Modular sensor and system platform for measurements, cleaning and calibrations in analytical, temperature and pressure measurement technology

Abstract

Modular sensor and system platform for measurements, cleaning and calibration in analytical, gas temperature, pressure measurement, flow measurement and level measurement technology. - with integrated Ethernet technology Advanced Physical Layer (APL) and Single Pair Ethernet (SPE) as well as a modular electronics hardware and electronics software platform for measurement parameters, cleaning / calibration systems and service systems in liquid and / or gas analysis and / or temperature and / or pressure measurement technology and / or flow measurement technology and / or level measurement technology. - with integrated fieldbus Ethernet technology APL and / or SPE, PROFINET etherCAT, Ethernet TCP / IP, Ethernet UDP / IP and other similar and / or adapted fieldbus protocols, e.g. I / O-Link, USB, for potentially explosive (IECEX, ATEX, FM) and / or non-hazardous (non-EX) environments, - with direct connection option to programmable logic controllers (PLCs) and / or input / output units (I / Os or remote I / Os) of established system manufacturers, via fixed cable connection, implemented as a 2-wire and / or multi-wire connection, copper and / or fiber optic connection, and / or wireless connection, WLAN and / or Bluetooth as well as WirelessHART. - with direct connection option to PCs for explosion-hazardous and non-explosion-hazardous environments via USB and / or via interface or , USB modem for sensor-side Ethernet APL and / or SPE and / or PROFINET and other sensor-side fieldbuses, e.g. I / O-Link, PROFIBUS DP / PA or or FF, or HART-IP, or HART 4mA and specially adapted fieldbuses (where the modem can be used for explosion-hazardous and / or non-explosion-hazardous environments). - operable with standardized user interfaces, such as PACTware-FDT / DTM, and / or common field communicators, e.g. Emerson 475 Field Communicator for FF and HART or other systems from established manufacturers, or apps or application software for mobile operating systems, such as iPhone and / or PC, laptop with different operating systems (e.g. Apple, Windows and the like) and / or Visual Basic with Visual Basic XML Generator (which generates Simple Visual Basic Code to Read & Write XML Data and uses libraries for C++, Oracle Java, VB .Net, Silverlight, VB6).

Description

[0001] The invention relates to a modular integrated Ethernet / Internet sensor and system concept for analytical measurement technology.

[0002] The following description, as well as the editing of the claims and the drawing, is based on terms from technical terminology, the essential meaning of which should be understood in particular in the sense of the following glossary: Glossary (* = registered trademark) Ethernet*CSMA / CD Algorithm In the OSI model, Ethernet defines Layer 1 (Physical Layer) and Layer 2 (Data Link Layer). Ethernet can form the basis for network protocols such as AppleTalk, DECNet, IPX / SPX, or TCP / IP. Ethernet operates at 10 Mbit / sec, 100 Mbit / sec (decoder), and 1000 Mbit / sec. Ethernet* for EX Reduced data transmission rate <=2.5 Mbit / sec and power consumption <=500 mA, <=20 volts, <=450 mA; Ethernet according to IEEE 802.3 Clause xx transmits in non-hazardous areas at 10 Mbit / s (e.g., 10BASE2), 100 Mbit / sec (e.g., 100BASE-TX), or 1000 Mbit / sec (e.g., 1000BASE-SX). These transmission rates are possible in hazardous areas up to the typical 'LINK' Zone 2. There, the Ethernet is transformed to 2-wire technology with a maximum of 2 Mbit / sec, EX-e. The maximum transmission distance from the link to the field switch is <=1000 m. In the field switch ZONE 1, the signal is designed and limited for EX-ia. Therefore, the maximum length to the sensor is 200m, using 2-wire technology, 2 Mbit / sec. PLC Programmable logic controller I / O, remote I / O Input / Output / / Input / Output modules in automation technology Asset management system Computer-based system for managing sensors and drives within a process plant; asynchronous operation and monitoring of field devices (sensors, drives) Fieldbus Communication link from sensors to PLC, I / O IEEE 802.3x Ethernet standard I / O link Special, simple fieldbus for non-EX applications EX Explosion-prone environments that require special hardware and software designs in electronics Non-EX Applications in non-explosive environments Profibus* DP Special, simple fieldbus for non-EX applications Profibus* PA Special, simple fieldbus for EX applications FF Fieldbus Foundation, a special fieldbus for EX and non-EX applications Profinet* Special fieldbus with point-to-point connection, non-EX Modbus* RTU Modbus RTU is based, for example, on the RS-485 or RS-232 interface. Due to the current and voltage requirements, a Modbus RTU is not suitable for use in hazardous areas (RTU: Remote Terminal Unit). The Modbus protocol is an open standard. HARD * Highway Addressable Remote Transducer Protocol; (Highway for addressable remote access to transducers) the global standard by which intelligent field devices and monitoring systems exchange digital information over an analog wiring. HART* IP HART at Ethernet speed HART* - 4 mA Operated in hard digital multidrop mode, i.e., without a 4-20mA signal. EtherNet / IP* EtherNet Industrial Protocol (often simply called EIP) is a real-time Ethernet protocol primarily used in automation technology. EtherNet / IP was developed by Allen-Bradley (part of Rockwell Automation) and later released as an open standard to the OpenDeviceNet Vendor Association (ODVA). Alongside Profinet and Modbus / TCP, EtherNet / IP is a currently widespread Ethernet-based fieldbus. Ethernet* TCP / IP Transmission Control Protocol / Internet Protocol (OSI model: Layers 1 and 2 network access Ethernet, Layer 3 Internet Protocol, Layer 4 control protocol for Internet Protocol and transmission, Layer 4 application) OSI* Open Systems Interconnection Model, consisting of 7 layers: Layer 1: Physical Layer, Layer 2: Data Link Layer, Layer 3: Network Layer (e.g., Internet), Layer 4: Transport Layer (e.g., BTCP), Layer 5: Session Layer, Layer 6: Presentation Layer, Layer 7: Application Layer Wireless, e.g. WirelessHART* Wireless connection, WirelessHART is based on the HART protocol. Bluetooth* Bluetooth is a wireless connection, e.g., Bluetooth 4.0 for low-power applications. ZigBee* ZigBee is a specification for low-data-rate wireless networks, such as those used in home automation, sensor networks, and lighting technology. ZigBee primarily focuses on short-range networks (10 to 100 meters), but ranges of several kilometers are also possible. The ZigBee specification extends the IEEE 802.15.4 standard by adding a network and application layer. WLAN / WIFI* Wireless Area Network according to IEEE 802.11; Since WLAN / WIFI uses the same addressing as Ethernet at the data link layer (layer 2 in the OSI model), a connection to wired networks (in WLAN / WIFI jargon "Distribution System", DS) can easily be established via a wireless access point with an Ethernet port. APP Application software (also application program, or simply application or app) refers to computer programs used to process or support a useful or desired non-system-related functionality (e.g., iPhone 5). PACTware* User interface for devices, systems, and communication components. PACTware is the open, manufacturer-independent, and fieldbus-crossing user interface for plant-wide operation of devices, systems, and communication components. FDT is a specification for a software interface. This software- An interface describes the data exchange between an application and software components for field devices. FDT is standardized as the international standards IEC 62453 and ISA103. DTM* Device Type Manager (DTM) is essentially a driver analog to the printer driver and therefore a specific device software. FDT* Available FDT and DTM technologies. PACTware has integrated the FDT interface. FDT (Field Device Tool) is the standard for unifying the interface between device and user interface. FDT makes it possible to integrate device operation easily and quickly. A / D Analog to Digital Conversion, A / D Conversion DSP Digital Signal Processor, faster data processing hardware FPGA Field Programmable Gate Array (FPGA) is a digital integrated circuit (IC) into which a logic circuit can be programmed. ASIC Application-specific integrated circuit (ASIC) chips for special customer-specific hardware / software processing. Highly integrated electronic circuit. Hybrid Analog and digital crossover circuitry in a single package, highly miniaturized, similar to ASIC. VP Variopin, special connector system (plug and plug socket for industrial applications) M12 connector* Standard connectors in automation technology CAT-5* Special Ethernet cable 8P8C* Ethernet connector EtherCAT EtherCAT is a real-time Ethernet technology developed by Beckhoff Automation. Mesh network In a mesh network, each network node is connected to one or more other nodes. Information is passed from node to node until it reaches its destination. When every participant is connected to every other participant, it is called a fully meshed network. µ-Controller microcomputer Ex Approval (ATEX, FM, Nepsi, CSA) Certifications with the following exemplary ignition protection types: Zone 1: II 2G Ex ia IIC T4-T6 and Zone 0: II 1G Ex ia IIB T4 ... G ¼ E, G ¼ B, G ½ B, ¼NPT, Typical process connections for sensors and systems AMS*, FieldCare* Emerson's asset management system, DELTAV is the associated control system. FieldCare is Endress+Hauser's asset management system, comparable to AMS. PLC Programmable Logic Unit (PLC) USB Universal Serial Bus (USB) is a serial bus system for connecting a computer to external devices. Multidrop mode In an optional data transmission mode, a single slave continuously reports a standardized event (HART, 4mA). A high number of messages in data bundling mode is normally only possible in point-to-point mode. PLC Programmable Logic Unit (PLC) DCS Digital Control System (control system, control hardware, cyclic services in automation technology) Non-EX and EX (area) Non-explosion-hazardous (protected) and explosion-hazardous (protected) environments Power over Ethernet*IEEE 802.3af Power over Ethernet (PoE) is regulated by the Ethernet standard IEEE 802.3af (IEEE 802.3 Clause 33). This method describes how Ethernet-enabled devices can be powered via the twisted-pair cable. This is achieved either by utilizing the unused wires of the cable or by transmitting a DC component along with the data signal over the four used wires. Devices designed accordingly are powered with 48 V and up to 15.4 watts. The PoE+ standard, ratified at the end of 2009, achieves up to 30 W at 54 V. A logic circuit ensures that only PoE-enabled devices are powered. 8P8C plug / RJ connectors* RJ connectors are standardized connectors for telecommunications cabling, defined by the US Federal Communications Commission (FCC). The standards describe the physical designs of plugs and sockets, as well as their pin assignments, and are designated with the letters RJ followed by a number (e.g., RJ-45) – sometimes without a hyphen (RJ45) – where "RJ" stands for Registered Jack (standardized socket). 8P8C plug / RJ connectors* The most common RJ connectors used in PC / network and telephony applications are modular connectors. Typical types have six contact positions: RJ-11 has two (6P2C), RJ-14 (as well as the rarely used RJ-12 and RJ-13) has four (6P4C), and RJ-25 has all six positions (6P6C). In networking, any fully populated eight-pin (8P8C) modular connector is often called an "RJ-45". Full DupolEx Data can be transmitted in both directions simultaneously. Simplex Data can only be transmitted in one direction; this technique does not allow for a response. half-duple Data can flow alternately, but not simultaneously, in both directions.

