Laminating apparatus with preheating device for laminating an electrochemical layer stack

Abstract

A laminating apparatus for laminating an electrochemical layer stack comprises: a movable first workpiece carrier for carrying a layer stack of individual substrates stacked one on top of the other in the form of layers; a preheating device for heating the first workpiece carrier when it is laden with the layer stack; and a laminating press for applying pressure, and optionally also heat, to the layer stack carried by the first workpiece carrier in such a way that the layer stack is thereby pressed against the first workpiece carrier by means of the laminating press in order for the substrates of the layer stack to be bonded to form a laminate. A corresponding laminating process is also described.

Description

[0001] Laminating device with preheating device for laminating an electrochemical layer stack

[0002] The present invention relates to a laminating device for laminating an electrochemical layer stack.

[0003] The electrochemical layer stack can, in particular, be an electrode stack with at least one anode electrode, at least one cathode electrode, and a respective separator between each anode electrode and each cathode electrode. Such a layer stack can, in particular, be an electrode stack for lithium-ion battery cells. For example, it can be an electrode stack for a battery cell for a vehicle battery, in particular a high-voltage battery, which is designed as an energy source for vehicle drives of so-called battery-electric vehicles (BEVs) or hybrid vehicles (HEVs).

[0004] Further examples of such a layer stack are a membrane electrode assembly (MEA) or a membrane electrode frame assembly (MEFA) for a fuel cell, particularly of the PEM type.

[0005] The individual layers of an electrochemical layer stack can consist, in particular, of individual plate-shaped, foil-shaped, or strip-shaped layers that are stacked on top of one another to produce the layer stack and then firmly bonded together by lamination. During lamination, the stacked layers are bonded to form a laminate under pressure and, depending on the lamination method, optionally with additional heat.

[0006] It is an object of the invention to further improve the lamination of electrochemical layer stacks, in particular with regard to the manufacturing efficiency achievable thereby.

[0007] This problem is solved according to the teaching of the independent claims. Various embodiments and further developments of the solution are the subject of the dependent claims.

[0008] A first aspect of the solution presented here relates to a laminating device for laminating an electrochemical layer stack. The laminating device comprises: (i) a movable first workpiece carrier for supporting a layer stack of individual substrates stacked one on top of the other;

[0009] (ii) a preheating device for heating the first workpiece carrier when it is loaded with the layer stack; and

[0010] (iii) a laminating press for applying pressure, and optionally additionally heat, to the layer stack carried by the first workpiece carrier, such that the layer stack is pressed against the first workpiece carrier by means of the laminating press in order to bond the substrates of the layer stack to form a laminate.

[0011] The laminating device is configured to feed the first workpiece carrier, when loaded with the layer stack, to the preheating device in order to heat the first workpiece carrier (and thus also indirectly heat the layer stack via the preheating device), and subsequently to feed the heated and loaded first workpiece carrier to the laminating press for laminating the layer stack.

[0012] The term "laminating device," as used herein, refers to a device, in particular a system with one or more processing stations, designed to bond two or more substrates, in particular sheet- or film-like substrates, into a laminate by lamination. The term "lamination" refers to a joining process in which several overlapping layers (substrates) are joined together to form a multilayer composite material (laminate). Joining the layers can, in particular, comprise pressing the substrates together, applying heat, creating a material-to-material bond, and / or a welding process.

[0013] The term “electrochemical layer stack”, as used herein, is to be understood as a multi-layer stack of different, overlapping substrates which are selected and arranged relative to one another in such a way that together, at least after the laminate has been produced therefrom, they form at least one galvanic cell or an electrochemically active assembly thereof. A galvanic cell can in particular be a primary cell, a secondary cell (accumulator), a tertiary cell (fuel cell), or an electrolysis cell. Some examples of electrochemical layer stacks have already been mentioned above. The term “workpiece carrier”, as used herein, is to be understood as meaning in particular a carrier structure, in particular in the form of a plate or framework, in or on which one or more workpieces can be inserted or removed.can be applied, in particular inserted or placed on top, in order to be able to transport them by a workpiece conveyor along a production device, in particular a production line, through several production stations and to be processed there. The workpiece carrier can in particular have a fixing device for fixing the at least one workpiece to the workpiece carrier. The laminating device according to the first aspect can be considered as such a production device. In the present case, the layer stack serves in particular as the workpiece.

[0014] The term "substrate," as used herein, refers in particular to a homogeneous or heterogeneous material layer. It can be present, in particular, as a solid at room temperature (25°C), so that several such substrates can be stacked by placing them one on top of the other. A substrate can, in particular, have a plate-like, film-like, or strip-like shape, at least in sections. Depending on the type of layer stack to be formed and the layer in question, the material considered can be, in particular, a cathode material, an anode material, a separator material, or a fuel cell membrane.

[0015] With the laminating device according to the first aspect, a high throughput for the laminating process can be achieved, in particular. Several effects can come into play here.

[0016] On the one hand, the layer stack carried by the first workpiece carrier can be indirectly preheated by the preheating device through the heating of the first workpiece carrier, so that the dwell time required for subsequent lamination in the laminating press can be reduced because only less additional heat needs to be introduced into the layer stack to bond the individual layers. Preheating can take place in the laminating device, particularly during the transport of the first workpiece carrier loaded with the layer stack to the laminating press, so that little or even no additional time is required for preheating.

[0017] On the other hand, during preheating, due to the heat input into the layer stack emanating from the heated first workpiece carrier, the layers closer to the first workpiece carrier can be exposed to a greater heat input than the layers further away, resulting in a temperature gradient emanating from the first workpiece carrier. However, the subsequent lamination process in the lamination press can result in an opposite temperature gradient, since the more distant layers, which come into direct contact with the lamination press, can be heated more quickly by the lamination process (through pressure and / or heat input from the lamination press) than the layers closer to the first workpiece carrier, which are only in indirect contact with the lamination press via the first workpiece carrier.

[0018] If, in accordance with the laminating device, preheating precedes the pressing process in the laminating press, the two opposing temperature gradients can at least partially compensate for each other during lamination. The interaction of both heating processes (during preheating on the one hand and during laminating pressing on the other) quickly achieves a temperature profile across the entire stack of layers, particularly one that is approximately constant and necessary to form the lamination between the layers. This counteracts (viewed in the stacking direction) a lag in the heating of one side of the stack of layers compared to the other side, shortening the lamination process and thus achieving higher throughput.This is particularly crucial for shortening the overall throughput time of the lamination process when—as is often the case—the actual lamination process using the lamination press significantly influences the overall throughput time. This can be the case, for example, if the lamination process limits the possible cycle time for the timed serial processing of layer stacks (or simultaneously processable groups of layer stacks).

[0019] In the following, various exemplary embodiments of the laminating device are described, which can each be combined with each other as desired and with the second aspect of the present solution described below, unless this is expressly excluded or is technically impossible.

