CERAMIC MULTI-LAYER COMPONENT AND METHOD FOR ITS PRODUCTION

Description

[0001] The present invention relates to a ceramic multilayer component. The invention further relates to a method for producing a ceramic multilayer component. For the integration of functionalities into multilayer components, for example, the integration of a completely enclosed electrical ceramic or functional ceramic into an inert organic material is known. The construction of a carrier from a functional ceramic itself, such as a varistor ceramic, is also known. However, additional surface layers, for example made of glass or polymer, are required to protect the functional ceramic from external influences.

[0002] A sensor element for high-temperature measurement comprising an NTC functional ceramic is known from patent EP 2362938 B1. Multilayer components that are sintered together with an integrated functional ceramic are disclosed, for example, in US Pat. No. 5,661,882 A and DE 10 2012 110849 A1.

[0003] Further examples of multilayer components according to the prior art are provided by the documents EP 1369402 A1, DE 10 2005 037 456 A1, DE 10 2010 001 791 A1 and US 2005 / 109453 A1.

[0004] The document WO 2007 / 058438 A1 shows the arrangement of an LED and a functional ceramic on a carrier substrate.

[0005] One problem to be solved is to provide an improved multilayer component and a method for producing an improved multilayer component.

[0006] This object is achieved by the subject matter and the method according to independent claims 1 and 16.

[0007] According to one aspect, a multilayer component according to claims 1 to 15 is specified. The multilayer component has an inert ceramic substrate. "Inert" in this context means that a surface of the ceramic substrate has a high insulation resistance. The high insulation resistance protects the surface of the substrate against external influences. The high insulation resistance makes the surface insensitive, for example, to electrochemical processes, such as the deposition of metallic layers on the surface. The high insulation resistance also makes the surface of the substrate insensitive to aggressive media, e.g., aggressive fluxes used, for example, in soldering processes.

[0008] The multilayer component comprises at least one functional ceramic. The multilayer component can also comprise more than one functional ceramic. For example, the multilayer component comprises two, three, five, ten, or more functional ceramics. The functional ceramic serves to provide specific functionalities of the multilayer component. The functional ceramic serves to integrate the specific functions into the substrate. Different functional ceramics can provide different or identical functionalities.

[0009] The ceramic substrate serves as a carrier for the functional ceramic. The functional ceramic is completely enclosed by the ceramic substrate. In other words, the functional ceramic is surrounded on all sides by the inert, dielectric ceramic material of the substrate. The functional ceramic has specific properties, such as a defined shape and size, to integrate the functional ceramic into the ceramic substrate. For example, the functional ceramic is grain-shaped, spherical, disc-shaped, elliptical, or cubic. For example, the functional ceramic has a diameter of less than or equal to 100 µm, for example 50 µm.

[0010] The ceramic substrate has specific properties for integrating the functional ceramic into the substrate. For example, a recess is provided in an inner region of the substrate into which the functional ceramic is inserted during the production of the multilayer component. The functional ceramic is arranged entirely within the interior of the substrate.

[0011] The inert, dielectric ceramic substrate protects the functional ceramic from harmful external influences. This allows for a compact, stable, durable, and adaptive multilayer component.

[0012] According to one embodiment, the ceramic substrate comprises LTCC (low temperature cofired ceramics). LTCC technology allows the realization of ceramic multilayer components with multiple metallization levels, into which a variety of passive components such as conductor tracks, resistors, capacitors, and inductors can be integrated. The LTCC ceramic preferably has a low dielectric constant. This allows undesirable parasitic electrical effects, such as parasitic capacitances of the substrate, to be suppressed.

[0013] According to one embodiment, the multilayer component comprises a plurality of functional ceramics. The functional ceramics have different properties. For example, the functional ceramics have different expansion coefficients and / or different sintering temperatures. By completely embedding the functional ceramics in the inert dielectric ceramic material of the substrate, the different properties of the functional ceramics can be compensated. A wide variety of functionalities can thus be integrated. This allows for the realization of extremely adaptive and flexibly deployable multilayer components.

