Partially encapsulated DC link capacitor module and voltage converter
Patent Information
- Application Number
- EP2023733692
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-06-15
- Filing Date
- 2023-06-14
- Publication Date
- 2025-04-23
AI Technical Summary
The high cost and significant quantity of resin required in existing direct current link capacitor modules lead to increased manufacturing costs, necessitating a reduction in resin usage while maintaining effective protection and cooling of the capacitor cells.
A partially coated direct current link capacitor module design featuring a capacitor cell partially immersed in epoxy resin, with a waterproof cover and thermal conductive elements for improved cooling, along with a simplified manufacturing process using complementary shapes and positioning reliefs, reduces resin usage and polymerization time.
This design reduces resin consumption, lowers production costs, enhances protection and cooling of the capacitor cells, and simplifies the manufacturing process, thereby improving the reliability and efficiency of the capacitor module.
Smart Images
Figure 1.1
Abstract
Description
[0001] Description
[0002] Title of the invention: PARTIALLY POTTED DIRECT CURRENT LINK CAPACITOR MODULE AND VOLTAGE CONVERTER
[0003] The invention relates to a DC link capacitor module, to a voltage converter, in particular an inverter, comprising such a DC link capacitor module. The invention also relates to a method for manufacturing such a DC link capacitor module.
[0004] A voltage converter, in particular inverters, comprises a DC link capacitor module for filtering a DC voltage supplied by a DC voltage source. It is known from patent application US20140286064A1, a DC link capacitor module comprising:
[0005] - a capacitor cell comprising a capacitor element comprising a first metallized film and a second metallized film wound together; and a first contact terminal connected to the first metallized film and a second contact terminal connected to the second metallized film,
[0006] - a housing forming a bowl, the at least one capacitor cell being entirely immersed in the bowl,
[0007] - a protective resin poured into the bowl and completely covering at least one capacitor cell.
[0008] Such a DC link capacitor module has the disadvantage of requiring the use of a large amount of resin. Since the cost of the resin and its implementation is high, the cost of the DC link capacitor module is also high.
[0009] The present invention aims to resolve all or part of these drawbacks.
[0010] A direct current link capacitor module comprising:
[0011] - at least one capacitor cell comprising a capacitor element, a first contact terminal and a second contact terminal,
[0012] - a housing forming a bowl, the at least one capacitor cell being at least partially immersed in the bowl,
[0013] - a sealed cover comprising a base and a peripheral wall, the sealed cover covering the capacitor element,
[0014] - a protective resin, in particular an epoxy resin, poured into the bowl, in which a first part of at least one capacitor cell is immersed in the protective resin over a first height and a second part of the at least one capacitor cell, distinct from the first part, is outside the protective resin over a second height, and the peripheral wall comprising an uninterrupted end zone immersed in the protective resin over a third height so that the second part of the at least one capacitor cell is protected in a sealed manner by the sealed cover.
[0015] Such a DC link capacitor module allows for a reduced amount of protective resin used while ensuring good protection of the capacitor cell. In addition, such a reduced amount of resin reduces the time required for resin polymerization. This reduces the cost of the DC link capacitor.
[0016] According to an additional characteristic of the invention, the first contact terminal and the second contact terminal respectively have a first contact end and a second contact end, the first contact end and the second contact end being outside the resin so as to be able to be electrically connected to a plurality of controllable switches of a power electronic module.
[0017] According to an additional feature of the invention, a positioning relief is formed in the housing, the relief being in contact with a guide portion formed in the peripheral edge.
[0018] Such a positioning relief and guide part allows precise positioning of the waterproof cover in the housing. This simplifies the manufacturing of the DC link capacitor module.
[0019] According to a further feature of the invention, the guide portion is formed in the uninterrupted end area of the peripheral wall.
[0020] According to an additional characteristic of the invention, a connection by complementary shapes, in particular by clipping, is made between the at least one capacitor cell and the sealed cover.
[0021] Such a form-fitting connection allows, for example, assembly of the sealed cover and the capacitor cell before their positioning in the bowl formed by the housing. Since only one subassembly is handled during this positioning, manufacturing is simplified. The use of this form-fitting connection as well as the positioning reliefs and guide portion described above allows for even simpler manufacturing by allowing the positioning of the sealed cover and the capacitor cell in the housing at the same time. According to an additional characteristic of the invention, the uninterrupted end zone comprises at least one opening so as to allow the presence of resin inside the sealed cover up to the level of the opening.
