METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

Description

[0001] The present application relates to a method for producing an electronic component and to an electronic component.

[0002] During the manufacture of electronic components, it may be provided that a component is hermetically encapsulated with a cap or a lid. A sealed gap is then provided between the component and the cap, which is under negative pressure or vacuum when emptied of air, or which is specifically filled with a gas. During the manufacture of such an electronic component, it may, for example, be provided that the cap is sealed in a one-step soldering process in a bonding chamber in which the desired vacuum or a specific gas atmosphere prevails. A two-step process may also be provided in which the cap is closed in a soldering process except for a small, exposed opening, and the gap between the cap and component is then placed under vacuum or gas in a chamber and then sealed.Sealing is achieved, for example, by laser soldering a solder deposit at the opening, by melting the solder deposit at the opening with local heating structures, or by sputtering or vapor deposition of material to seal the opening. Particularly with metal caps, it may be provided that a tube is welded on. By connecting a vacuum pump to the tube, a vacuum can then be created in the space between the tubes, and the tube can then be closed and shortened with pliers. US 2008 / 231145 A1 relates to a quartz crystal device containing a crystal resonator element and a housing. Several components are bonded together using a metal paste sealing material containing metal particles, an organic solvent, and a resin material.Further state of the art can be found in the document "WEI-SHAN WANG ET AL: Substrate bonding at low temperature by using plasma activated porous gold, 2013 IEEE SENSORS, IEEE".

[0003] Against the background of these aspects, it is an object of the present application to propose an improved method for producing an electronic component. In particular, it is an object of the present application to propose a method that enables the production of an electronic component with a reliably sealed gap in a comparatively simple and cost-effective manner. Furthermore, it is an object of the present application to propose a correspondingly advantageous electronic component.

[0004] These objects are achieved by a method according to the invention which is defined in claim 1.

[0005] Advantageous further developments result from the features of the dependent claims and the embodiments.

[0006] In the proposed method for producing an electronic component, a flat component and a, in particular flat, cap are provided. In addition, a porous and fluid-permeable, in particular gas-permeable, sealing element is arranged on the cap or on the component. Furthermore, the component and the cap are arranged relative to one another such that the sealing element is arranged between the cap and the component and is in contact with both the cap and the component, and that an intermediate space between the cap and the component is at least partially delimited by the porous and fluid-permeable sealing element. The intermediate space is generally delimited, for example completely, by the sealing element, the component and the cap.In a further step, a first bonding of the component and the cap takes place by applying a first bonding pressure and / or a first bonding temperature such that a mechanically durable connection is created between the component and the cap. In a further step, for example after the first bonding, the cap and the component are exposed to a fluid, in particular a gas atmosphere, or a vacuum, wherein fluid, in particular gas, flows through pores in the sealing element into the intermediate space or escapes from it. During this or subsequently, a second bonding of the component and the cap takes place by applying a second bonding pressure and / or a second bonding temperature, whereby the pores of the sealing element are closed and the intermediate space is sealed. As a rule, the second bonding takes place in the gas atmosphere or in the vacuum, in particular in a chamber provided for this purpose.After the second bonding, the fluid, in particular the gas, that flowed through the pores of the sealing element into the gap, or a vacuum created by the escape of fluid, in particular gas, through the pores of the sealing element, is typically contained in the sealed gap. A vacuum in the sense of the present application is typically understood to mean a pressure of less than 300 mbar or, in some embodiments, a negative pressure of 300 mbar or more.

