Component supply device and component supply method

Abstract

To provide a component supply device capable of improving quality of components to be supplied.SOLUTION: A component supply part 33, which is a component supply device, includes: a punching part 33b for executing a punching process to punch out a component 5 from a tape member 200 into which the component 5 is incorporated using a metal mold 336; a measuring part 333 for measuring a measurement value on the punching process; a control part 331 for changing a cleaning condition on the basis of the measurement value; and a cleaning part 334 for cleaning the component 5 punched out by the punching process according to the cleaning condition.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a part supplying device that supplies parts. [Background technology]

[0002] Conventionally, there has been provided a component bonding device that bonds electronic components (hereinafter simply referred to as "components") to a substrate such as a liquid crystal panel. This component bonding device bonds the components to the edge of the liquid crystal panel via an anisotropic conductive film (ACF), which is an anisotropic conductive member. In other words, the ACF is attached to the edge of the liquid crystal panel as an adhesive member. The component bonding device mounts the components on the portion of the liquid crystal panel to which the ACF is attached, and bonds them to the liquid crystal panel.

[0003] Also, a component mounting device has been proposed that punches out components from a tape member such as a TCP (Tape Carrier Package) in which the components are embedded, and presses the punched components onto a board (see Patent Document 1). Such a component mounting device can be said to include a component supplying device that supplies components, and a press-bonding device that presses the supplied components onto the board. The component supplying device punches out components from the tape member, and supplies the punched components to the press-bonding device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-53182 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the component supplying device of Patent Document 1 has a problem in that the quality of the supplied components may deteriorate.

[0006] Therefore, the present disclosure provides a part supplying device and the like that can improve the quality of the parts supplied. [Means for solving the problem]

[0007] A component supplying device according to one embodiment of the present disclosure includes a punching unit that uses a mold to perform a punching process to punch out electronic components from a tape member having electronic components embedded therein, a measuring unit that measures measurement values ​​related to the punching process, a control unit that changes cleaning conditions based on the measurement values, and a cleaning unit that cleans the electronic components punched out by the punching process in accordance with the cleaning conditions.

[0008] These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may be a non-transitory recording medium. Effect of the Invention

[0009] The component supply device of the present disclosure can improve the quality of the components supplied.

[0010] Further advantages and benefits of certain aspects of the present disclosure will become apparent from the specification and drawings, in which such advantages and / or benefits are provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of which are provided to obtain one or more identical features. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. [Diagram 2] FIG. 2 is a plan view of a component mounting line according to the embodiment. [Diagram 3]FIG. 3 is a diagram showing an example of a tape material handled by a component supply unit in the embodiment and a component punched out from the tape material. [Figure 4] FIG. 4 is a block diagram illustrating a schematic configuration example of a component supply unit according to the embodiment. [Diagram 5] FIG. 5 is a diagram illustrating an example of a specific mechanism of the component supply unit according to the embodiment. [Figure 6] FIG. 6 is a diagram for explaining an example of a punching process by the punching unit and a measurement by the measuring unit in the embodiment. [Figure 7] FIG. 7 is a diagram for explaining another example of the punching process by the punching unit and the measurement by the measuring unit in the embodiment. [Figure 8] FIG. 8 is a flowchart illustrating an example of a processing operation of the component supply unit in the embodiment. [Figure 9] FIG. 9 is a flowchart illustrating another example of the processing operation of the component supply unit in the embodiment. [Figure 10] FIG. 10 is a flowchart showing in detail the process of determining whether or not a die has deteriorated in the embodiment. [Figure 11] FIG. 11 is a diagram illustrating an example of a configuration of a component supply unit in a modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] (Findings on which this disclosure is based) The present inventors have found that the component supplying device of Patent Document 1 described in the "Background Art" section has the following problems.

[0013] The component supply device of the above-mentioned Patent Document 1 uses a punching die (hereinafter, also referred to as a die) to punch out components from a tape member. The components punched out by this die may have foreign matter such as burrs and whiskers attached to their side edges. The whiskers are elongated foreign matter made of the tape member or the material of the components. When a component with such foreign matter attached is pressure-attached to a substrate such as a liquid crystal panel, the foreign matter may cause an electrical short circuit or produce a mounting substrate with a pressure mark defect. The pressure mark defect is a state in which the electrodes of the component are not electrically connected to the electrodes of the substrate even when the component is pressure-attached to the substrate via the ACF. Therefore, the foreign matter has a large influence on the quality of the mounting substrate.

[0014] Therefore, the component supplying device of the above-mentioned Patent Document 1 removes the foreign matter from the component by brushing it with a brush. If the foreign matter scattered by the brushing adheres to the surface of the component, the component supplying device recognizes the foreign matter and determines that the component will not be mounted on the board. In other words, the supply of components is stopped.

[0015] However, in the component supplying device of the above-mentioned Patent Document 1, brushing is performed under the same conditions for each punched component. In other words, even if the number of punchings by the die increases and the edge of the die becomes dull and punching by the die becomes difficult to perform smoothly, brushing is performed under the same conditions for each component as when the edge of the die was sharp. As a result, there is a possibility that foreign matter cannot be properly removed from the components. Therefore, the quality of the supplied components is reduced. In addition, if a foreign matter that has not been removed is recognized and the supply of the component to which the foreign matter is attached is stopped, the efficiency of the supply of components is reduced. In other words, in order to maintain a high efficiency of the supply of components, the quality of the supplied components is reduced.

[0016] In order to solve these problems, the component supplying device according to the first aspect of the present disclosure includes a punching unit that uses a mold to perform a punching process to punch out electronic components from a tape member having electronic components embedded therein, a measuring unit that measures measurement values ​​related to the punching process, a control unit that changes cleaning conditions based on the measurement values, and a cleaning unit that cleans the electronic components punched out by the punching process in accordance with the cleaning conditions.

[0017] As a result, the cleaning conditions for the electronic components punched out by the punching process using the die are changed based on the measured values ​​for the punching process, so that the electronic components can be cleaned according to the state of the die. In other words, even if the edges of the die become dull and many foreign matters such as burrs and whiskers adhere to the electronic components to be punched out, the foreign matters can be appropriately removed from the electronic components. As a result, the quality of the provided components can be improved.

[0018] In the component supplying device according to a second aspect, the measured value may be a stress applied to the die when the die punches out the electronic components from the tape material. Note that the second aspect is dependent on the first aspect.

