Waterproof enclosure configured to receive one or more components

The sealed housing design with angled edges and external fluid connections addresses inefficiencies in existing cooling systems by enabling compact and efficient heat transfer within sealed enclosures for electronic components.

FR3167032A1Pending Publication Date: 2026-04-03VALEO SYST THERMIQUES SAS
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Patent Information

Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-10-01
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing cooling systems for electronic components, such as those in data center servers, face challenges in efficiently connecting fluid inlets and outlets with the heat transfer channels within sealed enclosures, leading to potential bulkiness and inefficiencies.

Method used

A sealed housing design featuring a base plate with raised edges forming right-angle corners and a channel plate with corresponding edges, creating a network of channels and fluid inlets/outlets that redirect fluid efficiently without additional parts, and external fluidic connections, allowing for a compact and effective heat transfer system.

Benefits of technology

The solution enables a compact and efficient heat transfer system by facilitating right-angle connections between fluid inlets/outlets and channels, reducing bulk within the enclosure and enhancing heat exchange surface area, thereby improving cooling efficiency.

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Abstract

Title: Watertight housing configured to receive one or more components The invention relates to a housing (1), in particular watertight, configured to receive one or more components (100) to be cooled and in particular a cooling fluid in which the component(s) (100) are at least partially immersed, this cooling fluid being in particular a dielectric fluid, the housing (1) comprising: a receptacle (2) configured to receive the component(s) (100), the receptacle (2) comprising: a base plate (22), an outer plate (24) assembled with the base plate (22) to form, between the two plates, a network of channels (50),and the raised edge (42) of the bottom plate (22) and the raised edge (44) of the outer plate (24) being placed against each other at the opening (28) of the outer plate (24) so ​​that the cavity area (52) of the bottom plate (22) forms with the raised edge (44) of the outer plate (24) a fluid inlet cavity (53) or fluid outlet cavity (55) which communicates with the channel network (50). Figure for the abstract: Fig. 2,
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Description

Title of the invention: Waterproof housing configured to receive one or more components

[0001] The present invention relates to a sealed housing configured to receive one or more components to be cooled and a cooling fluid in which the component(s) are at least partially immersed.

[0002] It is known to cool electronic components, for example those belonging to data center servers, by using a dielectric fluid in which these components are immersed. For this purpose, these components are placed in sealed enclosures. It is known to cool the dielectric fluid by means of a plate system placed beneath the server.

[0003] The present invention aims in particular to improve the plates, especially in terms of fluidic connection, of such a housing.

[0004] The invention thus relates to a housing, in particular a sealed one, configured to receive one or more components to be cooled, and in particular a cooling fluid in which the component(s) are at least partially immersed, this cooling fluid being in particular a dielectric fluid, the housing comprising: - a receptacle configured to receive the component(s), the receptacle comprising: • a base plate comprising a main wall to form a base of the receptacle, a base on which the component(s) to be cooled can be placed, the base plate further comprising at least one raised edge which forms a corner, for example at a right angle, with the main wall, the raised edge comprising a cavity area, • an outer plate assembled with the base plate to form, between the two plates, a network of channels for a heat transfer fluid, the outer plate being in particular a channel plate having a main wall which includes shapes to define at least partially the network of channels, the outer plate further having at least one raised edge which forms a corner, for example at a right angle, with the main wall, the raised edge being provided with an opening forming a fluid inlet or a fluid outlet, • and the raised edge of the base plate and the raised edge of the outer plate being placed against each other at the right angle of the opening of the outer plate so that the cavity area of ​​the base plate, together with the raised edge of the outer plate, forms a fluid inlet or outlet cavity that communicates with the channel network, - in particular a lid configured to close, in particular in a watertight manner, the receptacle.

[0005] The channel network can be formed from a single channel which, for example, meanders between a fluid inlet and a fluid outlet, or from several channels. In general, the channel network can take any type of conformation.

[0006] Thanks to the invention, it is possible to easily create, without additional parts, a right-angle connection between the fluid inlet / outlet on the raised edges and the channel network on the bottom. The cavity area of ​​the base plate thus serves to redirect fluid from one side of the receptacle to the other. In other words, heat transfer fluid arriving on one side of the housing is directed to the bottom of the housing. The fluid inlet or outlet cavity occupies a small space on the inside of the receptacle.

