Heat dissipation assembly

Abstract

A heat dissipation assembly comprising: a base plate (10) having at least one opening (11) and mounting elements for holding an electronic component opposite the at least one opening (11), and a heat sink (20) independent of the base plate (10) and comprising at least one thermal contact inserted through the at least one opening (11) and arranged to be in thermal contact with the electronic component. Figure for the abbreviation: Fig. 1.

Description

Title of the invention: Heat dissipation assembly technical field

[0001] The present invention relates generally to a heat dissipation assembly, an electronic device containing at least one such heat dissipation assembly and a manufacturing method for manufacturing such a heat dissipation assembly and such an electronic device. State of the art

[0002] Heat sinks are known in the prior art. However, these systems may have disadvantages related to high weight, high cost and / or limited thermal performance. Summary of the invention

[0003] One aim of the present description is to address the disadvantages of the prior art mentioned above and in particular, first of all, to propose an inexpensive heat dissipation assembly allowing high heat dissipation and a reduction in the weight of the heat dissipation assembly and / or of an electronic device containing it.

[0004] To this end, a first aspect of the description concerns a heat dissipation assembly comprising: - a base plate comprising at least one opening and fixing elements for holding an electronic component opposite at least one opening, - a heat sink independent of the base plate and comprising at least one thermal contact introduced through at least one opening and arranged to be in thermal contact with the electronic component.

[0005] In an assembled configuration, the heat sink is essentially located on one face of the base plate, while the electronic component and the thermal switch are located on a second face of the base plate opposite the first face. Preferably, the thermal switch protrudes from the base plate.

[0006] Such a two-part heat dissipation assembly can be lightweight, inexpensive to manufacture and integrate, and achieve good thermal performance. The base plate can have a structural support function and / or a thermal energy dissipation function, while the heat sink can be limited to heat dissipation. For example, a first manufacturing process One manufacturing process can be used for the base plate, and a second process can be used for the heat sink. Thus, the base plate can be a stamped sheet metal piece, and the heat sink can be extruded or molded.

[0007] Advantageously, the heat sink is supplied as a single unit to reduce costs and optimize thermal performance. Furthermore, the heat sink may include a raised surface opposite the thermal contactor, the raised surface maximizing heat exchange with the surrounding atmosphere. This raised surface may include studs, fins, blades, channels, or trenches.

[0008] Advantageously, the thermal contactor comprises a contact surface arranged to be in thermal contact with the electronic component and a dissipation plate from which the relief protrudes. Advantageously, the contact surface is fixed to the dissipation plate in such a way as to allow passage of the surrounding atmosphere between the dissipation plate and the contact surface. Alternatively, or in combination with the protruding relief, the base plate may be identical to the relief and may include, for example, angles or undulations allowing the maximization of heat exchange.

[0009] Advantageously, the thermal contactor includes a shielding surface arranged recessed and surrounding the contact surface so as to receive an electromagnetic shielding layer for the electronic component. Preferably, this electromagnetic shielding layer is configured to surround the electronic component when the electronic component is in thermal contact with the contact surface and can be perforated to leave a free space in its center for the contact surface.

[0010] Advantageously, the mounting elements are arranged to secure the electronic component from 3 mm to 30 mm from the base plate. Such a distance from the electronic component allows for optimized heat dissipation. For example, the electronic component is fixed directly or through a printed circuit board or electronic board that supports it.

[0011] Another aspect of this description relates to an electronic device comprising:

[0012] - the heat dissipation assembly as described previously,

[0013] - an electronic component, fixed to the base plate so as to be in contact thermal with the thermal contactor.

[0014] Another aspect of this description relates to a method for manufacturing a heat dissipation assembly as described above, comprising: the supply of the base plate, the supply of the heat sink, - the assembly of the heat sink on the base plate, so as to introduce the thermal contactor of the heat sink through at least one opening in the base plate. This process can enable the simple and inexpensive manufacture of a heat sink that is easy to integrate and thermally efficient.