[0022] Such an opening allows a portion of the protective resin to penetrate inside the sealed cover over a portion of the third non-zero height and strictly less than the third height. The retention of the sealed cover in the protective resin is thus improved. According to an additional characteristic of the invention, the at least one capacitor cell is in thermal contact with a first interior surface of the bottom of the sealed cover via a first thermally conductive block, in particular a thermal interface material, for example a thermal paste or a thermal pad.
[0023] Such thermal contact via a thermal block improves the cooling of the capacitor cell. This improves the reliability of the DC link capacitor module.
[0024] According to an additional feature of the invention, a first outer surface of the bottom of the sealed cover, opposite the first inner surface of the bottom of the sealed cover, has first cooling fins.
[0025] Such cooling fins help to improve the cooling of the capacitor cell.
[0026] According to an additional characteristic of the invention, the bottom of the sealed cover is at least partially metallic, in particular the first cooling fins, and the first thermally conductive block is electrically insulating.
[0027] According to an additional feature of the invention, the capacitor element comprises a first metallized film and a second metallized film wound together, the first contact terminal being connected to the first metallized film and the second contact terminal being connected to the second metallized film.
[0028] According to an additional feature of the invention, the direct current link capacitor module comprises a plurality of capacitor cells.
[0029] The invention also relates to a voltage converter, in particular an inverter, comprising a direct current link capacitor module as described above and a power module comprising a plurality of controllable switches electrically connected to the first contact terminal and second contact terminal.
[0030] According to an additional feature of the invention, the voltage converter comprises a housing, the housing being formed from material in the housing.
[0031] The invention also relates to a method of manufacturing a direct current link capacitor module as described above comprising the following steps:
[0032] - a first step of providing at least one capacitor cell comprising a capacitor element, a first contact terminal and a second contact terminal,
[0033] - a second stage of supplying a housing forming a bowl,
[0034] - a third step of providing a watertight cover comprising a base and a peripheral wall,
[0035] - a step of positioning the at least one capacitor cell in the bowl so that the at least one capacitor cell is at least partially immersed in the bowl,
[0036] - a step of mounting the waterproof cover on the capacitor element so that the waterproof cover covers the capacitor element, - a step of holding the waterproof cover in position,
[0037] - during the step of holding the sealed cover in position, a step of pouring a protective resin, in particular an epoxy resin, into the bowl so as to immerse a first part of F at least one capacitor cell in the protective resin over a first height and so as to leave outside the protective resin a second part of F at least one capacitor cell over a second height and so that an uninterrupted end zone of the peripheral wall is immersed in the protective resin over a third height,
[0038] - following the pouring step, a step of polymerization of the protective resin.
[0039] According to an additional characteristic of the invention, the method for manufacturing a direct current link capacitor module comprises a step of creating a vacuum relative to atmospheric pressure before the pouring step and a step of reducing the vacuum, in particular creating atmospheric pressure, after the pouring step but before the polymerization step.
[0040] Such a vacuum step and a vacuum reduction step increase the amount of protective resin penetrating into the sealed cover. With this increased amount of protective resin inside the sealed cover, the fixing of the cover and the fixing of the capacitor cell by the resin are improved.
[0041] According to an additional characteristic of the invention, the method for manufacturing a direct current link capacitor module comprises a step of overpressure relative to atmospheric pressure after the pouring step and a step of reducing the overpressure, in particular of bringing to atmospheric pressure, after the polymerization step.
[0042] Such an overpressure step and an overpressure reduction step make it possible to increase the amount of protective resin penetrating inside the sealed cover. Thanks to this increased amount of protective resin inside the sealed cover, the fixing of the cover and the fixing of the capacitor cell by the resin are improved. In addition, after the overpressure reduction step, the pressure inside the sealed cover remains high, substantially at the level at which it was during the overpressure step. This high pressure inside the cover makes it possible to limit or even eliminate a possible problem of gas diffusion from the outside of the sealed cover to the inside of the sealed cover. The inside of the sealed cover is thus protected from pollution coming from outside the sealed cover.In all of the above, the rotor may comprise any number of pole pairs, for example six or eight pole pairs.
