Panel element for surface heating and cooling systems with heating or cooling register

Description

[0001] The present invention relates to a panel element for surface heating or cooling of ceilings or walls in building interiors, through which a heating or cooling medium flows for heating or cooling purposes. Such panel elements are either individually installed as surface heating systems on walls or ceilings or as a plurality of coupled panels mounted on the ceilings, for example, to meet the heating and air conditioning requirements in the rooms of buildings. In addition to a base plate, the panel elements have a register for a heating or cooling medium attached to or within the base plate, which flows, for example, through meandering copper or plastic pipes. Thus, both a chilled ceiling and a heated ceiling can be created from several such interconnected panel elements, which replace or supplement conventional radiators or ventilation heating systems.

[0002] It is known to insert heat-conducting profiles between the heating or cooling coils in the panel elements, which provide improved heat transfer to the base plate of the elements, which is primarily metallic. It is also known to integrate, for example, coiled copper or plastic pipes as heating or cooling coils within a highly thermally conductive material in the panel elements. The base plates, which are implemented, for example, as perforated metal sheets with trough-shaped edges, serve to accommodate both the coil and the brackets and fixings for such panel elements on the walls or ceilings of buildings.

[0003] A disadvantage of existing panel elements for surface heating systems is that, in certain applications, heat transfer to the base plates facing the interior is insufficient to achieve the desired heating or cooling effect in the rooms. Problems arise, for example, with non-flat base plates, as the connected cooling registers or heat-conducting profiles then only make contact at specific points, resulting in inadequate thermal conductivity of the heat to the metallic base plates of the ceiling or wall elements. Reduced heating or cooling performance is then inevitable. In the past, it has been suggested that specially shaped heat-conducting profiles be installed between the register and the pipes for the heating or cooling medium on the base plate side of such panel elements for ceiling heating systems.This achieves a certain improvement, however, these measures are costly and complex to manufacture and are not always suitable, for example in the case of three-dimensionally shaped and nested panel elements, which do not allow sufficient heat transfer to the inside or visible side facing the interior of the building.

[0004] DE 91 02 260 U1 relates to a chilled ceiling for room air cooling, in which the plate-shaped base element has a toothing at a central point into which a counter toothing of a heat conducting rail for the cooling register can be inserted via a clip connection.

[0005] EP 0 769 659 A1 relates to a heating and cooling ceiling with a contact plate which has a local adhesive recess in which an adhesive strip or adhesive is provided for attachment to the underlying base plate (perforated ceiling plate).

[0006] JP 2018 194280 A describes an air conditioning panel in which an adhesive is used to better fix the pipe in the recesses or in the connection to the base plate. The adhesive is applied between a base plate, referred to as the substrate, and a pipe, sometimes also in recesses in the base plate, where very small recesses or grooves in the micrometer range are incorporated to improve the adhesive bond.

[0007] DE 20 2012 003 810 U1 relates to a composite element with a sandwich-shaped design of a heat-conducting layer with two plates that enclose the pipes of a register from above and below.

[0008] Against this background, the object of the present invention is to provide a panel element for surface heating or cooling of ceilings or walls of building interiors, comprising a heating or cooling register, which allows for the largest possible and most uniform heat emission and reduced energy consumption for heating and cooling building interiors, even with differently shaped and designed panel elements. Furthermore, it is an object of the present invention to achieve improved heat transfer from the heating and cooling registers to the base plates, regardless of the shape of the base plates of such panel elements, with the lowest possible design effort and manufacturing costs.

[0009] This problem is solved by a panel element for surface heating or cooling of ceilings or walls of building interiors according to claim 1. Advantageous embodiments and further developments of the invention are the subject of the dependent claims.

[0010] According to claim 1, a panel element for surface heating or cooling of ceilings or walls of building interiors is provided with a surface facing the interior space.The proposed plate element consists of a metallic base plate facing the visible side of the room and a register for a heat transfer medium, in particular a heating or cooling medium, which flows through the register and is directly or indirectly connected to it, and has at least one heat-conducting layer between the base plate and the register for heat transfer between the register and the base plate, wherein the plate element is characterized in that the base plate has a three-dimensional, uneven shape in its surface area and that the heat-conducting layer on the side facing the base plate has a counter-shape corresponding to the uneven shape of the base plate for a positive interlocking and continuous surface bonding of the heat-conducting layer to the base plate together with the register for heating or cooling, or forms such a bond in the assembly of the base plate and the heat-conducting layer.