[0015] Advantageously, the process includes manufacturing the base plate by stamping, which limits the cost and weight of the base plate. Cutting and perforation steps may also be included.

[0016] Advantageously, the process includes manufacturing the heat sink by extrusion, which makes it possible to obtain a high level of thermal performance. Alternatively, the heat sink is manufactured by molding or machining, or a combination of these processes. Description of the figures

[0017] Other features and advantages of this description will become clearer upon reading the following detailed description of the embodiment(s) given by way of non-infinitive example(s) and illustrated by the accompanying drawings, in which:

[0018] [Fig-1] represents an exploded view of a heat dissipation assembly according to the present description with two electronic components;

[0019] [Fig.2] represents a view of a base plate according to the present description;

[0020] [Fig.3] represents an opposite view of a base plate according to [Fig.2];

[0021] [Fig.4] represents a side view of a heat sink according to the present description ;

[0022] [Fig.5] represents a three-quarter view of a heat sink according to [Fig.4];

[0023] [Fig.6] represents a heat dissipation assembly according to the present description in assembled configuration;

[0024] [Fig.7] represents an opposite view of the heat dissipation assembly according to [Fig.6];

[0025] [Fig.8] represents a heat dissipation assembly of the [Fig.6] ready for mounting on a printed circuit board.

[0026] A heat sink is an essential component used in electronics to effectively control the heat generated by various electrical devices. This device plays the crucial role of balancing and dissipating the heat produced during the operation of components such as semiconductors or microprocessors. Heat dissipation is fundamentally important because it allows for maintaining a critical temperature at which devices operate optimally without risk of failure.

[0027] Heat sinks are designed with various heat-conducting materials, such as copper and aluminum, known for their excellent thermal conductivity. They can be manufactured as removable plates or integrated directly into electronic circuit designs. The purpose is to transfer heat to an external dissipation point, such as a cool, ventilated surface or an external cooling source such as fresh air.

[0028] The main purpose of a heat sink in electronic devices is to maintain proper operation, extend their lifespan, improve performance, and ensure safety. Excessive heat can negatively affect component operation, leading to decreased efficiency or even failure. By effectively controlling the internal temperature, heat sinks help prevent these problems and thus ensure the long-term proper functioning of electronic devices.

[0029] Heat sinks have been produced by extrusion: this manufacturing process generates profiles using a die and offers solutions for reducing the weight of the heat sinks. The aluminum used in this manufacturing method has better thermal performance than that used in injection molding. Furthermore, this process allows for thinner thicknesses, thus significantly reducing the volume and weight of the part. The drawback of extrusion is the requirement for simple shapes. Indeed, it does not allow for complex shapes to serve as structures, particularly for mechanically securing electronic boards or for assembling mechanical parts.

[0030] Heat sinks can be produced by molding, for example by injecting thermally conductive material such as aluminum or one of its alloys into a mold. This manufacturing process allows for the production of complex parts, but it requires greater thicknesses, for example, minimum thicknesses of 2 mm and draft angles of at least 3°. Furthermore, the aluminum alloy used for injection molding is less thermally efficient compared to extrusion. Heavy and expensive parts are thus obtained, resulting in a less thermally efficient heat sink with excess material to meet the minimum thickness requirements. On the other hand, it is possible to create a mechanical structure for mounting on the circuit board or mechanical components.

[0031] Finally, a stamped plate can act as a heat sink: stamping is a simple and inexpensive manufacturing process that allows for the production of structurally complex parts for assembling electronic boards and mechanical components. However, it does not allow for the creation of a large number of fins to achieve a significant heat exchange surface with the ambient air and thus good thermal performance. Therefore, in the case of Stamped plates acting as heat sinks, their thermal performance remains quite low.

