Thermoplastic resin composition, and resin molding using the same

JP2024175500AInactive Publication Date: 2024-12-18TECHNO UMG CO LTD +1
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Patent Information

Application Number
JP2023093334
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2024-12-18
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

To provide a thermoplastic resin composition in which, while maintaining properties derived from rigid resin (e.g., weather resistance, color development, surface hardness, and tensile / bending property), heat resistance and flowability are further improved in addition to performance improvement such as impact resistance of a molding by a resin composition of a combination of rigid resin and rubber-reinforced resin, and a resin molding using the thermoplastic resin composition.SOLUTION: A thermoplastic resin composition of the present invention contains rubber-reinforced resin (A) having 20 pts.mass or more and 45 pts.mass or less, first acrylic resin (B) having 15 pts.mass or more and 79 pts.mass or less, and second acrylic resin (C) having 1 pt.mass or more and 40 pts.mass or less such that the resins become 100 pts.mass in total. Herein, the second acrylic resin (C) contains (meth)acrylic constitutional unit (I) and aromatic vinyl constitutional unit (II), a ratio of the constitutional unit (I) to the total of the constitutional unit (I) and the constitutional unit (II) is 1 mol% or more and 99 mol% or less, and at least a partial aromatic double bond in the aromatic vinyl constitutional unit (II) is hydrogenated.SELECTED DRAWING: None
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