[0003] In analytical measurement technology, temperature, pressure, flow, and level measurement, specific requirements apply to all applications and industries. This applies to the sensors used (accuracy, pressure, and temperature) as well as to the corresponding systems (cleaning, calibration, adjustment). Similarly, different industries require different certifications for these sensors, such as for use in potentially explosive atmospheres (ATEX, FM, CSA, TIIS, NEPSI, etc.), surface finish and design features (e.g., 3A or EHEDG), and materials (FDA compliant). Sensor lifespans and system service requirements also vary considerably.

[0004] In analytical measurement technology, the parameters pH / ORP (redox), total chlorine, free chlorine, ozone and chlorine dioxide, as well as conductive conductivity (2-pole, 4-pole), solids measurement and turbidity are most frequently used for measurement and control, often in conjunction with temperature sensors and pressure, level and flow sensors (as integrated into the sensor or as a separate sensor).

[0005] The sensors are used as → Sensor measuring point (monitoring) or compact sensors, comprising sensor, signal processor (signal processing) and communication (APL Ethernet for Ex and SPE for non-Ex and Ethernet TCP / IP or Ethernet UDP / I), cable, or fiber optic or WLAN / WIFI, whereby all components can be located either in the compact sensor or decentrally on the sensor and coupling. → All sensors are internet-enabled through the use of Ethernet protocols! Fig.Figure 1a shows the basic block diagram of such a sensor. Fig. Figure 1b shows the basic PCB design → The compact sensors are powered via Ethernet cable from the PLC or an Ethernet-enabled PC. → Compact sensors equipped with WLAN / WIFI communication are compact sensors with a battery as their power supply ( Fig. 1a and Fig. 1b) → The APL network topologies can be implemented as trunk and trace for EX areas using Ethernet APL. Fig. 1c shows the network topology for a SPUR network, Fig. Figure 1d shows the network topology for a trunk network, for Ex and non-Ex areas respectively. → The APL network topologies are implemented in a star topology for both Ex areas and non-Ex areas ( Fig. 1d) → Measuring system (control, regulation), automatic cleaning and / or calibration, also used with APL Ethernet (Ex and non-Ex) or SPE Ethernet (non-Ex) or Ethernet TCP / IP or Ethernet UDP / IP in the applications.

[0006] Depending on the parameters listed above, all sensors require different cleaning, calibration and maintenance concepts.

[0007] Considering a typical measuring point with a compact sensor, the raw voltage and / or current values ​​of the analog signal generated by the electrochemical sensor are digitally converted and displayed in the MCU (microcontroller unit). This MCU can be a microcontroller, DSP, FPGA, ASIC, or a combination of these components. The compensation algorithms for temperature and pressure (e.g., pH, chlorine, or dissolved oxygen) are also executed in the MCU. Furthermore, the Ethernet physical layer and the data link layer of the APL protocol (APL PHY), power data decoupling, APL input, and power supply are integrated into the measuring point or compact sensor. The same applies to SPE Ethernet, Ethernet TCP / IP, or Ethernet UDP / IP.

[0008] In most cases, the data evaluated by the MCU is transmitted from the transmitter to the programmable logic controller (PLC) with its associated input / output units (I / O) or to an Ethernet-enabled PC via standardized interfaces (fieldbuses) such as Ethernet APL, Ethernet SPE, Ethernet TCP / IP, or Ethernet UDP / IP, and from there forwarded to the control system or asset management system in the control room. The regulation and control of the cleaning and calibration processes still often take place in the manufacturer-specific proprietary transmitters, but increasingly also in the PLC or the MCU of the sensor system.

[0009] Today, there is a large installed base of transmitters from various manufacturers with the characteristics described above, which can only process different analog input signals from the sensors. Similarly, there are different sensor manufacturers, each of which in turn only supports very specific analog signals. The combination of different transmitters and sensors is therefore only possible to a limited extent for customers.

[0010] Since around 2007, several manufacturers in the analytical measurement technology sector have launched digital sensors that communicate digitally from the sensor to the transmitter (see Memosens from E+H, IMS from Mettler Toledo, and ARC from Hamilton). Since 2015, KROHNE has offered the compact SMARTPAT sensor with HART 7 protocol, which can be connected directly to a PLC or, via an interface modem, to the USB port of a PC.

[0011] For over 30 years, communication protocols have followed the 19 fieldbus families standardized for automation according to IEC 61158: The most important of these to date are, among others, Foundation Fieldbus (FF) FF-H1 and FF-H2, Common Industrial Protocol (CIP), PROFIBUS DP (non-Ex) and PROFIBUS PA (EX), PROFINET IO (Ethernet-based), P-Net, WorldFIP, Interbus, SwiftNet, CC-Link (Ethernet-based), HART, Modbus TCP (Ethernet-based) and RTU, EtherCAT (Ethernet-based), SERCOS and SafetyNET.

[0012] The frequently expressed customer desire to integrate the transmitter directly into analytical measurement sensors (see compact sensors for temperature, flow, pressure, and level) has been persistently ignored by manufacturers, partly due to the technical feasibility of high miniaturization. Furthermore, in their business models, omitting the transmitter represents a perceived and excessive financial loss.

[0013] Based on this, in order to meet future customer requirements regarding the application possibilities of sensors and their compatibility with existing systems, but also to meet future customer demands to be able to connect sensors directly to standardized components and systems of automation technology without a manufacturer-specific transmitter, the present invention defines a new modular platform of sensors and systems with end-to-end Ethernet technology, which no longer requires the conventional transmitter and decentralizes the intelligence and computing power to the sensor element and / or the sensor housing and / or the sensor connector and / or the connector coupling with cable or fiber optic cable and / or to a wireless module WLAN / WIFI (part of the Ethernet protocol).

[0014] This means that the sensors and systems for liquid / gas analysis and temperature and pressure measurement are designed modularly with regard to sensor element, sensor housing and sensor coupling so that they can be used in potentially explosive (EX) environments in the form of Ethernet APL (Advanced Physical Layer) and non-explosion-proof (non-EX) environments in the form of Ethernet SPE (Single Pair Ethernet) directly with the PLCs and / or I / Os or Ethernet-enabled PCs (e.g.) via WLAN / WiFi without requiring an additional external transmitter of the conventional type.

[0015] The following section explains the special features of the new concept for a modular sensor and system platform in more detail. Reference is made to the figures in the drawing.

[0016] Fig.Figure 2 shows the block diagram of a new compact sensor that uses either Ethernet APL (Ex area) or Ethernet SPE as the communication protocol in the wired version. In both cases (APL and SPE), the PROFINET protocol is used in application layer 7 of the OSI model.

[0017] Also in Fig. Figure 2 shows communication via WLAN / WiFi instead of the wired version (above).

[0018] Fig. Figure 3 shows the APL or SPE compact sensors for connection to Ethernet / Internet / WLAN-enabled PCs and PLCs. If the PC is not Ethernet / Internet-enabled, communication can be carried out via a USB interface (see Figure 3). Fig. 3 below).

[0019] Using the respective sensors of the standardized sensor and system platform, measurement systems are developed that enable automatic cleaning and calibration with standard automation components, which also use Ethernet APL, Ethernet SPE, Ethernet TCP / IP, or Ethernet UDP / IP for communication. This means the sensors are directly connected to the PLC and / or the I / Os. The evaluation and / or cleaning algorithms are then executed (software) either in the sensor's MCU, in the PLC, or on the Ethernet-enabled PC itself. Fig. 11 shows a block diagram for this)

[0020] The central communication interface to the higher-level system components (PLC, I / O) is the Ethernet protocol according to IEEE standard 802.3cg, e.g., Ethernet APL or Ethernet SPE with 10 Mbit / sec, or Ethernet TCP / IP or Ethernet UDP / IP. Sensors equipped with Ethernet APL or SPE are internet-enabled!

[0021] According to claim 1, essential features of the new sensor and system concept for analytical measurement technology, temperature and pressure measurement technology, as well as level measurement technology and flow measurement technology are: - Modular sensor and system platform or compact sensors for measurements, cleaning and calibration in analytical measurement technology and / or temperature and / or pressure measurement and / or flow measurement technology and / or level measurement technology - with integrated Ethernet technology in the form of Ethernet APL and Ethernet SPE according to standard IEEE 802-3cg and modular electronic hardware and software platform for measurement parameters, cleaning / calibration systems and service systems in liquid and / or gas analysis and / or temperature and / or pressure measurements and / or flow measurement technology and / or level measurement technology - and / or integrated and / or non-integrated design, - with integrated fieldbus Ethernet technology in the application layer (layer 7 of the OSI model). Examples include the Ethernet-based fieldbuses PROFINET, EtherCAT, EtherTalk and / or - with direct connection option to programmable logic controllers (PLCs) and / or input / output units (I / Os) of established system manufacturers, via fixed cable connection, implemented as a 2-wire and / or multi-wire connection, copper and / or fiber optic connection, and / or wireless connection, in particular WLANNIFI, which is implemented in the Ethernet protocol or Ethernet II Frame. - with direct connection option to Ethernet / WLAN / WIFI-enabled PCs for potentially explosive atmospheres via Ethernet APL and / or non-potentially explosive atmospheres via Ethernet SPE - Operable with standardized user interfaces, such as Visual Basic, PACTtware-FDT / DTM, and common field communicators, such as the Emerson 475 Field Communicator for FF and HART and / or other systems from established manufacturers, and / or apps or application software for mobile operating systems, such as iPhone or Samsung (Android) and / or Ethernet / WLAN / WIFI-enabled PCs, laptops with different operating systems (e.g., Apple, Android, Windows, etc.)

[0022] As a general example of the realization of such a concept, reference is made to the schematic representation of the Fig. Reference is made to Figure 1 of the drawing.

