Cooling device configured to cool an electronic module

Abstract

Title: Cooling Device Configured to Cool an Electronic Module The invention relates to a cooling device (3) configured to cool an electronic module (2) comprising an electronic board (4) on which a plurality of electronic components (5) are mounted, the cooling device comprising: a housing configured to receive the electronic board (4) and the electronic components (5), and to be filled with a dielectric fluid intended to immerse the electronic components, the housing (10) comprising in particular at least one retaining element (11) for the electronic board, a lid (14) configured to close the housing, at least one wall (21, 22) to form a channel for the circulation of dielectric fluid (23), this wall having an upper edge facing the lid and a lower edge facing the bottom of the housing (10), the wall comprising a flexible strip (30,31) on its upper and / or lower edge configured to ensure peripheral sealing along its upper and / or lower edge. Figure for abbreviation: Fig. 1,

Description

Title of the invention: Cooling device configured to cool an electronic module

[0001] The present invention relates in particular to a cooling device configured to cool an electronic module.

[0002] It is known, in the context of cooling an electronic power card, such as that used in a DCDC converter (this converter being intended to transform a voltage of a direct current from a first voltage value to a second voltage value), to use a cooling liquid circulating in a plate which is in contact with the electronic card. Such a system involves a significant fluid flow rate and is energy-intensive. In addition, the architecture of the electronic card can complicate access, in terms of cooling, to the hottest components.

[0003] The present invention aims in particular to further improve the thermal regulation, in particular the cooling, of an electronic module.

[0004] The invention thus relates to a cooling device configured to cool an electronic module comprising an electronic board on which a plurality of electronic components are mounted, the cooling device comprising: - an enclosure configured to receive the electronic board and electronic components, and to be filled with a dielectric fluid intended to immerse the electronic components, the enclosure including in particular at least one retaining element for the electronic board, - a lid designed to close the enclosure, - at least one wall to form a channel for the circulation of dielectric fluid, this wall having an upper edge facing the cover and a lower edge facing the bottom of the enclosure, the wall having a flexible strip on its upper edge and / or its lower edge configured to ensure peripheral sealing along its upper edge and / or its lower edge.

[0005] Thanks to the invention, the dielectric fluid circulation channel makes it possible to direct the dielectric fluid towards electronic components that require stronger cooling than other electronic components of the electronic module. In other words, the invention makes it possible to preferentially direct the dielectric fluid towards the components that require a greater cooling capacity because these components tend to emit more heat than others. components.

[0006] The peripheral seal on the wall(s) forming the channel allows the dielectric fluid to be efficiently directed towards these components requiring significant cooling. The term peripheral seal refers to a seal along the wall, preventing the fluid from bypassing the fluid path defined by the walls.

[0007] According to one aspect of the invention, the cooling device comprises a plurality of walls configured to form the circulation channel, including one or more U-shaped sections.

[0008] Thus the dielectric fluid can follow a path that meanders within the cooling device.

[0009] According to one aspect of the invention, the plurality of walls are parallel to each other, and arranged in a staggered pattern to provide one or more U-shaped forms for the flow.

[0010] According to one aspect of the invention, the flexible strip of the wall is configured to be compressed when the wall is mounted in the enclosure closed by the lid.

[0011] The flexible strip which is compressed ensures a good seal.

[0012] The flexible band can be compressed between the wall and the cover, or the flexible band can be compressed between the wall and the bottom of the enclosure or the electronic module.

[0013] According to one aspect of the invention, the flexible strip extends over the entire length of the upper or lower edge of the wall, preferably continuously.

[0014] According to one aspect of the invention, the wall comprises a flexible band on its upper edge and another flexible band on its lower edge.

[0015] Alternatively, the wall has a flexible band only on one of its lower and upper edges.

[0016] According to one aspect of the invention, when the partition is mounted in the enclosure, the edge of the flexible strip of the partition presses against an electronic component or an obstacle on the electronic board. The obstacle may be, for example, a screw or a retaining clip in the center of the electronic board.

