Substrate processing equipment and substrate transportation method

Abstract

To provide substrate processing equipment comprising a transportation mechanism having a plurality of hands supporting substrates, and a substrate transportation method using the transportation mechanism having the plurality of hands.SOLUTION: Substrate processing equipment 100 comprises: a substrate mounting portion 29 which includes a first support unit group having ten first support units, each supporting a single substrate W, and on which a plurality of substrates are mounted; a plurality of processing units 21 which process the substrates; a first transportation mechanism 7 which has five first hands 9 each for supporting a wafer and transports the substrate from a carrier C which houses a plurality of substrates to the substrate mounting portion; and a second transportation mechanism 23 which has two second hands 25 each supporting the substrate and transports substrates from the substrate mounting portion to the plurality of processing units.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a substrate transport method. [Background technology]

[0002] The substrate processing system described in Patent Document 1 includes a first processing unit, a second processing unit, a main transfer device, a first transfer device, and a second transfer device.

[0003] The main carrier has multiple (five) wafer holders for holding wafers. The main carrier can move horizontally and vertically and rotate around a vertical axis, and can simultaneously transport multiple wafers between the cassette and the delivery block using the wafer holders.

[0004] The first transfer device includes one wafer holding part. The first transfer device uses the wafer holding part to take out a wafer from the delivery block and transport it to the first processing unit, and to take out a wafer that has been processed by the first processing unit from the first processing unit and transport it to the delivery block. Therefore, the wafer holding part is shared by both the unprocessed wafer and the processed wafer.

[0005] The second transport device includes one wafer holding unit. The second transport device uses the wafer holding unit to take out a wafer from the delivery block and transport it to the second processing unit, and to take out a wafer that has been processed by the second processing unit from the second processing unit and transport it to the delivery block. Thus, the wafer holding unit is shared by both unprocessed and processed wafers. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-201526 A Summary of the Invention [Problem to be solved by the invention]

[0007] An embodiment of the present invention provides a substrate processing apparatus including a transfer mechanism having a plurality of hands for supporting a substrate, and a method for transferring a substrate by the transfer mechanism having a plurality of hands. [Means for solving the problem]

[0008] One embodiment of the present invention provides a substrate processing apparatus comprising: a first support group having ten first support parts each supporting one substrate, a substrate mounting part on which a plurality of substrates are mounted, a plurality of processing units for processing the substrates, a first transport mechanism having five first hands each supporting one substrate and transporting the substrate from a carrier that accommodates the plurality of substrates to the substrate mounting part, and a second transport mechanism having two second hands each supporting one substrate and transporting the substrate from the substrate mounting part to the plurality of processing units.

[0009] In one embodiment, the first transport mechanism transports the substrate from the carrier, which can accommodate 25 substrates, to the substrate platform.

[0010] In one embodiment, the first transport mechanism further transports the substrate from the substrate platform to the carrier with five of the first hands, and the second transport mechanism further transports the substrate from the processing unit to the substrate platform.

[0011] In one embodiment, the second transport mechanism has a total of four second hands including the two second hands, and the second transport mechanism transports the substrate from the substrate placement part to the processing unit using two of the four second hands, and transports the substrate from the processing unit to the substrate placement part using the remaining two of the four second hands.

[0012] In one embodiment, the substrate mounting section further includes a second support group having ten second supports each supporting one substrate. The first transport mechanism transports the substrate from the carrier to the first support group using five of the first hands, and transports the substrate from the second support group to the carrier using five of the first hands. The second transport mechanism transports the substrate from the first support group to the processing unit using two of the four second hands, and transports the substrate from the processing unit to the second support group using the remaining two of the four second hands.

[0013] In one embodiment, on the substrate mounting part, the first support group is arranged on a lower stage, and the second support group is arranged on an upper stage.

[0014] In one embodiment, four second hands are arranged spaced apart in the vertical direction so that two of the second hands that transport the substrate from the substrate mounting portion to the processing unit are vertically continuous, and two of the second hands that transport the substrate from the processing unit to the substrate mounting portion are vertically continuous.

[0015] In one embodiment, of the four second hands, two second hands that are consecutive in the vertical direction on the lower level transport the substrate from the substrate mounting portion to the processing unit, and two second hands that are consecutive in the vertical direction on the upper level transport the substrate from the processing unit to the substrate mounting portion.

[0016] One embodiment of the present invention provides a substrate transport method for transporting the substrates between a substrate mounting part on which a plurality of substrates are mounted, a carrier that houses the plurality of substrates, and a plurality of processing units that process the substrates, the method including a first support part group having ten first support parts each supporting one substrate, the substrate mounting part including a first support part group having ten first support parts each supporting one substrate, the carrier that houses the plurality of substrates, and a plurality of processing units that process the substrates. The method includes a first step of transporting the substrates from the carrier to the substrate mounting part by a first transport mechanism having five first hands each supporting one substrate, and a second step of transporting the substrates from the substrate mounting part to the processing units by a second transport mechanism having two second hands each supporting one substrate.

[0017] In one embodiment, the second transport mechanism includes a total of four second hands including the two second hands. In the second step, the second transport mechanism transports the substrate from the substrate placement part to the processing unit using two of the four second hands. The method further includes a third step of transporting the substrate from the processing unit to the substrate placement part by the second transport mechanism using the remaining two of the four second hands, and a fourth step of transporting the substrate from the substrate placement part to the carrier by the first transport mechanism using five of the first hands.

[0018] In one embodiment, the substrate placement section further includes a second support group having ten second supports each supporting one substrate. In the first step, the first transport mechanism transports the substrate from the carrier to the first support group with five of the first hands. In the second step, the second transport mechanism transports the substrate from the first support group to the processing unit using two of the four second hands. In the third step, the second transport mechanism transports the substrate from the processing unit to the second support group using the remaining two of the four second hands. In the fourth step, the first transport mechanism transports the substrate from the second support group to the carrier with five of the first hands.

[0019] This specification also discloses a substrate processing apparatus having the following characteristics.

[0020] In one example, the substrate processing apparatus includes a substrate placement part, a plurality of processing units, and a transport mechanism. A plurality of substrates are placed on the substrate placement part. Each of the plurality of processing units processes the substrate. The transport mechanism transports the substrate between the substrate placement part and the processing units. In one transport cycle, the transport mechanism receives N (N is an integer of 2 or more) substrates before processing by the processing units from the substrate placement part, transports the N substrates into N processing units among the plurality of processing units, and transports the N substrates after processing by the N processing units out of the N processing units, and passes the N substrates to the substrate placement part. The transport mechanism includes a plurality of hands. Each of the plurality of hands supports the substrate. The plurality of hands includes a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands arranged between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are arranged consecutively in the up-down direction from the first non-shared hand to the second non-shared hand. In the one transport cycle, the M shared hands support the substrate before processing by the processing unit and the substrate after processing at different times. In the one transport cycle, the first non-shared hand supports only the substrate before processing by the processing unit. In the one transport cycle, the second non-shared hand supports only the substrate after processing by the processing unit. When the transport mechanism has received the N substrates from the substrate placement part, the second non-shared hand is not supporting the substrate, and the M shared hands and the first non-shared hand support the substrates.

[0021] In one example, in the substrate processing apparatus, in one transfer cycle, it is preferable that the M shared hands and the first non-shared hand receive the substrate from the substrate placement part. In one transfer cycle, it is preferable that the second non-shared hand unloads the processed substrate from the processing unit. In one transfer cycle, it is preferable that one of the M shared hands adjacent to the second non-shared hand unloads the substrate before processing into the processing unit from which the second non-shared hand unloaded the substrate. In one transfer cycle, it is preferable that the shared hand adjacent to the second non-shared hand unloads the processed substrate from the processing unit different from the processing unit into which the shared hand unloaded the substrate before processing.

[0022] In one example, in the substrate processing apparatus, the total number of the M shared hands, the first non-shared hand, and the second non-shared hand is preferably N+1, where M=N-1.

[0023] In one example, in the substrate processing apparatus, the total number of the plurality of hands is preferably 2N.

[0024] In one example, in the substrate processing apparatus, it is preferable that N=2.

[0025] In one example, the substrate processing apparatus preferably further includes a controller that controls the transport mechanism. The transport mechanism preferably operates in either a first substrate transport mode or a second substrate transport mode under the control of the controller. The first substrate transport mode is preferably a mode in which the N+1 hands of the 2N hands are used as the M shared hands, the first non-shared hand, and the second non-shared hand. The second substrate transport mode is preferably a mode in which, of the 2N hands, N hands are used to support only the substrate before processing by the processing unit, and the other N hands are used to support only the substrate after processing by the processing unit.

[0026] In one example, in the substrate processing apparatus, the total number of the plurality of hands is preferably N+1.

[0027] This specification also discloses a substrate transport method having the following features.

[0028] In one example, the substrate transport method is performed by a transport mechanism that transports substrates between a substrate placement part on which a plurality of substrates are placed and a plurality of processing units that process the substrates. The substrate transport method includes, in one transport cycle, receiving N (N is an integer of 2 or more) substrates from the substrate placement part before processing by the processing units, transporting the N substrates into N processing units among the plurality of processing units, and transporting the N substrates after processing by the N processing units out of the N processing units, and transferring the N substrates to the substrate placement part. The transport mechanism includes a plurality of hands each supporting the substrate. The plurality of hands includes a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands arranged between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are arranged continuously along the up-down direction from the first non-shared hand to the second non-shared hand. In the process of transferring the N substrates to the substrate mounting section, in one transport cycle, the M shared hands support the substrate before and after processing by the processing unit at different times, in one transport cycle, the first non-shared hand supports only the substrate before processing by the processing unit, in one transport cycle, the second non-shared hand supports only the substrate after processing by the processing unit, and when the transport mechanism receives the N substrates from the substrate mounting section, the second non-shared hand is not supporting the substrate, and the M shared hands and the first non-shared hand support the substrate.

[0029] In one example, in the substrate transport method, in the step of transferring the N substrates to the substrate mounting section, in one transport cycle, the M shared hands and the first non-shared hand receive the substrates from the substrate mounting section, in one transport cycle, the second non-shared hand transports the processed substrate from the processing unit, in one transport cycle, a shared hand among the M shared hands adjacent to the second non-shared hand transports the processed substrate to the processing unit from which the second non-shared hand transports the substrate, and in one transport cycle, the shared hand adjacent to the second non-shared hand transports the processed substrate from the processing unit different from the processing unit to which the unprocessed substrate was transported by the shared hand.

[0030] In one example, in the substrate transport method, the total number of the M shared hands, the first unshared hand, and the second unshared hand is preferably N+1, where M=N-1.

