Protective layer forming agent for plasma cutting and method for manufacturing a semiconductor chip
DE602019065238T2Active Publication Date: 2025-01-22TOKYO OHKA KOGYO CO LTD
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Patent Information
- Application Number
- DE602019065238
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2019-09-12
- Publication Date
- 2025-01-22
- Estimated Expiration
- 2039-09-12
AI Technical Summary
Technical Problem
Existing methods for plasma dicing of semiconductor wafers face challenges in forming openings of desired shapes at precise positions, leading to inefficiencies and potential damage to the insulating films.
Method used
A thermally decomposable protective film forming agent is developed, comprising a water-soluble resin with a weight loss rate of at least 80% at 500°C, a light absorber, and a solvent, which allows for precise formation of openings by laser irradiation.
Benefits of technology
The protective film forming agent enables the formation of desired-shaped openings with high precision, reducing the risk of damage to the semiconductor chips and improving the overall efficiency of the plasma dicing process.
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