[0007] The proposed method allows for the comparatively simple and inexpensive production of an electronic component having a reliably sealed intermediate space. This is achieved in particular by the fact that the first bonding, during which, for example, an alignment takes place, does not necessarily have to take place in the fluid or gas atmosphere or in a vacuum. For example, the first bonding can be carried out in a first bonder. It can also be provided that the arrangement of the component and the cap relative to one another is carried out by the first bonder. The arrangement and the first bonding usually involve the positioning and fixing of the cap, which can take place, for example, in air. In typical embodiments, it is provided that the sealing element contributes to the mechanical durability of the connection between cap and component created by the first bonding, in particular alone or together with other components.In typical designs, the sealing element ensures both the mechanically durable connection between the component and the cap and guarantees the sealing of the gap. A wide selection of purpose-adapted and conventional bonders are available for the first bonder, advantageously enabling reliable alignment. The first bond can thus allow precise placement and fixation of the caps without the gap having to be sealed in this step. This is particularly advantageous because many precise chip bonders for sequential assembly do not have a vacuum or process gas. Pumping the vacuum or filling with a gas can take place in a second process step before sealing the sealing element. The second bond can therefore take place in a second bonder that is equipped to generate the gas atmosphere or vacuum.In this case, it is generally no longer necessary to place the cap, which considerably simplifies the second bonder or a bonding chamber of the second bonder. It can therefore be provided that the first bonder is not equipped with a vacuum and / or gas connection and / or that the second bonder is not equipped with a device for placing a cap. Therefore, the proposed method does not require the first bonder or a component feeder of the first bonder to be placed in a hermetic chamber as in known methods, or that a small bell is provided that is lowered over the bonding point, so that long process times and high costs can be avoided with the proposed method.

[0008] Accordingly, an electronic component is advantageous which in particular comprises the planar component, the planar cap and the sealing element which is arranged between the cap and the component and is in contact with both the cap and the component. The intermediate space between the cap and the component can be delimited at least in sections by the sealing element. The sealing element can be compacted in such a way that the pores of the sealing element are closed and the intermediate space is sealed. The intermediate space generally contains a noble gas or inert gas atmosphere or a vacuum. In particular, the present application can relate to an electronic component produced by a method as described below or above. A person skilled in the art will recognize from the finished electronic component that this was manufactured by the manufacturing process as described above or below.The sealing element typically also has a somewhat porous structure containing pores closed by the second bonding process, although the sealing element is generally not completely dense. Therefore, a person skilled in the art will typically recognize regular pores in the cross-section of the sealing element.

[0009] It can be provided that the porous and fluid-permeable sealing element contains a porous metal, in particular porous gold. It can also be provided that the porous and fluid-permeable sealing element is nanoporous. Typically, the porous material of the sealing element is from the group of precious metals. As a rule, the sealing element is open-pored. It can be provided that the sealing element is predominantly made of gold. In this case, the sealing element is particularly suitable for allowing fluid or gas to flow into or escape from the gap through pores in the sealing element before the second bonding and, on the other hand, for ensuring reliable sealing of the gap through suitable process parameters during the second bonding. In typical embodiments, the gap is filled with a gas via the sealing element before the gap is sealed.After sealing, the sealing element can seal the gap, whereby a gas in the gap can be an inert gas, for example nitrogen, or a noble gas such as helium, argon or krypton.

[0010] Typically, the sealing element is annular. In this case, it can be referred to as a sealing ring. The sealing element can be provided to surround the space between the cap and the component in a ring-like manner. In particular for particularly reliable sealing of the space, the sealing element can, in typical designs, completely encircle the space, in particular in the sense of a closed ring. The sealing element can, but does not necessarily have to, be circular. The porosity of the sealing element (defined as 1 minus the quotient of bulk density and true density) before the second bonding is generally at least 0.2, in particular at least 0.4, or at least 0.65 and / or at most 0.9. Reliable sealing after the second bonding can generally be achieved with a porosity greater than 0.65 to 0.9.The porosity typically changes from an open-pored structure to a closed pore structure or to a structure with enclosed pores. This process can be supported by temperature- and time-dependent diffusion processes during compaction. In order to enable reliable sealing of the intermediate space with minimal space requirement for the sealing element, the width of the sealing element at its narrowest point is generally at least 1 µm and / or at most 500 µm. The height of the sealing element after the second bonding is generally at least 1 µm and / or at most 40 µm. Before it is compacted by the second bonding, the height of the sealing element can be at least 1 µm and / or at most 30 µm greater, for example. Furthermore, in some designs the sealing element can be mounted on a substructure or spacer orframe, whereby an increase in the volume of the intermediate space can be achieved.

