Integrated circuit package comprising crossed dipole antenna
Patent Information
- Application Number
- JP2022017002
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-02-12
- Filing Date
- 2022-02-07
- Publication Date
- 2025-02-12
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention generally relates to an integrated circuit package comprising at least one crossed dipole antenna.
Background Art
[0002] The use of smart devices has been rapidly expanding, and smart devices often require the ability to transmit and receive signals via a wireless link. Also, with the advent of 5G, the use of antennas operating within the 1 - 30 GHz spectrum has been increasing and continues to increase. Therefore, the use of millimeter - wave antennas has been rapidly expanding. In some solutions, antennas integrated with integrated circuit chips are used. The integrated circuit chip may be, for example, a radio - frequency chip using integrated fan - out wafer level packaging (InFO - WLP) technology or similar packaging technology. The transmission line of such a solution usually uses a rectangular waveguide to transmit signals to and / or receive signals from the antenna of the integrated circuit package. The main purpose of combining an integrated antenna with InFO - WLP is to reduce signal loss in the feed line between the chip and the antenna. The current technical problem is that it cannot provide a polarization that matches the circularly polarized antenna. Furthermore, the current technical problem is that the antennas of the device are inhibited and / or blocked due to the other components of the device coupling and / or interfering with each other.
[0003] U.S. Patent No. 9,583,811 (B2) discloses a microwave device including a semiconductor package comprising a microwave semiconductor chip and a waveguide section associated with the semiconductor package.
Summary of the Invention
[0004] Providing an integrated circuit package with at least one cross-dipole antenna formed on the redistribution metal layer of the integrated circuit package offers advantages in achieving miniaturization, interference reduction, and increased antenna gain. Furthermore, providing a circularly polarized antenna allows for its positioning regardless of the antenna element of the communicating device. Additionally, providing the antenna in the package eliminates the need for specific high-frequency materials, allowing for the use of standard, cost-effective PCB materials.
[0005] These advantages are satisfied by providing a configuration having the features of the independent claim. A typical embodiment is defined in the dependent claim.
[0006] Accordingly, according to one aspect of the present invention, an integrated circuit package is provided. The integrated circuit package may be an embedded wafer-level ball grid array (eWLB). The integrated circuit package may comprise a transceiver radio-frequency integrated circuit (RFIC). The RFIC may be understood as, for example, a chip, chipset, and / or die. The RFIC may be a transceiver RFIC. The RFIC may be a transceiver RFIC configured for any frequency between 1 and 45 GHz. Preferably, the RFIC may be a 24.25 GHz to 29.5 GHz transceiver RFIC or a 37 GHz to 43.5 GHz transceiver RFIC. More preferably, the RFIC may be a 28 GHz transceiver RFIC. The integrated circuit package may comprise at least one antenna array. The antenna array may be configured to be beam-steering capable. The antenna array may be capable of beam steering of ±50°. At least one antenna array may be formed within a redistribution metal layer (RDL) of the integrated circuit package. The statement “At least one antenna array may be formed within the redistribution metal layer (RDL) of the integrated circuit package” may be understood, for example, as “at least one antenna array is comprised of the RDL, at least one antenna array is realized within the RDL, and / or at least one antenna array is located within the RDL.” The at least one antenna array may be a planar antenna array. The at least one antenna array may be located in the fan-out region of the integrated circuit package. The at least one fan-out region may include a mold compound. The at least one antenna array may be configured to transmit and / or receive signals through the mold compound of the fan-out region. The at least one antenna array may comprise at least one cross dipole antenna.Each cross dipole antenna may comprise a first dipole having two first legs, a second dipole having two second legs, and two pairs of legs. The first and second legs may be understood, for example, as the dipole leg of the first dipole and the dipole leg of the second dipole, respectively. Each pair of legs may comprise one first leg of the first dipole and one second leg of the second dipole of the corresponding cross dipole antenna. The integrated circuit package may comprise at least one pair of feed lines formed within the RDL. Each feed line of each pair of feed lines may connect each pair of legs of each cross dipole antenna to the RFIC. Each pair of feed lines may extend from the center of each cross dipole antenna toward the RFIC between adjacent first legs and adjacent second legs of the two pairs of legs of each cross dipole antenna. An adjacent first leg and an adjacent second leg may belong to different leg pairs of the two leg pairs. The feed line may be understood as, for example, a transmission line. Therefore, the cross dipole antenna and its respective feed lines can be realized using planar transmission line technology. That is, the cross dipole antenna and its respective feed lines can be realized in a single metal layer.