[0023] In particular, the new concept may also have the following features: - Sensor with integrated Ethernet / Internet technology and fieldbus technology for non-Ex (Ethernet SPE) and Ex Ethernet (APL areas) or Ethernet TCP / IP or Ethernet UDP / IP or sensor with integrated Ethernet technology and fieldbus technology according to IEEE 802.2, 802.3u, for non-Ex and Ex areas IEEE 802.3. - Sensor with integrated Ethernet technology and fieldbus technology for WLAN / WIFI (Wireless-Local Area Network) according to IEEE 802.3u and / or IEEE 802.11 according to IEEE 802.2, 802.3u and Ex areas and / or 2-wire Ethernet SPE for non-Ex areas. - Ethernet TCP / IP or Ethernet UDP / IP optionally implemented in layers 1-4 of the OSI model) (Layer 1-4). Ethernet TCP / IP and Ethernet UDP / IP comprise layers 1-4 of the OSI model. (see Fig. 2 and Fig. 3) -SPE Ethernet for non-Ex (Ethernet SPE) over coax and / or twisted pair cables and / or other two-wire cables and / or multi-wire cables and / or fiber optic cables. - The sensor consists of a modular system comprising a sensor element and / or sensor housing and / or sensor connector and / or sensor coupling (see Fig.4) The sensor element can also be separate from the sensor housing and connected to it via an interface (see Fig. 4) The sensor element and / or sensor housing and / or sensor connector can also be combined in a compact, non-separable housing (compact sensor). The sensor connector is the counterpart integrated into the sensor housing and / or sensor element to the connector coupling with cable (copper) and / or fiber optic cable and / or wireless connection option (WLAN / WiFi) to the PLC and / or I / O and / or field switch and / or field link and / or control system and / or Ethernet / Internet-enabled PC. In the case of WLAN / WiFi, a power supply is provided as a battery in the sensor housing and / or sensor coupling (see Fig. 5) - The electronics of the sensor element consist according to Fig.6. This includes analog pre-amplification, A / D conversion, processor system MCU 1 (signal pre-processing) and / or processor system MCU 2 (main signal processing in the sensor housing) and / or combined as a single processor system MCU communication hardware for Ethernet APL (APL PHY) and Ethernet SPE (SPE PHY) with corresponding hardware and / or software main signal processing. This includes, among other things, algorithms for measured value processing and / or measured value calculation and / or the communication stacks for Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP and the compensation algorithms for temperature and / or pressure and / or flow and / or similar parameters and / or the calibration algorithms and / or the algorithms for cleaning and / or maintenance and / or diagnostics (predictive maintenance).This also includes protocol processing and / or protocol generation (APL Ethernet, Ethernet SPE, Ethernet TCP / IP, Ethernet UDP / IP, or other fieldbuses, see above). Hardware and software communication, power supply. Processor system 1 (MCU 1) and processor system 2 (MCU 2) can, for example, also be combined into a single-processor solution (MCU), which is the standard case.

[0024] The sensor housing can also include a second MCU2, which can be combined with MCU1 as a single MCU. Galvanic isolation can be achieved between the A / D converter and processor system 1, and / or between processor system 1 and processor system 2 (or combined as an MCU), and / or between processor system 2 (or combined as an MCU) and communication hardware (power unit decoupling). Galvanic isolation can also be implemented directly through inductive, optical, and / or capacitive measures between the sensor element and the sensor housing, and / or the sensor housing, and / or the connector, and / or the sensor coupling. - The signal processing and communication (Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or MCU (MCU1 and MCU2)) can be modularly divided between the sensor element and / or the sensor housing and / or the sensor coupling and / or the sensor connector, or compactly integrated in modular form, each discrete and / or as an FPGA and / or as an ASIC and / or as a hybrid (e.g. analog and digital circuitry in one component) and / or as a combination of different hardware technologies integrated in the sensor element and / or in the sensor housing and / or in the sensor coupling and / or in the sensor connector. - Direct connectivity or interfacing capability of the sensors via Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or Ethernet-based WLAN / WIFI ( Fig.7. Sensor element and sensor housing separated by a mechanical interface such as a jack plug or similar) to Ethernet-enabled PCs and / or standardized components, e.g., programmable logic controllers (PLCs) and / or remote I / Os (input / output) and / or links and / or field switches and / or Ethernet-enabled PCs (e.g., the manufacturer of these circuitry products such as Siemens, ABB, Yokogawa, Emerson, E+H, Schneider Elektrik, Turck, PhoenixContact, B&R, Pepperl&Fuchs or similar). - Sensors, both EX and non-EX, communicate optionally via Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP - Ethernet / IP or Ethernet TCP / IP. - Sensors, EX and / or non-EX, communicate directly with common PLCs and / or I / Os and / or Ethernet-enabled PCs via cable or fiber optic cable or with Ethernet-based WLAN / WIFI. Fig. 8 - Sensor housing with the usual process connections 3 / 4", 1", PG 13.5 (e.g. pH / redox electrodes) etc., installation with or without snap ring in flow fittings. The sensors have a diameter <= 4 cm.

[0025] Fig. 8. Other process connections are G ¼ E, G ¼ B, G ½ B, ¼ NPT. - The Ethernet protocol Ethernet APL and the other Ethernet protocols can be implemented as a 2-wire (Ethernet SPE for non-Ex areas), 4-wire, 6-wire, or 8-wire solution (Ethernet APL for Ex areas and non-Ex areas). - The Ethernet communication - Ethernet APL (layer 1 and layer 2) - or Ethernet SPE (layer 1 and layer 2) - or Ethernet TCP / IP (layers 1-4 according to the OSI layer model) the power supply, the µ-controller MCU and / or DSP unit and the analog amplification, A / D conversion are integrated centrally and / or decentrally in the sensor. - The data rate for the Ethernet sensor (in Zone 1, Zone 2) to the field switch is <=10 Mbit / sec for the hazardous area (Zone 1). The transmission length from the sensor to the field switch is <=1500m for Zone 0 and <=400m for Zone 0. - The data rate from the switch to the Ethernet link (field link) for the EX area (Zone 1, Zone 2) is <= 4 Mbit / sec, the transmission length is <= 1500 m. For EX reasons, the power transmission is <= 500 mW, the voltage is <= 20 V and the current is <= 450 mA. - For non-hazardous areas, transmission lengths and data rates (typically 10 Mbps, 100 Mbps, or 1000 Mbps for Ethernet) increase accordingly due to greater available power (Ethernet compliant). Higher voltage, current, and power values ​​are common for non-hazardous applications. The electronics are implemented in the sensor using a single-board or multi-board solution. Each sensor module (sensor element and / or sensor housing and / or sensor coupling and / or sensor connector) can utilize a single-board or multi-board solution (PCB: Printed Circuit Board). Piggyback boards and / or flexible printed circuit boards and / or rigid boards are possible. - The sensor can communicate autonomously wirelessly with higher-level systems using standardized protocols (WLAN / WiFi) Fig. Figure 9 clarifies the situation. In this case, the power supply must be ensured by means of a battery integrated into the sensor or by a local external power source (e.g. solar cells, etc.), since there is no power supply from the PLC via cable. - The WLAN / WIFI (wireless module) ( Fig.9) can also be used only for communication and operation of the sensor on site, whereby the power supply and / or signal data transmission (measured value and / or temperature value and / or pressure value and / or flow rate and / or level and / or status) to the PLC and / or to the field link and / or field switch and / or I / O (remote or non-remote) and / or control system can still be carried out via cable and / or fiber optic cable. - As special operating software, operation via apps (iPhone or similar) is also an option. - The connection from the sensor (sensor element and / or sensor housing and / or sensor coupling and / or sensor plug) can be directly a two- or multi-core copper cable and / or an optical fiber and / or multiple optical fibers and / or a WLAN / WIFI connection. - In the case of direct wireless communication without fiber optic and / or cable connection to the PLC or similar, a battery can be arranged as a power source in the sensor element and / or sensor housing and / or connector coupling and / or sensor coupling. - Mesh networks are also an option for wireless communication. The sensors can be connected directly to PCs for both hazardous and non-hazardous areas via Ethernet connectors, and / or via Ethernet and / or USB interfaces and / or modems. These interfaces and / or modems are dimensioned or designed for explosion-proof (hazardous area) and / or non-hazardous environments. In these applications, the sensors are powered via the PC's Ethernet interface. User interfaces on the PC can be common operating systems (e.g., Apple, Windows, etc.) and / or in combination with PACTware (FDT / DTM). The sensor connector can also be a USB or mini-USB connector. - The sensors and systems can be implemented according to the fieldbuses available, based on APL / SPE Ethernet technology, as so-called trunk and spur technology for the Ex area or as a star topology for Ex and non-Ex areas. - Direct connection of the sensors to the PC via WLAN / WIFI and / or USB and / or interface and / or modem (the PC has a USB interface, the sensor has an Ethernet or fieldbus interface) enables offline calibration and laboratory measurements. The sensors are powered via the PC's USB interface. The modem handles power, voltage, current, and protocol conversions. The mechanical interface between the sensor and the cable or fiber optic cable leading to the PLC or I / O can be an APL connector, an SPE connector, or generally an Ethernet connector of the CxPy type, e.g., an 8P8C connector (RJ-45), or an M12, S8, VP, Metrohm, or coaxial connector system. Appropriate adapters and / or optocoupler systems must be used for fiber optic transmission. - All sensors can also operate according to the IEEE 802.3af (IEEE 802.3 Clause 33) standard, Power over Ethernet, if operationally feasible and / or required. In this case, the Ethernet-enabled devices are powered via the twisted pair cable (see also Glossary). - All communications can be implemented in simplex, full duplex or half duplex mode, according to the specific communication connection options and standards.

[0026] The following describes embodiments and implementation variants of the invention, all of which are variations of the general new sensor and system concept characterized by the totality of the aforementioned features. 1. Implementation variant (compact sensor)

[0027] To explain this implementation variant, particular reference is made to the schematic representations of the Fig. 2 and Fig.3 of the drawing refers to the fact that, on the one hand, the Ethernet interface is implemented in the sensor and its power supply is provided via the Ethernet APL cable, or Ethernet SPE cable, and on the other hand, Ethernet (Ethernet TCP / IP or Ethernet UDP / / IP) is converted into the USB signal via an interface modem and the power supply of the modem and sensor is provided via USB / PC.