[0032] A heat dissipation assembly according to this description has been designed with these considerations in mind and includes a base plate and a heat sink that is independent of the base plate and can be fitted or arranged within the base plate. The heat sink is designed to be in thermal contact with an electronic component. Description of the implementation methods

[0033] Fig. 1 represents a heat dissipation assembly comprising a base plate 10 having at least one, for example two openings 11, and a heat sink 20 configured to fit into the base plate 10 so as to contact at least one, for example two electronic components 41 located on an opposite face with respect to the heat sink 20.

[0034] Figures 2 and 3 show the two faces of the base plate 10 comprising at least one opening 11 passing through the base plate 10, for example at least two openings 11. The openings 11 are for example square, but can have any geometry and are adapted to accommodate or fit at least a part of the heat sink 20. For example, the base plate 10 can comprise a first face 10A and a second face 10B opposite the first face 10A.

[0035] The base plate 10 comprises at least one fastening element 12, for example, a plurality of fastening elements 12. These fastening elements may be studs arranged to receive a screw or rivet, or to be fitted together with another fastening element of another element to be fixed to the base plate. Alternatively, the fastening elements 12 may take other forms, such as through holes or recesses allowing for fitting.

[0036] The base plate 10 may include at least one other opening allowing the passage of an electrical connector or an electronic card, for example a communication opening 13. Such a communication opening 13 may be provided with an electromagnetic shielding element 14 as required, for example supported on the base plate 10. In the example of Figures 2 and 3, this electromagnetic shielding element 14 comprises two sub-electromagnetic shielding elements each placed on one of the first and second faces 10A, 10B.

[0037] Furthermore, at least one recess 15 may be provided to accommodate a bulky element positioned opposite the base plate 10. This recess 15 may be a raised feature of the base plate 10, that is to say, a deformed portion defining a recess and creating a volume to accommodate the bulky element and / or to bring it closer to another element located opposite the face of the plate of base 10. In addition, a surface of the footprint 15 can be in thermal contact with the bulky element or the other element if moderate heat dissipation is required. Thus, the base plate 10 can be adapted to different internal configurations of an electronic device and / or can allow direct heat dissipation for electronic components that generate little heat.

[0038] Finally, other elements can be supported by the base plate 10, such as a ventilation grille 30 to allow hot air to escape from the electronic device, in order to permit or optimize the airflow on at least one face, for example, on both faces of the base plate 10. The ventilation grille 30 may have irregular or anisotropic perforations so as to force the airflow in a certain direction and / or be provided with a sleeve or walls to direct the airflow. The ventilation grille 30 may also provide electromagnetic shielding to meet electromagnetic compatibility (EMC) requirements.

[0039] The base plate 10 therefore serves as a support or chassis, allowing for the attachment and organization of electronic elements and / or components on either side of the base plate 10. Furthermore, the base plate 10 is preferably made of a thermally conductive material such as metal, and can thus contribute to a heat dissipation function with or without a heat sink. For example, the base plate 10 is a stamped sheet, for example, a sheet of steel, preferably stainless steel, a sheet of aluminum alloy, preferably from the Ixxx, 3xxx, or 5xxxx series as known to those skilled in the art, or even a sheet of copper or brass.

[0040] Figures 4 and 5 show two views of the heat sink 20. The heat sink comprises at least one thermal contactor 21 arranged to be in thermal contact with an electronic component, for example, two thermal contacts 21 as seen in Figures 4 and 5. In addition, the heat sink 20 may comprise at least one anchor 22 arranged to allow attachment to the base plate 10, for example, through a fastening element 12 of the base plate 10 or another fastening element such as a rivet or a screw. In [Fig. 5], three anchors 22 are visible in the form of through holes.

[0041] Preferably, at least one thermal switch 21 comprises a protruding contact surface 23, i.e., positioned above a shielding surface 24. The contact surface is arranged to be in thermal contact with an electronic component, and the optional shielding surface 24 is arranged to receive an electromagnetic shielding layer 43 as illustrated in [Fig. 8]. Alternatively, the upper surface of the thermal switch 21 is provided to be in thermal contact with the electronic component 4L. In this case, electromagnetic shielding may be provided around the thermal switch 21 if necessary.

