Rectifying device with diode coupled to an antenna

Abstract

The invention relates to a rectifier device 1 with a diode 20 of the MIIM type coupled to an antenna 10, in which the diode 20 comprises a semiconducting layer 23 of graphene G located between the first and second insulating layers 22, 24 of the MIIM diode, and in which the first metal layer 21 of the MIIM diode is made of a first metal M1 having an output work ΨM1 less than or equal to the output work ΨG of the graphene G. Figure for the abstract: Fig.2A

Description

Title of the invention: Rectifying device with diode coupled to an antenna Technical field

[0001] The field of the invention is that of rectifier devices with a diode coupled to an antenna, also called "rectennas". The invention finds application in particular in the field of infrared or terahertz detection, and in that of energy conversion. STATE OF THE PRIOR ART

[0002] Infrared and terahertz detectors that operate at room temperature may be, for example, bolometer-type thermal detectors. They may then comprise an absorbent membrane, suspended above a substrate containing a reading circuit, which contains a thermistor material whose electrical resistance varies as a function of its heating. However, the performance of these thermal detectors is generally limited by their thermal time constant, which may be of the order of tens of milliseconds.

[0003] Infrared and terahertz detectors can also be antenna-coupled diode rectifier devices, also called "rectifying antennas" or "rectennas", where the diode can be of the MIM (metal-insulator-metal) type. These rectennas can have a much faster response time than that of bolometer-type thermal detectors, since the transit time of electrons by tunneling, through the thin insulating layer of the diode, is of the order of femtoseconds to nanoseconds.

[0004] [Fig.lA] illustrates the schematic diagram of a rectenna Al, here in the case of an energy conversion application. It is formed of an antenna A10 adapted to absorb the incident electromagnetic radiation, and a rectifier element A20 such as a diode, for example a MIM type diode, electrically coupled to the antenna A10. A DC filter A2 is generally connected in parallel with the diode A20 to keep only the DC component of the rectified AC signal. The operating principle of such a rectenna Al is as follows: the antenna A10 absorbs the incident electromagnetic radiation and converts it into a high-frequency electrical signal, which is transferred to the input of the diode A20. The diode A20 rectifies the AC electrical signal, then the DC filter A2 keeps only the DC component of the rectified electrical signal, to supply it here to an electrical load A3.

[0005] [Fig.lB] illustrates an example of an energy band diagram of a MIM diode rectenna, here in the case of an optical detection application. Such a rectenna is described in particular in the article by de Grover & Moddel entitled Applicability of Metal / Insulator / Metal (MIM) Diodes to Solar Rectennas, IEEE Journal of Photovoltaics, Vol. 1, no. 1, pp. 78-83, 2011. The MIM diode comprises two metal layers (metals Ml and M2) between which is located the same insulating layer (electrical insulator I). The diagram depends in particular on the values ​​of the work functions WMi and WM2 of the metals Ml and M2, the electronic affinity of the insulator I, and the bias voltage VD applied to the MIM diode. Electrons can cross the energy barrier by different conduction mechanisms, for example by Fowler-Nordheim tunneling or by direct tunneling, depending in particular on the heights q>L and q>R of the energy barriers.These different types of conduction mechanisms are described in particular in the article by Chiu entitled A Review on Conduction Mechanisms in Dielectric Films, Advances in Materials Science and Engineering, vol. 2014, Article ID 578168, 18 pages, 2014. In this example, the tunnel conduction is of the Fowler-Nordheim type.

[0006] As indicated in the article by Grover & Moddel 2011, in terms of performance, we seek to ensure that the MIM diode has a high responsivity, this parameter [3 corresponding to a measurement of the rectified DC signal as a function of the incident energy power. It can be determined from the I(V) characteristic of the diode from the relationship: [3 = 1'7(21'), where F and I” are the first and second derivatives of the electric current as a function of the electric voltage I(V), at the bias voltage VD. In addition, we also seek to ensure that the diode has a low dynamic resistance to obtain a good impedance match with the antenna.

[0007] However, it appears that, for a MIM diode, i.e. a diode with a single insulating layer located between the two metal layers, the optimization of the responsivity leads to a degradation of the value of the dynamic resistance, and vice versa. Also, it does not seem possible to optimize both the responsivity and the dynamic resistance of a MIM diode. However, it appears that a MIIM diode, i.e. a diode with two insulating layers having different electronic affinities, makes it possible to remove this constraint, so that it is possible to configure the MIIM diode so that it has both high responsivity and low dynamic resistance. This is particularly the case when the MIIM diode allows conduction of the charge carriers by resonant tunneling effect.