[0014] According to one embodiment, the at least one functional ceramic comprises an HTCC ceramic. Sintering temperatures for HTCC ceramics are significantly above 1000°C, for example, 1500°C. The grain structure of the HTCC ceramic is not affected by the processing (firing) of the LTCC ceramic of the substrate at temperatures significantly below 1000°C. The functionality of the functional ceramic in the substrate is thus retained even after the LTCC ceramic is fired.

[0015] According to one embodiment, the functional ceramic comprises a varistor, an NTC (negative temperature coefficient) ceramic, a PTC (positive temperature coefficient) ceramic, or a ferrite. For example, the functional ceramic is designed as an ESD protection element. The functional ceramic can thus provide various functionalities of the multilayer component.

[0016] According to a further aspect, a method for producing a multilayer component is described. The method preferably produces the multilayer component described above. All features described in connection with the multilayer component also apply to the method, and vice versa.

[0017] In a first step, at least one functional ceramic, preferably several functional ceramics, are produced. Functional ceramics with different functionalities can be produced. The respective functional ceramic is based on ceramic spray granules, a ceramic powder and / or ceramic green layers. The spray granules, the ceramic powder and / or the green layers are sieved, pressed and sintered. During this manufacturing process, the functional ceramic is sintered at temperatures greater than or equal to 1000°C, for example 1300°C or 1500°C. During production, the functional ceramic can be given a wide variety of geometric shapes. For example, the functional ceramic can have a sintered grain, a sintered sphere, a sintered chip or a sintered cube.

[0018] In a further step, LTCC green sheets are prepared, each having at least one recess. The green sheets are stacked on top of each other. The recess is created by punching or lasering the green sheets and completely penetrates the provided green sheets.

[0019] In a further step, electrode structures are provided, for example, printed, on at least a portion of the green sheets. The electrode structures comprise, for example, silver and / or palladium. The electrode structures are preferably applied before the provided green sheets are stacked.

[0020] In a further step, the functional ceramic is inserted into the recess. Specifically, the recess is filled with the functional ceramic and the functional ceramic is vibrated into the recess to ensure a precise fit.

[0021] In a further step, ceramic cover sheets are prepared in the green state. These are arranged on the top and bottom of the stack of green sheets. The cover sheets are free of the recess, so that the functional ceramic is surrounded by ceramic material on all sides.

[0022] In a further step, the green films and the cover films are laminated and pressed into a green stack.

[0023] In a further step, additional recesses can optionally be introduced into the green stack using punching or laser processes to create through-holes. These recesses completely penetrate the green stack. The recesses are arranged in an area of the green stack that is spatially separated from the area in which the functional ceramic is located.

[0024] In a further step, the green stack is sintered. The green stack is sintered at a temperature that is, for example, 150 °C below the sintering temperature of the functional ceramic. This ensures that the functionality of the integrated functional ceramic is not affected by the sintering of the green stack. By appropriately selecting the LTCC ceramic with defined sintering shrinkage in the z-direction and low shrinkage in the x- and y-directions, the functional ceramic is enclosed by the ceramic substrate without cracks. The ceramic material of the substrate can fit snugly against the functional ceramic. Alternatively, a gap can remain between the functional ceramic and the material of the ceramic substrate after sintering the green stack.

[0025] In a final step, external contacts are provided on the outer surfaces of the sintered green stack. For example, a silver paste is applied to the front side of the sintered green stack and then fired.

[0026] The resulting multilayer component has at least one functional ceramic fully integrated into the ceramic substrate. By embedding the functional ceramic in the inert, dielectric ceramic material, the multilayer component can be exposed to harsh environmental conditions (high temperatures, aggressive media) without damage to the functional ceramic. Due to the low dielectric constant of the ceramic substrate, the multilayer component can also be used in applications where the reduction of undesirable parasitic electrical effects (e.g., parasitic capacitance) of the substrate plays a role. This provides a long-lasting and adaptive multilayer component.

[0027] The drawings described below are not to be considered to scale. Rather, individual dimensions may be enlarged, reduced, or distorted for clarity.

[0028] Elements that are identical or that perform the same function are designated by the same reference symbols.