[0011] It can be provided that the sealing element is arranged on the cap and / or on the component by deposition, in particular galvanic deposition, on the cap or component. Preferably, the porous and fluid-permeable sealing element is produced by arranging, in particular depositing, an alloy on the cap or on the component. The alloy can contain a first alloy component, in particular a metallic one, and a second alloy component, in particular a metallic one. As a rule, the first alloy component is more noble and the second alloy component is less noble. It can be provided that the first alloy component is gold. For example, it can be provided that the second alloy component is silver.In a further, particularly subsequent, step, the second alloy component can be etched, particularly in such a way that the first alloy component remains, thereby forming the porous and fluid-permeable sealing element. In this way, a particularly homogeneous sealing ring can be produced, which is characterized by advantageous structuring capabilities with small dimensions.

[0012] It can be provided that the cap or the component has a mating surface. Before the first bonding on the component or on the cap, the mating surface can be arranged and formed opposite the sealing element in such a way that the first bonding creates a material-to-material connection between the sealing element and the mating surface. The mating surface can, for example, comprise a metal layer. The mating surface can, for example, contain the same material as the sealing element, in particular gold. In this way, a connection created by the first bonding between the cap and the component can be made mechanically more durable.

[0013] The sealing element can be arranged on a flat surface of the component or on a substructure, for example, a material-bonded and / or frame-shaped substructure, such as a metal frame or a silicon frame. The substructure can be manufactured, for example, before the sealing element is manufactured.

[0014] The first bonding and / or the second bonding can be performed by thermocompression bonding. Normally, no specifications are required regarding the process parameters as long as the described functional results of the first bonding—i.e., creating a mechanically durable connection—and the second bonding—sealing the gap—are achieved. However, it is generally advantageous if the first bonding pressure and / or the first bonding temperature are lower than the second bonding pressure or the second bonding temperature. In this way, it can be reliably ensured that the connection between the cap and the component is made mechanically durable by the first bonding, but that the pores of the sealing element are not yet sealed fluid-tight.

[0015] In some embodiments, it is provided that the gap or the cap and the component are baked, in particular after the first bonding and / or before sealing the gap. For this purpose, temperature profiles can be run, in particular in the second bonder or in a chamber of the second bonder. This allows gases absorbed on the walls of the cap or component to be removed, thus achieving greater purity of the electronic component. In particular, the achievable final vacuum can be increased in this way.

[0016] In some embodiments, the component is a wafer or a wafer part, which can in particular contain integrated circuits. The cap can be a wafer or a chip. Sometimes the term "flat element" or "lid" is used, which generally refers to a flat substrate with a sealing element. A cap is generally understood to be a more common design in which, for example, a cavity has been etched into the substrate and a sealing element runs around the cavity on the non-etched part. Another cap variant comprises two parts: a flat substrate and a firmly connected frame, which also form a cavity, with the sealing element running on the frame. Each of these three variants can represent a cap within the meaning of the present application.

[0017] The component can form a first substrate and the cap a second substrate. It can be provided that the first bonding is carried out by a flip-chip bonder. It can also be provided that the arrangement of the component and the cap relative to one another is carried out by the flip-chip bonder. This is an established process, whereby the desired alignment and mechanical connection can be achieved in a reliable manner. In addition, with a flip-chip bonder during the first bonding, the sequential bonding of further caps, described in more detail below, can be carried out in a particularly time-saving manner. It can be provided that the arrangement and / or the first bonding by the flip-chip bonder is carried out in air.