[0008] In this respect, [Fig.lC] illustrates an example of an energy band diagram of an infrared rectenna with a MIIM diode configured to allow conduction of charge carriers, here electrons, by resonant tunneling. This type of energy band diagram is described in particular in the article by Grover & Moddel entitled Engineering the current-voltage characteristics of metal-insulator-metal diodes using double-insulator tunnel barriers, Solid-State Electron. 67, 94-99 (2012), as well as in that of Belkadi et al. entitled Demonstration of resonant tunneling effects in metal-double-insulator-metal (MPM) diodes, Nat Commun 12, 2925 (2021).

[0009] Resonant tunneling occurs when electrons pass through the insulating layers via a right-angled triangle-shaped quantum well located between the two insulating layers. Electrons whose energy corresponds to the energy levels of the quasi-bound states of the quantum well can pass through the insulating layers and reach the metal layer M2 while minimizing reflection, thus producing a higher electric current than in the case of non-resonant tunneling. Note that, in this example, the electrons pass through the first insulating layer via Fowler-Nordheim tunneling, and the second insulating layer via direct tunneling.The authors showed that by using insulators with different electron affinities, it is possible to configure a resonant tunneling MIIM diode to achieve both high responsivity and low dynamic resistance, which is not possible to obtain in the case of a MIM diode.

[0010] However, there is a need to further improve the performance of a MIIM type diode rectenna, whether for infrared or terahertz detection applications, or even energy conversion. Statement of the invention

[0011] The invention aims to remedy at least in part the drawbacks of the prior art, and more particularly to propose a rectifier device with a MIIM type diode coupled to an infrared antenna having improved performance.

[0012] For this, the object of the invention is a rectifier device comprising: an antenna adapted to absorb electromagnetic radiation of interest; and a MIIM type diode electrically coupled to the antenna. The MIIM diode comprises: a first metal layer and a second metal layer; and a first insulating layer made of a first electrical insulator having an electronic affinity q>i, and a second insulating layer made of a second electrical insulator having an electronic affinity q>2 different from q>i.

[0013] According to the invention, the diode comprises a graphene semiconductor layer located between the first and second insulating layers. In addition, the first metal layer is made of a first metal having an output work WMi less than or equal to the output work WG of the graphene.

[0014] Some preferred but non-limiting aspects of this rectifier device are as follows.

[0015] The graphene semiconductor layer can be formed from at most two monoatomic sheets.

[0016] The first and second insulating layers may have a thickness between 0.5 and 2nm.

[0017] The first and second metal layers may have a thickness at least equal to 80 nm.

[0018] The electronic affinities q>i and q>2 of the first and second electrical insulators may be lower than the work function WG of graphene.

[0019] The rectifier device may comprise an electrical source adapted to apply a non-zero electrical bias voltage VD to the diode.

[0020] The electrical source may be adapted to apply an electrical potential to the first and second metal layers, the electrical potential applied to the second metal layer being greater than that applied to the first metal layer.

[0021] The first metal layer may have an electrical potential equal to that of the second metal layer.

[0022] The rectifier device may comprise a reflector of the electromagnetic radiation of interest, located between a support substrate and the antenna, and spaced from the antenna so as to form a quarter-wave cavity.

[0023] The antenna may be adapted to absorb electromagnetic radiation in the infrared or terahertz range.

[0024] The device may comprise a matrix of rectifier devices according to any one of the preceding characteristics, identical to each other.

[0025] The invention also relates to a method of manufacturing a rectifier device according to any one of the preceding characteristics, comprising the following steps: - production of a first conductive part of the antenna; - production of the first metallic layer of the diode, in electrical contact of the first conductive part of the antenna; - production of a first continuous insulating layer, made of the first electrical insulator, in electrical contact with the first metal layer; - production of a continuous semiconducting layer of graphene, in contact with the continuous insulating layer; - production of a second continuous insulating layer, made of the second electrical insulator, in contact with the continuous semiconducting layer of graphene; - structuring the first continuous insulating layer, the continuous semiconductor layer and the second continuous insulating layer, so as to form the first insulating layer, the graphene semiconductor layer, and the second insulating layer of the diode; - production of the second metal layer of the diode, in electrical contact of the second insulating layer of the diode; - production of a second conductive part of the antenna, in electrical contact with the second metallic layer of the diode. Brief description of the drawings

[0026] Other aspects, aims, advantages and characteristics of the invention will appear better on reading the following detailed description of preferred embodiments thereof, given by way of non-limiting example, and made with reference to the appended drawings in which:

[0027] [Fig.1A], already described, is a schematic view of a rectifier device with a diode coupled to an antenna, according to an example of the prior art;

[0028] [Fig.1B], already described, illustrates an example of an energy band diagram of a MIM diode rectifier device, according to an example of the prior art;

[0029] [Fig.1C], already described, illustrates an example of an energy band diagram of a MIIM diode rectifier device, according to an example of the prior art;