[0007] According to one aspect of the present invention, a configuration is provided. The configuration may comprise an integrated circuit package according to another aspect of the present invention. The configuration may further comprise a heat sink element. The heat sink element may be disposed on the RFIC of the integrated circuit package.
[0008] According to one aspect of the present invention, a system is provided. The system may comprise a configuration relating to another aspect of the present invention. The system may further comprise a printed circuit board (PCB). The configuration may be mounted on the PCB. The phrase "mounted" further means, for example, attached, positioned and / or soldered.
[0009] At least one antenna array and at least one pair of feed lines can be arranged in the RDL plane. That is, at least one antenna array and at least one pair of feed lines can be arranged in and / or along a plane, and the plane is located in the RDL. The plane may further be understood as a surface. Thus, the integrated circuit package can be miniaturized. At least one antenna array and at least one pair of feed lines can be realized in planar technology. At least one antenna array and at least one pair of feed lines can be realized in the RDL in planar technology.
[0010] Each pair of feed lines may extend in a first direction from the center of each cross dipole antenna. The first direction may be positioned at an angle of approximately 45° with respect to the longitudinal axis of adjacent first legs and adjacent second legs of two leg pairs. Adjacent first legs and adjacent second legs may consist of different leg pairs of two leg pairs. Therefore, the degradation of antenna performance due to interference caused by the feed lines of the cross dipole antenna can be mitigated and / or reduced. In other words, the first direction may be positioned at an angle of approximately 45° with respect to the longitudinal axis of the first leg of the first leg pair of two leg pairs and the longitudinal axis of the second leg of the second leg pair of two leg pairs. Similarly, the first direction may be positioned at an angle of approximately 45° with respect to the longitudinal axis of the second leg of the first leg pair of two leg pairs and the longitudinal axis of the first leg of the second leg pair of two leg pairs. Interference can be minimized if the feed lines are positioned at an angle of approximately 45° with respect to the longitudinal axes of adjacent first legs and adjacent second legs of two leg pairs. However, it should be understood that the angle may be between 35° and 45° with respect to the longitudinal axes of adjacent first legs and adjacent second legs. The feed lines of each pair may extend in a first direction from the center of each cross dipole antenna toward a bend. The distance from the center toward the bend may be shorter than the length of the second leg. The feed lines may be positioned parallel to each other from the center of the cross dipole antenna. The distance between two feed lines may be substantially zero or narrower than the width of the feed line.
[0011] Each cross dipole may be a circularly polarized antenna. For a cross dipole antenna to be circularly polarized, the relationship between the length of the first leg and the length of the second leg of the cross dipole antenna is important. If the cross dipole antenna is placed in a redistribution metal layer and the feed line is not coupled to the cross dipole antenna or does not extend perpendicularly to the cross dipole antenna, this relationship is 1.55. If the feed line is introduced into a redistribution metal layer and coupled to the cross dipole antenna, this relationship needs to be adjusted to maintain the circular polarization of the cross dipole antenna. The first length of each first leg of at least one cross dipole antenna may be longer than the second length of each second leg of at least one cross dipole antenna. To adjust the relationship in a specific way so that the cross dipole antenna to which the feed line is coupled maintains circular polarization, the first length may need to be increased by 11%, and the second length may need to be increased by 6%. The relationship between the first length of each first leg of at least one cross dipole antenna and the second length of each second leg of at least one cross dipole antenna is 1.52 to 1.68. Preferably, the relationship between the first length of each first leg of at least one cross dipole antenna and the second length of each second leg of at least one cross dipole antenna is 1.62. Thus, the cross dipole antenna may be a circularly polarized antenna formed in a redistribution metal layer and coupled to a feed line formed in the same redistribution metal layer.
[0012] The length and width of the legs of a cross dipole antenna determine its impedance. It is advantageous to use relatively wide legs to facilitate the production of cross dipole antennas. Wider legs also reduce resistive losses. The relationship between the length and width of the first leg of a cross dipole antenna may be 6.8 to 7.6. Preferably, the relationship between the length and width of the first leg of a cross dipole antenna may be 7.2. It should be understood that the length of the first leg is greater than the width of the first leg. The relationship between the length and width of the second leg of a cross dipole antenna may be 4.2 to 4.8. Preferably, the relationship between the length and width of the second leg of a cross dipole antenna may be 4.5. It should be understood that the length of the second leg is greater than the width of the second leg. The widths of the first and second legs are equal. The widths of the first and second legs may be 0.018 to 0.022 of the wavelength to which the cross dipole antenna corresponds. Preferably, the widths of the first and second legs may be 0.02 of the wavelength to which the cross dipole antenna corresponds. The length of the first leg may be 0.14 or 1 / 7 of the wavelength to which the cross dipole antenna corresponds. The length of the second leg may be 0.09 or 1 / 11 of the wavelength to which the cross dipole antenna corresponds. The wavelength to which the cross dipole antenna corresponds may be understood as the free-space wavelength.
