Double-sided printed carrier film with multi-stage drilled perforation and its manufacturing process

Description

Subject of the invention

[0001] The present invention relates to a method for producing a through-hole plating in a carrier film printed on both sides and to a carrier film printed on both sides with a through-hole plating. Background of the invention

[0002] Carrier foils printed with conductor tracks are known in the prior art, for example, from WO2014 / 095232. For example, RFID labels ("radio frequency identification" labels or labels for identification using electromagnetic waves) comprise an antenna in the form of a conductor track printed on a foil, which is connected to an RFID chip and serves both as a power supply and for communication with an RFID reader. The conductor track is often spiral-shaped and is connected to corresponding contacts of the RFID chip at two spaced-apart antenna taps.

[0003] With sufficiently large RFID chips, it is possible to connect the two antenna taps directly to the RFID chip by placing the RFID chip directly onto the spiral conductor, thereby connecting two distantly located contacts of the RFID chip to the antenna taps. The RFID chip acts as a bridge between the two antenna taps via the additional antenna windings located between the antenna taps.

[0004] EP 1 545 175 A2 describes a method for providing a through-hole plating in a printed circuit board, wherein intermediate layers of electrically conductive material are embedded to prevent a laser beam from penetrating an undesired distance through the layer composite; in other words, the penetration depth of the laser is controlled via an intermediate layer.

[0005] EP 0 971 570 A1 also describes the production of a printed circuit board in which electrically conductive material is introduced into intermediate layers to control the hole formation during laser ablation.

[0006] US 6,434,819 B1 describes a via in which electrically conductive material is embedded in a layered composite in order to stop laser ablation.

[0007] US 2009 / 0 241 332 A1 describes an electrical circuit board which is provided with a through-hole produced with a CO2 laser.

[0008] US 5,227,013 A describes the possibility of simultaneously inserting a plurality of through holes of the via.

[0009] US 2011 / 048 775 A1 also describes a printed circuit board having a plurality of vias, wherein the vias are constructed from two opposing conical regions.

[0010] EP 1 096 842 A2 describes a method for producing a multilayer printed circuit board, in which a filling step is also carried out by introducing an ink to produce the through-hole.

[0011] US 2011 / 180310 A1 describes a structure for a printed circuit board in which an electrically conductive plate is embedded between two vias. WO 2013 / 139470 A2 describes a substrate for a portable data carrier, in particular a chip card, which has a first antenna part on one side and a second antenna part on the other side, wherein the two antenna parts are electrically connected to each other via the via regions.

[0012] WO 2004 / 038 793 A1 describes an identity card equipped with an RFID module. The electrodes are arranged on the same side of the substrate layer, thus eliminating the need for through-hole plating.

[0013] WO 2014 / 095232 A1 describes a method for producing an inlay with an antenna that contacts a microchip using an adhesive layer. The adhesive layer forms an adhesive meniscus comprising a predetermined shape that can be verified during subsequent testing.

[0014] US 6 407 363 B2 describes a method for producing a multi-stage through-hole using a laser system. Description of the invention

[0015] Against the background described, it is the object of the present invention to provide an improved method for producing a carrier film printed on both sides, wherein in particular the conductivity in the area of ​​the through-hole is further improved.

[0016] This object is achieved by a method for producing a through-hole in a carrier film printed on both sides with conductor tracks according to claim 1, a carrier film according to claim 9, an RFID inlay according to claim 12, and a valuable or security document according to claim 13. The dependent claims contain further advantageous embodiments of the invention.

[0017] The invention is based on and includes the finding that due to the progressive miniaturization of RFID chips, bridging the antenna windings is becoming increasingly difficult, since the distance between the contacts of the RFID chips is often smaller than the minimum distance between the two antenna taps of the conductor track that can be achieved with reasonable effort.