[0031] In one example, in the substrate transport method, the total number of the plurality of hands is preferably 2N.

[0032] In one example, in the substrate transport method, it is preferable that N=2.

[0033] In one example, in the substrate transport method, the transport mechanism preferably operates in either a first substrate transport mode or a second substrate transport mode. The first substrate transport mode is preferably a mode in which the N+1 hands of the 2N hands are used as the M shared hands, the first non-shared hand, and the second non-shared hand. The second substrate transport mode is preferably a mode in which N hands of the 2N hands are used to support only the substrate before processing by the processing unit, and the other N hands are used to support only the substrate after processing by the processing unit.

[0034] In one example, in the substrate transport method, the total number of the plurality of hands is preferably N+1. [Brief description of the drawings]

[0035] [Figure 1] 1 is a plan view showing an inside of a substrate processing apparatus according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] 1 is a side view showing a substrate processing apparatus according to an embodiment of the present invention; [Diagram 5] FIG. 2 is a side view showing the inside of the processing unit according to the embodiment. [Figure 6] 2 is a side view showing a first transport mechanism, a substrate placement unit, and a second transport mechanism of the substrate processing apparatus according to the present embodiment. FIG. [Figure 7] 5 is a diagram showing an example of an overall flow of a first substrate transfer method executed by the substrate processing apparatus according to the present embodiment. FIG. [Figure 8] 5 is a flowchart showing the first stage of a first substrate transfer method executed by the substrate processing apparatus according to the present embodiment. [Figure 9] 10 is a flowchart showing a latter stage of the first substrate transfer method executed by the substrate processing apparatus according to the present embodiment. [Figure 10] 5 is a diagram showing an example of an overall flow of a second substrate transfer method executed by the substrate processing apparatus according to the present embodiment. FIG. [Figure 11] 10 is a flowchart showing the first stage of a second substrate transfer method executed by the substrate processing apparatus according to the present embodiment. [Figure 12] 10 is a flowchart showing a latter stage of a second substrate transfer method executed by the substrate processing apparatus according to the present embodiment. [Figure 13] FIG. 2 is a diagram for generalizing and explaining a first substrate transfer method executed by the substrate processing apparatus according to the present embodiment. [Figure 14]This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has 2N second hands. [Figure 15] This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has N+1 second hands and N is an odd number. [Figure 16] This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method when the second transport mechanism of this embodiment has N+1 second hands and N is an even number. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference symbols, and the description will not be repeated. In addition, for convenience of explanation, a three-dimensional orthogonal coordinate system (X, Y, Z) is appropriately depicted in the drawings. In the drawings, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. In addition, in the description of the embodiment, a first direction DX, a second direction DY, and a third direction DZ are appropriately used. The first direction DX, the second direction DY, and the third direction DZ are mutually orthogonal. As an example, the first direction DX and the second direction DY are approximately parallel to the horizontal direction, and the third direction DZ is approximately parallel to the vertical direction. For convenience of explanation, the third direction DZ may be described as the "up-down direction DZ".

[0037] First, a substrate processing apparatus 100 according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a plan view showing the inside of the substrate processing apparatus 100 according to this embodiment. In this embodiment, an intake system and an exhaust system are omitted to simplify the drawings and description.

[0038] 1 processes a substrate W. The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0039] The substrate processing apparatus 100 includes an indexer unit 1 and a processing unit 20. The processing unit 20 is disposed adjacent to the indexer unit 1. The indexer unit 1 supplies a substrate W to the processing unit 20. The processing unit 20 processes the substrate W. The indexer unit 1 recovers the substrate W from the processing unit 20.

[0040] The indexer section 1 includes a plurality of carrier placement parts 3 (for example, four carrier placement parts 3). The plurality of carrier placement parts 3 are arranged along the first direction DX. A plurality of carriers C are placed on each of the plurality of carrier placement parts 3. Each of the plurality of carriers C accommodates a plurality of substrates W. In the present embodiment, as an example, each of the plurality of carriers C accommodates 25 substrates W. The carriers C are, for example, front opening unified pods (FOUPs).

[0041] The indexer unit 1 includes a first transfer chamber 5. The first transfer chamber 5 is located between the plurality of carrier placement units 3 and the processing unit 20.

[0042] The indexer unit 1 includes at least one first transport mechanism 7. In the present embodiment, as an example, the indexer unit 1 includes one first transport mechanism 7. The first transport mechanism 7 is disposed in the first transport chamber 5. The first transport mechanism 7 transports the substrate W. Specifically, the first transport mechanism 7 transports the substrate W between each carrier C and the processing unit 20.

[0043] The first transport mechanism 7 includes a plurality of first hands 9 and a first hand driving unit 11. Note that only one first hand 9 is shown in FIG. 1, and illustration of the other first hands 9 is omitted for simplicity. Each first hand 9 supports one substrate W. In this embodiment, each first hand 9 supports one substrate W in a horizontal position. The first hand driving unit 11 is connected to each first hand 9. The first hand driving unit 11 moves each first hand 9. The first hand driving unit 11 includes a plurality of electric motors.

[0044] Next, the first hands 9 and the first hand driving unit 11 will be described with reference to Figures 1 and 2. Figure 2 is a cross-sectional view taken along line II-II in Figure 1.

[0045] As shown in FIG. 2, the multiple first hands 9 are arranged along the vertical direction DZ. In this embodiment, as an example, the first transport mechanism 7 includes five first hands 9. In practice, as described later, the multiple first hands 9 are arranged at intervals in the vertical direction DZ. The first hand driving unit 11 moves the multiple first hands 9 while maintaining the intervals between the multiple first hands 9 in the vertical direction DZ. Each first hand 9 receives an unprocessed substrate W from the carrier C and transports the unprocessed substrate W to the processing unit 20 (first step). In addition, each first hand 9 receives a processed substrate W that has been processed by the processing unit 20 from the processing unit 20 and transports it to the carrier C (fourth step).

[0046] As shown in FIGS. 1 and 2, the first hand driving unit 11 includes a rail 11a, a horizontal moving unit 11b, a vertical moving unit 11c, a rotating unit 11d, a rotating shaft 11e, and a forward / backward moving unit 11f.

[0047] The rail 11a is disposed at the bottom of the first transfer chamber 5. The rail 11a extends along a first direction DX. The horizontal moving part 11b is supported by the rail 11a. The horizontal moving part 11b moves in the first direction DX along the rail 11a. The vertical moving part 11c is supported by the horizontal moving part 11b. The vertical moving part 11c moves in the up-down direction DZ relative to the horizontal moving part 11b.

[0048] The swivel unit 11d is supported by the vertical moving unit 11c. The swivel unit 11d swivels with respect to the vertical moving unit 11c. The swivel unit 11d swivels about a swivel axis A1 when the swivel shaft 11e is driven. The swivel axis A1 is an imaginary line extending along the vertical direction DZ.

[0049] The advancing / retreating unit 11f reciprocates in one horizontal direction determined by the orientation of the swivel unit 11d. The advancing / retreating unit 11f is connected to each first hand 9. The advancing / retreating unit 11f then reciprocates each first hand 9 individually in one horizontal direction determined by the orientation of the swivel unit 11d. The advancing / retreating unit 11f is connected to each first hand 9.

[0050] As described above with reference to Figs. 1 and 2, the first transport mechanism 7 includes a first hand driving unit 11. Therefore, each first hand 9 is capable of translation along the vertical direction DZ. In this case, the first hand driving unit 11 moves the plurality of first hands 9 as a whole along the vertical direction DZ. Also, each first hand 9 is capable of rotating about the rotation axis A1. In this case, the first hand driving unit 11 rotates, for example, the plurality of first hands 9 as a whole. And each first hand 9 is capable of translation in any horizontal direction.

[0051] Next, the processing section 20 will be described with reference to Figures 1 to 4. Figure 3 is a cross-sectional view taken along line III-III in Figure 1. Figure 4 is a side view showing the substrate processing apparatus 100.

[0052] 1, 3, and 4, the processing section 20 includes a plurality of processing units 21. Each of the plurality of processing units 21 processes a substrate W one by one. For example, each processing unit 21 processes the substrate W with a processing liquid (e.g., a chemical liquid). In the present embodiment, as an example, the processing section 20 includes 24 processing units 21.

[0053] Specifically, the processing section 20 has a plurality of processing towers TW. As an example, each processing tower TW is composed of K processing units 21 arranged along the vertical direction DZ. In this embodiment, K is an integer equal to or greater than 2. In each processing tower TW, K / 2 processing units 21 are arranged on a lower level LW, and K / 2 processing units 21 are arranged on an upper level UP.

[0054] In this embodiment, as an example, K=6, and one processing tower TW is configured by six processing units 21. The processing unit 20 has four processing towers TW. The four processing towers TW may be referred to as processing towers TW1, TW2, TW3, and TW4, respectively.

[0055] The processing towers TW1 and TW2 are disposed along the second direction DY. The processing towers TW3 and TW4 are disposed along the second direction DY. The processing towers TW1 and TW2 and the processing towers TW3 and TW4 face each other in the first direction DX with the second transfer chamber 31 in between.

[0056] 1 and 2, the processing section 20 further includes a plurality of substrate mounting parts 29. In this embodiment, as an example, the processing section 20 includes two substrate mounting parts 29. A plurality of substrates W can be mounted on each substrate mounting part 29. In this embodiment, as an example, 20 substrates W can be mounted on each substrate mounting part 29. Each substrate mounting part 29 is adjacent to the first transfer chamber 5.

[0057] Hereinafter, of the two substrate mounting portions 29, the substrate mounting portion 29 located on the lower level LW may be referred to as "substrate mounting portion 29L," and the substrate mounting portion 29 located on the upper level UP may be referred to as "substrate mounting portion 29U."

[0058] The substrate placement part 29L is disposed in the second transfer chamber 31 of the lower level LW. The substrate placement part 29U is disposed in the second transfer chamber 31 of the upper level UP. The substrate placement part 29L and the substrate placement part 29U are disposed in a straight line along the vertical direction DZ.

[0059] 2, the processing section 20 further includes a plurality of second transport mechanisms 23 and a plurality of second transport chambers 31. In the present embodiment, as an example, the processing section 20 includes two second transport mechanisms 23 and two second transport chambers 31. The second transport mechanism 23 corresponds to an example of a "transport mechanism."

[0060] The two second transfer chambers 31 are arranged along the vertical direction DZ. Each of the second transfer chambers 31 extends along the second direction DY. Each of the second transfer chambers 31 is connected to the first transfer chamber 5.