[0028] This implementation variant has the following special features in particular: The sensor, consisting of the sensor housing, sensor element, and sensor connector, forms a single unit. In addition to the parameter of interest, the sensor element or the sensor housing may also contain a temperature and / or pressure sensor. The sensor coupling with cable contains no electronics. In the case of fiber optic transmission, the optoelectronic conversion can take place within the coupling. In the case of WLAN / WiFi, power is supplied by a battery located in the sensor housing or sensor coupling. - The pre-amplification, the A / D conversion, the µ-controller system and / or the DSP system or a mix of both (MCU), the power supply, the galvanic isolation(s) and the communication (Ethernet APL and Ethernet SPE or other Ethernet-based fieldbuses such as PROFINET or EtherCAT) are directly integrated into the sensor. Power is supplied from the PLC's I / O (e.g., 24V or similar) via an Ethernet cable. This applies to both Ethernet APL and Ethernet SPE. - The communication - optionally Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or an Ethernet-based protocol in application layer 7 of the OSI model, e.g. PROFINET or EtherCAT or Modbus TCP or similar, is integrated directly into the sensor (sensor element plus sensor housing plus sensor connector). The Ethernet protocols can be implemented as 2-, 4-, or 6-wire solutions, or as 8-wire solutions, each with or without shielding. Depending on the application, the various sensors can be designed for hazardous areas (Ethernet APL) or non-hazardous areas (Ethernet SPE). - The MCU processor system can be a single and / or a multiple processor, consisting of only µ-controllers or only DSP or a mix of both processors. - The electronics can be discrete and / or as ASIC and / or as FPGA and / or hybrid and combinations thereof and a single and / or multi-board system, or an M12 or S8 or VP or Metrohm or coaxial connector system or an Ethernet connector or a USB connector or the like. - The WLAN / WIFI wireless module can also be used specifically for communication and operation only, while the power supply and / or the measurement signals (e.g. sensor readings and / or temperature values, etc.) are still transmitted via cable or fiber optic cable. Fig. 3) or a battery is integrated into the sensor housing and / or sensor coupling. - When using fiber optic cable, the conversion of optical and electrical signals takes place in the sensor housing, the sensor connector, or the sensor coupling. The sensor connector is then a standard connector system for fiber optic transmission. If the conversion of optical signals to electrical signals occurs in the connector coupling, the sensor connector itself can still be a VP, Metrohm, coaxial, S7, S8, or similar connector. - As special operating software, operation via apps (using iPhone or Samsung or similar devices) is also an option. Fig. 2; Use Case A and Fig. 3) - The interface to the PLC and / or I / O can be a battery-powered wireless module integrated into the sensor (WLAN / WIFI). Fig. 2 Use Case B) The sensor is directly connected to the PC via the Ethernet interface and is powered via the PC / e.g., USB interface. The sensor connector must be designed for an Ethernet interface and / or USB connection and can also be a USB connector. - If the sensor has an integrated USB interface, it can be connected directly to the USB interface of the PC via the sensor plug / coupling system or connected to the Ethernet-enabled PC via Ethernet cable. If the sensor has an integrated, standard Ethernet-compatible fieldbus, it can be connected to the PC's USB interface via a modem. This modem converts the sensor's Ethernet APL, Ethernet SPE, PROFINET, EtherCAT, or similar signal into a USB-compatible signal (power and / or USB protocol) and vice versa. The sensor and / or modem are then powered via the PC / USB interface.

[0029] (Note: The characteristics of the preceding and preceding bullet points also apply to all further implementation variants explained below) 2. Implementation variant (2-part sensor without intelligence in the sensor head)

[0030] To explain this implementation variant, particular reference is made to the schematic representation of the Fig. 4 and Fig. Reference is made to section 5 of the drawing. This implementation variant has the following special features: The sensor, consisting of a sensor housing and a sensor element, is divided into two parts. In addition to the analytical parameter of interest, the sensor element or the sensor housing can also contain a temperature sensor and / or a pressure sensor. - There is a mechanical connector between the sensor element and the sensor housing; the sensor element contains no electronics. The mechanical connection is a jack plug, a 'Metrohm plug', or a similar connector. A connector is mechanically integrated between the sensor housing and the connector coupling, which is connected to the PLC (I / O) via a sensor coupling cable or Ethernet cable. The sensor can also be connected to an Ethernet-enabled and WLAN / WiFi-enabled PC via WLAN / WiFi. - The mechanical interface between the sensor housing and the sensor coupling with cable leading to the PLC or I / O can be an M12 or S8 or VP or Metrohm or coaxial connector system or Ethernet connector 8P8C (in variants) or a USB connector. - When using fiber optic cable, the conversion of optical signals into electrical signals takes place in the sensor housing, the sensor connector, or the sensor coupling. If the optoelectronics are integrated into the sensor housing, the sensor connector must be a standard connector system for fiber optic transmission. - Communication is optionally Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or PROFINET in the application layer of the OSI model and is directly integrated into the sensor housing. The Ethernet protocol – Ethernet APL, Ethernet SPE, Ethernet TCP / IP, Ethernet UDP / IP, PROFINET, or other Ethernet-based protocols – can be implemented as a 2-, 4-, 6-, or 8-wire solution, with or without shielding. Depending on the application, the various sensors can be designed for hazardous or non-hazardous areas. - The MCU processor system can be a single and / or multiple processor, consisting of only microcontrollers, or only DSPs, or FPGAs, or ASICs, or a mix of all electronic components. - The electronics can be discrete and / or as ASIC and / or as FPGA and / or hybrid and combinations thereof and a single and / or multiple board system. - The wireless module WLAN / WIFI can be used for communication and operation, while the power supply and / or the transmission of measured values ​​(sensor and / or temperature and / or pressure) can still be done via cable or fiber optic cable, or a battery can be located in the sensor housing or in the sensor coupling. - Special operating software options also include operation via apps (iPhone, Samsung or similar) and / or PC operating systems, e.g., Windows, in combination with, e.g., PACTware or similar. - The interface to the PLC and / or I / O can be a wireless module (WLAN / WIFI) integrated into the sensor with battery power supply ( Fig. 5) or an external, locally available energy source (e.g., solar cells) that powers the sensor on site. 3. Implementation variant (Two-part sensor with intelligence in the sensor element (partial electronics) with plug connection)

[0031] To explain this implementation variant, particular reference is made to the schematic representation of the Fig. Reference is made to sections 5 to 7 of the drawing. This implementation variant has the following special features: The sensor, consisting of a sensor housing, sensor element, and sensor connector, is divided into two parts. In addition to the parameter of interest, the sensor element or the sensor housing may also contain a temperature sensor and / or a pressure sensor. - A sensor connector is mechanically integrated between the sensor housing and the connector coupling, which is connected to the PLC and / or I / O via sensor coupling cable or sensor coupling fiber optic cable. - A mechanical plug connection (jack plug or 'Metrohm plug' or similar plug) is located between the sensor element and the sensor housing. - The connection between the sensor element and the sensor housing can be a mechanical-electrical connector (optical, inductive, capacitive, or mechanical). Energy and / or signal transmission takes place via the appropriate interfaces. - The Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP can be connected via the connector interfaces between the sensor element and the sensor housing. - A partial electronics component for signal preprocessing and / or communication processing in Ethernet format is integrated into the sensor element. - A sensor connector is mechanically integrated into the sensor housing, which is connected to the PLC and / or I / O and / or to an Ethernet-enabled PC via a sensor coupling and cable or fiber optic cable (coupling). - The mechanical interface between the sensor housing and the sensor coupling with cable leading to the PLC and / or I / O can be an Ethernet APL or Ethernet SPE or Ethernet connector 8P8C (in variants), an M12 or S8 or VP or Metrohm or coaxial connector system, or a USB connector. -When using fiber optic cable, the conversion of optical signals into electrical signals takes place in the sensor housing, the sensor connector, or preferably in the connector coupling. The sensor connector is then a standard connector system for fiber optic transmission. - The signal preprocessing in the sensor element can consist of analog pre-amplification and optionally A / D conversion and optionally galvanic isolation and optionally signal preprocessing using a µ-controller and optionally of power supply (mains adapter) or battery or combinations thereof. - The processing in the sensor element can optionally include the overall signal processing and the Ethernet communication stack and can be converted to Ethernet APL or Ethernet SPE using a suitable interface. - The signal processing in the sensor element can optionally include temperature processing and / or pressure processing, and additionally, optionally temperature compensation and / or pressure compensation (calculation with the measured signal). Alternatively, this processing can be performed in the sensor housing. Communication and overall signal processing – if not already performed in the sensor element – ​​takes place in the electronics of the sensor housing and / or in the sensor connector, which is connected to the sensor housing via a suitable coupling (see above). This includes, for example, temperature and / or pressure compensation, measured value calculation, sensor diagnostics (advanced diagnostics), sensor calibration, etc. The sensor housing also generates the Ethernet APL, Ethernet, Ethernet TCP / IP, Ethernet UDP / IP, or another common protocol based on Ethernet technology. - The communication electronics (HW- / SW) can optionally be implemented as Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP and as Ethernet-based PROFINET or EtherCAT or similar. The Ethernet protocol and other protocols can be implemented as 2-wire (Ethernet SPE, non-ex) or 4-, 6-, or 8-wire solutions (Ethernet APL Ex, Ethernet TCP / IP, Ethernet UDP / IP), each with or without shielding. Depending on the application, the various sensors can be designed for either EX or non-EX environments, as mentioned. - The processor system and / or electronics system can be a single and / or a multi-processor system and consist of only µ-controllers or only DSP or a mix of both processors as well as FPGAs and ASICs. - The electronics can be discrete and / or as ASIC and / or as FPGA and / or hybrid and combinations thereof and a single and / or multiple board system. - Printed circuit boards can be rigid and / or flexible - The wireless module WLAN / WIFI can only be used for local communication and operation, while the power supply and / or transmission of measured values ​​(sensor and / or temperature) can still be done via cable and / or fiber optic cable. - Optionally, operation via apps (iPhone, Android, etc.) is also possible. The interface to the PLC and / or I / O can be a wireless module (WLAN / WIFI) integrated into the sensor with battery power supply ( Fig. 7) 4. Implementation variant (two-part sensor with decentralized intelligence in the sensor element and / or sensor housing and / or sensor connector (partial electronics) and / or in connector coupling).