[0017] According to one aspect of the invention, the electronic component(s) on which the flexible wall strip presses are chosen from among the electronic component(s) which heat up the least during operation.

[0018] According to one aspect of the invention, the fluid circulation channel is configured so that, when the electronic module is in place in the enclosure, the electronic component(s) that give off the most heat are present within the channel.

[0019] In other words, the component or components that give off the most heat are next to the flexible strip of the wall, and not underneath.

[0020] Thus, the electronic component(s) that give off the most heat can be better cooled by the fluid flowing within the channel.

[0021] According to one aspect of the invention, the channel can be chosen with a sufficient width so that the component(s) which give off the most heat are at a non-zero distance from the walls of the channel.

[0022] According to one aspect of the invention, the flexible strip has a straight profile.

[0023] According to one aspect of the invention, the flexible strip has a thickness sufficient so that, when the wall presses on electronic components with less heat release, the flexible strip deforms sufficiently to conform to the shape of these electronic components.

[0024] According to one aspect of the invention, this flexible strip can be an initially straight strip which is locally deformed to conform to the shape of the components which can have different heights.

[0025] This flexible strip can thus be deformed by being compressed differently depending on the local height of the electronic components on which the flexible strip rests.

[0026] Alternatively, the wall may have a lower edge with a variable profile, for example crenellated, and the flexible strip follows this variable profile of the lower edge. In another alternative embodiment, the flexible strip has the variable profile.

[0027] This variable profile is chosen to conform to the shape of the electronic components and / or the obstacles on which the flexible strip presses when the wall is in place in the enclosure.

[0028] This configuration is particularly advantageous in the case where the compression of the flexible strip does not allow to absorb all the differences in height of the electronic components and / or obstacles on which the wall rests.

[0029] The variable profile may, for example, have slots of different heights.

[0030] According to one aspect of the invention, the circulation channel is formed by a plurality of walls according to the invention.

[0031] According to one aspect of the invention, the walls form an assembly of walls which, where appropriate, can be a single piece.

[0032] According to one aspect of the invention, the wall assembly comprises a peripheral wall, for example rectangular in shape, and one or more internal walls configured to give the outline of the circulation channel.

[0033] According to one aspect of the invention, the inner walls can be straight and arranged in a staggered pattern to form a flow with successive U-shapes.

[0034] According to one aspect of the invention, the wall assembly is through-hole. In other words, the wall assembly is open on its upper edge and on its lower edge before being mounted in the enclosure closed by the lid.

[0035] This wall assembly rests in a sealed manner on the bottom of the enclosure or on the electronic module, and rests in a sealed manner on the lid.

[0036] The wall assembly is thus sandwiched between, on the one hand, the bottom of the enclosure or the electronic module and, on the other hand, the lid.

[0037] In another embodiment of the invention, the wall assembly comprises a plate covering the upper edges of the peripheral wall and the inner walls. Thus, this wall assembly is non-through.

[0038] According to one aspect of the invention, the plate is made of compressible material.

[0039] Alternatively, the plate is made of the same material as the wall(s).

[0040] Alternatively, the plate is made of a rigid material, in particular non-electrically conductive.

[0041] According to one aspect of the invention, the wall assembly plate is configured to be placed against the cover, and the walls that delimit the circulation channel rest in a sealed manner on the bottom of the enclosure or the electronic module.

[0042] According to one aspect of the invention, the plate is solid.

[0043] Alternatively, the plate has one or more openings configured to receive the electronic component(s) that give off the most heat.

[0044] According to one aspect of the invention, electronic components that protrude through openings in the fluid circulation channel can thus be better cooled, while components that require less cooling are located under the plate of the wall assembly and are not cooled by the fluid in the circulation channel.

