Resist composition, method of forming resist pattern, compound, and polymer compound

JP2024175511APending Publication Date: 2024-12-18TOKYO OHKA KOGYO CO LTD
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Patent Information

Application Number
JP2023093345
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2024-12-18
Patent Text Reader

Abstract

To provide a resist composition and the like good in any of sensitivity, roughness, and etching resistance.SOLUTION: A resist composition generating an acid by light exposure, and varying solubility to a developer by action of an acid includes a resin constituent (A1) varying solubility to a developer by action of an acid, where the resin constituent (A1) includes a constitutional unit (a0) expressed by the following general formula (a0-1). R expresses a hydrogen atom, a 1-5C alkyl group, or a 1-5C alkyl halide group, L0 expresses a single bond, or a bivalent coupling group, X0 expresses an oxygen atom, a sulfur atom, or a group expressed by -N(Rx0)-, Rx0 expresses a 1-3C alkyl group, Rpg expresses an acid dissociable group, R0 expresses a substituent group, and n0 expresses an integer of 0-4.SELECTED DRAWING: None
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