[0011] The panel element according to the invention thus comprises a base plate located on the inside of the rooms and an associated register consisting of, for example, pipes, channels, or conduits for a heating or cooling medium, through which the register flows for heating and cooling purposes. Furthermore, the panel element is provided with at least one heat-conducting layer arranged between the base plate and the register to enable improved and, if possible, large-area transfer of heat or cold from the register to the base plate located on the outside and thus into the interior of the building. According to the invention, the base plate is a panel or sheet metal element that has a three-dimensional, uneven shape in its surface area.The base plate is therefore not a completely flat plate, but has a special three-dimensional, projecting or recessed shape with raised and recessed areas, which can be structured or unstructured, for example. Thus, the base plate does not form a flat contact surface on its side facing the register, so that, for example, flat heat transfer elements or register elements attached to it can only make contact at specific points.

[0012] To prevent this and the associated poor heat transfer between the register and the base plate, the invention provides at least one heat-conducting layer in the plate element, which has a counter-shape on the side facing the base plate that corresponds to the uneven shape of the base plate. The counter-shape is designed to enable a positive-locking interlock between the heat-conducting layer and the base plate, allowing the heat-conducting layer to bond to the base plate completely and without gaps. This ensures that the heat-conducting layer, and also the register connected to or even integrated within the heat-conducting layer, is thermally coupled to the metallic base plate as closely as possible and over a large area. In this way, significantly improved heat transfer is achieved.The heat transfer between the register and the outer surface of the panel elements, which faces into the building space, is achieved. This allows for greater heating or cooling efficiency, even over large areas. The uneven shape of the base panels effectively increases the effective heat-emitting surface compared to purely flat surface heating systems. Consequently, energy consumption is lower than with conventional panel elements of this type. The overall surface area is also increased by the uneven shape of the base panel compared to a purely flat, uniform ceiling panel, which may also be perforated for acoustic purposes.

[0013] The plate elements according to the invention thus exhibit a significantly improved heat conduction technology for heating or cooling ceilings, particularly for three-dimensionally deformed, uneven base plates. The at least one heat-conducting layer, which can also be formed from several different heat-conducting layers, is designed in its structure, material, or cured final shape to provide a corresponding counter-shape for the three-dimensional, uneven shape of the base plate. The two elements can therefore be arranged in a shape corresponding to each other and in complete surface contact, so that even with a relatively thin design of the plate elements, very good heat transfer between the heating or cooling medium in the register on the one hand and the base plate, which is usually made of a metal sheet, is ensured even with high variability in the shape of the base plate.

[0014] A connection or bond between the base plate and the heat-conducting layer can be achieved, for example, by simply placing it on top, by bonding, or by compression in the case of a compressible heat-conducting layer material. In all these cases, the heat-conducting layer is always formed in its final state with a corresponding counterpart and lies flush against the base plates of the plate elements across the entire three-dimensional plane.The uneven counter-shape on the side of the heat-conducting layer facing the base plate can also be achieved by machining it in a manner similar to the machining of the base element: For example, if the metallic base plate is realized as a three-dimensionally embossed metal sheet with square deformations, the counter-shape can be created in advance of joining or assembling the elements and components by means of appropriately shaped embossing dies or mechanical machining of the heat-conducting layer material. Overall, the plate element according to the invention results in significantly improved properties with regard to the heating and cooling of buildings, acoustics, weight and thickness of the plates, as well as the processing and manufacturing of the enhanced heat transfer properties.No elaborate structural measures such as extra material layers or ventilation channels requiring additional installation space within the structure of the panel element are necessary to achieve the improved and optimized heating or cooling effect in the panel elements for ceilings or surface heating of ceilings or walls according to the invention.

[0015] According to an advantageous embodiment of the invention, the register for the heating or cooling medium comprises lines, channels, or pipes for the heat transfer medium (heating or cooling medium), in particular pipes in a meandering shape, distributed across the surface of the plate element. Such serpentine or meandering pipes, for example made of copper, form a large-area heating or cooling register for such plate elements, which is provided directly in the area of ​​the base plate and thermally connected to it according to the invention. The cooling register is arranged as close as possible to the uneven surface of the base plate that faces the interior of the building, so that good heat transfer or cold transfer between the heat transfer medium and the base plate is ensured despite its uneven, three-dimensionally structured or unstructured shape.

[0016] According to a further advantageous embodiment of the invention, the register for the heating or cooling medium is at least partially embedded in the material of the heat-conducting layer and positively enclosed or surrounded by it. For example, the register can be enclosed and embedded on both sides by a plate-shaped, compressible material made of thermally conductive plates. Alternatively, the register can be only partially embedded within a highly thermally conductive material that is initially liquid and subsequently hardens, such as gypsum or the like. Good heat or cold transfer from the register to the base plate forming the radiating surface is thus ensured.The best possible heat transfer and heat radiation in such surface heating systems can thus be achieved with the plate elements according to the invention, while still maintaining a relatively simple structural design, a low height and a relatively low weight of the entire plate elements.