[0045] According to one aspect of the invention, the plate with the openings is placed against the bottom of the enclosure or the electronic module.

[0046] According to one aspect of the invention, the openings are formed in the plate, between walls.

[0047] According to one aspect of the invention, the plate of the wall assembly may include a fluid inlet passage and / or a fluid outlet passage of the circulation channel.

[0048] According to one aspect of the invention, the plate and the walls can be made in a single piece.

[0049] According to one aspect of the invention, the plate is made of flexible material so that it can rest on at least some of the electronic components by deforming.

[0050] According to one aspect of the invention, the walls of the wall assembly have a width chosen so that the channel is adjusted in width as much as possible to the electronic components to be cooled in the channel.

[0051] In other words, these walls can be relatively thick.

[0052] According to one aspect of the invention, the assembly of walls can be carried out in entirely in a flexible material, for example a flexible polymer or a foam such as a dense foam.

[0053] Alternatively, at least some of the walls comprise a body made of rigid material, for example rigid plastic or metal, and the flexible strip is made of a flexible material different from the body.

[0054] According to one aspect of the invention, the flexible strip is then assembled with the rigid body of the wall, for example by gluing or welding or by adhesion during the formation of the flexible strip, or by mechanical assembly.

[0055] According to one aspect of the invention, the flexible band is made of flexible polymer or foam.

[0056] According to one aspect of the invention, the flexible strip can be obtained by depositing a material such as a resin, coated onto the rigid body.

[0057] This coating material can be polymerized, for example by heating. This is then referred to as "Potting" in English.

[0058] According to one aspect of the invention, the flexible strip has a U-shaped cross-section allowing it to wrap around an edge of the rigid body of the wall.

[0059] Of course, any other form of the cross-section can be considered.

[0060] The U-shaped flexible band allows this flexible band to be threaded onto the rigid body without the need for glue.

[0061] The rigid body, particularly of metal, of the walls can be made in one piece with the lid. In this case, a flexible strip is provided on the lower edge of these walls so as to create a seal with the bottom of the enclosure or the electronic module.

[0062] When the entire wall is made of a flexible material, for example of a flexible polymer or foam, the rigidity of these walls can be locally reinforced by shims on the lid.

[0063] When the entire wall is made of flexible material, it is understood that the flexible strip is a portion of this wall made of flexible material.

[0064] The wedges allow the flexible material walls to be held mechanically in place.

[0065] In the case of a flexible strip on the lower edge of the wall, the wall and the cover can be made from a single piece.

[0066] The invention further relates to a method of assembling the cooling device with an electronic module, the method comprising the following step: - assembling the wall with the electronic module so as to compress the flexible strip of the wall against the cover or the bottom of the enclosure or of the electronic module.

[0067] The process may further include the following steps: - provide one or more walls with a rigid body and flexible strips threaded onto it, on each side of the walls, - Position the electronic module inside the enclosure, - assemble dielectric fluid inlet and outlet pipes in common interaction with the speaker, - position the walls within the enclosure, - close the enclosure with the lid, this lid exerting a force on the walls tending to compress the flexible bands.

[0068] Alternatively, the process further comprises the following steps: - provide the cover which has a relief shape similar to the circulation channel, as well as shims, - Position the sides on the lid, holding them in place with the raised edges and wedges. - Place the electronic board / module inside the enclosure. - assemble dielectric fluid inlet and outlet pipes in common interaction with the speaker, - close the enclosure with the lid which supports the walls, this closure causing the compression of the flexible bands.

[0069] In another example of an implementation of the invention, the process comprises the following steps: - attach a flexible strip to the lid, - place the electronic module inside the enclosure, - place fluid inlet and outlet pipes in communication with the enclosure, - thread the flexible strips onto the lower edge of the walls, - Position the partitions on the electronic module, specifically on the circuit board electronics, - then close the enclosure with the lid with the flexible strip(s) on the lid which come to rest on the upper edge of the walls.

