Cooling module for power electronics components

Abstract

Cooling Module for Power Electronics Components The present invention relates to a cooling module for power electronics components, comprising: - a support plate, - side walls (34, 36) adapted to at least partially surround power electronics components, the side walls (34, 36) defining a receiving area for the power electronics components on the support plate, - a heat transfer fluid circuit (6) extending within the side walls (34, 36), from a first end (61) of the heat transfer fluid circuit (6) to a second end of the heat transfer fluid circuit (6), the cooling module being characterized in that the side walls (34, 36) are formed of a sealed casing (5) and a structure (4) nested within the sealed casing (5), the heat transfer fluid circuit (6) being delimited partly by the structure (4) and partly by the sealed casing (5).(Figure 3).

Description

Title of the invention: Cooling module for power electronics components

[0001] The present invention relates to the fields of mechanics and thermodynamics, and more specifically concerns a cooling module for power electronics components, finding particular application in the automotive field.

[0002] Electric or hybrid vehicles incorporate various power electronic devices to operate their electric motors, to charge their high-voltage batteries and to power their on-board networks.

[0003] These power electronic devices include components which are subjected in operation to high currents, of several hundred amperes, which causes an increase in their temperature and is likely to damage them in the absence of specific cooling means.

[0004] Generally, the choke coils or transformer coils of these power electronic devices are placed, by means of thermal paste, on a cooling plate through which glycol water flows, circulating in a heat transfer fluid circuit including a heat exchanger. These coils, and other power electronic components, are further protected in housings dedicated to a specific function, such as a charger or DC-DC converter housing.

[0005] Given the integration requirements driving the need to increasingly reduce the size of these power electronic devices, the inventors seek to group components of a charger and a DC-DC converter within a single housing, by grouping certain components requiring specific cooling in an enclosure whose side walls are cooled by glycol water. In this way, the cooling of these components is more efficient than with a simple water plate.

[0006] However, such an enclosure is preferably made of steel or aluminum by casting, and its design is therefore subject to the constraints of its manufacturing process, which notably requires radii of curvature and angles adapted to the demolding of the enclosure. It is therefore difficult to produce an enclosure whose side walls, connected at right angles, incorporate an efficient cooling circuit, that is to say, one that provides homogeneous cooling of the side walls without significant pressure losses.

[0007] Furthermore, in order to also cool other components of the charger and the DC-DC converter, which only require a cooling surface because, for example, they are located on a printed circuit board, tubular connections could link a heat transfer fluid circuit from a water plate cooling these other components to the enclosure's cooling circuit. However, these tubular connections would add bulk and pressure drop, which is undesirable.

[0008] There is therefore a need to create an efficient, industrializable and inexpensive cooling module for power electronics components that rapidly heat up during operation, and that allows integration into a housing containing other power electronics components that may also require cooling.

[0009] The present invention aims to remedy at least in part the aforementioned drawbacks by providing a cooling module that is inexpensive to manufacture, allowing for the lateral cooling of power electronics components, with a heat transfer fluid circuit that can be complex while running through several lateral walls of the cooling module.

[0010] To this end, the invention proposes a cooling module for power electronics components, comprising: - a support plate, - side walls suitable for at least partially enclosing power electronics components, the side walls defining a receiving area for the power electronics components on the support plate, - a heat transfer fluid circuit extending through the side walls, from a first end of the heat transfer fluid circuit to a second end of the heat transfer fluid circuit, the cooling module being characterized in that the side walls are formed of a sealed envelope and a structure nested within the sealed envelope, the heat transfer fluid circuit being delimited partly by the structure and partly by the sealed envelope.

[0011] The cooling module according to the invention is of course not limited to integration in an electric charger for electric or hybrid vehicles, it finds applications in any electrical product requiring cooling of all or part of its components.

[0012] Furthermore, the receiving area is part of the support plate. This receiving area is intended to receive power electronics components that generate a lot of heat, such as choke coils or transformers, and the side walls are suitable for cooling them.

