Cooling module for power electronics components

Abstract

Cooling Module for Power Electronics Components The invention relates to a cooling module (1) for power electronics components, comprising: - a support plate (2) having a heat transfer fluid inlet (21) and an outlet (22), - side walls (32, 34, 36) defining a receiving area (23) on the support plate (2), - a heat transfer fluid circuit extending in the side walls (32, 34, 36), from a first end to a second end of the heat transfer fluid circuit, - a first junction zone (24) connecting the heat transfer fluid inlet (21) to the first end and a second junction zone (25) connecting the heat transfer fluid outlet (22) to the second end, the first or second junction zone (24, 25) being capable of forming a cooling surface for the power electronics components by bringing the heat transfer fluid into contact with the reception area (23).(Figure 1).

Description

Title of the invention: Cooling module for power electronics components

[0001] The present invention relates to the fields of mechanics and thermodynamics, and more specifically concerns a cooling module for power electronics components, finding particular application in electric or hybrid vehicles.

[0002] Electric or hybrid vehicles incorporate various power electronic devices to operate their electric motors, to charge their high-voltage batteries and to power their on-board networks.

[0003] These power electronic devices include components which are subjected in operation to high currents, of several hundred amperes, which causes an increase in their temperature and is likely to damage them in the absence of specific cooling means.

[0004] Generally, the choke coils or transformer coils of these power electronic devices are placed, by means of thermal paste, on a cooling plate through which glycol water flows, circulating in a heat transfer fluid circuit including a heat exchanger. These coils, and other power electronic components, are further protected in housings dedicated to a specific function, such as a charger or DC-DC converter housing.

[0005] Given the integration requirements driving the need to increasingly reduce the size of these power electronic devices, inventors seek to group components of a charger and a DC-DC converter within a single housing, grouping the components most likely to heat up in an enclosure cooled by a heat transfer fluid such as glycol water. In this way, the cooling of these critical components is more efficient than with a simple water plate.

[0006] However, such an enclosure is preferably made of steel or aluminum by casting, and its design is therefore subject to the constraints of its manufacturing process, which notably requires radii of curvature and angles adapted to the demolding of the casing. It is therefore difficult to produce an enclosure cooled on all its sides, especially while limiting pressure losses. Such a limitation would indeed require a complex circulation scheme for the heat transfer fluid.

[0007] Furthermore, the less critical components of the charger and the DC-DC converter, located outside this enclosure in the casing, also require cooling, which is not adequately provided by the enclosure as envisioned by the inventors.

[0008] There is therefore a need to create an efficient, industrializable and inexpensive cooling module for power electronics components that rapidly heat up during operation, and that allows integration into a housing containing other power electronics components that may also require cooling.

[0009] The present invention aims to remedy at least in part the aforementioned drawbacks by providing a cooling module for power electronics components, inexpensive and easy to industrialize, which includes an enclosure ensuring efficient cooling for power electronics components that heat up quickly, and simple cooling zones for power electronics components that heat up less quickly.

[0010] To this end, the invention proposes a cooling module for power electronics components, comprising: - a support plate comprising a heat transfer fluid inlet and a heat transfer fluid outlet, - side walls rising above the support plate and capable of at least partially enclosing power electronics components, the side walls defining a receiving area for power electronics components on the support plate, - a heat transfer fluid circuit extending through the side walls, from a first end of the heat transfer fluid circuit to a second end of the heat transfer fluid circuit, - a first junction zone connecting the heat transfer fluid inlet to the first end of the heat transfer fluid circuit and a second junction zone connecting the heat transfer fluid outlet to the second end of the heat transfer fluid circuit, the cooling module being characterized in that the first or second junction zone is capable of forming a cooling surface for the power electronics components by bringing the heat transfer fluid into contact with the receiving area of ​​the power electronics components.

[0011] The cooling module according to the invention is of course not limited to integration in an electric charger for electric or hybrid vehicles, it finds applications in any electrical product requiring cooling of all or part of its components.