[0042] The thermal contactor 21 can protrude from a heat dissipation plate 27 and can be fixed to this heat dissipation plate 27 so as to allow heat exchange with a surrounding environment. In Figures 4 and 5, such a fixing is achieved by means of strips 25 defining at least one channel 26 or tunnel between the heat dissipation plate 27 and the thermal contactor 21, the channel allowing a flow of air or gas, for example ambient air, to circulate. Three channels 26 are visible under each thermal contactor 21 in Figures 4 and 5.

[0043] On the dissipation plate 27, a relief 28 can optimize heat exchange with the surrounding environment. For example, the relief 28 protrudes from the face of the dissipation plate 27 opposite the face housing the thermal contactor 21. The relief 28 can comprise a plurality of slats 28a or fins, or any other structure known to those skilled in the art that maximizes solid / gas heat exchange, such as corrugated structures, channels, or studs. Alternatively, or in combination, the dissipation plate 27 has a shape that optimizes heat exchange, for example, a non-planar shape with corrugations or angles.

[0044] The heat sink 20 is preferably made in one piece from a thermally conductive material such as a metal, for example aluminum or an aluminum alloy such as alloys 6063 and 1050. For example, the heat sink 20 is manufactured by extrusion. Alternatively, the heat sink 20 is manufactured by injection molding, machining, or a combination of these techniques. Other suitable materials for the heat sink 20 include copper, graphite, metal matrices (MMCs), or technical ceramics, for example, based on aluminum nitride (AIN) or boron nitride (BN).

[0045] Figures 6 and 7 show a heat dissipation assembly according to the present description in its assembled configuration. The heat dissipation plate 27 is thus fixed to one face of the base plate 10, such as the first face 10A, for example by screws or rivets (see [Fig. 7]). The thermal contacts 21 are passed through the corresponding openings 11 in the base plate 10, so as to protrude from the base plate 10 on the second face 10B, opposite the first face 10A to which the heat dissipation plate 27 of the heat sink 20 is fixed. Preferably, the heat dissipation plate 27 of the heat sink 20 can be fixed in thermal contact with the base plate 10, for example by direct contact. In addition, the thermal contact 21 can be in thermal contact with the base plate 10, for example by direct thermal contact with at least one of the fins 25.

[0046] A method for manufacturing a heat dissipation assembly may include the following steps. The base plate may be manufactured, for example by stamping a sheet of metal, so as to create at least one opening 11 and optionally the necessary holes, for example, for the fastening elements 12, as well as at least one optional communication opening 13 and at least one optional indentation 15, depending on the specific application of the heat dissipation assembly. Furthermore, the base plate 10 may be cut to the correct dimensions. Fastening means 12, a ventilation grille 30, and / or at least one electromagnetic shielding element 14 may then be attached to the base plate 10, as required, or after the assembly step described below.

[0047] Simultaneously, or before or after the above step, the heat sink 20 can be obtained, for example, by injection molding, machining, or preferably by extrusion. The heat sink 20 is then assembled to the base plate 10 to obtain the heat dissipation assembly by inserting the thermal contactor 21 through the opening 11. A fastening step may be provided to secure the heat sink 20 to the base plate 10, for example, by screwing, riveting, or locking.

[0048] Once the heat sink 20 is attached to the base plate 10, the thermal mounting assembly can be attached to an electronic component, either directly by attaching the electronic component to the base plate 10 using the mounting elements 12, or indirectly by attaching a circuit board 40 (PCB) supporting the electronic component 41 to the base plate 10 using the mounting elements 12, as shown in [Fig. 8]. For example, screws or rivets can be inserted through mounting holes 42 in the circuit board and fastened into the mounting elements 12, or the mounting holes 42 can fit one end of the mounting elements 12.