[0030] [Fig.2A] illustrates an energy band diagram of a MIGIM diode rectifier device according to one embodiment;

[0031] [Fig.2B] and [Fig.2C] are schematic and partial views, in cross-section ([Fig.2B]) and in top view ([Fig.2C]), of a MIGIM diode rectifier device according to one embodiment;

[0032] [Fig.3A] illustrates an evolution of the absorption rate of the antenna of a MIGIM diode rectifier device according to one embodiment;

[0033] [Fig.3B] illustrates an I(V) characteristic of a MIGIM diode of a rectifier device according to one embodiment;

[0034] Figures 4A to 4M illustrate different steps of a method of manufacturing a MIGIM diode rectifier device according to one embodiment.

[0035] DETAILED DESCRIPTION OF PARTICULAR EMBODIMENTS

[0036] In the figures and in the remainder of the description, the same references represent identical or similar elements. In addition, the different elements are not shown to scale so as to enhance the clarity of the figures. Furthermore, the different embodiments and variants are not mutually exclusive and may be combined with each other. Unless otherwise indicated, the terms "substantially", "approximately", "in the order of" mean to within 10%, and preferably to within 5%. Furthermore, the terms "between ... and ..." and equivalents mean that the limits are included, unless otherwise stated.

[0037] The invention relates to a rectifier device with a diode coupled to an antenna, also called a "rectenna". It can act as an infrared or terahertz detector, or even as an energy converter, depending in particular on whether the diode is polarized or not, at a non-zero voltage VD.

[0038] Generally speaking, the antenna of the rectenna can be adapted to absorb electromagnetic radiation of interest in a spectral range ranging in particular from infrared to terahertz. Thus, the antenna can be configured to absorb in the near infrared (SWIR, for Short Wavelength IR, in English) corresponding to a spectral range ranging from approximately 0.8 to 2.7 pm; in the medium infrared (MWIR, for Middle Wavelength IR, in English) corresponding to a spectral range ranging from approximately 3 to 5 pm; in the far infrared (LWIR, for Long Wavelength IR, in English) corresponding to a spectral range ranging from approximately 7 to 14 pm; or even in the terahertz whose spectral range ranges from approximately 0.1 to 1 mm (approximately 0.3 to 3 THz).

[0039] [Fig.2A] is a very schematic view of a rectenna according to one embodiment, as well as an example of its energy band diagram. Figures 2B and 2C are schematic and partial views in longitudinal section ([Fig.2B]) and in top view ([Fig.2C]) of a rectenna 1 according to one embodiment.

[0040] Here and for the remainder of the description, a three-dimensional direct reference XYZ is defined, where the XY plane (main plane) is parallel to the main plane of the antenna 10 of the rectenna 1, and where the Z axis is oriented along the thickness of the diode 20 of the rectenna 1. Furthermore, the terms “lower” and “upper” are understood as relating to an increasing positioning along the +Z direction.

[0041] In this example, the rectenna 1 is an infrared detector whose antenna is adapted to absorb in the LWIR infrared, with a central wavelength equal to approximately 100 m. Of course, the rectenna 1 can be configured to absorb in the other spectral ranges of the infrared, or even in the terahertz.

[0042] Preferably, the rectenna 1 described belongs to a matrix of unitary rectennas, identical to each other, connected to an electrical control and reading circuit (ROIC) responsible for polarizing the diodes 20 and reading the electrical signals generated.

[0043] As explained in detail below, the rectenna 1 comprises a diode 20 of the MIIM type which comprises a semiconducting layer 23 of graphene located between the two insulating layers 22, 24. The diode 20 is then called a MIGIM diode.

[0044] Generally speaking, the rectenna 1 comprises an antenna 10, the MIGIM diode 20 and a DC filter (not shown). Here, it comprises an electrical source for polarizing the MIGIM diode at a non-zero voltage VD (optical detection application). On the other hand, in the case of an energy conversion application (solar cell, for example), the MIGIM diode can be unpolarized or polarized at a zero voltage, and can be connected to an electrical load.

[0045] The antenna 10 is adapted to absorb the incident electromagnetic radiation, here an LWIR infrared radiation and is electrically connected to the MIGIM diode 20 to transmit to it the electrical signal generated in response to the absorption of the infrared radiation of interest.

[0046] The antenna 10 comprises at least two electrically conductive parts 11, 12, made of at least one absorbing metal, such as for example Ti, TiN, Al, Au, Pt, among others. The conductive parts 11, 12 are aligned along a main detection axis X. In this example, the antenna 10 comprises two conductive parts extending along the same main axis X, but as a variant (not shown), it can comprise more conductive parts, for example four conductive parts, two of which extend along a first main axis, and two of which extend along a second main axis orthogonal to the first axis.