[0061] Each second transport mechanism 23 transports a substrate W. Specifically, the second transport mechanism 23 transports the substrate W between the substrate mounting portion 29 and the processing unit 21. Hereinafter, of the two second transport mechanisms 23, the second transport mechanism 23 located on the lower tier LW may be referred to as the "second transport mechanism 23L," and the second transport mechanism 23 located on the upper tier UP may be referred to as the "second transport mechanism 23U."

[0062] The second transport mechanism 23L is disposed in the second transport chamber 31 of the lower stage LW. The second transport mechanism 23U is disposed in the second transport chamber 31 of the upper stage UP.

[0063] 1 to 3, each second transport mechanism 23 includes a plurality of second hands 25 and a second hand driving unit 17. In the present embodiment, as an example, each second transport mechanism 23 includes four second hands 25. The second hands 25 correspond to an example of a "hand".

[0064] Each second hand 25 supports one substrate W. In this embodiment, each second hand 25 supports one substrate W in a horizontal position. A second hand driving unit 17 is connected to each second hand 25. The second hand driving unit 17 moves each second hand 25. The second hand driving unit 17 includes a plurality of electric motors.

[0065] Specifically, in each second transport mechanism 23, the multiple second hands 25 are arranged along the vertical direction DZ. In practice, as described later, in each second transport mechanism 23, the multiple second hands 25 are arranged at intervals in the vertical direction DZ. Then, the second hand driving unit 17 moves the multiple second hands 25 while maintaining the intervals between the multiple second hands 25 in the vertical direction DZ. For example, the second hand 25 receives an unprocessed substrate W from the substrate placement unit 29 and transports the unprocessed substrate W to the processing unit 21. For example, the second hand 25 receives a processed substrate W that has been processed by the processing unit 21 from the processing unit 21 and passes it to the substrate placement unit 29.

[0066] The second hand driving unit 17 includes two support columns 27a, a vertical moving unit 27b, a horizontal moving unit 27c, a rotating unit 27d, a rotating shaft 27e, and a forward / backward moving unit 27f.

[0067] The two pillars 27a are disposed in the second transfer chamber 31. Specifically, the two pillars 27a are disposed on the inner surface of the second transfer chamber 31. The two pillars 27a are disposed at an interval in the second direction DY. Each pillar 27a extends along the up-down direction DZ. The vertical moving part 27b is supported by the two pillars 27a. The vertical moving part 27b extends along the second direction DY across the two pillars 27a. The vertical moving part 27b moves in the up-down direction DZ along the two pillars 27a. The horizontal moving part 27c is supported by the vertical moving part 27b. The horizontal moving part 27c moves in the second direction DY between the two pillars 27a along the vertical moving part 27b.

[0068] The swivel unit 27d is supported by the horizontal moving unit 27c. The swivel unit 27d swivels with respect to the horizontal moving unit 27c. The swivel unit 27d swivels about a swivel axis A2 as the swivel shaft 27e is driven. The swivel axis A2 is an imaginary line extending along the vertical direction DZ.

[0069] The advancing and retreating portion 27f moves relative to the swivel portion 27d. The advancing and retreating portion 27f moves back and forth in one horizontal direction determined by the orientation of the swivel portion 27d. The advancing and retreating portion 27f is connected to each second hand 25.

[0070] As described above with reference to Figs. 1 to 3, each second transport mechanism 23 includes a second hand driving unit 17. Therefore, each second hand 25 is capable of translation along the vertical direction DZ. In this case, the second hand driving unit 17 moves the entire plurality of second hands 25 along the vertical direction DZ. Also, each second hand 25 is capable of rotating about the rotation axis A2. In this case, the second hand driving unit 17 rotates, for example, the entire plurality of second hands 25. Also, each second hand 25 is capable of translation in any horizontal direction.

[0071] 1, the substrate processing apparatus 100 further includes a control unit 200. The control unit 200 controls each component of the substrate processing apparatus 100. Specifically, the control unit 200 controls the first transport mechanism 7, the second transport mechanism 23, and the processing unit 21.

[0072] The control unit 200 is, for example, a computer. Specifically, the control unit 200 includes a processor and a storage device. The processor includes, for example, a CPU (Central Processing Unit). The storage device stores data and computer programs. The storage device includes, for example, a main storage device such as a semiconductor memory, and an auxiliary storage device such as a semiconductor memory, a solid-state drive, and / or a hard disk drive. The storage device may include a removable medium. The storage device corresponds to an example of a non-transitory computer-readable storage medium.

[0073] Specifically, the processor of the control unit 200 controls the first transport mechanism 7, the second transport mechanism 23, and the processing unit 21 by executing a computer program stored in the storage device.

[0074] Continuing to refer to FIG. 1 and FIG. 2, the overall flow when the first transport mechanism 7 and the second transport mechanism 23 transport the substrate W will be described.

[0075] The first hand 9 of the first transport mechanism 7 receives the plurality of unprocessed substrates W from the carrier C, and delivers the plurality of unprocessed substrates W to the substrate mounting part 29L or the substrate mounting part 29U. As a result, the plurality of unprocessed substrates W are mounted on the substrate mounting part 29L or the substrate mounting part 29U. In this embodiment, the "unprocessed substrate" refers to a substrate W that has not been processed by the processing unit 21, that is, a substrate W that has not been processed by the processing unit 21.

[0076] The second hand 25 of the second transport mechanism 23L receives the unprocessed substrates W from the substrate mounting part 29L, and carries the unprocessed substrates W one by one into each processing unit 21 of the lower tier LW. Then, each processing unit 21 of the lower tier LW processes the unprocessed substrates W.

[0077] Furthermore, the second hand 25 of the second transport mechanism 23L carries out the processed substrates W from each processing unit 21 in the lower tier LW, and transfers the processed substrates W to the substrate mounting part 29L. As a result, the processed substrates W are mounted on the substrate mounting part 29L.

[0078] Meanwhile, the second hand 25 of the second transport mechanism 23U receives the unprocessed substrates W from the substrate mounting part 29U, and carries the unprocessed substrates W one by one into each processing unit 21 of the upper stage UP. Then, each processing unit 21 of the upper stage UP processes the unprocessed substrates W.

[0079] Further, the second hand 25 of the second transport mechanism 23U carries out the processed substrates W from each processing unit 21 of the upper stage UP, and transfers the processed substrates W to the substrate mounting part 29U. As a result, the processed substrates W are mounted on the substrate mounting part 29U.

[0080] The first hand 9 of the first transport mechanism 7 receives the plurality of processed substrates W from the substrate placement part 29L or the substrate placement part 29U, and transfers the plurality of processed substrates W to the carrier C. As a result, the carrier C contains the plurality of processed substrates W.

[0081] Next, the processing unit 21 will be described with reference to FIG. 5. FIG. 5 is a side view showing the inside of the processing unit 21. As shown in FIG. 5, the processing unit 21 includes a processing housing 41, a substrate holding unit 43, a rotation drive unit 45, a first nozzle 47, a first nozzle moving unit 47a, a second nozzle 49, a second nozzle moving unit 49a, a third nozzle 51, a third nozzle moving unit 51a, a fourth nozzle 53, a fourth nozzle moving unit 53a, and a cup 55. The substrate processing apparatus 100 further includes a first processing liquid supply pipe 473, a second processing liquid supply pipe 493, a third processing liquid supply pipe 513, and a rinsing liquid supply pipe 533.

[0082] The processing housing 41 has a box shape. The processing housing 41 accommodates the substrate holder 43, the rotation drive unit 45, the first nozzle 47, the first nozzle movement unit 47a, the second nozzle 49, the second nozzle movement unit 49a, the third nozzle 51, the third nozzle movement unit 51a, the fourth nozzle 53, the fourth nozzle movement unit 53a, and the cup 55. The processing housing 41 also accommodates a part of the first processing liquid supply pipe 473, a part of the second processing liquid supply pipe 493, a part of the third processing liquid supply pipe 513, and a part of the rinsing liquid supply pipe 533. The substrate W carried into the processing unit 21 by the second transport mechanism 23 is accommodated inside the processing housing 41.

[0083] The substrate holding part 43 holds the substrate W horizontally. The substrate holding part 43 is, for example, a vacuum type spin chuck. Note that the method by which the substrate holding part 43 holds the substrate W is not limited to the vacuum type. The method by which the substrate holding part 43 holds the substrate W may be, for example, a clamping type or a Bernoulli type.

[0084] The rotation drive unit 45 rotates the substrate holding unit 43 about the rotation axis A3. As a result, the substrate W and the substrate holding unit 43 rotate together about the rotation axis A3. The rotation axis A3 is an imaginary line extending along the vertical direction DZ. The rotation drive unit 45 includes, for example, an electric motor.

[0085] The first nozzle 47 supplies a first processing liquid to the substrate W from above the substrate W. More specifically, the first nozzle 47 ejects the first processing liquid toward the substrate W while it is rotating. The first nozzle moving unit 47a moves the first nozzle 47 between a processing position and a retracted position. When the first nozzle 47 moves to the processing position, it faces the substrate W in a planar view. When the first nozzle 47 moves to the retracted position, it does not face the substrate W in a planar view. More specifically, when the first nozzle 47 moves to the retracted position, it retracts to the periphery of the substrate W in a planar view.

[0086] Specifically, the first nozzle moving unit 47a has a first nozzle arm 471 and a first nozzle driving unit 472. The first nozzle arm 471 extends along a substantially horizontal direction. The first nozzle 47 is disposed at the tip of the first nozzle arm 471. The first nozzle driving unit 472 rotates the first nozzle arm 471 along a substantially horizontal plane about a rotation axis extending along the vertical direction DZ. As a result, the first nozzle 47 moves in the circumferential direction about the rotation axis extending in the vertical direction DZ. The first nozzle driving unit 472 includes an electric motor capable of forward and reverse rotation.

[0087] The first processing liquid supply pipe 473 supplies the first processing liquid to the first nozzle 47. The first processing liquid supply pipe 473 is a tubular member through which the first processing liquid flows. In this embodiment, the first processing liquid is an acidic liquid. For example, the first processing liquid is hydrofluoric acid (hydrofluoric acid), a mixture of sulfuric acid and hydrogen peroxide (SPM), sulfuric acid, sulfuric acid-hydrogen peroxide, hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid), or hydrochloric acid.

[0088] The second nozzle 49 supplies the second processing liquid to the substrate W from above the substrate W. More specifically, the second nozzle 49 ejects the second processing liquid toward the substrate W during rotation. The second nozzle moving unit 49a moves the second nozzle 49 between the processing position and the retreat position in the same manner as the first nozzle moving unit 47a. More specifically, the second nozzle moving unit 49a has a second nozzle arm 491 and a second nozzle driving unit 492 in the same manner as the first nozzle moving unit 47a. The configurations of the second nozzle arm 491 and the second nozzle driving unit 492 are similar to those of the first nozzle arm 471 and the first nozzle driving unit 472, and therefore will not be described.