[0020] In some embodiments, the preheating device comprises a heating element for dissipating heat to the first workpiece carrier. Furthermore, the preheating device is configured to bring the heating element into thermal contact with the first workpiece carrier in order to heat it when the first workpiece carrier is in a preheating position before being fed to the lamination press. In particular, the preheating device can be configured to preheat the heating element itself and bring it to the required temperature, so that it can immediately dissipate heat to the first workpiece carrier without any loss of time as soon as it is brought into thermal contact with it.

[0021] The term “thermal contact”, as used here, is to be understood in particular as a constellation in which a first body (e.g. first workpiece carrier) and a second body (e.g. heating element or cooling element) are brought into direct contact (touching) or into indirect contact via at least one medium located therebetween (e.g. third body) in such a way that a heat exchange (supply and / or removal of heat) is possible between the first body and the second body by means of heat conduction. The thermal conductivity along the heat conduction path for this heat exchange is preferably higher than that of air, preferably at least 1W / (m K), in particular at least 10W / (m K).

[0022] In some embodiments, the preheating device is designed such that the heating element is movable between a waiting position and a heating position, for example horizontally or with a horizontal movement component, wherein the heating element is not in thermal contact with the first workpiece carrier in the waiting position. If, on the other hand, the heating element is in a heating position, it comes into thermal contact with the first workpiece carrier, which is then in the preheating position, in order to be heated in the process. A heating element movable in this way offers the possibility, in particular, of only being introduced into the transport path of the first workpiece carrier and brought into thermal contact with it once the first workpiece carrier loaded with the layer stack has reached the preheating position.In this way, the transport path can be kept clear during the movement of the first workpiece carrier without affecting the subsequent or preceding heating of the first workpiece carrier by the heater.

[0023] In some embodiments, the laminating device further comprises a transport device for transporting the first workpiece carrier along a defined transport path through the laminating device starting from a starting position. The transport path extends over several spaced-apart, in particular parallel, such as horizontal, levels, and the transport device has a lifting device for transporting the first workpiece carrier between two or more of the levels. In this way, on the one hand, a design that is optimized (i.e. compact) with regard to the required footprint for the laminating device can be achieved, since individual processing stations or associated processing processes occurring along the transport path can be arranged one above the base.In this way, even if the laminating device is designed with a high degree of spatial compactness, crossings in the transport path on the same level can be easily avoided and sections of the transport path that lie one above the other or cross one another on different levels can still be realized.

[0024] In some embodiments, the transport device is configured to move the loaded first workpiece carrier by means of the lifting device between one of the superimposed levels, in which the loaded first workpiece carrier can be fed to the lifting device, and another of the superimposed levels, in which the preheating position is located. This allows a level change to be implemented in a confined space. In particular, the preheating device can be combined with the lifting device in such a way that the preheating position of the first workpiece carrier is arranged along a travel path of the lifting device, so that the heating of the first workpiece carrier loaded with the layer stack can take place during the level change and thus in a particularly time-saving manner.

[0025] In some embodiments, the preheating device for heating the first workpiece carrier comprises an induction heater. This is particularly advantageous with regard to short processing times due to the low thermal inertia of an induction heater. In particular, the induction heater can be accommodated in or on the aforementioned heating element. The first workpiece carrier can in particular be configured such that it has a current path, e.g. a conductor loop, for an eddy current subject to ohmic losses that can be generated by the induction heater along the current path, so that the eddy current losses associated with the eddy current, in particular ohmic losses, can be used to heat the first workpiece carrier.

[0026] In some embodiments, the first workpiece carrier has a thermal conductivity of at least 1 W / (m K), in particular at least 10 W / (m K), with respect to a heat conduction path which heat-conductingly connects at least one point in or on the first workpiece carrier, at which heat can be supplied to it by means of the preheating, to at least one support surface on the first workpiece carrier for receiving the layer stack. In this way, on the one hand, the preheating can quickly introduce heat into the first workpiece carrier and, on the other hand, rapid heat dissipation from the heated first workpiece carrier to the layer stack carried by it can occur. In some embodiments, the laminating device further comprises a cooling device for dissipating heat from the laminate after its production by means of the laminating press.Here, the laminating device is configured to feed the first workpiece carrier, once loaded with the laminate after its production, to the cooling device in order to cool the first workpiece carrier (and thus indirectly via the first workpiece carrier, the produced laminate). Cooling the laminate carried by the first workpiece carrier by means of the cooling device can, in turn, shorten the processing time until the laminate, which has cooled sufficiently after lamination, cures and is released.

[0027] In some embodiments, the cooling device comprises a first heat sink for cooling the first workpiece carrier. Furthermore, the cooling device is configured to bring the first heat sink into thermal contact with the first workpiece carrier in order to cool it when the first workpiece carrier loaded with the laminate is in a cooling position located downstream of the lamination press along the transport path.

[0028] In particular, in some of these embodiments, the cooling device is designed such that the first heat sink is movable between a waiting position and a cooling position, for example, horizontally or with a horizontal movement component, wherein the first heat sink is not in thermal contact with the first workpiece carrier in its waiting position, but is in thermal contact with the first workpiece carrier in its cooling position in order to cool it. Similar to the situation with the aforementioned heating element, such a movable heat sink also offers the possibility of being introduced into the transport path of the first workpiece carrier and brought into thermal contact with it only when the first workpiece carrier loaded with the laminate has reached the cooling position.In this way, the transport path can be kept clear during the movement of the first workpiece carrier without impairing the subsequent or preceding cooling of the first workpiece carrier by the heat sink.

[0029] In some embodiments, the cooling device further comprises a second heat sink, and the laminating device is configured to bring the laminate into thermal contact with the second heat sink on its side opposite the first workpiece carrier in order to cool the laminate. This allows for two-sided and thus faster cooling of the laminate. This also serves to shorten the processing time. In some embodiments, the preheating position and the cooling position of the first workpiece carrier are located on the same plane. Furthermore, a position in which the first workpiece carrier is located during the laminating process carried out by means of the laminating press can also be located on this same plane.This allows particularly fast transfers of the loaded first workpiece carrier between these positions without the need for a lift in between, while maintaining the advantages resulting from the multi-level concept with regard to other sections of the transport path due to the very short distances thus made possible between the preheating position, the laminating press and the cooling position.

[0030] In some embodiments, the laminating device further comprises a stacking device configured to apply the layer stack, which is subsequently to be preheated and laminated, to the first workpiece carrier or to produce it by stacking its layers on top of one another while the first workpiece carrier is located at a stacking position, which may in particular be on a different plane than the preheating position and the cooling position. The stacking device is thus arranged upstream of the preheating device with respect to the transport path and may in particular be a processing station of the laminating device located as the first along the transport path. For example, the stacking device may be arranged entirely or partially below or above one of the other processing stations (preheating device, laminating press, cooling device, etc.).) and thus achieve an optimized (small) footprint of the lamination device, in particular because the empty workpiece carrier after the output of the fully processed layer stack can be transported back to the stacking device on a different level than the aforementioned processing stations in order to be reloaded with a new layer stack to be processed. The layer stack can be formed on the workpiece carrier using the stacking device and, after completion, immediately secured by clamping, in particular before further processing begins. It is also conceivable to load several workpiece carriers arranged one behind the other at the same time.In some embodiments, the laminating device further comprises a welding device configured to weld conductor contacts of same-polarity electrodes of the laminate to one another while the first workpiece carrier is located at a welding position, which may in particular be located on a different plane than the preheating position and the cooling position. Here, too, the aforementioned advantages of the multi-plane concept can be realized. The welding device may in particular be located downstream of the cooling position with respect to the transport path, so that welding takes place on the already cooled and thus mechanically more robust state of the laminate (compared to the heated state before cooling).