[0007] Advantageously, the outer plate is a channel plate having a main wall comprising shapes to define at least partially the channel network. Thus, the channel plate is on the outside of the receptacle, which prevents the shapes for defining at least partially the channel network from facing the inside of the receptacle. Advantageously, the bottom inside the receptacle is flat (in other words, the bottom plate is generally flat to define the flat bottom). Alternatively, the bottom plate is a channel plate having a main wall comprising shapes to define at least partially the channel network, and the outer plate is generally flat.

[0008] According to one aspect of the invention, the cavity area of ​​the base plate has a shape substantially flaring towards the bottom of the receptacle.

[0009] According to one aspect of the invention, the cavity area of ​​the base plate is triangular in shape.

[0010] According to one aspect of the invention, the cavity area is formed by a stamping of the base plate.

[0011] Alternatively, the cavity area is made from an added piece and welded onto the raised edge of the base plate.

[0012] According to one aspect of the invention, the housing comprises at least one fluidic connection element, in particular a connecting tube or flange, fixed on an external face of the raised edge of the external plate.

[0013] In particular, the fluidic connection element is configured to allow a connection with an external tube at an angle, for example, of 90° relative to the raised edges.

[0014] According to one aspect of the invention, the fluidic connection element is disposed on the outside of the housing. This avoids additional bulk inside the receptacle.

[0015] According to one aspect of the invention, the channel network comprises at least one channel extending along at least one side wall of the housing, in particular in addition to channels on the bottom. This increases the exchange surface area between the channel network and the dielectric fluid in the receptacle.

[0016] According to one aspect of the invention, the fluid inlet or fluid outlet cavity is configured to also supply the channel or channels on the side wall of the receptacle.

[0017] According to one aspect of the invention, the raised edges are obtained by folding a sheet metal which also forms the main wall of the base plate and the outer plate.

[0018] According to one aspect of the invention, the watertight case is configured to be introduced into a cabinet using a sliding drawer of the cabinet.

[0019] According to one aspect of the invention, the electronic components placed in the housing(s) according to the invention are components of a computer server, in particular a Central Processing Unit or in English “CPU” (for “Central Processing Unit”), or a Graphics Processing Unit or in English “GPU” (for “Graphics Processing Unit”).

[0020] According to one aspect of the invention, the housing includes electrical connection elements between the inside and outside of the housing, to ensure the electrical connection between the electronic components and external devices.

[0021] According to one aspect of the invention, the receptacle is made at least partially of metal or plastic.

[0022] According to one aspect of the invention, the lid is made at least partially of metal or plastic.

[0023] The invention further relates to an assembly comprising a sealed housing as described above, and one or more components to be cooled placed in the housing, the component(s) being at least partially immersed in a cooling fluid, this cooling fluid being in particular a dielectric fluid.

[0024] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and an example of an embodiment given by way of illustration and not limitation with reference to the accompanying schematic drawings on the other hand, in which:

[0025] [Fig-1] The [Fig. 1] is a perspective representation of a watertight housing according to an example of an embodiment of the invention;

[0026] [Fig.2] Fig.2 is a perspective representation of the watertight housing of the [Fig.l], without the lid;

[0027] [Fig.3] Fig.3 is a perspective representation of the channel plate of the waterproof case of the [Fig.l];

[0028] [Fig.4] Fig.4 is a cross-sectional view of the watertight housing of the [Fig.2],

[0029] [Fig. 5] Fig. 5 is a perspective view of a watertight enclosure, without lid, according to another embodiment of the invention;

[0030] [Fig.6] Fig.6 is a perspective representation of the channel plate of the waterproof housing according to [Fig.5].

[0031] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0032] Figures 1 to 3 show a sealed housing 1 configured to receive components 100 to be cooled. Inside this housing 1, the components 100 are immersed in a cooling fluid, which in this case is a dielectric fluid.