[0018] In some embodiments, a further cap is bonded to the component, in particular after the first bonding of the component and the cap. In this case, a further porous and fluid-permeable, in particular gas-permeable, sealing element can delimit a further intermediate space which is formed between the further cap and the component. The first bonding can take place sequentially, so that at least five, in particular at least ten further caps are bonded to the component. A particularly time-saving method can be achieved in that, during the second bonding, the further cap, in particular any further caps provided, is / are bonded to the component at the same time as the cap, as a result of which pores in the further sealing element are closed and the further intermediate space (or spaces) is sealed. In this way, the method step in which a fluid or a gas atmosphere orA vacuum is provided, simplifies the bonding process. Any height differences between the caps can be compensated for during the second bonding process with a soft, particularly temperature-resistant, foil. This allows the pressure to be evenly distributed across all caps. The foil can be applied to the top of the caps during the second bonding process.

[0019] It can also be provided that a second porous and fluid-permeable, in particular gas-permeable, sealing element is arranged on a second cap or on a second component. The second component and the second cap can be arranged relative to one another such that the second sealing element is arranged between the second cap and the second component and is in contact with both the second cap and the second component, and that a second intermediate space between the second cap and the second component is delimited, at least in sections, by the second porous and fluid-permeable sealing element. In a further step, the second component and the second cap can be bonded by applying a bonding pressure and / or a bonding temperature such that a mechanically durable connection is created between the second component and the second cap.In a further step, the second cap and the second component can be exposed to the fluid, in particular the gas atmosphere, or to the vacuum together with the cap and the component in such a way that fluid, in particular gas, flows through pores of the second sealing element into or escapes from the second intermediate space and in such a way that the second cap and the second component are arranged on the cap and the component. During the second bonding of the component and the cap, the overlying second component and second cap can be bonded simultaneously by applying the second bonding pressure and / or the second bonding temperature. This allows the pores of the second metal element to be closed and the second intermediate space to be sealed. It can be provided that the cap and the component are separated from the second cap and the second component by a film during the second bonding.This prevents damage and ensures even pressure distribution during the second bonding process. By arranging the second cap and second component on the cap and component and performing the second bonding simultaneously, production can be particularly simple and time-saving. In particular, the second bonding of the second cap and second component can be performed in the second bonder together with the cap and component, for example, in a stack.

[0020] It can be provided that the electronic component is an optoelectronic component. For example, the component and / or the cap can contain a laser diode and / or a photodetector. In some embodiments, it can be provided that the cap has at least one, in particular integrated, lens. Furthermore, the component can have at least one optical detector or emitter. It can be provided that the sealed intermediate space is arranged between the lens and the detector or emitter. Typically, the lens and the detector or emitter are arranged one above the other after the cap and component have been arranged.

[0021] It can also be provided that the electronic component is a MEMS component. In this case, the cap and / or the component can have an inertial sensor, a pressure sensor, a microbolometer, and / or an RF switch. It can further be provided that the component is an optical MEMS component, wherein the component and / or the cap has micromirrors or mirror arrays. The electronic component can, for example, form a hermetic package for sensitive optoelectronic components, for example laser diodes or photodetectors. Furthermore, the electronic component can advantageously comprise a microbattery. The electronic component can also be a microfluidic component that has heat pipes or vapor chambers sealed by the sealed space and filled with water.

[0022] Features described above or below with respect to the method for manufacturing the electronic component are applicable accordingly to the electronic component and vice versa.

[0023] Examples of implementation are described below using the figures. Figs. 1(a) to (d) schematic views illustrating a method for manufacturing an electronic component according to the invention. Figs. 2(a) to (d) schematic views illustrating a method for producing an electronic component according to a further embodiment of the invention and Figs. 3(a) to (d) further schematic views to illustrate a method for producing an electronic component according to the invention.

