Electronic component and manufacturing method for the same, and electronic apparatus

Abstract

To provide a technique advantageous in increasing the temperature of a bonding member effectively.SOLUTION: A manufacturing method for an electronic apparatus includes: a step of preparing a first structure in which a first electrode is disposed on a first main surface of a first substrate; a step of preparing a second structure in which a second electrode is disposed on a first main surface of a second substrate; and a curing step of making the first main surface of the first substrate and the first main surface of the second substrate face each other through a bonding member and curing the bonding member with force applied to the first structure and the second structure so that the bonding member is pressed. At least one of the first electrode and the second electrode has a window part. In the curing step, the bonding member is cured by irradiating the bonding member with light through the window part.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an electronic component, a manufacturing method thereof, and an electronic device. [Background technology]

[0002] Electronic components that can be incorporated into devices such as imaging devices and display devices may include an electronic substrate on which electronic elements are provided and a circuit board for supplying power to the electronic substrate from an external source. The electronic substrate may include an element region in which electronic elements are arranged and a peripheral region provided on the outer edge of the element region. Connection terminals are provided in the peripheral region, and a circuit substrate such as a flexible printed circuit board (FPC) may be electrically connected to the connection terminals. Examples of bonding materials that can be used include anisotropic conductive films (ACFs) containing conductive particles and anisotropic conductive pastes (ACPs). A thermocompression bonding method is known in which such bonding materials are heated and pressurized to electrically connect connection terminals to a circuit substrate. Patent Document 1 discloses a method for electrically connecting electrodes arranged on a glass substrate to correspondingly arranged connection electrodes using a thermosetting resin, in which the thermosetting resin is irradiated with laser light to harden. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-253665 Summary of the Invention [Problem to be solved by the invention]

[0004] The method of irradiating a thermosetting resin with laser light is advantageous because it selectively irradiates the joining member with laser light, thereby efficiently curing the joining member without applying excessive heat to components other than the joining member, such as an electronic substrate. However, the joining member has areas covered with opaque electrodes and areas not covered with electrodes. The areas not covered with electrodes are easily cured by direct irradiation with laser light. On the other hand, the areas covered with opaque electrodes are difficult to cure because the electrodes block the laser light. Therefore, the method of irradiating the joining member with light such as laser light has a problem in that it is not possible to stably cure the areas of the joining member covered with opaque electrodes.

[0005] An object of the present invention is to provide an advantageous technique for effectively hardening a joining member. [Means for solving the problem]

[0006] One aspect of the present invention relates to a method for manufacturing an electronic device, the manufacturing method including: a step of preparing a first structure having a first electrode arranged on a first main surface of a first substrate; a step of preparing a second structure having a second electrode arranged on a first main surface of a second substrate; and a step of placing the first main surface of the first substrate and the first main surface of the second substrate opposite each other via a bonding material, and curing the bonding material while applying force to the first structure and the second structure so that the bonding material is pressurized, wherein at least one of the first electrode and the second electrode has a window portion, and in the curing step, the bonding material is cured by irradiating the bonding material with light through the window portion. [Effects of the Invention]