[0047] The antenna 10 may have a spiral, serpentine, dipole, or bow-tie shape. In this example, the antenna 10 is of the bow-tie type, also called a butterfly antenna. The two conductive parts 11, 12 have a substantially planar and triangular shape in the XY plane, where the vertices of the triangles are located opposite, along the vertical axis Z, the diode 20. The antenna 10 has a length L along the main axis X of the order of Xc / 2, where / . c is the central wavelength of the LWIR spectral range, for example here approximately 100 μm. The angular aperture of each conductive part 11, 12 of triangular shape, defined at the level of the vertices opposite the diode 20, may be equal to approximately 60°. Finally, the antenna may have a resistance RA of the order of 100 μ.

[0048] The two conductive parts 11, 12 are separated from each other, and are electrically connected to each other by means of the diode 20. They are arranged on either side of the diode 20 along the main axis X. Thus, as illustrated in [Fig.2B] and 2C, a lower conductive part 11 is in electrical contact with a lower metal layer 21 of the diode 20, and an upper conductive part 12 is in electrical contact with an upper conductive layer 25 of the diode 20.

[0049] The diode 20 is adapted to receive the high-frequency AC electrical signal generated by the antenna 10 in response to the absorption of the electromagnetic radiation of interest, here in the LWIR, and to rectify it to provide a rectified AC electrical signal.

[0050] The diode 20 is formed from a stack of two metal layers 21, 25, between which are located at least two insulating layers 22, 24. In addition, a semiconducting layer 23 made of graphene is located between and in contact with the two insulating layers 22, 24. Also, the diode 20 is of the MIIM type and is called MIGIM.

[0051] In this example, the stack of layers 21, 22, 23, 24, 25 is oriented along the vertical axis Z. The lower metal layer 21 is in electrical contact with the proximal end of the conductive part 11 of the antenna 10, and the upper metal layer 25 is in electrical contact with the proximal end of the conductive part 12. By proximal ends, we mean the ends of the parts conductive 11, 12 oriented towards each other.

[0052] In this example, the diode 20 comprises two insulating layers 22, 24, such that each insulating layer 22, 24 is in contact with a metal layer 21, 25 and the semiconducting layer 23 of graphene. Alternatively, the diode 20 may comprise several insulating layers and several semiconducting layers of graphene, where each semiconducting layer of graphene is located between and in contact with two insulating layers.

[0053] The first metal layer 21 (lower layer) is made of at least one first metal M1 whose work function is denoted WMi. Here, it is in contact with the first insulating layer 22. The second metal layer 25 (upper layer) is made of at least one second metal M2, whose work function is denoted WM2. Here, it is in contact with the second insulating layer 24.

[0054] In the case here of an optical detection application, the two metals M1 and M2 may be identical or different in terms of work functions. On the other hand, in the case of an energy conversion application, the work functions WMi, WM2 are different from each other. By work functions different from each other, it is meant that the work function 4¼ of the metal M1 has a relative deviation from the work function WM2 of the metal M2 greater than 10%. In other words, we have AWmh^APmi = l / WM1 > 10%.

[0055] Furthermore, the first metal Ml is chosen so that its work function WMi is less than or equal to the work function WG of 4.5eV of graphene. By work functions equal to each other, it is meant that the work function WMi of the metal Ml has a relative deviation from the work function WG of graphene less than or equal to 10%. In other words, we have AWMiGAPi = PPMi-WçJAPi < 10%.

[0056] The metal Ml can be chosen in particular from Ti, Cr, TiN and AlCu, and the metal M2 can be chosen, in the case here where Ml is chosen to be different from M2, from Ni, Pt, and Au. Thus, in the case where the metal Ml is titanium Ti, it has a work function W mi of the order of 4.3eV, so that the relative difference with the work function WG of 4.5eV of graphene is here equal to 4.6%. We therefore have WMi < WG.

[0057] The first insulating layer 22 (lower layer) is located here in contact with the first metal layer 21 and the semiconducting layer 23 of graphene. It is made of an electrically insulating material II with an electron affinity q>i. The second insulating layer 24 (upper layer) is located here in contact with the semiconducting layer 23 of graphene and the second metal layer 25. It is made of an electrically insulating material 12 with an electron affinity q>2 different from q>i. In other words, the electron affinity q>i has a relative deviation from the electron affinity q>2 greater than 10%. In other words, we have Aq>i2 / q>i = lq>iq>2l / q>i > 10%.