[0024] Figures 1(a) to 1(d)illustrate steps of a method for producing an electronic component. The method allows the production of a gap in the electronic component that is specifically filled or evacuated with a gas. In the proposed method, a component 1, for example a semiconductor chip or a semiconductor wafer with integrated circuits, can first be provided. In addition, a cap 2 can be provided, which can be designed, for example, as a wafer or as a chip. The cap comprises on one surface a closed ring of nanoporous gold, which forms an initially gas-permeable sealing element 3, characterized in the Figs. 1(a)illustrated cross-section with the reference numerals 3 and 3'. In another embodiment, the sealing element 3 can also be arranged on the component 1. The cap 2 can be aligned with the component using a flip-chip bonder known per se and bonded to the component 2 with the flip-chip bonder in a first bonding step. For this purpose, the cap 2 is arranged and aligned over the component 1 such that the sealing element 3 faces an annular counter-surface 4 deposited on a surface of the component 1, which is formed, for example, by a gold coating shaped corresponding to the sealing element 3 and is identified in the figure with the reference numerals 4 and 4'. After the cap 2 has been aligned with the component 1, the cap 2 is pressed onto the component by the flip-chip bonder in a thermocompression bonding step at elevated temperature.This first bonding takes place, for example, in normal environments, especially in air.

[0025] To produce the porous sealing element 3, for example, a silver-gold alloy can first be electroplated onto component 1 or cap 2. The silver of the alloy can then be etched, leaving the initially gas-permeable sealing element 3 in the form of a sponge-like, yet open-pored and nanoporous gold.

[0026] The first bonding results in the Figs. 1(b)shown arrangement, in which the sealing element 3 is materially connected to the mating surface 4. As a result, the component 1 and the cap 2 are already mechanically firmly connected to one another. Recurring features are provided with the same reference numerals in this and the following figures. The sealing element 3 forms a ring that completely circumferentially delimits an intermediate space 5 between the component 1 and the cap 2. The sealing element 3 is generally not yet compacted by the first bonding and pores of the sealing element 2 are not closed by the first bonding, so that the sealing element 3 remains open-pored and gas-permeable after the first bonding.

[0027] In a second bonding step in a second bonder, which does not have to correspond to the first bonder designed as a flip-chip bonder, the sealing element 3 is to be sealed to seal the gap 5. Before sealing the sealing element 3 by the second bonding, the gap 5 is deliberately exposed to a gas atmosphere or a vacuum, usually after removing the partially manufactured component from the flip-chip bonder, which Figs. 1(c)illustrated. The arrows with the reference numerals 6 and 6' illustrate that air flows out of the gap by connecting a vacuum pump to a chamber in which the component 1 and the cap 2 are arranged. This chamber already forms part of the second bonder, in which the subsequent second bonding step is carried out. Because a vacuum prevails in the chamber, a vacuum also forms in the gap 5. Subsequently, the component 1 and the cap 2 can be baked out in the chamber, for example by running a temperature profile, so that the pressure in the gap 5 is further reduced.

[0028] The second bonding can also be performed in the chamber of the second bonder and, like the first bonding, is a thermocompression bonding process in which the cap 2 and component 1 are pressed together at an elevated temperature. Both the temperature and pressure are higher during this second bonding process than during the previous first bonding process. Generally, at least one of the two bonding parameters, pressure or temperature, is higher during the second bonding process than during the first bonding process. Figs. 1(d)As illustrated, the distance between the cap 2 and the component 1 decreases during the second bonding process due to compression of the sealing element 3. The pores of the sealing element 3 are closed in such a way that the sealing element 3 closes and seals the intermediate space 5 in a gas-tight manner. This ensures that the vacuum remains in the intermediate space 5 even after the component 1 has been removed from the chamber of the second bonder together with the cap 2, forming the finished electronic component.

