Heat exchanger for an electronic component cooling system

Abstract

Heat exchanger for a cooling system for electronic components. The present invention relates to a heat exchanger (1) for a cooling system for electronic components (5) arranged in a housing (3), said heat exchanger (1) being configured to be arranged in the housing (3) and comprising: - a first section (S1) intended to cool a first part (P1) of the electronic components (5) and comprising: - a fluid-air heat exchange zone comprising a first fluid circuit (C1) configured to receive a heat transfer fluid and, - a fan (7) configured to generate air circulation inside the housing (3) between the fluid-air heat exchange zone and the first part (P1) of the electronic components (5), - a second section (S2) comprising a second fluid circuit (C2, C2') in fluidic communication with the first fluid circuit (C1) and configured to receive the heat transfer fluid,said second section (S2) being intended to cool a second part (P2) of the electronic components (5), said second section (S2) comprising a cooling plate (9) in contact with the second part (P2) of the electronic components (5). Fig.1,

Description

Title of the invention: Heat exchanger for a cooling system for electronic components

[0001] The present invention relates to a heat exchanger for a cooling system for electronic components.

[0002] Servers used for data processing (commonly referred to as information technology or "IT") generally consist of printed circuit boards (PCBs) on which electronic components such as integrated circuits are arranged. These components may include central processing units (CPUs), random access memory (RAM), etc. All these electronic components generate heat when in use. In order to maintain the server's contents at an optimal temperature and maximize server performance, it is essential to dissipate the heat generated and / or cool the components involved.

[0003] In general, electronic components used in servers are air-cooled. A heat sink with fins or similar elements is typically used to dissipate heat into the surrounding air. This heat sink is then placed in contact with the surface of the electronic chip. This contact can be direct or achieved through a thermal interface material between the two components. In addition to the heat sink, one or more fans can be used to circulate air to remove heat from the heat sink. Such a heat sink can be used in combination with cooling on the server installation side, such as air conditioning. However, this cooling method is not particularly efficient.It also has high operating costs and requires very large spaces to manage the air used for cooling.

[0004] Liquid immersion cooling is an alternative to air cooling. In some cases, liquid cooling allows for more efficient heat transfer from electronic components, and therefore greater cooling power. These liquids are, for example, dielectric fluids or mineral oil.

[0005] Liquids having a high specific heat capacity are particularly advantageous.

[0006] However, liquid cooling by immersion imposes significant technical constraints related to the sealing of the casings in which the circuits are immersed. printed materials as well as the weight of these boxes which must be able to be supported by the buildings in which they are installed.

[0007] It is therefore necessary to find a solution that allows for the efficient dissipation of heat from the electronic components of servers while limiting the technical constraints imposed by this cooling of the electronic components.

[0008] To this end, the invention relates to a heat exchanger for a cooling system for electronic components arranged in a housing, said heat exchanger being configured to be arranged in the housing and comprising: - a first section designed to cool a first part of the electronic components and comprising: - a fluid-air heat exchange zone comprising a first fluid circuit configured to receive a heat transfer fluid and, - a fan configured to generate air circulation inside the case between the fluid-to-air heat exchange zone and the first part of the electronic components, - a second section comprising a second fluid circuit in fluidic communication with the first fluid circuit and configured to receive the heat transfer fluid, said second section being intended to cool a second part of the electronic components, said second section comprising a cooling plate in contact with the second part of the electronic components.

[0009] Such a heat exchanger makes it possible to cool several separate elements or several separate circuits from a single source, thus simplifying the circuit. Furthermore, the cooling power can be adapted according to each of the components to be cooled.

[0010] According to another aspect of the present invention, the first fluid circuit comprises a plurality of tubes through which the heat transfer fluid circulates and a plurality of fins arranged around said tubes to maximize heat exchange between the heat transfer fluid and the air.

[0011] According to another aspect of the present invention, the heat exchanger further comprises a temperature sensor configured to measure a temperature associated with the temperature of the first part of the electronic components, the fan being configured to adapt its rotation speed according to the temperature measured by the temperature sensor.

[0012] According to another aspect of the present invention, the cooling plate includes a fluid circulation channel.