[0013] Since the heat transfer fluid circuit is entirely formed by the sealed casing and the structure, the invention simplifies a complex heat transfer fluid circuit diagram into a portion of the circuit made from a moldable or machined structure, and another portion made from a moldable or machined sealed casing. The sealed casing is preferably metallic, for example aluminum or steel, which provides good thermal conductivity, and the structure is, for example, metallic or made of a synthetic polymer. The structure may be made of several parts assembled together.

[0014] Thanks to the invention, a simple realization of a cooling module is made possible, comprising a single heat transfer fluid circuit running through several lateral walls of the module, this circuit being able to take complex forms and thus run over a large extent of the lateral walls with little pressure loss.

[0015] The sealed casing and structure optionally extend the heat transfer fluid circuit into the receiving area. Thus, the heat transfer fluid circuit in the receiving area forms a cooling surface intended to be interposed between the support plate and the power electronics components, the cooling surface covering, for example, at least 90% of the receiving area.

[0016] In this embodiment of the invention, power electronics components that are prone to overheating are therefore arranged on a portion of the sealed enclosure and structure located in the receiving area, thus allowing them to be cooled at their bases as well, without the need for an additional cold plate. The corresponding cooling surface is formed by the surface of the sealed enclosure delimiting the heat transfer circuit above the receiving area, between the side walls of the cooling module.

[0017] In one embodiment of the invention, the structure is formed of blocks of material having straight cutouts opening opposite the sealed casing or the support plate, the straight cutouts intersecting each other from the first to the second end of the heat transfer fluid circuit. In other words, in this embodiment of the invention, the part of the heat transfer fluid circuit formed by the structure can only be made by drilling, for example, orthogonally to the walls of the blocks of material forming the structure, these blocks of material being, for example, parallelepiped-shaped. Alternatively, the blocks of material of the structure are not parallelepiped-shaped and the straight cutouts are made at angles other than 90° to the walls of the blocks of material, these angles being, however, sufficiently large to allow a milling cutter to make the corresponding cutouts.

[0018] According to an optional and advantageous feature of the invention, the structure is formed from a single machined piece. This allows for low-cost manufacturing. Alternatively, the structure is formed by high-pressure injection, or from several pieces assembled together by welding, gluing, or screwing.

[0019] In one embodiment of the invention, the cooling module includes at least one closing plate attached to the sealed casing and disposed between the support plate and the structure, the closing plate having a first orifice opposite the first end of the heat transfer fluid circuit and a second orifice opposite the second end of the heat transfer fluid circuit.

[0020] This sealing plate is attached in a watertight manner to the sealed casing, so as to completely enclose the structure between the sealed casing and the sealing plate, with the heat transfer fluid only able to pass through the first and second openings. Alternatively, this sealing plate is formed by the structure itself. It is understood that the heat transfer fluid circuit need not be completely watertight between the structure and the sealed casing, provided that the heat transfer fluid cannot leak from the sealed casing and the sealing plate, or from the portion of the structure closing the sealed casing, except through the first and second openings of the sealing plate or, respectively, through the first and second ends of the heat transfer fluid circuit.

[0021] In one embodiment of the invention, the heat transfer fluid circuit runs through three lateral walls of the cooling module, referred to as cooling lateral walls, the cooling module further comprising at least one lateral separation wall between power electronics components, formed solely by the sealed casing.

[0022] For example, the side separation wall is suitable for separating the power electronics components arranged above the receiving area from the other power electronics components of the cooling module, or for separating the power electronics components arranged above the receiving area from each other. These side separation walls have an electromagnetic shielding effect.

[0023] Alternatively, the cooling module includes cooling side walls suitable for separating power electronics components arranged above the receiving area, in addition to the cooling side walls that surround all the power electronics components arranged above the receiving area.

[0024] In this embodiment of the invention, the sealed enclosure comprises, for each cooling side wall, a partition intended to be opposite the power electronics components, the heat transfer fluid circuit extending for example on at least 90% of the partition. This feature of the invention allows for efficient and homogeneous cooling of the power electronics components located above the receiving area.