[0058] The insulating layers 22, 24 may be made of electrically insulators such as aluminum, hafnium, zirconium, silicon, zinc oxides among others, such as for example Al2O3, HfO2, HfAlO, ZrO2, SiO2, ZnO. The insulating materials may preferably be materials with a high dielectric constant (high-ky materials such as for example Al2O3, HfO2, ZrO2 and ZnO, so as to increase the asymmetry of the diode 20 and reduce its dynamic resistance. In addition, the insulators II and 12 are chosen so that the electronic affinities q>i, <p2 sont inférieures au travail de sortie WG du graphène, de manière à permettre la formation d’un puits quantique.

[0059] The insulating layers 22, 24 have thicknesses of the order of a few tenths of nanometers to a few nanometers, preferably between 0.5 and 2nm, for example equal to 0.5nm, 1nm, or even more. The thicknesses may or may not be identical.

[0060] The insulating layers 22, 24 are thin layers, i.e. layers having a thickness ranging from one atomic layer to around ten nanometers. It can be produced by conventional microelectronics techniques, including chemical deposition (CVD, ALD, etc.), physical deposition (PVD, etc.), among others.

[0061] According to the invention, a semiconductor layer 23 of graphene G is located between and in contact with the two insulating layers 22, 24. Graphene is a two-dimensional crystalline material formed from one or more sheets of carbon atoms arranged in a hexagon to form a planar structure of monoatomic thickness. Graphene has an output function equal to approximately 4.3eV. One sheet corresponds to a monoatomic layer. The semiconductor layer 23 of graphene has a thickness of one to a few sheets, and preferably at most two sheets. The thickness of one sheet of graphene is 0.34nm, and that of two sheets is 0.68nm.

[0062] Thus, due to the fact that the output work WMi of the metal Ml is less than or equal to that of graphene, the MIGIM diode 20 has an energy band diagram highlighting a quantum well located between the two insulating layers 22, 24 and formed by the semiconducting layer 23 of graphene. It allows very good transmission of electrons by resonant tunneling effect, due in particular to the conduction properties of graphene. As detailed below, it appears that the diode 20 has a strong asymmetry of its I(V) characteristic and therefore a strong responsiveness, as well as a low dynamic resistance.

[0063] Rectenna 1 also includes a DC filter (not shown), electrically connected to diode 20, so as to filter the rectified AC electrical signal to keep only the DC continuous component. The filter is then electrically connected to a circuit for reading the electrical signal (optical detection application) or to an electrical load (energy conversion application).

[0064] An electrical source may be present to electrically bias the diode 20 to a bias voltage VD. For example, the metal layer M1 is grounded while the metal layer M2 is brought to the electrical potential UD, which may be zero or non-zero depending on the intended application. Preferably, in the case of an optical detection application, the electrical potential UD applied to the metal layer 25 is positive and greater than that applied to the metal layer 21. The electrical voltage VD may be between 0 and 0.2 V approximately.

[0065] Let us recall here that the performances of the rectenna 1 depend in particular on the dynamic resistance RD of the diode 20, on the asymmetry AsD of the characteristic I(V), and on the responsivity [3. The dynamic resistance RD can be determined from the relation RD = 1 / 1', where I' is the first derivative of the electric current I as a function of the electric voltage V, at the bias voltage VD. The asymmetry AsD can be determined from the relation AsD = IIf / Irl, at the bias voltage VD, where If is the value of the forward electric current and Ir is that of the reverse electric current. Finally, the responsivity [3 was defined previously and can be determined by the relation: [3 = 1'7(21').

[0066] Thus, the rectenna 1 comprises a MIGIM type diode where a semiconducting layer 23 of graphene is located between the two insulating layers 22, 24 of different electronic affinities. In addition, the metal M1 has an output work 0¼ less than or equal to the output work WG of the graphene. Due to these characteristics, the MIGIM diode 20 allows the transmission of charge carriers by resonant tunneling effect, while increasing the asymmetry of the I(V) characteristic and therefore the responsivity, and reducing the low dynamic resistance. Thus, the rectification efficiency of the electrical signal is improved, as is the coupling efficiency of the diode 20 with the antenna 10. The rectenna 1 then has improved performance compared to that of conventional MIIM diode rectennas.

[0067] Note furthermore that the electrical polarization of the semiconductor layer 23 of graphene results in a modification of the band gap energy. This can thus vary between 0.0001 and 0.29eV depending on the value of the bias voltage VD. This polarization of the semiconductor layer 23 can be advantageous in the case where the semiconductor layer 23 is formed of at least two monolayers of graphene. In this case, applying an electric field will vary the width of the band gap, and therefore the work function of the graphene. This can therefore make it possible to control this work function of the graphene relative to the work function of the metal Ml in order to have a wide choice of metals for the metal Ml and also to refine the tunnel resonance effect.