[0032] To explain this implementation variant, particular reference is made to the schematic representation of the Fig. 8 and Fig. Reference is made to drawing 9. This implementation variant has the following special features: The sensor, consisting of the sensor housing, sensor connector, and sensor element, is a single unit. In addition to the parameter of interest for analysis, the sensor may also include a temperature sensor and / or a pressure sensor. A mechanical connection exists between the sensor element / sensor housing / sensor connector and the sensor coupling with cable or fiber optic cable. Depending on the cable, this connection may be an Ethernet connector of the form CxPy, e.g., C8P8, an Ethernet APL connector, an Ethernet SPE connector, or similar; an M12, S8, Vario Pol (VP), Metrohm, or coaxial connector system; a jack plug; a Metrohm connector; a USB connector; or a similar connector system. The sensor coupling cable leads to the PLC or the I / O. When using fiber optic cable, the conversion of the optical signals to electrical signals takes place in the sensor housing, the sensor connector, or preferably in the connector coupling. The sensor connector is then a standard connector system for fiber optic transmission (see, e.g., Ethernet standards). The connection between the sensor element and the sensor housing can be a mechanical-electrical connector (optical, inductive, capacitive, or mechanical). Energy and / or signal transmission occurs via the respective optical, inductive, capacitive, or mechanical interface. -Ethernet APL or Ethernet SPE can be transmitted via the optional pluggable interface between the sensor element and the sensor housing. - It integrates partial electronics for signal preprocessing and / or main signal processing and / or the protocol stacks for Ethernet APL or Ethernet SPE into the sensor element / sensor housing. - The signal preprocessing in the sensor element / sensor housing / sensor connector can consist of analog preamplification and optionally A / D conversion and optionally galvanic isolation and optionally signal preprocessing using a µ-controller MCU and / or µ-controller MCU2 and / or the entire MCU (MCU1+MCU2 or similar) and optionally a power supply or combinations thereof. The processing within the sensor element / sensor housing / sensor connector can optionally include signal preprocessing and / or complete signal processing and / or communication stacks for Ethernet APL or Ethernet SPE. The results or partial results are transmitted via a suitable interface. Preferably, the complete signal processing takes place in the sensor coupling – unless already performed in the sensor element / sensor housing / sensor connector – and the data and results are converted to Ethernet APL, Ethernet SPE, or Ethernet TCP / IP (OSI model layers 1-4), or to an alternative Ethernet protocol (if not already performed in the sensor housing / sensor connector), and transmitted to the PLC via cable, fiber optic cable, or WLAN / Wi-Fi. In the case of WLAN / Wi-Fi, for example, a battery is located in the sensor housing or sensor coupling to provide power. - The signal processing in the sensor element / sensor housing can optionally also include temperature processing and / or pressure processing, and additionally optionally temperature compensation and / or pressure compensation (calculation with the measured value signal). All signal processing and communication processing, in the form of Ethernet APL and Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP, takes place in the electronics of the sensor coupling (with cable or fiber optic cable), unless already performed in the sensor element / sensor housing / sensor connector. Signal processing and protocol stacks are handled on a single processor or are distributed between the sensor housing (signal processing) and the sensor coupling (communication). This means that signal processing, temperature compensation, measurement calculation, sensor diagnostics, sensor calibration, etc., are performed in the sensor housing. The Ethernet protocol (Ethernet APL, Ethernet SPE, Ethernet TCP / IP, or Ethernet UDP / IP) and Ethernet-based fieldbuses such as PROFINET or EtherCAT) are generated in the sensor coupling, or alternatively, another fieldbus protocol / signal is generated. Additionally, optoelectronic conversion is performed if fiber optic cable is used. - The Ethernet interface can optionally be implemented as Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or PROFINET or EtherCAT and is located directly in the sensor coupling and transmits the data via Ethernet cable or fiber optic connection or WLAN / WIFI to the PLC and / or I / O and / or Ethernet-enabled PC. - The Ethernet protocol and other protocols can be implemented as a 2-wire (Ethernet SPE, non-ex) or 4-wire, 6-wire or 8-wire (full-duplex) solution (Ethernet APL Ex, Ethernet TCP / IP, Ethernet UDP / IP; Ethernet APL is for hazardous areas) - The processor system and / or electronics system can be a single and / or a multi-processor system and can consist of only µ-controllers or only DSP or a mix of both processors. - The electronic system can be discrete and / or as an ASIC and / or as an FPGA and / or hybrid and combinations thereof and a single and / or multiple board system. - The electronic system can be built from a single and / or multiple circuit board system. - The circuit boards can be rigid or flexible - A wireless module WLAN / WIFI can optionally be integrated into the connector (with cable or fiber optic cable) and used for Ethernet communication and local operation, whereby the power supply and / or the transmission of measured values ​​(parameter-specific measured values ​​and / or temperature and / or pressure and / or status value) can be an integrated battery in the sensor housing or the sensor connector, or the power supply can still be provided via Ethernet cable or fiber optic cable. - As a special operating software option, operation via apps (iPhone, Android, etc.) is also possible. - The interface to the PLC and I / O can be a wireless WLAN / WIFI module integrated into the connector without cables and powered by a battery-( Fig.9) Alternatively, the sensor can also be powered by an on-site energy supply (e.g., solar cells).

[0033] The Fig. 10 and Fig. Figure 11 of the drawing illustrates how the new sensor concept for automatic cleaning can be applied with standard components (PLC, I / O) of automation technology.

[0034] With Fig. Figure 10 shows a chlorine system with automatic sensor cleaning as well as temperature and pH compensation without conventional transmitter technology.

[0035] The sensors no longer require a transmitter; they communicate directly with the PLC modules using standardized Ethernet protocols (Ethernet APL, Ethernet SPE, Ethernet TCP / IP, or Ethernet UDP / IP). Both the hardware and software are standardized and readily available to the customer. All components that communicate using Ethernet protocols are internet-enabled.

[0036] With Fig.Section 11 describes an automatic cleaning system for pH sensors that does not use conventional transmitter technology. All components communicate via Ethernet and are internet-enabled. The automatic pH cleaning system is combined with an automatic changeover valve. The sensor is moved from the process into the valve's rinsing chamber, cleaned with liquid, and then returned to the process.

[0037] A disadvantage of the current state of the art is that proprietary transmitters are used instead of PLCs and I / Os; that is, all sensors require company-specific (proprietary hardware and software) transmitters for signal evaluation before the evaluated signals can be converted into a standardized communication protocol and passed on to the corresponding I / Os.

[0038] The new Ethernet-based sensor concept offers customers space savings, drastic cost reductions, simplified installation and handling, reduced maintenance, and standardized communication using the Ethernet protocols Ethernet APL (Ex), Ethernet SPE (Non-Ex), Ethernet TCP / IP, or Ethernet UDP / IP. Further advantages include: • Ethernet and Internet-enabled communication through the use of sensors and (or components that have integrated Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP or other common Ethernet protocols) • WLAN / WIFI-enabled communication via Ethernet-based WLAN / WIFI • APL network topologies for star connections for hazardous and non-hazardous areas, as well as trunk and trace connections for hazardous areas, are feasible. • Longer sensor lifespan • More precise measurement • Short and easy maintenance • Simple calibration through calibration in the laboratory (and not in process) under defined conditions • No process interruption • Halving of investment and maintenance costs • Space saving

[0039] The state of the art in analytical measurement technology can be summarized as follows: - Today, sensors are typically connected to transmitters (installed base) via proprietary, company-specific interfaces to transmit voltage and current values. - Almost all sensors today require company-specific transmitters (proprietary hardware and software) for signal evaluation before the evaluated signals can be converted into a standardized communication protocol of automation technology and passed on to the corresponding I / Os and / or the PLC. - Sensors for chlorine and disinfection parameters do not communicate with standardized automation components. Direct connections to PLCs via fieldbus or Ethernet are not possible. To communicate with a PLC using sensors, an additional external proprietary transmitter is always required. Disinfection sensors typically require a transmitter for signal processing. The conversion of the results into a standardized communication protocol and their transmission to a higher-level control system takes place exclusively within the transmitter. - Such standardized interfaces originating from the transmitter include 4..20 mA, 4..20mA / HART, Modbus RTU, Profibus DP, Profibus PA, Fieldbus Foundation (FF) etc. - The most widespread standardized interface from transmitter to PLC is still the 4...20mA signal, followed by 4...20mA / HART 7. Cleaning and calibration systems cannot currently be directly connected to programmable logic controllers (PLCs) and their input / output units. All systems require an additional, proprietary transmitter and a separate control unit. This typically makes the systems very expensive and unattractive for the customer. Furthermore, these systems are very maintenance-intensive, as the sensor must be regularly refilled with electrolyte for calibration.

[0040] In contrast, the new Ethernet-based sensor concept offers the following significant improvements and unique selling points: - The sensors of the new sensor generation are based on a modular sensor platform and a modular electronics platform and are internet / Ethernet-enabled. They are suitable for both normal applications (e.g., water, wastewater, swimming pools, etc.) in non-hazardous environments and for hazardous environments (chemical, petrochemical, mining, pharmaceutical, etc.). - The sensor and system platform (cleaning and calibration) enables direct connection to the standardized programmable logic controllers and / or IOs (input and output units) of renowned control system manufacturers, such as Siemens, ABB, Yokogawa, Emerson, E+H, Schneider Electric, via Ethernet connection - Ethernet APL or Ethernet SPE or Ethernet TCP / IP or other Ethernet protocols. - The sensors can also communicate via WLAN / WIFI with all Ethernet-enabled PCs running Apple and Windows operating systems. - Sensors equipped with Ethernet / WLAN / WIFI and Ethernet-based fieldbuses of application layer 7 of the OSI model, such as PROFINET and EtherCAT or Modbus TSP, can be directly connected to the Internet. - The sensors have the external transmitter, as mentioned in the original state of the art, integrated as compact electronics in the sensor element and / or in the sensor housing and / or decentrally divided into sensor element and sensor housing and / or in the sensor connector and / or sensor coupling. -The sensors communicate via Ethernet APL or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP - The sensors and systems are also operated using standardized HMI (Human Machine Interface) user interfaces, e.g., Windows, Apple, Visual Basic or PACTware, FDT / DTM or similar.