[0007] The present invention provides an advantageous technique for effectively curing a joining member. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing electronic components according to first to eighth embodiments. [Figure 2]FIG. 2 is a cross-sectional view of the electronic component according to the first embodiment (part B in FIG. 1). [Figure 3A] 3A to 3C are diagrams illustrating a method for manufacturing an electronic component according to the first embodiment. [Figure 3B] 3A to 3C are diagrams illustrating a method for manufacturing an electronic component according to the first embodiment. [Figure 3C] 3A to 3C are diagrams illustrating a method for manufacturing an electronic component according to the first embodiment. [Figure 4] 3A to 3C are diagrams illustrating a method for manufacturing an electronic component according to the first embodiment. [Figure 5A] 5A to 5C are diagrams illustrating a method for manufacturing an electronic component according to a second embodiment. [Figure 5B] 5A to 5C are diagrams illustrating a method for manufacturing an electronic component according to a second embodiment. [Figure 5C] 5A to 5C are diagrams illustrating a method for manufacturing an electronic component according to a second embodiment. [Figure 6] 10A to 10C are diagrams illustrating a method for manufacturing an electronic component according to a third embodiment. [Figure 7] FIG. 10 is a diagram showing an electronic component according to a fourth embodiment. [Figure 8] FIG. 10 is a diagram showing an electronic component according to a fifth embodiment. [Figure 9] FIG. 10 is a diagram showing an electronic component according to a sixth embodiment. [Figure 10] FIG. 13 is a diagram showing an electronic component according to a seventh embodiment. [Figure 11] FIG. 13 is a diagram showing an electronic component according to an eighth embodiment. [Figure 12] 1 is a schematic diagram showing an electronic device or a display device according to an embodiment. [Figure 13] 1 is a schematic diagram showing an electronic device or a display device according to an embodiment. [Figure 14] 1A and 1B are diagrams illustrating electronic devices configured as display devices. [Figure 15] 10A to 10C are diagrams showing application examples of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] [First embodiment] An electronic component 400 according to a first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a perspective view showing the structure of electronic component 400 according to the first embodiment, and Figure 2 is a cross-sectional view of part B in Figure 1 as viewed from the direction of arrow A. Electronic component 400 may include a first structure (electronic substrate) 100, a second structure (circuit board) 200, and a bonding member 300.

[0011] The first structure 100 may include a first substrate 101 made of a substrate material such as silicon or glass, and a first electrode 102 disposed on a first main surface P11 of the first substrate 101. The first main surface P11 of the first substrate 101 may include an element region where electronic elements are disposed and a peripheral region disposed between the element region and an edge of the first substrate 101, and the first electrode 102 may be disposed in the peripheral region. The second structure 200 may include a second substrate 201 and a second electrode 102 disposed on a first main surface P21 of the second substrate 201. The second electrode 202 is disposed to face the first electrode 102. Typically, the first substrate 101 has a plurality of first electrodes 102 disposed on the first main surface P11, and the second substrate 201 has a plurality of second electrodes 202 disposed on the first main surface P21. In this case, a corresponding one of the multiple second electrodes 202 faces each of the multiple first electrodes 102. The bonding member 300 is disposed between the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 so as to electrically bond the first electrode 102 of the first structure 100 and the second electrode 202 of the second structure 200.

[0012] The second structure 200 may be, for example, a printed wiring board. More specifically, the second structure 200 may be a rigid substrate, such as a glass epoxy substrate or a composite substrate, with a wiring pattern printed on it. Alternatively, the second structure 200 may be a flexible wiring board in which a wiring pattern is formed on a flexible film, such as polyimide. Alternatively, the second structure 200 may be a rigid-flexible wiring board, which is a composite of a flexible film and a rigid substrate. The second structure 200 may be configured to supply power to the first substrate 101 of the first structure 100. The second structure 200 may also have the function of supplying signals to the first substrate 101 of the first structure 100 and the function of transmitting or outputting signals output from the first substrate 101 of the first structure 100 to another device. The second electrode 202 may be provided with a window portion 202b. In another aspect, the second electrode 202 includes an electrode portion 202a and a window portion 202b. The window portion 202b may be an opening provided in the second electrode 202, or may be formed by filling the opening with a transparent material. In the former case, the opening may be filled with air. The window portion may be provided in the first electrode 102 of the first structure 100, or may be provided in both the first electrode 102 of the first structure 100 and the second electrode 202 of the second structure 200.

[0013] The bonding member 300 may include a bonding resin 301 and a plurality of conductive particles 302 dispersed in the bonding resin 301. The bonding resin 301 may be, for example, an adhesive material such as a thermosetting resin, a UV-curable resin (photo-curable resin), or a UV-thermal curable resin.

[0014] A manufacturing method of the electronic component 400 of the first embodiment will be described below with reference to FIGS. 3A-3C and 4. First, as illustrated in FIG. 3A, a plurality of first structures 100 are formed on a first main surface of a substrate 101W made of silicon, glass, or the like, and the plurality of first structures 100 are then singulated by dicing or the like. This results in the preparation of singulated first structures 100. Each first structure 100 has an electronic element and a first electrode 102. The electronic element is not particularly limited, but may be, for example, at least one of an imaging element, a display element (e.g., a liquid crystal display element or an organic EL display element), and a piezoelectric element.