[0089] The second processing liquid supply pipe 493 supplies the second processing liquid to the second nozzle 49. The second processing liquid supply pipe 493 is a tubular member through which the second processing liquid flows. In this embodiment, the second processing liquid is an alkaline liquid. For example, the second processing liquid is an ammonia hydrogen peroxide solution (SC1), an ammonia water, an ammonium fluoride solution, or a tetramethylammonium hydroxide (TMAH).

[0090] The third nozzle 51 supplies the third processing liquid to the substrate W from above the substrate W. More specifically, the third nozzle 51 ejects the third processing liquid toward the substrate W during rotation. The third nozzle moving unit 51a moves the third nozzle 51 between the processing position and the retracted position in the same manner as the first nozzle moving unit 47a. More specifically, the third nozzle moving unit 51a has a third nozzle arm 511 and a third nozzle driving unit 512 in the same manner as the first nozzle moving unit 47a. The configurations of the third nozzle arm 511 and the third nozzle driving unit 512 are similar to those of the first nozzle arm 471 and the first nozzle driving unit 472, and therefore will not be described.

[0091] The third treatment liquid supply pipe 513 supplies the third treatment liquid to the third nozzle 51. The third treatment liquid supply pipe 513 is a tubular member through which the third treatment liquid flows. In this embodiment, the third treatment liquid is an organic solvent. For example, the third treatment liquid is isopropyl alcohol (IPA), methanol, ethanol, hydrofluoroether (HFE), or acetone.

[0092] The fourth nozzle 53 supplies the rinsing liquid to the substrate W from above the substrate W. More specifically, the fourth nozzle 53 ejects the rinsing liquid toward the substrate W during rotation. The fourth nozzle moving unit 53a moves the fourth nozzle 53 between the processing position and the retreat position in the same manner as the first nozzle moving unit 47a. More specifically, the fourth nozzle moving unit 53a has a fourth nozzle arm 531 and a fourth nozzle driving unit 532 in the same manner as the first nozzle moving unit 47a. The configurations of the fourth nozzle arm 531 and the fourth nozzle driving unit 532 are similar to those of the first nozzle arm 471 and the first nozzle driving unit 472, and therefore will not be described.

[0093] The rinse liquid supply pipe 533 supplies the rinse liquid to the fourth nozzle 53. The rinse liquid supply pipe 533 is a tubular member through which the rinse liquid flows. For example, the rinse liquid is pure water, carbonated water, electrolytic ion water, hydrogen water, ozone water, or diluted hydrochloric acid water.

[0094] The cup 55 is disposed around the substrate holding part 43. The cup 55 surrounds the sides of the substrate W held by the substrate holding part 43. The cup 55 receives the first to third processing liquids and the rinsing liquid splashed from the substrate W during rotation.

[0095] Next, the first transport mechanism 7, the second transport mechanisms 23L, 23U, and the substrate placement parts 29L, 29U will be described with reference to FIG.

[0096] FIG. 6 is a side view showing the first transport mechanism 7, the second transport mechanisms 23L and 23U, and the substrate placement parts 29L and 29U.

[0097] 6, the first transport mechanism 7 includes P first hands 9. In this specification, unless otherwise specified, P is an integer of 2 or more and indicates the total number of first hands 9. As a preferred example, the P first hands 9 are disposed at equal intervals d along the vertical direction DZ.

[0098] Each first hand 9 supports an unprocessed substrate W or a processed substrate W. Each first hand 9 supports one substrate W at a time.

[0099] In the present embodiment, as an example, P=5, and the first transport mechanism 7 includes five first hands 9.

[0100] Each of the second transport mechanism 23L and the second transport mechanism 23U includes Q second hands 25. Unless otherwise specified in this specification, Q is an integer equal to or greater than 3 and indicates the total number of second hands 25 in each of the second transport mechanism 23L and the second transport mechanism 23U. As a preferred example, the Q second hands 25 are disposed at equal intervals d along the vertical direction DZ. In other words, the interval in the vertical direction DZ between two second hands 25 adjacent to each other in the vertical direction DZ is the interval d. Each second hand 25 supports one substrate W at a time.

[0101] For example, some of the Q second hands 25 may be used both for supporting the substrate W before processing and for supporting the substrate W after processing.

[0102] For example, some of the Q second hands 25 may support only unprocessed substrates W, and other of the second hands 25 may support only processed substrates W.

[0103] In the present embodiment, as an example, Q=4, and each of the second transport mechanism 23L and the second transport mechanism 23U includes four second hands 25.

[0104] Hereinafter, in each of the second transport mechanisms 23L and 23U, the four second hands 25 will be referred to as second hand HA, second hand HB, second hand HC, and second hand HD, in that order from bottom to top.

[0105] Each of the substrate placement portion 29L and the substrate placement portion 29U includes R support portions 291. Unless otherwise specified in this specification, R is an integer of 2 or more and indicates the total number of support portions 291 in each of the substrate placement portion 29L and the substrate placement portion 29U. R is, for example, an even number of 2 or more. The R support portions 291 are arranged at intervals along the vertical direction DZ. As a preferred example, the R support portions 291 are arranged at equal intervals d along the vertical direction DZ. That is, the interval in the vertical direction DZ between two support portions 291 adjacent to each other in the vertical direction DZ is the interval d. Each support portion 291 supports one substrate W. Specifically, each support portion 291 supports one substrate W in a horizontal position.

[0106] As a preferred example, the interval d between the support portions 291, the interval d between the first hands 9, and the interval d between the second hands 25 are substantially equal.

[0107] In this embodiment, as an example, in each of the substrate mounting portions 29L and 29U, R / 2 support portions 291 in the lower tier 291A support the substrate W before processing, and R / 2 support portions 291 in the upper tier 291B support the substrate W after processing.

[0108] In this embodiment, as an example, R=20, and each of the substrate placement portion 29L and the substrate placement portion 29U has 20 supports 291. Therefore, the R / 2 supports 291 in the lower stage 291A correspond to 10 first supports, which constitute a first support group. Also, the R / 2 supports 291 in the upper stage 291B correspond to 10 second supports, which constitute a second support group.

[0109] The intervals between the first hands 9 are not particularly limited, and may not be equal intervals or may be partially equal intervals, for example. The intervals between the second hands 25 are not particularly limited, and may not be equal intervals or may be partially equal intervals, for example. Furthermore, the intervals between the support parts 291 are not particularly limited, and may not be equal intervals or may be partially equal intervals, for example. Furthermore, the intervals between the support parts 291 adjacent to each other, the intervals between the first hands 9 adjacent to each other, and the intervals between the second hands 25 adjacent to each other do not have to be equal.

[0110] Next, an example of a first substrate transport method according to this embodiment will be described with reference to Fig. 7. In the description of Fig. 7, when it is not necessary to specify a specific substrate W, it will simply be referred to as a "substrate".

[0111] The first substrate transport method is performed by the second transport mechanism 23 which transports substrates between the substrate mounting portion 29 and the processing unit 21. In the first substrate transport method, M second hands 25 are shared for both unprocessed substrates and processed substrates to transport a plurality of substrates. In this specification, unless otherwise specified, M is an integer equal to or greater than 1. The first substrate transport method corresponds to one example of a "substrate transport method".

[0112] Fig. 7 is a diagram showing an example of an overall flow of the first substrate transport method. For ease of explanation, Fig. 7 focuses on the substrate placement part 29L arranged in the lower stage LW, the second transport mechanism 23L arranged in the lower stage LW, and the processing units 21A and 21B among the multiple processing units 21 arranged in the lower stage LW. The processing unit 21A and the processing unit 21B are arranged in different positions. In addition, an unprocessed substrate is placed on the lower stage 291A of the substrate placement part 29L, and a processed substrate is placed on the upper stage 291B of the substrate placement part 29L.

[0113] In addition, in the description of the first substrate transfer method, the second hand HA may be described as a “first non-shared hand HA,” the second hand HB may be described as a “shared hand HB,” and the second hand HC may be described as a “second non-shared hand HC.” In the exemplary first substrate transfer method shown in FIG. 7, the second hand HD is not used.

[0114] Furthermore, in the following description, a transport cycle CY refers to the operations from when the second transport mechanism 23 receives an unprocessed substrate from the substrate mounting portion 29, to when the second transport mechanism 23 transports the unprocessed substrate into the processing unit 21, and when the second transport mechanism 23 transports the processed substrate out of the processing unit 21, until when the second transport mechanism 23 places the processed substrate on the substrate mounting portion 29.

[0115] As shown in FIG. 7, as an example, at a certain point in time, ten unprocessed substrates W1 to W10 are placed along the vertical direction DZ on the lower tier 291A of the substrate mounting portion 29L, and no substrates are placed on the upper tier 291B of the substrate mounting portion 29L.

[0116] In the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L transports two unprocessed substrates W1, W2 into the two processing units 21A, 21B, and transports two processed substrates WX1, WX2 out of the two processing units 21A, 21B. The transport cycle CY is repeatedly executed.

[0117] Specifically, in the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L receives two substrates W1, W2 before processing by the processing units 21A, 21B from the substrate mounting portion 29L, transports the two substrates W1, W2 into two processing units 21A, 21B of the multiple processing units 21, and transports the two substrates WX1, WX2 after processing by the two processing units 21A, 21B out of the two processing units 21A, 21B, and passes the two substrates WX1, WX2 to the substrate mounting portion 29L.

[0118] More specifically, the four second hands HA-HD include a first unshared hand HA, a shared hand HB, and a second unshared hand HC. The shared hand HB is disposed between the first unshared hand HA and the second unshared hand HC. The shared hand HB is adjacent to the second unshared hand HC in a first specific direction SD1. The first unshared hand HA is adjacent to the shared hand HB in the first specific direction SD1.

[0119] The first specific direction SD1 indicates the direction from the second unshared hand HC to the first unshared hand HA. On the other hand, the second specific direction SD2 is the opposite direction to the first specific direction SD1 and indicates the direction from the first unshared hand HA to the second unshared hand HC. The first specific direction SD1 and the second specific direction SD2 are approximately parallel to the up-down direction DZ. For example, the first specific direction SD1 indicates the downward direction, and the second specific direction SD2 indicates the upward direction.

[0120] The first unshared hand HA, the shared hand HB, and the second unshared hand HC are arranged consecutively along the vertical direction DZ from the first unshared hand HA to the second unshared hand HC.