[0013] Therefore, the phase difference between the first dipole and the second dipole of the cross dipole antenna can be adjusted. That is, the phase difference between the first dipole and the second dipole of the cross dipole antenna can be adjusted by adjusting the lengths of the first and second dipoles.
[0014] The first dipole of each cross dipole antenna may have a first angle of input admittance, and the second dipole of each cross dipole antenna may have a second angle of input admittance. The first angle of input admittance and the second angle of input admittance may differ by 90°. The first and second lengths may be determined such that the first and second angles of input admittance differ by 90°.
[0015] The two feed lines may be understood as, for example, a transmission line, an ungrounded transmission line, a differential transmission line, and / or an ungrounded differential transmission line. Each of the two feed lines of a pair of feed lines may be signaled by an RFIC. The two signals sent to the two feed lines of each pair of feed lines may have a phase difference of 180°. The RFIC may send a first signal to one feed line of a pair of feed lines and a second signal to the other feed line of the pair of feed lines. The term "send" may further mean, for example, output, provide, and / or supply. The RFIC may have at least two phase-shifter outputs configured to send the first signal and / or the second signal. Each phase-shifter output may be for the first signal and for the second signal.
[0016] The integrated circuit package may include at least two antenna arrays. The first antenna array of the at least two antenna arrays may be located in a first fan-out region of the fan-out region. The second antenna array of the at least two antenna arrays may be located in a second fan-out region of the fan-out region. The first and second fan-out regions may be located on opposite sides of the RFIC. The first and second antenna arrays of the at least two antenna arrays may be located on opposite sides of the RFIC.
[0017] Each antenna array may comprise at least four cross dipole antennas. However, it should be understood that each antenna array may contain any number of cross dipole antennas. For example, an antenna array may contain, for example, 1, 2, 3, 4, 5, 6, 7, 8, or more cross dipole antennas. Furthermore, an integrated circuit package may comprise at least two antenna arrays, and different antenna arrays may comprise different numbers of cross dipole antennas. The cross dipole antennas of an antenna array may be arranged in a single row, multiple rows, one stage, multiple stages, grid, and / or matrix. For example, the cross dipole antennas of an antenna array may be arranged along several aligned rows, with each row comprising the same number of cross dipole antennas.
[0018] The heat sink element may be configured to cool the RFIC. The heat sink element may be positioned between a first fan-out region and a second fan-out region. The heat sink element may be positioned on top of the RFIC. The heat sink may be positioned so as not to cover at least one antenna array. The heat sink may be positioned so that the first and second fan-out regions are not covered by the heat sink element. Thus, interference and / or blockage of at least one antenna array can be reduced. In addition, the heat sink element may be at least part of a reflective wall that can be configured to increase the gain of at least one antenna array.
[0019] A PCB may have a reflective metal layer. A PCB may further have a plurality of vias. An RFIC on a printed circuit board may be mounted on a plurality of vias. The plurality of vias may be understood, for example, as fencing and / or via fencing. The plurality of vias may be arranged through the PCB, or from the top surface of the PCB toward the bottom surface of the PCB, and / or from the top surface of the PCB toward the reflective metal layer of the PCB. The plurality of vias may be arranged along a rectangle. The rectangle may be arranged in a plane parallel to the reflective metal layer. The plurality of vias may be at least part of a reflective wall which may be configured to increase the gain of at least one antenna array.
[0020] At least one antenna array in the configuration may be configured for communication at a specific wavelength. For example, if the wavelength at 28 GHz is 10.7 mm, at least one antenna array may be configured for communication at the 10.7 mm wavelength. The term "communication" further means, for example, transmitting and / or receiving signals. At least one antenna array may be positioned at a first distance from the reflective metal layer. At least one antenna array may be positioned at a second distance from a plurality of vias. The first distance may be 1 / 4 of the specific wavelength. This can cause reinforcing interference, potentially increasing the antenna gain. The second distance may be 1 / 2 to 3 / 4 of the specific wavelength. This can maintain the circular polarization of the cross dipole antenna, i.e., improve the circular polarization performance. This can increase the gain of at least one antenna array. The heat sink element may have a height of approximately 3 / 10 of the specific wavelength. This reduces interference from the heat sink element and optimizes the antenna gain. However, the heat sink element may have a height of less than 3 / 10 of the specific wavelength.