[0015] 3B, the second structure 200 is fabricated by forming a second electrode 202 having a window portion 202b on the first main surface of the second substrate 201. In another aspect, the second structure 200 is fabricated by forming a second electrode 202 having an electrode portion 202a and a window portion 202b on the first main surface of the second substrate 201. In this way, the second structure 200 is prepared.

[0016] 3C , a bonding member 300 is placed in a region where the first electrode 102 and the second electrode 202 are electrically connected. The bonding member 300 may be, for example, a film-like ACF or a liquid ACP. Here, the bonding member 300 is placed on the first main surface of the second substrate 201, but the bonding member 300 may also be placed on the first main surface of the first substrate 101. As described above, the bonding member 300 may include a bonding resin 301 and a plurality of conductive particles 302 dispersed and arranged in the bonding resin 301.

[0017] Next, a curing process illustrated in FIG. 4 is performed. In the curing process, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are placed opposite each other via the bonding member 300, and the bonding member 300 is cured while applying force to the first structure 100 and the second structure 200 so that the bonding member 300 is compressed. In the curing process, a pressure may be applied to the first structure 100 and the second structure 200 by the pressure bonding head 500 in a direction in which the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 approach each other. In the curing process, light such as laser light (hereinafter, referred to as heating light) may be irradiated onto the bonding member 300 via the pressure bonding head 500 from a normal direction to the second surface P22 of the second substrate 201 of the second structure 200 having the window portion 202b. The compression bonding head 500 may be made of a material that transmits the heating light, such as glass. The heating light has a wavelength band that hardens the bonding resin 301 of the bonding member 300, and the crimping head 500 is configured to transmit light in that wavelength band. The window 202b may be an opening filled with air or the like, or may be made of a material that transmits the heating light. The second substrate 201 is also made of a material that transmits the heating light. The absorption rate of the heating light by the bonding member 300 is higher than the absorption rate of the heating light by the second electrode 202 having the window 202b. Similarly, when the first electrode 102 has a window, the absorption rate of the heating light by the bonding member 300 is higher than the absorption rate of the heating light by the first electrode 102 having the window.

[0018] The bonding member 300 includes a first portion disposed in a first region 301(a) that is not sandwiched between the first electrode 102 and the second electrode 202, and a second portion disposed in a second region 301(b) that is sandwiched between the first electrode 102 and the second electrode 202 (including the window portion 202b). The first portion of the bonding member 300 disposed in the first region 301(a) is irradiated with heating light through the second substrate 201, thereby raising the temperature of the first portion and hardening it. The second portion of the bonding member 300 disposed in the second region 301(b) is irradiated with heating light through the second substrate 201 and the window portion 202b, thereby raising the temperature of the second portion and hardening it. Note that the portion of the second portion that is covered by the electrode portion 202a of the second electrode 202 is heated by heat generated by the heating light incident through the window portion 202b, and may also be heated by scattered light of the heating light incident through the window portion 202b.

[0019] When a window portion is provided in the first electrode 102 of the first structure 100, the heating light is irradiated onto the bonding member 300 through the first substrate 101 of the first structure 100. More specifically, the heating light is irradiated onto a first portion of the bonding member 300 arranged in a first region 301(a) through the first substrate 101, and the heating light is irradiated onto a second portion of the bonding member 300 arranged in a second region 301(b) through the first substrate 101 and the window portion.

[0020] According to the first embodiment, the second portion of the bonding member 300, which is located in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 (including the window portion 202b), can also be cured by irradiating the bonding member 300 with heating light through the window portion. Therefore, for example, even in a region where the second electrodes 202 (or the first electrodes 102) are densely arranged, the bonding member 300 can be stably cured. In other words, according to the first embodiment, the bonding member 300 can be stably cured over the entire region, regardless of the arrangement density of the second electrodes 202 (or the first electrodes 102).

[0021] [Second embodiment] An electronic component 400 according to the second embodiment will be described below with reference to Fig. 1 and Figs. 5A-5C. Matters not mentioned in the second embodiment may follow those of the first embodiment. Fig. 1 is a perspective view showing the structure of electronic component 400 according to the second embodiment, and Fig. 5A is a cross-sectional view of portion B as seen from the direction of arrow A in Fig. 1.