[0017] According to a further advantageous embodiment of the invention, in some exemplary embodiments the heat-conducting layer comprises a compressible, thermally conductive material for realizing the uneven counter-shape corresponding to the uneven shape of the base plate. The three-dimensional structured or unstructured uneven shape of the base plate thus receives a corresponding counter-shape in the side of the heat-conducting layer facing it by compressing the material of the heat-conducting layer. Various compressible materials or plate elements can be used for this purpose, such as compressed graphite plates, honeycomb core plates, or metal foam plates.

[0018] When the individual components of the plate element are assembled—namely, the heat-conducting layer, the register, and the base plate—the heat-conducting layer, due to its material properties, deforms in such a way that it adapts to the shape of the register to form receiving recesses, and simultaneously creates an uneven counter-shape corresponding to the uneven shape of the base plate. The compressible material is thus deformed locally according to the specific conditions, for example, by pressing the individual layers together with a press and then fixing the elements to one another. Such a compressible form of heat-conducting material can have various configurations; for example, graphite plates can be used with appropriate thicknesses to create the three-dimensional uneven shape without any gaps.The depressions and elevations of the uneven base plate are replicated accordingly, ensuring a good connection and consistently flush fit of the heat-conducting layer to the base plate for improved heat and cold transfer into the room. The compressible shape of the heat-conducting layer can be achieved, for example, using permanently deformable foam materials, thermally conductive materials, or similar materials. Reversibly deformable materials can also be used, which are then attached and fixed to one another using appropriate clamps and supports. Preferably, in this design, the plate element is formed such that the registers are integrated within the material of the heat-conducting layer or are directly in contact with the base plate and are shaped accordingly by the heat-conducting layer from the rear.

[0019] According to a further advantageous embodiment of the invention, the heat-conducting layer is provided in the form of at least two-part, compressible plates made of thermally conductive material for sandwich-like mounting of the register between the plates and for the heat-conducting layer being bonded to the uneven base plate by means of a corresponding counter-form. A first compressible plate is provided, resting directly on the base plate, onto which the register is then placed, and subsequently the second compressible plate of the heat-conducting layer is placed over it. After the elements are pressed together, the register is integrated into the heat-conducting layer according to its shape, depending on the thermal profile, pipe shape, or the like, without any gaps or spaces being formed between them.Simultaneously, the counter-shape is formed on the lower compressible plate, corresponding to the uneven form of the base plate, so that a continuous, flat layer of heat conduction without gaps or cavities can be achieved within the plate element. This ensures excellent heat or cold transfer from the register to the base plate. Heat or cold loss is thus largely avoided, and good, uniform radiation of heat and cold over the largest possible area is achieved, also due to the uneven shape of the base plate and the integrated heat conduction layer.

[0020] According to a further advantageous embodiment of the invention, the base plate, the register, and the heat-conducting layer are pressed together and firmly bonded, in particular by adhesive bonding. Pressing achieves the most compact design possible without air inclusions within the panel element. The optional additional adhesive bonding prevents the individual elements from separating from one another later. The combined pressing and bonding can preferably be carried out in a single manufacturing process. This ensures the reliable assembly of the individual components of the panel elements with relatively simple manufacturing steps, and a compact and easily processable panel element can be provided, which is also ideally suited for large-area ceiling or wall heating systems as well as for cooling purposes in larger building areas.Furthermore, the pressing process ensures that all depressions in the uneven three-dimensional shape of the base plate are reliably filled, so that no air pockets or gaps remain in the individual layers after completion of the plate elements.

[0021] According to a further advantageous embodiment of the invention, the heat-conducting layer comprises a heat-conducting material that is initially liquid, sprayable, or flowable and solidifies in its final state, enabling it to conform to the shape of the uneven base plate. An example of such a heat-conducting layer is a gypsum material or a gypsum composite, which, in liquid or flowable form, is poured or applied to a base plate, for example, a trough-shaped one made of sheet metal or similar material, after the pipes of the heat exchanger have been inserted. Other flowable or sprayable materials, such as single-component or multi-component materials with hardeners, can also be used, such as paraffin or liquid cement. The flowable material completely encloses the heat exchanger or its pipes in its liquid or soft state, and the uneven shape of the base plate is simultaneously and completely filled with the corresponding counter-form.After the heat-conducting layer material has solidified due to cooling or a curing reaction, a compact, finished plate element is provided, allowing direct integration of the registers onto the uneven base plates, regardless of their shape, structure, or the design of any depressions or protrusions. In particular, the register containing the cooling or heating medium is thus completely and reliably surrounded on all sides by the heat-conducting material of the heat-conducting layer, irrespective of whether additional heat-conducting profiles, such as plate-shaped supports, ribs, or similar components that improve heat conduction, are provided on the register. Even hard-to-reach cavities, depressions, or areas are thus reliably filled by the heat-conducting layer material. According to the invention, a full-surface contact between the outer base plate and the heat-conducting layer is achieved.Good thermal conductivity values ​​can be achieved in this way.