[0031] In some embodiments, the laminating device further comprises a movable transport carrier for carrying the first workpiece carrier. Furthermore, the laminating device is configured, on the one hand, to move the first workpiece carrier, supported by the transport carrier, through the laminating device during processing of the layer stack, but, on the other hand, to feed the first workpiece carrier loaded with the layer stack to the laminating press for producing the laminate without the transport carrier. In particular, the laminating device can further be configured to move the first workpiece carrier, supported by the transport carrier, through the laminating device before and / or after the laminate is produced by the laminating press.

[0032] Designs with a transport carrier can be used advantageously, particularly when a transport system is to be used for the section-by-section transport of the first workpiece carrier along the transport path. This transport system is designed to transport one or more of the transport carriers (which must be distinguished from the first workpiece carrier). In particular, this can be a transport system designed for a variety of different applications (particularly beyond laminating devices), such as a belt conveyor. The first workpiece carrier can thus be adapted, in particular, for the transport of the layer stack or the resulting laminate, while such adaptation is not required for the transport carrier.Since the transport carrier is not involved in the actual lamination process on the laminating press, unlike the first workpiece carrier, it does not have to be designed in such a way that it has to withstand the pressure acting on the first workpiece carrier during lamination in the laminating press.

[0033] In some embodiments, at least one of the paths along which the first workpiece carrier can be moved along the transport path in sections by the laminating device, carried by the transport carrier, is located on a different plane than a laminating position in which the first workpiece carrier is located when the laminate is produced by means of the laminating press. For this purpose, the laminating device can be configured, in particular, while the first workpiece carrier is separated from the transport carrier, to move the transport carrier along a transport path running on the other plane and thus not through the laminating press to a receiving position at which, after the layer stack has been laminated on the laminating press, the first workpiece carrier loaded with the laminate is reunited with the transport carrier in order to be transported further by the latter.The pick-up position can be located, in particular downstream of the cooling device (if present) in relation to the transport path of the first workpiece carrier. Here, too, the multi-level concept is advantageous, since the first workpiece carrier and the transport carrier can be moved one above the other on the different levels in a space-saving manner, particularly asynchronously, during their separation.

[0034] In some embodiments, the laminating device is further configured, after the laminate completely processed by the laminating device has been removed from the first workpiece carrier, to return the transport carrier together with the now empty first workpiece carrier carried by it along a return path to the starting position. In this way, a particularly periodic (e.g., clocked) circular process can be implemented to increase efficiency, in which the same first workpiece carrier or transport carrier can be used again for processing another layer stack. The return path can, in particular, be located on one of the levels that is not used for the transport path of the first workpiece carrier and / or the transport carrier to an unloading position at which the laminate completely processed by the laminating device is removed from the first workpiece carrier.In this way, the advantages of the multi-level concept can be used again and, particularly in the case of simultaneous movement of several first workpiece carriers and transport carriers in the laminating device, collisions between them can be easily avoided.

[0035] In some embodiments, the first workpiece carrier has an activatable and deactivatable clamping device, by means of which the layer stack can be clamped to the first workpiece carrier. In this way, both the layer stack as a whole and the individual substrates stacked within it can be secured against slipping when the clamping device is activated. However, when the clamping device is deactivated, loading or unloading of the workpiece carrier is possible, since the layer stack is then not secured by the clamping device.

[0036] In particular, the laminating device can be configured to continuously clamp the layer stack carried by the first workpiece carrier after its production and before its transport through the laminating device by activating the clamping device, at least until either the entire processing of the layer stack up to the finished laminate is completed by the laminating device or until, during the production of the laminate in the laminating press, the individual substrates of the layer stack are otherwise secured against slipping by the laminating press and / or by their connection to the laminate before the clamping device is deactivated to release the laminate. In this way, the layer stack can be continuously secured against slipping and thus against resulting manufacturing defects during its processing up to its incorporation into the laminate.

[0037] In some embodiments, the laminating press comprises a hold-down device and is configured to secure the layer stack against slipping from a point in time before or during the production of the laminate by the laminating press by at least partially pressing the layer stack against the first workpiece carrier by means of the hold-down device. The clamping device can thus be deactivated when the hold-down device has taken over the fixation of the layer stack on the first workpiece carrier, without interrupting the fixation of the layer stack.

[0038] The hold-down device can be designed in particular in such a way that it

[0039] Layer stack is subjected to a higher clamping force than the clamping device in order to ensure particularly reliable fixation of the layer stack on or in the first workpiece carrier during the pressing process, which typically exerts strong forces on the layer stack.

[0040] In some embodiments, in addition to the first workpiece carrier, the laminating device also has a number N of further workpiece carriers, in particular of identical construction to the first workpiece carrier, each of which is configured to receive a respective layer stack. Here, N is a natural number, and the laminating device is configured to process each of the N+1 workpiece carriers, including the respective layer stack to be supported thereby, in the same way to produce a respective laminate from the respective layer stack, in particular as described in detail above in connection with the various embodiments of the laminating device for the first workpiece carrier.Thus, up to N+1 layer stacks can be processed simultaneously in the laminating device, each carried by one of the workpiece carriers, in the same way, in particular sequentially one after the other, or in groups simultaneously, or a combination of both. This allows the throughput and thus the efficiency of the laminating device to be further increased. In particular, according to some embodiments, the laminating device can be configured to process a plurality of layer stacks, each to be processed on an associated workpiece carrier, in parallel processing in order to produce a corresponding laminate from each of the layer stacks.In this case, the laminating device can in particular also be configured, within the scope of parallel processing, to hold the workpiece carriers to be processed in parallel in a predetermined relative arrangement to one another. However, the mutual spacing between the adjacent workpiece carriers in the arrangement can be varied such that this spacing for each pair of workpiece carriers is greater during the laminating process on the laminating press than during at least one common transport path of the workpiece carriers upstream or downstream of the laminating press. The relative arrangement can in particular be defined such that the workpiece carriers are arranged parallel to one another in the same orientation.

[0041] The designs of the laminating device mentioned herein, which include a transport device for transporting the first workpiece carrier along a defined transport path through the laminating device, starting from a starting position and extending over several spaced-apart, superimposed levels, and a lifting device, are generally also usable in a (different) laminating device for laminating an electrochemical layer stack if this (different) laminating device does not have the aforementioned preheating. This also applies to all other embodiments described herein and any combinations thereof, unless they themselves technically require the presence of preheating.