[0022] The electronic component 400 of the second embodiment has a larger number of conductive particles 302 disposed between the first electrode 102 and the second electrode 202 than the electronic component 400 of the first embodiment illustrated in Fig. 2. The electronic component 400 of the second embodiment is more suitable for high-speed communication than the electronic component 400 of the first embodiment.

[0023] 5B and 5C, a method for manufacturing electronic component 400 according to the second embodiment will be described. In the first embodiment, heating light is irradiated simultaneously onto first region 301(a) and second region 301(b), but in the second embodiment, heating light is irradiated onto first region 301(a) and then onto second region 301(b).

[0024] In the second embodiment, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are opposed to each other via the bonding member 300, and a curing process is performed while applying force to the first structure 100 and the second structure 200 so that the bonding member 300 is compressed. The curing process of the second embodiment includes a first curing process and a second curing process subsequent to the first curing process. First, as schematically shown in FIG. 5B, in the first curing process, a first portion of the bonding member 300 located in the first region 301(a) is selectively irradiated with heating light to increase the fluidity of the first portion and then cured. In the second curing process, as schematically shown in FIG. 5C, a portion of the second portion where the window portion 202b is present is selectively irradiated with heating light through the window portion 202b to increase the fluidity of the second portion and then cured.

[0025] When the fluidity of the second portion disposed in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 is increased, the conductive particles 302 in the second portion become mobile. In the first embodiment, the fluidity of the first and second portions is increased by simultaneously irradiating the first and second portions with heating light. As a result, in the first embodiment, some of the conductive particles 302 in the second portion, which is subjected to higher pressure due to the presence of the first electrode 102 and the second electrode 202, may move to the first portion. On the other hand, in the second embodiment, the first portion disposed in the first region 301(a) not sandwiched between the first electrode 102 and the second electrode 202, is cured before the second portion disposed in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202. Therefore, according to the second embodiment, the migration of the conductive particles 302 from the second portion to the first portion is suppressed. As a result, the number of conductive particles 302 in the second portion arranged in the second region 301(b) sandwiched between the first electrode 102 and the second electrode 202 can be made larger than in the first embodiment. This makes it possible to make the electrical resistance between the first electrode 102 and the second electrode 202 smaller than in the first embodiment. Therefore, the electronic component 400 of the second embodiment is more suitable for high-speed communication than the electronic component 400 of the first embodiment.

[0026] [Third embodiment] An electronic component 400 according to the third embodiment will be described below with reference to Fig. 1 and Fig. 6. Matters not mentioned in the third embodiment may follow those of the first embodiment. Fig. 1 is a perspective view showing the structure of electronic component 400 according to the third embodiment, and Fig. 6 is a cross-sectional view of part B as seen from the direction of arrow A in Fig. 1.

[0027] The third embodiment differs from the first embodiment in the method for manufacturing the electronic component 400. In the third embodiment, the first main surface P11 of the first substrate 101 and the first main surface P21 of the second substrate 201 are opposed to each other via the bonding member 300, and a curing process is performed while applying force to the first structure 100 and the second structure 200 so that the bonding member 300 is compressed. The curing process of the third embodiment includes a first curing process and a second curing process subsequent to the first curing process. In the first curing process, heating light is irradiated onto a central portion C of the bonding member 300 in the electrode arrangement direction (predetermined direction). In the second curing process performed following the first curing process, heating light is irradiated onto a peripheral portion D of the bonding member 300 in the electrode arrangement direction. Here, the electrode arrangement direction is the arrangement direction of the first electrodes 102, which is also the arrangement direction of the second electrodes. In FIG. 6, the electrode arrangement direction is the left-right direction. "Central region" and "periphery region" are relative terms; outside the central region is the periphery region, and inside the periphery region is the central region.

[0028] Irradiation of the heating light onto the bonding member 300 raises the temperature of the bonding member 300, and if the bonding member 300 is a bonding material containing an organic material such as an FPC, the bonding member 300 expands with the increase in temperature. As a result, if the entire bonding member 300 is cured at once as in the manufacturing method of the first embodiment, the expansion of the bonding member 300 may reduce the accuracy of alignment between the first electrode 102 and the second electrode 202 in the peripheral portion D.