Claims

[1] Modular sensor and system platform for measurements, cleaning and calibration in analytical, gas temperature, pressure measurement, flow measurement and level measurement. - with integrated Ethernet technology Advanced Physical Layer (APL) and Single Pair Ethernet (SPE) as well as a modular electronics hardware and electronics software platform for measurement parameters, cleaning / calibration systems and service systems in liquid and / or gas analysis and / or temperature and / or pressure measurement technology and / or flow measurement technology and / or level measurement technology. - with integrated fieldbus Ethernet technology APL and / or SPE, PROFINET etherCAT, Ethernet TCP / IP, Ethernet UDP / IP and other similar and / or adapted fieldbus protocols, e.g. I / O-Link, USB, for potentially explosive (IECEX, ATEX, FM) and / or non-hazardous (non-EX) environments, - with direct connection option to programmable logic controllers (PLCs) and / or input / output units (I / Os or remote I / Os) of established system manufacturers, via fixed cable connection, implemented as a 2-wire and / or multi-wire connection, copper and / or fiber optic connection, and / or wireless connection, WLAN and / or Bluetooth as well as WirelessHART. - with direct connection option to PCs for explosion-hazardous and non-explosion-hazardous environments via USB and / or via interface or , USB modem for sensor-side Ethernet APL and / or SPE and / or PROFINET and other sensor-side fieldbuses, e.g. I / O-Link, PROFIBUS DP / PA or or FF, or HART-IP, or HART 4mA and specially adapted fieldbuses (where the modem can be used for explosion-hazardous and / or non-explosion-hazardous environments). - operable with standardized user interfaces, such as PACTware-FDT / DTM, and / or common field communicators, e.g. Emerson 475 Field Communicator for FF and HART or other systems from established manufacturers, or apps or application software for mobile operating systems, such as iPhone and / or PC, laptop with different operating systems (e.g. Apple, Windows and the like) and / or Visual Basic with Visual Basic XML Generator (which generates Simple Visual Basic Code to Read & Write XML Data and uses libraries for C++, Oracle Java, VB .Net, Silverlight, VB6). [2] Modular platform according to claim 1, comprising at least one sensor with integrated Ethernet technology APL and / or SPE as well as PROFINET in the physical transmission and data link layer (Layer 1 and Layer 2 of the OSI model) application layer of the OSI model (Layer 7) or similar fieldbus technology for non-Ex and / or EX areas in the application layer of the OSI model (Open System Interconnection model). [3] Modular platform according to claim 1 or 2, comprising at least one sensor with integrated Ethernet technology and fieldbus technology according to IEEE 802.2, 802.3u for non-Ex and / or EX areas. [4] Modular platform according to one or more of the preceding claims, characterized by Sensors with integrated APL Ethernet technology and SPE Ethernet technology and fieldbus technology and / or WLAN according to IEEE 802.3u and / or IEEE 802.11 according to IEEE 802.2, 802.3u for non-Ex and EX areas and / or 2-wire SPE Ethernet technology. [5] Modular platform according to one or more of the preceding claims, characterized by Ethernet APL and / or Ethernet SPE optionally implemented in layers 1-2 of the OSI model (Layer 1-2) as well as PROFINET in layer 7 of the OSI model . [6] Modular platform according to one or more of the preceding claims, characterized by Ethernet TCP / IP and Ethernet UDP / IP (real-time Ethernet). [7] Modular platform according to one or more of the preceding claims, characterized by Ethernet TCP / IP or Ethernet UDP / IP encompasses layers 1-4 of the OSI model. [8] Modular platform according to one or more of the preceding claims, characterized by 2-wire Ethernet for non-EX and / or EX areas. [9] Modular platform according to one or more of the preceding claims, with sensor, modularly comprising a sensor element, sensor housing, sensor connector and sensor coupling, wherein the sensor element and sensor housing and sensor connector are combined in particular in a compact, non-separable housing or separable housing (sensor element and sensor housing / sensor connector); the sensor coupling is the connecting element to the sensor connector, which is integrated in the sensor housing and / or in the sensor element; the sensor coupling to the PLC or PC can be implemented with cable (copper) and / or fiber optic cable and / or WLAN connection option to the PLC and / or PC with PLC and / or PC-compatible I / Os and / or remote I / O and / or field link and / or control / asset management system. [10] Modular platform according to one or more of the preceding claims, comprising: the electronics consist of a sensor interface comprising analog pre-amplification, A / D conversion, signal pre-processing and / or processor system MCU and / or APL PHY (communication hardware) and / or (SPE communication hardware) with corresponding hardware and / or software signal pre-processing and / or signal processing and / or measurement calibration; with in particular algorithms for measurement processing and / or measurement calculation and / or compensation algorithms for temperature and / or pressure and / or flow and / or similar parameters and / or calibration algorithms and / or algorithms for cleaning and / or maintenance and / or diagnostics (predictive maintenance); furthermore with protocol processing and / or protocol generation and / or power supply and / or communication (HW and SW) and / or processor system MCU. [11] Modular platform according to one or more of the preceding claims, with galvanic isolation, in particular between A / D conversion and / or processor system MCU and / or between processor system MCU and / or communication hardware (e.g., Ethernet APL and / or Ethernet SPE). Communication hardware can, for example, be FSK modems from HART, SIM and SP4 ASICs in Profibus PA, etc., in addition to Ethernet APL and Ethernet SPE, and / or be located between the power supply and the MCU, wherein galvanic isolation is implemented directly, in particular by inductive, optical, and capacitive measures, between the sensor element and / or sensor housing and / or sensor connector and / or sensor coupling. [12] Modular platform according to one or more of the preceding claims, comprising the features: the signal processing is modularly divided between the sensor element and / or the sensor housing and / or the sensor connector and / or the sensor coupling or compactly integrated in modular form, each analog and / or discrete and / or as an FPGA and / or as an ASIC and / or as a hybrid and / or as a combination of different hardware technologies only in the sensor element or only in the sensor housing or only in the sensor coupling or only in the sensor connector or from combinations thereof. [13] Modular platform according to one or more of the preceding claims, comprising the features: direct connectivity or interfacing capability of the sensors via Ethernet APL (ATEX, IECEx) and / or SPE (Non-Ex) to standardized components, e.g., programmable logic controllers (PLCs) and / or I / Os and / or remote I / Os and / or field links and / or field switches (input / output), such as those from manufacturers Siemens, ABB, Yokogawa, Emerson, E+H, Schneider Electric, Turck, Phoenix Contact, B&R, Pepperl & Fuchs or the like. [14] Modular platform according to one or more of the preceding claims, wherein sensors for the EX area (APL) and / or the non-EX area (SPE) are optionally connected via the Ethernet protocol (Ethernet II Frame) or Ethernet TCP / IP or Ethernet UDP / IP, each with PROFINET or EtherCAT. [15] Modular platform according to one or more of the preceding claims, comprising the features: Sensors, for EX and / or non-EX, communicate directly with the common PLCs and I / Os, alternatively to Ethernet (EtherNET / IP or Ethernet TCP / IP or the like) optionally via the communication protocols that are implemented in the sensor as an alternative to Ethernet of layer 1 and layer 2 - e.g. Ethernet APÜL and Ethernet SPE. [16] Modular platform according to one or more of the preceding claims, with sensor housings having the usual process connections 3 / 4", 1", PG 13.5 or the like, for installation with or without a snap ring in flow fittings, wherein the sensors have a diameter <= 6 cm. [17] Modular platform according to claim 16, with further process connections G ¼ E, G ¼ B, G ½ B, ¼ NPT or the like. [18] Modular platform according to one or more of the preceding claims, comprising the features: the Ethernet protocol and / or the other communication protocols are implemented in particular as a 2- or 4- or 6- or 8-wire solution for the EX and / or non-Ex area, each with or without shielding. [19] Modular platform according to one or more of the preceding claims, comprising the features: the Ethernet communication APL and / or Ethernet communication SPE and / or Ethernet TCP / IP (Layer 1-4 according to the OSI layer model) and / or the power supply and / or the µ-controller and / or DSP unit MCU and / or the analog amplification and / or the A / D conversion are integrated centrally and / or decentrally in the sensor. [20] Modular platform according to one or more of the preceding claims, comprising the features: the communication Ethernet APL and power-data decoupling hardware and PROFINET and / or the communication SPE and / or the power-data decoupling hardware and PROFINET and / or the power supply and / or the µ-controller MCU and / or DSP unit MCU and / or the analog amplification and / or A / D conversion are integrated centrally and / or decentrally in the sensor. [21] Modular platform according to one or more of the preceding claims, comprising the features: the data rate for the Ethernet sensor (Zone 0, Zone 1, Zone 2) to the field switch is <=10 MBit for the Ex area (Zone 1); the transmission length from the sensor to the field switch is <=400 m. [22] Modular platform according to one or more of the preceding claims, comprising the features: the data rate from the field switch to the Ethernet link is <= 10 Mbit / sec for the EX area (Zone 1, Zone 2) with a transmission length of up to a maximum of <= 1000 m and for the Ex area (Zone 0) the transmission length is <= 200 m with a data rate <= 10 Mbit / sec [23] Modular platform according to one or more of the preceding claims, comprising the following features: for non-hazardous areas, the transmission lengths and data rates (typical for Ethernet are 10 Mbit / sec or 100 Mbit / sec or 1000 Mbit / sec; see IEEE standard) are increased accordingly due to greater available power (Ethernet-compliant); for non-hazardous applications, higher voltage, current, and power values ​​are possible; data transmission is carried out, inter alia, via twisted-pair or fiber optic cables or other typical Ethernet cables according to the IEEE standard or the like. [24] Modular platform according to one or more of the preceding claims, comprising: the electronics, consisting of sensor preprocessing, sensor interface, MCU, APL PHY, power supply, APL decoupling / input, are implemented in a single-board or multi-board solution in the sensor; in particular, single-board or multi-board solutions are implemented in each sensor module (sensor element and / or sensor housing and / or sensor connector and / or sensor coupling); piggyback boards and / or flexible and / or rigid printed circuit boards are possible. [25] Modular platform according to one or more of the preceding claims, comprising the following features: the sensor communicates autonomously and wirelessly with standardized WLANs, implemented in Ethernet Frame II and / or other Ethernet protocols, to higher-level systems, wherein the power supply is ensured by means of a power supply integrated in the sensor (battery or external power supply, e.g. SPE). [26] Modular platform according to one or more of the preceding claims, wherein the WLAN wireless module can also be used only for local communication and operation, and the power supply and / or measurement data are still provided via cables and / or fiber optics. [27] Modular platform according to one or more of the preceding claims, wherein the special operating software allows operation via apps (iPhone or the like). [28] Modular platform according to one or more of the preceding claims, comprising the features: the connection from the sensor (sensor element and / or sensor housing and / or sensor connector and / or sensor coupling is directly a two- or multi-core copper cable and / or a single optical fiber and / or multiple optical fiber and / or a wireless connection. [29] Modular platform according to one or more of the preceding claims, comprising the features: in the case of direct wireless communication without fiber optic and / or cable connection to the PLC or similar, a battery is arranged as an energy source in the sensor element and / or sensor housing and / or sensor connector and / or sensor coupling, or the sensor can be supplied by an external energy source on site (solar cells or the like). [30] Modular platform according to one or more of the preceding claims, wherein mesh networks can be implemented in wireless communication. [31] Modular platform according to one or more of the preceding claims, comprising the following features: the sensors are connected directly via USB to PCs for EX and / or non-EX areas and / or