[0068] As an example, we consider an infrared rectenna 1 adapted to absorb in the LWIR, and comprising a MIGIM diode 20. The antenna 10 is of the butterfly type and has a total length L of the order of Xc / 2 along the main axis X, where Xc is the central wavelength of the LWIR radiation to be detected. The length L is here equal to approximately 4 pm, and the angular aperture of the triangular conductive parts 11, 12 of the antenna 10 is of the order of 60°. The antenna 10 is located above a metal reflector 35, and is spaced vertically therefrom by a thickness of the order of Xc / 4n, where n is the optical index of the medium 37 separating the antenna 10 from the reflector 35. Here, this medium 37 is a silicon oxide with a thickness of the order of approximately I pm. This forms a quarter-wave cavity which improves the absorption rate by the antenna 10.

[0069] [Fig.3A] illustrates an example of the evolution of the absorption rate A as a function of the wavelength X of the incident electromagnetic radiation. It appears that this antenna has very good optical absorption A, of the order of 100%, for a spectral range of approximately 8.5 to 10 pm. In addition, the antenna has a resistance of the order of 100 Q around the central wavelength Xc of 100 pm.

[0070] [Fig.3B] illustrates examples of I(V) curves of the rectenna diode, in the case where the diode is a conventional MIIM diode, and in the case where the diode is of the MIGIM type. The two cases differ from each other only in the presence or absence of the graphene semiconductor layer. The diode is formed here of a first metallic layer of Ti, a first insulating layer of Al2O3 with a thickness of 0.5nm, a second insulating layer of HfO2 with a thickness of Inm, and finally a second metallic layer of Ni. The diode has dimensions of 100nmx100nm in the XY plane.

[0071] Note that the two insulators II, 12 are here chosen from insulators with a high dielectric constant (so-called high-k materials in English), which makes it possible to increase the asymmetry of the diode, and to contribute to reducing the dynamic resistance. Indeed, Al2O3 has a dielectric constant of the order of 6 to 7 in a very thin layer, and HfO2 has a dielectric constant of the order of 10 to 12 in a thin layer. Furthermore, Al2O3 has an electronic affinity q>i of the order of 1.3eV, and HfO2 has an electronic affinity q>2 of the order of 2.5eV.

[0072] Finally, note that Ti has a work function WMi of 4.3eV, and Ni has a work function WM2 of 5eV. Here, Ti has a work function WMi different from WM2 insofar as the relative difference (here AWMiM2APi) is here equal to approximately 16%, therefore greater than 10%. In addition, Ti has a work function WMi substantially equal to the work function WG of 4.5eV of graphene at most 10%. Indeed, the relative difference (here AWmigAPi) is here equal to approximately 4%, therefore less than 10%.

[0073] It appears that the presence of the graphene semiconductor layer results in an I(V) curve showing a reduction in the dynamic resistance RD of the diode (thus allowing a higher electric current). Also, the coupling efficiency of the diode with the antenna is improved. In addition, the I(V) curve of the MIGIM diode has a greater asymmetry than in the case of the MIIM diode, reflecting a better rectification of the AC electrical signal, and therefore an improvement in the responsiveness of the MIGIM diode. The performance of the MIGIM diode rectenna is therefore effectively improved compared to that of the MIIM diode rectenna.

[0074] Figures 4A to 4M illustrate different steps of a method for manufacturing a rectenna 1 according to one embodiment. The rectenna 1 is here adapted to absorb electromagnetic radiation of interest in the LWIR. Only a single rectenna is shown here, but preferably, the method relates to the manufacturing of an array of identical rectennas on the same reading substrate 31.

[0075] With reference to [Fig.4A], a reading substrate 31 is provided, containing a reading and control circuit (ROIC), for example of the CMOS type, adapted here to electrically bias the diode and to read the rectified electrical signal from the rectenna in response to the absorption of the LWIR radiation.

[0076] The reading substrate 31 is covered with a lower insulating layer 32, made of an insulating material such as silicon oxide. First conductive vias 33 are then made through the lower insulating layer 32, connected to connection pads of the reading substrate 31 (not shown), then first electrical connection pads 34 in contact with the conductive vias 33.

[0077] With reference to [Fig.4B], the reflector 35 and intermediate connection pads 36 are then produced. For this, a layer of at least one metallic material is deposited, which is structured by lithography and localized etching to form the reflector 35 and connection pads 36. The metallic layer may be a multi-layer, for example of the Ti / TiN / AlCu or Ti / TiN / AlSi type. The AlCu or the AISi may have a thickness of at least 80nm, for example equal to 300nm. The connection pads 36 are in electrical contact with the connection pads 34.