[0029] In the third embodiment, the second curing process of curing the peripheral portion D is performed after the first curing process of curing the central portion C, so that the second curing process is less susceptible to the effects of expansion of the bonding member 300. The third embodiment is advantageous when using a bonding member with a large linear expansion coefficient, such as an FPC, or when using a long electronic component that is easily affected by the expansion of the bonding member.

[0030] [Fourth embodiment] An electronic component 400 according to a fourth embodiment will be described below with reference to FIG. 7. Matters not mentioned in the fourth embodiment may conform to the first to third embodiments. The fourth embodiment provides an example of a window portion provided in the second electrode 202 and / or the first electrode 102. While a window portion provided in the second electrode 202 is exemplified here, a similar structure may also be applied to the first electrode 102.

[0031] As illustrated in FIG. 7(a), the second structure 200 may include a plurality of second electrodes 202 (electrode portions 202a) on a first main surface of a second substrate 201, and one second electrode 202 (electrode portion 202a) may be provided with one window portion 202b. The window portion 202b may be surrounded by the electrode portion 202a over its entire periphery, as illustrated in FIG. 7(a), or may be partially surrounded by the electrode portion 202a, as illustrated in FIG. 7(b). The window portion 202b may have a rectangular shape, as illustrated in FIGS. 7(a) and 7(b). Alternatively, the window portion 202b may have a curved shape, a circular shape, an elliptical shape, or another shape.

[0032] [Fifth embodiment] An electronic component 400 according to a fifth embodiment will be described below with reference to FIG. 8. Matters not mentioned in the fifth embodiment may conform to the first to third embodiments. The fifth embodiment provides an example of a window portion provided in the second electrode 202 and / or the first electrode 102. While a window portion provided in the second electrode 202 is exemplified here, a similar structure may also be applied to the first electrode 102.

[0033] 8, the second structure 200 can include a plurality of second electrodes 202 (electrode portions 202a) on a first main surface of a second substrate 201, and a plurality of window portions 202b can be provided in one second electrode 202 (electrode portion 202a). The electrode portion 202a is disposed between the window portions 202b, and a bonding member containing conductive particles is disposed between the electrode portion 202a of the second electrode 202 and the first electrode 102, thereby reducing the electrical resistance between the first electrode 102 and the second electrode 202.

[0034] [Sixth embodiment] An electronic component 400 according to a sixth embodiment will be described below with reference to FIG. 9. Matters not mentioned in the sixth embodiment may conform to the first to third embodiments. The sixth embodiment provides an example of the arrangement of a plurality of windows provided in the second electrode 202 and / or the first electrode 102. While the windows provided in the second electrode 202 are exemplified here, a similar structure may also be applied to the first electrode 102.

[0035] 9, in each second electrode 202, a plurality of window portions 202b are arranged along the longitudinal direction of the second electrode 202. A distance W0 from a short-side edge of each second electrode 202 to each of the plurality of window portions 202b is greater than a spacing W1 between adjacent window portions 202b among the plurality of window portions 202b. The sixth embodiment is advantageous, for example, when it is desired to arrange more conductive particles in an area from a short-side edge of each second electrode 202 to each of the plurality of window portions 202b by the spacing W0 than in an area with spacing W1 between adjacent window portions 202b.

[0036] [Seventh embodiment] An electronic component 400 according to the seventh embodiment will be described below with reference to FIG. 10. Matters not mentioned in the seventh embodiment may conform to the first to third embodiments. The seventh embodiment provides an example of the arrangement of a plurality of windows provided in the second electrode 202 and / or the first electrode 102. Here, the window provided in the second electrode 202 is exemplified. A similar structure may be applied to the first electrode 102.

[0037] The seventh embodiment provides an example in which a center line 202c along the longitudinal direction of each second electrode 202 (or first electrode 102) is arranged to pass through multiple window portions 202b. In the example shown in FIG. 10(a), the multiple window portions 202b are arranged linearly along the center line 202c. In the example shown in FIG. 10(a), the multiple window portions 202b are arranged in a staggered pattern along the center line 202c. Either example is advantageous for controlling the temperature distribution formed in the bonding member 300 by the heating light.