[0019] This allows the cleaning conditions to be changed according to the stress applied to the die when the electronic component is punched out. For example, if the edge of the die becomes dull, the stress increases. Therefore, more appropriate cleaning can be performed on the electronic component according to the state of the die.

[0020] In the component supplying device according to a third aspect, the measuring unit may include a piezoelectric element. Note that the third aspect is dependent on the second aspect.

[0021] This makes it possible to appropriately measure the stress when the electronic component is punched out.

[0022] In the component supplying device according to a fourth aspect, the measurement value may be the number of particles scattered when the electronic components are punched out of the tape material by the die. Note that the fourth aspect is dependent on the first aspect.

[0023] This allows the cleaning conditions to be changed according to the number of particles that fly off when the electronic components are punched out. For example, when the edge of the mold becomes dull, the number of particles tends to increase. Therefore, more appropriate cleaning can be performed on the electronic components according to the state of the mold.

[0024] In the component supplying device according to a fifth aspect, the measurement unit may include a particle sensor that measures the number of particles scattered around at least one of the mold and the electronic component. Note that the fifth aspect is dependent on the fourth aspect.

[0025] This makes it possible to appropriately measure the number of particles that are scattered when the electronic component is punched out as a measured value.

[0026] In addition, in the component supplying device according to a sixth aspect, the cleaning unit includes a brush that cleans the electronic components by contacting and sliding against the electronic components, The cleaning conditions may include at least one of a pressure at which the brush contacts the electronic component, a relative speed at which the brush slides against the electronic component, and a time required for cleaning. Note that the sixth aspect may be subordinate to any one of the first to fifth aspects.

[0027] This allows the brushing of the electronic components to be performed as cleaning, and foreign matter can be appropriately removed from the electronic components. Furthermore, the cleaning conditions can be changed in a variety of ways, and the degree of freedom in changing the cleaning conditions can be increased.

[0028] In the component supplying device according to a seventh aspect, the cleaning unit may include an ultrasonic generating unit that applies ultrasonic waves to the electronic components to clean the electronic components, and the cleaning conditions may include at least one of an output of the ultrasonic waves and a time required for cleaning. Note that the seventh aspect may be subordinate to any one of the first to fifth aspects.

[0029] This allows cleaning to be performed without contacting the electronic components, and foreign matter can be appropriately removed from the electronic components without damaging them. In addition, since there is little mechanical movement required for cleaning, the structure of the device can be simplified.

[0030] In the part supplying device according to an eighth aspect, the control unit may determine whether or not the die has deteriorated based on the measurement value, and when it is determined that the die has deteriorated, may notify maintenance of the die. Note that the eighth aspect may be subordinate to any one of the first to seventh aspects.

[0031] As a result, when the die deteriorates, it is determined that the die has deteriorated, and maintenance of the die is notified. Therefore, maintenance such as re-polishing of the die can be performed at an appropriate timing. For example, if the determination of deterioration is not performed, maintenance of the die or replacement with a new die is performed early, before the die deteriorates. In other words, early maintenance or replacement is performed periodically. However, in the eighth aspect, as described above, when it is determined that the die has deteriorated, maintenance is notified, so there is no need to perform early maintenance as described above. As a result, the efficiency of maintenance of the component supply device can be improved.

[0032] In addition, in the part supplying device according to a ninth aspect, the control unit may determine whether or not the die has deteriorated based on the number of times an abnormality occurs, and the abnormality may be an event in which the measurement value does not fall within a predetermined range. The ninth aspect is dependent on the eighth aspect. For example, when the number of times an abnormality occurs exceeds a threshold value, it is determined that the die has deteriorated.

[0033] This makes it possible to appropriately determine whether or not the mold has deteriorated.

[0034] In addition, in a component supplying device according to a tenth aspect, the component supplying device may include a first mold which is the mold and a second mold different from the first mold, and the control unit may cause the punching unit to perform the punching process using the second mold when it is determined that the first mold is deteriorated. The tenth aspect may be dependent on the eighth or ninth aspect.

[0035] As a result, when the first die is deteriorated, the die used for the punching process is switched from the first die to the second die, so that the supply of high-quality parts can be continued even if the first die is deteriorated.

[0036] In addition, in an eleventh aspect of the component supplying device, the component supplying device may include a second punching unit different from the first punching unit that is the punching unit, the first punching unit may perform the punching process using the die as a first die, and the control unit may cause the second punching unit to perform the punching process using a second die different from the first die when it is determined that the first die is deteriorated. Note that the eleventh aspect may be dependent on the eighth or ninth aspect.

[0037] As a result, when the first die is deteriorated, the punching unit that performs the punching process is switched from the first punching unit that uses the first die to the second punching unit that uses the second die. Therefore, even if the first die is deteriorated, it is possible to continue supplying high-quality parts.

[0038] Hereinafter, the embodiment will be specifically described with reference to the drawings.

[0039] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection of components, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components that are not described in an independent claim showing the highest concept are described as optional components. In addition, each figure is a schematic diagram and is not necessarily a strict illustration. In addition, the same components are given the same reference numerals in each figure.

[0040] (Embodiment) [Schematic configuration of component mounting line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line in this embodiment.

[0041] The component mounting line 1 in this embodiment is a system that produces products such as display panels (i.e., mounted boards) by mounting components 5 on a board 3 such as a liquid crystal panel, an organic EL (Electro-Luminescence) panel, etc. The components 5 are, for example, electronic components such as a drive circuit.

[0042] 1, such a component mounting line 1 has a board carry-in section 10, an adhesion section 20, a temporary pressure bonding section 30, a final pressure bonding section 40, and a board carry-out section 50. The board carry-in section 10, the adhesion section 20, the temporary pressure bonding section 30, the final pressure bonding section 40, and the board carry-out section 50 are connected in this order.

[0043] The substrate carry-in section 10 receives a rectangular substrate 3 carried in by a worker or from another device on the upstream side. The substrate 3 is then carried out to the bonding section 20 on the downstream side.

[0044] The adhering section 20 receives the substrate 3 carried out from the substrate carry-in section 10, and adheres an adhesive member such as ACF to each of the plurality of electrode sections 4 on the periphery of the substrate 3. Then, the substrate 3 with the adhesive member adhered thereto is carried out to the temporary pressure-bonding section 30. Each of the plurality of electrode sections 4 is formed of, for example, a plurality of electrodes.

[0045] The temporary bonding unit 30 receives the substrate 3 carried out from the attachment unit 20, and mounts and temporarily bonds the component 5 on the portion of the substrate 3 to which the adhesive member is attached. Then, the substrate 3 to which the component 5 is temporarily bonded is carried out to the full bonding unit 40.

