Apparatus including a substrate chuck, a dispenser and a planarizing head, and a method for using same - Patents.com

Abstract

The apparatus includes a first substrate chuck configured to hold a first substrate, a second substrate chuck configured to hold a second substrate, and a dispenser configured to dispense a formable material onto the first substrate while the first substrate is on the first substrate chuck and to dispense the formable material onto the second substrate while the second substrate is on the second substrate chuck. A method of forming a planarization layer on a substrate can use the apparatus. A method of manufacturing an article can include the method of forming the planarization layer.

Description

[Technical field]

[0001] The present invention relates to an apparatus, a method for using the same, and a method for manufacturing an article. [Background technology]

[0002] Fluid deposition techniques are useful for fabricating electronic devices on semiconductor wafers. Such techniques can include the use of a fluid dispensing system to dispense a formable material onto the wafer. A superstrate planarizes the dispensed material before it solidifies on the wafer. Planarization techniques are useful for fabricating semiconductor devices. For example, a process for fabricating semiconductor devices includes repeatedly adding and removing material from a substrate. This process produces a layered substrate with irregular height variations (i.e., topography), and as more layers are added, the substrate height variations increase. The height variations adversely affect the ability to add further layers to the layered substrate. Apart from that, the semiconductor substrate (e.g., silicon wafer) itself is not necessarily perfectly flat, but includes initial surface height variations (i.e., topography). One way to address this issue is to planarize the substrate during the lamination step.

[0003] A planarization technique, sometimes referred to as inkjet-based adaptive planarization (IAP), involves dispensing a variable drop pattern of polymerizable material between a substrate and a superstrate, where the drop pattern varies depending on the substrate topography, and the superstrate is then contacted with the polymerizable material, after which the material is polymerized on the substrate and the superstrate is removed.

[0004] However, if the collimated light is deflected by the superstrate chuck before it reaches the polymerizable material, defects can occur. Therefore, improvements in fluid handling techniques are desired to enable whole wafer processing. Summary of the Invention [Means for solving the problem]

[0005] In one aspect, an apparatus is disclosed that includes a first substrate chuck configured to hold a first substrate, a second substrate chuck configured to hold a second substrate, and a dispenser configured to dispense a formable material onto the first substrate while the first substrate is on the first substrate chuck and to dispense the formable material onto the second substrate while the second substrate is on the second substrate chuck.

[0006] In an embodiment, the apparatus further includes a first planarizing head configured to planarize the moldable material on the first substrate while the first substrate is placed on the first substrate chuck, and a second planarizing head configured to planarize the moldable material on the second substrate while the second substrate is placed on the second substrate chuck.

[0007] In certain embodiments, the apparatus further includes a load station, the dispenser being part of a dispensing station, the dispensing station being disposed between the load station and the first planarizing head in a top view.

[0008] In another specific embodiment, the dispenser is part of a dispensing station and the first planarizing head is disposed between the load station and the dispensing station in a top view.

[0009] In a further embodiment, the apparatus further comprises a dispenser conveyor coupled to the dispenser, wherein the first substrate chuck is configured to move along a first axis, the second substrate chuck is configured to move along a second axis, and the dispenser conveyor is configured to move the dispenser along a third axis distinct from each of the first axis and the second axis.

[0010] In another embodiment, the apparatus further comprises a first substrate stage coupled to the first substrate chuck and configured to move the first substrate from a first substrate position to a second substrate position, and a second substrate stage coupled to the second substrate chuck and configured to move the second substrate from a third substrate position to a fourth substrate position.

[0011] In certain embodiments, the apparatus further comprises a dispenser conveyor coupled to the dispenser, the first substrate stage configured to move the first substrate chuck along a first axis, the second substrate stage configured to move the second substrate chuck along a second axis, and the dispenser conveyor configured to move the dispenser along a third axis distinct from each of the first axis and the second axis.

[0012] In a more particular embodiment, the third axis is within 1 degree of orthogonal to the first axis or the second axis.

[0013] In another specific embodiment, the first substrate chuck is configured to move while dispensing and the dispenser is configured to remain stationary while dispensing.

[0014] In a further specific embodiment, the first substrate chuck is configured to remain stationary while dispensing and the dispenser is configured to move while dispensing.