[0018] The method according to the invention for producing a through-hole in a carrier film printed on both sides with conductor tracks and having a first and a second side comprises several steps. The specified order of the individual steps is not mandatory. The first side of the carrier film is printed with electrically conductive material, covering the area of ​​the intended through-hole. Material is removed over a large area from a surface of the second side in the area of ​​the intended through-hole, although in this step the material is not yet drilled through to the first side. Subsequently, at least one through-hole is made in the carrier film in the area of ​​the removed area. Alternatively, the invention can provide for the area removal and the creation of the through-hole to be carried out in a single step.

[0019] Finally, the second side of the carrier film is printed with electrically conductive material, preferably partially printed. The removed area and the through-hole are filled with electrically conductive material, preferably completely covered. Printing on the first side of the carrier film can be performed before or after material removal. It is also conceivable to perform printing on the first side of the carrier film between the surface removal and the creation of the at least one through-hole.

[0020] In the context of the present invention, filling is to be understood as creating a material connection between the electrically conductive material printed on the first side and the second side over the entire area or cross-sectional area of ​​the through-hole. Completely filling the through-hole, or the volume removed in this context, with electrically conductive material up to the surface of the second side is advantageous but not absolutely necessary.

[0021] The two- or multi-stage transition from the surface of the second side through the at least one through-hole to the electrically conductive material applied on the first side improves the printability of the material to be filled. In particular, the tendency to tear off during the printing process is reduced by the less steep edges in the area of ​​the through-hole. Conductivity is improved because the effective diameter of the filled through-holes increases due to the flat material removal, for example, in the form of a pilot hole.

[0022] At the same time, the minimum critical diameter of the membrane is smaller, which is why the electrical resistance also decreases.

[0023] Furthermore, the method according to the invention can achieve higher throughput and shorter processing times with a corresponding number of redundant production steps for material removal and through-hole creation. The hole geometry can be designed in a diverse and flexible manner.

[0024] Preferably, a plurality of through holes are made in the carrier film in the area of ​​the removed surface. The removed surface can be circular, oval, rectangular, or another shape. To prevent tearing of the filler material, a shape without corners, i.e., a circular or oval shape, is preferable.

[0025] In an advantageous variant, material from at least one additional area smaller than the previously removed area is removed. This has the advantage of creating a multi-stage, for example, funnel-shaped transition from the second side of the carrier film to the conductive material applied or yet to be applied to the first side. This further reduces the risk of tearing and improves conductivity.

[0026] The surface removal of material and / or the creation of at least one through-hole is carried out using a laser with an expanded laser beam provided according to the invention. Further embodiments not covered by the subject matter of the protection sought include the removal of material using a fiber laser and / or using a laser beam with an adjusted power level, and / or by evaporation. Fiber lasers are preferred due to their laser stability when the required power level changes. As an embodiment not covered by the subject matter of the protection sought, it is also conceivable to provide a milling step for the surface removal and a mechanical drilling step for creating the at least one through-hole. It is also possible to perform one of the two aforementioned steps mechanically and the other by laser.

[0027] The creation of at least one through-hole can be achieved using a pulsed laser, particularly percussion drilling, or a CO2 laser. Due to the reduced remaining material thickness resulting from the previous surface removal, the through-holes can be produced using fewer shots. This shortens the processing time.

[0028] The first side of the carrier film is preferably partially printed with electrically conductive material, namely in the area of ​​the intended through-hole connection. Preferably, the area of ​​the intended through-hole connection is completely covered with electrically conductive material.

[0029] A through-hole can be created in the carrier film before the first side of the carrier film is printed with electrically conductive material, or the first side of the carrier film can be printed with electrically conductive material before the through-hole is created in the carrier film. In particular, all printing steps can take place directly one after the other. Alternatively, the through-hole can be created after the first side has been printed, whereby the already applied electrically conductive material is retained. The material from the first printing step thus forms an electrically conductive closure of the through-hole, which ensures a good electrical connection with the electrically conductive material introduced into the through-hole in the second printing step. The variants mentioned allow the process to be flexibly integrated into existing processes.