[0078] With reference to [Fig.4C], an intermediate insulating layer 37 is deposited, made of an insulating material such as silicon oxide, so as to then define the quarter-wave cavity with the antenna. SiO2 can thus be deposited by plasma-enhanced physical vapor deposition (PECVD), with a thickness of 1.2 pm, at a deposition temperature less than or equal to 400°C to respect the thermal budget of the CMOS reading circuit. A chemical-mechanical polishing step can then be carried out to remove excess material and planarize the intermediate insulating layer 37 to a thickness of approximately 1 pm. Second conductive vias 38 are then produced, through the intermediate insulating layer 37, coming into contact with the connection pads 36.

[0079] With reference to [Fig.4D] and [Fig.4E], the lower conductive part 11 of the antenna and the lower metal layer 21 of the diode are then produced. To do this, a layer of at least one metallic material is deposited, which is structured by lithography and etching. The layer is preferably formed from a multilayer metal metal, for example Ti / TiN / AlCu. This multilayer forms both the lower conductive part 11 of the antenna and the lower metal layer 21 in AlCu of the diode. The multilayer may have a total thickness preferably between 200 and 500nm. The metal layer 21 in AlCu has a thickness preferably greater than 80nm to ensure the quality and continuity of the metal layer. From the multilayer, an upper connection pad 39 is also formed, intended to polarize the upper conductive part of the antenna. An upper insulating layer 40 is then deposited, for example in a silicon oxide of the TEOS type, which is planarized to free the upper face of the metal layer 21 of the diode as well as that of the upper connection pad 39.

[0080] With reference to [Fig.4F], an insulating layer 41 is then deposited, covering the metal layer 21, the connection pad 39, and the upper insulating layer 40. This insulating layer 41 is made of the first electrical insulator II and is intended to form the first insulating layer of the diode. In this example, it is made of Al2O3 with a thickness of between 0.5 and 2nm, and here 0.5nm. It can be deposited by atomic layer deposition (ALD) between approximately 200°C and 400°C.

[0081] With reference to [Fig.4G], a semiconducting layer 44 of graphene, here a monoatomic layer, is produced on an insulating layer 43, here made of a silicon oxide, resting on a support substrate 42. The graphene can be initially deposited on a copper substrate (not shown) by a high-temperature chemical vapor deposition technique, for example at approximately 1000°C, then be transferred onto the oxide layer 43.

[0082] With reference to [Fig.4H], a layer 45 of a polymer such as polymethyl methacrylate (PMMA), or a layer of glue, is deposited on the semiconducting layer 44 of graphene.

[0083] With reference to [Fig.41], the support substrate 42 and the oxide layer 43 are removed, for example by wet etching of the oxide layer 43 with hydrofluoric acid (HF) in the vapor phase. A layer 45 of PMMA is thus obtained on which the semiconductor layer 44 of graphene rests. Note that this technique for producing and transferring a graphene layer is notably described in the article by Lee et al. entitled Multilayered Graphene Electrode using One-Step Dry Transfer for Optoelectronics, Current Optics and Photonics, Vol. 1, Issue 1, pp. 7-11 (2017).

[0084] With reference to [Fig.4J], the semiconducting layer 44 of graphene is transferred onto the insulating layer 41 of Al2O3. The semiconducting layer 44 of graphene is then brought into contact with the Al2O3.

[0085] With reference to [Fig.4K], the PMMA layer 45 is removed, for example with an acetone-type solvent, to free the upper face of the graphene semiconductor layer 44. Then, an insulating layer 46 is deposited, covering the semiconductor layer 44 of graphene. This insulating layer 46 is made of the second electrical insulator 12 and is intended to form the second insulating layer of the diode. In this example, it is made of HfO2 with a thickness of between 0.5 and 2nm, and here 0.5nm. It can be deposited by atomic layer deposition (ALD) between approximately 200°C and 400°C.

[0086] With reference to [Fig.4L] and [Fig.4M], the stack of insulating layers 41, 46 and the graphene semiconductor layer 44 is locally etched, so as to form the capacitor 22, 23, 24 of the diode 20. The etched stack may have dimensions in the XY plane of the order of 50 to 500nm on each side. Then, the upper metal layer 25 of the diode 20 is produced, as well as the upper conductive part 12 of the antenna 10. The deposition is carried out in a through opening defined in a resin layer (not shown). Here, a layer of Ni forming the metal M2 of the metal layer 25 is deposited, for example with a thickness of at least 80nm, followed by the deposition of Al, Au, or Pt. The resin layer is then removed, for example using a solvent such as acetone. This produces the metallic layer 25 of Ni which is in contact with at least one surface of the insulating layer 24 of HfO2 on the one hand, and which also comes into contact with the upper connection pad 39.It is covered by the metal(s) which form the upper conductive part 12 of the antenna 10.