[0013] According to another aspect of the present invention, the fluid circulation channel of the cooling plate is in fluidic communication with the first fluid circuit and is configured to receive the heat transfer fluid. In the case of a ca- where the heat transfer fluid corresponds to a two-phase fluid, the heat transfer fluid can then be subcooled in the first fluid circuit and evaporated during its passage through the fluid circulation channel of the cooling plate.

[0014] According to another aspect of the present invention, the heat transfer fluid is a two-phase fluid.

[0015] According to another aspect of the present invention, the second section comprises a two-fluid exchanger, such as a plate exchanger, comprising the second fluid circuit and a third fluid circuit in fluidic communication with the fluid circulation channel of the cooling plate to form a circulation loop configured to receive a two-phase fluid.

[0016] According to another aspect of the present invention, the cooling plate is configured to control the flow of the two-phase fluid by capillary pumping.

[0017] According to another aspect of the present invention, the cooling plate comprises a porous structure forming a wick configured to perform capillary pumping.

[0018] According to another aspect of the present invention, the cooling plate includes a floating valve configured to regulate the flow of the two-phase liquid fluid entering the cooling plate according to the amount of two-phase liquid fluid present in the cooling plate so that the greater the evaporation of the two-phase fluid in the cooling plate, the greater the flow of two-phase liquid fluid entering the cooling plate.

[0019] According to another aspect of the present invention, at least some of the electronic components and the two-fluid exchanger are at least partially immersed in a dielectric fluid so that the heat produced by the at least partially immersed electrical components is transferred to the two-fluid exchanger via the dielectric fluid.

[0020] According to another aspect of the present invention, the heat exchanger further comprises a third section comprising: - an additional cooling plate configured to be at least partially immersed in the dielectric fluid and comprising a circulation loop of an additional heat transfer fluid so that the heat produced by the electrical components at least partially immersed and transferred via the dielectric fluid to the additional cooling plate can be evacuated to the two-fluid exchanger via the additional heat transfer fluid of the loop.

[0021] According to another aspect of the present invention, the additional heat transfer fluid circulation loop of the additional cooling plate is in fluidic communication with the first fluid circuit of the first section such that The additional heat transfer fluid corresponds to the heat transfer fluid.

[0022] According to another aspect of the present invention, the third section comprises an additional two-fluid exchanger, such as a plate exchanger, comprising a fourth fluid circuit in fluidic communication with the first fluid circuit and configured to receive the heat transfer fluid and a fifth fluid circuit in fluidic communication with the additional heat transfer fluid circulation loop of the additional cooling plate.

[0023] According to another aspect of the present invention, the second and third sections comprise a three-fluid exchanger, such as a plate exchanger, comprising a sixth fluid circuit in fluidic communication with the first fluid circuit and configured to receive the heat transfer fluid, a seventh fluid circuit in fluidic communication with the fluid circulation channel of the cooling plate to form the two-phase fluid circulation loop and an eighth fluid circuit in fluidic communication with the additional heat transfer fluid circulation loop of the additional cooling plate.

[0024] According to another aspect of the present invention, the heat exchanger is manufactured at least partially by additive manufacturing.

[0025] The present invention also relates to a system comprising a heat exchanger as described above and electronic components arranged in a housing in which the first part of the electronic devices is associated with a first thermal power and the second part of the electronic devices is associated with a second thermal power, greater than the first thermal power.

[0026] According to another aspect of the present invention, the electronic devices are arranged on a printed circuit board, the second part of the electronic devices comprising a processor and the first part of the electronic devices comprising the other components of the printed circuit board.

[0027] According to another aspect of the present invention, the system is a data server.

[0028] The present invention also relates to a method of using a heat exchanger as described above comprising a circulation loop of a two-phase fluid connecting a hot source and a cold source and in which the two-phase fluid is configured to evaporate when passing through the hot source and to condense when passing through the cold source.

[0029] According to another aspect of the present invention, the hot source comprises one or more electronic components and the cold source comprises a two-fluid or three-fluid exchanger.