[0015] In another embodiment, the dispenser has a length and a width, the length being greater than the width, and the length being oriented along a fourth axis.

[0016] In certain embodiments, the fourth axis is within 1 degree of orthogonal to the first axis or the second axis.

[0017] In another specific embodiment, the fourth axis is within 1 degree parallel to the first axis or the second axis.

[0018] In a further embodiment, the dispenser comprises multiple dispensing heads.

[0019] In another embodiment, the apparatus further comprises a substrate conveyor configured to move the first substrate over and remove the first substrate from the first substrate chuck, and to move the second substrate over and remove the second substrate from the second substrate chuck.

[0020] In another aspect, a method of forming a planarization layer is disclosed. The method includes placing a first substrate on a first substrate chuck, dispensing a formable material onto the first substrate while the first substrate is on the first substrate chuck, contacting the formable material with a first superstrate while the formable material is on the first substrate and the first substrate is on the first substrate chuck, curing the formable material on the first substrate to form a first planarization layer, placing a second substrate on a second substrate chuck, dispensing the formable material onto the second substrate while the second substrate is on the second substrate chuck, contacting the formable material with a second superstrate while the formable material is on the second substrate and the second substrate is on the second substrate chuck, and curing the formable material on the second substrate to form a second planarization layer, wherein dispensing the formable material onto the first substrate and dispensing the formable material onto the second substrate are performed using the same dispenser.

[0021] In an embodiment, the method further includes moving the first substrate from a first dispensing station to a first planarizing station along a first axis, moving the second substrate from a second dispensing station to a second planarizing station along a second axis, and moving the dispenser from the first dispensing station to the second dispensing station along a third axis.

[0022] In certain embodiments, the third axis is within 1 degree of orthogonal to the first axis or the second axis.

[0023] In another embodiment, curing the moldable material on the first substrate comprises exposing the moldable material to actinic radiation while the moldable material is in contact with the first substrate and the first superstrate and the first substrate is on the first substrate chuck, the method further comprising separating the first superstrate from the moldable material after exposing the moldable material to the actinic radiation.

[0024] In further embodiments, the first substrate moves and the dispenser remains stationary, or the dispenser moves and the first substrate remains stationary, while dispensing the moldable material onto the first substrate.

[0025] In a further aspect, a method of manufacturing an article is disclosed, comprising forming a first planarization layer on a first substrate using the method of claim 15, and processing the first substrate to complete the formation of the article.

[0026] The method includes placing a substrate on a substrate chuck, dispensing a formable material onto the substrate while the substrate is on the substrate chuck, contacting the formable material with a superstrate while the formable material is on the substrate and the substrate is on the substrate chuck, and processing the substrate to complete formation of the article. [Brief description of the drawings]

[0027] Embodiments are illustrated by way of example and not limitation in the accompanying figures. [Figure 1] FIG. 1 includes an illustration of a top view of an apparatus in accordance with an embodiment. [Diagram 2]FIG. 2 includes a top view illustration of an apparatus in another embodiment. [Diagram 3] FIG. 3 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Figure 4] FIG. 4 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Diagram 5] FIG. 5 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Figure 6] FIG. 6 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Figure 7] FIG. 7 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Figure 8] FIG. 8 includes a top view of a lane including a substrate, a substrate chuck, and a dispenser. [Figure 9] FIG. 9 includes a flow diagram of a method for manufacturing an article using an apparatus in an embodiment. [Figure 10] FIG. 10 includes an illustration of a cross-sectional view of a portion of a workpiece during a formable material dispensing operation. [Figure 11] FIG. 11 includes an illustration of a cross-sectional view of the workpiece of FIG. 10 during a planarization operation with a superstrate. [Figure 12] FIG. 12 includes an illustration of a cross-sectional view of the workpiece of FIG. 11 during exposure of the formable material to actinic radiation. [Figure 13] FIG. 13 includes an illustration of a cross-sectional view of the workpiece of FIG. 12 after the superstrate has been removed. [Figure 14] FIG. 14 includes an illustration of a cross-sectional view of a portion of a workpiece including a substrate, a layer, and a formable material. [Figure 15] FIG. 15 includes an illustration of a cross-sectional view of the workpiece of FIG. 14 during a patterning operation with a patterned mold. [Figure 16]FIG. 16 includes an illustration of a cross-sectional view of the workpiece of FIG. 15 during a patterning operation with a patterned mold to form a patterned layer from a moldable material. [Figure 17] FIG. 17 includes an illustration of a cross-sectional view of the workpiece of FIG. 16 after the patterned mold has been removed. [Figure 18] FIG. 18 includes an illustration of a cross-sectional view of the workpiece of FIG. 17 after etching the layers to define openings extending through the layers. [Figure 19] Figure 19 includes an illustration of a cross-sectional view of the workpiece of Figure 18 after removing a patterned layer of formable material. Those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help understand embodiments of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] The following description in combination with the drawings is provided to aid in understanding the teachings disclosed herein. The following discussion focuses on specific implementations and embodiments of the teachings. This focus is provided to help explain the teachings and should not be construed as limiting the scope or applicability of the teachings.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The materials, methods, and examples are illustrative only and are not intended to be limiting. Unless described herein, many details regarding specific materials and processing acts are conventional and can be found in textbooks and other sources in the art.