[0029] They show: Figure 1 shows a schematic representation of a multilayer component, Figure 2 shows a sectional representation of a multilayer component according to a first embodiment, Figure 3 shows a sectional representation of a multilayer component according to a second embodiment, Figure 4 shows a horizontal sectional view of the multilayer component according to Figure 3 , Figure 5 a horizontal sectional view of the multilayer component according to Figure 3according to a further embodiment, Figure 6 shows a sectional view of a multilayer component according to a third embodiment, Figure 7 shows a sectional view of a multilayer component according to a fourth embodiment, Figure 8a shows a method step in the production of a multilayer component according to the invention, Figure 8b shows a further method step in the production of a multilayer component according to the invention, Figure 8c shows a further method step in the production of a multilayer component according to the invention, Figure 8d shows a further method step in the production of a multilayer component according to the invention.

[0030] The Figure 1shows a schematic representation of a multilayer component 100. The multilayer component 100 has a substrate 1. The substrate 1 preferably has an inert dielectric ceramic carrier. In this context, "inert" means that a surface of the substrate 1 has a high insulation resistance. The high insulation resistance makes the surface of the substrate 1 insensitive to electrochemical processes, such as the deposition of metallic layers, e.g., layers comprising Ni, Z, Ag, or Ad, on the surface of the substrate 1. The high insulation resistance also makes the surface of the substrate 1 insensitive to aggressive media, such as aggressive fluxes used, for example, in soldering processes. These aggressive media can attack the surface and lead to undesirable side effects, such as short circuits and leakage currents.

[0031] The substrate 1 is preferably a multilayer ceramic. The substrate 1 preferably comprises an LTCC ceramic. Particularly preferably, the substrate 1 comprises a glass ceramic.

[0032] The multilayer component 100 further comprises a plurality of functional ceramics 2, for example, two, three, five, or ten functional ceramics 2. The functional ceramics 2 are arranged within the substrate 1. The functional ceramics 2 are completely enclosed by the substrate 1. The functional ceramics 2 are spatially separated from one another and electrically insulated.

[0033] The respective functional ceramic 2 preferably comprises an HTCC ceramic. The respective functional ceramic 2 can comprise ZnO-Pr (varistor), MnNiX (NTC ceramic), BaTiO 3 (PTC ceramic), or a ferrite, depending on the desired function and mode of operation of the respective functional ceramic 2. Several functional ceramics 2 can also have the same composition. Alternatively, each functional ceramic 2 can also be configured differently to realize various desired functions within the substrate 1.

[0034] The inert surface of the substrate 1 protects the functional ceramics 2 from external influences. Additional surface protection layers for the functional ceramics, such as glass or polymer layers, are therefore unnecessary.

[0035] The Figure 2 shows a sectional view of a multilayer component 100 according to a first embodiment. In particular, Figure 2a multilayer component 100 with a ceramic substrate 1 and an integrated disc varistor as functional ceramic 2 is shown. The functional ceramic 2 preferably comprises a plastic molded varistor, such as an SMD CU varistor or a ThermoFuse varistor.

[0036] The functional ceramic 2 is disk-shaped. The functional ceramic 2 preferably comprises a metal disk. The functional ceramic is a disk varistor. For example, the functional ceramic comprises ZnO-Pr.

[0037] The substrate 1 has internal electrodes 4. The internal electrodes 4 are arranged between ceramic layers (not explicitly shown) of the substrate 1. The internal electrodes 4 serve to electrically contact the functional ceramic 2. The functional ceramic 2 is arranged in a recess 6 (not explicitly shown here) in the interior of the substrate 1. The internal electrodes 4 extend to the edge of this recess 6 in order to electrically contact the functional ceramic 2.

[0038] The functional ceramic 2 has external contacts 3. The external contacts 3 are formed on outer surfaces, here the top and bottom, of the functional ceramic 2. For example, the external contacts 3 are metal layers on the top and bottom of the functional ceramic 2. The internal electrodes 4 are electrically connected to the external contacts 3.

[0039] Furthermore, external electrodes 5 are arranged on the opposite side surfaces of the substrate 1 for electrically contacting the multilayer component 100. The external electrodes 5 are electrically connected alternately to internal electrodes 4 of different polarity.

[0040] The Figure 2 The multilayer component 100 shown is designed for high-temperature applications at ≥ 150°C. The substrate 1, which completely surrounds the functional ceramic 2, protects the functional ceramic 2 from the high temperatures that occur. In particular, the inert surface of the substrate 1 serves to protect the integrated disc varistor, which is specified for maximum operating temperatures of up to 85°C, from the high temperatures.