[0121] In one transport cycle CY, the first non-shared hand HA supports only the substrate W1 before processing by the processing unit 21B. In one transport cycle CY, the shared hand HB supports the substrate W2 before processing by the processing unit 21A and the substrate WX1 after processing by the processing unit 21B at different times. In one transport cycle CY, the second non-shared hand HC supports only the substrate WX2 after processing by the processing unit 21A.

[0122] Still referring to FIG. 7, the states ST1 to ST4 of the second transport mechanism 23L in one transport cycle CY will be described.

[0123] In a state ST1 in which the second transport mechanism 23L receives the two substrates W1, W2 from the substrate mounting part 29L, the second non-shared hand HC is not supporting the substrate W, and the shared hand HB and the first non-shared hand HA support the substrates W1, W2. In the first substrate transport method, the second hand HD is not used.

[0124] The state ST2 next to state ST1 shows the state of the second transport mechanism 23L when the processed substrate WX2 is transported out of the processing unit 21A by the second non-shared hand HC not supporting a substrate, and the unprocessed substrate W2 is transported into the same processing unit 21A by the shared hand HB.

[0125] The state ST3 next to state ST2 shows the state of the second transport mechanism 23L when the processed substrate WX1 is transported out of the processing unit 21B by the shared hand HB that is not supporting a substrate in state ST2, and the unprocessed substrate W1 is transported into the same processing unit 21B by the first non-shared hand HA.

[0126] The state ST4 next to state ST3 shows the state of the second transport mechanism 23L when the processed substrate WX1 is supported by the shared hand HB, the processed substrate WX2 is supported by the second non-shared hand HC, and no substrate is supported by the first non-shared hand HA.

[0127] As described above with reference to FIG. 7, according to this embodiment, the second transport mechanism 23L of the substrate processing apparatus 100 includes the first unshared hand HA, the shared hand HB, and the second unshared hand HC, which are arranged successively in the vertical direction DZ. Therefore, when carrying out and loading the substrates W1, W2, WX1, and WX2 into and out of the processing units 21A and 21B, the moving distances of the first unshared hand HA to the second unshared hand HC (specifically, the second hands HA to HD) in the vertical direction DZ can be shortened compared to a case where a hand is not shared between the substrate before processing and the substrate after processing. As a result, the throughput of the transport operation of the substrates W1, W2, WX1, and WX2 by the second transport mechanism 23L can be improved. Details of this point will be described with specific examples with reference to FIG. 8, FIG. 9, FIG. 11, and FIG. 12.

[0128] Next, an example of the first substrate transport method will be described in detail with reference to Figures 8 and 9. In the following description, when the first unshared hand HA, the shared hand HB, the second unshared hand HC, and the second hand HD are referred to as a whole, they may be referred to as the second hands HA-HD to avoid redundancy. Also, when it is not necessary to indicate a specific substrate W, they will be simply referred to as "substrate".

[0129] Figures 8 and 9 are flow charts showing an example of the first substrate transfer method. As shown in Figures 8 and 9, the first substrate transfer method includes steps S1 to S12 in one transfer cycle CY. In the first substrate transfer method, the second hand HD is not used. In steps S1 to S12, the second hands HA to HD are moved by the second hand driving unit 17 under the control of the control unit 200.

[0130] 8, in step S1, the first non-shared hand HA supports an unprocessed substrate W1, and the shared hand HB supports an unprocessed substrate W2. Meanwhile, the second non-shared hand HC does not support any substrate. The second non-shared hand HC faces the transfer opening 41a of the processing unit 21A. Then, the second non-shared hand HC starts to move toward the processed substrate WX2 located inside the processing unit 21A.

[0131] The state of the second hands HA-HD in step S1 indicates a state ST1 in which the second hands HA-HD have moved to the position of the processing unit 21A. During processing of the substrate WX2, the transfer opening 41a is closed by a shielding member (not shown).

[0132] Next, in step S2, the second unshared hand HC carries the processed substrate WX2 out of the processing unit 21A through the transfer opening 41a.

[0133] Next, in step S3, the second unshared hand HC returns to the position before it moved, and the second hands HA to HD start moving in the second specific direction SD2.

[0134] Next, in step S4, the second hands HA-HD move a distance d in the second specific direction SD2 and stop. The distance d is approximately equal to the distance d between the second non-shared hand HC and the shared hand HB in the up-down direction DZ (FIG. 6). As a result, the shared hand HB faces the transfer opening 41a of the processing unit 21A. Then, the shared hand HB starts moving toward the inside of the processing unit 21A.

[0135] Next, in step S5, the shared hand HB carries the unprocessed substrate W2 into the processing unit 21A through the transfer opening 41a.

[0136] Next, in step S6, the shared hand HB returns to the position before it moved, and the second hands HA to HD start moving toward the next processing unit 21B (FIG. 9).

[0137] 9, in step S7, the first non-shared hand HA supports the unprocessed substrate W1, and the second non-shared hand HC supports the processed substrate WX2. Meanwhile, the shared hand HB does not support any substrate. The shared hand HB faces the transfer opening 41a of the processing unit 21B. Then, the shared hand HB starts to move toward the processed substrate WX1 located inside the processing unit 21B.

[0138] The state of the second hands HA-HD in step S7 shows a state in which the second hands HA-HD in step S6 shown in Fig. 8 have moved to the position of the processing unit 21B. During processing of the substrate WX1, the transfer opening 41a is closed by a shielding member (not shown).

[0139] Next, in step S8, the shared hand HB carries the processed substrate WX1 out of the processing unit 21B through the transfer opening 41a.

[0140] Next, in step S9, the shared hand HB returns to the position before it moved, and the second hands HA to HD start moving in the second specific direction SD2.

[0141] Next, in step S10, the second hands HA-HD move a distance d in the second specific direction SD2 and stop. The distance d is approximately equal to the distance d between the shared hand HB and the first unshared hand HA in the vertical direction DZ (FIG. 6). As a result, the first unshared hand HA faces the transfer opening 41a of the processing unit 21B. Then, the first unshared hand HA starts moving toward the inside of the processing unit 21B.

[0142] Next, in step S11, the first unshared hand HA carries the unprocessed substrate W1 into the processing unit 21B through the transfer opening 41a.

[0143] Next, in step S12, the first unshared hand HA returns to the position before it moved. Then, the second hands HA-HD start moving toward the substrate placement part 29L (FIG. 7). Then, the shared hand HB and the second unshared hand HC transfer the substrates WX1 and WX2, respectively, to the substrate placement part 29L.

[0144] As described above, steps S1 to S12 are executed in one transfer cycle CY as shown in Fig. 8 and Fig. 9. As a result, in one transfer cycle CY, two unprocessed substrates W1, W2 can be carried into the two processing units 21A, 21B, and two processed substrates WX1, WX2 can be carried out from the two processing units 21A, 21B.

[0145] Particularly in this embodiment, the shared hand HB is shared for carrying in the unprocessed substrate W2 into the processing unit 21A and carrying out the processed substrate WX1 from the processing unit 21B. Therefore, in order in the first specific direction SD1, the second non-shared hand HC to the first non-shared hand HA can be used for carrying out the substrates WX2, WX1 and carrying in the substrates W1, W2.

[0146] As a result, in order to carry the unprocessed substrate W2 into the same processing unit 21A after the unloading of the processed substrate WX2 from the processing unit 21A is completed, the shared hand HB only needs to move the distance d (the distance d between the second unshared hand HC and the shared hand HB) in the second specific direction SD2. Similarly, in order to carry the unprocessed substrate W1 into the same processing unit 21B after the unloading of the processed substrate WX1 from the processing unit 21B is completed, the first unshared hand HA only needs to move the distance d (the distance d between the shared hand HB and the first unshared hand HA) in the second specific direction SD2. Therefore, the throughput of the transport operation of the substrates W1, W2, WX1, and WX2 by the second transport mechanism 23L can be improved compared to the case where the hand is not shared between the unprocessed substrate and the processed substrate. Details of this point will be described later in comparison with the second substrate transport method shown in FIG. 11 and FIG. 12.

[0147] In the first substrate transport method of the present embodiment, the transport cycle CY (steps S1 to S12) is repeatedly executed while changing the processing units .

[0148] The second transport mechanism 23U (FIG. 6) performs the first substrate transport method in the same manner as the second transport mechanism 23L.

[0149] Next, an example of the second substrate transport method according to this embodiment will be described with reference to Fig. 10. The second substrate transport method is performed by the second transport mechanism 23 that transports the substrate W between the substrate placement part 29 and the processing unit 21. In the second substrate transport method, among the Q second hands 25, some of the second hands 25 that are continuous in the vertical direction DZ support only the unprocessed substrate W, and other some of the second hands 25 that are continuous in the vertical direction DZ support only the processed substrate W, thereby transporting a plurality of substrates W. Therefore, in the second substrate transport method, the second hand 25 is not shared between the processed substrate W and the unprocessed substrate W.

[0150] Fig. 10 is a diagram showing an example of an overall flow of the second substrate transport method. In Fig. 10, similarly to the case shown in Fig. 7, attention is focused on the substrate mounting part 29L, the second transport mechanism 23L, and the processing units 21A and 21B. Also, an unprocessed substrate is mounted on the lower stage 291A of the substrate mounting part 29L, and a processed substrate is mounted on the upper stage 291B of the substrate mounting part 29L. Furthermore, the definition of the transport cycle CY in the second substrate transport method is the same as the definition of the transport cycle CY in the first substrate transport method.

[0151] As shown in FIG. 10, as an example, at a certain timing, ten unprocessed substrates W1 to W10 are placed along the vertical direction DZ on the lower tier 291A of the substrate mounting portion 29L, and no substrates are placed on the upper tier 291B of the substrate mounting portion 29L.

[0152] In the second substrate transport cycle, similarly to the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L receives two substrates W1, W2 before processing by the processing units 21A, 21B from the substrate mounting part 29L, and transports the two substrates W1, W2 into two processing units 21A, 21B of the multiple processing units 21 (second step), and transports the two substrates WX1, WX2 after processing by the two processing units 21A, 21B out of the two processing units 21A, 21B, and passes the two substrates WX1, WX2 to the substrate mounting part 29L (third step). The transport cycle CY is repeatedly executed.

[0153] Specifically, in the second substrate transport method, in one transport cycle CY, the second hands HA, HB, which are continuous in the vertical direction DZ at the lower stage among the four second hands HA-HD, support only unprocessed substrates W1, W2, and the second hands HC, HD, which are continuous in the vertical direction DZ at the upper stage, support only processed substrates WX1, WX2.