[0087] Thus, a rectenna 1 is obtained formed of an antenna 10 here of the butterfly type, and of a MIGIM diode 20 located between the two vertices of the triangular conductive parts of the antenna 10. The diode 20 is polarized by means of conductive vias which extend between the conductive parts 11, 12 of the antenna 10 and the reading circuit. In addition, the antenna 10 is vertically spaced from a reflector 35, thus forming a quarter-wave cavity optimizing the absorption of the LWIR radiation. Insofar as the MIGIM diode 20 contains the semiconducting layer 23 made of graphene located between the insulating layers 22, 24, the MIGIM diode 20 allows the transmission of the charge carriers by resonant tunneling effect while presenting improved performances, in particular in terms of dynamic resistance and asymmetry, and therefore responsivity.

[0088] Particular embodiments have just been described. Different variants and modifications will appear to those skilled in the art.

[0089] Thus, the graphene semiconductor layer 23 can be electrically polarized by dedicated electrical means, in addition to the electrical polarization of the diode 20. The electrical polarization of the graphene semiconductor layer 23 can be applied laterally, i.e. here along the Y axis. Such additional electrical polarization can increase the asymmetry of the I(V) characteristic of the diode 20, thus improving the performance of the rectenna 1.

[0090] Such additional electrical polarization of the graphene semiconductor layer 23 can be effected by additional conductive parts of the antenna 10, extending for example along the Y axis, which would then be a second main axis for detecting the electromagnetic radiation of interest.

Claims

Claims

1. Rectifying device (1), comprising: • an antenna (10), adapted to absorb electromagnetic radiation of interest; • a diode (20) of the MIIM type, electrically coupled to the antenna (10), comprising: • a first metal layer (21) and a second metal layer (25); • a first insulating layer (22) made of a first electrical insulator (II) having an electronic affinity q>i, and a second insulating layer (24) made of a second electrical insulator (12) having an electronic affinity q>2 different from q>i / • characterized in that the diode (20) comprises a semi-conductor layer (23) of graphene (G), located between the first and second insulating layers (22, 24), • and in that the first metal layer (21) is made of a first metal (Ml) having an output work WMi less than or equal to the output work WG of the graphene (G).

2. A rectifier device (1) according to claim 1, wherein the graphene semiconductor layer (23) is formed of at most two monoatomic sheets.

3. Rectifying device (1) according to claim 1 or 2, wherein the first and second insulating layers (22, 24) have a thickness of between 0.5 and 2 nm.

4. Rectifying device (1) according to any one of claims 1 to 3, in which the first and second metal layers (21, 25) have a thickness at least equal to 80nm.

5. Rectifying device (1) according to any one of claims 1 to 4, wherein the electronic affinities q>i and q>2 of the first and second electrical insulators (II, 12) are lower than the work function WG of the graphene (G).

6. Rectifying device (1) according to any one of claims 1 to 5, comprising an electrical source adapted to apply a voltage non-zero VD polarization electric current to the diode (20).

7. Rectifying device (1) according to claim 6, wherein the electrical source is adapted to apply an electrical potential to the first and second metal layers (21, 25), the electrical potential applied to the second metal layer (25) being greater than that applied to the first metal layer (21).

8. Rectifying device (1) according to any one of claims 1 to 5, wherein the first metal layer (21) has an electrical potential equal to that of the second metal layer (25).

9. Rectifying device (1) according to any one of claims 1 to 8, comprising a reflector (35) of the electromagnetic radiation of interest, located between a support substrate and the antenna (10), and spaced from the antenna (10) so as to form a quarter-wave cavity.

10. Rectifying device (1) according to any one of claims 1 to 9, wherein the antenna (10) is adapted to absorb electromagnetic radiation in the infrared or terahertz range.

11. Device, comprising a matrix of rectifier devices (1) according to any one of claims 1 to 10, identical to each other.

12. A method of manufacturing a rectifier device (1) according to any one of claims 1 to 10, comprising the following steps: • producing a first conductive part (11) of the antenna (10); • producing the first metal layer (21) of the diode (10), in electrical contact with the first conductive part (11) of the antenna (10); • producing a first continuous insulating layer (41), produced from the first electrical insulator (II), in electrical contact with the first metal layer (21); • producing a continuous semiconducting layer (44) of graphene, in contact with the continuous insulating layer (41); • producing a second continuous insulating layer (46), produced from the second electrical insulator (12), in contact with the continuous semiconducting layer (44) of graphene;• structuring the first continuous insulating layer (41), the continuous semiconductor layer (44) and the second continuous insulating layer (46), so as to form the first; insulating layer (22), the semiconductor layer (23) of graphene, and the second insulating layer (24) of the diode (20); production of the second metal layer (25) of the diode (10), in electrical contact with the second insulating layer (24) of the diode (20); production of a second conductive part (12) of the antenna (10), in electrical contact with the second metal layer (25) of the diode (10).

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