[0025] In one embodiment of the invention, the support plate includes a heat transfer fluid inlet and a heat transfer fluid outlet, a first junction zone connecting the heat transfer fluid inlet to the first end of the heat transfer fluid circuit and a second junction zone connecting the heat transfer fluid outlet to the second end of the heat transfer fluid circuit.

[0026] The first and second joining zones are, for example, located at least partially on the side opposite the side walls relative to the support plate, the latter having a first opening joining the first joining zone to the first orifice of the closing plate and a second opening joining the second joining zone to the second orifice of the closing plate. The first and second joining zones are, in addition or alternatively, at least partially molded into the support plate.

[0027] Thus the first and second junction zones cool at least minimally the support plate, and therefore the power electronics components of the cooling module which are not located above the receiving zone, without the addition of tubular connections.

[0028] This embodiment therefore makes it possible to connect in series the heat transfer fluid circuit present in the side walls, and a cooling circuit present in the support plate, in an inexpensive manner.

[0029] In this embodiment, the power electronics components are, for example, first power electronics components, the receiving area is a first receiving area, the support plate having a second receiving area for second power electronics components extending beyond the side walls and the first receiving area, the first junction area or the second junction area being capable of forming a cooling surface for the second power electronics components by bringing the heat transfer fluid into contact with the second receiving area for the second power electronics components. The cooling surface for the second power electronics components is a second cooling surface when the heat transfer fluid circuit on the receiving area also forms a cooling surface, referred to in this case as the first cooling surface.

[0030] The first power electronics components are power electronics components capable of generating significant heat and are located between the side walls of the cooling module. These include choke coils or transformers. The second power electronics components are by Examples include capacitors or transistors. The second cooling surface extends, for example, over at least 40% of the second receiving area.

[0031] The first junction zone or the second junction zone comprises, for example, on the one hand, a conduit in the support plate extending at least from the inlet or respectively the outlet of the heat transfer fluid to a rib of the support plate, delimiting the first cooling surface and / or the second cooling surface, and on the other hand, a closing plate attached to the rib.

[0032] When the first junction zone is suitable for forming the cooling surface of the second power electronics components, the support plate optionally includes a third receiving zone for the third power electronics components extending beyond the side walls and the first receiving zone. This second junction zone is suitable for forming a cooling surface for the third power electronics components by bringing the heat transfer fluid into contact with the third receiving zone. The cooling surface for the third power electronics components is a third cooling surface when the heat transfer fluid circuit on the receiving zone forms a first cooling surface.

[0033] The third power electronics components are, for example, capacitors or transistors. The third cooling surface extends, for example, over at least 40% of the third receiving zone.

[0034] The invention also relates to a power electronics device for an electric or hybrid vehicle, at least some of whose components are arranged in a cooling module according to the invention. The power electronics device is, for example, capable of charging a high-voltage battery of the vehicle and of acting as a DC-DC converter. The first power electronics components above the first receiving zone are the transformers of the power electronics device according to the invention, and optionally a choke coil of the power electronics device according to the invention.

[0035] Other features and advantages of the invention will become apparent from the following description on the one hand, and from several illustrative and non-limiting examples of embodiments given by reference to the accompanying schematic drawings on the other hand, in which:

[0036] [Fig-1] represents in perspective a cooling module according to the invention, in one embodiment of the invention, a support plate for the cooling module being represented schematically only,

[0037] [Fig.2] shows in perspective a closing plate and a module structure of the cooling of [Fig.1], the cooling module being shown without the support plate and without a sealed envelope covering the structure on [Fig.1],

[0038] [Fig.3] shows in perspective and in partial section the sealed envelope of the cooling module of [Fig.1], covering the structure and closed by the closing plate,

[0039] [Fig.4] represents in isolation and in perspective the structure of the module of cooling of the [Fig.1],

[0040] [Fig.5] is another perspective view of the structure of the cooling module of [Fig.1], showing in the foreground a face of the structure, opposite to the face of the structure shown in the foreground of [Fig.4], and illustrating the path that a heat transfer fluid may follow,

[0041] [Fig.6] is a top and perspective view of the support plate for the cooling module of [Fig.1], and

[0042] [Fig.7] is a bottom and perspective view of the support plate shown [Fig.6].