[0154] Still referring to FIG. 10, states ST11 to ST14 of the second transport mechanism 23L in one transport cycle CY will be described.

[0155] In a state ST11 in which the second transport mechanism 23L receives the two substrates W1, W2 from the substrate platform 29L, the second hands HA, HB support the substrates W1, W2, respectively, and the second hands HC, HD do not support any substrates.

[0156] State ST12 next to state ST11 shows the state of the second transport mechanism 23L when the processed substrate WX2 is taken out of the processing unit 21A by the second hand HD and the unprocessed substrate W2 is carried into the same processing unit 21A by the second hand HB.

[0157] State ST13 next to state ST12 shows the state of the second transport mechanism 23L when the processed substrate WX1 is taken out of the processing unit 21B by the second hand HC and the unprocessed substrate W1 is carried into the same processing unit 21B by the second hand HA.

[0158] A state ST14 following the state ST13 shows the state of the second transport mechanism 23L when the processed substrates WX1, WX2 are supported by the second hands HC, HD and no substrates are supported by the second hands HA, HB.

[0159] 10, according to this embodiment, the second transport mechanism 23L of the substrate processing apparatus 100 includes the second hands HA and HB dedicated to supporting the unprocessed substrates W1 and W2, and the second hands HC and HD dedicated to supporting the processed substrates WX1 and WX2. This makes it possible to prevent the processing liquid from the processing unit 21 from adhering to the second hands HA and HB via the processed substrates WX1 and WX2. This in turn makes it possible to prevent the processing liquid from adhering to the unprocessed substrates newly supported by the second hands HA and HB.

[0160] Next, an example of the second substrate transport method will be described in detail with reference to Figures 11 and 12. In the following description, when there is no need to specify a specific substrate W, it will simply be referred to as a "substrate".

[0161] Figures 11 and 12 are flow charts showing an example of the second substrate transfer method. As shown in Figures 11 and 12, the second substrate transfer method includes steps S21 to S32 in one transfer cycle CY. In steps S21 to S32, the second hands HA to HD are moved by the second hand driving unit 17 under the control of the control unit 200.

[0162] 11, in step S21, the second hands HA and HB support unprocessed substrates W1 and W2, respectively. Meanwhile, the second hands HC and HD do not support any substrates. The second hand HD faces the transfer opening 41a of the processing unit 21A. Then, the second hand HD starts to move toward the processed substrate WX2 located inside the processing unit 21A.

[0163] The state of the second hands HA to HD in step S21 shows a state ST11 shown in FIG. 10 in which the second hands HA to HD have moved to the position of the processing unit 21A.

[0164] Next, in step S22, the second hand HD carries the processed substrate WX2 out of the processing unit 21A through the transfer opening 41a.

[0165] Next, in step S23, the second hand HD returns to the position before it moved, and the second hands HA to HD start moving in the second specific direction SD2.

[0166] Next, in step S24, the second hands HA-HD move a distance 2d (=2×d) in the second specific direction SD2 and stop. The distance 2d is approximately equal to the distance 2d between the second hands HD and HB in the up-down direction DZ (FIG. 6). As a result, the second hand HB faces the transfer opening 41a of the processing unit 21A. Then, the second hand HB starts moving toward the inside of the processing unit 21A.

[0167] Next, in step S25, the second hand HB carries the unprocessed substrate W2 into the processing unit 21A through the transfer opening 41a.

[0168] Next, in step S26, the second hand HB returns to the position before the movement, and the second hands HA to HD start to move toward the next processing unit 21B (FIG. 12).

[0169] 12, in step S27, the second hand HA supports the unprocessed substrate W1, and the second hand HB does not support a substrate. Meanwhile, the second hand HC does not support a substrate, and the second hand HD supports the processed substrate WX2. The second hand HC faces the transfer opening 41a of the processing unit 21B. Then, the second hand HC starts to move toward the processed substrate WX1 located inside the processing unit 21B.

[0170] The state of the second hands HA to HD in step S27 shows a state in which the second hands HA to HD in the state of step S26 shown in FIG. 11 have moved to the position of the processing unit 21B.

[0171] Next, in step S28, the second hand HC carries the processed substrate WX1 out of the processing unit 21B through the transfer opening 41a.

[0172] Next, in step S29, the second hand HC returns to the position before the movement, and the second hands HA to HD start to move in the second specific direction SD2.

[0173] Next, in step S30, the second hands HA-HD move a distance 2d (=2×d) in the second specific direction SD2 and stop. The distance 2d is approximately equal to the distance d between the second hands HC and HA in the vertical direction DZ (FIG. 6). As a result, the second hand HA faces the transfer opening 41a of the processing unit 21B. Then, the second hand HA starts moving toward the inside of the processing unit 21B.

[0174] Next, in step S31, the second hand HA carries the unprocessed substrate W1 into the processing unit 21B through the transfer opening 41a.

[0175] Next, in step S32, the second hand HA returns to the position before it moved. Then, the second hands HA-HD start to move toward the substrate placement part 29L (FIG. 10). Then, the second hands HC and HD transfer the substrates WX1 and WX2, respectively, to the substrate placement part 29L.

[0176] As described above, steps S21 to S32 are executed in one transfer cycle CY as shown in Fig. 11 and Fig. 12. As a result, in one transfer cycle CY, two unprocessed substrates W1, W2 can be carried in to the two processing units 21A, 21B by the second hands HA, HB, and two processed substrates WX1, WX2 can be carried out from the two processing units 21A, 21B by the second hands HC, HD.

[0177] In the second substrate transport method of the present embodiment, the transport cycle CY (steps S21 to S32) is repeatedly executed while changing the processing units 21.

[0178] The second transport mechanism 23U (FIG. 6) performs the second substrate transport method in the same manner as the second transport mechanism 23L.

[0179] Here, the first substrate transfer method and the second substrate transfer method are compared with each other with reference to FIG. 8 and FIG. 11. As shown in steps S3 and S4 of FIG. 8, the movement distance of the shared hand HB in the vertical direction DZ is "d". On the other hand, as shown in steps S23 and S24 of FIG. 11, the movement distance of the second hand HB is "2d". Therefore, the movement distance d of the shared hand HB in the first substrate transfer method is smaller than the movement distance 2d of the second hand HB in the second substrate transfer method. Similarly, as shown in steps S9 and S10 of FIG. 9 and steps S29 and S30 of FIG. 12, the movement distance d of the first non-shared hand HA in the first substrate transfer method is smaller than the movement distance 2d of the second hand HA in the second substrate transfer method.

[0180] As a result, compared to the second substrate transport method, the first substrate transport method can improve the throughput of the transport operation of the substrates W1, W2, WX1, and WX2 by the second transport mechanism 23. In other words, the first substrate transport method can improve the throughput of the transport operation of the substrates W1, W2, WX1, and WX2 by the second transport mechanism 23, compared to a case in which a hand is not shared between unprocessed substrates and processed substrates.

[0181] For example, in the first substrate transport method, compared to the second substrate transport method, the movement distance of the second hands HA-HD in the vertical direction DZ for one processing unit 21 is shorter by "d". Since the transport cycle CY is repeatedly executed, the fact that the movement distance for one processing unit 21 is shorter by "d" is effective in improving the throughput of the substrate transport operation by the second transport mechanism 23.

[0182] The first substrate transport method and the second substrate transport method have been described above with reference to Fig. 7 to Fig. 12. For example, the second transport mechanism 23 is set to execute either the first substrate transport method or the second substrate transport method, and the substrate processing apparatus 100 is delivered from the manufacturer to the user. That is, either the first substrate transport method or the second substrate transport method is implemented in the substrate processing apparatus 100.

[0183] However, both the first substrate transfer method and the second substrate transfer method may be implemented in the substrate processing apparatus 100, and the first substrate transfer method and the second substrate transfer method may be selected and executed. In this case, the user can select a desired substrate transfer method depending on the situation. As a result, the user's convenience can be improved.

[0184] In the first substrate transport method described above by way of example with reference to Figs. 7 to 9, three second hands 25 are used. However, the first substrate transport method is not limited to the use of three second hands 25, and can be generalized as shown in Fig. 13. In the following description, the number of processing units 21 into which the substrate W is loaded and unloaded in one transport cycle CY is written as "N". In this specification, unless otherwise specified, N is an integer of 2 or more. Attention is focused on the N processing units 21. For ease of understanding, attention is focused on the N+1 second hands 25 used in the first substrate transport method among the multiple (Q) second hands 25.

[0185] Fig. 13 is a diagram for explaining the first substrate transport method in a generalized manner. Fig. 13 shows one of the plurality of second transport mechanisms 23. As shown in Fig. 13, in one transport cycle CY in the first substrate transport method, the second transport mechanism 23 receives N substrates W that have not been processed by the processing units 21 from the substrate placement part 29, and carries the N substrates W into the N processing units 21_1 to 21_N among the plurality of processing units 21, and also carries the N substrates W that have been processed by the N processing units 21_1 to 21_N out of the N processing units 21_1 to 21_N, and delivers the N processed substrates W to the substrate placement part 29.

[0186] The N processing units 21_1 to 21_N may be some of the multiple processing units 21 included in the substrate processing apparatus 100 (total number of processing units 21>N), or may be all of the processing units 21 (total number of processing units 21=N).

[0187] The multiple second hands 25 include a first unshared hand H_F, M shared hands H_1 to H_M, and a second unshared hand H_S, where M is an integer equal to or greater than 1. The M shared hands H_1 to H_M are disposed between the first unshared hand H_F and the second unshared hand H_S.

[0188] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Also, M=N-1. That is, the second transport mechanism 23 includes N-1 shared hands H_1 to H_M.

[0189] The N+1 second hands 25 (the first non-shared hand H_F, the shared hands H_1 to H_M, and the second non-shared hand H_S) may be a portion of the multiple (Q) second hands 25 provided in the second transport mechanism 23, or may be all of the second hands 25.

[0190] The first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S are successively arranged in the vertical direction DZ from the first non-shared hand H_F to the second non-shared hand H_S.

[0191] Then, when the second transport mechanism 23 receives the N unprocessed substrates W from the substrate mounting part 29, the second non-shared hand H_S is not supporting the substrate W, and the M shared hands H_1 to H_M and the first non-shared hand H_F are supporting the substrate W. In other words, the M shared hands H_1 to H_M and the first non-shared hand H_F support the N substrates W.

[0192] In one transfer cycle CY, the M shared hands H_1 to H_M support the substrate W before and after the processing by the processing unit 21 at different timings.

