Integrated circuit package

Abstract

Integrated circuit package The present description relates to an integrated circuit package (200) comprising:- a substrate (101) having a first face (101A) and a second face (101B);- an electronic chip (102) having a first face (102A) and a second face (102B) assembled on the first face (101A) of the substrate,; and- a preformed glass (201) assembled on the first face of the substrate and shaped to contain the electronic chip. Figure for abstract: Fig. 2A

Claims

preformed glass (211) has a dome shape, for example a spherical or ovoidal dome.

10. A package according to any one of claims 1 to 9, further comprising a holding piece (221) between the electronic chip (102) and the preformed glass (201), for example the holding piece is assembled on the first face (102A) of the electronic chip and the preformed glass rests on the holding piece.

11. Housing according to any one of claims 1 to 10, in which the second face (101B) of the substrate (101) comprises connection balls (112), for example intended to assemble the substrate to a printed circuit board.

12. Package according to any one of claims 1 to 11, further comprising at least one optical component (103) integrated in the electronic chip (102) or assembled on the first face (102A) of the electronic chip (102), the package being an optical package.

13. An electronic device comprising an integrated circuit package (200; 210; 220; 230) according to any one of claims 1 to 12.

14. A method of assembling an integrated circuit package (200; 210; 220; 230) comprising: - providing a substrate (101) having a first face (101A) and a second face (101B); - assembling an electronic chip (102), comprising a first face (102A) and a second face (102B), on the substrate (101) such that the second face (102B) of the electronic chip is on the first face (101A) of the substrate; and - assembling a preformed glass (201; 211) on the first face of the substrate, said preformed glass being shaped to contain the electronic chip.

15. Method according to claim 14, further comprising, after the assembly of the electronic chip (102) on the substrate (101) and before the assembly of the preformed glass (201; 211) on the first face of the substrate: - the electrical connection of the electronic chip (102) to the substrate (101) by electrically conductive connection wires (104). [Fig. IA] 100 FIG. IA [Fig. IB] 110 FIG. IB [Fig. 2A] 200 210 FIG. 2B

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