[0043] According to an embodiment of the invention shown in Figures 1 to 7, a cooling module 1 according to the invention, shown [Fig. 1], is intended to form part of a housing for a power electronics device integrating a high-voltage battery charger for an electric or hybrid vehicle, and a DC-DC converter. Of course, the invention is applicable to other types of power electronics devices.

[0044] The cooling module 1 includes a support plate 2, forming the bottom of the housing, on which the power electronics components are intended to be arranged. More specifically, the power electronics components are intended to be arranged on an upper surface of the support plate 2, facing the inside of the housing. Electrical connectors arranged on raised edges of the support plate 2, not shown here, allow the power electronics to be electrically connected to a vehicle's high-voltage battery, a vehicle charging socket, and the vehicle's onboard electrical system.

[0045] The support plate 2 is substantially rectangular and extends parallel to a longitudinal direction Y along the length of the support plate 2, and extends parallel to a transverse direction X along the width of the support plate 2, the transverse direction X being orthogonal to the longitudinal direction Y.

[0046] A vertical direction Z orthogonal to the principal extension directions of the support plate 2 is directed perpendicularly to the support plate 2. The terms "above", "below", "down", "up", "superior" and "lower" in This application refers, in the vertical direction Z, to an "upward" orientation from the bottom of the housing along the raised edges. The terms "transverse" or "longitudinal" in this application refer to the transverse X and longitudinal Y directions, respectively.

[0047] The cooling module 1 also includes a set 3 of side walls 32, 34, 36, 38 delimiting an enclosure whose imprint on the upper face of the support plate 2 defines a first receiving area 23. This first receiving area 23 is intended for the mounting of initial power electronics components, which are likely to generate significant heat, such as the choke coils and transformers of the power electronics device. This first receiving area 23 is shown in dashed lines in [Fig. 6], which illustrates an embodiment of the support plate 2.

[0048] As shown in [Fig. 6], the support plate 2 also includes a second receiving area 28 for second components of the power electronics device, and a third receiving area 29 for third components of the power electronics device, located on the upper face of the support plate 2. The second and third components of the power electronics device have a lower cooling requirement than the first components of the power electronics device. Examples include capacitors and transistors.

[0049] It should be noted that in variant embodiments of the invention, the support plate comprises only the first receiving zone, or only the first receiving zone and one of the second or third receiving zones.

[0050] Of course, the power electronics components mentioned here are not necessarily in direct contact with the support plate 2; they are, for example, integrated into a printed circuit board (PCB) which is fixed to the support plate 2 by means of thermal paste. The support plate can also form vertical partitions to separate the power electronics components from each other.

[0051] Returning to [Fig. 1], the side walls 32, 34, 36, 38 of the cooling module 1 extend mainly in the vertical direction Z and are delimited by a sealed casing 5, sealed onto a closing plate 7, itself attached to the support plate 2. The closing plate 7 extends mainly in the longitudinal direction Y and the transverse direction X, between the side walls 32, 34, 36, 38 of the cooling module 1 and the support plate 2, while covering the first receiving area 23. As will be detailed below, the side walls of the cooling module 1 comprise cooling side walls 32, 34, 36 and a separating side wall 38.

[0052] The airtight casing 5 is preferably metallic, for example made of steel or aluminum, and is produced, for example, by molding or stamping. The closure plate 7 is also preferably metallic, for example made of steel or aluminum. The material of the airtight casing 5 is chosen in particular for its good thermal conductivity.

[0053] A first opening 26 in the support plate 2 allows a heat transfer fluid (represented by arrows) to enter a side wall 32 of the cooling module 1, and a second opening 27 in the support plate 2 allows the heat transfer fluid (represented by arrows) to exit from another side wall 36 of the cooling module 1.