[0022] According to an advantageous embodiment of the invention, the base plate is a three-dimensionally embossed or formed metal sheet. Such an embossed metal sheet can have different three-dimensional shapes, characterized by uniform or uneven protrusions and depressions distributed across the surface of the base plate. The base plate can have either a structured or an unstructured three-dimensional shape. In all these cases, the shape of the base plate is a plate element with an uneven—i.e., not extending in a single plane—extension of the plate or sheet material.With such a three-dimensional shape, both straight and angled depressions and protrusions can be incorporated, resulting in an overall uneven structure with multiple angles, making it difficult to connect flat heat-conducting materials. The base plate can, for example, be an embossed sheet metal plate with trough-shaped edges and rearward or upward-projecting edges. The base plate can be designed as a single panel or for a single surface heating system. The panel element can also be equipped with connections or couplings for linking and interconnecting several adjacent identical or similar panel elements, enabling the implementation of entire building ceilings or walls as surface heating or cooling systems.The plate element according to the invention particularly comprises a base plate with such an uneven shape, which may also be provided with perforations for the purpose of further acoustic optimization. Other materials and shapes of such uneven base plates, in particular also combined composite plates, can likewise be used within the scope of the present invention.

[0023] According to a further advantageous embodiment of the invention, the register is provided with heat-conducting profiles within or on the heat-conducting layer. In a form embedded in the material of the heat-conducting layer, the heat-conducting profiles are thus directly integrated into the material of the heat-conducting layer. In an embodiment in which a prefabricated plate formed with the uneven counterpart is used as the heat-conducting layer, the heat-conducting profiles, if they are implemented, for example, as plates on pipes, can also be placed flush with the top surface (opposite the base plate). For this purpose, a flat surface is provided on the heat-conducting layer. The uneven counterpart is located on the underside facing the base plate in order to be inserted into the corresponding uneven shape of the three-dimensionally formed base plate in a form-fitting and flush manner.

[0024] According to a further advantageous embodiment of the invention, the register comprises pipes for a heating or cooling medium with plate-shaped heat-conducting profiles attached to them or permanently affixed, for example, by soldering, gluing, or welding. The plate-shaped heat-conducting profiles improve the surface transfer of heat or cold to the heat-conducting layer and thus to the base plate facing the interior of the building. Other shapes of heat-conducting profiles, such as rib-shaped or star-shaped heat-conducting profiles, can also be attached to or affixed to the pipes.

[0025] According to a further advantageous embodiment of the invention, an adhesive layer is provided for bonding the base plate, heat-conducting layer, and / or registers together. This creates a secure, permanent bond. The individual parts of the plate element are so firmly connected that they can subsequently be easily transported, processed, and installed without the risk of individual areas and components of the plate elements detaching.

[0026] According to a further advantageous embodiment of the invention, the register for the heating or cooling medium rests on a flat surface of the heat-conducting layer facing away from the uneven base plate. For this purpose, the heat-conducting layer is specifically provided with a flat back or top surface onto which the heat-conducting profiles and other connection elements can be directly attached. The surface facing the side of the base plate, on the other hand, is uneven and features a corresponding counter-form in a three-dimensionally structured or unstructured design. In this way, the connection and maintenance of other elements, in particular the heating and cooling registers, is easier to implement and does not require complete integration or embedding in the material of the heat-conducting layer. The heat-conducting layer and base plate can thus also be manufactured in advance independently of the shape of a register.

[0027] According to a further advantageous embodiment of the invention, the heat-conducting layer has a pre-formed uneven counter-shape in a solid, thermally conductive material, corresponding to the uneven, three-dimensional shape of the base plate. The material of the heat-conducting layer is therefore a solid material with good thermal or cold conductivity properties. The material is processed by forming steps, such as mechanical machining or the like, so that it has an uneven counter-shape corresponding to the three-dimensional uneven shape of the base plate. The pre-formed uneven counter-shape of the heat-conducting layer simply needs to be inserted into the corresponding uneven base plates and connected to them, for example, by means of adhesive bonding or other supports or fasteners. The other elements, such as...The register for the cooling or heating medium can be easily attached directly to flat surfaces. By creating appropriate grooves or channels, the register can also be integrated into the material of such a heat-conducting layer. This also allows for easy fixing and attachment to ceilings or walls without creating unwanted gaps or cavities.