[0030] Other advantages and features will become apparent from the description of several illustrative but not limiting examples of the present invention, as well as attached drawings on which:

[0031] [Fig.1] Fig.1 is a schematic representation of a heat exchanger according to a first embodiment of the present invention;

[0032] [Fig.2] The [Fig.2] is a schematic representation of a heat exchanger according to a variant of the first embodiment of the present invention;

[0033] [Fig.3] The [Fig.3] is a schematic representation of a heat exchanger according to a second embodiment of the present invention;

[0034] [Fig.4] The [Fig.4] is a schematic representation of a circulation loop of a two-phase fluid between two thermal devices;

[0035] [Fig.5] The [Fig.5] is a schematic representation of a cooling plate comprising a floating valve allowing regulation of the flow of two-phase fluid;

[0036] [Fig.6] The [Fig.6] is a schematic representation of a heat exchanger according to a third embodiment of the present invention;

[0037] [Fig.7] The [Fig.7] is a schematic representation of a heat exchanger according to a fourth embodiment of the present invention;

[0038] [Fig.8] The [Fig.8] is a schematic representation of a heat exchanger according to a fifth embodiment of the present invention;

[0039] In these figures, identical elements bear the same reference numbers.

[0040] The following embodiments are examples. Although the description refers to one or more embodiments, this does not necessarily mean that each reference relates to the same embodiment, or that the features apply only to a single embodiment. Simple features from different embodiments can also be combined or interchanged to provide other embodiments.

[0041] The present invention relates to a heat exchanger for a cooling system for electronic components, in particular for electronic components of a data server.

[0042] Fig. 1 represents a schematic view of such a heat exchanger 1 according to a first embodiment.

[0043] The electronic components 5 and the heat exchanger 1 are arranged in a housing 3 allowing heat exchange by convection between the heat exchanger 1 and at least some of the electronic components 5.

[0044] The different electronic components 5 can be associated with different thermal powers, that is to say they can generate more or less heat and therefore require a greater or lesser dissipation of heat to limit their temperature.

[0045] The electronic components 5 are, for example, subdivided into a first part PI associated with a first thermal power and a second part P2 associated with a second thermal power greater than the first thermal power.

[0046] The second part P2 of the electronic components 5 includes, for example, a processor 5a (Central Processing Unit (CPU)) or a plurality of processors 5a, and the first part PI of the electronic components 5 includes, for example, random access memory (RAM), transistors, a power supply and other electronic components.

[0047] The set of electronic components 5 can be arranged on a single printed circuit board 6 (“Printed Circuit Board (PCB)” in English).

[0048] The heat exchanger 1 includes a first section SI intended to cool the first part PI of the electronic components 5 via air cooling.

[0049] The first section SI includes a fluid-air heat exchange zone comprising a first fluid circuit Cl made up of a plurality of tubes 11 configured to receive a heat transfer fluid, for example water or glycol water and around which air can circulate inside the housing 3.

[0050] The tubes 11 are for example arranged parallel to each other, in particular in a horizontal direction, and connected to each other by a first collector 14 called the inlet collector and a second collector 16 called the outlet collector.

[0051] The first manifold 14 is for example configured to be connected to a heat transfer fluid supply conduit 12 which supplies the various cabinets (“racks” in English) of the data server and which can be connected to a central heat exchanger (not shown) of the data server.

[0052] The first section SI may in particular include fins 13 arranged around the tubes 11 of the first fluid circuit Cl in order to maximize heat exchange between the heat transfer fluid and the air.

[0053] The tubes 11, the collectors 14 and 16, and the fins 13 are, for example, made of aluminum or steel. The tubes 11 can be brazed onto the collectors 14 and 16.

[0054] Alternatively, the first section SI can be obtained by additive manufacturing in which the various elements are produced by layering (the principle of 3D printing). The layers are, for example, formed from powder and bonded together by laser fusion. The assembly comprising the first section SI and the two-fluid heat exchanger 17 (which will be described later) of the second section S2 can be produced by a single additive manufacturing process.

[0055] The first section Sl can also be made by plates instead of tubes 11 and a porous matrix can be used instead of fins 13. The tube 11-fin 13 assembly can also be replaced by micro-channels.

[0056] The first SI section also includes at least one fan 7 (two in the case of [Fig.l]) configured to generate air circulation inside the housing 3 between the fluid-air heat exchange zone of the first section SI and the electronic components 5, in particular with the first part PI of the electronic components 5.

[0057] The fan 7 is for example disposed near the first SI section and is configured to drive the cooled air in the first SI section towards the first PI part of the electronic components 5 as represented by the dashed line.