[0046] The final compression bonding section 40 receives the board 3 carried out from the temporary compression bonding section 30, and performs final compression bonding (also called thermocompression bonding) on ​​the components 5 temporarily bonded to the board 3. Then, the board 3 that has been subjected to the final compression bonding is carried out to the board carrying-out section 50.

[0047] The substrate unloading section 50 receives the substrate 3 unloaded from the full-pressure bonding section 40. The substrate 3 received by the substrate unloading section 50 is unloaded to the downstream side.

[0048] In this manner, the component mounting line 1 performs component mounting work of mounting components 5 to each of the multiple electrode portions 4 provided on the periphery of the brought-in board 3, and then transports the board 3 on which the components 5 are mounted from the board unloading section 50 as a mounted board.

[0049] [Detailed configuration of component mounting line] FIG. 2 is a plan view of the component mounting line 1 in this embodiment. Specifically, FIG. 2 shows the configuration of the component mounting line 1 viewed from above. In this embodiment, the conveying direction of the board 3, i.e., the left-right direction, is referred to as the X-axis direction, the vertical direction, i.e., the up-down direction, is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, i.e., the depth direction, is referred to as the Y-axis direction. The negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side, respectively, in the conveying direction of the board 3, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side, respectively, in the vertical direction, and the negative side and the positive side in the Y-axis direction correspond to the near side and the far side, or the front side and the rear side, respectively, in the depth direction.

[0050] The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. The base 1a of the substrate loading section 10 is provided with a stage 11 on which the substrate 3 is placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. In addition, a plurality of suction holes 11a are provided on the upper surface of the stage 11. The stage 11 holds the substrate 3, which has been loaded by an operator or from another upstream device and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

[0051] The adhering unit 20 has a function of performing an adhering operation of adhering an ACF, which is an adhesive member, to the electrode unit 4 of the substrate 3. The adhering unit 20 includes a substrate moving mechanism 21 and an adhering mechanism 22.

[0052] The substrate moving mechanism 21 is a mechanism that moves the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the stage 23 are stacked on top of each other on the base 1b in this order from the bottom.

[0053] The Y-axis table is provided to extend in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, and raises and lowers the stage 23 provided on the upper portion in the Z-axis direction and rotates it around the Z axis.

[0054] Furthermore, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this manner, the substrate moving mechanism 21 suctions and holds the substrate 3, moves it within a horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (i.e., the Z-axis direction), and rotates it around the Z axis.

[0055] The bonding mechanism 22 is provided with, for example, two bonding heads aligned in the X-axis direction above the base 1b. Each bonding head is provided with a supply unit that supplies ACF and a bonding tool for bonding the ACF to the substrate 3. Each of the two bonding heads bonds the ACF to positions on the substrate 3 that correspond to the multiple electrode portions 4. Also, a bonding support stand is provided at a position corresponding to each of the two bonding heads below.

[0056] The pre-bonding unit 30 performs a pre-bonding operation of mounting and pre-bonding a component 5 on the area of ​​the substrate 3 where the ACF is attached (i.e., the target portion for bonding). The pre-bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transport unit 35.

[0057] The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3. The stage 37 has a plurality of suction holes 37a on its upper surface. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction through the plurality of suction holes 37a. The substrate moving mechanism 31 also has a function of moving the stage 37 that suction-holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 37, the substrate moving mechanism 31 positions the region of the substrate 3, to which the ACF is affixed, that is held by suction above the backup unit 36, which is a backup stage of the component mounting mechanism 32.

[0058] The component supply unit 33 is provided on the far side of the component mounting mechanism 32 (i.e., the positive side in the Y-axis direction) and protrudes from the rear of the base 1b. For example, the component supply unit 33 includes a supply reel 33a around which a tape member such as TCP is wound, a punching unit 33b, a movable stage 33c, a rail 33d, and a cleaning unit 334. Such a component supply unit 33 sequentially supplies components 5 from the tape member by the movements of these components. The component supply unit 33 is an example of a component supply device in this embodiment. Details of the component supply device 33 will be described later.

[0059] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 to the side of the crimping tool 34 included in the component mounting mechanism 32 .

[0060] The component mounting mechanism 32 is provided on the base 1b, and includes a pressure bonding tool and a backup unit .

[0061] The backup unit 36 ​​is a member formed in an elongated shape, and supports the substrate 3 from below. In other words, the backup unit 36 ​​supports from below a portion to be compressed, which is a predetermined portion of the substrate 3 held by the stage 37. The portion to be compressed is the portion of the substrate 3 to which the ACF is attached.

[0062] The bonding tool 34 holds the component 5 and bonds the component 5 to the upper surface of the substrate 3 supported by the backup unit 36. That is, the bonding tool 34 bonds the component 5 to the portion of the substrate 3 to be bonded. Specifically, the bonding tool 34 moves up and down in the Z-axis direction and adsorbs (i.e., picks up) the component 5 moved by the component transfer unit 35 from above. The bonding tool 34 then places the adsorbed component 5 on the ACF and presses the substrate 3 against the backup unit 36, thereby pre-bonding the component 5 to the substrate 3. The pre-bonding unit 30 may include a mechanism for rotating the orientation of the substrate 3 held by the substrate movement mechanism 31 by 90 degrees.

[0063] The final bonding section 40 performs a final bonding operation (also referred to as a thermocompression operation) of final bonding (i.e., thermocompression bonding) of the component 5, which has been provisionally bonded to the substrate 3 by the provisional bonding section 30, to the substrate 3. In this manner, the electrode section 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. The final bonding section 40 includes a substrate moving mechanism 41 and a bonding mechanism 42.

[0064] The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the plurality of suction holes 49a. The substrate moving mechanism 41 also has a function of moving the stage 49, which suction-holds the substrate 3, in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 49, the substrate moving mechanism 41 positions the area where the component 5 of the substrate 3, which is suction-held and temporarily pressure-bonded, above the pressure-bonding support unit of the pressure-bonding mechanism 42.

[0065] The bonding mechanism 42 presses the component 5 on the substrate 3 toward the bonding support part with a heated head. This causes the component 5 to be fully bonded, and the electrode parts 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0066] The substrate unloading section 50 has a function of vacuum-adsorbing and holding the substrate 3 transferred from the final bonding section 40 on the stage 51. The substrate 3 held in the substrate unloading section 50 is either carried out to another device downstream or removed from the stage 51 by an operator. The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 holds the substrate 3 transferred from the final bonding section 40 on its upper surface by vacuum adsorption.