[0028] Further advantages, features, and aspects of the present invention will be described in more detail below with reference to several exemplary embodiments and the accompanying drawings. The drawings show: Fig. 1a, Fig. 1b respective sectional views of a first embodiment of a plate element according to the invention for surface heating with a two-part, plate-shaped heat-conducting layer and integrated heating or cooling register, wherein Fig. 1a an exploded view and Fig. 1b Fig. 2a, Fig. 2b show the assembled state of the plate element; Fig. 2b shows sectional views of a second embodiment of a plate element according to the invention with a liquid, curable or solidified mass for producing the heat-conducting layer, wherein Fig. 2a the state of manufacture and Fig. 2b the completed panel element with integrated heating or cooling register; Figs. 3a to 3c show sectional views of a third embodiment of a panel element according to the invention for surface heating with a heating or cooling register with heat-conducting profiles, wherein Fig. 3a und 3b the state of manufacture of the plate element and Fig. 3c the completed plate element; and Figs. 4a to 4c show sectional views of a fourth embodiment of a plate element according to the invention with a preformed uneven heat-conducting layer, wherein Fig. 4a und Fig. 4b the manufacturing process and Fig. 4c Show the completed panel element with the heating or cooling register attached to the heat-conducting profile.

[0029] The Fig. 1a und Fig. 1b The figures show, in sectional views, a first embodiment of a panel element 10 according to the invention for surface heating or cooling of ceilings or walls of building interiors. The panel element 10 comprises at least a base plate 1, a register 2 through which a heating or cooling medium flows, and a heat-conducting layer 3 which is connected to the base plate 1. In the Fig. 1a The plate element 10 of this first embodiment is shown in an exploded view before the individual components, namely the base plate 1, the register 2 and the heat-conducting layer 3, are connected to each other on a support 11 provided for this purpose by, for example, a pressing device, while in the Fig. 1b The completed plate element 10 according to the invention is shown after connecting and pressing the base plate 1 with the heat-conducting layer and the register 2.

[0030] The plate elements 10 according to the invention have a base plate 1, in particular a metallic one, which has an uneven, three-dimensional shape in its surface area, as shown in the Fig. 1a, 1b The raised areas 5 and the depressions 6 are exemplified by this. The base plate 1 can be a three-dimensionally embossed metal sheet or another plate with an uneven, three-dimensional shape in its surface area. The uneven three-dimensional shape of the base plate 1 can be a uniform shape with a structured design, for example, with uniform square raised areas 5 and depressions 6, or alternatively, it can be an unstructured shape with varying angles and configurations of the raised areas 5 and depressions 6 in an uneven form, for example, as a kind of crinkled pattern.

[0031] A heat-conducting layer 3 made of a material or mass that promotes heat or cold conduction is applied, attached, or connected to the uneven base plate 1 of the plate element 10. The heat-conducting layer 3 can be a layer of several different individual elements or a single heat-conducting layer 3 made of a plate or mass. Furthermore, the plate element 10 according to the invention includes a heating or cooling register 2 for the flow of a heating or cooling medium, which in this first embodiment is shown by way of example with pipes 4 that are laid in a meandering pattern in the plate element 10 and have an inlet and an outlet for connection to a heat transfer fluid (not shown in the drawings).The heat transfer medium enables an optimized heating or cooling effect across the surface of the plate element 10 according to the invention. This effect is transferred as directly as possible into the interior of the building via the heat-conducting layer 3 and the uneven base plate 1, which has a relatively large surface area. According to the invention, the heat-conducting layer 3 is formed with a correspondingly uneven counter-form on its underside, so that it engages positively with the uneven shape of the base plate 1 after assembly. This ensures a continuous, surface-wide connection and bond between the heat-conducting layer 3 and the base plate 1, without any gaps or air spaces in the uneven areas of the protrusions 5 and depressions 6 of the base plate 1.