[0058] A temperature sensor 15 can be disposed near the second part P2 of the electronic components 5, for example directly on the printed circuit board 6. The rotation speed of the fan(s) 7 can thus be controlled by the measured temperature so that the higher the temperature measured by the temperature sensor 15, the higher the rotation speed of the fan(s) 7.

[0059] The heat exchanger 1 also includes a second section S2 comprising a second fluid circuit C2 in fluidic communication with the first fluid circuit Cl and in which the heat transfer fluid from the first section SL circulates

[0060] The second section S2 is configured to cool the second part P2 of the electronic components 5, in our case the processor 5a.

[0061] In the example of [Fig.1], the second section S2 includes a two-fluid exchanger 17 in which the heat transfer fluid circulates within the second fluid circuit C2 on the one hand and a second fluid, for example a two-phase fluid, within a third fluid circuit C3 on the other hand.

[0062] The two-fluid exchanger 17 is, for example, a plate exchanger.

[0063] In the example of [Fig.1], the second fluid circuit C2 is composed of a plurality of fluidic paths connected on one side to the second manifold 16 of the first section SI and configured on the other side to be connected to a return conduit 18 of the heat transfer fluid.

[0064] The return duct 18 of the heat transfer fluid is for example connected to the central heat exchanger of the data server.

[0065] According to an alternative embodiment shown in [Fig.2], the plurality of fluidic paths is connected to a connecting conduit 20 connected to the second manifold 16 of the second section S2. The heat exchanger 1 of [Fig.2] is otherwise identical to the heat exchanger of [Fig.1].

[0066] The second section S2 also includes a cooling plate 9 disposed in contact with the second part P2 of the electronic components 5, i.e., the processor 5a in the present case. The second part P2 of the electronic components 5 may also include a plurality of processors 5a.

[0067] The cooling plate 9 includes a fluid circulation channel, here the two-phase fluid, connected to the third fluid circuit C3 of the two-fluid exchanger 17 to form a circulation loop B of the two-phase fluid between the cooling plate 9 and the two-fluid exchanger 17.

[0068] The two-phase fluid is chosen such that, during its circulation in the circulation loop B, the two-phase fluid evaporates as it passes through the cooling plate 9, which, together with the second part P2 of the electronic components 5, constitutes a hot source, and condenses as it passes through the two-fluid heat exchanger 17, which constitutes a cold source. This evaporation and condensation allow the two-phase fluid to circulate in the circulation loop B, with the flow rate of the two-phase fluid being greater the higher the power to be dissipated by the cooling plate 9.

[0069] According to an alternative embodiment shown in [Fig. 4], the circulation loop B comprises a porous structure 19 forming a wick at the level of the cooling plate 9. The porous structure 19 is disposed in the circulation channel of the two-phase fluid in the cooling plate 9. The porous structure 19 is configured to control the flow rate of the two-phase fluid by capillary pumping. Indeed, the gaseous phase of the two-phase fluid evaporated in the cooling plate 9 returns to the two-fluid heat exchanger 17 via a first section SE1 of the circulation loop B. This evaporation causes the two-phase fluid in liquid phase from the two-fluid heat exchanger 17 to be drawn into the second section SE2 of the circulation loop B, the two-phase fluid condensing as it passes through the two-fluid heat exchanger 17.

[0070] According to an alternative embodiment shown in [Fig. 5], the circulation loop B includes a floating valve 21 at the level of the cooling plate 9. The floating valve 21 is disposed in the circulation channel of the two-phase fluid of the cooling plate 9. The floating valve 21 is configured to regulate the flow of the two-phase fluid in liquid phase entering the cooling plate 9 according to the quantity of two-phase fluid in liquid phase present in the cooling plate 9 so that the greater the evaporation of the two-phase fluid in the cooling plate 9, the lower the level of the floating valve 21 and the greater the flow of two-phase fluid in liquid phase from the two-fluid exchanger 17 and entering the cooling plate 9.The two-phase gaseous fluid evaporated in the cooling plate 9 returns to the two-fluid heat exchanger 17 via the circulation loop B. The two-phase fluid is then condensed in the two-fluid heat exchanger 17 to return to the cooling plate 9 in a liquid state.

[0071] Thus, the circulation of the two-phase fluid in the circulation loop B can take place without requiring a pump and without any energy input other than the heat produced by the processor 5a in contact with cooling plate 9.