[0030] In an advantageous variant, the second side of the carrier film is printed with electrically conductive material at least once more, filling the removed area, the through-hole, and the electrically conductive material already printed on the second side in the area of ​​the through-hole. This variant has the advantage that an additional printing step creates a filling print, which results in more conductive material being present in the through-hole. At the same time, increased stability against lateral constrictions is achieved during subsequent lamination.

[0031] Furthermore, conductivity is increased and electrical resistance is reduced. "Breaks" in the filling pressure on the flanks of the through-hole are compensated for by additional pressure, such as the antenna pressure. This results in higher yields and greater tolerance to unfavorable through-hole geometries. Holes with a higher aspect ratio can be filled, for example, when using thicker substrates, when the hole diameter cannot be increased due to the sensitivity of the exposed "membrane."

[0032] For example, in a first printing step, conductive tracks can be applied to the first side of the carrier film. After the first printing step is completed, the fill print and conductive tracks, for example, as an antenna, are applied to the second side of the carrier film in a second and third printing step. However, it is also possible for multiple printing steps to be performed simultaneously or overlapping.

[0033] If the through-hole is introduced before the first printing step or if the through-hole, when introduced after the first printing step, also extends through the already applied electrically conductive material, it is preferred if the through-hole is dimensioned such that the electrically conductive material applied in the subsequent printing steps, in particular the first and second printing steps, does not shoot through the through-hole. InIn other words, the electrically conductive material printed on one side of the carrier film should not essentially pass through the through-hole and freely exit on the other side; rather, it should remain in the through-hole to fill it. This can usually be achieved by a sufficiently small cross-section of the through-hole overall or at least on the other side, adapted to the flow properties of the electrically conductive material during the printing process. For example, the through-hole can be shaped like a truncated cone with a cross-section that decreases toward the other side.

[0034] Printing, especially the first printing on the second side, can be done using screen printing or a jet printing process. However, other technologies suitable for increasing the amount of conductive material applied are also conceivable.

[0035] The diameter of the through-hole can be between 50 micrometers and 5,000 micrometers. Particularly when the through-hole is created after the first printing step while preserving the electrically conductive material applied during the printing step, it is preferred for the diameter of the through-hole to be between 100 micrometers and 500 micrometers. A suitable diameter ensures secure through-plating with high electrical conductivity. In this case, there is no risk of the material applied in the second printing step being shot through. Particularly in cases where shooting through is generally possible, the diameter of the through-hole is preferably between 50 micrometers and 200 micrometers. With electrically conductive materials commonly used for printing processes, this prevents the material from being shot through.The thickness of the carrier film is preferably 20 micrometers to 250 micrometers, more preferably 50 micrometers to 100 micrometers, ensuring that the through-hole is filled as far as possible, or even completely, by the electrically conductive material applied in a single printing step. The thickness of the carrier film and the diameter of the through-hole are typically selected interdependently, with a thicker carrier film resulting in a larger through-hole diameter.

[0036] Even if dimensions for the diameter of the through-hole are specified above, the shape of the through-hole is not limited to the preferred circular configuration. In the case of a non-circular through-hole, the cross-sectional area of ​​the through-hole directly related to the diameter specifications applies, i.e., preferably 0.002 square millimeters to 20.0 square millimeters, more preferably 0.008 square millimeters to 0.2 square millimeters, or 0.002 square millimeters to 0.03 square millimeters.

[0037] According to the invention, the through-hole is created by lasers, preferably CO2 lasers, and in embodiments not covered by the subject matter of the protection sought, by punching and drilling.

[0038] If the electrically conductive material applied during the first printing step or when printing the first side is to be retained as far as possible, the through-hole must be created by laser, as this allows the required accuracy to be easily maintained.

[0039] It is preferred if the electrically conductive material comprises or consists of silver conductive paste. Silver conductive paste is well suited for printing conductor tracks. According to the invention, the carrier film comprises polycarbonate or consists of polycarbonate. A carrier film made of polycarbonate can be laminated to further layers of polycarbonate to form a multilayer RFID security document, without increasing the risk of delamination due to incompatible materials in the layers of the multilayer composite.