[0032] After Fig. 1a In this first embodiment, the heat-conducting layer 3 consists of two plates 3.1, 3.2 of a heat-conducting material, between which the register 2 with the pipes 4 for the cooling or heating medium is sandwiched. Subsequently, the heat-conducting layer 3, the register 2, and the base plate 1 located at the bottom are pressed together by applying pressure to a support 11, so that in the final state a compact and relatively thin planar plate element 10 is formed according to the Fig. 1 This results in a configuration in which both the tubes 4 of the register 2 and the uneven surface with the depressions 6 and the protrusions 5 of the base plate 1 are completely filled with the material of the heat-conducting layer 3. In this embodiment, the heat-conducting layer 3 can comprise two or more plates 3.1, 3.2 made of a highly thermally conductive, compressible material. For example, compressed graphite plates or foam plates made of other highly thermally conductive foam material can be used to press and thus compress the material of the heat-conducting layer 3 for the tubes 4 in the finished plate element 10. The register 2 for the heating or cooling medium itself can, for example, be a meandering coil of copper tubes 4, which are provided with appropriate connections for the inlet and outlet of the heat transfer medium.Alternatively, stainless steel or plastic pipe coils can be used.

[0033] The plate elements 10 according to the invention exhibit very good heat dissipation properties because their surface area is further increased by their uneven shape compared to purely flat plate elements of the same type. The plate elements according to the invention can be manufactured relatively cost-effectively by positively interlocking the heat-conducting layer 3 with correspondingly uneven counter-forms to match the uneven shape of the base plate 1. The overall height of the plate elements 10 is relatively low, as is the total weight required for the plate elements 10 due to the comparatively small number of individual components.Such an uneven surface shape of the base plate 1 allows for the creation of structured or unstructured special surfaces of such plate elements 10, which offer advantages in terms of acoustics in interior spaces and, not least, also enable the realization of certain visual effects and interior designs. Overall, the plate element 10 according to the invention is therefore very versatile and can also include further acoustically improving measures, for example, by having the base plate 1 perforated or with holes. The material of the base plate 1 can, for example, be a metal sheet that can be produced with the uneven three-dimensional shape by simple stamping or embossing processes.The base plate 1 of the plate elements 10 can have trough-shaped, upwardly projecting, right-angled curved edges on the sides, so that the heat-conducting layer 3 can be completely accommodated in the interior of the trough-shaped base plates 1 thus formed.

[0034] The plate elements 10 according to the invention have the advantage that significantly improved heat or cold dissipation can be achieved with such surface heating or cooling systems. Furthermore, the heat conduction register 2 can be easily integrated and fixed into different shapes of such base plates 1 of the plate elements 10 without any structural differences in the coupling. The tubes 4 of the heat conduction register 2 can, for example, be integrated into the interior of the material of the heat-conducting layer 3 with or without heat-conducting profiles 7 (see the following embodiments) or applied to and fixed on the material of the heat-conducting layer 3.Last but not least, the shaped panel element 10 also offers advantages with regard to installation and fixing to ceilings or walls of buildings: The panel elements 10 can be mounted relatively close to the respective wall or ceiling of the building, for example by means of lateral brackets or clamps on the edges of the base plate 1. It is therefore not necessary to provide an additional gap or open space within the panel elements 10 for the register 2 of the cooling technology. This results in significantly reduced installation heights for such panel elements 10, enabling optimized design of such surface heating or cooling systems.

[0035] In Fig. 2a und Fig. 2b A second embodiment of a plate element 10 according to the invention, as well as the steps for its manufacture, are schematically illustrated in respective lateral sectional views. The plate element 10 according to this second embodiment comprises a heat-conducting mass 8 or liquid as a heat-conducting layer 3. This mass or liquid is poured into the area of ​​the base plate 1, which has an uneven surface with protrusions 5 and depressions 6 or other irregularities, after the insertion of the register 2 for the heating or cooling medium (in this example, in the form of tubes 4). The initially liquid heat-conducting material 8 is thus initially flowable and is poured onto the base plate 1 after the insertion of the register 2 and subsequently hardens, as shown in the illustration. Fig. 2a This is shown schematically. A liquid, sprayable, or flowable mass or material composition with good thermal conductivity properties, such as a gypsum-based material with or without heat-conducting particles or granules, can be used as a thermally conductive mass 8 for the material in the thermal conductivity layer 3. Other materials, such as single-component or multi-component materials, can also be used. For example, paraffin or liquid cement are also possible materials for the thermal conductivity layer.

[0036] In the Fig. 2b After the curing of the mass 8 of the heat-conducting layer 3, the completed plate element 10 is shown, in which the uneven shapes of the base plate 1 with the protrusions 5 and depressions 6 are completely filled and depicted as a form-identical counterpart. Likewise, the tubes 4 of the register 2 are completely surrounded by the heat-conducting material of the heat-conducting layer 3 without any gaps. In this second embodiment of the invention, the plate element 10 is provided with a cooling register 2 that is completely embedded in and surrounded by the material of the heat-conducting layer 3. Furthermore, the tubes 4 of the register are at least partially in direct contact with the uneven base plate 1. Fig. 2a shown. Alternatively, the register 2 can also be only partially embedded or, alternatively, provided only outside the material of the heat-conducting layer 3. Further connections or connecting webs as heat-conducting profiles 7 (see following embodiments) can also be attached to the pipes 4 of the register 2 in order to achieve even better heat or cold transfer from the heat transfer medium to the surface of the plate elements 10 facing the interior of the building (underside of base plate 1 in the figures).