[0067] The transport section 60 is a device that transports the substrate 3. Specifically, the transport section 60 has a function of delivering (transporting) the substrate 3 that has been carried into the substrate carry-in section 10 to the adhering section 20, the temporary pressure-bonding section 30, the final pressure-bonding section 40, and the substrate carry-out section 50 in this order. The transport section 60 is disposed in a front area (i.e., on the negative side in the Y-axis direction) of the adhering section 20, the temporary pressure-bonding section 30, and the final pressure-bonding section 40.

[0068] The transport section 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D, which are arranged in this order from the upstream side on a moving base 61 extending in the X-axis direction across the bases 1a, 1b, and 1c. Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In this embodiment, a case is illustrated in which each of the substrate transport mechanisms 62A to 62D includes two arm units 64. The base 63 is provided on the moving base 61 and is freely movable in the X-axis direction. On the base 63, two arm units 64 are provided side by side in the X-axis direction. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0069] Each of the substrate transport mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-sucked from above, and receives or transfers the substrate 3 from the rising and lowering stage 11, 23, 37, 49, 51. For example, the substrate transport mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carry-in section 10 and transfers it to the stage 23 of the bonding section 20. Also, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the bonding section 20 and transfers it to the stage 37 of the temporary pressure bonding section 30. Also, for example, the substrate transport mechanism 62C receives the substrate 3 from the stage 37 of the temporary pressure bonding section 30 and transfers it to the stage 49 of the main pressure bonding section 40. Also, for example, the substrate transport mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding section 40 and transfers it to the stage 51 of the substrate carry-out section 50.

[0070] [Details of the parts supply unit (parts supply device)] FIG. 3 is a diagram showing an example of a tape material handled by component supply unit 33 in this embodiment and a component 5 punched out from the tape material.

[0071] As shown in FIG. 3(a), the tape member 200 is a tape-shaped member in which a plurality of components 5 are assembled in a line. The plurality of components 5 are arranged such that adjacent components 5 are spaced apart by a predetermined distance. Each of the plurality of components 5 is, for example, a circuit film component in which electronic components are mounted on a flexible resin film. A plurality of sprocket holes 203 are formed in a line along the longitudinal direction of the tape member 200 at both ends in the width direction of the tape member 200. Such a tape member 200 is wound around a supply reel 33a.

[0072] The punching section 33b of the component supply unit 33 punches out the components 5 incorporated in the tape material 200 from the tape material 200 while unwinding the tape material 200 from the supply reel 33a. The above-mentioned multiple sprocket holes 203 are used to unwind the tape material 200. The rectangular area surrounded by the dashed line shown in FIG. 3(a) is punched out as the components 5.

[0073] As shown in FIG. 3B, the punched component 5 is, for example, a substantially rectangular film and has a plurality of electrodes 5a. A die is used to punch the component 5 by the punching unit 33b. If the die is repeatedly used to punch the component 5, the edge of the die becomes dull, and punching by the die cannot be performed smoothly. As a result, the edge of the component 5 may sag in the punching direction, and further, foreign matter such as burrs and whiskers may adhere to the edge. For example, foreign matter adheres to the electrode 5a. Therefore, the component supply unit 33 in this embodiment performs cleaning to remove foreign matter from the component 5.

[0074] FIG. 4 is a block diagram showing a schematic configuration example of the component supply unit 33 in this embodiment.

[0075] The component supply unit 33 includes a control unit 331 , a punching unit 33 b , a measuring unit 333 , a cleaning unit 334 , and a transport unit 335 .

[0076] The punching unit 33b includes a die 336, a motor 337, and a sprocket 338. The die 336 is a metal member for punching the component 5 from the tape member 200. The motor 337 provides mechanical power to the sprocket 338 to rotate the sprocket 338 and unwind the tape member 200 from the supply reel 33a. In the example of FIG. 4, the motor 337 is provided in the punching unit 33b, but may be provided outside the punching unit 33b. The number of motors 337 provided in the component supply unit 33 may be one or two or more. The punching unit 33b in this embodiment performs a punching process for punching the component 5 from the tape member 200 in which the component 5 is incorporated, using the die 336.

[0077] The measuring unit 333 measures a measurement value related to the punching process. Details of the measurement value will be described later. The control unit 331 changes the cleaning conditions based on the measurement value. The cleaning unit 334 cleans the part 5 punched by the punching process in accordance with the above-mentioned cleaning conditions. The transfer unit 335 is a mechanism for transferring the part 5 punched by the punching unit 33b, and includes the movable stage 33c and rails 33d shown in FIG. 2.

[0078] FIG. 5 is a diagram showing an example of a specific mechanism of the component supply unit 33 in this embodiment.

[0079] The component supply unit 33 includes the above-mentioned supply reel 33a, and further includes a cover tape recovery unit 33a1 and a winding unit 33a2. The cover tape recovery unit 33a1 recovers the cover tape 204 peeled off from the tape member 200. That is, when the cover tape 204 is attached to the tape member 200, as the tape member 200 is unwound from the supply reel 33a, the cover tape 204 is peeled off from the tape member 200 and wound around the cover tape recovery unit 33a1. The winding unit 33a2 recovers the tape member 200 after the component 5 has been punched out.

[0080] The punching section 33b punches out the component 5 from the tape member 200, and places the punched component 5 on the movable stage 33c.

[0081] The movable stage 33c moves along the rail 33d. For example, the movable stage 33c moves with the component 5 placed thereon to transfer the component 5 to a pick-up position. Note that the rail 33d is arranged along the X-axis direction, but in FIG. 5, it is shown to be along the Y-axis direction in order to easily show the movement of the movable stage 33c.

[0082] The component transfer section 35 picks up the component 5 placed on the movable stage 33c at the pick-up position, and transfers the component 5 to the main section 30a of the temporary crimping section 30. The main section 30a is a section having the crimping tool 34, the backup section 36, and the stage 37. The component transfer section 35 includes a transfer rail 35a, a transfer head 35b, and a transfer stage 35c. The transfer rail 35a is disposed so as to connect the component supply section 33 and the main section 30a of the temporary crimping section 30. The transfer head 35b picks up the component 5 placed on the movable stage 33c, and moves along the transfer rail 35a toward the main section 30a of the temporary crimping section 30. The transfer head 35b then places the component 5 on the transfer stage 35c waiting at the transfer position. The transfer stage 35c moves with the component 5 placed thereon, thereby transferring the component 5 to the bonding tool 34 of the temporary bonding unit 30. The bonding tool 34 picks up the component 5 and presses it together with the substrate 3 placed on the stage 37 against the backup unit 36, thereby temporarily bonding the component 5 to the substrate 3.