indirectly via interfaces and / or modems that convert the PC-side USB signal (power and protocol) into sensor-specific communication protocols and / or power supply; such modems are for Ethernet APL or SPE Ethernet or Ethernet-USB; the interfaces and modems are dimensioned or designed for explosion-proof (EX area) and / or non-explosion-proof (non-EX) environments; in these applications, the sensors are powered directly via the PC's USB interface or via the aforementioned modems of the PC; user interfaces on the PC are the common operating systems (e.g., Apple or Windows or the like) and / or in combination with PACTtware (FDT / DTM). [32] Modular platform according to one or more of the preceding claims, comprising the features: the sensors and systems operate according to the fieldbuses suitable for this purpose (Ethernet APL and / or Ethernet SPE and PROFINET). [33] Modular platform according to one or more of the preceding claims, wherein the direct connectivity to the PC via USB and / or Ethernet and / or interface and / or modem enables offline calibration and laboratory measurements. [34] Modular platform according to one or more of the preceding claims, comprising: the mechanical interface between the sensor and the cable leading to the PLC or I / O is an M12, S8, VP, Metrohm, or coaxial connector system, or an Ethernet connector, e.g., APL, SPE, or 8P8C (RJ-45), or another Ethernet connector variant belonging to this family, or a USB connector; the transmission can be carried out via copper cables and / or fiber optic cables with appropriate optocouplers (adapters); the optocouplers can, in turn, be integrated in the connector socket or sensor head, or in the sensor housing, or in the sensor element. The sensor can also be a fixed-cable sensor and thus not have a connector sensor in the conventional sense. Furthermore, Ethernet communication can be implemented using WLAN, since WLAN is implemented in the Ethernet protocol or Ethernet II Frame. [35] Modular platform according to one or more of the preceding claims, wherein all sensors, if operationally possible and / or required, can operate according to the IEEE 802.3af (IEEE 802.3 Clause 33) standard, Power over Ethernet, wherein the Ethernet-enabled devices are supplied with power via the twisted pair cable. [36] Modular platform according to one or more of the preceding claims, wherein all communications are realized in simplex or full duplex or half duplex according to the specific communication connection options. [37] Modular platform according to one or more of claims 1 to 36, comprising: the sensor, consisting of a sensor housing, sensor element, and sensor connector, forms a single unit; the sensor element may, in addition to the analytical parameter of interest, also include a temperature sensor and / or pressure sensor and / or flow sensor and / or level sensor. The sensor coupling with cable may be equipped with or without electronics. In the case of an optical fiber, the optoelectronic conversion is preferably integrated in the connector coupling. [38] Modular platform according to one or more of claims 1 to 37, comprising the features: the A / D conversion, the µ-controller system and / or the DSP system or a mix of both, the power supply, the galvanic isolation(s) and the communication, in particular Ethernet APL and / or Ethernet SPE (and other fieldbuses) are directly integrated into the sensor. [39] Modular platform according to one or more of claims 1 to 38, comprising the features: the power supply is provided by the I / O of the PLC (e.g. <=24V or similar). [40] Modular platform according to one or more of claims 1 to 39, comprising the features: the communication - optionally Ethernet APL and / or Ethernet SPE and / or Ethernet TCP / IP and( / or PROFINET which is an Ethernet protocol implemented in 2-wire is directly integrated in the sensor (sensor element + sensor housing + sensor connector). [41] Modular platform according to one or more of claims 1 to 40, comprising: the Ethernet protocol as well as Ethernet APL and / or Ethernet SPE and the other protocols are implemented as a 2- or 4- or 6- or 8-wire solution, wherein corresponding variants with or without shielding can be implemented; the variants can be designed for the EX (APL) or non-EX (SPE) area. [42] Modular platform according to one or more of claims 1 to 41, comprising: the processor system is a single and / or a multiple processor, consisting of only µ-controllers and / or only DSP or a mix of both processors. [43] Modular platform according to one or more of claims 1 to 42, comprising the features: the electronics are discrete (with discrete components) and / or as ASIC and / or as FPGA and / or hybrid and combinations thereof and a single and / or multiple board system. [44] Modular platform according to one or more of claims 1 to 43, comprising: the mechanical interface between the sensor and the cable leading to the PLC or I / O or PC is an M12 or S8 or Varipol (2-pin or 4-pin or 6-pin or 8-pin) or Metrohm or coaxial connector system or an APL Ethernet connector or an SPE connector, e.g., an 8P8C connector or a USB connector or a WLAN antenna or Bluetooth antenna; in the case of the use of fiber optic cable and / or WLAN, the optoelectronic conversion or radio antenna is implemented in the sensor housing or in the sensor connector or preferably in the connector coupling; in the case of fiber optic transmission, the connector system must be a connector system commonly used for fiber optic cables for processing in the sensor housing or in the sensor connector. [45] Modular platform according to one or more of claims 1 to 44, comprising the features: the wireless module (WLAN) is used for communication and operation, wherein the power supply and / or the transmission of measured values ​​(parameters and / or temperature and / or pressure and / or the like) is also carried out via cables and / or fiber optics. [46] Modular platform according to one or more of claims 1 to 45, featuring: operation is carried out via apps (using iPhone or the like) as special operating software. Fig. 2; Use Case A and Fig. 3)) [47] Modular platform according to one or more of claims 1 to 46, comprising the feature that the interface to the PLC and to the I / O is a battery-powered wireless module (Bluetooth or WLAN or WirelessHART or ZigBee) integrated into the sensor. Fig. 2; Use case B) [48] ​​Modular platform according to one or more of claims 1 to 47, comprising the features: the sensor is directly connected via the USB interface of the Ethernet-enabled PC and is supplied with power via the PC / USB interface ( Fig. 3). [49] Modular platform according to one or more of claims 1 to 48, comprising the following features: the sensor, in the case that it has an integrated APL and / or SPE and / or PROFINET common fieldbus, is connected to the USB interface of the PC via a modem, which converts the sensor-side APL Ethernet protocol and / or SPE Ethernet protocol into a USB compliant signal (power and / or USB protocol) and vice versa; the sensor and / or the modem are supplied with power via the PC / USB interface. [50] Modular platform according to one or more of claims 1 to 36, comprising: the sensor, consisting of sensor housing and sensor element and sensor connector, is divided into three parts or two parts; the sensor element or the sensor housing may additionally include a temperature sensor and / or pressure sensor. [51] Modular platform according to one or more of claims 1 to 36, or 50, comprising the following features: a mechanical plug connection is provided between the sensor element and the sensor housing, and no electronics are integrated into the sensor element; the mechanical connection is a jack plug or Metrohm plug or similar plug; a plug is mechanically integrated into the sensor housing, which can be connected to the PLC (I / O) by means of a sensor coupling cable or fiber optic cable; when using a fiber optic cable, the conversion of the optical signals into the electrical signals takes place in the sensor housing or in the sensor plug or preferably in the connector coupling; in the case of fiber optic transmission and conversion of the optoelectronic signal in the sensor housing or in the sensor plug, the plug system is a connection system commonly used for fiber optic cables. [52] Modular platform according to one or more of claims 1 to 36, or 50 or 51, comprising: the mechanical interface (sensor connector) between sensor housing and sensor coupling with cable or fiber optic cable leading to the PLC or I / O is an M12 or S8 or VP or Metrohm or coaxial connector system or an APL Ethernet connector or an SPE Ethernet connector or an Ethernet connector 8P8C, 6P6C etc. in variants according to Ethernet standard) or USB connector; corresponding variants can be implemented with or without shielding; all variants can be designed for EX or non-EX areas. [53] Modular platform according to one or more of claims 1 to 36, or 50 to 52, comprising the features: the communication is optionally APL Ethernet or SPE Ethernet or Ethernet TCP / IP or a 2-wire implemented SPE Ethernet protocol or PROFINET is directly integrated in the sensor housing or sensor connector system which is integrated in the sensor housing. [54] Modular platform according to one or more of claims 1 to 36, or 50 to 53, comprising the features: the APL Ethernet and / or SPE Ethernet and the other protocols such as PROFINET (based on Ethernet) are implemented as a 2-, 4-, 6- or 8-wire solution; all variants can be implemented with or without shielding of the cable; all variants for APL Ethernet can be implemented for EX areas or for SPE Ethernet non-Ex areas. [55] Modular platform according to one or more of claims 1 to 36, or 50 to 54, comprising: the processor system is a single and / or a multiple processor consisting of only µ-controllers or only DSP or a mix of both processors and / or FPGA and / or ASICs. [56] Modular platform according to one or more of claims 1 to 36, or 50 to 55, comprising: the electronics are discrete and / or as ASIC and / or as FPGA and / or hybrid and combinations thereof and a single and / or multiple board system. [57] Modular platform according to one or more of claims 1 to 36, or 50 to 56, comprising the following features: the WLAN (wireless) module is used for communication and operation, wherein the power supply and / or the transmission of measured values ​​(parameters and / or temperature and / or pressure and / or the like) is still carried out via cable or fiber optic cable. Alternatively, a battery in the sensor housing and / or the sensor coupling can serve as the power supply, which is particularly necessary for WLAN transmission. [58] Modular platform according to one or more of claims 1 to 36, or 50 to 57, comprising the features: as special operating software, operation via apps (iPhone or the like) and / or PC operating systems such as Apple or Android, each in combination with e.g. PACTware or FDT / DTM or the like. [59] Modular platform according to one or more of claims 1 to 36, or 50 to 58, comprising the features: the interface to the PLC and / or I / O and / or PC is a wireless module integrated into the sensor with battery power supply (WLAN or possibly Bluetooth). Alternatively, the sensor can also be supplied locally with a power source (e.g. solar cells). [60] Modular platform according to one or more of claims 1 to 36, comprising: the sensor, consisting of sensor housing and sensor connector and sensor element, is essentially divided into two parts; the sensor element or the sensor housing can also include a temperature sensor and / or pressure sensor and / or flow sensor and / or level sensor in addition to the analytical parameter of interest. [61] Modular platform according to one or more of claims 1 to 36, or 60, with the feature: a mechanical plug connection (APL Ethernet, SPE plug, Variopol plug, jack plug or Metrohm plug or similar plug system) is provided between sensor element and sensor housing. [62] Modular platform according to one or more of claims 1 to 36, or 60 or 61, comprising the features: the connection between sensor element and sensor housing can be a mechanical-electrical connector connection (optical or inductive or capacitive or mechanical), wherein the energy transmission and / or signal transmission takes place via the respective optical or inductive or capacitive or mechanical interfaces. [63] Modular platform according to one or more of claims 1 to 36, or 60 to 62, comprising the features: APL Ethernet and / or SPE Ethernet and / or Ethernet TCP / IP (Layer 1- Layer 4 according to the OSI model) are transmitted via the connection between the sensor element and the sensor housing (plug interfaces). [64] Modular platform according to one or more of claims 1 to 36, or 60 to 63, comprising: at least one partial electronics for signal preprocessing is integrated in the sensor element. [65] Modular platform according to one or more of claims 1 to 36, or 60 to 64, comprising the following features: a sensor connector is mechanically integrated in the sensor housing, which is connected to the PLC (I / O) or the Ethernet-enabled PC via the connector coupling with cable or fiber optic cable; in the case of the use of fiber optic cable, the optoelectronic conversion is implemented in the sensor housing or in the sensor connector or preferably in the connector coupling; in the case of fiber optic transmission, the sensor connector system is a standard connector