[0043] In all of the above, the rotating electrical machine may have a stator having a polyphase electrical winding, for example formed by wires or by conductive bars connected to each other. The rotating electrical machine may comprise a power electronic component, capable of being connected to the on-board network of a vehicle. This power electronic component comprises for example an inverter / rectifier allowing, depending on whether the rotating electrical machine operates as a motor or as a generator, to charge an on-board network of the vehicle or to be electrically powered from this network.
[0044] The invention may be better understood by reading the following description of non-limiting examples of its implementation and by examining the attached drawing in which:
[0045] - [Fig.l] Figure 1 represents an electrical diagram of an electrical voltage converter assembly according to the invention,
[0046] - [Fig.2] Figure 2 represents a partial schematic sectional view of a direct current link capacitor module according to a first embodiment,
[0047] - [Fig.3] Figure 3 represents a partial schematic sectional view of a direct current link capacitor module according to a second embodiment,
[0048] - [Fig.4] Figure 4 represents a partial schematic sectional view of a direct current link capacitor module according to a third embodiment,
[0049] - [Fig.5] Figure 5 represents a partial schematic sectional view of a direct current link capacitor module according to a fourth embodiment,
[0050] - [Fig.6] Figure 6 represents a partial schematic sectional view of a direct current link capacitor module according to a fifth embodiment,
[0051] - [Fig.7] Figure 7 represents a partial schematic sectional view of a direct current link capacitor module according to a sixth embodiment,
[0052] - [Fig.8] Figure 8 represents a partial schematic sectional view of a voltage converter according to the invention,
[0053] - [Fig.9] Figure 9 represents a flowchart of the different steps of a first variant of a method for manufacturing a direct current connection capacitor module according to the invention,
[0054] - [Fig.10] Figure 10 shows a flowchart of the different steps of a second variant of a method for manufacturing a DC link capacitor module according to the invention. In all the figures, elements that are identical or provide the same function bear the same reference numbers. The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference relates to the same embodiment or that the characteristics apply only to a single embodiment. Single characteristics of different embodiments can also be combined or interchanged to provide other embodiments.
[0055] Ordinal numeral adjectives are used to differentiate characteristics. They do not define the position of a characteristic. Therefore, for example, a third characteristic of a product does not mean that the product has a first and / or a second characteristic. Figure 1 shows an electrical assembly 100 in which the invention can be implemented. The electrical assembly 100 is for example intended to be installed in a motor vehicle. The electrical assembly 100 firstly comprises an electrical power source 102 designed to provide a direct voltage U. The electrical power source 102 comprises for example a battery.
[0056] The electrical assembly 100 further comprises a rotating electrical machine 130 comprising several phase windings (not shown) intended to present respective phase voltages.
[0057] The electrical assembly 100 further comprises an electronic system 104.
[0058] In the different embodiments shown in the figures, the electronic system 104 is a voltage converter 104. However, in other embodiments not shown, the assembly can perform a different function.
[0059] The voltage converter 104 is connected between the electrical power source 102 and the rotating electrical machine 130 to convert between the DC voltage U and the phase voltages.
[0060] The voltage converter 104 firstly comprises a positive electrical line 106 and a negative electrical line 108 intended to be connected to the electrical power source 102 to receive the direct voltage U, the positive electrical line 106 receiving a high electrical potential and the negative electrical line 108 receiving a low electrical potential.
[0061] The voltage converter 104 further comprises at least one electronic power module 110 comprising one or more phase electrical lines 122 intended to be respectively connected to one or more phases of the rotating electrical machine 130, to provide their respective phase voltages.
[0062] In the example described, the voltage converter 104 comprises three electronic power modules 110 each comprising two phase electrical lines 122 connected to two phases of the electrical machine 130.
[0063] More specifically, in the example described, the electrical machine 130 comprises two three-phase systems each comprising three phases, and intended to be electrically phase-shifted by 120° relative to each other. Preferably, the first phase electrical lines 122 of the power electronic modules 110 are respectively connected to the three phases of the first three-phase system, while the second phase electrical lines 122 of the power electronic modules 110 are respectively connected to the three phases of the second three-phase system.