[0029] The manufacturing process used in Figs. 2(a) to (d) illustrated corresponds to the above with regard to Figs. 1(a) to (d)described method with the difference that there is no vacuum in the gap 5 after the second bonding. Instead, a gas atmosphere is deliberately created in the chamber of the second bonder before the second bonding. This can be, for example, an inert gas, such as nitrogen, or a noble gas such as helium, argon, or krypton. Typically, the gas atmosphere is not a normal room air atmosphere. As the arrows with the reference numerals 7 and 7' in Figs. 2(c)To illustrate, the gaseous medium flows through the open-pore material of the sealing element 3 into the intermediate space 5. Subsequently, the sealing element 3 is compressed during the second bonding as described above, so that the intermediate space 5 is sealed. The gas therefore remains in the intermediate space 5 even after the electronic component has been completed. The gas can, for example, be an inert gas, e.g., for inertial sensors for adjusting the damping. However, other applications described in this application are also conceivable. A base area of ​​the sealed intermediate space 5, which, depending on the embodiment, is filled with fluid, in particular with the gas, or in which a vacuum prevails, is, in realistic designs, at least 10 µm 2< , in particular at least 0.2 mm 2< , and / or at most 100 cm 2< , in particular at most 500 mm 2< . Smaller areas can, for example, have edge lengths of a few µm, e.g.5 µm x 5 µm, while larger dimensions can reach up to 100 mm x 100 mm. Typical values ​​range from 1 mm x 1 mm to 15 mm x 15 mm.

[0030] Figures 3(a) to (d) illustrate further steps for manufacturing the electronic component. In this method, several caps 2, 2' are sequentially aligned with the component 1 using the flip-chip bonder and applied to it. For example, a sequential hermetic bonding of many individual caps on a component 1 designed as a functional wafer is provided. In this case, the first bonder can be a bonder that operates in air or, if necessary, under an inert gas curtain. In this chip-to-wafer bonding, the caps are picked up from a template and arranged and bonded at the respective position on the wafer. The caps 2, 2' are designed like the cap 2 described above. In the Figs. 3(a)In the illustrated state, component 1 lies on a table 8 of the flip-chip bonder, and the left cap 2 is already bonded to component 1 by the first bonding step, as described in detail above. The right cap 2' is designed like the left cap 2 and is currently being held by a manipulator 9 of the flip-chip bonder and aligned with component 1. This process takes place in air. Figure 3(b) shows the first bonding of the right cap 2', in which the flip-chip bonder presses the second cap 2' against component 1 at elevated temperature, as illustrated by the arrows with reference numerals 10 and 10'. Subsequently, further caps (not shown) can be bonded sequentially to component 1 in a corresponding manner until all positions on component 1 are populated.

[0031] Subsequently, the component 1 with the caps 2, 2' permanently attached to it by the first bonding is inserted into a Figs. 3(c) and 3(d)shown chamber 11 of a second bonder. In the second bonder, no alignment is necessary anymore, since the caps 2, 2' were already individually fixed in the first bonder under normal ambient air. The wafer or component 1 can be further treated in a subsequent step in chamber 11 by tempering or baking in a vacuum. Depending on the desired filling state of the gaps 5, 5' of the finished electronic component, a gas or vacuum atmosphere then prevails in chamber 11, which is specifically introduced into chamber 11 by a vacuum pump or gas sources of the second bonder. In chamber 11, component 1 is arranged on a table 12 of the second bonder.Subsequently, an upper part 13 of the second bonder simultaneously applies pressure to all caps 2, 2' toward component 1 at elevated temperature, compressing the sealing elements 4, 4' of the various caps to seal the gaps 5, 5'. Any height differences can be compensated for with a soft, temperature-resistant film on the top surfaces of the caps 2, 2', thus distributing the pressure more evenly across all caps 2, 2'.

[0032] In other embodiments, the second compression step for sealing the caps can be performed in a stack of multiple wafers. In this case, the stacks of wafers arranged one above the other, each with its pre-bonded cap, can be separated by a foil, which can equalize the pressure in the event of small height differences. Thus, in the second bonding chamber 11, the annealing, vacuum processes or gas filling, and sealing can be performed simultaneously for all wafers in an integrated press.

[0033] Only features of the various embodiments disclosed in the exemplary embodiments can be combined with one another and claimed individually.