[0049] The thermal contactor 21 is then brought into thermal contact with the electronic component 41 either by direct contact or through a thermal gel or a layer of thermally conductive material, such as a silicone pad. Furthermore, an electromagnetic shielding layer 43 can be provided around the electronic component 41 and come into contact with, or be compressed by, the shielding surface 24 so as to provide good electromagnetic sealing without hindering heat transfer.

[0050] The electronic component 41 and / or the electronic board 40 can thus be fixed at a distance from the base plate 10, for example by means of the fixing elements 12. For example, a space of 3 to 30 mm, preferably 6 to 24 mm and even more preferably 11 to 19 mm is provided between the electronic component 41 and / or the electronic board 40 and the base plate. This spacing thus corresponds to a height of the heat sink 20 protruding from the base plate 10, for example the height of thermal contactor 21 and of the blades 25 less the thickness of the base plate 10. Alternatively or in combination, this spacing corresponds to a height of the fixing elements 12, for example measured from the base plate 10.

[0051] In an example not shown, a second electronic component or a second electronic board may be fixed to the first face 10A opposite the electronic board 40. For example, this second electronic board may include electronic components dissipating less heat than the electronic board 40, in which case a heat sink is not necessary. Heat dissipation can then occur naturally or by simple thermal contact with the base plate 10.

[0052] Alternatively, a second heat sink can be attached to the base plate 10, through other openings in the base plate (not shown) and in a reverse orientation with respect to the heat sink 20. In this way, at least two electronic boards can be mounted on either side of the base plate. Furthermore, electrical or electronic communication between these at least two electronic boards can be ensured by a connector, a cable, or a communication electronic board inserted through the communication opening 13, and, for example, surrounded by the electromagnetic shielding element 14.

[0053] The recess 15 can accommodate an electronic component or any other bulky element on one face of the base plate and / or provide moderate heat dissipation for this electronic element through thermal contact between a surface of the recess 15 and this electronic component. Furthermore, the base plate 10 can itself be attached to a housing or chassis and / or attach accessory elements such as wiring, one or more fans, and / or components of a liquid cooling system (not shown).

[0054] The base plate 10 therefore has a structural function by supporting and securing the heat sink 20 and the electronic board 40 and / or the electronic component 4L. It thus makes it possible to lighten an electronic device and simplify its manufacture by minimizing the number of elements required for securing the electronic components and dissipating the generated heat, for a reduced cost. The heat sink can be optimized for heat dissipation, without taking into account mechanical constraints. It can be manufactured by a different process than the base plate, for example by extrusion, and thus allow for optimal heat exchange.

[0055] During operation, the electronic component 41 will generate heat and this heat will be transferred to the heat sink 20, allowing an exchange of optimal heat with the surrounding environment through relief 28 and preferably through the dissipation plate 27, the lamellae 25 and at least one channel 26.

[0056] In addition, the base plate 10 is preferably made of a thermally conductive material and is preferably in thermal contact with the heat sink 20, thereby increasing the exchange surface and thus optimizing the transfer of thermal energy generated by the electronic component to the external environment. Industrial application

[0057] A heat dissipation assembly according to the present description, and its manufacture, are capable of industrial application in order to structure and ensure heat exchange in any type of electronic device having any type of electronic component.

[0058] A non-exhaustive list of electronic devices in which one or more embodiments are likely to be implemented includes computers, graphics cards, computer servers, routers, internet or wide area network access gateways, network switches, televisions, computer monitors, set-top boxes, power audio amplifiers, dimmers for high-power LED lighting, power supplies for computers and other electronic devices, fast chargers for smartphones and tablets, inverters for uninterruptible power supply systems, electric motor controllers for electric vehicles and industrial equipment, high-power electrical transformers, RF amplifiers for wireless communication equipment, voltage regulators for power electronic systems,Electric vehicles, renewable energy systems, and battery energy storage systems.