[0042] A second aspect of the present solution relates to a method for laminating an electrochemical layer stack. The method comprises: (i) providing a layer stack of substrates stacked in layers on top of one another to be bonded to form a laminate by lamination on a movable first workpiece carrier for supporting the layer stack; (ii) heating the first workpiece carrier loaded with the layer stack; and (iii) following the heating, applying pressure to the layer stack carried by the first workpiece carrier such that the layer stack is pressed against the first workpiece carrier by means of the laminating press in order to bond the substrates of the layer stack to form a laminate.The method according to the second aspect can be configured in particular for implementation using the laminating device according to the first aspect, in particular according to one of the embodiments of the laminating device described herein or a combination of two or more of these embodiments. The laminating device according to the first aspect can be configured in particular for implementation of the method according to the second aspect.

[0043] The features and advantages explained with regard to the first aspect of the solution therefore also apply mutatis mutandis to the method according to the second aspect of the solution.

[0044] Further advantages, features and possible applications of the present solution will become apparent from the following detailed description in conjunction with the figures.

[0045] It shows:

[0046] Fig. 1 shows a schematic cross-sectional view of an exemplary embodiment of a laminating device and at the same time the corresponding sequence of process steps when laminating a layer stack by means of the laminating device;

[0047] Fig. 2 shows various views of an exemplary embodiment of a workpiece carrier loaded with a layer stack to be laminated or a laminate already produced therefrom;

[0048] Fig. 3 shows various views of an exemplary embodiment of a clamp of the workpiece carrier from Fig. 2;

[0049] Fig. 4 shows a perspective view of an exemplary embodiment of a transport carrier for receiving the workpiece carrier from Fig. 2;

[0050] Fig. 5 shows a cross-sectional view of an exemplary embodiment of a preheating arrangement in which the workpiece carrier loaded with the layer stack is located in a preheating position in the preheating device, where it can be heated by means of an induction heater;

[0051] Fig. 6A shows a top view of an exemplary embodiment of an arrangement of multiple workpiece carriers for parallel processing; Fig. 6B shows a top view of an exemplary embodiment of a gripping device for jointly gripping the workpiece carriers from Fig. 6A;

[0052] Fig. 6C is a perspective view of the gripping device of Fig. 6B; and

[0053] Fig. 7A-C a sequence of positions of the laminating press during lamination.

[0054] In the figures, like reference numerals designate like, similar, or corresponding elements. Elements shown in the figures are not necessarily drawn to scale. Rather, the various elements shown in the figures are depicted in such a way that their function and general purpose will be understood by those skilled in the art. Connections and couplings between functional units and elements shown in the figures can also be implemented as indirect connections or couplings, unless expressly stated otherwise.

[0055] Fig. 1 illustrates a cross-sectional view (in a cross-sectional plane spanned by the coordinates X and Z) of a laminating device 100 according to an exemplary embodiment. The laminating device 100 has a plurality of processing stations 102 to 110 arranged along a production line.

[0056] The laminating device 100 has a transport system by means of which a workpiece carrier 200 (see Fig. 2) can be moved along the production line from processing station to processing station. The transport system is configured such that it can transport the workpiece carrier along the production line in sections, supported on another carrier, referred to herein as transport carrier 400 (see Fig. 4).

[0057] In Fig. 1, the outward transport path 114 of the workpiece carrier 200, which runs between the first processing station 102 and the last processing station 110, as well as the outward transport path 116 of the transport carrier 400, which partially coincides with it and also runs between the processing stations 102 and 110, are shown in the XZ plane. However, it is also conceivable for the transport paths to also include paths that have at least one component along the Y direction, which runs orthogonal to the XZ plane. A common return transport path 118, which leads from the processing station 110 back to the first processing station 102 and is traversed by the workpiece carrier together with the transport carrier 400 carrying it during operation of the lamination device 100, is also shown.

[0058] The transport path 114 runs in one section in a first (upper) level 120 extending in the X / Y direction, while in other sections it runs in a lower, second (middle) level 122 also extending in the X / Y direction. The transport path 116 runs continuously in the middle level 122 up to the last processing station. The common return transport path 118 of the workpiece carrier 200 and the transport carrier 400 runs in a third (lower) level 124, which is still below the level 122 and also extends in the X / Y direction. To accomplish the level changes of the workpiece carrier 200 along the transport path 114 and both carriers down to the return transport path 118, the laminating device 100 has lifts designed for this purpose.

[0059] It is optionally possible for the laminating device 100 (as shown in Fig. 1) to have one or more further processing stations 112 along the production line of the processing station 110. In this case, deviating from the previous description of the transport paths, the outward transport paths 114 and 116 extend to the last of the processing stations 112, and the return transport path originates from this last of the processing stations 112. Such a processing station 112 could, for example, be an output device for the laminate producible by means of the laminating device 100 or a laminate stacker for stacking such laminates after their respective production.

[0060] At the beginning of the production line, processing station 102 is a stacking device configured to stack several different substrates onto one another to form an electrochemical layer stack 204 (see Fig. 2). For example, layer stack 204 can comprise a repeatedly repeating sequence of an anode / cathode pair with a separator inserted between the anode and cathode.

[0061] Such layer stacks 204 are known in particular as electrode stacks for high-voltage batteries for supplying vehicle drives, such as electrode stacks for lithium-ion battery cells, in particular in the form of a pouch cell. Other examples of electrochemical layer stacks have already been mentioned at the beginning (e.g. MEA or MEAFA for a fuel cell). During stacking on the stacking device 102, the individual substrates are placed on top of one another in the desired order, e.g. in the order anode-separator-cathode / anode-separator-cathode / etc. that is useful for a series connection of elementary cells (anode, separator, cathode) to form a battery cell. The layer stack is already built up on a workpiece carrier 200 for further processing or is deposited after the stack on the workpiece carrier 200 as a whole or successively in partial stacks.For efficiency reasons, it may be advantageous to build the layer stack 204 directly on the workpiece carrier 200.

[0062] A further processing station along the production line is a preheating device 104, which is configured to heat the layer stack 204 carried by the workpiece carrier 200 (preheating) and thus to a desired target temperature before the actual lamination follows, in which the layer stack is joined together to form the laminate and bonded. Depending on the type of lamination to be performed (e.g., hot lamination), the preheating can serve, in particular, to bring adhesives present on one or more of the substrates or the substrate material itself to or close to a suitable joining temperature for the subsequent lamination.

[0063] The preheating device 104 has a heating element 126 which can be introduced, in particular pivoted or pushed into, the transport path 114 or below the first (upper) level 120, in particular between the first (upper) level 120 and the middle level 122, in such a way that it comes into the immediate vicinity of or even into heat-conducting contact (thermal contact) with the workpiece carrier 200 for heating in order to heat the latter and, via the resulting heating, also introduce heat into the layer stack 204 in order to bring the latter to the target temperature.

[0064] The heating element 126 can, in particular, be traversed by one or more channels through which a heated heating fluid can be passed to heat the heating element. Additionally or alternatively, the heating element 126 can, in particular, have an induction heater configured to generate an alternating magnetic field in the workpiece carrier 200 or parts thereof in order to cause lossy eddy currents there for heating the workpiece carrier. This will be explained in more detail below with reference to Fig. 5. A further processing station along the production line is a laminating press 106, which is configured to join the individual substrates of the layer stack 204 together to form a multilayer laminate by applying pressure (pressing) and optionally supplying additional heat. The laminating press 206 will be explained in more detail below with reference to Figs. 7A-C.