[0012] Furthermore, the receiving area is part of the support plate. This receiving area is intended to receive power electronics components. which get very hot, such as stop coils or transformers, the side walls and the first or second junction area are suitable for cooling.

[0013] The cooling surface formed by either of the junction zones corresponds to a portion of the corresponding junction zone in which a wall, which helps to delimit the junction zone, is interposed between the heat transfer fluid circulating in the junction zone and the receiving area for the power electronics components, i.e., the portion of the support plate on which the power electronics components are received. In this context, the heat transfer fluid is said to be in contact with the receiving area insofar as the thickness of the interposed wall allows the transfer of heat between the power electronics components and the heat transfer fluid.

[0014] Thanks to the invention, the power electronics components located between the side walls above the receiving area are cooled by the heat transfer fluid circuit passing through the side walls, and by the first or second junction zone passing under these components and forming a cooling circuit connected in series with the heat transfer fluid circuit passing through the side walls. This heat transfer fluid circuit in the side walls is more easily industrialized than a heat transfer fluid channel that would run through both the side walls and the receiving area, and limits pressure losses by channeling the heat transfer fluid more efficiently than in such a channel. The cooling surface extends, for example, over at least 80% of the receiving area.

[0015] According to an optional feature of the invention, the first or second junction zone includes in particular a part hollowed out in the thickness of the support plate and a closing plate participating in forming one of the opposite faces of the support plate.

[0016] According to an optional feature of the invention, the receiving area extending, for example, over an upper face of the support plate, the closing plate of the first or second junction area suitable for forming the cooling surface participating in forming a lower face of the support plate, opposite the upper face. Alternatively, the closing plate of the first or second junction area suitable for forming the cooling surface participates in forming the upper face of the support plate, the receiving area then extending over said closing plate.

[0017] In one embodiment of the invention, the power electronics components are first power electronics components, the receiving area is a first receiving area and the cooling surface is a first cooling surface, the support plate comprising a second receiving area for second power electronics components extending beyond the side walls and the first receiving zone, the first junction zone or the second junction zone being able to form a second cooling surface for the second power electronics components by bringing the heat transfer fluid into contact with the second receiving zone of the second power electronics components.

[0018] This second cooling surface allows for the cooling of less temperature-critical power electronics components, such as capacitors, around the receiving area. The second cooling surface extends, for example, over at least 40% of the second receiving area.

[0019] The first or second junction zone comprises, for example, on the one hand, a conduit in the support plate extending at least from the inlet or outlet of the heat transfer fluid to a rib in the support plate, located on the underside of the support plate and defining at least part of the first and / or second cooling surface, and on the other hand, a closing plate attached to the rib. This embodiment of the invention is simple and inexpensive to produce. In particular, the closing plates can be made of synthetic polymer material. The use of synthetic polymer material rather than metal also reduces the weight of the vehicle and therefore its environmental footprint.

[0020] Furthermore, each junction zone can contribute to the cooling of less temperature-critical power electronics components. For example, the first junction zone is suitable for forming the second cooling surface, and the support plate includes a third receiving zone for third power electronics components extending beyond the side walls and the first receiving zone. The second junction zone is suitable for forming a third cooling surface for the third power electronics components by bringing the heat transfer fluid into contact with the third receiving zone for the third power electronics components. The second and third receiving zones are located on either side of the receptacle. The third cooling surface extends, for example, over at least 40% of the third receiving zone.

[0021] This embodiment allows more flexibility in the arrangement of power electronics components on the support plate.

[0022] The first junction zone comprises, for example, a first conduit molded into the support plate and extending at least from the heat transfer fluid inlet to a first rib of the support plate, delimiting the first cooling surface and / or the second cooling surface, the first junction zone comprising a first closing plate attached to the first rib, and the second junction zone includes a second conduit molded into the support plate and extending at least from the heat transfer fluid outlet to a second rib of the support plate, delimiting the first cooling surface and / or the third cooling surface, the second junction zone including a second closing plate attached to the second rib.