[0193] In one transport cycle CY, the first non-shared hand H_F supports only the substrate W before being processed by the processing unit 21.

[0194] In one transport cycle CY, the second unshared hand H_S supports only the substrate W after the processing by the processing unit 21.

[0195] Still referring to FIG. 13, the operation of the second transport mechanism 23 in the first substrate transport method will be described in detail.

[0196] In one transfer cycle CY, each of the M shared hands H_1 to H_M and the first non-shared hand H_F receives an unprocessed substrate W from the substrate platform 29.

[0197] In one transfer cycle CY, the second unshared hand H_S moves to a position facing the transfer opening 41a of the processing unit 21_1, and carries the processed substrate W out of the processing unit 21_1.

[0198] In one transfer cycle CY, the N+1 second hands 25 move a distance d in the second specific direction SD2, so that the shared hand H_M adjacent to the second non-shared hand H_S among the M shared hands H_1 to H_M moves to a position facing the transfer opening 41a of the processing unit 21_1. The distance d indicates the interval between the adjacent second hands 25 in the vertical direction DZ. Then, the shared hand H_M carries the unprocessed substrate W into the processing unit 21_1 from which the substrate W was carried out by the second non-shared hand H_S. The processing unit 21_1 processes the substrate W.

[0199] In one transfer cycle CY, the N+1 second hands 25 move, so that the shared hand H_M adjacent to the second non-shared hand H_S moves to a position facing the transfer opening 41a of a processing unit 21_2 different from the processing unit 21_1 into which the unprocessed substrate W was carried in by the shared hand H_M. Then, the shared hand H_M carries out the processed substrate W from the processing unit 21_2.

[0200] In one transfer cycle CY, the N+1 second hands 25 move by a distance d in the second specific direction SD2, so that the shared hand H_M-1 adjacent to the shared hand H_M among the M shared hands H_1 to H_M moves to a position facing the transfer opening 41a of the processing unit 21_2. The shared hand H_M-1 is adjacent to the shared hand H_M in the first specific direction SD1. The shared hand H_M-1 then carries the unprocessed substrate W into the processing unit 21_2 from which the shared hand H_M carried out the substrate W. The processing unit 21_2 processes the substrate W.

[0201] In one transfer cycle CY, the N+1 second hands 25 move, so that the shared hand H_M-1 adjacent to the shared hand H_M moves to a position facing the transfer opening 41a of the processing unit 21_3 different from the processing unit 21_2 into which the unprocessed substrate W was carried in by the shared hand H_M-1. Then, the shared hand H_M-1 carries out the processed substrate W from the processing unit 21_3.

[0202] In one transport cycle CY, the N+1 second hands 25 move by a distance d in the second specific direction SD2, so that the shared hand H_M-2 adjacent to the shared hand H_M-1 moves to a position facing the transport opening 41a of the processing unit 21_3. The shared hand H_M-2 is adjacent to the shared hand H_M-1 in the first specific direction SD1. The shared hand H_M-2 then carries the unprocessed substrate W into the processing unit 21_3 from which the shared hand H_M-1 carried out the substrate W. The processing unit 21_3 processes the substrate W.

[0203] In one transfer cycle CY, the N+1 second hands 25 move, so that the shared hand H_M-2 adjacent to the shared hand H_M-1 moves to a position facing the transfer opening 41a of the processing unit 21_4 different from the processing unit 21_3 into which the unprocessed substrate W was carried in by the shared hand H_M-2. Then, the shared hand H_M-2 carries out the processed substrate W from the processing unit 21_4.

[0204] Thereafter, in one transfer cycle CY, the shared hands H_M-3 to H_2 similarly carry the substrate W into and out of the processing units 21_4 to 21_N-1. The processing units 21_4 to 21_N-1 process the substrate W.

[0205] Then, in one transport cycle CY, the N+1 second hands 25 move, so that the shared hand H_1 adjacent to the shared hand H_2, i.e., the shared hand H_1 adjacent to the first non-shared hand H_F, moves to a position facing the transport opening 41a of a processing unit 21_N different from the processing unit 21_N-1 from which the substrate W was unloaded by the shared hand H_2. The shared hand H_1 is adjacent to the shared hand H_2 in the first specific direction SD1. Then, the shared hand H_1 unloads the processed substrate W from the processing unit 21_N.

[0206] That is, in one transport cycle CY, the shared hand H_1 carries out the processed substrate W from the Nth processing unit 21_N.

[0207] Then, in one transfer cycle CY, the N+1 second hands 25 move in the second specific direction SD2 by the distance d, so that the first non-shared hand H_F moves to a position facing the transfer opening 41a of the processing unit 21_N. Then, the first non-shared hand H_F carries the unprocessed substrate W into the processing unit 21_N from which the substrate W was carried out by the shared hand H_1 adjacent to the first non-shared hand H_F. The processing unit 21_N processes the substrate W.

[0208] That is, in one transport cycle CY, the first non-shared hand H_F carries the unprocessed substrate W into the N-th processing unit 21_N.

[0209] Then, the M shared hands H_1 to H_M and the second unshared hand H_S deliver the N processed substrates W to the substrate placement part 29.

[0210] 13, in this embodiment, the shared hands H_1 to H_M are shared for carrying in the unprocessed substrate W into the processing units 21_1 to 21_N-1 and for carrying out the processed substrate W from the processing units 21_2 to 21_N. Therefore, the second non-shared hand H_S to the first non-shared hand H_F can be used for carrying in and carrying out the substrate W in turn in the first specific direction SD1.

[0211] As a result, in order to load an unprocessed substrate W into the same processing unit 21 after completing the unloading of the processed substrate W from the processing unit 21, it is sufficient for the shared hands H_1 to H_M and the first non-shared hand H_F to move a distance d (the distance d between the second hands 25) in the second specific direction SD2. Therefore, compared to a case in which a hand is not shared between the unprocessed substrate W and the processed substrate W (for example, the second substrate transport method), the throughput of the transport operation of the substrate W by the second transport mechanism 23L can be improved.

[0212] Next, in the case where the first substrate transport method is generalized, the relationship between the total number Q of second hands 25, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method will be described with reference to Figures 14 to 16. One second transport mechanism 23 out of the multiple second transport mechanisms 23 is shown in Figures 14 to 16. Also, the number of processing units 21 into and out of which substrates W are loaded and unloaded in one transport cycle CY is denoted as "N".

[0213] Figure 14 is a diagram showing the relationship between the total number Q of second hands 25, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method when the second transport mechanism 23 has 2N second hands 25.

[0214] 14, Q=2×N=2N. Therefore, the total number Q of the multiple second hands 25 included in the second transport mechanism 23 is 2N. In other words, the second transport mechanism 23 includes 2N second hands 25. In this example, N is an integer equal to or greater than 2.

[0215] When the first substrate transfer method is implemented in the substrate processing apparatus 100, the 2N second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S, where M is an integer equal to or greater than 1.

[0216] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Furthermore, M=N-1. That is, the second transport mechanism 23 includes N-1 shared hands H_1 to H_M. Note that, in the first substrate transport method, N-1 second hands 25 out of the Q (=2N) second hands 25 are not used.

[0217] On the other hand, when the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the 2N second hands 25, N second hands 25 (e.g., the lower second hands 25) that are consecutive in the vertical direction DZ support the substrate W before processing, and the other N second hands 25 (e.g., the upper second hands 25) that are consecutive in the vertical direction DZ support the substrate W after processing.

[0218] 14, according to this embodiment, by setting the total number Q of the second hands 25 to 2N, all of the second hands 25 can be used when implementing the second substrate transport method in the substrate processing apparatus 100. As a result, it is possible to improve the throughput when transporting the substrate W in the second substrate transport method. Also, by providing the second transport mechanism 23 with 2N second hands 25 in advance, when implementing the first substrate transport method in the substrate processing apparatus 100, the existing N+1 second hands 25 can be used without adding new second hands 25.

[0219] For example, when N=2, the first substrate transport method can be performed by the first non-shared hand H_F, one shared hand H_1, and the second non-shared hand H_S. In other words, the first substrate transport method can be performed by the second hand 25 with a minimum configuration. Therefore, the cost of the second transport mechanism 23 can be reduced.

[0220] Here, for example, either one of the first substrate transfer method and the second substrate transfer method described with reference to FIG.

[0221] However, both the first and second substrate transfer methods may be implemented in the substrate processing apparatus 100.

[0222] Specifically, the second transport mechanism 23 may be controlled by the controller 200 to operate in either a first substrate transport mode MD1 or a second substrate transport mode MD2.

[0223] The first substrate transport mode MD1 is a mode in which the second transport mechanism 23 executes the first substrate transport method. Specifically, the first substrate transport mode MD1 is a mode in which N+1 second hands 25 out of the 2N second hands 25 are used as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S.

[0224] The second substrate transport mode MD2 is a mode in which the second transport mechanism 23 executes a second substrate transport method. Specifically, the second substrate transport mode MD2 is a mode in which, of the 2N second hands 25, N second hands 25 are used to support only substrates W before processing by the processing units 21, and the other N second hands 25 are used to support only substrates W after processing by the processing units 21.

[0225] A user can operate the second transport mechanism 23 in either the first substrate transport mode MD1 or the second substrate transport mode MD2 by operating the control unit 200. This improves user convenience. Furthermore, a manufacturer of the substrate processing apparatus 100 can also operate the control unit 200 to set the mode to either the first substrate transport mode MD1 or the second substrate transport mode MD2 before shipping the substrate processing apparatus. This improves manufacturer convenience.

[0226] Figure 15 is a diagram showing the relationship between the total number Q of second hands 25, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method when the second transport mechanism 23 has N+1 second hands 25 and N is an odd number.

[0227] 15, Q=N+1. Therefore, in the second transport mechanism 23, the total number Q of the multiple second hands 25 is N+1. That is, the second transport mechanism 23 is equipped with N+1 second hands 25. In this example, N is an odd number equal to or greater than 3.

[0228] When the first substrate transfer method is implemented in the substrate processing apparatus 100, the N+1 second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S, where M is an integer equal to or greater than 1.

[0229] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Furthermore, M=N-1. That is, the second transport mechanism 23 is equipped with N-1 shared hands H_1 to H_M. In particular, in the first substrate transport method, all of the Q (=N+1) second hands 25 are used. That is, according to this embodiment, the number of second hands 25 when performing the first substrate transport method is optimized, and no extra second hands 25 exist. Therefore, the cost of the second transport mechanism 23 can be reduced.