[0038] [Eighth embodiment] An electronic component 400 according to an eighth embodiment will be described below with reference to FIG. 11. Matters not mentioned in the eighth embodiment may conform to the first to third embodiments. The eighth embodiment provides an example of the arrangement of a plurality of windows provided in the second electrode 202 and / or the first electrode 102. Here, the window provided in the second electrode 202 is illustrated, but a similar structure may also be applied to the first electrode 102.

[0039] The eighth embodiment provides an example in which the second electrodes 202 (or the first electrodes 102) are arranged in a grid pattern, as illustrated in Fig. 11. Such an arrangement is advantageous for controlling the temperature distribution formed in the bonding member 300 by the heating light.

[0040] [Ninth embodiment] The bonding members in the first to eighth embodiments may be replaced with photocurable bonding members. In this case, the light for curing the bonding members does not need to include a wavelength range capable of heating the bonding members, but only needs to include a wavelength range capable of curing the bonding members by photopolymerization.

[0041] [Application example] FIG. 12 is a schematic diagram showing an electronic device or display device according to one embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits (FPCs) 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005, respectively. The touch panel 1003 and the display panel 1005 correspond to first substrates having first electrodes on their first main surfaces, and the flexible printed circuits (FPCs) 1002 and 1004 correspond to second substrates having second electrodes on their first main surfaces. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different location even if the display device is a portable device.

[0042] The electronic device or display device according to this embodiment may have color filters having red, green, and blue colors, and the red, green, and blue colors may be arranged in a delta configuration in the color filters.

[0043] The display device according to the present embodiment may be used as a display unit of a mobile terminal. In this case, the display device may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0044] The electronic device or display device according to this embodiment may be used as a display unit of an imaging device having an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit located within the viewfinder. The imaging device may be a digital camera or a digital video camera.

[0045] 13(a) is a schematic diagram showing an electronic device or an imaging device according to an embodiment. The electronic device or imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may include the electronic components described above. The electronic components may be, for example, a display device, which may display not only the captured image but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the speed at which the subject is moving, the possibility that the subject will be blocked by an obstruction, and the like.

[0046] The electronic device or imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be understood as a photoelectric conversion device. The photoelectric conversion device may include an imaging method that does not involve sequential imaging, but instead detects the difference from the previous image, or cuts out an image from a constantly recorded image, etc.

[0047] FIG. 13(b) is a schematic diagram illustrating an example of an electronic device according to an embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a laptop computer.

[0048] FIG. 14(a) shows an electronic device configured as a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device according to this embodiment may be used for the display unit 1302. The display device 1300 has the frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 14(a). The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0049] FIG. 14(b) is a schematic diagram showing an electronic device or a display device according to one embodiment. The electronic device or display device 1310 of FIG. 14(b) is configured to be bendable, and is configured as a so-called foldable display device. The electronic device or display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may include a light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single, seamless display unit. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may display a single image.

[0050] The electronic device or display device can be applied to a system that can be attached as a wearable device such as smart glasses, HMD, smart contact lenses, etc. The electronic device may have an imaging device that can photoelectrically convert visible light and a display device that can emit visible light.

[0051] 15(a) illustrates glasses 1600 (smart glasses) according to one application example of the electronic device. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a display device serving as the electronic device described above is provided on the back side of the lens 1601.

[0052] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0053] FIG. 15(b) illustrates glasses 1610 (smart glasses) as an example of an application of the electronic device. The glasses 1610 include a control device 1612, which is equipped with an imaging device equivalent to the imaging device 1602 and a display device. A lens 1611 includes an optical system for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the display device and controls the operation of the imaging device and the display device. The control device may also include a gaze detection unit for detecting the wearer's gaze. Infrared light may be used for gaze detection. The infrared light emitter emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit with a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. A reduction unit for reducing light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality.

[0054] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using an image of the eyeball. One example is a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea.

[0055] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0056] A display device according to an embodiment of the present invention may have an imaging device having a light receiving element, and may control the image displayed on the display device based on information about the user's line of sight from the imaging device.