[0041] The Figure 3 shows a sectional view of a multilayer component 100 according to a second embodiment. In particular, Figure 3A multilayer component 100 with an integrated SMD (surface-mounted device) varistor with a low clamping voltage and capacitance is shown as functional ceramic 2. The clamping voltage occurs during an ESD event along with a specific surge current at the component. The higher the clamping voltage occurring at the varistor for the same current, the greater the electrical power and thus ultimately the energy that the varistor must absorb. At lower clamping voltages, a higher current carrying capacity is thus achieved to achieve the same energy absorption.

[0042] The multilayer component 100 has the substrate 1 described above. The functional ceramic 2 is arranged or embedded in a recess 6 within the substrate 1. The recess 6 enables the introduction of the functional ceramic 2 into the substrate 1 during the manufacturing process. For example, the recess 6 has a sintered via or a sintered through-plating of individual layers of the substrate 1. The recess 6 is characterized in particular in that it does not completely penetrate the substrate 1. Thus, the functional ceramic 2 embedded in the recess 6 is surrounded on all sides, i.e. completely, by the material of the substrate 1.

[0043] Depending on the requirements of the multilayer component 100, the recess 6 and / or the functional ceramic 2 can be designed such that the functional ceramic 2 is enclosed by the substrate 1 in such a way that no gap remains between the material of the substrate 1 and the functional ceramic 2 (see Figure 2 ). Alternatively, the recess 6 can also be designed in such a way that a gap remains between the functional ceramic 2 and the material of the substrate 1 (see Figure 3 ), so that the recess 6 is also visible after completion of the multilayer component 100. This may be necessary in particular if the material of the functional ceramic 2 and the substrate 1 has different expansion coefficients in order to avoid cracks or damage to the multilayer component 100 during further processing, for example during soldering.

[0044] In this exemplary embodiment, the functional ceramic 2 is spherical. The functional ceramic 2 preferably comprises a varistor sphere. The functional ceramic 2 comprises, for example, ZnO-PrCo. The functional ceramic 2 is preferably a sintered ZnO-PrCo grain. The functional ceramic 2 has a low capacitance. For example, the capacitance of the functional ceramic is 0.5 pF or less, for example 0.47 pF. The functional ceramic 2 has a diameter of less than 100 µm, preferably less than or equal to 50 µm. The functional ceramic preferably has a specific electric field strength Ev = 500 V / mm. The dielectric constant epsilon of the functional ceramic 2 is high. For example, eps = 400.

[0045] In contrast, substrate 1 has a very low dielectric constant epsilon. For example, the dielectric constant of the substrate is less than 50, preferably less than 10. Preferably, eps = 7 or eps = 7.5. The low dielectric constant of the surrounding substrate 1 serves to suppress the parasitic capacitance of substrate 1. For example, the parasitic capacitance of substrate 1 is 0.47 pF lower than the parasitic capacitance of a standard carrier substrate with eps = 400 according to the prior art.

[0046] The substrate 1 further comprises the properties already described in connection with Figure 2 mentioned internal electrodes 4. Finally, the external electrodes 5 are arranged on the opposite side surfaces of the substrate 1 for electrically contacting the multilayer component 100.

[0047] The internal electrodes 4 serve to electrically contact the functional ceramic 2 and extend to the edge of the recess 6 in order to electrically contact the functional ceramic 2. Depending on the design of the functional ceramic, the respective internal electrode 4 can have different shapes (see the Figures 4 and 5 ). For example, the respective inner electrode 4 can have a constriction 4b in the area of the feed to the functional ceramic ( Figure 5 ). This is particularly advantageous when the functional ceramic 2 is spherical. In particular, the respective inner electrode 4 can be electrically connected to the functional ceramic 2 in a targeted and precise manner by the constriction 4b. Alternatively, the respective inner electrode 4 can have a web 4a or web-shaped connection area for electrically contacting the functional ceramic 2 ( Figure 4This is advantageous, for example, when the functional ceramic 2 has a larger horizontal dimension, for example, an elliptical shape. However, other configurations of the inner electrode 4 for connecting the functional ceramic 2 are also conceivable.