[0021] A heat sink element, an RFIC, and a plurality of vias can form a reflective wall. The reflective wall can be disposed between antenna arrays of an integrated circuit package including at least two antenna arrays. The reflective metal layer and the reflective wall can form a corner reflector antenna. The arrangement of the corner reflector antenna can be configured to maintain the circular polarization of the cross-dipole antenna and not adversely affect the gain. Therefore, the corner reflector antenna can improve the performance of circular polarization.
Brief Description of the Drawings
[0022] Next, the present invention and other aspects of the present invention will be described in more detail with reference to the accompanying drawings representing embodiments of the present invention.
[0023] [Figure 1] A cross-sectional view of an integrated circuit package according to a typical embodiment of the present invention is schematically shown. [Figure 2] A perspective view of a cross-dipole antenna according to a typical embodiment of the present invention is schematically shown. [Figure 3] A perspective view of an integrated circuit package according to a typical embodiment of the present invention is schematically shown. [Figure 4] A cross-sectional view of a system according to a typical embodiment of the present invention is schematically shown. [Figure 5] A perspective view of a system according to a typical embodiment of the present invention is schematically shown.
Modes for Carrying Out the Invention
[0024] Figure 1 schematically shows a cross-sectional view of an integrated circuit package 2 according to a typical embodiment of the present invention. The integrated circuit package 2 comprises a first surface 2a and a second surface 2b. The first surface 2a and the second surface 2b are opposite to each other. The first surface 2a comprises bumps 26a and 26b. The bumps 26a and 26b comprise interconnect elements 26a. The bumps 26a and 26b also comprise dummy bumps 26b. The integrated circuit package 2 comprises three passivation layers. One of the passivation layers comprises the first surface 2a. The passivation layer extends along the length and width of the integrated circuit package 2. The integrated circuit package 2 comprises a first redistribution metal layer (RDL) 25. The first RDL 25 is located between two passivation layers. The integrated circuit package 2 comprises two antenna arrays 100 (see Figure 3). It should be understood that each antenna array 100 may comprise multiple antennas and / or antenna arrays. Each antenna array 100 may comprise at least one cross dipole antenna 10 (see Figure 2). The antenna array 100 is formed within a first RDL 25. The integrated circuit package 2 comprises dies constituting a radio frequency integrated chip (RFIC) 21. The RFIC 21 is located at the top of the passivation layer opposite the first face 2a. The RFIC 21 is also located in the center of the integrated circuit package 2 with respect to its length and width. The first RDL 25 is coupled to the RFIC 21. Therefore, a portion of the first RDL 25 extends to the RFIC 21 through one of the passivation layers. The antenna array 100 is coupled to the RFIC 21 via the first RDL 25. The integrated circuit package 2 comprises a second RDL. A portion of the second RDL extends to the RFIC 21 through two passivation layers. The interconnect element 26a is coupled to the RFIC 21 via the second RDL. The first RDL25 and the second RDL are placed between the passivation layers. Therefore, the second RDL is placed between the passivation layer having the first surface 2a and the intermediate passivation layer, and the first RDL25 is placed between the intermediate passivation layer and the passivation layer adjacent to the RFIC21. The integrated circuit package 2 includes a fan-out region 22. The fan-out region 22 includes a mold compound.The fan-out region 22 comprises a first fan-out region 22a and a second fan-out region 22b (see Figure 4). The first fan-out region 22a and the second fan-out region 22b are located on the surface where the dies constituting the RFIC 21 are located. The first fan-out region 22a and the second fan-out region 22b are part of the fan-out region 22 comprising at least one antenna array 100. The mold compound of the fan-out region 22 is located around the RFIC 21 at the top of the passivation layer and metal redistribution layer opposite to the first surface 2a. The top of the RFIC 21 is exposed. The mold compound does not cover the top of the RFIC 21. However, it should be understood that the mold compound may be located on the top of the RFIC 21. The top of the RFIC 21 and the mold compound comprises the second surface 2b. At least one antenna array 100 is configured to transmit and / or receive radio signals via molded compounds of first and second fan-out regions 22a, 22b.