[0072] According to a second embodiment shown in [Fig. 3], the first section SI may be substantially identical to the first section SI of the embodiment of [Fig. 1] and comprises a fluid-air heat exchange zone including a first fluid circuit Cl within which the heat transfer fluid circulates. The first fluid circuit Cl includes, for example, one or more tubes around which fins may be arranged to maximize heat exchange between the heat transfer fluid and the air circulating around the tubes.

[0073] The first section SI also includes one or more fans 7 configured to generate air circulation inside the housing 3 between the fluid-air heat exchange area and the first part PI of the electronic components 5 as represented by the dashed line.

[0074] The second section S2 also includes a cooling plate 9 which may be substantially identical to the cooling plate 9 of the embodiment of [Fig.1] and disposed on the processor 5a.

[0075] In this embodiment, the second fluid circuit C2' comprises a conduit 20, the fluid circulation channel of the cooling plate 9 and a conduit 22 connected to the return conduit 18. The second fluid circuit C2' is in fluidic communication with the first fluid circuit Cl so that the heat transfer fluid circulates in the circulation channel of the cooling plate 9.

[0076] In this embodiment, the circulation of the heat transfer fluid can be ensured via a pump disposed for example in the supply duct 12 or in the return duct 18.

[0077] The heat transfer fluid can be water or glycol water.

[0078] Alternatively, the heat transfer fluid can be a two-phase fluid which is subcooled when passing through the first fluid circuit Cl of the first section SI and then is evaporated when passing through the circulation channel of the cooling plate 9.

[0079] According to a third embodiment shown in [Fig.6], at least some of the electronic components 5 of the housing 3 are at least partially immersed in a dielectric fluid 23.

[0080] Furthermore, the heat exchanger 1 also includes a third section S3. The third section S3 includes an additional cooling plate 25 configured to be at least partially immersed in the dielectric fluid 23 in which the electronic components 5 are immersed. A mixer 29 can be disposed in the dielectric fluid 23 to homogenize the temperature of the dielectric fluid and thus promote the dissipation of heat from the at least partially immersed electronic components 5 via the dielectric fluid 23.

[0081] The third section S3 also includes a circulation loop 27 of the heat transfer fluid which extends into the additional cooling plate 25.

[0082] The first end of the circulation loop 27 is for example connected to the outlet of the second fluid circuit C2 of the two-fluid heat exchanger 17 (which is no longer connected to the return duct 18) so that the heat transfer fluid 17 is received at the inlet of the circulation loop 27 after passing through the two-fluid heat exchanger 17. The outlet of the circulation loop 27 is for example connected to the return duct 18.

[0083] Thus, the heat produced by the electrical components 5, at least partially immersed, is transferred via the dielectric fluid to the additional cooling plate 25 and is evacuated from the additional cooling plate 25 via the heat transfer fluid through the circulation loop 27.

[0084] The heat exchanger 1 and in particular the first SI and second S2 sections can also be substantially identical to the embodiment of [Fig.1].

[0085] According to an unrepresented variant of the third embodiment, the housing 3 is devoid of a dielectric fluid, the heat produced by the electronic components 5 can then be transferred to the additional cooling plate 25 by convection via the air circulating in the housing 3 and / or by radiation and then evacuated via the circulation loop 27.

[0086] According to a fourth embodiment shown in [Fig.7], the third section S3 includes an additional two-fluid exchanger 31, such as a plate exchanger, for example the same exchanger as the two-fluid exchanger 17 of the second section S2.

[0087] The additional two-fluid heat exchanger 31 of the third section S3 includes a fourth fluid circuit C4 in fluidic communication with the first fluid circuit C1 of the first section S1 and the second fluid circuit C2 of the second section S2, through which the heat transfer fluid circulates. The inlet of this fourth fluid circuit C4 is, for example, connected to the outlet of the second fluid circuit C2 of the two-fluid heat exchanger 17 of the second section S2 (which is no longer connected to the return line 18), so that the heat transfer fluid 17 is received in the fourth fluid circuit C4 after passing through the two-fluid heat exchanger 17. The outlet of the fourth fluid circuit C4 is, for example, connected to the return line 18.

[0088] The additional two-fluid heat exchanger 31 of the third section S3 also includes a fifth fluid circuit C5 in which an additional heat transfer fluid circulates. The fifth fluid circuit C5 is in fluidic communication with the circulation loop 27 so that the additional heat transfer fluid circulates in the additional cooling plate 25.