[0037] A third embodiment of a plate element 10 according to the invention is shown in the schematic sectional views of the Fig. 3a, Fig. 3b und Fig. 3c shown. In this third embodiment, the heat-conducting layer 3 is also produced from an originally flowable or liquid heat-conducting mass 8, which is cast into the unevenly shaped base plate 1 (cf. Fig. 3a ). After the initially flowable mass 8 of the material of the heat-conducting layer 3 has hardened, a flat surface 9 is formed on the upper side of the heat-conducting layer 3 for the connection of the register 2 for the cooling or heating medium (cf. Fig. 3b und Fig. 3c In this third embodiment, the heat-conducting layer 3 has a comparatively small diameter, allowing for an even more compact design and lighter plate elements 10 with optimized thermal performance. The initially liquid, thermally conductive material 8 of the heat-conducting layer 3 is simply poured in a relatively thin layer until it fills the uneven shape of the base plate 1, so that the depressions 6 are completely filled and the protrusions 5 are also covered by the material of the heat-conducting layer. After hardening, a virtually flat surface of the heat-conducting layer 3, which is firmly bonded to the base plate 1, is obtained. The cooling technology, in the form of, for example, a register 2 made of tubes 4 and heat-conducting profiles 7 (optional), can then simply be placed on this flat surface 9 and attached by gluing or other means.This results in a compact design of plate elements 10 optimized with regard to heat and cold emission for surface heating or cooling, which have a three-dimensional, uneven shape of the base plate 1 on the side facing the interior (underside in the figures of the drawings), for example in the form of regular elevations 5 and depressions 6 (structured 3D surface) or another uneven shape in an unstructured or non-uniform design.

[0038] The plate elements 10 according to the invention thus not only offer advantages with regard to the integrated heating and cooling technology of such surface heating systems, but also acoustic advantages due to the uneven design of the base plate 1. In this embodiment, the plate elements 10 can also be provided with or without additional perforations to further enhance the acoustic effect and improve sound insulation. The illustrated embodiments can also be combined with one another as desired, for example, in the third embodiment using a flowable mass 8, which allows complete embedding of the register 2. Alternatively, a flowable material can be provided as a first layer 3.1 of the heat-conducting layer 3, and a plate-shaped, compressible, heat-conducting material, as in the first embodiment, can be used as a second layer 3.2. Fig. 1a, 1b is used. The combination and variation of the plate elements 10 of these previously presented embodiments is therefore diverse and can be easily varied as needed without leading to significant structural changes and thus cost increases.

[0039] In Fig. 4a, Fig. 4b und Fig. 4c Figure 10 shows a fourth embodiment of a plate element 10 according to the invention for surface heating or cooling of building ceilings or walls, comprising a heating or cooling register 2, in various side views and sectional views. In contrast to the previously described embodiments, the heat-conducting layer 3 here is provided as a three-dimensional shape pre-produced with an uneven counter-form, as shown in Figure 1. Fig. 4a The exploded view shows the thermally conductive layer 3 and the base plate 1 before assembly. The thermally conductive layer 3 can be made of any heat-conducting material and is produced, for example, by machining it with corresponding protrusions 6 and depressions 5 to create the corresponding counterpart to the uneven shape of the base plate 1, which also has such protrusions 5 and depressions 6. The prefabricated thermally conductive layer 3 is then placed onto the base plate 1 and connected to it completely and without gaps by means of a form-fit connection. Alternatively, a connection can also be made using an adhesive layer, so that the elements are then firmly coupled together.The prefabricated plate of the heat-conducting layer 3 of this embodiment can, for example, be made from a gypsum-like sheet material, which, through appropriate milling operations or deformation (casting), acquires the protrusions 6 and depressions 5 with the necessary counter-shape to the uneven three-dimensional form of the base plate 1. The base plate 1 itself can, for example, be a metal sheet and be formed with the uneven three-dimensional shape with the protrusions 5 and the depressions 6 by an embossing step.