[0065] During pressing, the layer stack is pressed by the press against the heated workpiece carrier 200 that supports it. This results, on the one hand, in a first temperature gradient emanating from the stack side facing away from the workpiece carrier 200 and in direct contact with the press, while, on the other hand, at the beginning of the pressing process, a second temperature gradient emanating from the workpiece carrier 200 is present due to the preheating. The two temperature gradients thus overlap during pressing, resulting overall in a modified, approximately homogeneous temperature profile along the stacking direction of the substrates.

[0066] Thus, two heating processes occurring at different times are available for heating the layer stack to the required joining temperature: preheating at the preheating device 104 and lamination at the laminating press 106. Since the layer stack 204 already has the target temperature, which is at least close to the joining temperature, due to its preheating at the preheating device 104, no or only a shortened period of time is required for the lamination process at the laminating press 106 to bring the layer stack 204 to the joining temperature.

[0067] In this way, a gain in efficiency can be achieved, especially if a synchronized operation of the laminating device is provided, in which several layer stacks, each mounted on an associated workpiece carrier 200, are processed simultaneously at different processing stations in a single cycle. For example, one layer stack can be assembled into a laminate on the laminating press 106 while the next layer stack to be laminated is being preheated in the preheating device 104.

[0068] A cooling device 108 follows as a further processing station along the production line. This cooling device is configured to cool the laminate created in the lamination press from the layer stacks 204, in particular to solidify any cohesive bonds created during lamination. For this purpose, the cooling device has a first cooling body 128, which is designed to be movable, in particular similar to the heating body 126, in order to be introduced into the transport path 114 and brought into thermal contact with the workpiece carrier 200 when the workpiece carrier 200 is in a cooling position for cooling on the cooling device 108. In addition, the cooling device 108 has a second cooling body 130, which can also be movable and is configured to be brought into direct thermal contact with the laminate, for example with the side of the laminate facing away from the workpiece carrier 200. Thus, the laminate can be cooled effectively and quickly on multiple sides.The first heat sink 128 and / or the second heat sink 130 can each be cooled in particular via a coolant that can be passed through one or more channels formed therein.

[0069] As can be seen in Fig. 1, the transport paths 114 and 116 run separately from one another in the area of ​​the preheating device 104, the laminating press 106, and the cooling device 108, while otherwise they coincide. This has the advantage that the transport carrier 400 does not have to be designed for the high thermal or mechanical loads that occur during preheating, pressing, and cooling. In particular, this allows the use of a transport system that can also be used for other applications and thus does not have to be specifically designed for a laminating process. In other embodiments, the use of the transport carrier 400 can be omitted.

[0070] Optionally (depending on the type of layer stack) a further processing station along the production line is a welding device 108, which is configured, in the case of an electrode stack as a layer stack 204, to electrically connect the same-pole electrode contacts of the electrode stack by welding. The electrode contacts can be formed, in particular, in a manner known to those skilled in the art as conductor lugs 206a (positive pole) and 206b (negative pole) projecting laterally from the laminate (see Fig. 2).

[0071] It is optionally possible for some of the processing stations, in particular the preheating device 104, the laminating press 106, and / or the cooling device 108, to be duplicated. In this case, the transport paths can also include paths that have at least one component along the Y-direction running orthogonal to the XZ plane in order to feed workpiece carriers 200 loaded with layer stacks 204 to these additional processing stations.

[0072] Fig. 2 shows various views (a) to (d) of an exemplary embodiment of the workpiece carrier 200, which, depending on the processing stage, is initially loaded with the layer stack 204 to be laminated or, after lamination, with the laminate already produced therefrom. Views (a) and (b) are lateral cross-sectional views along a long side and an end face, respectively, of the loaded workpiece carrier 200. View (c) is a top view of the layer stack 204 or the laminate and the workpiece carrier 200 loaded therewith, and view (d) is a corresponding perspective view.

[0073] The workpiece carrier 200 has a base plate 202 with good electrical conductivity, in particular a metallic base plate. One of its main sides is intended to receive the layer stack 204 or the laminate resulting from it during the process on a support surface and to support it along the production line. To secure the layer stack 204 or the laminate on the workpiece carrier against slipping, several clamps 208 are arranged laterally of the support surface, each of which is configured to press the layer stack 204 or the laminate against the workpiece carrier 200 in order to fix it by means of a clamping action. The clamps 208 will be explained in more detail below with reference to Fig. 3.

[0074] In addition, the workpiece carrier 200 has a plurality of gripping pins 210, in particular nail-head-shaped, on its base plate 202 in order to enable simple and secure gripping and handling of the workpiece carrier 200 by a gripping device (see Fig. 6B) during loading and / or unloading into or out of the laminating device 100 as well as during transport along the production line, in particular by the lifts.

[0075] Fig. 3 shows in various views (a) to (d) an exemplary embodiment of the clamp 208 of the workpiece carrier 200 from Fig. 2. Views (a) and (b) are each side cross-sectional views along a long side or an end face of the clamp 208. View (c) is a plan view of clamp 208 in the direction of the workpiece carrier 200 and view (d) is a corresponding perspective view.

[0076] The clamp 208 has a base part 302, which serves to fasten the clamp 208 to the workpiece carrier 200 and as a (direct or indirect) holding structure for the other components of the clamp 208. A clamp lever 304 is pivotable about a pivot axis 306 and mounted on the base part 302. A spring 308, which can be designed in particular (as shown) as a leg spring mounted on a bolt-like spring carrier 314, is arranged such that it applies a torque to the clamp lever 304 with respect to the pivot axis 306. The spring carrier 314 can be secured to the base part in particular by means of a lock washer 316.

[0077] At one end of the clamping lever 304, a cylindrical roller 310 is mounted so as to rotate about its axis of symmetry. At the other end of the clamping lever 304, a clamping piece 312 is mounted so as to rotate about its central axis. It can, in particular, have a cylindrical basic shape, although flat partial surfaces are optionally formed on the outer surface of the clamping piece to enable it to be placed flat on the layer stack. The spring 308 is arranged such that the torque exerted by it on the clamping lever 304 presses the clamping piece at least partially in the direction of the base plate 202 in order to be able to effect a clamping effect on the layer stack when the latter is located between the support surface on the base plate 202 and the clamping piece.The roller 310 serves to temporarily open the clamp 308 during the lamination process in the laminating press 106 by means of a clamp opener 710 acting on the roller 310, as will be explained in more detail below with reference to Figures 7A-C.

[0078] Fig. 4 shows a perspective view of an exemplary embodiment of the transport carrier 400 for receiving the workpiece carrier 200 from Fig. 2. The transport carrier 400 has a carrier plate 402, in which one or more recesses 404 can optionally be formed (as shown), be they as through-openings, mere depressions, or a combination of both. The recesses can be configured in particular for weight reduction and / or, if present, for receiving protruding parts of the workpiece carrier 200. In addition, one or more stop pieces 406 can be provided for aligning and laterally securing the workpiece carrier 200 during its application and subsequent transport on the transport carrier 400.