[0070] In another example of an implementation of the invention, the process comprises the following steps: - provide a lid with walls formed on this lid, these walls being in particular rigid, - place the electronic module inside the enclosure, - place the dielectric fluid inlet and outlet pipes in communication with the enclosure, - position the flexible strip(s) that are part of a wall assembly

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[0080] having a plate with openings or this assembly of walls being non-through, - close the enclosure with the lid which supports the walls so that they rest on the flexible strip(s) already positioned in the enclosure. According to yet another example of implementation of the invention, the process comprises the following steps: - to provide walls made of flexible materials, - place the electronic module inside the enclosure, - place the fluid inlet and outlet pipes in communication with the enclosure, - Position the flexible material panels on the electronic module, specifically on the circuit board. - close the enclosure with the lid. In general, the invention allows for the formation of a cooling circuit on the electronic board. The sealing of this circuit is ensured by the flexible strip(s) on the edges of the walls that delimit the circulation channel. The invention also relates to a system comprising an electronic module and a cooling device as described above, configured to cool the electronic module. According to one aspect of the invention, the areas to be preferably cooled include, in particular, transistors, especially of the MOSFET type. According to one aspect of the invention, the electronic module is part of a DCDC converter, particularly for motor vehicles. The invention thus makes it possible to preferentially cool the areas that tend to heat up the most, in particular areas on the electronic board that group the transistors. Such transistors in the case of a DCDC converter can generate more than half of the total heat loss. The enclosure includes a retaining element for the electronic board, this retaining element being for example a hollow column, for example threaded, allowing the board to be fixed to it, for example with a screw. Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the attached schematic drawings on the other hand, in which: [Fig. 1] Fig. 1 is a schematic representation of a system according to an example of an embodiment of the invention, with an electronic module in an enclosure of cooling device;

[0081] [Fig.2] The [Fig.2] is a view of the wall assembly of the system of the [Fig.1];

[0082] [Fig.3] Figure [Fig.3] shows, in profile and in section, a wall with its flexible strips of the cooling device illustrated in figures 1 and 2, before assembly;

[0083] [Fig.4] Figure [Fig.4] shows, in profile and in section, a wall with its flexible strips of the cooling device illustrated in figures 1 and 2, after assembly;

[0084] [Fig.5] Figure [Fig.5] shows, in profile and in section, a wall with its flexible strips of a cooling device according to another embodiment, before assembly

[0085] [Fig.6] Figure [Fig.6] shows, in profile and in section, a wall with its flexible strips of [Fig.5], after assembly;

[0086] [Fig.7] Fig.7 is a perspective representation of an assembly of walls according to another embodiment;

[0087] [Fig.8] Fig.8 is a schematic representation of a system according to another example of an embodiment of the invention, with an electronic module in a housing of a cooling device;

[0088] [Fig.9] Fig.9 is a schematic representation of a system according to yet another Another example of the embodiment of the invention, with an electronic module in a housing of a cooling device.

[0089] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0090] Figure [1] shows a system 1 comprising an electronic module 2 and a cooling device 3 according to an example of an embodiment of the invention, configured to cool the electronic module.

[0091] The electronic module 2 is part of a DCDC converter, in particular for motor vehicles.

[0092] The electronic module 2 includes an electronic board 4 on which are mounted a plurality of electronic components 5, including MOSFET type transistors present in areas 6.

[0093] Areas 6 are to be cooled preferentially because MOSFET transistors tend to heat up more than other components. Such transistors in the case of a DCDC converter can generate more than half of the total heat loss.

[0094] The cooling device 3 includes a housing 10 configured to receive the electronic board 4 and the electronic components 5, and to be filled with a dielectric fluid intended to immerse the electronic components 5.

[0095] The enclosure includes retaining elements 11 for the electronic board 4. The enclosure 10 is for example a single piece, made of plastic or metal, and is in the form of a tank.