[0040] The carrier film according to the invention, printed on both sides with conductor tracks, has at least one via produced according to the invention. For further explanation, reference is made to the above statements. Since the electrical conductivity of a via may be too low for a intended use due to the dimensioning of the through-hole required for the inventive method, it is possible to electrically connect a conductor track on different sides of the carrier film by means of an array of at least two vias. The vias, which are preferably arranged closely adjacent to one another, thus establish parallel connections between the two conductor tracks, resulting in an increased cumulative electrical conductivity between the two conductor tracks.In addition, there is a redundancy of the vias, whereby an insufficient contact in one via is compensated by a successful contact in another via.

[0041] It is further preferred if two conductor tracks connected by at least one via on the carrier film comprise contact points for testing the via(s). Test probes of a measuring device can be applied to the contact points, thus verifying the basic existence of an electrical connection via the via(s) and / or the electrical resistance or electrical conductivity of the via(s).

[0042] The RFID inlay according to the invention comprises a carrier film according to the invention and an RFID chip connected to the conductor tracks. The valuable or security document according to the invention comprises an RFID inlay according to the invention. The RFID inlay according to the invention and the valuable or security document according to the invention have the features and advantages already mentioned above in connection with the method according to the invention and the carrier film according to the invention. Typical examples of a valuable or security document according to the present invention are identity cards, passports, driver's licenses, company ID cards, credit cards, encryption cards, and the like. Description of implementation examples

[0043] Further features, properties, and advantages of the present invention are described in more detail below using embodiments with reference to the accompanying figures. All features described above and below are advantageous both individually and in any combination.

[0044] The figures are not necessarily detailed or to scale and may be enlarged or reduced to provide a better overview. Therefore, the functional details disclosed herein are not to be interpreted in a limiting sense, but merely as an illustrative basis for teaching one skilled in the art how to variously employ the present invention.

[0045] As used herein, the term "and / or," when used in a series of two or more elements, means that any of the listed elements may be used alone, or any combination of two or more of the listed elements may be used. For example, if a composition is described as containing components A, B, and / or C, the composition may contain A alone; B alone; C alone; A and B in combination; A and C in combination; B and C in combination; or A, B, and C in combination. Fig. 1 shows a schematic representation of an embodiment of an RFID inlay with a carrier film according to the invention. Fig. 2a shows a schematic detailed representation of the carrier film from Figure 1 . Fig. 2b shows a schematic detailed representation of a variant of Figure 2a. Fig. 3 schematically shows the first steps of a first embodiment of the method according to the invention for producing a through-hole in a carrier film printed on both sides with conductor tracks. Fig. 4 schematically shows a further step of the first embodiment of the method according to the invention. Fig. 5 schematically shows the first steps of a second embodiment of the method according to the invention for producing a through-hole in a carrier film printed on both sides with conductor tracks. Fig. 6 schematically shows a further step of the second embodiment of the method according to the invention. Fig. 7 schematically shows yet a further step of the second embodiment of the method according to the invention. Fig. 8 schematically shows the first steps of a further embodiment of the method according to the invention. Fig. 9 schematically shows a further step of this embodiment of the method according to the invention. Fig.10 schematically shows a final step of this embodiment of the method according to the invention.

[0046] In Figure 1 An RFID inlay 1, such as is used in security documents (e.g., passports), is shown. The RFID inlay 1 comprises a carrier film 10 according to the invention, which is printed on both sides with conductor tracks 11. In Figure 1 The conductor tracks 11 on the directly visible front side of the carrier film 10 are shown in solid lines, while the conductor tracks 11 on the back side of the carrier film 10 are shown in dashed lines. The RFID inlay 1 further comprises the RFID chip 2, indicated only by a dash-dotted line, which is arranged on the back side of the carrier film 10.