[0079] Fig. 5 shows a cross-sectional view of an exemplary embodiment of a preheating arrangement 500, in which the workpiece carrier 200 loaded with the layer stack 204 is located in a preheating position in the preheating device 104 on the heating element 126. The heating element 126 has an induction heater 502 supported by a support structure 504, which is configured to induce lossy eddy currents in the base plate 202 of the workpiece carrier 200 by means of induction, which can heat the base plate 202 and thus indirectly also the layer stack. The heating element 126 can in particular be configured to accommodate a plurality of, for example four, six, or eight, workpiece carriers 200 loaded with a respective layer stack 204.

[0080] In addition, a lifting device with a vertically adjustable gripper can be provided, which lifts one or more workpiece carriers 200 on gripping pins formed thereon from the middle level 122 upwards above the travel plane of the heating element 126 and, after moving the heating element 126, places the workpiece carrier(s) 200 on the heating element 126.

[0081] Fig. 6A shows a top view of an exemplary embodiment of an arrangement 600 of a group of several, here four, workpiece carriers 200a to 200d, wherein the laminating device 100 is configured to transport this group of workpiece carriers 200a to 200d simultaneously along the production line in the sense of parallel processing and to simultaneously process the layer stacks 204 stored thereon or the laminates resulting therefrom. In particular, the workpiece carriers 200a to 200d of the group can be preheated simultaneously, then processed simultaneously in the laminating press, and subsequently cooled in the cooling device 108. Stacking at the stacking device 102 and / or welding in the welding device 110 can also be carried out simultaneously for the entire group, as can any processing in any further processing stations 112.

[0082] Depending on the design of the laminating device 100, the workpiece carriers 200a to 200d of the group can be transported on those paths where the transport paths 114 and 116 coincide, in particular each on a respective separate transport carrier 400 or jointly on a single transport carrier 400. Furthermore, at least in the first-mentioned case, it is possible to define or configure the laminating device 100 such that the movement of the transport carriers 400 and thus the workpiece carriers 200 of the group relative to one another can occur with a variable relative distance 602. For example, it can be achieved that the relative distance 602 in the area of ​​the laminating press is set differently, in particular larger, than in the area of ​​the preheating device 104 and / or the cooling device 108. This makes it possible, for example, to accommodate an increased space requirement of the laminating tools during the laminating process.

[0083] This is illustrated in more detail in Figures 6B and 6C, wherein Fig. 6B illustrates an exemplary embodiment of a gripping device 604 for jointly gripping one or simultaneously several workpiece carriers 200 to be processed together. More specifically, Fig. 6B shows, in a top view, an exemplary embodiment for simultaneously gripping the four parallel-aligned workpiece carriers 200a-d from Fig. 6A. The gripping device 604 consists of two assemblies 608a and 608b, respectively, which are identical in construction except for their mirrored design and are each aligned along the X-direction. In Fig. 6C, the assembly 608a is shown in more detail in a perspective view as an example.

[0084] Each of the assemblies 608a and 608b has one or more grippers 606 for each workpiece carrier to be gripped, in the present example, two grippers 606 per workpiece carrier. The grippers 606, each assigned to a single workpiece carrier 200, form a group and are spaced apart by a fixed distance 614 from one another, which is defined such that the grippers 606 of the group can grip the gripper pins 210 of the workpiece carrier 200 arranged on the side of the workpiece carrier 200 facing them in order to grasp the workpiece carrier 200 and move it in a controlled manner, in particular to raise and / or lower it. The distance 602 between any two adjacent groups, however, is, as already mentioned above, variably adjustable. This can be achieved, in particular, such that each group is mounted on a carriage that is mounted for translational movement in the X direction along a rail 610.To adjust the distance 602, a drive (not shown) arranged on the rail 610 can be provided, which moves the groups or their associated carriages in a translational manner. A drive 612, in particular a spindle drive, can be provided for the joint movement of all groups or grippers in the X direction.

[0085] In order to move the grippers 606 from the respective associated assembly 608a, b along the Y direction towards the respectively assigned gripper pins 210 (and later away from them again) (see movement arrow 616), so that the grippers 606 can grasp the gripper pins 210, the assemblies 608a, b each additionally have a bidirectional drive for this movement.

[0086] By means of the gripping device 604, the workpiece carriers 200 to be processed together (or, if applicable, the single workpiece carrier 200 if purely serial processing is omitted) can be grasped and moved together, in particular during raising or lowering by a lifting device. This can be used in particular to lift the workpiece carriers 200 from the respective assigned transport carriers 400 or, conversely, to place them thereon.

[0087] Figures 7A-C show a sequence 700 of positions of the laminating press 106 during lamination. Fig. 7A shows, in view (a), a starting position of the laminating process. The laminating press 106 has an upper tool 702 and a lower tool 704 as laminating tools. The workpiece carrier 200, with the layer stack 204 fixed thereto by means of the clamps 208, is mounted on the lower tool 704. The upper tool 702 is arranged, at least in part, to be movable relative to the lower tool in order to be able to press the layer stack 204 and workpiece carrier 200 onto the lower tool 704 in a pressing position. The upper tool 702 and / or the lower tool 704 can also be heatable, and one or both of the laminating tools can be spring-mounted (not shown), in particular to limit the maximum contact pressure.

[0088] The upper tool 702 has a press ram 714 for applying pressure to the layer stack 204 when the press ram 714 is moved against the layer stack 204, as will be described below. However, in the initial position according to view (a), the upper tool is not yet in contact with either the workpiece carrier 200 or the layer stack 204 mounted thereon.

[0089] Furthermore, the upper tool 702 has one or more hold-down devices 706, each spring-mounted via a hold-down spring (e.g., coil spring, leaf spring element, gas spring, or pneumatic cylinder), and for each clamp 208 of the workpiece carrier 200, a clamp opener 710, each spring-mounted via a clamp opener spring 712 (e.g., coil spring).

[0090] View (b) in Fig. 7A shows a subsequent position in which the lamination press 106, more precisely the upper tool 702, has left the starting position and moved toward the lower tool 704, so that the hold-down devices 706 have just come into contact with the layer stack 204. The clamp openers 710, on the other hand, have not yet made contact with the workpiece carrier 200.

[0091] View (c) in Fig. 7B shows a further subsequent position in which the upper tool 702 has moved even further in the direction of the lower tool 704, so that the hold-down devices 706 now apply a compressive force to the layer stack 204 and thus additionally fix it to the workpiece carrier 200. The clamp openers 710 have also just come into contact with the respectively assigned clamps 208 of the workpiece carrier 200, more precisely with their rollers 310. However, the clamps 208 are still closed and thus still contribute to the fixation of the layer stack 204 on the workpiece carrier 200. View (d) in Fig. 7B shows an even further subsequent position in which the upper tool 702 has moved even further in the direction of the lower tool 704, so that the hold-down devices 706 continue to apply a compressive force to the layer stack 204 and thus fix the workpiece carrier 200.Each of the clamp openers 710 now presses on the roller 310 of its respective associated clamp 208, exerting a torque on the clamp lever 304 of the clamp 308 that counteracts the spring action of the spring 308 and is stronger than the spring action, causing the clamp to open and its clamping action on the layer stack to be released. The task of securing the layer stack 204 to the workpiece carrier 200 is thus transferred seamlessly from the clamps 308 to the hold-down devices 706.