[0023] In one embodiment of the invention, the first and second joining zones are arranged at least partially on the support plate on the side opposite the side walls. The ribs are, for example, formed by stamping and project onto the face of the support plate that is opposite the side walls, thus maintaining a substantially flat receiving area.

[0024] The support plate is, for example, traversed by a first opening leading into the first junction zone, the first opening being opposite the first end of the heat transfer fluid circuit, and by a second opening leading into the second junction zone, the second opening being opposite the second end of the heat transfer fluid circuit. Seals are, for example, provided between each first or second end of the heat transfer fluid circuit and each first or second opening.

[0025] Furthermore, in one embodiment of the invention, the heat transfer fluid circuit is formed by three of the side walls, which are hollow and open opposite the support plate. In this embodiment of the invention, the side walls and the heat transfer fluid circuit form a U-shape, with the first and second ends of the heat transfer fluid circuit located at the free ends of the arms of the U. This allows the heat transfer fluid circuit to be easily manufactured by molding the side walls. These are preferably metallic, for example, steel or aluminum, which have good thermal conductivity.

[0026] In this embodiment of the invention, the cooling module comprises a cover sealed onto the three side walls, between them and the support plate. The cover leaves the first and second ends of the heat transfer fluid circuit, located opposite the first and second openings in the support plate respectively, free. The cover may only cover the hollow portions of the side walls or may also extend over the receiving area. In the latter case, the cover is made of a thermally conductive material, for example, metal. More generally, the cover is made of metal or a synthetic polymer material. For example, it is brazed to the side walls, with annular seals arranged around the first and second openings between the cover and the support plate.In the case where the lid is made of synthetic polymer material, the lid forms . for example a sealing joint between the support plate and the side walls, and annular sealing joints are not necessary.

[0027] Furthermore, the cooling module optionally includes a base connecting the side walls, the base and side walls forming a receptacle for the power electronics components intended to be arranged above the receiving area on the support plate, the base being fixed against the upper face of the support plate. The use of a receptacle facilitates the fixing of the power electronics components intended to be surrounded by the side walls, in parallel with the fixing of the other power electronics components to the support plate.

[0028] The invention also relates to a power electronics device for an electric or hybrid vehicle, at least some of whose components are arranged in a cooling module according to the invention. The power electronics device is, for example, capable of charging a high-voltage battery of the vehicle and of acting as a DC-DC converter. The receptacle of the cooling module then houses the transformers of the power electronics device according to the invention, and optionally a choke coil for the power electronics device according to the invention.

[0029] Other features and advantages of the invention will become apparent from the following description on the one hand, and from several illustrative and non-limiting examples of embodiments given by reference to the accompanying schematic drawings on the other hand, in which:

[0030] [Fig-1] is a perspective view of a top face of a support plate of a cooling module according to the invention, in an embodiment of the invention, and on which is fixed a receptacle for certain power electronics components of the cooling module,

[0031] [Fig.2] is a top view of an upper face of the support plate of the [Fig. 1], lacking a receptacle, but on which power electronics components are positioned,

[0032] [Fig.3] is a perspective view of, on the one hand, a lower part of the receptacle for power electronics components, forming part of the cooling module of [Fig.1], this receptacle having hollow side walls, and on the other hand, a cover for closing the hollow side walls of the receptacle, and

[0033] [Fig.4] is a perspective view of part of an underside of the plate support for the cooling module of [Fig.l], and on the other hand of closure plates for areas delimited by ribs on the lower face.

[0034] According to an embodiment of the invention shown in Figures 1 to 4, a cooling module 1 according to the invention, shown [Fig. 1], is intended to make Part of a housing for a power electronics device incorporating a high-voltage battery charger for an electric or hybrid vehicle, and a DC-DC converter. Of course, the invention is applicable to other types of power electronics devices.