[0054] These two parallel side walls 32, 36, and a connecting side wall 34, form a U-shape and house a heat transfer fluid circuit 6 [Fig. 2]. The three side walls 32, 34, 36 forming this U are therefore cooling side walls. The heat transfer fluid is, for example, glycol water or oil. This heat transfer fluid is thus intended to enter the side wall 32 through the first opening 26, circulate within this side wall 32 and then within each of the side walls 34, 36 arranged successively, and then exit via the second opening 27.

[0055] The heat transfer fluid circuit 6 is formed on the one hand by the sealed casing 5, and on the other hand by a structure 4 nested within the sealed casing 5, the structure 4 having recesses forming meanders for the passage of the heat transfer fluid. This structure 4 is, for example, made of molded polymer material, or of machined or cast metal. It can therefore be metallic.

[0056] The structure 4 is preferably press-fitted into the watertight casing 5 so that the latter completely closes the recesses in the structure 4 opening into the watertight casing 5. Furthermore, the structure 4 and the watertight casing 5 are secured together by suitable means, optionally with sealing means, to fix the position of the structure within the watertight casing. For example, the structure 4 has grooves that are press-fitted into suitable recesses formed in an internal surface of the watertight casing. Alternatively, the structure 4 and the watertight casing 5 have screw-fastening means, combined with sealing means such as gaskets.In another variant, the structure 4 and the watertight casing 5 are fixed to each other by elastic fastening means such as a boss on the structure 4, which temporarily deforms the watertight casing 5 to fit into a recess in it. In another variant, the watertight casing 5 is welded to the structure 4, for example brazed to the structure 4.

[0057] It is understood that the press-fit assembly of the structure 4 within the sealed casing 5 aims to position the structure as close as possible to the walls of the sealed casing, but that it does not necessarily result in a strict fit of the edges of the structure against the walls defining the sealed casing, and that some play may be present at the junction of an edge and a wall. The heat transfer fluid tends, in fact, to follow the path of largest cross-section formed by the meanders created by the recesses in the structure 4, rather than attempting to enter through gaps between the structure and the sealed casing.

[0058] The closing plate 7 is attached in a sealed manner to the sealed envelope 5, for example by brazing, friction stir welding, gluing or via a sealing gasket.

[0059] As can be seen [Fig.2], the closing plate 7 has a first orifice 71 which is arranged opposite the first opening 26 of the support plate 2, and a second orifice 72 which is arranged opposite the second opening 27 of the support plate 2. Sealing means are arranged on the one hand between the first orifice 71 and the first opening 26 and on the other hand between the second orifice 72 and the second opening 27. These sealing means are, for example, flat or annular sealing gaskets, arranged in recesses formed in the support plate 2 around the first opening 26 and the second opening 27 and visible [Fig.6].

[0060] As shown in Figures 2 and 3, the structure 4 comprises three material blocks 42, 44, and 46 and a base 45 which forms a common base for the material blocks. These material blocks are arranged on the edges of the base to create a U-shape, with one side of the base 45 not covered by any material block. The U-shaped arrangement of the material blocks forms a housing for power electronics components. This housing is vertically delimited by the central portion of the base not covered by the material blocks. This base 45 is made more particularly visible in Figure 4 with a dashed line illustrating a plane vertically separating the base 45 from the material blocks 42, 44, and 46.

[0061] The material blocks 42, 44, 46 are parallelepiped-shaped and each has recesses arranged continuously, i.e., opening onto the recess located downstream when considering the direction of flow of the coolant. These three material blocks all extend primarily along the vertical direction Z on the one hand and along one of the longitudinal Y and transverse X directions on the other, with a central material block 44 interposed between two parallel material blocks 42, 46 to form a U-shaped form suitable for insertion into the sealed casing 5 to form respectively the three lateral cooling walls 32, 34 and 36.

[0062] The base 45 is dimensioned to cover the receiving area 23 of the support plate 2, and it is covered on one side by the closing plate 7, in direct contact with the receiving area of ​​the support plate, and on the other side by the sealed enclosure 5 interposed between the power electronics components and this base 45 participating in defining the circuit 6 within which the cooling fluid circulates.