[0047] The RFID chip 2 of the RFID inlay 1 is connected via supply lines 3 to antenna taps 4 of an antenna 5, the latter serving not only for communication purposes but also for power supply. The supply lines 3, the antenna taps 4 and the antenna 5 itself are formed by the conductor tracks 11 printed on the carrier film 10. On the front side of the carrier film 10, the conductor track 11 is spirally designed to form the antenna 3 and is extended at the antenna taps 4 to form merely exemplary circular fields. On the back side, the conductor tracks 11 are designed as two separate supply lines 3, each of which is connected at one end (in Figure 1by the antenna taps 4) have circular fields analogous to the antenna taps 4 on the front. In the exemplary embodiment shown, the two supply lines 3 are designed to converge on each other at their other ends on a common axis. This optional but preferred embodiment allows the carrier film 10 to be flexibly equipped with various RFID chips 2, since the layout of the conductor tracks 11 does not prescribe a spacing for the contacts of the RFID chip 2, but rather RFID chips 2 with different contact spacings can be arranged on the carrier film 10 such that one contact is connected to each supply line 3.

[0048] To connect the conductor tracks 11 on the front and back of the carrier film 10, fields of through-contacts 12 are provided in the area of ​​the antenna taps 4, with which the antenna taps 4 are electrically connected to the supply lines 3 and thus the antenna 5 to the RFID chip 2.

[0049] In Figures 2a and b Two different design variants for the field of vias 12 are shown in schematic detail views, whereby the variant from Figure 2a the representation from Figure 1 The through-contacts 12, which are actually concealed by the conductor track 11 on the front, are indicated by dotted lines.

[0050] In the version according to Figure 2a In the area of ​​each antenna tap 4, 21 vias 12 are provided, each via 12 having a diameter of approximately 140 micrometers. In the embodiment according to Figure 2bOnly five vias 12 are provided in the area of ​​each antenna tap 4. However, since these each have a diameter of approximately 285 micrometers, the cumulative electrical conductivity of a respective array of vias 12 is practically identical in both embodiments, assuming identical materials and thickness of the carrier foil 10. The invention is not limited to the number of vias 12 shown and can be implemented with different configurations in individual cases.

[0051] The vias 12 of the carrier foil 10 of the RFID chip from the Figures 1 and 2a, b have been produced using a method according to the invention. A first embodiment of the method according to the invention is described below with reference to Figures 3 and 4 A second embodiment of the method according to the invention is explained in more detail below. Figures 5 to 7An additional design variant is explained in more detail using the Figures 8 to 10 explained in more detail. The Figures 3 to 10 The carrier film 10 shown comprises a first side 21 and a second side 22. This can be a top side or bottom side or a front side or back side.

[0052] The Figure 3 schematically shows the first steps of a first embodiment of the method according to the invention for creating a through-hole plating in a carrier film 10 printed with conductor tracks on both sides. In an optional first step, the first side 21 of the carrier film 10 is printed with electrically conductive material 13, for example, silver conductive paste, in the area of ​​the intended through-hole plating 12. The printing can, for example, include the printing of conductor tracks 11. The printing of the first side 21 can also take place after the production of the through-hole plating through the carrier film 10.

[0053] On the second side 22, material is removed over a large area in the area of ​​the intended via 12. The removed area is identified by reference numeral 15. The removal can be carried out by vaporization using a laser 24, preferably a CO2 laser. According to the invention, a correspondingly expanded beam, generated by defocusing in the laser's beam path, and / or a beam with an adjusted power level are used.

[0054] In one in the Figure 4In a further step shown schematically, a plurality of through-holes 14 are introduced into the carrier film 10 in the region of the removed surface 15. This can also be done by means of a laser 24, for example by percussion drilling. The order of the steps of surface ablation and the introduction of the through-holes can also be interchanged according to the invention, or both steps can be carried out together in one step, for example by choosing a dwell time and / or the intensity of the laser at a respective location to be lower for the surface ablation than for the introduction of the through-holes. However, this does not achieve any particular advantages over a multi-stage process, which is why the step-by-step processing shown in the figures is preferred. Subsequently, the second side 22 of the carrier film 10 is Figure 4printed with electrically conductive material (not shown), wherein the removed surface 15 and the through holes 14 are filled, preferably completely covered.