[0096] The retaining elements 11 of the electronic board include hollow, for example threaded, posts allowing the board to be fixed to them, for example by means of screws. The screws pass through holes formed in the board 4.

[0097] The cooling device 3 further includes a cover 14 configured to close the enclosure 10, as can be seen in [Fig.3].

[0098] The cooling device 3 comprises an assembly 20 of walls, the assembly being a single piece or made of several assembled pieces.

[0099] As can be seen more clearly in [Fig.2], the wall assembly 20 comprises a peripheral wall 21, here forming a closed rectangular perimeter, and internal walls 22 configured to give the outline of a circulation channel 23. This channel 23 includes a fluid inlet 25 and a fluid outlet 26. Dielectric fluid inlet and outlet pipes are fixed respectively to these fluid inlet 25 and outlet 26.

[0100] The inner walls 22 can be straight and arranged in a staggered pattern to form the channel 23 with successive U-shapes.

[0101] In the example described, the wall assembly 20 is through-wall. In other words, the wall assembly 20 is open on its upper edge and on its lower edge before being mounted in the enclosure 10.

[0102] This wall assembly 20 rests in a sealed manner on the board 4 and some of the electronic components 5, and rests in a sealed manner on the cover 15, as will be explained below.

[0103] Each peripheral wall 21 or inner wall 22 has an upper edge 28 opposite the cover 14 and a lower edge 29 opposite the electronic board 4.

[0104] Each peripheral wall 21 or inner wall 22 has a flexible strip 30 on its upper edge 28 and another flexible strip 31 on its lower edge 29, the flexible strips 30 and 31 being configured to provide a peripheral seal along its upper edge 28 and its lower edge 29, as illustrated in [Fig.3] (before assembly) and [Fig.4] (after assembly).

[0105] Each peripheral wall 21 or inner wall 22 comprises a body 35 made of rigid material, for example rigid plastic or metal, and the flexible strips 30 and 31 are made of a flexible material different from the body.

[0106] The flexible strips 30 and 31 are then assembled with the rigid body 35 of the wall, for example by gluing or welding or by adhesion during the formation of the flexible strip, or by mechanical assembly.

[0107] Each flexible band 30, 31 is made of flexible polymer or foam.

[0108] Alternatively, the flexible strip 30, 31 can be obtained by depositing a material such than a resin, coated onto the rigid body.

[0109] This coating material can be polymerized, for example by heating. This is then referred to as "Potting" in English.

[0110] The flexible strip 30, 31 has a U-shaped cross-section allowing it to wrap around an edge of the rigid body 5 of the wall, as can be seen on the right in figures 3 and 4.

[0111] The U-shaped flexible band 30, 31 allows this flexible band to be threaded onto the rigid body without the need for glue.

[0112] Of course, any other form of the cross-section can be envisaged.

[0113] The rigid body 5 could be made in one piece with the lid. In this case, a single flexible strip 31 is provided on the lower edge of these walls in order to seal with the card 4.

[0114] Each flexible strip 30, 31 of the wall is configured to be compressed when the wall 21, 22 is mounted in the enclosure closed by the cover 14.

[0115] The flexible band 30, 31 which is compressed ensures a good seal.

[0116] The flexible strip 30, 31 is compressed between the wall 21, 22 and the cover 14, and between wall 21, 22 and electronic module 2.

[0117] The flexible band 30, 31 extends in a straight line along the entire length of the upper edge 28 or lower edge 29 of the wall.

[0118] When the wall 21, 22 is mounted in the enclosure, the flexible band 31 presses on electronic components 5 and on the electronic board 4.

[0119] The electronic component(s) 5 on which the flexible strip 31 of the wall presses are chosen from among the electronic component(s) which heat up the least during operation, and therefore outside of areas 6 which heat up the most.

[0120] The fluid circulation channel 23 is configured so that, when the electronic module 2 is in place in the enclosure 10, the electronic component(s) which give off the most heat, in the zones 6, are present within the channel 23.