[0064] Each power electronic module 110 comprises, for each phase electrical line 122, a first controllable switch 112 connected between the positive electrical line 106 and the phase electrical line 122 and a second controllable switch 114 connected between the phase electrical line 122 and the negative electrical line 108. Thus, the controllable switches 112, 114 are arranged so as to form a chopping arm, in which the phase electrical line 122 forms a midpoint.
[0065] Each controllable switch 112, 114 comprises first and second main terminals 116, 118 and a control terminal 120 for selectively opening and closing the controllable switch 112, 114 between its two main terminals 116, 118 as a function of a control signal applied thereto. The controllable switches 112, 114 are preferably transistors, for example insulated gate bipolar transistors (IGBTs) having a gate forming the control terminal 120, and a drain and a source respectively forming the main terminals 116, 118.
[0066] For example, the controllable switches 112, 114 each have the shape of a plate, for example substantially rectangular, having an upper face and a lower face. The first main terminal 116 extends on the lower face, while the second main terminal 118 extends on the upper face. In addition, the lower face forms a heat dissipation surface.
[0067] The voltage converter 104 further comprises a filtering capacitor 124 having a first terminal 126 and a second terminal 128 respectively connected to the positive electrical line 106 and to the negative electrical line 108. In the voltage converter of FIG. 1, a filtering capacitor 124 is associated with each electronic power module 110. In another embodiment of the invention not shown, the filtering capacitor is associated with several electronic power modules.
[0068] Figure 2 shows a schematic partial sectional view of a direct current link capacitor module 1 according to a first embodiment. The direct current link capacitor module 1 comprises:
[0069] - at least one capacitor cell 2 comprising a capacitor element 3, a first contact terminal 4 and a second contact terminal 5,
[0070] - a housing 7 forming a bowl 8, at least one capacitor cell 2 being at least partially immersed in the bowl 8,
[0071] - a sealed cover 9 comprising a bottom 10 and a peripheral wall 11, the sealed cover 9 covering the capacitor element 3,
[0072] - a protective resin 12, in particular an epoxy resin, poured into the bowl 8.
[0073] A first portion of at least one capacitor cell 2 is immersed in the protective resin 12 over a first height 13. A second portion of at least one capacitor cell 2, distinct from the first portion, is outside the protective resin 12 over a second height 14. The peripheral wall 11 comprises an uninterrupted end zone 15 immersed in the protective resin 12 over a third height 16 so that the second portion of at least one capacitor cell 2 is protected in a sealed manner by the sealed cover 9. The uninterrupted end zone 15 is uninterrupted in that the protective resin 12 is in contact with the peripheral wall 11 over a fourth non-zero height 33 from the surface 34 of the protective resin 12.
[0074] The first contact terminal 4 and the second contact terminal 5 are for example respectively electrically connected to the positive power line 106 and to the negative power line 108. For example, the direct current link capacitor module 1 provides the function of the filter capacitor 124.
[0075] The first contact terminal 4 and the second contact terminal 5 may respectively have a first contact end 17 and a second contact end 18. The first contact end 17 and the second contact end 18 are for example outside the resin so as to be able to be electrically connected to a plurality of controllable switches 112, 114 of a power electronic module 110. For example, the first contact end 17 and the second contact end 18 are respectively welded to a first bus bar and a second bus bar of the power electronic module 110.
[0076] Figure 3 shows a schematic partial sectional view of a DC link capacitor module 1 according to a second embodiment. In the second embodiment, the uninterrupted end zone 15 comprises at least one opening 22 so as to allow the presence of resin inside the sealed cover up to the level of the opening 22. As in the first embodiment, the uninterrupted end zone 15 is uninterrupted in that the protective resin 12 is in contact with the peripheral wall 11 over a non-zero depth from the surface of the protective resin 12. The uninterrupted end zone 15 is for example uninterrupted over a fourth height 33 between the opening 22 and the surface 34 of the protective resin 12.
[0077] In another embodiment of the invention, not shown, the uninterrupted end zone comprises at least one crenellated opening so as to allow the presence of resin inside the sealed cover up to the bottom of the crenellated shape.