[0025] Figure 2 schematically shows a perspective view of a cross dipole antenna 10 according to a typical embodiment of the present invention. The perspective view of Figure 2 shows a cross dipole antenna 10 arranged in a plane, and its field of view is perpendicular to the plane. The cross dipole antenna 10 is arranged within a first RDL 25, which can be understood as including the plane. The cross dipole antenna 10 may be understood as being formed within the first RDL 25, formed by the first RDL 25, and / or composed by the first RDL 25. The cross dipole antenna 10 comprises a first dipole and a second dipole. The first dipole comprises two first legs 11. The second dipole comprises two second legs 12. The cross dipole antenna 10 also includes two leg pairs 10a, 10b, which can be understood as the first leg pair 10a and the second leg pair 10b. Each leg pair 10a, 10b comprises a first leg 11 of the first dipole and a second leg 12 of the second dipole. The first leg 11 and second leg 12 of each leg pair 10a, 10b are positioned perpendicular to the longitudinal axes of the first leg 11 and second leg 12. The two first legs 11 are positioned parallel to the longitudinal axis of the first leg 11. The two first legs 11 are aligned along the longitudinal axis of the first leg 11. The two second legs 12 are positioned parallel to the longitudinal axis of the second leg 12. The first leg pair 10a and the second leg pair 10b have substantially the same shape. However, the first leg pair 10a and the second leg pair 10b are rotated 180° relative to each other in the plane. The cross dipole antenna 10 has a center 15. Each leg 11, 12 has a proximal end and a distal end. The proximal ends of the legs 11, 12 are positioned at the center 15. The first leg 11 extends in opposite directions from each proximal end toward each distal end. The second leg 12 extends in opposite directions from each proximal end toward each distal end. The direction of extension of the first leg 11 is perpendicular to the direction of the second leg 12. Therefore, the first leg 11 and the second leg 12 may be understood as being arranged in an X-shape, a + shape, or in a cross.The first and second legs 11, 12 have a rectangular shape and taper at their respective proximal ends. Thus, the first and second legs 12 may be understood to have a rectangular arrow shape. The first leg 11 is longer than the second leg 12. Thus, the first leg 11 and the second leg 12 have different lengths. As a result, the first dipole and the second dipole of the cross dipole antenna 10 have different dipole lengths. The first leg 11 and the second leg 12 have the same width. The relationship between the length and width of the first leg 11 is 7.2. The relationship between the length and width of the second leg is 4.5. The relationship between the length of the first leg 11 and the length of the second leg is 1.62. The different dipole lengths enable the realization of circular polarization of the cross dipole antenna 10. That is, the relationship between the lengths of the first leg 11 and the second leg 12 is set such that the cross dipole antenna 10 has circular polarization.
[0026] A pair of feed lines 20a and 20b are coupled to the cross dipole antenna 10. The pair of feed lines 20a and 20b may be understood as comprising a first feed line 20a and a second feed line 20b. The first feed line 20a is coupled to the first leg pair 10a at the center 15. Each feed line 20a and 20b is divided into two parts at the center 15, and the two parts are coupled to the first leg 11 and second leg 12 of the first leg pair 10a and the first leg 11 and second leg 12 of the second leg pair 10b, respectively. Thus, at the center 15, the first feed line 20a is coupled to the first leg 11 and second leg 12 of the first leg pair 10a, and the second feed line 20b is coupled to the second leg pair 10b. As a result, the second feed line 20b is coupled to the first leg 11 and the second leg 12 of the second leg pair 10b. The feed lines 20a and 20b extend from the center 15 between the first leg pair 10a and the second leg pair 10b. The feed lines 20a and 20b extend in the direction of extension, which has angles α and β with respect to the adjacent legs. The angles α and β are 45 degrees. The interference to the cross dipole antenna 10 caused by the feed lines 20a and 20b is minimized when the angles α and β are 45 degrees. The term "adjacent legs" means, for example, the two closest legs of the cross dipole antenna 10, and / or the second leg 12 of the first leg pair 10a and the first leg 11 of the second leg pair 10b. The extension direction of the feed lines 20a and 20b can optimally reduce interference and / or disruption of the first and second dipoles of the cross dipole antenna. The feed lines 20a and 20b are arranged adjacent to each other along the extension line from the center 15. The feed lines 20a and 20b extend toward the RFIC 21 (not shown, see Figures 1 and 3). The above typical embodiment eliminates the need to cross the feed lines that feed the cross dipole antenna 10, thereby creating a simpler and more compact solution. The above typical embodiment realizes the cross dipole antenna 10 in planar technology. That is, the cross dipole antenna 10 and the pair of feed lines 20a and 20b are realized within a single RDL of the integrated circuit package 2.