[0057] Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0058] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0059] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI ​​program may be included in the display device, the imaging device, or an external device. If included in an external device, it is transmitted to the display device via communication.

[0060] When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0061] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0062] 100: first structure, 101: first substrate, 102: first electrode, 200: second structure, 201: second substrate, 202: second electrode, 202a: electrode portion, 202b: window portion, 300: bonding member, 301: bonding resin, 302: conductive particles

Claims

1. preparing a first structure having a first electrode disposed on a first main surface of a first substrate; preparing a second structure having a second electrode disposed on a first main surface of a second substrate; a curing step of placing the first main surface of the first substrate and the first main surface of the second substrate opposite each other via a bonding member and curing the bonding member; At least one of the first electrode and the second electrode has a window portion, and in the curing step, the bonding member is cured by irradiating the bonding member with light through the window portion. A method for manufacturing an electronic component comprising the steps of:

2. In the curing process, the first main surface of the first substrate and the first main surface of the second substrate are opposed to each other via the bonding member, and the bonding member is cured while applying force to the first structure and the second structure so that the bonding member is pressurized. The method for manufacturing an electronic component according to claim 1 .

3. The window portion is an opening.

3. The method for manufacturing an electronic component according to claim 1 or 2.

4. a light absorptance of the bonding member is higher than a light absorptance of the first electrode or the second electrode having the window portion; The method for manufacturing an electronic component according to any one of claims 1 to 3.

5. the bonding member includes a first portion disposed in a first region not sandwiched between the first electrode and the second electrode, and a second portion disposed in a second region sandwiched between the first electrode and the second electrode, The curing step comprises: a first curing step of selectively irradiating the first portion with the light to increase the fluidity of the first portion and then curing the first portion; a second curing step of selectively irradiating a portion of the second portion where the window portion is present with the light through the window portion after the first curing step, thereby increasing the fluidity of the second portion and then curing the second portion, The method for manufacturing an electronic component according to any one of claims 1 to 4.

6. the first structure has a plurality of the first electrodes, the plurality of the first electrodes being arranged along a predetermined direction; the second structure has a plurality of the second electrodes, the plurality of the second electrodes being arranged along the predetermined direction; The curing step comprises: a first curing step of irradiating a central portion of the bonding member in the predetermined direction with the light; A second curing step of irradiating the peripheral portion of the bonding member in the predetermined direction with the light after the first curing step. The method for manufacturing an electronic component according to any one of claims 1 to 4.

7. a first structure in which a first electrode is disposed on a first main surface of a first substrate; a second structure in which a second electrode is disposed on a first main surface of a second substrate; a bonding member disposed between the first main surface of the first substrate and the first main surface of the second substrate so as to electrically bond the first electrode and the second electrode, The first electrode has an electrode portion and a window portion that transmits light, In a plan view of the first main surface of the first substrate, an entire periphery of the window portion is surrounded by the electrode portion and is disposed within a region of the second substrate. An electronic component characterized by:

8. The longitudinal direction of the window portion is parallel to the longitudinal direction of the first electrode.

8. The electronic component according to claim 7.

9. A plurality of windows including the window are provided in the first electrode.

8. The electronic component according to claim 7.

10. The plurality of windows are arranged along a longitudinal direction of the first electrode, a distance from an edge of the first electrode in a short side direction to each of the plurality of window portions is greater than an interval between adjacent window portions among the plurality of window portions; 10. The electronic component according to claim 9.

11. A center line along a longitudinal direction of the first electrode is disposed so as to pass through the plurality of window portions.

10. The electronic component according to claim 9.

12. The plurality of windows are arranged in a lattice pattern.

10. The electronic component according to claim 9.

13. The plurality of window portions are arranged along a longitudinal direction of the first electrode, A longitudinal direction of the plurality of windows is parallel to a longitudinal direction of the first electrode.

10. The electronic component according to claim 9.

14. The window portion includes a transparent member disposed in an opening of the first electrode.

8. The electronic component according to claim 7.

15. An electronic device comprising the electronic component according to any one of claims 7 to 14, The electronic component is provided as a display panel.

1. An electronic device comprising:

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