[0083] Here, the cleaning unit 334 in this embodiment cleans the component 5 picked up by the transfer head 35b of the component transport unit 35. For example, the cleaning unit 334 cleans the component 5 while the transfer head 35b is moving while picking up the component 5. When cleaning the component 5, the transfer head 35b may be stationary or may be moving.

[0084] Specifically, the cleaning unit 334 includes a brush 334a and an ultrasonic wave generating unit 334b.

[0085] The brush 334a cleans the component 5 by abutting against it and sliding against it. Specifically, the brush 334a cleans the component 5 by abutting against and sliding against the underside of the component 5 picked up by the transfer head 35b. The brush 334a also includes a movement mechanism for moving in the X-axis direction, the Y-axis direction, and the Z-axis direction. The cleaning conditions are adjusted by this movement mechanism. For example, the brush 334a strongly abuts against the component 5 by moving in the positive Z-axis direction, and conversely, weakly abuts against the component 5 by moving in the negative Z-axis direction. That is, the pressure with which the brush 334a abuts against the component 5 is adjusted as the cleaning conditions. The brush 334a also brushes the component 5 strongly by quickly reciprocating in the X-axis or Y-axis direction, and conversely, brushes the component 5 weakly by slowly reciprocating. The brush 334a may be a rotating brush having a rotation mechanism, and may be rotated around a rotation axis along the X-axis or Y-axis direction by the rotation mechanism. In this case, by increasing the rotation speed, the brush 334a brushes the component 5 strongly, and conversely, by decreasing the rotation speed, the brush 334a brushes the component 5 weakly. In other words, the relative speed at which the brush 334a slides against the component 5 is adjusted as a cleaning condition. The time required for cleaning may also be adjusted as a cleaning condition. The time required for cleaning is the time during which the brush 334a slides against the component 5 in contact with it. Such a time is adjusted by the timing of raising and lowering the brush 334a by the above-mentioned movement mechanism, or the time during which the transfer head 35b is stopped on the brush 334a, etc.

[0086] The ultrasonic generator 334b ​​applies ultrasonic waves to the component 5 to clean the component 5. Specifically, the ultrasonic generator 334b ​​cleans the component 5 by emitting or outputting ultrasonic waves from below the component 5 picked up by the transfer head 35b. For example, the ultrasonic generator 334b ​​increases the cleaning intensity for the component 5 by increasing the amplitude or frequency of the ultrasonic waves, and conversely, decreases the cleaning intensity for the component 5 by decreasing the amplitude or frequency of the ultrasonic waves. That is, the output of the ultrasonic waves is adjusted as a cleaning condition. The time required for cleaning may also be adjusted as a cleaning condition. The time required for cleaning is adjusted by the time during which the ultrasonic waves are output toward the component 5, or the time during which the transfer head 35b is stopped on the ultrasonic generator 334b, or the like.

[0087] In this embodiment, the control unit 331 changes the above-mentioned cleaning conditions based on the measurement value measured by the measurement unit 333.

[0088] FIG. 6 is a diagram for explaining an example of the punching process by punching unit 33b and an example of the measurement by measuring unit 333. In FIG.

[0089] For example, as shown in FIG. 6, the punching unit 33b includes a motor 337, a sprocket 338, and a die 336. The die 336 includes a punch 336a and a die 336b. As shown in FIG. 6(a), the motor 337 rotates the sprocket 338 under the control of the control unit 331. The sprocket 338 rotates while engaging with a sprocket hole 203 formed in the tape member 200. As a result, the sprocket 338 pays out the tape member 200 such that the portion of the tape member 200 in which the component 5 is incorporated is positioned below the punch 336a.

[0090] Then, as shown in Fig. 6(b), the punch 336a descends. At this time, the edge of the punch 336a pinches and presses the periphery of the portion of the tape member 200 where the component 5 is incorporated (indicated by a dashed line in Fig. 3) between the edge of the die 336b. Furthermore, as shown in Fig. 6(c), when the punch 336a descends, the periphery of the above-mentioned portion is cut. In other words, the component 5 is punched out from the tape member 200. The punched component 5 is placed on the movable stage 33c.

[0091] 6, the measuring unit 333 in this embodiment includes a piezoelectric element 333a, which is disposed on a die 336b. The piezoelectric element 333a is also called a piezo element. Thus, the piezoelectric element 333a measures, as a measured value, the stress applied to the die 336 when the component 5 is punched out of the tape member 200 by the die 336.

[0092] For example, as the number of uses of the mold 336 increases, the edges of the mold 336, i.e., the edges of the punch 336a and the die 336b, become dull. As a result, the measured value, which is the stress measured by the piezoelectric element 333a, increases. The control unit 331 obtains the measured value from the piezoelectric element 333a and changes the cleaning conditions of the cleaning unit 334 according to the measured value.

[0093] The cleaning conditions of the brush 334a include at least one of the pressure with which the brush 334a contacts the component 5, the relative speed at which the brush 334a slides with respect to the component 5, and the time required for cleaning. The relative speed is the speed of the brush 334a relative to the component 5. For example, the control unit 331 controls the brush 334a so that the pressure of the brush 334a increases, the relative speed increases, or the time required for cleaning increases as the measured value increases.

[0094] The cleaning conditions of the ultrasonic generator 334b ​​include at least one of the ultrasonic output and the time required for cleaning. For example, the control unit 331 controls the ultrasonic generator 334b ​​so that the ultrasonic output is increased or the time required for cleaning is increased as the measurement value increases.

[0095] As described above, in this embodiment, the cleaning conditions for the part 5 punched by the punching process using the die 336 are changed based on the measured values ​​related to that punching process, so that cleaning can be performed on the part 5 according to the state of the die 336. In other words, even if a large amount of foreign matter such as burrs and whiskers adheres to the part 5 being punched due to the edge of the die 336 becoming dull, the foreign matter can be appropriately removed from the part 5. As a result, the quality of the parts 5 provided can be improved.

[0096] Moreover, in the example of FIG. 6, the cleaning conditions are changed according to the stress applied to the die 336 when the component 5 is punched out. For example, when the edge of the die 336 becomes dull, the stress increases. Therefore, more appropriate cleaning can be performed on the component 5 according to the state of the die 336. Moreover, in the example of FIG. 6, since the piezoelectric element 333a is used, the stress when the component 5 is punched out can be appropriately measured as a measured value.