[0048] The Figure 6 shows a sectional view of a multilayer component 100 according to a third embodiment. In particular, Figure 6 a multilayer component 100 in the form of an LED carrier with integrated ESD protection is shown. In the following, only the differences to the ones related to the Figures 2 to 5 described multilayer components 100.

[0049] The multilayer component 100 has a heat source 10, for example, an LED. The heat source 10 is electrically connected to the external contacts 5 of the substrate 1 via contact surfaces 9 on the underside of the heat source 10, for example, an electrically conductive metallic layer. In this exemplary embodiment, the respective external contact 5 is arranged on the top side of the substrate 1 and connected to the respective contact surface 9 via a solder connection 8.

[0050] The substrate 1 has vias or through-contacts 7. Each through-contact 7 completely penetrates the substrate 1 in the vertical direction. On the top side of the substrate 1, each through-contact 7 is electrically connected to an external contact 5. Arranged on the underside of the substrate 1 are further external electrodes 5, which are electrically connected to the respective through-contact 7. In this exemplary embodiment, the internal electrodes 4 do not extend to the side surfaces of the substrate 1, but are electrically connected to the through-contacts 7.

[0051] The substrate 1 may further comprise a thermal contact 11, for example, for a temperature sensor. The thermal contact 11 may, for example, comprise a metal-filled via.

[0052] The functional ceramic 2 is, for example, spherically shaped, sintered, and inserted into the recess 6 within the substrate 1, so that the functional ceramic 2 is completely surrounded on all sides by the material of the substrate 1. In this exemplary embodiment, the functional ceramic 2 serves as an ESD protection structure. The functional ceramic 2 is a varistor chip. The heat source 10, which is very sensitive to overvoltages, such as those triggered by an ESD pulse, is effectively protected against these current or voltage surges with the help of the functional ceramic 2.

[0053] The Figure 7 shows a sectional view of a multilayer component 100 according to a fourth embodiment. In particular, Figure 7 a multilayer component 100 in the form of an LED carrier with integrated ESD protection and temperature sensor is shown.

[0054] In the following, only the differences to the one related to Figure 6 described multilayer component 100. In addition to the multilayer component 100 of Figure 6 A second functional ceramic 2 is embedded in the substrate 1. The two functional ceramics 2 are spatially separated from each other and each completely surrounded by the material of the substrate 1.

[0055] A first functional ceramic 2, which is Figure 7 The first functional ceramic 2, shown in the lower area of the substrate 1, serves as an ESD structure and protects the heat source 10, for example, an LED, from overvoltages. The first functional ceramic 2 is designed as a varistor chip.

[0056] A second functional ceramic 2, which is Figure 7in the upper region of the substrate 1, is designed as a thermistor (NTC thermistor). In particular, the second functional ceramic 2 is an NTC temperature sensor. The substrate 1 has a thermal contact 11. The thermal contact 11 is conductively connected to the second functional ceramic 2. The thermal contact 11 is designed, for example, in the form of a via. The via extends from the top of the substrate 1 to the second functional ceramic 2.

[0057] By completely embedding the functional ceramics 2 in the inert dielectric ceramic carrier (substrate 1), functional ceramics 2 with completely different properties, such as sintering temperature and expansion coefficient, can be integrated together into the substrate 1. This allows extremely adaptive and flexibly usable multilayer components 100 to be realized.

[0058] In the following, in connection with the Figures 8a to 8d a method for producing a multilayer component 100 is described. All features required for the multilayer components 100 in connection with the Figures 1 to 7 explained also apply to the procedure and vice versa.

[0059] In a first step, at least one functional ceramic 2 is produced. Preferably, several different functional ceramics 2 are produced, depending on the specific requirements for the multilayer component 100. Depending on the intended use of the respective functional ceramic 2, its production can vary greatly. All functional ceramics 2 have in common that they are sintered before being introduced into the substrate 1.

[0060] For example, to produce functional ceramic 2, ceramic powder is provided and doped with dopants, such as ZnO. The powder is then sintered. This occurs at temperatures greater than or equal to 1000°C and less than or equal to 1300°C, for example, at 1100°C. This process results in functional ceramic 2 in the form of a sintered grain, which is used, for example, as an SMD varistor.