[0035] The cooling module 1 includes a support plate 2, forming the bottom of the housing, on which the power electronics components are intended to be arranged. More specifically, the power electronics components are intended to be arranged on an upper surface of the support plate 2, facing the inside of the housing. Electrical connectors, arranged on raised edges of the support plate 2, allow the power electronics to be electrically connected to a vehicle's high-voltage battery, a vehicle charging socket, and the vehicle's onboard electrical system.

[0036] The support plate 2 is preferably made of steel or cast aluminum. The support plate 2 is substantially rectangular and extends parallel to a longitudinal direction Y along the length of the support plate 2, and extends parallel to a transverse direction X along the width of the support plate 2, the transverse direction X being orthogonal to the longitudinal direction Y.

[0037] A vertical direction Z orthogonal to the principal extension directions of the support plate 2 is directed perpendicularly to the support plate 2. The terms "above," "below," "down," "up," "superior," and "lower" in this application refer, in this vertical direction Z, to an "upward" orientation from the bottom of the housing along the raised edges. The terms "transverse" or "longitudinal" in this application refer to the transverse X and longitudinal Y directions, respectively.

[0038] The cooling module 1 also includes a receptacle 3 formed of a base 35 and side walls 32, 34, 36, 38 delimiting an enclosure whose imprint on the upper face of the support plate 2 defines a first receiving area 23 (represented in dotted lines on [Fig.2]) on the support plate 2. This first receiving area 23 is intended for the fixing of first power electronics components 41, which are likely to get very hot, such as the choke coils and transformers of the power electronics device.

[0039] As can be seen in [Fig. 3], three of the side walls 32, 34, 36 of the receptacle 3 are hollow and together form a U-shaped heat transfer fluid circuit 6. The heat transfer fluid is, for example, glycol water or oil. These three side walls 32, 34, 36 of the receptacle 3 are therefore cooling side walls and form a U corresponding to the U of the heat transfer fluid circuit 6, while the last side wall 38 of the receptacle 3, closing the U formed by the three side walls 32, 34, 36, is a separating side wall between, on the one hand, the first components 41 of power electronics located above the first receiving area 23 and housed in the receptacle 3, and on the other hand other components 42, 43 of power electronics of the power electronics device.

[0040] This lateral separation wall 38 has an electromagnetic shielding function. The receptacle 3 includes another separation wall 37 (visible [Fig. 1]) parallel to the lateral separation wall 38 and allowing electromagnetic separation between them, forming two distinct compartments of the receptacle 3, of the first power electronics components 41 located above the first receiving zone 23.

[0041] Returning to [Fig.3], a first end 61 of the heat transfer fluid circuit 6 is located at one end of the U formed by one of the three lateral walls 32, and a second end 62 of the heat transfer fluid circuit 6 is located at another end of the U formed by another of the three lateral walls 36.

[0042] In order to close the heat transfer fluid circuit 6 except at its ends, a cover 7 is attached to the lower edges of the three side walls 32, 34, 36. The receptacle 3 and the cover 7 are, for example, made of steel or aluminum, and the cover 7 is brazed onto the receptacle 3. Alternatively, the cover 7 forms a seal made of synthetic polymer material which is compressed between the receptacle 3 and the support plate 2.

[0043] The cover 7 has a first orifice 71, opposite the first end 61 of the heat transfer fluid circuit 6, and a second orifice 72, opposite the second end 62 of the heat transfer fluid circuit 6. These orifices 71, 72 allow the heat transfer fluid to communicate with a first junction zone 24 (referenced in Figures 1 and 2) and a second junction zone 25, partly arranged on the underside of the support plate 2 as described below.

[0044] The lower edges of the three side walls 32, 34, 36 form a hollow indentation of the cover 7 on the underside of the bottom 35 of the receptacle. This indentation is configured so that when the cover 7 is placed onto these lower edges, the bottom 35 of the receptacle and the cover 7 present a flat surface. This allows the receptacle 3, fitted with the cover 7, to be positioned on the bottom wall of the housing with the bottom 35 of the receptacle pressed effectively against this bottom wall of the housing, so that the bottom 35 of the receptacle can be effectively cooled via the bottom wall of the housing, and thus by the first or second junction zone 24, 25 shown in Figures 1, 2, and 4.