[0078] Figure 4 shows a schematic partial sectional view of a DC link capacitor module 1 according to a third embodiment of the invention. The third embodiment of the invention is similar to the first and second embodiments of the invention. In the third embodiment of the invention, a positioning relief 19 is formed in the housing 7, the relief being in contact with a guide portion 20 formed in the peripheral edge 11. For example, the positioning relief 19 comprises a cavity and the guide portion 20 comprises a tenon, the tenon penetrating into the cavity.
[0079] In a variant not shown of the third embodiment of the invention, the guide part is held in the relief, for example by means of a clip-on connection. In a variant not shown of the third embodiment of the invention, several positioning reliefs are formed in the housing, each positioning relief being in contact with a guide part formed in the peripheral edge.
[0080] For example, the guide portion 20 is formed in the uninterrupted end zone 15 of the peripheral wall 11.
[0081] Figure 5 shows a schematic partial sectional view of a direct current connection capacitor module 1 according to a fourth embodiment of the invention. The fourth embodiment of the invention is similar to the embodiments of the invention previously described. In the fourth embodiment of the invention, a form-fitting connection 21 is made between the at least one capacitor cell 3 and the sealed cover 9. For example, the form-fitting connection 21 is a clip-on connection. For example, the clip-on connection is made between the first contact terminal 4 and the sealed cover 9. In the embodiment shown in Figure 5, two form-fitting connections 21 are made. For example, the clip-on connection is made by means of a tab formed in the first contact terminal 4 penetrating into a notch formed in the sealed cover 9.
[0082] In a variant embodiment of the invention not shown, a connection by complementary shapes, in particular by clipping, is made between the second contact terminal and the waterproof cover.
[0083] In a variant embodiment of the invention not shown, a connection by complementary shapes, in particular by clipping, is made between the first contact terminal and the sealed cover and a connection by complementary shapes, in particular by clipping, is made between the second contact terminal and the sealed cover.
[0084] Figure 6 represents a partial schematic sectional view of a direct current link capacitor module 1 according to a fifth embodiment of the invention. The fifth embodiment of the invention is similar to the embodiments of the invention previously described. In the fifth embodiment of the invention, the at least one capacitor cell 2 is in thermal contact with a first inner surface 23 of the bottom 10 of the sealed cover 9 via a first thermally conductive block 24. For example, the first thermally conductive block 24 is a thermal interface material (TIM), in particular a thermal paste or a thermal pad.
[0085] For example, a first outer surface 25 of the bottom of the sealed cover 9, opposite the first inner surface 23 of the bottom 10 of the sealed cover 9, has first cooling fins 26.
[0086] For example, the bottom 10 of the sealed cover 9 is at least partially metallic and the first thermally conductive block 24 is for example an electrical insulator. For example, the first cooling fins 26 are metallic, in particular aluminum. For example, the sealed cover 9 comprises a non-metallic part, in particular plastic. For example, the metallic part of the bottom 10 of the sealed cover 9 is overmolded in the non-metallic part. In another embodiment of the invention, not shown, the first cooling fins are made of a thermally conductive plastic material, for example a plastic material with a filler, for example a metallic filler, in particular a silver (Ag) filler.
[0087] In another embodiment of the invention, not shown, the sealed cover is made entirely of a thermally conductive plastic material, for example a plastic material with a filler, for example a metallic filler, in particular a silver (Ag) filler. For example, a first outer surface of the bottom of the sealed cover, opposite the first inner surface of the bottom of the sealed cover, has first cooling fins.
[0088] Figure 7 represents a partial schematic sectional view of a direct current link capacitor module 1 according to a sixth embodiment of the invention. The sixth embodiment of the invention is similar to the embodiments of the invention previously described. In the sixth embodiment of the invention, at least one capacitor cell 2 is in thermal contact with a second inner surface 29 of the housing 7 via a second thermally conductive block 28. For example, the second thermally conductive block 28 is a thermal interface material, in particular a thermal paste or a thermal pad. For example, a second outer surface 30 of the housing 7, opposite the second inner surface 29 of the housing 7, has second cooling fins 31. For example, the housing 7 is metallic, in particular aluminum.In another example, the housing 7 is made of a thermally conductive plastic material, for example a plastic material with a filler, for example a metallic filler, in particular a silver (Ag) filler.