[0061] If a varistor chip is to be formed as functional ceramic 2, a granulate consisting of sintered grains as described above is prepared, sieved, and pressed. The pressed granulate is then sintered (1000°C ≥ T ≤ 1300°C) and processed into a disc-shaped varistor chip. The varistor chip is then metallized by sputtering or screen printing.

[0062] In a next step, LTCC green sheets are provided to form the substrate 1. The green sheets contain, for example, a ceramic powder, a binder, and a glass component. The green sheets 15 are stacked one above the other to form a stack. At least one recess 6 is introduced into the green layers 15 by laser ablation or punching. The recess serves to introduce the functional ceramic 2 into the green stack 16 in a later process step. The number of recesses 6 introduced into the green layers 15 corresponds to the number of functional ceramics 2 in the finished multilayer component 100.

[0063] In a further step, metal structures for forming the internal electrodes 4 are provided, for example, printed, on at least a portion of the green films 15. The metal structures are preferably applied before the provided green films 15 are stacked together. The metal structures comprise, for example, Ag, Cu, Pd, or a combination thereof. The metal structures can be specifically shaped, in particular, in a connection region for connecting the functional ceramic 2, as described in connection with the Figures 4 and 5 was described.

[0064] Subsequently, at least one functional ceramic 2 is introduced into the recess 6 ( Figure 8a ). The recess 6 is filled with the functional ceramic 2 and this is then vibrated in.

[0065] In a further step, ceramic cover foils 13 are provided in the green state ( Figure 8a). These are arranged on the top and bottom of the stack of green sheets 15. The cover sheets 13 are free of the recess 6, so that the functional ceramic 2 is now surrounded by ceramic material on all sides. The green sheets 13, 15 are then laminated and pressed together to form a green stack 16 (Figure 8b).

[0066] Further recesses are introduced into the green foils 13, 15 by punching or laser processes to create the through-holes 7. These recesses completely penetrate the green stack 16 consisting of the green foils 15 and the cover foils 13. To create the respective through-hole 7, the recess is filled with a connecting material after a sintering step, for example, by depositing a metal from a solution. The recess is preferably completely filled. The metal contains or is, for example, copper, silver, and / or palladium.

[0067] In a further step, the green stack 16 is sintered ( Figure 8c ). The green stack 16 is sintered at a temperature which is below the sintering temperature of the functional ceramic 2. For example, the sintering temperature of the green stack is 150°C below the sintering temperature for the functional ceramic 2. For example, the sintering temperature is between 750°C and 900°C, the limits being inclusive. The green stack 16 is preferably sintered at 800°C or 850°C. By firing the LTCC ceramic at temperatures significantly below 1000°C, the grain structure of the functional ceramic 2 is no longer affected. The functionality of the functional ceramic 2 can thus be largely retained by suitable selection of the LTCC ceramic and the sintering process (atmosphere).

[0068] Sintering results in shrinkage of the green sheets 13, 15. The appropriate selection of the LTCC ceramic with defined shrinkage in the z-direction and low shrinkage in the x- and y-direction enables crack-free enclosing of the functional ceramic 2.

[0069] In a final step, the external contacts 5 are provided on the outer surfaces of the sintered green stack 16. For example, a silver paste 14 is arranged on at least a partial area of the outer surfaces ( Figure 8d ) and then burned in.

[0070] The invention is not limited to the individual embodiments described, but is defined only by the features of independent claims 1 and 15. List of reference symbols

[0071] 1LTTC ceramic / substrate 2Functional ceramic 3External contact 4Internal electrode 4aBridge 4bConstriction 5Outer electrode 6Recess 7Via / through-hole 8Solder connection 9Contact surface 10Heat source 11Thermal contact 13Cover film 14Silver paste 15Green film 16Green stack 100Multilayer component

Claims

1. Multi-layered component (100) comprising an inert ceramic substrate (1), which comprises an LTCC ceramic, at least one functional ceramic (2), which is completely enclosed by the ceramic substrate (1) and comprises an HTCC ceramic, and internal electrodes in the ceramic substrate (1) for electrically contacting the functional ceramic (2).

2. Multi-layered component (100) according to Claim 1, wherein the ceramic substrate (1) has a high insulation resistance, namely a dielectric constant of less than 50.