[0045] This first junction zone 24 and this second junction zone 25 allow the heat transfer fluid to be supplied to the heat transfer fluid circuit 6 and cooled simultaneously:

[0046] - the lower parts of the first 41 power electronics components in forming a first cooling surface if on the first receiving zone 23, - second power electronics components 42 fixed on a second receiving area 28 on the upper face of the support plate 2, forming a second cooling surface s2, on this second receiving area 28, and - third power electronics components 43 fixed on a third receiving area 29 on the upper face of the support plate 2, forming a third cooling surface s3, on this third receiving area 29.

[0047] Of course, the power electronics components 41, 42, 43 are not necessarily in direct contact with the support plate 2; they are, for example, integrated into a printed circuit board (PCB) which is fixed to the support plate 2 by means of fasteners such as screws and thermally connected by an insulated or uninsulated thermal interface, for example, thermal paste. The support plate can also form vertical partitions to separate the power electronics components from each other.

[0048] The first junction zone 24 connects a heat transfer fluid inlet 21, arranged on a longitudinally raised edge of the support plate 2, to the first end 61 of the heat transfer fluid circuit 6, while the second junction zone 25 connects a heat transfer fluid outlet 22 arranged on the longitudinally raised edge of the support plate 2, to the second end 62 of the heat transfer fluid circuit 6.

[0049] The inlet 21 and outlet 22 of the heat transfer fluid are arranged at two opposite ends of the longitudinal raised edge, connected on one side to a first transverse raised edge of the support plate 2 and on the other side to a second transverse raised edge of the support plate 2. This allows the first junction zone 24 to extend over a substantial part of the second receiving zone 28, located between the first transverse raised edge and the receptacle 3, and the second junction zone 25 to extend over a substantial part of the third receiving zone 29, located between the second transverse raised edge and the receptacle 3. This also allows, in this embodiment, since the openings of the U-shaped circuit 6 are on the same side, for one of the junction zones 24, 25 to pass under the bottom 35 of the receptacle.The first junction zone 24 includes a first conduit 242 molded into the support plate 2, opening on one side into the heat transfer fluid inlet 21 and on the other side into a first space delimited by a first rib 244 (visible [Fig.4]) of the support plate 2, arranged on the lower face of the support plate 2, i.e. on the side opposite the receptacle 3 with respect to the support plate 2. The first space is formed in the thickness of the support plate 2, being open on the lower face of this support plate 2. A first opening 26 passing through the support plate 2 into the first space allows it to communicate with the heat transfer fluid circuit 6, as detailed later.

[0050] A first closing plate 246 seals this first space tightly by being fixed to the first rib 244, for example by brazing. Alternatively, the first closing plate 246 is made of synthetic polymer molded onto the first rib 244. The first closing plate 246 rests, where applicable, on a shoulder formed in the first rib 244, on the periphery of the first space. In another embodiment, the first closing plate 246 is internal to the support plate 2.

[0051] The first junction zone 24 is therefore in two parts, a first part being formed by the first conduit 242 and a second part formed by the first rib 244, the lower face of the support plate 2 and the first closing plate 246.

[0052] The first rib 244 extends under the second receiving area 28 and delimits the second cooling surface s2, intended to cool the second power electronics components 42.

[0053] The second cooling surface s2 extends for example over at least 40% of the second receiving zone 28, or even over at least 80% of the second receiving zone 28.

[0054] Similarly, the second junction zone 25 includes a second conduit 252 molded into the support plate 2, opening on one side into the heat transfer fluid outlet 22 and on the other side into a second space delimited by a second rib 254 of the support plate 2, arranged on the lower face of the support plate 2. The second space is formed in the thickness of the support plate 2, being open on the lower face of this support plate 2. A second opening 27 passing through the support plate 2 into the second space allows the latter to communicate with the heat transfer fluid circuit 6, as detailed later.