[0089] In the various embodiments of the invention, the capacitor element 3 may comprise a first metallized film and a second metallized film wound together. The first contact terminal 4 is for example connected to the first metallized film and the second contact terminal 5 is for example connected to the second metallized film.
[0090] In another embodiment of the invention, the capacitor element 3 is of the ceramic, tantalum, electrolytic or polymer type.
[0091] The direct current link capacitor module 1 may comprise a plurality of capacitor cells 2.
[0092] Figure 8 shows a partial schematic sectional view of the voltage converter 104 according to the invention. The voltage converter 104 comprises a direct current link capacitor module 1 and a power module 110 comprising a plurality of controllable switches 112, 114 electrically connected to the first contact terminal 4 and second contact terminal 5. The voltage converter 104 may also comprise a housing 27. The housing 7 is for example formed from material in the housing 27.
[0093] Figure 9 represents a flowchart of the different steps of a first variant of a manufacturing method 200 of the direct current link capacitor module according to the invention. The manufacturing method 200 comprises the following steps:
[0094] - a first step 201 of providing at least one capacitor cell 2 comprising a capacitor element 3, a first contact terminal 4 and a second contact terminal 5,
[0095] - a second step 202 of supplying a housing 7 forming a bowl 8,
[0096] - a third step 203 of providing a sealed cover 9 comprising a base 10 and a peripheral wall 11,
[0097] - a step 204 of positioning the at least one capacitor cell 2 in the bowl so that at least one capacitor cell 2 is at least partially immersed in the bowl 8,
[0098] - a step 205 of mounting the sealed cover 9 on the capacitor element 3 so that the sealed cover 9 covers the capacitor element,
[0099] - a step of holding the waterproof cover 9 in position 206,
[0100] - during the step 206 of holding the sealed cover 9 in position, a step 207 of pouring a protective resin 12, in particular an epoxy resin, into the bowl 8 so as to immerse a first part of the at least one capacitor cell 2 in the protective resin 12 over a first height 13 and so as to leave a second part of the at least one capacitor cell 2 outside the protective resin 12 over a second height 14 and so that an uninterrupted end zone 15 of the peripheral wall 11 is immersed in the protective resin 12 over a third height 16,
[0101] - following the pouring step 207, a polymerization step 210 of the protective resin 12. As seen previously, the uninterrupted end zone 15 is uninterrupted in that the protective resin 12 is in contact with the peripheral wall 11 over a fourth non-zero height 33 from the surface 34 of the protective resin 12.
[0102] For example, the position holding step 206 is carried out using a prior fixing step, for example screwing or clipping the cover 9, in particular screwing or clipping the cover 9 onto the housing 7. In another example, the position holding step 206 is carried out by position holding tooling, in particular a robot manipulator arm.
[0103] The first variant of the method 200 may further comprise a step of creating a vacuum 208 relative to atmospheric pressure before the pouring step 207 and a step of reducing the vacuum 209, in particular of creating atmospheric pressure, after the pouring step 207 but before the polymerization step 210. Figure 10 represents a flowchart of the different steps of a second variant of a manufacturing method 300 of the direct current link capacitor module according to the invention.
[0104] The second variant of the method 300 is similar to the first variant of the method 200. However, the second variant of the method 300 comprises a step 211 of overpressure relative to atmospheric pressure after the pouring step 207 and a step 212 of overpressure reduction, in particular of atmospheric pressure, after the polymerization step 210.
Claims
Demands
1. DC current link capacitor module (1) comprising: a. at least one capacitor cell (2) comprising a capacitor element (3), a first contact terminal (4) and a second contact terminal (5), b. a housing (7) forming a cup (8), the at least one capacitor cell (2) being at least partially immersed in the cup (8), c. a sealing cover (9) comprising a bottom (10) and a peripheral wall (11), the sealing cover (9) covering the capacitor element (3), d.a protective resin (12), in particular an epoxy resin, cast in the cup (8), in which a first part of at least one capacitor cell (2) is immersed in the protective resin (12) to a first height (13) and a second part of the at least one capacitor cell (2), separate from the first part, is out of the protective resin (12) to a second height (14), and the peripheral wall (11) comprising an uninterrupted end zone (15) immersed in the protective resin (12) to a third height (16) so that the second part of the at least one capacitor cell (2) is hermetically protected by the hermetically sealed cover (9).