system for fiber optic cables if the optoelectronics are integrated in the sensor housing or in the connector housing. For WLAN, corresponding electronics are integrated in the connector housing or in the connector coupling. [66] Modular platform according to one or more of claims 1 to 36, or 60 to 65, comprising: the mechanical interface between the sensor housing and the cable leading to the PLC or I / O or PC is an APL Ethernet connector or SPE Ethernet connector or M12 or S8 or Variopol or Metrohm or coaxial connector system or USB connector; in the case of the use of an optical fiber, the optoelectronic conversion is implemented in the sensor housing or in the sensor connector and the connector system must be designed for optical fiber. [67] Modular platform according to one or more of claims 1 to 36, or 60 to 66, comprising the features: the signal preprocessing in the sensor element can consist of analog preamplification and additionally optionally A / D conversion and additionally optionally galvanic isolation and additionally optionally signal preprocessing by means of an MCU (µ-controller etc.) and optionally of power supply or combinations thereof. [68] Modular platform according to one or more of claims 1 to 36, or 60 to 67, comprising the features: the processing in the sensor element can optionally include the overall signal processing software and be transmitted via a suitable interface such as APL Ethernet or Ethernet SPE or Ethernet TCP / IP or Ethernet UDP / IP and / or PROFINET or the like. [69] Modular platform according to one or more of claims 1 to 36, or 60 to 68, comprising the features: the signal processing in the sensor element can optionally also include temperature processing and / or pressure processing and / or level processing and / or flow processing and additionally optionally temperature compensation and / or pressure compensation (compensation with the measured value signal) or flow compensation or level compensation; alternatively, these processing operations can also be carried out in the sensor housing and / or the connector coupling. [70] Modular platform according to one or more of claims 1 to 36, or 60 to 69, comprising the following features: the communication and overall signal processing takes place - if not already carried out in the sensor element - in the electronics of the sensor housing and / or in the sensor connector; these include, for example, temperature compensation and / or pressure compensation and / or level calculation, and / or flow calculation, measured value calculation, sensor diagnostics (advanced diagnostics), sensor calibration or the like; likewise, the APL Ethernet and / or the SPE Ethernet and / or PROFINET or another fieldbus protocol / signal is generated in the sensor housing. [71] Modular platform according to one or more of claims 1 to 36, or 60 to 70, comprising the features: the Ethernet interface can be optionally configured as APL Ethernet and / or SPE Ethernet and as PROFINET as an Ethernet-based protocol in the application layer or USB. [72] Modular platform according to one or more of claims 1 to 36, or 60 to 71, comprising the following features: APL Ethernet and SPE Ethernet and the other application layer 7 protocols of the OSI model can be implemented as 2-, 4-, 6-, or 8-wire solutions, each with or without shielding. APL Ethernet and its variants are designed for hazardous or non-hazardous areas. SPE Ethernet is for non-hazardous areas. When using fiber optic cable, the conversion of the optical signals into electrical signals takes place in the sensor housing or in the sensor connector, or preferably in the sensor coupling. In the case of fiber optic transmission, the connector system is a standard connector system for fiber optic cables, particularly when the optoelectronics are integrated in the sensor housing or sensor connector. [73] Modular platform according to one or more of claims 1 to 36, or 60 to 72, comprising the features: the processor system and / or electronic system can be a single and / or a multi-processor system and consist of only µ-controllers or only DSP or only FPGAs or only ASICs or a mix of all electronic components. [74] Modular platform according to one or more of claims 1 to 36, or 60 to 73, comprising: the electronics can be discrete and / or as an ASIC and / or as an FPGA and / or hybrid and combinations thereof and a single and / or multi-board system. Microcontrollers and / or DSPs can be integrated in the FPGAs and / or ASICs or a mix of both. [75] Modular platform according to one or more of claims 1 to 36, or 60 to 74, comprising the features: the printed circuit boards can be rigid or flexible. [76] Modular platform according to one or more of claims 1 to 36, or 60 to 75, comprising: a wireless module WLAN (integrated in the Ethernet protocol) can optionally be integrated and used for communication, operation and data processing, wherein the power supply and / or the transmission of measured values ​​(sensor readings and / or temperature readings and / or pressure readings and / or level readings and / or flow readings or the like) can still be carried out via cable or fiber optic cable via APL Ethernet and / or SPE Ethernet. [77] Modular platform according to one or more of claims 1 to 36, or 60 to 76, comprising the features: as special operating software, operation via apps (iPhone or Android or the like) is optionally provided. [78] Modular platform according to one or more of claims 1 to 36, or 60 to 77, comprising the following features: The interface to the PLC and I / O is a wireless module integrated into the sensor with battery power supply (Bluetooth or WLAN or WirelessHART or ZigBee). The WLAN protocol is implemented in the Ethernet II frame or another Ethernet frame. Optionally, the sensor can also be powered locally via an external power source (e.g., solar cells). [79] Modular platform according to one or more of claims 1 to 36, comprising: the sensor, consisting of sensor element and sensor housing and sensor connector, is a unit; the sensor may also include a temperature sensor and / or pressure sensor and / or flow sensor and / or level sensor in addition to the analytical parameter of interest. [80] Modular platform according to one or more of claims 1 to 36, or 79, comprising the following features: a mechanical plug connection is provided between the sensor element / sensor housing / sensor connector and the sensor coupling with cable or fiber optic cable and can be an APL Ethernet connector and / or an SPE Ethernet connector or an M12 or S8 or Variopo or Metrohm or coaxial connector system or jack connector or Metrohm connector or USB connector; the cable or fiber optic cable of the sensor coupling leads to the PLC or to the I / O or to the PC via Ethernet cable or WLAN; in the case of the use of a fiber optic cable, the optoelectronic conversion is implemented in the sensor coupling; the connector system on the PLC side is, in the case of fiber optic transmission, a connection system commonly used for fiber optic cables. [81] Modular platform according to one or more of claims 1 to 36, or 79 or 80, comprising the features: the connection between sensor element / sensor housing and connector coupling with cable is a mechanical-electrical connector connection (only mechanical or optical or inductive or capacitive or combinations thereof); the energy transmission and / or signal transmission takes place via the respective suitable interfaces. [82] Modular platform according to one or more of claims 1 to 36, or 79 to 81, comprising the features: the APL Ethernet and the SPE Ethernet or USB can be specifically transmitted via the plug interface between sensor housing / sensor plug and sensor coupling. [83] Modular platform according to one or more of claims 1 to 36, or 79 to 82, comprising: a partial electronics for signal preprocessing or total signal processing is integrated in the sensor element / sensor housing / sensor connector. [84] Modular platform according to one or more of claims 1 to 36, or 79 to 83, comprising the features: the signal preprocessing in the sensor element / sensor housing / sensor connector can consist of analog preamplification and additionally optionally A / D conversion and additionally optionally galvanic isolation and additionally optionally signal preprocessing by means of a µ-controller and / or DSP system and / or FPGA and / or ASIC and optionally of a power supply or combinations thereof. [85] Modular platform according to one or more of claims 1 to 36, or 79 to 84, comprising the features: the processing in the sensor element / sensor housing / sensor connector can optionally include the overall signal processing and the data and signals are transmitted to the sensor coupling via a suitable interface, e.g., APL Ethernet and / or PROFINET or SPE Ethernet and / or PROFINET USB, or as a voltage signal, and converted to Ethernet TCP / IP (OSI model Layer 1-4) or the like. [86] Modular platform according to one or more of claims 1 to 36, or 79 to 85, comprising the features: the sensor element / sensor housing / sensor connector / sensor coupling can optionally also include temperature processing and / or pressure processing and / or flow processing and / or level processing and additionally optionally temperature compensation and / or pressure compensation (compensation with the measured value signal) and / or compensation of the level measurement signal and / or the flow measurement signal. [87] Modular platform according to one or more of claims 1 to 36, or 79 to 86, comprising the following features: the Ethernet APL communication and / or Ethernet SPE communication as well as the overall signal processing takes place - if not already carried out in the sensor element / sensor housing / sensor connector - in the electronics of the sensor coupling with cable or fiber optic cable; these include, for example, temperature compensation, measurement calculation, sensor diagnostics (Advanced Diagnostic), sensor calibration or the like; likewise, the APL Ethernet protocol and / or SPE Ethernet protocol is generated, processed and transmitted there. [88] Modular platform according to one or more of claims 1 to 36, or 79 to 87, comprising: the APL Ethernet interface and / or SPE Ethernet interface as 2-wire, 4-wire, 6-wire or 8-wire, optionally implemented as Ethernet TCP / IP or a 2-wire SPE Ethernet, and is located directly in the sensor coupling with cable or fiber optic cable; in the case of the use of fiber optic cable, the conversion of the optical signals into electrical signals and vice versa is also integrated in the sensor coupling: the mechanical interface between the sensor coupling and the sensor connector can be an Ethernet APL and / or Ethernet SPE or an M12 or S7 or S8 or VP or Metrohm or coaxial connector system or a USB connector or the like. [89] Modular platform according to one or more of claims 1 to 36, or 79 to 88, comprising the following features: the Ethernet protocol and the other protocols can be implemented as a 2-, 4-, 6-, 8-wire or 10-wire solution; all variants can be implemented application-specifically with or without shielding, each for EX (APL Ethernet) or non-Ex areas (SPE Ethernet); in the case of the use of an optical fiber, the optoelectronic conversion is implemented in the sensor coupling; the optical fiber system, in the case of optical fiber transmission, may be a connection system commonly used for optical fibers. [90] Modular platform according to one or more of claims 1 to 36, or 79 to 89, comprising the features: the processor system and / or electronic system can be a single and / or a multi-processor system and / or FPGA and / or ASIC and can consist of only µ-controllers or only DSP or only FPGAs or only ASICs or a mix of all electronic components. [91] Modular platform according to one or more of claims 1 to 36, or 79 to 90, comprising the features: the electronic system can be discrete and / or as an ASIC and / or as an FPGA and / or hybrid and combinations thereof. [92] Modular platform according to one or more of claims 1 to 36, or 79 to 91, comprising the features: the electronic system can be composed of a single and / or multiple circuit board system. [93] Modular platform according to one or more of claims 1 to 36, or 79 to 92, comprising the features: The printed circuit boards can be rigid or flexible. [94] Modular platform according to one or more of claims 1 to 36, or 79 to 93, comprising: a wireless WLAN module can optionally be integrated into the connector coupling with cable and used for local communication and operation, wherein the power supply and / or the transmission of measured values ​​(sensor parameter specific and / or temperature and / or pressure and / or level and / or flow and / or the like) can still be carried out via cable and / or fiber optic cable. [95] Modular platform according to one or more of claims 1 to 36, or 79 to 94, comprising the features: as special operating software, operation via apps (iPhone or Android etc.) is implemented. [96] Modular platform according to one or more of claims 1 to 36, or 79 to 95, comprising the following features: the interface to the PLC and / or I / O and / or PC is a wireless module with battery power (WLAN or Bluetooth or the like) integrated into the connector or sensor plug without a cable. Optionally, the sensor can also be powered locally via an external power supply (e.g., solar cells).

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