Claims

1. A method to manufacture an electronic component, comprising the following steps: - providing a planar component (1), - providing a cap (2), - arranging a porous and fluid-permeable, particularly gas-permeable, sealing element (3) on the cap (2) or on the component (1), comprising - the manufacture of the porous and fluid-permeable sealing element (3) by arranging an alloy containing a first alloy component and a second alloy component on the cap (2) or on the component (1), and - a subsequent etching of the second alloy component, such that the first alloy component remains and thereby forms the porous and fluid-permeable sealing element (3); - arranging the component (1) and the cap (2) in relation to one another such that the sealing element (3) is arranged between the cap (2) and the component (1) and is in contact with both the cap (2) and the component (1), and that an intermediate space (5) between the cap (2) and the component (1) is bounded at least sectionally by the porous and fluid-permeable sealing element (3), - first bonding of the component (1) and the cap (2) by applying a first bonding pressure and / or a first bonding temperature in such a way to create a mechanically durable connection between the component (1) and the cap (2), - exposing the cap (2) and the component (1) to a fluid, particularly a gas atmosphere, or to a vacuum, after the first bonding, with fluid or gas flowing through pores in the sealing element (3) into the intermediate space (5) or escaping from it, - second bonding of the component (1) and the cap (2) by applying a second bonding pressure and / or a second bonding temperature, thereby closing the pores of the sealing element (3) and sealing the intermediate space (5).

2. The method according to claim 1, characterized in that the sealing element (3) both ensures the mechanical durability of the connection between the component (1) and the cap (2) is as well as a sealing of the intermediate space (5).

3. A the method according to one of claims 1 or 2, characterized in that the sealing element (3) completely surrounds the intermediate space (5).

4. The method according to any of claims 1 to 3, characterised in that the porous and fluid-permeable sealing element (3) contains a porous metal, in particular porous gold.

5. The method according to any of claims 1 to 4, characterised in that the porous and fluid-permeable sealing element (3) is nanoporous.

6. The method according to one of claims 1 to 5, characterized in that the cap (2) or the component (1) has a counter-surface (4) which, prior to the first bonding, is arranged on the component (1) or on the cap (2) opposite the sealing element (3) and is designed in such a way that the first bonding forms a materially bonded connection between the sealing element (3) and the counter-surface (4).

7. The method according to any of claims 1 to 6, characterised in that the first bonding pressure and / or the first bonding temperature is / are lower than the second bonding pressure and / or the second bonding temperature.

8. The method according to any of claims 1 to 7, characterised in that the first bonding occurs via a flip-chip bonder.

9. The method according to any one of claims 1 to 8, characterized by: - bonding a further cap (2') onto the component (1) after the first bonding of the component (1) and the cap (2), whereby a further porous and fluid-permeable, particularly gas-permeable, sealing element delimits a further intermediate space (5') formed between the further cap (2') and the component (1).

10. The method according to claim 9, characterized in that during the second bonding the further cap (2') is simultaneously bonded to the component (1) together with the cap (2), whereby closing pores of the further sealing element and sealing the further intermediate space (5').

11. The method according to any one of claims 1 to 10, characterized by: - arranging a second porous and fluid-permeable, in particular gas-permeable, sealing element on a second cap or on a second component, - arranging the second component and the second cap in relation to one another such that the second sealing element is arranged between the second cap and the second component and is in contact with both the second cap and the second component, and such that a second intermediate space between the second cap and the second component is at least partially bounded by the second porous and fluid-permeable sealing element, - bonding the second component and the second cap by applying a bonding pressure and / or a bonding temperature in such a way to create a mechanically durable connection between the second component and the second cap, - exposing the second cap and the second component to the fluid, particularly the gas atmosphere, or to the vacuum together with the cap and the component in such a way that fluid, in particular gas, flows through pores of the second sealing element into the second intermediate space or escapes from it and in such a way that the second cap and the second component are arranged on the cap (2) and the component (1), whereby during the second bonding of the component (1) and the cap (2), the second component and overlying second cap are simultaneously bonded by applying the second bonding pressure and / or the second bonding temperature, whereby the pores of the second sealing element are closed and the second intermediate space is sealed.