[0040] After connecting the heat-conducting layer 3 and the base plate 1 with or without an intervening adhesive layer, the register 2 is placed on the then flat surface of the heat-conducting layer 3 (see figure). Fig. 4b The register 2 can, for example, be provided with pipes 4 for the cooling or heating medium, which may or may not be equipped with an additional heat-conducting profile 7, shown here by way of example in the form of straight profile plates on the underside of the pipes 4. After attaching the registers 2 to the top of the heat-conducting layer 3, the finished plate element 10 according to the invention is thus created according to this fourth embodiment. The same advantages regarding compactness, lightness, and improved thermal conductivity as in the previous embodiments also apply to this embodiment. Last but not least, the plate element 10 thus formed according to the invention also offers considerable advantages with regard to the extent and size of the outer surface towards the interior due to the three-dimensional structured or unstructured shaping of the base plate 1. The effective thermal surface area is thereby increased.This also offers acoustic advantages in addition to the visual variations, since the sound waves are further refracted by the three-dimensional uneven shape. Therefore, according to the invention, it is not absolutely necessary to provide additional means to avoid acoustic disadvantages. The plate elements 10 according to the invention essentially integrate properties optimized with regard to heating and cooling technology as well as acoustic improvements in a surprisingly simple and relatively inexpensive-to-manufacture plate element 10.

[0041] This fourth embodiment can also be combined with the aspects and features of the previous embodiments as desired. For example, here too, the registers 2 can be completely integrated within the material of a heat-conducting layer 3, either by means of additional plates 3.1, 3.2 or by an additional initially flowable mass 8 of thermally conductive material, which, according to the [reference to the figure], Fig. 4c The shown shape is applied separately.

Claims

1. Plate element (10) for surface heating or cooling of ceilings or walls of building interiors, with a metallic base plate (1) facing the interior and with a register (2), directly or indirectly connected thereto, for a heating or cooling medium flowing through the register (2), and with at least one heat-conducting layer (3) between the base plate (1) and the register (2) for heat transfer between the register (2) and the base plate (1), characterised in that the base plate (1) has a three-dimensional, uneven, protruding or recoiling shape over the entire surface area, with elevations (5) and depressions (6), and in that the heat-conducting layer (3), on the side facing the base plate (1), forms a counter-shape corresponding to the uneven shape of the base plate (1) for positive interlocking and continuous flat bonding of the heat-conducting layer (3) to the base plate (1) together with the register (2) for heating or cooling, or in the assembly of the base plate (1) and heat-conducting layer (3).

2. Plate element (10) according to claim 1, characterised in that the register (2) for the heating or cooling medium comprises lines, channels or pipes (4), in particular pipes (4) in a meandering shape, arranged distributed over the surface of the plate element (10).

3. Plate element (10) according to claim 1 or 2, characterised in that the register (2) is at least partially embedded in the material of the heat-conducting layer (3) and is enclosed by the latter in a form-fitting manner.

4. Plate element (10) according to any of the preceding claims, characterised in that the heat-conducting layer (3) has a compressible, heat-conducting material for realising the uneven counter-shape corresponding to the uneven shape of the base plate (1).

5. Plate element (10) according to any of the preceding claims, characterised in that the heat-conducting layer (3) is provided as at least two-part, compressible plates (5, 6) made of thermally conductive material for the sandwich-like accommodation of the register (2) between the plates (5, 6) and for form-fitting connection to the uneven base plate (1) by means of a corresponding counter-shape.

6. Plate element (10) according to any of the preceding claims, characterised in that the base plate (1), the register (2) and the heat-conducting layer (3) are mutually pressed together and firmly connected, in particular by adhesive bonding.

7. Plate element (10) according to any of the preceding claims, characterised in that the heat-conducting layer (3) comprises an originally liquid, sprayable or flowable and in the end state solidified heat-conducting material for form-fitting connection to the uneven base plate (1).

8. Plate element (10) according to any of the preceding claims, characterised in that the base plate (1) is a three-dimensionally embossed or deformed metal sheet, in particular with a perforation.

9. Plate element (10) according to any of the preceding claims, characterised in that the register (2) is provided with heat-conducting profiles (7) within or on the heat-conducting layer (3).

10. Plate element (10) according to any of the preceding claims, characterised in that the register (2) comprises pipes (4, 5) for a heating or cooling medium with plate-shaped heat-conducting profiles (7) attached thereto or fixedly attached thereto.

11. Plate element (10) according to any of the preceding claims, characterised in that an adhesive layer is provided for connecting the base plate (1), heat-conducting layer (3) and / or register (2) to each other.

12. Plate element (10) according to any of claims 1, 2, 4 to 11, characterised in that the register (2) for the heating or cooling medium rests on a flat surface of the heat-conducting layer (3) facing away from the uneven base plate (1).

13. Plate element (10) according to any of the preceding claims, characterised in that the heat-conducting layer (3) has an uneven counter-shape in a solid heat-conducting material corresponding to the uneven, three-dimensional shape of the base plate (1).