[0097] 5 and 6, the brush 334a is used for cleaning, so that brushing of the component 5 can be performed as cleaning, and foreign matter can be appropriately removed from the component 5. Furthermore, since the above-mentioned cleaning conditions are changed for the brush 334a, it is possible to change various cleaning conditions, and the degree of freedom in changing the cleaning conditions can be increased.

[0098] 5 and 6, the ultrasonic generator 334b ​​is used for cleaning, so that cleaning can be performed without contacting the component 5, and foreign matter can be appropriately removed from the component 5 without damaging the component 5. In addition, the ultrasonic generator 334b ​​requires little mechanical movement for cleaning, so that it is possible to simplify the structure of the component supply unit 33.

[0099] FIG. 7 is a diagram for explaining another example of the punching process by punching unit 33b and the measurement by measuring unit 333. In FIG.

[0100] For example, as in the example shown in Fig. 6, the punching unit 33b pays out the tape member 200 by rotating a sprocket 338 by a motor 337, and punches out a component 5 from the tape member 200 by lowering a punch 336a, as shown in Fig. 7(a), (b) and (c). Furthermore, when the component 5 is punched out of the tape member 200 by the die 336, a plurality of particles may scatter, as shown in Fig. 7(c).

[0101] For example, as the number of times the die 336 is used increases, the edges of the die 336, i.e., the edges of the punch 336a and the die 336b, become dull. When the edges become dull, a large stress is applied to the punch 336a and the die 336b when the punch 336a and the die 336b pinch the tape member 200, and when the component 5 is punched out from the tape member 200, the large stress is suddenly reduced. As a result, many particles are scattered around the die 336 and the component 5. The particles are, for example, pieces of the tape member 200, dust particles attached to the die 336 or the tape member 200, and the like.

[0102] 7, the measurement unit 333 in this embodiment includes a particle sensor 333b. This particle sensor 333b measures the number of particles scattered around at least one of the die 336 and the component 5. In other words, the measurement value measured by the measurement unit 333 is the number of particles scattered when the component 5 is punched out of the tape material 200 by the die 336.

[0103] For example, as described above, when the edges of the mold 336, i.e., the edges of the punch 336a and the die 336b, become dull, the measurement value, which is the number of particles measured by the particle sensor 333b, increases. The control unit 331 acquires the measurement value from the particle sensor 333b and changes the cleaning conditions of the cleaning unit 334 in accordance with the measurement value.

[0104] For example, the control unit 331 controls the brush 334a so that the pressure of the brush 334a increases, the relative speed increases, or the time required for cleaning increases as the measured value increases. Also, the control unit 331 controls the ultrasonic generator 334b ​​so that the output of the ultrasonic waves increases, or the time required for cleaning increases as the measured value increases.

[0105] In this way, in the example of FIG. 7, the cleaning conditions are changed according to the number of particles that fly off when the component 5 is punched out. For example, when the edge of the mold 336 becomes dull, the number of particles tends to increase. Therefore, more appropriate cleaning can be performed on the component 5 according to the state of the mold 336. Furthermore, in the example of FIG. 7, the particle sensor 333b is used, so that the number of particles that fly off when the component 5 is punched out can be appropriately measured as a measurement value.

[0106] In addition, the measurement unit 333 in this embodiment may include both the piezoelectric element 333a and the particle sensor 333b. In this case, the control unit 331 changes the cleaning conditions using the measurement value of the piezoelectric element 333a and the measurement value of the particle sensor 333b. This allows the control unit 331 to appropriately change the cleaning conditions even if either the piezoelectric element 333a or the particle sensor 333b is broken.

[0107] FIG. 8 is a flowchart showing an example of the processing operation of the component supply unit 33 in this embodiment.

[0108] The control unit 331 of the component supply unit 33 causes the punching unit 33b to execute a punching process for punching the component 5 from the tape member 200 (step S1). Then, the control unit 331 acquires measurement values ​​related to the punching process measured by the measurement unit 333 (step S2). Next, the control unit 331 changes the cleaning conditions of the cleaning unit 334 based on the measurement values ​​measured by the measurement unit 333 (step S3). Thereafter, the control unit 331 causes the cleaning unit 334 to clean the component 5 according to the cleaning conditions changed in step S3 (step S4).

[0109] Here, the component supply unit 33 may determine whether or not the die 336 of the punching unit 33b has deteriorated, and change the processing depending on the result of the determination.

[0110] FIG. 9 is a flowchart showing another example of the processing operation of the component supply unit 33 in this embodiment.

[0111] For example, the control unit 331 of the component supply unit 33 executes the processes of steps S1 and S2, similar to the example shown in FIG. 8. Then, the control unit 331 judges whether the mold 336 has deteriorated based on the measured value measured by the process of step S2 (step S10). Here, if the control unit 331 judges that the mold 336 has not deteriorated (No in step S10), it executes the processes of steps S3 and S4, similar to the example shown in FIG. 8. On the other hand, if the control unit 331 judges that the mold 336 has deteriorated in step S10 (Yes in step S10), the control unit 331 notifies the worker of the maintenance of the mold 336 (step S6). That is, the control unit 331 outputs maintenance information for prompting the worker of the component mounting line 1 to perform maintenance such as re-polishing the mold 336. For example, the control unit 331 may output the maintenance information to a display provided in the component mounting line 1, thereby displaying a message or image prompting the worker to perform maintenance of the mold 336 on the display. Alternatively, the control unit 331 may output the message information to, for example, a server connected to the component mounting line 1 via a communication network. By outputting the maintenance information, the worker can perform maintenance on the mold 336 at an appropriate time.

[0112] After the process of step S4 or step S6 is performed, the control unit 331 determines whether or not to continue the supply of the components 5 (step S7). If the control unit 331 determines to continue the supply of the components 5 (Yes in step S7), it repeats the process from step S1, and if the control unit 331 determines not to continue the supply of the components 5 (No in step S7), it ends the supply of the components 5.

[0113] 10 is a flowchart showing in detail the process of determining whether or not there is deterioration of the mold 336. That is, FIG. 10 is a flowchart showing in detail an example step S10 in FIG.

[0114] The control unit 331 determines whether or not the measurement value measured by the measurement unit 333 exceeds the first threshold value (step S11). If the control unit 331 determines that the measurement value is equal to or less than the first threshold value (No in step S11), that is, if the control unit 331 determines that the mold 336 has not deteriorated, it executes the process of step S3.