[0027] Figure 3 schematically shows a perspective view of an integrated circuit package 2 according to a typical embodiment of the present invention. The perspective view in Figure 3 is a view of the integrated circuit package 2 from below. That is, the perspective view in Figure 3 shows the first face 2a of the integrated circuit package 2, and the viewing angle is perpendicular to the first face 2a. The integrated circuit package 2 has a rectangle with four sides, as shown in Figure 3. The integrated circuit package 2 comprises an RFIC 21 and a fan-out area 22. The RFIC 21 is rectangular and is located in the center of the integrated circuit package 2. The sides of the RFIC 21 are parallel to the adjacent sides of the integrated circuit package 2. The fan-out area 22 is located around the RFIC 21. The fan-out area 22 comprises two antenna arrays 100. Each antenna array 100 is located in its respective fan-out area of the fan-out area 22. One of the antenna arrays 100 is located in the first fan-out region 22a of the fan-out region 22, and the other antenna array 100 is located in the second fan-out region 22b of the fan-out region 22. The fan-out region 22 further comprises two grounding points 27. The grounding points 27 are configured to reduce interference and / or interference between the RFIC 21 and the antenna arrays 100, and between the antenna arrays 100. The grounding points 27 may comprise grounding vias and / or grounding wires. Each grounding point 27 is located between the side of the RFIC 21, the side of the integrated circuit package 2 adjacent to the said side of the RFIC 21, and the two antenna arrays 100.
[0028] Each antenna array 100 comprises four cross dipole antennas 10. The four dipole antennas 10 of each antenna array 100 are arranged in a row. The two rows are parallel to the width of the integrated circuit package 2. The four dipole antennas 10 are arranged such that the longitudinal axis of the first dipole 11 of each dipole antenna 10 is parallel to the diagonal of the first surface 2a of the integrated circuit package 2. The four dipole antennas 10 of each antenna array 100 are positioned similarly. The integrated circuit package 2 comprises eight pairs of feed lines 20a, 20b. Each pair of feed lines 20a, 20b is coupled to its respective cross dipole antenna 10. The feed lines 20a, 20b coupled to the two cross dipole antennas 10 located in the center of the row of four dipole antennas 10 of each antenna array 100 extend from the center of each cross dipole antenna 10 to the RFIC 21. The first portions of the feed lines 20a and 20b of the two cross dipole antennas 10 located at the beginning and end of the row of four dipole antennas 10 in each antenna array 10 extend from the center of each cross dipole antenna 10 toward the nearest ground point 27. The second portions of the feed lines 20a and 20b of the two cross dipole antennas 10 located at the beginning and end of the row of four dipole antennas 10 in each antenna array 10 extend from the first portions of the feed lines 20a and 20b toward the RFIC 21.
[0029] The integrated circuit package 2 comprises several bumps 26a, 26b similar to those shown in Figure 1. The bumps located on the RFIC 21 are interconnect elements 26a. The interconnect elements 26a may be understood, for example, as solder bumps. The interconnect elements 26a are configured to couple the integrated circuit package 2 to the PCB 5 (not shown; see Figures 4 and 5) and / or another circuit. The bumps located in the fan-out region are dummy bumps 26b. The dummy bumps 26b are located around each cross dipole antenna 10. The dummy bumps 26b do not have to be configured to couple to another circuit. When coupled to the PCB 5 or a circuit, the dummy bumps 26b may be configured to provide support and / or stability to the integrated circuit package 2. Furthermore, the dummy bumps 26b may be configured to reduce interference and / or interference between the RFIC 21 and the cross dipole antenna 10 or between the dipole antennas 10.