[0059] A non-exhaustive list of electronic components includes general-purpose processing processors (CPU) and / or dedicated processing processors (DSP, FPGA, etc.) for desktops, laptops, servers, switches and routers, graphics processing units (GPUs) for desktops, laptops and servers, gateways, multimedia equipment, memory modules (RAM) for desktops, switches, routers, laptops and servers, power transistors (MOSFETs, IGBTs, BJTs), power diodes (Schottky diodes, PIN diodes), linear voltage regulators (LDOs, low dropout regulators), switching voltage regulators (Buck, Boost, Buck-Boost), power operational amplifiers, thyristors (SCRs, TRIACs), silicon-controlled rectifiers (SCRs), IGBT modules for variable frequency drives and inverters, power resistors (wirewound resistors, thick-film resistors), power inductors. (iron core inductors, ferrite core inductors), power transformers (high frequency transformers, low frequency transformers), power LED modules for lighting, electric motors, power modules for telecommunications equipment (RF amplifiers, transceivers), power modules for medical equipment (ultrasound amplifiers, X-ray generators) and power modules for welding equipment (welding inverters, welding rectifiers).

[0060] It will be understood that various modifications and / or improvements obvious to a person skilled in the art can be made to the different embodiments of the description described in this description without going out of the scope of the description.

[0061] In particular, it should be noted that the base plate is not limited to a specific shape or dimensions, but can be adapted to the desired application. The heat sink can have any suitable shape and, in particular, any type of relief. The thermal contactor can have any suitable shape and is not limited to a parallelepiped. Several base plates can be fixed together, and each base plate can include one or more heat sinks, fixed parallel or staggered on one or both sides of the base plate.

Claims

Demands

1. Heat dissipation assembly comprising: a. a base plate (10) including at least one opening (11) and fixing elements (12) for holding an electronic component (41) opposite the at least one opening (11), and b. a heat sink (20) independent of the base plate (10) and including at least one thermal contactor (21) introduced through the at least one opening (11) and arranged to be in thermal contact with the electronic component (41).

2. Heat dissipation assembly according to claim 1, wherein the heat sink (20) is provided as a single block and includes at least one relief (28) opposed to the thermal contactor (21), the relief (28) being configured to maximize heat exchange with the surrounding atmosphere.

3. Thermal dissipation assembly according to claim 2, wherein the thermal contactor (21) comprises a contact surface (23) arranged to be in thermal contact with the electronic component (41) and a dissipation plate (27) from which the relief (28) protrudes, the contact surface (23) being fixed on the dissipation plate (27) so as to permit passage of the surrounding atmosphere between the dissipation plate (27) and the contact surface (23).

4. Heat dissipation assembly according to claim 3, wherein the thermal contactor (21) includes a shielding surface (24) arranged recessed and around the contact surface (23) so as to receive an electromagnetic shielding layer (43) for the electronic component (41).

5. Heat dissipation assembly according to any one of claims 1 to 4, wherein the fixing elements (12) are arranged to fix the electronic component (41) from 3 mm to 30 mm from the base plate (10).

6. Electronic device comprising: - the heat dissipation assembly according to any one of claims 1 to 5; and

7.

8.

9.

10. - an electronic component (41), fixed to the base plate (10) so as to be in thermal contact with the thermal switch (20). Method for manufacturing a heat dissipation assembly according to any one of claims 1 to 5, comprising: - the supply of the base plate (10), - the supply of the heat sink (20), - the assembly of the heat sink (20) on the base plate, so as to introduce the thermal contactor (21) of the heat sink (20) through at least one opening (11) of the base plate (10). Manufacturing method according to claim 7, comprising manufacturing the base plate (10) by stamping. Manufacturing method according to claim 8, comprising manufacturing the heat sink (20) by extrusion. Use of a heat dissipation assembly according to any one of claims 1 to 5, to dissipate the thermal energy of an electronic component (41).

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