[0115] On the other hand, when the control unit 331 determines that the measured value exceeds the first threshold value (Yes in step S11), it increments the number of abnormality occurrences (step S12). That is, the number of abnormality occurrences is increased by one. The number of abnormality occurrences is the number of times an abnormality occurs, and the abnormality is an event in which the measured value exceeds the first threshold value. For example, the number of abnormality occurrences is reset to 0 at a predetermined timing. The predetermined timing is the timing when the existing mold 336 is replaced with a new mold 336, or the timing when maintenance such as re-polishing is performed on the mold 336.

[0116] Next, the control unit 331 judges whether the number of abnormality occurrences exceeds a second threshold value (step S13). If the control unit 331 judges that the number of abnormality occurrences is equal to or less than the second threshold value (No in step S13), that is, if the control unit 331 judges that the mold 336 has not deteriorated, it executes the process of step S3. On the other hand, if the control unit 331 judges that the number of abnormality occurrences exceeds the second threshold value (Yes in step S13), that is, if the control unit 331 judges that the mold 336 has deteriorated, it executes the process of step S6.

[0117] In this manner, the control unit 331 in this embodiment determines whether or not the mold 336 has deteriorated based on the measurement value, and issues a notification to require maintenance of the mold 336 if it is determined that the mold 336 has deteriorated.

[0118] As a result, when the die 336 deteriorates, it is determined that the die 336 has deteriorated, and maintenance of the die 336 is notified. Therefore, maintenance such as re-polishing of the die 336 can be performed at an appropriate timing. For example, if the determination of deterioration is not performed, maintenance of the die 336 or replacement with a new die is performed early before the die 336 deteriorates. In other words, early maintenance or replacement is performed periodically. However, in this embodiment, as described above, when it is determined that the die 336 has deteriorated, maintenance is notified, so that there is no need to perform early maintenance as described above. As a result, the efficiency of maintenance of the parts supply unit 33 can be improved.

[0119] Furthermore, the control unit 331 in this embodiment judges whether or not the mold 336 has deteriorated based on the number of times an abnormality has occurred. The abnormality is an event in which the measurement value does not fall within a predetermined range. This allows appropriate judgment of whether or not the mold 336 has deteriorated. In the above example, the predetermined range is a range equal to or less than the first threshold value. When the measurement value output from the piezoelectric element 333a is a negative value, that is, when the greater the stress generated during the punching process, the smaller the measurement value output from the piezoelectric element 333a, the predetermined range may be a range equal to or greater than the threshold value.

[0120] As described above, component supply unit 33, i.e., the component supply device, in this embodiment changes the cleaning conditions for component 5 punched by punching process using die 336 based on the measurement values ​​related to that punching process, and therefore can perform cleaning of component 5 according to the state of die 336. In other words, even if a large amount of foreign matter such as burrs and whiskers adheres to component 5 being punched due to the edge of die 336 becoming dull, such foreign matter can be appropriately removed from component 5. As a result, the quality of components 5 provided can be improved.

[0121] (Modification) In the above embodiment, when it is determined that the die 336 is deteriorated, a maintenance notice is issued. However, if the deteriorated die 336 is not maintained and the punching process continues to be performed using the deteriorated die 336, the quality of the mounting board may deteriorate. Therefore, in this modification, the die 336 determined to be deteriorated is not used for the punching process, and another die 336 that is not deteriorated is used for the punching process in place of the deteriorated die 336.

[0122] FIG. 11 is a diagram showing an example of the configuration of the component supply unit 33 in this modified example.

[0123] The component supply unit 33 in this modified example includes not only a punching unit 33b used for punching processing, but also another preliminary punching unit 33b.

[0124] That is, the component supply unit 33 includes two punching units 33b that perform a punching process on the tape material 200 unwound from the supply reel 33a located on the negative side (i.e., the left side) in the X-axis direction out of the two supply reels 33a. One of the two punching units 33b is a first punching unit L1, and the other is a second punching unit L2. The first punching unit L1 is arranged so as to be capable of performing the punching process, and the second punching unit L2 is arranged as a reserve unit. When it is determined that the die 336 of the first punching unit L1 is deteriorated, the second punching unit L2 is arranged so as to be capable of performing the punching process in place of the first punching unit L1. As a result, the deteriorated die 336 of the first punching unit L1 is not used for the punching process, and the undeteriorated die 336 of the second punching unit L2 is used for the punching process in place of the deteriorated die 336.

[0125] That is, in this modified example, the component supply unit 33 includes a first punching unit L1 and a second punching unit L2 different from the first punching unit L1. The first punching unit L1 performs a punching process using a metal mold 336 as a first metal mold. When it is determined that the first metal mold is deteriorated, the control unit 331 causes the second punching unit L2 to perform a punching process using a second metal mold different from the first metal mold. As a result, when the first metal mold is deteriorated, the punching unit performing the punching process is switched from the first punching unit L1 using the first metal mold to the second punching unit L2 using the second metal mold. Therefore, even if the first metal mold is deteriorated, it is possible to continue supplying high-quality components 5. In addition, while the punching process is being performed by the second punching unit L2, maintenance of the first metal mold can be performed.

[0126] Of the two supply reels 33a, the punching process for the supply reel 33a on the positive side (i.e., the right side) in the X-axis direction is performed in the same manner as the punching process for the left supply reel 33a. That is, the component supply unit 33 includes two punching units 33b that perform a punching process on the tape material 200 unwound from the right supply reel 33a of the two supply reels 33a. One of the two punching units 33b is a first punching unit R1, and the other is a second punching unit R2. The first punching unit R1 is disposed so as to be capable of performing the punching process, and the second punching unit R2 is disposed as a backup. When it is determined that the die 336 of the first punching unit R1 has deteriorated, the second punching unit R2 is disposed so as to be capable of performing the punching process, instead of the first punching unit R1. As a result, the deteriorated die 336 in the first punching section R1 is not used for the punching process, and the non-deteriorated die 336 in the second punching section R2 is used for the punching process in place of the deteriorated die 336.

[0127] Here, in the above example, the first punching units L1 and R1 are replaced with the second punching units L2 and R2, respectively. At this time, the first punching unit L1 and the second punching unit L2 may move, and the passage path of the tape material 200 unwound from the left supply reel 33a may be changed. Similarly, the first punching unit R1 and the second punching unit R2 may move, and the passage path of the tape material 200 unwound from the right supply reel 33a may be changed.