[0033] The components 100 placed in the housing 1 are electronic components of a computer server, in particular a Central Processing Unit or in English “CPU” (for “Central Processing Unit”), or a Graphics Processing Unit or in English “GPU” (for “Graphics Processing Unit”).

[0034] The housing 1 includes a receptacle 2 which receives the components 100, and a cover 4 configured to seal the receptacle 2 tightly.

[0035] The housing 1 has a substantially rectangular outline. The receptacle 2 and the lid 4 are made of metal. Alternatively, the receptacle 2 and the lid 4 may be made of plastic. The lid 4 has hooks (not shown) that allow the receptacle 2 to be closed.

[0036] The receptacle 2 further comprises a base plate 22 which is assembled with a plate 24 with cooling fluid channels. This channeled plate 24 is an external plate within the meaning of the invention.

[0037] The base plate 22 has a main wall 32 extending in a plane P and forms a flat bottom of the receptacle 2, a bottom on which the components 100 to be cooled are placed.

[0038] The base plate 22 further includes four raised edges 42 which each form a right-angled corner with the main wall 32. The raised edges 42 are obtained by folding a sheet metal which also forms the main wall 32 of the base plate 22. The right-angled corners are made watertight by welding.

[0039] The raised edge 42, which is on the front face of the housing 1, has two cavity areas 52 which each have a triangular shape which flares out towards the bottom of the receptacle 2.

[0040] The cavity area 52 is formed by a stamping 55 of the base plate 22.

[0041] The 24-channel plate is assembled, in particular by brazing or welding, by example laser welding, with the base plate 22 to form, between the two plates, a network of channels 50 for a heat transfer fluid.

[0042] The channel plate 24 has a main wall 34 which includes shapes 38 to define the channel network 50. The channel plate 24 further has two raised edges 44, on the same side of the plate 24, each of which forms a right angle with the main wall 34.

[0043] Each raised edge 44 of the channel plate 24 is provided with an opening 28 which respectively forms a fluid inlet 3 for one of the raised edges 44 and a fluid outlet 5 for the other raised edge 44.

[0044] In [Fig. 4], the base plate 22 and the channel plate 24 are shown in cross-section transverse perpendicular to plane P. The raised edge 42 of the base plate 22 and the raised edge 44 of the channel plate 24 are placed against each other at the opening 28. Thus, the cavity area 52 forms with the raised edge 44 of the channel plate 24 a fluid inlet cavity 53 or a fluid outlet cavity 55. The inlet cavity 53 and the outlet cavity 55 communicate with the channel network 50.

[0045] The cavity area 52 allows, simply and without additional parts, for an angle connection between the fluid inlet 3 / fluid outlet 5 on the raised edges 42 and 44 and the channel network 50 on the bottom. The cavity area 52 of the base plate 22 thus serves to redirect fluid from one face to the other of the receptacle 2. The heat transfer fluid enters on a lateral face of the housing 1 and is then directed to the bottom of the housing 1. The fluid inlet cavity 53 or fluid outlet cavity 55 occupies a small space on the inner side of the receptacle 2.

[0046] In addition, the channel plate 24 is on the outside of the receptacle 2, which prevents the shapes 38 for defining the channel network 50 from being turned towards the inside of the receptacle 2.

[0047] The housing 1 includes at least one fluidic connection element 60, such as a connecting tube or flange, fixed on an external face of the raised edge 44 of the channel plate 24.

[0048] The fluidic connection member 60 is configured to allow a connection with an external tube at an angle, for example, of 90° relative to the raised edges 44.

[0049] The fluidic connection member 60 is located on the outside of the housing 1. This avoids additional bulk inside the receptacle 2.

[0050] The housing 1 also includes electrical connection elements 70 between the inside and outside of the housing 1, to ensure the electrical connection between the electronic components 100 and external devices. These electrical connection elements 70 are, for example, electrical plugs.

[0051] In the example just described, the channel network 50 extends only over the base plate 22, and not over the side walls. This channel network 50 comprises, for example, a succession of parallel channels on the bottom of the receptacle.

[0052] Now we will describe a second embodiment of the housing 1 which is shown in Figures 5 and 6, in which the channel network 50 is formed of channels 6 on the bottom of the receptacle and channels 7 which extend over two opposite lateral walls 12 of the housing 1.