[0063] Returning to [Fig. 1], the sealed enclosure 5 is configured to form the separating side wall 38, extending primarily along the vertical direction Z and the transverse direction X, to connect the two cooling side walls 32, 36 that form the arms of the U, thus closing it. This separating side wall 38 extends vertically from the closing plate 7, to a height measured along the vertical direction Z, which is equal to the corresponding height of the cooling side walls 32, 34, 36. The separating side wall 38 does not house any block of material from the structure 4 and is therefore thinner than the three cooling side walls 32, 34, 36, being formed solely by the sealed enclosure 5. This separating side wall 38 is, in effect, a separating side wall that allows the first power electronics components to be separated from the second power electronics components.Other lateral separation walls are alternatively provided to separate the coils intended to be housed above the receiving area 23. In another variant, the closing wall is a cooling side wall.

[0064] The cooling side walls 32, 34, 36 are formed in particular by partitions of the sealed casing 5 which overlap the structure 4, notably to close the recesses in the structure and delimit the cooling fluid circulation circuit. In particular, internal partitions 52, 54, 56 can be distinguished, intended to be located respectively opposite the power electronics components positioned in the housing arranged between the cooling side walls and the base of the structure covered by the sealed casing. Two of the internal partitions 52, 56, respectively associated with a cooling side wall 32, 36 forming the arm of the U, close recesses in the structure 4, in which the heat transfer fluid circulates, while another 54 of the partitions is separated from such recesses only by a thin layer of material forming a partition specific to a block of material of the structure.At the branches of the U, the surface area of ​​a partition 52, 56 in contact with recesses in the structure 4 corresponds to at least 90% of the area of ​​one face of this partition 52, 54, or even to at least 30% of this area. Thus, the first power electronics components can be cooled efficiently due to a particularly large cooling surface.

[0065] It should be noted that the cooling side walls 32, 34, 36 extend in the lower part of the structure 4, up to the closing plate 7.

[0066] As partially visible in Figures 3 and 4, the structure 4 comprises a first recess opposite the first opening 71 of the closing plate 7, this recess forming a first end 61 of the heat transfer fluid circuit 6, and a final recess opposite the second opening 72 of the closing plate 7, this latter recess forming a second end 62 of the heat transfer fluid circuit 6. The first end 61 and the second end 62 are each located at a separate free end of the U formed by the cooling side walls 32, 34, 36.

[0067] Furthermore, as can be seen in [Fig. 4] and [Fig. 5], the base 45 of the structure has two longitudinal recesses 450, forming trenches opening into the enclosure formed by the side walls 32, 34, 36, 38 of the cooling module 1 and extending longitudinally from the separating side wall 38 to the cooling side wall 34 forming the base of the U. They are separated only by a thin longitudinal partition 451 of material intended, on the one hand, to keep the deeply recessed base 45 of the structure 4 rigid, and on the other hand, to partition a coolant inlet section and a coolant outlet section. The contact surface between these two recesses and the sealed casing 5 forms a first cooling surface if oriented orthogonally to the vertical direction Z and intended to cool the lower parts of the first power electronics components.This first cooling surface, si, has been schematically represented in [Fig. 4] to facilitate the reader's understanding, even though the sealed enclosure is not shown here. This first cooling surface, si, when present, preferably covers at least 90% of the first receiving area 23, or even at least 30% of the receiving area 23. This first cooling surface, si, is optional.

[0068] Figure 4 also shows that structure 4 has a vertical and longitudinal plane of symmetry. The recesses in structure 4 are symmetrical with respect to this vertical and longitudinal plane of symmetry, which makes it easier to visualize the path of the heat transfer fluid circuit 6, partially represented by arrows in Figure 5. The dashed lines along the path represent sections obscured by parts of structure 4.