[0055] In a second variant, as in the Figure 5 shown schematically, a first material removal 15, as already described in connection with the Figure 3 In contrast to the method described in the Figure 3 In the variant shown, a smaller area is removed at a lower depth. Then, as shown in the Figure 6 shown, on the already removed surface 15, a further surface 16 is removed in the same way, whereby the further surface 16 is none other than the previously removed surface 15. The removal of further surfaces is carried out as in the Figure 7shown schematically, continued analogously until a through-hole 14 has been created. The material is removed by laser drilling with multiple pulses at a gradually reduced beam diameter, according to the invention via defocusing or focus adjustment, and with corresponding power adjustment to ablate increasingly smaller areas. Due to the laser stability with changing power levels, fiber lasers are preferable. In this embodiment, too, it is conceivable to drill the through-hole 14 in a single step by adjusting the dwell time or intensity of the laser, although the multi-step procedure shown is considered more advantageous.

[0056] The successively removed surfaces preferably have a circular cross-section with a diameter that decreases from surface to surface. This easily creates a stepped, conical or funnel-shaped passage through the carrier film, which offers the advantages already mentioned.

[0057] Subsequently, the second side 22 of the carrier film 10 is Figure 7 printed with electrically conductive material (not shown), wherein the removed surfaces 15, 16 and the through-hole 14 are filled and preferably completely covered.

[0058] The variants described can also be combined with each other. For example, in the Figure 7 The variant shown also has a plurality of through holes 14 into which the carrier film 10 is introduced, for example in a depression created after repeated surface removal.

[0059] In the following, the Figures 8 to 10A variant is described in which, as part of the method according to the invention, a filling pressure is additionally applied. To simplify the illustration, the through-holes 14 are shown without the material removal 15 or the stepped configuration 15, 16, but these are intended to be present in the exemplary embodiment. The method variant described below is applied to the stepped passages through the carrier film 10 produced as described above.

[0060] In the present variant, as in the Figure 8 As shown schematically in a sectional view, first the first side 21 of the carrier film 10 is printed with electrically conductive material 13, for example silver conductive paste, in the area of ​​the intended through-hole. The printing may, for example, include the printing of conductor tracks 11. Then, from the second side 22, as shown in the Figures 3 to 7As described above, a simplified through-hole 14 is introduced into the carrier film 10 after prior surface material removal. This is done by means of a laser 24, preferably a CO2 laser.

[0061] In a subsequent step, the result of which is shown in the Figure 9 As shown schematically in a sectional view, the second side 22 of the carrier film 10 is printed with electrically conductive material 13, for example silver conductive paste, filling the through-hole 14. The filling pressure thus generated is designated by the reference numeral 23. The filling pressure 23 ensures that the side surfaces and edges of the through-hole 14 are coated with conductive material. Thereafter, in the Figure 10In the step shown, the second side 22 of the carrier film 10 is reprinted with electrically conductive material 13, for example, silver conductive paste, completely covering the through-hole 14 and the fill print. The antenna print thus generated is designated by reference numeral 25.

[0062] The filling pressure 23 causes more conductive material to be placed in the through-hole 14 or in the through-plating 12. This results in greater mechanical stability and lower electrical resistance. As an alternative to the variant shown, the material removal 15, 16 can also be performed first and the through-hole 14 can be created in the carrier film 10 using a laser 24. Subsequently, the first side 21 can be printed with conductive material 13, for example, during the printing of conductor tracks 11. Thus, with suitable flowability of the applied conductive material, material penetrating the existing through-hole can have an advantageous effect on the subsequent contacting from the opposite side. The filling pressure 23 can then be applied, followed by the antenna pressure 25.