3. Multi-layered component (100) according to Claim 1 or 2, wherein the multi-layered component (100) comprises a multiplicity of functional ceramics (2).

4. Multi-layered component (100) according to Claim 3, wherein the functional ceramics (2) have different coefficients of expansion and / or different sintering temperatures.

5. Multi-layered component (100) according to any of the preceding claims, wherein the functional ceramic (2) comprises a varistor, an NTC ceramic, a PTC ceramic or a ferrite.

6. Multi-layered component (100) according to any of Claims 1 to 5, - wherein the substrate (1) comprises a cutout (6) with the functional ceramic (2) arranged therein, - wherein the internal electrodes (4) extend as far as an edge of the cutout (6).

7. Multi-layered component (100) according to any of Claims 1 to 6, - wherein the functional ceramic (2) comprises external contacts (3) formed at outer surfaces of the functional ceramic (2), - wherein the internal electrodes (4) are electrically conductively connected to the external contacts (3).

8. Multi-layered component (100) according to any of Claims 1 to 7, - wherein external electrodes (5) for electrically contacting the multi-layered component (100) are arranged at opposite side surfaces of the substrate (1), - wherein the external electrodes (5) are electrically connected alternately to the internal electrodes (4) of a different polarity.

9. Multi-layered component (100) according to any of Claims 1 to 8, wherein the internal electrodes (4) each have a constriction (4b) in the region of a feed to the functional ceramic (2).

10. Multi-layered component (100) according to any of Claims 1 to 9, wherein the internal electrodes (4) each have a web (4a) or a web-shaped connection region for electrically contacting the functional ceramic (2).

11. Multi-layered component (100) according to any of Claims 1 to 10, comprising: - an LED (10), - wherein the substrate (1) comprises external contacts (5) for electrically contacting the multi-layered component (100), - wherein the LED (10) is electrically conductively connected to the external contacts (5) of the substrate (1).

12. Multi-layered component (100) according to Claim 11, - wherein the substrate (1) comprises plated-through holes (7) penetrating through the substrate (1), - wherein the plated-through holes (7) are each electrically conductively connected to one of the external contacts (5), - wherein the internal electrodes (4) are electrically conductively connected to the plated-through holes (7).

13. Multi-layered component (100) according to any of Claims 1 to 10, - wherein a first and a second of the functional ceramics (2) are embedded in the substrate (1) and are spatially separated from one another, - wherein the first functional ceramic is configured as a varistor chip, - wherein the second functional ceramic is configured as an NTC thermistor.

14. Multi-layered component according to Claim 13, - wherein the substrate (1) comprises a thermal contact (11) configured as a plated-through hole, - wherein the plated-through hole extends from a top side of the substrate (1) as far as the second functional ceramic (2).

15. Multi-layered component (100) according to any of Claims 1 to 14, wherein the functional ceramic (2) is configured in granular, spherical, disc-shaped or elliptical fashion.

16. Method for producing a multi-layered component (100), in particular suitable for producing a multi-layered component according to Claims 1 to 15, comprising the following steps: - producing and sintering at least one functional ceramic (2), wherein the functional ceramic (2) is sintered at a temperature of greater than or equal to 1000°C; - providing LTCC green sheets (15) having at least one cutout (6); - providing electrode structures on at least one portion of the green sheets (15); - introducing the at least one sintered functional ceramic (2) into the cutout (6); - providing cover sheets (13) in the green state; - laminating and pressing the green sheets (13, 15) to form a green stack (16); - sintering the green stack (16), wherein the green stack (16) is sintered at a temperature that is below the sintering temperature of the functional ceramic (2); - providing external contacts (5) at outer surfaces of the sintered green stack (16).

17. Method according to Claim 16, wherein the ceramic substrate (1) has a high insulation resistance, namely a dielectric constant of less than 50.

18. Method according to Claim 16 or 17, wherein the at least one cutout (6) is provided by stamping or laser treating the green sheets (15).

19. Method according to any of Claims 16 to 18, wherein spray granules, ceramic powder and / or green layers are provided for producing the functional ceramic (2), and wherein the spray granules, the ceramic powder and / or the green layers are subsequently sintered.

20. Method according to any of Claims 16 to 19, wherein the green stack (16) is sintered at a temperature of less than or equal to 900°C and greater than or equal to 750°C.