[0055] A second closing plate 256 seals this second space tightly by being fixed to the second rib 254, for example by brazing. Alternatively, the second closing plate 256 is made of synthetic polymer molded onto the second rib 254. The second closing plate 256 rests, where applicable, on a shoulder formed in the second rib 254, on the periphery of the second space. In another embodiment, the second closing plate 256 is internal to the support plate 2.

[0056] The second junction zone 25 is therefore in two parts, a first part being formed by the second conduit 252 and a second part formed by the second rib 254, the lower face of the support plate 2 and the second closing plate 256.

[0057] The second rib 254 extends under the first receiving zone 23 and under the third receiving zone 29, and thus delimits the first cooling surface if intended to cool the first 41 power electronics components, and the third cooling surface s3, intended to cool the third 43 power electronics components.

[0058] The first cooling surface extends over at least 10% of the first receiving zone 23, or even over at least 40% to 80% of the first receiving zone 23.

[0059] The third cooling surface s3 extends for example over at least 10% of the third receiving zone 29, or even over at least 40% to 80% of the third receiving zone 28.

[0060] In alternative embodiments, the first cooling surface is formed by the first junction zone 24, or a single cooling surface on the support plate 2 is formed by one or the other of the junction zones 24, 25, or only two cooling surfaces are formed on the support plate 2 by the junction zones 24, 25. In yet another embodiment, the same cooling surface can be formed jointly by the first and second junction zones.

[0061] The first end 61 of the cooling circuit 6 is fluidly connected to the first junction zone 24 by means of the first opening 26 through the support plate 2 in the first space delimited by the first rib 244, and disposed opposite the first orifice 71 of the cover 7.

[0062] Similarly, the second end 62 of the cooling circuit 6 is fluidly connected to the second junction zone 25 by means of a second opening 27 passing through the support plate 2 in the second space delimited by the second rib 254, and arranged opposite the second orifice 72 of the cover 7.

[0063] When the cover 7 does not itself form a sealing gasket between the receptacle 3 and the support plate 2, a first annular sealing gasket is disposed in a groove arranged around the first opening 26 on the support plate 2 and compressed between the cover 7 and the support plate 2, and a second annular sealing gasket is disposed in a groove arranged around the second opening 27 on the support plate 2 and compressed between the cover 7 and the support plate 2.

[0064] The heat transfer fluid therefore circulates, in the cooling module 1, from the heat transfer fluid inlet 21 to the first junction zone 24, where it cools from below, thanks to the second cooling surface s2, the second power electronics components 42, and from there it passes through the first opening 26 in the support plate 2 to enter through the first orifice 71 of the cover 7 to the first end 61 of the heat transfer fluid circuit 6, whose U-shape it follows, thus cooling the first power electronics components 1 laterally thanks to the side walls 32, 34, 36 of the receptacle 3 in which it follows this path. Then the heat transfer fluid exits the heat transfer fluid circuit 6 through the second end 62, exits the heat transfer fluid circuit 6, through the second orifice 72 of the cover 7 and through the second opening 27 in the support plate, to enter the second junction zone 25 which it traverses, thus cooling the first power electronics components 41 also from below thanks to the first cooling surface s1, and the third power electronics components 43 from below thanks to the third cooling surface s3. The heat transfer fluid then exits the cooling module 1 through the heat transfer fluid outlet 22.

[0065] Of course, the invention is not limited to the examples just described, and many modifications can be made to these examples without departing from the scope of the invention. In particular, the features of different embodiments of the invention can be combined to carry out the invention, provided that these embodiments are not incompatible with each other.