[0092] View (e) in Fig. 7C shows a further subsequent position in which the upper tool 702 has moved even further in the direction of the lower tool 704, so that compared to the position in view (d), the clamp levers 304 of the clamps 308 have been pivoted open even further by the pressure effect of the clamp openers 710 and completely clear the way for the press ram 714 to the layer stack 204, which continues to be fixed by the hold-down devices 706.

[0093] View (f) in Fig. 7C finally shows a further subsequent position in which the upper tool 702 has moved even further toward the lower tool 704, so that the press ram 714 has rested on the layer stack 204 and presses it against the workpiece carrier held by the lower tool 704, joining the layer stack 204 to form the laminate under pressure and, if necessary, heat from the heatable laminating tools 702 and / or 704. The hold-down devices 706 and the clamp openers 710 are now strongly compressed. Preferably, the surface of the press ram 714 contacting the layer stack 204 is dimensioned such that it completely covers or overlaps the surface of the layer stack 204 facing it.

[0094] The laminating press can then be opened by raising the upper tool 702, and the workpiece carrier 200, along with the former layer stack 204 it carries and which has now been converted into a laminate, can be transported out and further processed along the production line. Transporting out can be carried out, in particular, using the gripping device 604 (see Figures 6B and 6c). In particular, the mutual distance 602 between the workpiece carriers can be varied again, in particular reduced, before, during, or after reaching the subsequent processing station (cooling device 108). The initial loading of the workpiece carrier 200 at the stacking device 102 can be carried out in a comparable manner with regard to the actuation of the clamps 308.This means that the stacking device 102 also has clamp openers of the same or different design as the clamp openers 710, in order to initially open the clamps 308 at least sufficiently by exerting pressure on the respective rollers 310 and thereby bring them into a corresponding loading position so that the layer stack 204 can be applied to the support surface of the workpiece carrier without being obstructed by the clamps 308. The loading position can, in particular, correspond to the position of the clamps 308 shown in view (f) in Fig. 7C.

[0095] LIST OF REFERENCE SYMBOLS

[0096] 100 laminator.

[0097] 102 Stacking device

[0098] 104 Preheating device

[0099] 106 Laminating press

[0100] 108 Cooling device

[0101] 110 Welding device

[0102] 112 if necessary, further processing equipment for the laminate, e.g.

[0103] Output device for the produced laminate or laminate stacker

[0104] 114 Transport path (outward path) of the workpiece carrier

[0105] 116 Transport route (outward journey) of the transport carrier

[0106] 118 common return transport path (return path) for workpiece carriers and

[0107] Transport carrier

[0108] 120 upper level

[0109] 122 middle level

[0110] 124 lower level

[0111] 126 radiators

[0112] 128 first (lower) heat sink

[0113] 130 second (upper) heat sink

[0114] 200, 200a-d Workpiece carrier, loaded with layer stack or already produced laminate

[0115] 202 Base plate of the workpiece carrier

[0116] 204 layer stack or already manufactured laminate

[0117] 206a electrical connection lugs for the positive pole of the layer stack / laminate

[0118] 206b Electrical connection lugs for negative pole of the layer stack / laminate

[0119] 208 clamp with spring-loaded clamp

[0120] 210 gripper pin

[0121] 300 Different views of terminal 208

[0122] 302 base part

[0123] 304 clamp lever

[0124] 306 Swivel axis of the clamp lever 304

[0125] 308 spring

[0126] 310 roller

[0127] 312 clamping piece

[0128] 314 spring carrier

[0129] 316 lock washer

[0130] 400 Transport carrier 402 Carrier plate

[0131] 404 Recess in carrier plate (depression or continuous opening)

[0132] 406 Stop piece for aligning a workpiece carrier on the

[0133] Transport carrier 500 preheating arrangement

[0134] 502 Induction heating, in particular surface induction heating

[0135] 504 Support structure for induction heating

[0136] 600 Arrangement of several workpiece carriers for parallel processing

[0137] 602 mutual distance between adjacent workpiece carriers 700 sequence of positions of the laminating press during laminating

[0138] 702 upper tool

[0139] 704 Lower tool

[0140] 706 hold-down device

[0141] 708 hold-down spring 710 staple opener

[0142] 712 staple opener spring

[0143] 714 press ram

Claims

CLAIMS 1. A laminating device (100) for laminating an electrochemical layer stack (204), the laminating device (100) comprising: a movable first workpiece carrier (200; 200a) (200) for supporting a layer stack (204) of individual substrates stacked one on top of the other in layers; a preheating device (104) for heating the first workpiece carrier (200; 200a) when it is loaded with the layer stack (204); and a laminating press (106) for applying pressure to the layer stack (204) carried by the first workpiece carrier (200; 200a) (200) such that the layer stack (204) is pressed against the first workpiece carrier (200; 200a) (200) by means of the laminating press (106) in order to bond the substrates of the layer stack (204) to form a laminate; wherein the laminating device (100) is configured:200a), when loaded with the layer stack (204), to the preheating device (104) in order to heat the first workpiece carrier (200; 200a) (200) therewith; and subsequently to transport the heated and loaded first workpiece carrier (200; 200a) (200) to be fed to the laminating press (106) for laminating the layer stack (204).

2. The laminating device (100) according to claim 1, wherein: the preheating device (104) comprises a heater (126) for dissipating heat to the first workpiece carrier (200; 200a) (200); and the preheating device (104) is configured to bring the heater (126) into thermal contact with the first workpiece carrier (200; 200a) to heat it when the first workpiece carrier (200; 200a) is in a preheating position before being fed to the laminating press (106).

3. Laminating device (100) according to claim 2, wherein the preheating device (104) is designed such that the heating body (126) is movable between a waiting position and a heating position, wherein the heating body (126) is not in thermal contact with the first workpiece carrier (200; 200a) in the waiting position.

4. Laminating device (100) according to one of the preceding claims, Further comprising a transport device for transporting the first workpiece carrier (200; 200a) along a defined transport path (114, 118) starting from a starting position through the Laminating device (100), wherein the transport path (114, 118) extends over several planes (120, 122, 124) lying one above the other at a distance from one another, and the transport device has a lifting device for transporting the first workpiece carrier (200; 200a) between two or more of the planes (120, 122, 124).

5. Laminating device (100) according to claim 4, wherein the transport device is configured to move the loaded first workpiece carrier (200; 200a) by means of the lifting device between one of the superimposed levels (120), in which the loaded first workpiece carrier (200; 200a) can be fed to the lifting device, and another of the superimposed levels (122), in which the preheating position is located.

6. Laminating device (100) according to one of the preceding claims, wherein the preheating device (104) for heating the first workpiece carrier (200; 200a) comprises an induction heater (502).