[0063] Several filling pressure steps can also be carried out in order to further increase the amount of conductive material 13 present in the through hole 14.

[0064] The printing of the first side 21 can also be the antenna printing and the final printing of the second side 22, which covers the fill printing, can be the printing of the conductor tracks. List of reference symbols:

[0065] 1RFID inlay 2RFID chip 3Feed line 4Antenna tap 5Antenna 6Contact points 10Carrier foil 11Conductor track 12Through-hole 13Electrically conductive material 14Through-hole 15Removed area 16Removed area 21First side 22Second side 23Fill print layer 24Laser 25Antenna print layer

Claims

1. A method for producing a through-hole plating (12) in a carrier film (10) printed on both sides with conductor tracks (11), wherein the carrier film (10) comprises a first side (21) and a second side (22), wherein the method comprises the following steps: - printing of the first side (21) of the carrier film (10) with electrically conductive material (13), whereby the area of the provided through-hole plating (12) is covered, - planar removal of material from a surface (15) of the second side (22) in the area of the intended through-hole plating, - introducing of at least one through hole (14) into the carrier film (10) in the region of the provided through-hole plating and thereby forming a two-step or multi-step transition from the second side (22) through the at least one through hole (14) to the electrically conductive material (13) applied to the first side (21), and - printing of the second side (22) of the carrier film (10) with electrically conductive material (13), whereby the removed surface (15) and the through hole (14) are filled in, characterized in that the carrier film comprises polycarbonate or consists of polycarbonate, and in that the two-step or multi-step transition is effected by the planar removal of material with an expanded laser beam, whereas the expansion of the laser beam being produced by a defocusing in the beam path.

2. The method according to claim 1, characterized in that a plurality of through holes (14) are incorporated into the carrier film (10) in the region of the intended through-hole plating in the carrier film (10).

3. The method according to any one of the preceding claims, characterized in that the removal of material (15, 16) and the introduction of at least one through hole (14) into the carrier film (10) takes place before the printing of the first side (21) of the carrier film (10) with electrically conductive material (13) or the printing of the first side (21) of the carrier film (10) with electrically conductive material (13) takes place before the removal of material and the introduction of at least one through hole (14) into the carrier film (10).

4. The method according to any one of the preceding claims, characterized in that the second side (22) of the carrier film (10) is printed at least once more with electrically conductive material (13), wherein the removed surface (15, 16), the through hole (14) and the already printed electrically conductive material (13) being filled.

5. The method according to any one of the preceding claims, characterized in that if the introduction of the through hole (14) takes place after the printing of the first side (21), the electrically conductive material (13) already applied is retained.

6. The method according to any one of the preceding claims, characterized in that the first printing of the second side (22) is carried out by means of screen printing or by means of a jet printing process.

7. The method according to any one of the preceding claims, characterized in that the diameter of the through hole (14) is 50 micrometers to 5000 micrometers, preferably 50 micrometers to 200 micrometers or 100 micrometers to 500 micrometers, and / or the thickness of the carrier film (10) is 20 micrometers to 250 micrometers, preferably 75 micrometers to 125 micrometers.

8. The method according to any one of the preceding claims, characterized in that the electrically conductive material (13) comprises silver conductive paste.

9. A carrier film (10), which is printed on both sides with conductor tracks (11) and has at least one through-hole plating (12) produced in accordance with one of the preceding claims.

10. The carrier film (10) according to claim 9, characterized in that in each case one conductor track (11) on different sides of the carrier film (10) is electrically connected to one another by an array of at least two through-hole platings (12).

11. The carrier film according to claim 9 or 10, characterized in that two conductor tracks (11) are connected by at least one through-hole plating(s) (12) comprising contact points (6) for checking the through-hole plating(s) (12).

12. A RFID inlay (1) with a carrier film (10) according to any one of claims 09 to 11 and a RFID chip (2) connected to the conductor tracks (11).

13. A value or security document with a RFID inlay according to the preceding claim.