[0069] As can be seen in Figures 4 and 5, the recesses in the parallelepiped blocks of material 42, 44, 46 of structure 4, and in the base 45 of structure 4, which is also parallelepiped, are straight recesses formed orthogonally to the walls of these parallelepiped blocks of material or of this base 45. In other words, the recesses are formed in such a way that the walls delimiting these recesses and allowing communication from one recess to another are walls orthogonal to the walls of the parallelepiped blocks of material 42, 44, 46 and of the base 45. Structure 4, for example, is formed from a single piece of machined material, and the straight recesses are made by drilling or molding.

[0070] As mentioned previously, the recesses in the parallelepiped blocks of material 42, 44, 46 of the structure 4 and in the base 45 of the structure 4 intersect each other so as to create a passage for the heat transfer fluid, between the first end 61 and the second end 62 of the heat transfer fluid circuit 6.

[0071] In this embodiment of the invention, the recesses in the parallelepiped blocks of material 42, 44, 46 form crenellations that are as high as they are wide and occupy most of these blocks of material. Furthermore, in this embodiment of the invention, the recesses in two of the parallelepiped blocks of material 42 and 46 are through-holes, while the recesses in another 44 of the parallelepiped blocks of material are not through-holes. In an alternative embodiment of the invention, at least some of the recesses in the main embodiment are not through-holes instead of through-holes, and vice versa. In yet another embodiment of the invention, the recesses form longitudinal or transverse grooves, or convolutions, or even meanders of any shape.

[0072] The support plate 2 is now described in more detail in relation to figures 6 and 7. The external impression of the assembly 3 of the side walls 32, 34, 36, 38 of the cooling module 1 is marked by dotted lines around the first receiving area 23.

[0073] The support plate 2 has a heat transfer fluid inlet 21 and a heat transfer fluid outlet 22.

[0074] A first junction zone 24 connects the heat transfer fluid inlet 21 to the first opening 26 in the support plate 2, which is connected to the first end 61 of the heat transfer fluid circuit 6 by the first orifice 71 of the closure plate 7. The first junction zone 24 has a first conduit 242 molded into the support plate 2, opening on one side into the heat transfer fluid inlet 21 and on the other side into a first space delimited by a first rib 244 (visible [Fig. 7]) of the support plate 2, arranged on the underside of the support plate 2, i.e., on the side opposite the lateral walls 32, 34, 36 of the cooling module 1 relative to the support plate 2. A first closure plate, not shown, seals this first space by being fixed to the first rib 244, for example by brazing or by friction stir welding. In this case, the first closing plate is metallic. This first Rib 244 extends under the second receiving area 28 and thus delimits a second cooling surface s2, intended to cool the second power electronics components.

[0075] The second optional cooling surface s2 extends for example over at least 10% of the second receiving zone 28, or even over at least 40 to 80% of the second receiving zone 28.

[0076] Similarly, a second junction zone 25 connects the heat transfer fluid outlet 22 to the second opening 27 in the support plate 2, which is connected to the second end 62 of the heat transfer fluid circuit 6 via the second orifice 72 of the closure plate 7. The second junction zone 25 includes a second conduit 252 molded into the support plate 2, opening on one side into the heat transfer fluid outlet 22 and on the other side into a second space delimited by a second rib 254 (visible [Fig. 7]) of the support plate 2, arranged on the underside of the support plate 2. A second closure plate, not shown, seals this second space by being attached to the second rib 254, for example by brazing or friction stir welding. In this case, the second closure plate is metallic.This second rib 254 extends under the third receiving zone 29 and thus delimits a third cooling surface s3, intended to cool the third power electronics components.

[0077] The optional third cooling surface s3 extends, for example, over at least 10% of the third receiving zone 29, or even over at least 40 to 80% of the third receiving zone 29.

[0078] The first and second closing plates are alternatively made of synthetic polymer material, and for example bonded in a watertight manner to the ribs 244, 254. Such a choice of material makes it possible to lighten the vehicle and therefore reduce its environmental footprint.

