Piezoelectric-on-insulator (POI) substrate and method for producing a piezoelectric-on-insulator (POI) substrate

DE602023011887T2Active Publication Date: 2026-02-11SOITEC SA
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Patent Information

Application Number
DE602023011887
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-03-08
Filing Date
2023-03-03
Publication Date
2026-02-11
Estimated Expiration
2043-03-03

AI Technical Summary

Technical Problem

The significant difference in acoustic impedance between silicon-based substrate materials and silicon oxide dielectric layers in piezoelectric substrates leads to performance losses and parasitic modes in acoustic wave devices, such as sensors and filters.

Method used

A piezoelectric substrate on insulator (POI) design featuring a silicon oxynitride intermediate layer with a variable composition along its thickness, gradually matching the acoustic impedance between the dielectric layer and the support substrate, thereby reducing the impedance difference and minimizing parasitic effects.

Benefits of technology

The design enhances the stability and performance of acoustic wave devices by reducing acoustic impedance differences, leading to improved characteristics and reduced parasitic modes, thus enhancing the functionality of sensors and filters.

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