[0089] In certain embodiments, the heat transfer fluid circulation loop in the additional cooling plate 25 has at least two passes, and a fluid connection between the two passes with a bypass device, active or passive, configured to open or close the connection between the two passes so as to be able to reduce the fluid circuit by bypassing part of said circuit (i.e. the second pass).

[0090] Advantageously, the exchange surface of the additional cooling plate 25 is minimized or not, which has the effect of modulating the thermal power dissipated by the additional cooling plate 25. In other words, the idea is thus to prevent the circulation of the heat transfer fluid in a part of the additional cooling plate 25 so as not to cool the bubble bath more than necessary.

[0091] This is particularly advantageous in the case of a single-phase fluid, because it allows the flow rate of the heat transfer fluid to be managed independently on one side, and the cooling power of the additional cooling plate 25 on the other.

[0092] According to a fifth embodiment shown in [Fig.8], the second section S2 and the third section S3 are grouped together to form a three-fluid exchanger 33, such as a plate exchanger.

[0093] The three-fluid exchanger 33 includes a sixth fluid circuit C6 in fluidic communication with the first fluid circuit Cl of the first section SI and configured to receive the heat transfer fluid, the sixth fluid circuit C6 being configured to be connected to the return conduit 18, a seventh fluid circuit C7 in fluidic communication with the circulation channel of the cooling plate 9 to form the circulation loop B configured to receive the two-phase fluid and an eighth fluid circuit C8 in fluidic communication with the circulation loop of the additional cooling plate 25 and configured to receive the additional heat transfer fluid.

[0094] The three-fluid exchanger 33 is configured so that the heat from the electronic components 5 is removed by the heat transfer fluid in the return duct 18 via the two-phase fluid of the circulation loop B on the one hand and via the additional heat transfer fluid of the circulation loop 27 on the other hand.

[0095] According to an alternative embodiment not shown, the third section S3 is devoid of an additional cooling plate 25, the heat from the electronic components 5 at least partially immersed in the dielectric fluid is removed by the bi-fluid exchanger 17 or 33 partially immersed via the dielectric fluid.

[0096] The heat exchanger 1 of the various figures can be obtained at least partially by additive manufacturing.

[0097] The invention is not limited to the embodiments described but can be extended to other embodiments obvious to a person skilled in the art. The positioning of the different sections can therefore be different as well as the direction of circulation of the heat transfer fluid so that the latter can circulate first in the second section S2 then in the first SI and / or the second section S2 can be located above the first section SI for example.

[0098] The present invention also relates to a system comprising a heat exchanger 1 as described above and electronic components 5. The system is for example a data server comprising a plurality of heat exchangers 1 as described above connected to a central heat exchanger and a general circuit allowing the circulation of the heat transfer fluid to the various heat exchangers via supply ducts 12 and return ducts 18.

[0099] The present invention also relates to a method of using a heat exchanger 1 as described above comprising a circulation loop of a two-phase fluid, for example the circulation loop B, connecting a hot source, for example the cooling plate 9 in contact with the processor 5a, and a cold source, for example the two-fluid exchanger 17 or three-fluid exchanger 33, and in which the two-phase fluid is configured to evaporate when passing through the hot source, here the cooling plate 9, and to condense when passing through the cold source, here the two-fluid exchanger 17 or three-fluid exchanger 33. The flow rate of the two-phase fluid is, for example, controlled by a floating valve 21 or a porous structure 19 forming a wick configured to perform capillary pumping.

[0100] Thus, the present invention makes it possible, by using a heat exchanger comprising at least two sections providing at least two types of cooling from a single heat transfer fluid, to efficiently cool electronic components having different thermal powers while limiting the weight of the electronic component cooling device.