[0121] In other words, the component(s) 4 that give off the most heat are next to the flexible strip 31 of the wall, and not underneath it. In other words, said components are located between the walls 21, 22 of the channels.

[0122] Thus, this or these electronic components 5 which give off the most heat can be better cooled by the fluid which flows within the channel 23.

[0123] Channel 23 can be chosen with sufficient width so that the components 5 which give off the most heat are at a non-zero distance from the walls 21, 22 of the channel.

[0124] The flexible strip 31 has sufficient thickness so that, when the wall 21, 22 presses on electronic components 5 with less heat release, the flexible strip deforms sufficiently to conform to the shape of these electronic components 5.

[0125] This flexible strip 31 can be an initially straight strip which is locally deformed to fit the shape of the components 5 which can have different heights.

[0126] This flexible strip 31 can thus be deformed by being compressed differently depending on the local height of the electronic components on which the flexible strip 31 presses, as can be seen in [Fig.4].

[0127] Alternatively, the wall 21, 22 may have a lower edge 29 with a variable profile, for example in crenellations, and the flexible strip 31 follows this variable profile of the lower edge 29, as illustrated in [Fig.5] (before assembly) and [Fig.6] (after assembly).

[0128] This variable profile is chosen to fit the shape of the electronic components 5 on which the flexible strip 31 presses when the wall 21, 22 is in place in the enclosure 10.

[0129] This configuration is particularly advantageous in the case where the compression of the flexible strip 31 does not allow to absorb all the height differences of the electronic components 5.

[0130] The variable profile may, for example, have slots of different heights.

[0131] In another alternative embodiment, it is the flexible strip 31 that has the variable profile.

[0132] The method for assembling the cooling device 3 with the electronic module 2 thus comprises the following steps: - provide the walls 21, 22 with the flexible strips 30, 31 threaded onto them, on each side of the walls, - Position the electronic module 2 in the enclosure, - Install inlet and outlet pipes for dielectric fluid in communication with the enclosure, - position the walls 21, 22 within the enclosure, - close the enclosure 10 with the cover 14, this cover 14 exerting on the walls a force tending to compress the flexible strips 30, 31.

[0133] In another embodiment of the invention illustrated in [Fig.7], the wall assembly 40 comprises a solid plate 41 covering the upper edges of the peripheral wall 21 and the inner walls 22. Thus this wall assembly 40 is non-through.

[0134] Plate 41 is made of compressible material.

[0135] Alternatively, the plate 41 is made of the same material as the walls 21, 22.

[0136] The plate 41 of the wall assembly is configured to be placed against the cover 14, and the walls which delimit the circulation channel 23 rest in a watertight manner on the bottom of the cover.

[0137] Alternatively, as illustrated in [Fig.8], the walled assembly 50 includes a plate 51 placed against the bottom of the enclosure 10 and which has several openings 52 configured to receive electronic components 5 that give off the most heat.

[0138] The electronic components 5 in the areas 6 which overflow through the openings 52 into the fluid circulation channel 23 can thus be better cooled, while the components 5 which have less need for cooling are located under the plate 51 of the wall assembly 50 and are not cooled by the fluid in the circulation channel 23.

[0139] The openings 52 are formed in the plate 51, between walls 22.

[0140] The plate 51 of the wall assembly may include a fluid inlet passage 55 and / or a fluid outlet passage 56 of the circulation channel.

[0141] The plate 51 and the walls 21, 22 can be made in a single piece.

[0142] The plate 51 is made of flexible material so that it can come to rest on at least some of the electronic components 5 by deforming.

[0143] The walls 21, 22 have a width chosen so that the channel 23 is adjusted in width as much as possible to the electronic components 5 to be cooled in the channel.

[0144] Figure 9 shows such walls 21, 22 can be relatively thick so that the openings 52 are tangent to these walls 21, 22.