7. Laminating device (100) according to one of the preceding claims, wherein the first workpiece carrier (200; 200a) has a thermal conductivity of at least 1W / (m K), in particular at least 10W / (m K) with respect to a heat conduction path which connects at least one point in or on the first workpiece carrier (200; 200a) at which heat can be supplied to it by means of the preheating, to at least one support surface on the first workpiece carrier (200; 200a) for receiving the layer stack (204) in a heat-conducting manner.

8. Laminating device (100) according to one of the preceding claims, further comprising a cooling device (108) for dissipating heat from the laminate after its production by means of the laminating press (106), wherein the laminating device (100) is configured to feed the first workpiece carrier (200; 200a), when loaded with the laminate after its production, to the cooling device (108) in order to cool the first workpiece carrier (200; 200a) there.

9. Laminating device (100) according to claim 8, wherein: the cooling device (108) has a first heat sink (128) for cooling the first workpiece carrier (200; 200a); and the cooling device (108) is configured to bring the first heat sink (128) into thermal contact with the first workpiece carrier (200; 200a) in order to cool it when the first workpiece carrier (200; 200a) loaded with the laminate is in a cooling position located downstream of the laminating press (106) along the transport path.

10. Laminating device (100) according to claim 9, wherein the cooling device (108) is designed such that the first heat sink (128) is movable between a waiting position and a cooling position, wherein the first heat sink (128) is not in thermal contact with the first workpiece carrier (200; 200a) in its waiting position, but is in thermal contact with the first workpiece carrier (200; 200a) in its cooling position in order to cool it.

11. Laminating device (100) according to claim 9 or 10, wherein the cooling device (108) further comprises a second heat sink (130) and the laminating device (100) is configured to bring the laminate into thermal contact with the second heat sink (130) on its side opposite the first workpiece carrier (200; 200a) in order to cool the laminate.

12. Laminating device (100) according to one of claims 8 to 11 in combination with claim 4 or 5, wherein the preheating position and the cooling position of the first workpiece carrier (200; 200a) are located on one of the planes (120).

13. Laminating device (100) according to one of the preceding claims, further comprising a stacking device (102) which is configured to apply the layer stack (204) to be subsequently preheated and laminated to the first workpiece carrier (200; 200a) or to produce it by stacking its layers on top of one another while the first workpiece carrier (200; 200a) is in a stacking position.

14. Laminating device (100) according to one of the preceding claims, further comprising a welding device (110) which is configured to weld together arrester contacts (206a, 106b) of same-pole electrodes of the laminate while the first workpiece carrier (200; 200a) is in a welding position.

15. Laminating device (100) according to one of the preceding claims, further comprising a movable transport carrier (400) for carrying the first workpiece carrier (200; 200a); wherein the laminating device (100) is configured, during the processing of the layer stack (204), to move the first workpiece carrier (200; 200a) carried by the transport carrier (400) in sections through the laminating device (100), and to feed the first workpiece carrier (200; 200a) loaded with the layer stack (204) but without the transport carrier (400) to the laminating press (106) for producing the laminate.

16. Laminating device (100) according to claim 15, wherein the laminating device (100) is further configured to move the first workpiece carrier (200; 200a) in sections before and / or after the production of the laminate by the laminating press (106) carried by the transport carrier (400) through the laminating device (100).

17. Laminating device (100) according to claim 15 or 16 in combination with claim 4 or 5, wherein at least one of the paths along which the first workpiece carrier (200; 200a) is movable along the transport path (114, 118) carried by the transport carrier (400) in sections by the laminating device (100) is located on a different plane (120) than a laminating position in which the first workpiece carrier (200; 200a) is located when the laminate is produced by means of the laminating press (106).

18. Laminating device (100) according to one of claims 15 to 17 in combination with claim 4 or 5, wherein the laminating device (100) is further configured, after removal of the laminate completely processed by the laminating device (100) from the first workpiece carrier (200; 200a), to return the transport carrier (400) together with the now empty first workpiece carrier (200; 200a) carried thereby along a return path to the starting position.

19. Laminating device (100) according to claim 9 in combination with one of claims 15 to 18, wherein the transport carrier (400) comprises the first heat sink (128).

20. Laminating device (100) according to one of the preceding claims, wherein the first workpiece carrier (200; 200a) has an activatable and deactivatable clamping device (208) by means of which the layer stack (204) can be fixed to the first workpiece carrier (200; 200a) by means of clamping.

21. Laminating device (100) according to claim 20, wherein the laminating device (100) is configured to continuously fix the layer stack (204) carried by the first workpiece carrier (200; 200a) by means of clamping after its production and before its transport through the laminating device (100) by activating the clamping device (208) at least until either the entire processing of the layer stack (204) up to the finished laminate by the laminating device (100) is completed or until, during the production of the laminate in the laminating press (106), the individual substrates of the layer stack (204) are otherwise secured against slipping by the laminating press (106) and / or by their connection to the laminate before the clamping device (208) is deactivated to release the laminate.

22. Laminating device (100) according to claim 20, wherein the laminating press (106) has a hold-down device and is configured to secure the layer stack (204) against slipping from a time before or during the production of the laminate by the laminating press (106) by means of at least some pressing of the layer stack (204) by means of the hold-down device against the first workpiece carrier (200; 200a).

23. Laminating device (100) according to one of the preceding claims, wherein the laminating device (100) comprises, in addition to the first workpiece carrier (200; 200a), a number N of further, in particular identical, workpiece carriers (200b,...,200d), each configured to receive a respective layer stack (204). Here, N is a natural number, and the laminating device (100) is configured to process each of the N+1 workpiece carriers (200a,...,200d), including the respective layer stack (204) to be supported thereby, in the same manner to produce a respective laminate from the respective layer stack (204).

24. Laminating device (100) according to claim 23, wherein the laminating device (100) is configured to form a plurality of layer stacks (204) to be processed on an associated one of the workpiece carriers (200a,..., 200d) in the to be processed in parallel processing in order to produce a corresponding laminate from each of the layer stacks (204).

25. Laminating device (100) according to claim 24, wherein the laminating device (100) is configured to hold the workpiece carriers (200a,..., 200d) to be processed in parallel in a predetermined relative arrangement (600) to one another within the scope of parallel processing, wherein, however, the mutual distance between the workpiece carriers (200a,..., 200d) adjacent to one another in the arrangement (600) is or becomes variable such that this distance per pair of workpiece carriers is greater during lamination than during at least one of the laminating presses (106) in the upstream or downstream common transport path of the workpiece carriers (200a,..., 200d).

26. A method for laminating an electrochemical layer stack (204), the method comprising: Providing a layer stack (204) of substrates stacked in layers on top of one another to be joined to form a laminate by lamination on a movable first workpiece carrier (200; 200a) for carrying the layer stack (204); Heating the first workpiece carrier (200; 200a) loaded with the layer stack (204); and following the heating, applying pressure to the layer stack (204) carried by the first workpiece carrier (200; 200a) such that the layer stack (204) is pressed against the first workpiece carrier (200; 200a) by means of the laminating press (106) in order to bond the substrates of the layer stack (204) to form a laminate.

Images