[0030] Figure 4 schematically shows a cross-sectional view of a system 500 according to a typical embodiment of the present invention. The system 500 comprises a configuration 1 and a printed circuit board 5. Configuration 1 comprises an integrated circuit package 2 and a heat sink element 50. The heat sink element 50 is positioned on the RFIC 21 of the integrated circuit package 2. The heat sink element 50 is positioned between the first fan-out region 22a and the second fan-out region 22b of the integrated circuit package 2. The heat sink element 50 has a curved shape, which may be understood as a semicircular shape with a bottom. The bottom of the heat sink element 50 is positioned on the RFIC 21. The heat sink element 50 is widest at its bottom. The shape and position of the heat sink element 50 can be configured to reduce interference and / or obstruction between antenna arrays 100, and can improve the beam steering performance of the antenna arrays 100. Configuration 1 is mounted on the PCB 5. Configuration 1 is mounted on the PCB by solder bumps 26a, 26b. The solder bump 26b is located below the fan-out regions 22a and 22b. The solder bump 26a includes an interconnect element and is configured to connect the integrated circuit package 2 to the PCB 5. The solder bumps 26a and 26b are part of the design and provide improved antenna performance and mechanical stability to the integrated circuit package 2. The PCB 5 includes a reflective metal layer 6. The reflective metal layer 6 is located on the bottom surface of the PCB 5, which is opposite to the side of the PCB on which the integrated circuit package 2 is mounted. The integrated circuit package 2 is mounted on the PCB 5 such that the antenna array 100 of the integrated circuit package 2 is located at a first distance d1 from the reflective metal layer 6. The first distance d1 is measured in a direction perpendicular to the reflective metal layer 6. By positioning the antenna array 100 at a first distance d1 from the reflective metal layer 6, reinforcing interference of wavelengths and / or an increase in the gain of the antenna array 100 are achieved.
[0031] PCB 5 comprises a plurality of vias 7. The plurality of vias 7 are configured to reflect antenna signals from the antenna array 100. The plurality of vias 7 are arranged along a shape corresponding to the outer perimeter shape of the RFIC 21. The integrated circuit package 2 is placed on PCB 5 such that the plurality of vias 7 are arranged along and / or around the outer perimeter of the RFIC 21, or along and / or around the outer perimeter at a distance from the perimeter. The plurality of vias 7 may also include vias within the outer perimeter of the RFIC 21. The integrated circuit package 2 is placed on PCB 5 such that the antenna array 100 of the integrated circuit package 2 is located at a second distance d2 from the plurality of vias 7. The second distance d2 is measured in a direction parallel to the reflective metal layer 6. That is, the second distance d2 is measured in a direction perpendicular to the first distance d1. The second distance d2 is measured from the center of the antenna array 100 to the plurality of vias 7. The second distance d2 may be understood as the shortest distance between the center of the antenna array 100 and the plurality of vias 7. The heat sink element 50, the RFIC 21, and the multiple vias 7 together form a sidewall reflector 8. The sidewall reflector 8 may be understood as an electric wall. The sidewall reflector 8 can increase the gain of the antenna array 100. The antenna array 100 is configured for transmission and / or reception at a specific wavelength (i.e., a specific frequency). The first distance d1 is equal to 1 / 4 of the specific wavelength. The second distance d2 is equal to 1 / 2 of the specific wavelength. The combination of the sidewall reflector 8 and the reflective metal layer 6 may be understood as a corner reflector antenna. The corner reflector antenna can further increase the wavelength-reinforcing interference and / or gain of the antenna array 100.
[0032] Figure 5 schematically shows a perspective view of a system 500 according to a typical embodiment of the present invention. The system 500 comprises an integrated circuit package 2, a heat sink element 50, and a PCB 5. The first surface 2a of the integrated circuit package 2 is soldered to the PCB 5 at the center of the PCB 5. The heat sink element 50 is positioned on the second surface 2b of the integrated circuit package 2. The heat sink element 50 extends in the longitudinal direction. The heat sink element 50 has two ends and a central portion. The central portion of the heat sink element 50 is positioned along the central portion of the integrated circuit package 2. The central portion of the integrated circuit package 2 includes an RFIC 21 and a ground portion 27. The first fan-out region 22a and the second fan-out region 22b of the integrated circuit package 2 are not covered by the heat sink element 50. The width of the central portion of the heat sink element 50 is approximately equal to the width or height of the RFIC 21. This reduces interference from the heat sink element 50 to the antenna array 100, which is comprised of the first and second fan-out regions 22a and 22b. Furthermore, the ends of the heat sink element 50 widen from the center towards each longitudinal end of the heat sink element 50. Each end of the heat sink element 50 is provided with two fastening holes. One fastening hole at each end is configured to receive fastening means such as screws and nuts for attaching the heat sink element 50 to the PCB 5. The other fastening hole at each end is configured to receive fastening means such as screws and nuts for attaching the system 500 to the housing and / or auxiliary devices. The shape of the heat sink element 50 is configured to reflect signals transmitted and / or received by the antenna array 100. That is, the shape of the heat sink element 50 is configured to increase the gain of the antenna array 100.