[0145] In another variant, the wall assembly can be made entirely of a flexible material, for example a flexible polymer or a foam such as a dense foam.

[0146] When the entire wall is made of a flexible material, for example, a flexible polymer or foam, the rigidity of these walls can be locally reinforced by shims on the lid. When the entire wall is made of a flexible material, it is understood that the flexible strip is a portion of this wall made of flexible material. The shims allow the flexible material walls to be mechanically held in place.

Claims

Claims

1. Cooling device (3) configured to cool an electronic module (2) comprising an electronic card (4) on which a plurality of electronic components (5) are mounted, the cooling device comprising: - an enclosure configured to receive the electronic card (4) and the electronic components (5), and to be filled with a dielectric fluid intended to immerse the electronic components, the enclosure (10) comprising in particular at least one holding member (11) of the electronic card, - a cover (14) configured to close the enclosure, - at least one wall (21, 22) to form a dielectric fluid circulation channel (23), this wall comprising an upper edge (28) facing the cover and a lower edge (29) facing the bottom of the enclosure (10), the wall comprising a flexible strip (30,31) on its upper edge and / or its lower edge configured to provide a peripheral seal along its upper edge (28) and / or its lower edge (29).,

2. Cooling device (3) according to the preceding claim, in which the cooling device (3) comprises a plurality of walls (21, 22) configured to form the circulation channel (23), the plurality of walls (21, 22) being in particular parallel to each other, and arranged in a staggered manner to provide one or more U-shapes for the flow.

3. Cooling device (3) according to one of the preceding claims, in which the wall (21, 22) comprises a flexible strip (30) on its upper edge (28) and another flexible strip (31) on its lower edge (29).

4. Cooling device (3) according to one of claims 1 and 2, in which the wall (21, 22) comprises a flexible strip (30, 31) only on one of its lower and upper edges, in particular lower.

5. Cooling device (3) according to one of the preceding claims, in which the electronic component(s) (2) on which supports the flexible strip (30, 31) of the wall are chosen from the electronic component(s) which heat up the least during operation.

6. Cooling device (3) according to one of the preceding claims, in which the fluid circulation channel (23) is configured so that, when the electronic module (2) is in place in the enclosure, the electronic component(s) which release the most heat are present within the channel.

7. Cooling device (3) according to one of the preceding claims, in which the flexible strip (30, 31) is an initially rectilinear strip and which is locally deformed to match the shape of the components which may have different heights, and in particular the flexible strip (30, 31) has a U-shape in cross section making it possible to envelop an edge of a rigid body (35) of the wall.

8. Cooling device (3) according to one of claims 1 to 6, in which the wall may have a lower edge (29) of variable profile, for example in notches, and the flexible strip (31) follows this variable profile of the lower edge.

9. Cooling device (3) according to one of the preceding claims, in which the assembly (20) of walls comprises a peripheral wall (21), for example of rectangular shape, and one or more interior walls (22) configured to give the outline of the circulation channel (23).

10. Cooling device (3) according to one of the preceding claims, in which the assembly (20) of walls is through, namely the assembly of walls is open on its upper edge and on its lower edge before mounting in the enclosure closed by the cover.

11. A cooling device (3) according to claim 9, wherein the wall assembly comprises a plate (41) covering the upper edges of the peripheral wall (21) and the inner walls (22).

12. Cooling device (3) according to the preceding claim, wherein the plate (41) comprises one or more openings (52) configured to receive the electronic component(s) (52) which give off the most heat.

13. Method of assembling the cooling device (3) according to one of the preceding claims with an electronic module (2), the method comprising the following step: - assembling the wall with the electronic module so as to compress a flexible strip (30, 31) of the wall against the cover (14) or the bottom of the enclosure or the electronic module.

14. System comprising an electronic module (2) and a cooling device (3) according to one of claims 1 to 12, configured to cool the electronic module (2).

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