2. DC current bonding capacitor module (1) according to the preceding claim wherein the first contact terminal (4) and the second contact terminal (5) respectively have a first contact end (17) and a second contact end (18), the first contact end (17) and the second contact end (18) being outside the resin so as to be able to be electrically connected to a plurality of controllable switches (112, 114) of a power electronic module (110).
3. DC bonding capacitor module (1) according to any one of the preceding claims wherein a positioning relief (19) is formed in the housing (7), the relief being in contact with a guide part (20) formed in the peripheral edge (11).
4. DC current bonding capacitor module (1) according to the preceding claim in which the guiding part (20) is formed in the uninterrupted end zone (15) of the peripheral wall (11).
5. DC current bonding capacitor module (1) according to any one of the preceding claims wherein a bond by complementary shapes (21), in particular by clipping, is carried out between at least one capacitor cell (3) and the sealing cover (9).
6. DC current bonding capacitor module (1) according to any one of the preceding claims wherein the uninterrupted end area (15) includes at least one opening (22) so as to permit the presence of resin inside the sealing cover up to the level of the opening (22).
7. DC bonding capacitor module (1) according to any one of the preceding claims wherein at least one capacitor cell (2) is in thermal contact with a first inner surface (23) of the bottom (10) of the sealing cover (9) via a first thermally conductive block (24) in particular a thermal interface material, for example a thermal paste or a thermal pad.
8. DC bonding capacitor module (1) according to the preceding claim wherein a first outer surface (25) of the bottom of the sealing cover, opposite the first inner surface (23) of the bottom (10) of the sealing cover (9), has first cooling fins (26).
9. DC bonding capacitor module (1) according to the preceding claim wherein the bottom (10) of the sealed cover (9) is at least partially metallic, in particular the first cooling fins (26), and the first thermally conductive block (24) is electrically insulating.
10. Voltage converter (104), in particular an inverter, comprising a DC coupling capacitor module (1) according to any one of the preceding claims and a power module (110) comprising a plurality of controllable switches (112, 114) electrically connected to the first contact terminal (4) and second contact terminal (5), in particular the voltage converter (104) comprises a housing (27), the casing (7) being formed of material in the housing (27).
11. A method for manufacturing (200, 300) a DC coupling capacitor module (1) according to any one of claims 1 to 9 comprising the following steps: a. a first step of supplying (201) at least one capacitor cell (2) comprising a capacitor element (3), a first contact terminal (4) and a second contact terminal (5), b. a second step of supplying (202) a housing (7) forming a cup (8), c. a third step of supplying (203) a sealing cover (9) comprising a base (10) and a peripheral wall (11), d. a step of positioning (204) at least one capacitor cell (2) in the cup such that at least one capacitor cell (2) is at least partially immersed in the cup (8), e. a step of mounting (205) the sealing cover (9) on the capacitor element (3) so that the sealing cover (9) covers the capacitor element (3), f. a step of holding in position (206) the sealing cover (9), g. during the step of holding in position (206) the sealing cover (9), a step of pouring (207) a protective resin (12), in particular an epoxy resin, into the bowl (8) so as to immerse a first part of at least one capacitor cell (2) in the protective resin (12) to a first height (13) and so as to leave out of the protective resin (12) a second part of at least one capacitor cell (2) to a second height (14) and so as to immerse an uninterrupted end area (15) of the peripheral wall (11) in the protective resin (12) to a third height (16), h.following the pouring step (207), a polymerization step (210) of the protective resin (12).
12. Manufacturing process (200) according to the preceding claim comprising a step of depressurizing (208) relative to atmospheric pressure before the pouring step (207) and a step of reducing the depression (209), in particular of bringing it to atmospheric pressure, after the pouring step (207) but before the polymerization step (210).
13. Manufacturing process (300) according to claim 11 comprising a step of pressurizing (211) relative to atmospheric pressure after the pouring step (207) and a step of reducing overpressure (212), in particular of reducing to atmospheric pressure, after the polymerization step (210).