Claims

Demands

1. Cooling module (1) for power electronics components (41, 42, 43), comprising: - a support plate (2) having a heat transfer fluid inlet (21) and a heat transfer fluid outlet (22), - side walls (32, 34, 36) rising above the support plate (2) and adapted to surround at least partially power electronics components (41), the side walls (32, 34, 36) delimiting a receiving area (23) for power electronics components on the support plate (2), - a heat transfer fluid circuit (6) extending in the side walls (32, 34, 36), from a first end (61) of the heat transfer fluid circuit (6) to a second end (62) of the heat transfer fluid circuit (6),- a first junction zone (24) connecting the inlet (21) of the heat transfer fluid to the first end (61) of the heat transfer fluid circuit and a second junction zone (25) connecting the outlet (22) of the heat transfer fluid to the second end (62) of the heat transfer fluid circuit, the cooling module (1) being characterized in that the first or second junction zone (24, 25) is capable of forming a cooling surface (si) for the power electronics components by bringing the heat transfer fluid into contact with the receiving zone (23) of the power electronics components (41).

2. Cooling module (1) according to claim 1, wherein the receiving area (23) extends over an upper face of the support plate (2), the first or second junction area (24, 25) suitable for forming the cooling surface (si) extends over an under face of the support plate (2), opposite the upper face.

3. Cooling module (1) according to claim 2, comprising a base (35) connecting the side walls (32, 34, 36), the base (35) and the side walls (32, 34, 36) forming a receptacle (3) for the power electronics components (41) intended to be arranged above the receiving area (23) on the support plate (2), the base (35) being fixed against the upper face of the support plate (2).

4. Cooling module (1) according to any one of claims 1 to 3, wherein the power electronics components are first power electronics components (41), the receiving area (23) is a first receiving area and the cooling surface (si) is a first cooling surface, the support plate (2) having a second receiving area (28) for second power electronics components (42) extending beyond the side walls (32, 34, 36) and the first receiving area (23), the first junction area (24) or the second junction area (25) being able to form a second cooling surface (s2) for the second power electronics components (42) by bringing the heat transfer fluid into contact with the second receiving area (28) for the second power electronics components (42).

5. Cooling module (1) according to claim 4 taken in combination with claim 2, wherein the first junction zone (24) or the second junction zone (25) comprises on the one hand a conduit (242, 252) in the support plate (2) extending at least from the inlet (21) or respectively the outlet (22) of heat transfer fluid to a rib (244, 254) of the support plate (2), disposed on the lower face of the support plate (2) and delimiting at least in part the first cooling surface (s1) and / or the second cooling surface (s2), and on the other hand a closing plate (246, 256) attached to the rib (244, 254).

6. Cooling module (1) according to claim 4 taken in combination with claim 3, wherein the first junction zone (24) is able to form the second cooling surface (s2), wherein the support plate (2) has a third receiving zone (29) for third power electronics components (43) extending beyond the side walls (32, 34, 36) and the first receiving zone (23), and wherein the second junction zone (25) is able to form a third cooling surface (s3) for the third power electronics components (43) by bringing the heat transfer fluid into contact with the third receiving zone (29) for the third power electronics components (43), the second receiving zone (28) and the third receiving zone (29) being located on either side of the receptacle (3).

7. Cooling module (1) according to any one of claims 1 to 6, wherein the support plate (2) is traversed by a first opening (26) leading into the first junction zone (24), the first opening (26) being opposite the first end (61) of the heat transfer fluid circuit (6), and by a second opening (27) leading into the second junction zone (25), the second opening (27) being opposite the second end (62) of the heat transfer fluid circuit (6).

8. Cooling module (1) according to any one of claims 1 to 7, in which the heat transfer fluid circuit (6) is formed by three of the side walls (32, 34, 36), these being hollow and opening opposite the support plate (2).

9. Cooling module (1) according to claims 7 and 8, comprising a cover (7) attached in a sealed manner to the three side walls (32, 34, 36), between them and the support plate (2), the cover (7) leaving free the first end (61) and the second end (62) of the heat transfer fluid circuit (6) located opposite the first (26) and respectively the second opening (27) in the support plate (2).

Images