Claims

Demands

1. Heat exchanger (1) for a cooling system for electronic components (5) arranged in a housing (3), said heat exchanger (1) being configured to be arranged in the housing (3) and comprising: - a first section (S1) intended to cool a first part (P1) of the electronic components (5) and comprising: - a fluid-air heat exchange zone comprising a first fluid circuit (C1) configured to receive a heat transfer fluid and, - a fan (7) configured to generate air circulation inside the housing (3) between the fluid-air heat exchange zone and the first part (P1) of the electronic components (5), - a second section (S2) comprising a second fluid circuit (C2, C2') in fluidic communication with the first fluid circuit (C1) and configured to receive the heat transfer fluid,said second section (S2) being intended to cool a second part (P2) of the electronic components (5), said second section (S2) comprising a cooling plate (9) in contact with the second part (P2) of the electronic components (5), the cooling plate (9) comprising a fluid circulation channel, and the second section (S2) comprising a two-fluid exchanger (17), such as a plate exchanger, comprising the second fluid circuit (C2) and a third fluid circuit (C3) in fluidic communication with the fluid circulation channel of the cooling plate (9) to form a circulation loop (B) configured to receive a two-phase fluid.

2. Heat exchanger (1) according to the preceding claim in which the first fluid circuit (Cl) comprises a plurality of tubes (11) through which the heat transfer fluid circulates and a plurality of fins (13) arranged around said tubes (11) to maximize heat exchange between the heat transfer fluid and the air.

3. Heat exchanger (1) according to any one of the preceding claims comprising a temperature sensor (15) configured to measure a temperature associated with the temperature of the first part (PI) of the electronic components (5) and in which the fan (7) is configured to adapt its rotational speed according to the temperature measured by the temperature sensor (15).

4. Heat exchanger (1) according to claim 1 in which the cooling plate (9) is configured to control the flow of the two-phase fluid by capillary pumping.

5. Heat exchanger (1) according to claim 1 wherein the cooling plate (9) comprises a floating valve (21) configured to regulate the flow of the liquid-phase two-phase fluid entering the circulation channel of the cooling plate (9) according to the amount of liquid-phase two-phase fluid present in the circulation channel of the cooling plate (9) such that the greater the evaporation of the two-phase fluid in the circulation channel of the cooling plate (9), the greater the flow of liquid-phase two-phase fluid entering the circulation channel of the cooling plate (9).

6. Heat exchanger (1) according to any one of the preceding claims wherein at least some of the electronic components (5) and the two-fluid exchanger (17) are at least partially immersed in a dielectric fluid (23) such that the heat produced by the at least partially immersed electrical components (5) is transferred to the two-fluid exchanger (17) via the dielectric fluid.

7. Heat exchanger (1) according to the preceding claim wherein the heat exchanger (1) further comprises a third section (S3) comprising: - an additional cooling plate (25) configured to be immersed at least partially in the dielectric fluid (23) and comprising a loop (27) for circulating an additional heat transfer fluid such that the heat produced by the electrical components (5) at least partially immersed and transferred via the dielectric fluid to the additional cooling plate (25) is discharged to the two-fluid heat exchanger (17) via the additional heat transfer fluid of the loop (27).

8. Heat exchanger (1) according to the preceding claim in which the additional heat transfer fluid circulation loop (27) of the additional cooling plate (25) is in fluidic communication with the first fluid circuit (Cl) of the first section (SI) and is configured to receive the heat transfer fluid.

9. Heat exchanger (1) according to claim 7, wherein the third section (S3) comprises an additional two-fluid heat exchanger (31), such as a plate heat exchanger, comprising a fourth circuit of fluid (C4) in fluidic communication with the first fluid circuit (Cl) and configured to receive the heat transfer fluid and a fifth fluid circuit (C5) in fluidic communication with the loop (27) of circulation of additional heat transfer fluid of the additional cooling plate (25).

10. Heat exchanger (1) according to any one of claims 1 to 3 in combination with claim 7 wherein the second (S2) and third (S3) sections comprise a three-fluid exchanger (33), such as a plate exchanger, comprising a sixth fluid circuit (C6) in fluidic communication with the first fluid circuit (Cl) and configured to receive the heat transfer fluid, a seventh fluid circuit (C7) in fluidic communication with the fluid circulation channel of the cooling plate (9) to form the two-phase fluid circulation loop (B) and an eighth fluid circuit (C8) in fluidic communication with the additional heat transfer fluid circulation loop (27) of the additional cooling plate (25).

11. Heat exchanger (1) according to any one of the preceding claims characterized in that it is manufactured at least partially by additive manufacturing.

12. A method of using a heat exchanger (1) according to any one of the preceding claims comprising a two-phase fluid circulation loop connecting a hot source and a cold source and wherein the two-phase fluid is configured to evaporate when passing through the hot source and to condense when passing through the cold source.

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