[0128] In the example shown in FIG. 11, the spare second punching units L2 and R2 are provided in the component supply unit 33. However, the second punching units L2 and R2 may not be provided, and the punching unit 33b performing the punching process may be switched between the first punching unit L1 on the left side and the first punching unit R1 on the right side. For example, when it is determined that the die 336 of the first punching unit L1 on the left side is deteriorated, the first punching unit R1 on the right side performs the punching process on the left supply reel 33a instead of the first punching unit L1 on the left side. In this case, the first punching unit R1 on the right side moves to the left, or the left supply reel 33a moves to the right, and the first punching unit R1 performs the punching process on the left supply reel 33a. Alternatively, the passage path of the tape material 200 unwound from the left supply reel 33a may be changed.

[0129] In the example shown in FIG. 11, the entire punching unit 33b is switched, but only the die 336 of the punching unit 33b may be switched. That is, the component supply unit 33 includes a first die, which is the die 336, and a second die different from the first die. When it is determined that the first die is deteriorated, the control unit 331 causes the punching unit 33b to perform a punching process using the second die. As a result, the die 336 used in the punching process is switched from the first die to the second die. That is, when the first die is deteriorated, the die used in the punching process is switched from the first die to the second die. Therefore, even if the first die is deteriorated, it is possible to continue supplying high-quality components 5. The first die and the second die may be provided in one punching unit 33b. Alternatively, the second die may be disposed outside the punching unit 33b. In this case, each of the left and right punching sections 33b may have a first die and share the second die.

[0130] Although the component supply device and the component supply method according to one or more aspects have been described based on the above embodiment and its modified examples, the present disclosure is not limited to the above embodiment and its modified examples. As long as it does not deviate from the gist of the present disclosure, various modifications conceived by a person skilled in the art to the above embodiment and its modified examples, and forms constructed by combining the components of the above embodiment and its modified examples may also be included within the scope of the present disclosure.

[0131] For example, in the above embodiment and its modified examples, substrate 3 is a liquid crystal panel to which component 5 is temporarily and permanently pressure-bonded, but substrate 3 may be a substrate other than a liquid crystal panel.

[0132] Moreover, the bristles of the brush 334a of the cleaning portion 334 in the above embodiment may be made of resin molding, fiber, or wire.

[0133] In the above embodiment and its modified examples, all or part of the components such as the control unit 331 may be configured with dedicated hardware, or may be realized by executing a software program suitable for the components. The control unit 331 may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the component supply unit 33 to execute each step shown in Figs. 8 to 10.

[0134] The control unit 331 may also be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC) or a large scale integration (LSI). The IC or LSI may be integrated into one chip or into multiple chips. Here, the IC or LSI is referred to as an IC or an LSI, but the name may change depending on the degree of integration, and may be called a system LSI, a very large scale integration (VLSI), or an ultra large scale integration (ULSI). Also, a field programmable gate array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose. [Industrial Applicability]

[0135] The present disclosure can be used, for example, in a component supplying device provided in a component mounting line that produces liquid crystal displays. [Explanation of symbols]

[0136] 1. Component mounting line 3. Substrate 4 Electrode section 5 parts 5a electrode 10. Board loading section Stages 11, 23, 37, 49, 51 20 Adhesive part 21, 31, 41 Substrate moving mechanism 30 Temporary crimping section 30a Main part 32 Parts mounting mechanism 33 Parts supply section (parts supply device) 33a Supply reel 33a1 Cover tape collection section 33a2 Winding section 33b Punching section 33c Movable stage 33d Rail 34 Crimping tool 35 Parts Transfer Section 35a Transfer rail 35b Transfer head 35c Transfer stage 36 Backup Department 40 Crimping section 50 Substrate removal section 60 Conveyor 200 Tape material 203 Sprocket Hole 204 Cover Tape 331 Control Unit 333 Measuring section 333a Piezoelectric element 333b Particle Sensor 334 Cleaning Department 334a Brush 334b Ultrasonic generator 335 Transfer section 336 Molds 336a Punch 336b Die 337 Motor 338 Sprocket L1, R1 First punching section L2, R2 Second punching section

Claims

1. a punching unit that uses a die to perform a punching process for punching out the electronic components from a tape member having the electronic components incorporated therein; A measurement unit for measuring a measurement value related to the punching process; A control unit that changes cleaning conditions based on the measured value; a cleaning unit that cleans the electronic component punched by the punching process in accordance with the cleaning conditions; A part supply device comprising:

2. The measured value is a stress applied to the die when the electronic component is punched out of the tape material by the die. The component supply device according to claim 1 .

3. The measurement unit includes a piezoelectric element.

3. The component supply device according to claim 2.

4. The measurement value is the number of particles scattered when the electronic component is punched out of the tape member by the die. The component supply device according to claim 1 .

5. the measurement unit includes a particle sensor that measures the number of the particles scattered around at least one of the mold and the electronic component; 5. The component supply device according to claim 4.

6. the cleaning portion includes a brush that cleans the electronic component by contacting and sliding against the electronic component, The cleaning conditions include at least one of a pressure at which the brush contacts the electronic component, a relative speed at which the brush slides against the electronic component, and a time required for cleaning. The component supply device according to any one of claims 1 to 5.

7. the cleaning unit includes an ultrasonic generating unit that applies ultrasonic waves to the electronic component to clean the electronic component, The cleaning conditions include at least one of an output of the ultrasonic wave and a time required for cleaning. The component supply device according to any one of claims 1 to 5.

8. The control unit is determining whether or not the mold has deteriorated based on the measurement value, and notifying the user of the need for maintenance of the mold when it is determined that the mold has deteriorated; The component supply device according to claim 1 .

9. The control unit is Determining whether the mold is deteriorated or not based on the number of times the abnormality occurs; The abnormality is an event in which the measurement value does not fall within a predetermined range.

9. The component supply device according to claim 8.

10. The component supply device includes: The mold includes a first mold, which is the mold, and a second mold different from the first mold, The control unit is When it is determined that the first die is deteriorated, the punching unit performs the punching process using the second die.

10. The component supplying device according to claim 8 or 9.

11. The component supply device includes: A second punching portion different from the first punching portion, The first punching unit performs the punching process by using the die as a first die, The control unit is When it is determined that the first die is deteriorated, the second punching unit performs the punching process using a second die different from the first die.

10. The component supplying device according to claim 8 or 9.

12. A punching process is performed using a die to punch out the electronic components from the tape member having the electronic components incorporated therein; measuring measurements related to the punching process; Based on the measured value, the cleaning conditions are changed; cleaning the electronic component punched out by the punching process according to the cleaning conditions; Parts supply method.

Images