[0033] Those skilled in the art will recognize that the present invention is not limited to the typical embodiments described above. Rather, many modifications and variations are possible within the scope of the appended claims.
Claims
1. A transceiver radio frequency integrated circuit (RFIC) (21); At least one antenna array (100) formed in a redistribution metal layer (RDL) (25) of an integrated circuit package and disposed in a fan-out region (22a, 22b) of said integrated circuit package, comprising at least one cross-dipole antenna (10); Each cross dipole antenna is a first dipole having two first legs (11); a second dipole having two second legs (12); at least one antenna array (100) comprising two leg pairs (10a, 10b), each leg pair comprising one first leg of said first dipole and one second leg of said second dipole; An integrated circuit package (2) comprising: The integrated circuit package further comprises at least one pair of power supply lines (20a, 20b) formed in the RDL; Each feed line of each pair of feed lines (20a, 20b) is coupled between a respective leg pair of a respective cross-dipole antenna and the RFIC; Each pair of feed lines extends from a center (15) of a respective cross-dipole antenna to the RFIC between adjacent first legs and adjacent second legs of the two leg pair of the respective cross-dipole antenna; The adjacent first leg and the adjacent second leg belong to different ones of the two leg pairs.
2. The integrated circuit package (2) of claim 1, wherein said at least one antenna array and said at least one pair of feed lines are disposed in a plane of said redistribution metal layer.
3. Each pair of feed lines extends in a first direction from the center (15) of the respective cross-dipole antenna; 3. The integrated circuit package (2) of claim 1 or 2, wherein the first direction is disposed at an angle of approximately 45 degrees relative to longitudinal axes of the adjacent first legs and the adjacent second legs.
4. The integrated circuit package (2) according to any one of claims 1 to 3, wherein each cross-dipole antenna (10) is a circularly polarised antenna.
5. 5. The integrated circuit package (2) of claim 1, wherein a relationship between a first length of each first leg of the at least one cross-dipole antenna and a second length of each second leg of the at least one cross-dipole antenna is between 1.52 and 1.
68.
6. 6. The integrated circuit package (2) of claim 1, wherein a first leg of each cross dipole antenna has a first length such that each first dipole of each cross dipole antenna has an input admittance at a first angle, and a second leg of each cross dipole antenna has a second length such that each second dipole of each cross dipole antenna has an input admittance at a second angle, the input admittance at the first angle and the input admittance at the second angle differing by 90 degrees.
7. The two feed lines of each pair of feed lines are each sent a signal by the RFIC, The integrated circuit package (2) according to any one of the preceding claims, wherein the two signals sent to the two feed lines of each pair of feed lines have a phase difference of 180°.
8. Further comprising at least two antenna arrays; a first antenna array of the at least two antenna arrays is disposed in a first fan-out region (22a) of the fan-out region (22); a second antenna array of the at least two antenna arrays is disposed in a second fan-out region (22b) of the fan-out region (22); The integrated circuit package (2) of any one of claims 1 to 7, wherein the first fan-out region and the second fan-out region are located on opposite sides of the RFIC.
9. The integrated circuit package (2) of claim 8, wherein each antenna array comprises at least four cross-dipole antennas.
10. An integrated circuit package (2) according to claim 8 or 9, a heat sink element (50) disposed on the RFIC of the integrated circuit package and between the first fan-out region and the second fan-out region.
11. The configuration (1) according to claim 10, A printed circuit board (PCB) (5), The configuration (1) is mounted on the printed circuit board (5), forming a system (500).
12. The PCB is A reflective metal layer (6); a plurality of vias (7); The system (500) of claim 11, wherein the RFIC of the printed circuit board is mounted to the plurality of vias.
13. the at least one antenna array of the arrangement is configured for communication at a particular wavelength; the at least one antenna array is disposed a first distance from the reflective metal layer and a second distance from the plurality of vias; the first distance is ¼ of the particular wavelength; The system (500) of claim 12, wherein the second distance is between 1 / 2 and 3 / 4 of the particular wavelength.
14. the heat sink element, the RFIC and the vias form a reflective wall; The system (500) of any one of claims 12 to 13, wherein the reflecting wall is configured to increase the gain of the at least one antenna array.
15. the reflective metal layer and the reflective wall form a corner reflector antenna; The system (500) of claim 14, wherein the corner reflector antenna is configured to increase the gain of the at least one antenna array.