, and the positive and negative poles; there are no complex auxiliary components. The integration of the structure is achieved through the process of combination and pressing or forming. The volume is small, and it can be adapted to small electronic systems, portable devices, and other scenarios; the range of applications is wide. 3. The present utility model has a stable structure and a long service life: The thermal interface material and the semiconductor material are combined and pressed or shaped, tightly connected; the positive and negative poles are located deep within the semiconductor material, the contact is stable to prevent poor contact or loosening of the components during long-term use; the selected positive and negative poles and the thermal interface material all have good corrosion resistance and stability, which extends the module's service life. Explanation of the illustrations Fig. shows a sectional view of a thermally induced current generation module in embodiment 1. Fig. shows a structural view of a thermally induced current generation module in embodiment 1. Reference symbols in the illustrations are:

[0010] (1) Thermal conductivity material; (2) Semiconductor material; (3) Positive pole; (4) Negative pole. Designs

[0011] The present utility model is described in detail and specifically below by means of concrete embodiments in order to enable a better understanding of the present utility model; however, the scope of protection of the present utility model is not limited by the following embodiments. Example 1

[0012] The present embodiment discloses a thermally induced current generation module.

[0013] As in Fig. until Fig. As shown, the present embodiment comprises a thermal conductivity material (1) and a semiconductor material (2), the two of which are combined by a specific process to form a stable current generation structure.

[0014] The thermal interface material (1) and the semiconductor material (2): For the thermal interface material (1), a material with high thermal conductivity is selected, specifically one or more of thermally conductive silicone, thermally conductive resin, and aluminum trioxide. These materials have excellent thermal conductivity and can quickly absorb external heat and transfer it to the interior to provide sufficient heat energy sources for the power generation process. A cavity is provided in the central part of the thermal interface material (1). The shape and size of the cavity are adapted to the semiconductor material (2), into which the semiconductor material (2) is filled. The semiconductor material (2) serves as the core medium for converting thermal energy into electrical energy, facilitating the movement of electrons during temperature changes and thus enhancing the power generation effect.

[0015] A process of combination, pressing, or forming is used for the thermal interface material (1) and the semiconductor material (2). This means that the thermal interface material (1) filled into the semiconductor material (2) is pressed as a whole, so that the two are tightly connected without gaps. On the one hand, this ensures the rapid transfer of heat energy from the thermal interface material (1) to the semiconductor material (2) to reduce heat energy loss; on the other hand, it increases the structural stability of the module body, preventing the separation or detachment of the thermal interface material (1) and the semiconductor material (2) during long-term use.

[0016] Mounting holes and positive and negative terminals (4): Two mounting holes are symmetrically provided on one end of the module body. These holes penetrate the thermal interface material (1) and contact the semiconductor material (2). The mounting holes provide a channel for mounting the positive and negative terminals (4), ensuring that they can be directly connected to the semiconductor material (2) for effective electron transfer. A specific distance is maintained between the two mounting holes to prevent a short circuit between the positive and negative terminals (4) and ensure stable power output.

[0017] The positive and negative terminals (4) are each positioned at the two mounting holes. For the positive terminal (3), a material with good thermal conductivity and stability is selected; specifically, one or more materials such as lead, copper, or stainless steel can be used. For the negative terminal (4), a negatively charged material is selected, in which electrons move quickly; specifically, one or more materials such as magnesium or lithium can be used. The positive and negative terminals (4) are positioned deep within the semiconductor material (2) through the mounting holes, making close contact with the semiconductor material (2). This ensures that the electrons can move smoothly between the positive and negative terminals (4) and the semiconductor material (2), providing a stable path for the output of electrical energy. II. Electricity generation principle

[0018] The current generation principle of the present thermally induced current generation module is related to the operating principle of a thermocouple; the core is based on the difference in electron motion triggered by temperature changes; the specific process is as follows: When the module body is heated, the external heat is rapidly transferred through the thermal conductivity material (1) to the semiconductor material (2), so that the entire module is in a state of temperature increase. At this point, the velocity of the electrons in the material (such as magnesium, lithium) of the negative pole (4) is much greater than that in the material (lead, copper, stainless steel) of the positive pole (3). This difference in electron velocity creates a potential difference between the positive and negative poles (4), generating a voltage. With the continuous increase in temperature, the electron velocity accelerates further. Under the influence of the potential difference, the electrons move in a specific direction from the negative pole (4) to the positive pole (3), generating a continuous current. This enables the process of converting thermal energy into electrical energy.

[0019] During the heating process, a voltage and a heat wave frequency can also be generated by the module body; such physical phenomena further support the electronic activity of the semiconductor material (2) and the positive and negative poles (4), strengthen the regularity of electron movement and indirectly increase the current generation efficiency, ensuring that the module can output the electrical energy stably under different temperature conditions. III. Manufacturing process

[0020] The manufacturing process of the module body is simple and efficient, facilitating large-scale mass production; the specific process is as follows: Shaping the thermal conductivity material (1): first, process the selected thermal conductivity material (1) (such as thermally conductive silicone, thermally conductive resin, aluminum trioxide) into a module with a predetermined shape, and reserve a cavity in the middle part of the module for subsequent filling with the semiconductor material (2).

[0021] Filling and pressing the semiconductor material (2): filling the semiconductor material (2) into the cavity of the thermal interface material (1), ensuring that the cavity is filled by the semiconductor material (2) and that there is no gap; then placing the thermal interface material (1) filled by the semiconductor material (2) into a pressing machine, combining and pressing or forming it so that the thermal interface material (1) is tightly combined with the semiconductor material (2), forming a complete module body.

[0022] Machining the mounting hole and mounting the positive and negative poles (4): machining two mounting holes symmetrically on the head of the module body, ensuring that the mounting holes penetrate the thermal conductivity material (1) and contact the semiconductor material (2); finally, arranging the positive pole (3) and the negative pole (4), which are already prepared, in both mounting holes, so that the positive and negative poles (4) are positioned and secured deep within the semiconductor material (2) to complete the manufacture of the entire thermally induced current generation module.

Claims

[1] Thermally induced power generation module, characterized by , that it comprises a module body comprising a thermally conductive material (1), a semiconductor material (2), a cavity is provided in a central part of the thermally conductive material (1) into which the semiconductor material (2) is filled, the thermally conductive material (1) and the semiconductor material (2) are combined and pressed or shaped, two mounting holes are symmetrically provided in a head part of the module body, which penetrate the thermally conductive material (1) and contact the semiconductor material (2), and a positive pole (3) and a negative pole (4) are provided at each of the two mounting holes. [2] Thermally induced power generation module according to claim 1, characterized by that the distance between the mounting holes is greater than 2 mm. [3] Thermally induced power generation module according to claim 1, characterized bythat the thermal conductivity material is one or more of thermally conductive silicone, thermally conductive resin, or aluminum trioxide. [4] Thermally induced power generation module according to claim 1, characterized by , that the positive pole (3) is one or more of lead, copper, stainless steel. [5] Thermally induced power generation module according to claim 1, characterized by , that the negative pole (4) is one or more of magnesium, lithium.