[0053] The channel plate 24 has two raised edges 48 opposite each other which coincide with the two side walls 12 of the housing 1. Each of the raised edges 48 has embossed sections to form the channels 7.

[0054] The fluid inlet cavities 53 and fluid outlet cavities 55 are configured to supply both the channels 6 on the bottom and the channels 7 on the side walls 12 of the receptacle 2.

[0055] The housing 1 may include tubes 63 connecting a heat transfer fluid inlet 62 and an internal connector 61, these tubes going to cooling blocks (not shown) of the components 100, in particular a Central Processing Unit or in English “CPU” (for “Central Processing Unit”), or a Graphics Processing Unit or in English “GPU” (for “Graphics Processing Unit”).

[0056] The sealed housing 1 is configured to be inserted into a cabinet (also called a "Rack" in English) using a sliding drawer of the cabinet.

Claims

1. Demands A housing (1), in particular a sealed one, configured to receive one or more components (100) to be cooled, and in particular a cooling fluid in which the component(s) (100) are at least partially immersed, this cooling fluid being in particular a dielectric fluid, the housing (1) comprising: - a receptacle (2) configured to receive the component(s) (100), the receptacle (2) comprising: • a base plate (22) having a main wall (32) to form a base of the receptacle (2), a base on which the component(s) (100) to be cooled can be placed, the base plate (22) further comprising at least one raised edge (42) which forms a corner, for example at a right angle, with the main wall (32), the raised edge (42) having a cavity area (52), • an outer plate (24) assembled with the base plate (22) to form, between the two plates, a network of channels (50) for a heat transfer fluid, the outer plate being in particular a channel plate having a main wall (34) which includes shapes (38) to define at least partially the network of channels (50), the outer plate further having at least one raised edge (44) which forms a corner, for example at a right angle, with the main wall (34), the raised edge (44) being provided with an opening (28) forming a fluid inlet (3) or a fluid outlet (5), • and the raised edge (42) of the bottom plate (22) and the raised edge (44) of the outer plate (24) being placed against each other at the opening (28) of the outer plate (24) so ​​that the cavity area (52) of the bottom plate (22) forms with the raised edge (44) of the outer plate (24) a fluid inlet cavity (53) or fluid outlet (55) which communicates with the channel network (50), - in particular a cover (4) configured to close, in particular in a sealed manner, the receptacle (2).

2. Watertight housing (1) according to the preceding claim, in which the cavity area (52) is formed by a stamping (55) of the base plate (22) or is made of an added piece and welded to the raised edge (42) of the base plate (22).

3. A sealed housing (1) according to any one of the preceding claims, wherein the cavity area (52) of the base plate (22) has a shape substantially flaring towards the bottom of the receptacle (2).

4. A watertight housing (1) according to any one of the preceding claims, wherein the channel network (50) comprises at least one channel (7) extending over at least one side wall (12) of the housing (1), in particular in addition to channels (6) on the bottom.

5. Watertight housing (1) according to any one of the preceding claims, in which the raised edges (42, 44) are obtained by folding a sheet metal which also forms the main wall (32, 34) of the bottom plate (22) and the outer plate (24).

6. A sealed housing (1) according to any one of the preceding claims, comprising at least one fluidic connection element (60), in particular a connecting tube or flange, fixed to an external face of the raised edge (44) of the external plate (24).

7. A sealed enclosure (1) according to any one of the preceding claims, comprising electrical connection elements (70) between the inside and outside of the enclosure (1), to ensure the electrical connection between the electronic components (100) and external devices.

8. A sealed enclosure (1) according to any one of the preceding claims, configured to be inserted into a cabinet using a sliding drawer of the cabinet.

9. An assembly comprising a sealed housing according to any one of the preceding claims, and one or more components to be cooled placed in the housing, the component(s) being at least partially immersed in a cooling fluid, this cooling fluid being in particular a dielectric fluid?

10. Assembly according to the preceding claim, wherein the electronic components (100) placed in the housing(s) (1) are components of a computer server.

Citation Information

Patent Citations

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    FR3104893A1

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