[0230] On the other hand, when the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the N+1 second hands 25, (N+1) / 2 second hands 25 (e.g., the second hands 25 on the lower tier) that are consecutive along the vertical direction DZ support the substrate W before processing, and the other (N+1) / 2 second hands 25 (e.g., the second hands 25 on the upper tier) that are consecutive along the vertical direction DZ support the substrate W after processing.

[0231] Here, for example, either one of the first substrate transfer method and the second substrate transfer method described with reference to FIG.

[0232] However, similarly to the case described with reference to FIG. 14, the second transport mechanism 23 may be controlled by the controller 200 to operate in either the first substrate transport mode MD10 or the second substrate transport mode MD20.

[0233] The first substrate transport mode MD10 is a mode in which the second transport mechanism 23 executes the first substrate transport method. Specifically, the first substrate transport mode MD10 is a mode in which all of the Q (=N+1) second hands 25 are used as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S.

[0234] The second substrate transport mode MD20 is a mode in which the second transport mechanism 23 executes the second substrate transport method. Specifically, the second substrate transport mode MD20 is a mode in which, of the Q (=N+1) second hands 25, (N+1) / 2 second hands 25 consecutive in the vertical direction DZ are used to support only the substrates W before being processed by the processing unit 21, and the other (N+1) / 2 second hands 25 consecutive in the vertical direction DZ are used to support only the substrates W after being processed by the processing unit 21.

[0235] When both the first substrate transport mode MD10 and the second substrate transport mode MD20 are implemented, convenience for users and manufacturers can be improved, similar to when both the first substrate transport mode MD1 and the second substrate transport mode MD2 are implemented.

[0236] Figure 16 is a diagram showing the relationship between the total number Q of second hands 25, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method when the second transport mechanism 23 has N+1 second hands 25 and N is an even number.

[0237] 16, Q=N+1. Therefore, in the second transport mechanism 23, the total number Q of the multiple second hands 25 is N+1. That is, the second transport mechanism 23 is equipped with N+1 second hands 25. In this example, N is an even number equal to or greater than 2.

[0238] When the first substrate transport method is implemented in the substrate processing apparatus 100, the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is an even number are the same as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is an odd number described with reference to Figure 15.

[0239] On the other hand, when the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the N+1 second hands 25, N / 2 second hands 25 (e.g., the lower second hand 25) that are consecutive in the vertical direction DZ support the unprocessed substrate W, and the other N / 2 second hands 25 that are consecutive in the vertical direction DZ support the processed substrate W. The uppermost second hand 25 or the lowermost second hand 25 is not used.

[0240] Here, for example, either one of the first substrate transfer method and the second substrate transfer method described with reference to FIG.

[0241] However, similarly to the case described with reference to FIG. 14, the second transport mechanism 23 may be controlled by the control unit 200 to operate in either the first substrate transport mode MD100 or the second substrate transport mode MD200.

[0242] The first substrate transport mode MD100 is similar to the first substrate transport mode MD10 described with reference to FIG.

[0243] The second substrate transport mode MD200 is a mode in which, of the Q (=N+1) second hands 25, N / 2 second hands 25 consecutive in the vertical direction DZ are used to support only the substrates W before they are processed by the processing unit 21, and the other N / 2 second hands 25 consecutive in the vertical direction DZ are used to support only the substrates W after they have been processed by the processing unit 21.

[0244] When both the first substrate transport mode MD100 and the second substrate transport mode MD200 are implemented, convenience for users and manufacturers can be improved, similar to when both the first substrate transport mode MD1 and the second substrate transport mode MD2 are implemented.

[0245] The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 16). However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist of the present invention (for example, (1) to (4) below). Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, a certain component among all the components shown in one embodiment may be added to the components of another embodiment, or some of all the components shown in one embodiment may be deleted from the embodiment.

[0246] The drawings show each component diagrammatically to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configurations of each component shown in the above embodiment are merely examples, and are not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0247] (1) In the first substrate transport method described with reference to Fig. 13, the second transport mechanism 23 may include one or more second hands 25 continuous with the first unshared hand H_F in the first specific direction SD1, or may include one or more second hands 25 continuous with the second unshared hand H_S in the second specific direction SD2. This point is the same for the second transport mechanism 23 described with reference to Figs. 7 to 9.

[0248] 13, in the first substrate transfer method, the lowermost second hand 25 among the N+1 second hands 25 is set to the first non-shared hand H_F, and the uppermost second hand 25 is set to the second non-shared hand H_S (first embodiment). However, the lowermost second hand 25 among the N+1 second hands 25 may be set to the second non-shared hand H_S, and the uppermost second hand 25 may be set to the first non-shared hand H_F (second embodiment).

[0249] In this case, the first specific direction SD1 and the second specific direction SD2 are reversed from those in Fig. 13. That is, the first specific direction SD1 indicates the upward direction, and the second specific direction SD2 indicates the downward direction. In this case, in Fig. 13, the reference characters of the shared hands 25 are "H_1 to H_M" from the top, and the reference characters of the processing units 21 are "21_1 to 21_N" from the bottom.

[0250] Furthermore, when the transport cycle CY is repeatedly performed, the first substrate transport method may be performed by mixing the first and second modes.

[0251] The second mode may also be adopted in the first substrate transport method for the second transport mechanism 23 described with reference to Figures 7 to 9. For example, the second hand HC may be set as the first non-shared hand, and the second hand HA may be set as the second non-shared hand. In the second transport mechanism 23 described with reference to Figures 7 to 9, the first substrate transport method may be performed using the second hand HB to the second hand HC without using the second hand HA.

[0252] 1 may determine the processing unit 21 that carries in and out the substrate W in one transport cycle CY according to a predetermined schedule or in an event-driven manner. The event-driven manner is a manner in which the optimal processing unit 21 is determined from among a plurality of processing units 21 at the time of determining the processing unit 21 that carries in and out the substrate W.

[0253] (4) The configuration of the first hand driving unit 11 shown in Figs. 1 to 3 is not particularly limited as long as it can drive the first hand 9. For example, the rotation axes of all five first hands 9 may be common. For example, as long as the rotation axis lines are aligned, among the five first hands 9, the rotation axes of four first hands 9 that are consecutive in the vertical direction DZ may be common, and the rotation axis of the remaining first hand 9 may be different. Similarly, the configuration of the second hand driving unit 17 is not particularly limited as long as it can drive the second hand 25. [Industrial Applicability]

[0254] The present invention relates to a substrate processing apparatus and a substrate transport method, and has industrial applicability. [Explanation of symbols]

[0255] 7...First conveying mechanism 9…First Hand 21, 21A, 21B, 21_1 to 21_N... Processing unit 23, 23L, 23U...Second transport mechanism (transport mechanism) 25, HA~HD, H_F, H_S, H_1~HM ... 2nd hand (hand, 1st non-shared hand, 2nd non-shared hand, shared hand) 29, 29L, 29U...Substrate placement section 100...Substrate processing apparatus 200...Control unit

Claims

1. a substrate placement section including a first support group having ten first support sections each supporting one substrate, the first support group having ten first support sections each supporting one substrate, the substrate placement section having a plurality of substrates placed thereon; a plurality of processing units for processing the substrates; a first transport mechanism having five first hands each supporting one substrate, and configured to transport the substrate from a carrier housing a plurality of the substrates to the substrate placement portion; a second transport mechanism having two second hands, each supporting one substrate, for transporting the substrate from the substrate placement part to the plurality of processing units.

2. The substrate processing apparatus according to claim 1 , wherein the first transport mechanism transports the substrate from the carrier capable of accommodating 25 substrates to the substrate placement part.

3. the first transport mechanism further transports the substrate from the substrate placement part to the carrier by five of the first hands; The substrate processing apparatus according to claim 1 , wherein the second transport mechanism further transports the substrate from the processing unit to the substrate platform.

4. the second transport mechanism has a total of four second hands including the two second hands, 4. The substrate processing apparatus of claim 3, wherein the second transport mechanism uses two of the four second hands to transport the substrate from the substrate mounting portion to the processing unit, and uses the remaining two of the four second hands to transport the substrate from the processing unit to the substrate mounting portion.

5. the substrate mounting portion further includes a second support portion group having ten second support portions each supporting one substrate; the first transport mechanism transports substrates from the carrier to the first support group with five of the first hands, and transports substrates from the second support group to the carrier with five of the first hands; 5. The substrate processing apparatus of claim 4, wherein the second transport mechanism uses two of the four second hands to transport the substrate from the first support group to the processing unit, and uses the remaining two of the four second hands to transport the substrate from the processing unit to the second support group.

6. The substrate processing apparatus according to claim 5 , wherein on the substrate mounting part, the first support group is arranged on a lower stage, and the second support group is arranged on an upper stage.

7. The substrate processing apparatus according to any one of claims 4 to 6, wherein four second hands are arranged at intervals in the vertical direction so that two second hands transporting the substrate from the substrate mounting part to the processing unit are vertically continuous, and two second hands transporting the substrate from the processing unit to the substrate mounting part are vertically continuous.

8. 8. The substrate processing apparatus according to claim 7, wherein, of the four second hands, two second hands that are vertically consecutive in a lower tier transport the substrate from the substrate mounting portion to the processing unit, and two second hands that are vertically consecutive in an upper tier transport the substrate from the processing unit to the substrate mounting portion.

9. A substrate transport method comprising: a first support group having ten first support parts each supporting one substrate; and transporting the substrates between a substrate placement part on which a plurality of substrates are placed, a carrier that accommodates the plurality of substrates, and a plurality of processing units that process the substrates, the method comprising: a first step of transporting the substrate from the carrier to the substrate placement part by a first transport mechanism having five first hands, each of which supports one substrate; a second step of transporting the substrate from the substrate placement part to the processing unit by a second transport mechanism having two second hands each supporting one substrate.

10. the second transport mechanism includes a total of four second hands including the two second hands, In the second step, the second transport mechanism transports the substrate from the substrate placement part to the processing unit using two of the four second hands; a third step of transporting the substrate from the processing unit to the substrate mounting part by the second transport mechanism using the remaining two of the four second hands; The substrate transport method according to claim 9 , further comprising: a fourth step of transporting the substrate from the substrate placement part to the carrier by the first transport mechanism using five of the first hands.

11. the substrate mounting portion further includes a second support portion group having ten second support portions each supporting one substrate; In the first step, the first transport mechanism transports the substrate from the carrier to the first support group by five of the first hands; In the second step, the second transport mechanism transports the substrate from the first support group to the processing unit using two of the four second hands; In the third step, the second transport mechanism transports the substrate from the processing unit to the second support group using the remaining two of the four second hands; The substrate transport method according to claim 10 , wherein in the fourth step, the first transport mechanism transports the substrate from the second support group to the carrier with five of the first hands.

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