[0079] In this embodiment of the invention, the second space also extends under the first receiving zone 23. Alternatively, the first receiving zone 23 being already cooled by the heat transfer fluid circulating in the base 45 of the structure 4, the second space extends only under the third receiving zone 29, passing for example between the set 3 of the side walls 32, 34, 36, 38 of the cooling module 1 and an edge of the support plate 2, to connect the second orifice 27 to this third receiving zone 29.

[0080] Of course, the invention is not limited to the examples just described, and many modifications can be made to these examples without departing from the scope of the invention. In particular, the features of different embodiments of the invention can be combined to carry out the invention, provided that these embodiments are not incompatible with each other.

Claims

Demands

1. Cooling module (1) for power electronics components, comprising: - a support plate (2), - side walls (32, 34, 36) adapted to at least partially surround power electronics components, the side walls (32, 34, 36) defining a receiving area (23) for the power electronics components on the support plate (2), - a heat transfer fluid circuit (6) extending within the side walls (32, 34, 36), from a first end (61) of the heat transfer fluid circuit (6) to a second end (62) of the heat transfer fluid circuit (6), the cooling module (1) being characterized in that the side walls (32, 34, 36) are formed of a sealed casing (5) and a structure (4) fitted into the sealed casing (5), the circuit (6) of heat transfer fluid being delimited partly by the structure (4) and partly by the sealed envelope (5).

2. Cooling module (1) according to claim 1, wherein the sealed casing (5) and the structure (4) extend the heat transfer fluid circuit (6) over the receiving area (23).

3. Cooling module (1) according to claim 2, wherein the heat transfer fluid circuit (6) on the receiving area (23) forms a cooling surface intended to be interposed between the support plate (2) and the power electronics components.

4. Cooling module (1) according to any one of claims 1 to 3, wherein the structure (4) is formed of blocks of material having straight recesses opening opposite the sealed casing (5) or the support plate (2).

5. Cooling module (1) according to any one of claims 1 to 4, wherein the structure (4) is formed from a single machined piece.

6. Cooling module (1) according to any one of claims 1 to 5, wherein the cooling module (1) comprises at least one closing plate (7) attached to the sealed casing (5) and disposed between the support plate (2) and the structure (4), the closing plate (7) comprising a first orifice (71) opposite the first end (61) of the circuit (6) of heat transfer fluid and a second orifice (72) opposite the second end (62) of the heat transfer fluid circuit (6).

7. Cooling module (1) according to any one of claims 1 to 6, wherein the heat transfer fluid circuit (6) runs through three side walls (32, 34, 36) of the cooling module, referred to as cooling side walls (32, 34, 36), the cooling module (1) further comprising at least one separating side wall (38) between power electronics components, formed solely by the sealed enclosure (5).

8. Cooling module (1) according to any one of claims 1 to 7, wherein the support plate (2) has a heat transfer fluid inlet (21) and a heat transfer fluid outlet (21), a first junction zone (24) connecting the heat transfer fluid inlet (21) to the first end (61) of the heat transfer fluid circuit (6) and a second junction zone (25) connecting the heat transfer fluid outlet (22) to the second end (62) of the heat transfer fluid circuit (6).

9. Cooling module (1) according to claim 8, wherein the power electronics components are first power electronics components, the receiving area (23) is a first receiving area (23), the support plate (2) having a second receiving area (28) for second power electronics components extending beyond the side walls (32, 34, 36) and the first receiving area (23), the first junction area (24) or the second junction area (25) being able to form a cooling surface (s2) for the second power electronics components by bringing the heat transfer fluid into contact with the second receiving area (28) for the second power electronics components.

10. Cooling module (1) according to claim 9, wherein the first junction zone (24) is adapted to form the cooling surface (s2) of the second power electronics components, and wherein the support plate (2) comprises a third receiving zone (29) for third power electronics components extending beyond the side walls (32, 34, 36) and the first receiving zone (23), the second junction zone (25) being adapted to form a cooling surface (s3) of the third power electronics components power by bringing the heat transfer fluid into contact with the third receiving zone (29) of the third power electronics components.

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