[0030] The apparatus has a configuration that allows for higher throughput compared to conventional apparatus. Such an apparatus is configured to dispense formable material and contact the formable material with the superstrate while the substrate is on the substrate chuck. In this manner, no registration step is required between the dispensing and planarizing operations. Such an apparatus occupies a relatively small area compared to conventional apparatus. Thus, valuable manufacturing space can be used for other equipment or tools.

[0031] 1 includes a top view of an apparatus 100 that can be used to form a planarization layer on a substrate. As shown, the X and Y directions are along the surface of the drawing sheet, and the Z direction is in and out of the drawing sheet.

[0032] As shown in FIG. 1, the apparatus 100 includes an Equipment Front End Module (EFEM) 120, a dispensing station 150, and a flattening station 170.

[0033] The EFEM 120 includes substrate containers 122, each of which holds one or more substrates. More or fewer substrate containers 122 may be used with the EFEM 120. The substrate containers 122 may be wafer cassettes or, in more specific embodiments, may be Front Opening Universal Pods (FOUPs).

[0034] The EFEM 120 further includes a processing station 124 that is used before or after the planarization layer is formed on the substrate. The processing station 124 can be configured to clean the substrate in place or in conjunction with heating or cooling the substrate. In an embodiment, the EFEM 120 includes multiple processing stations 124, one of the processing stations 124 configured to heat or cool the substrate and another processing station 124 configured to clean the substrate. Many other combinations of processing stations can be used. In any of the foregoing embodiments, any particular processing station 124 can be configured to clean the substrate for a period of time and heat or cool the same or another substrate for a different period of time. For example, one of the processing stations 124 cleans the substrate before the formable material is formed on the substrate and another processing station 124 heats the substrate after the formable material is exposed to actinic radiation to bake the formable material. The apparatus 100 can have more or fewer processing stations 124. The processing stations 124 are illustrated as part of the apparatus 100. In another embodiment, one or both of the processing stations 124 may be part of a different device. One skilled in the art can determine whether the apparatus 100 has any processing stations 124, the number of processing stations 124, the functionality provided by the processing stations 124, and the location of the processing stations 124 within the apparatus 100 to meet the needs or desires of a particular application.

[0035] The EFEM 120 includes an alignment station 126 configured to measure the position of the substrate. In an embodiment, the alignment station 126 can rotate the substrate and measure a notch along the periphery of the substrate. This alignment is used to properly orient the substrate on the chuck. Once the substrate is placed on the chuck prior to dispensing, registration is required. This registration helps ensure that the formable material is dispensed and planarized at the proper areal density on the substrate to achieve a properly formed planarized layer.

[0036] The EFEM 120 includes a substrate transfer station 130 (shown in dashed lines) configured to move a substrate within or from the EFEM 120 to a substrate chuck 162 that may be located at either the dispensing station 150 or the planarization station 170. The substrate transfer station 130 includes a substrate conveyor 132 that moves the substrate translationally (XY directions), vertically (Z directions), and / or rotationally (Oz directions) by manipulating a substrate handler 134. In an embodiment, the substrate transfer station 130 may obtain a substrate from the alignment station 126 and place the substrate on one of the substrate chucks 162 using translational, vertical, or rotational motion, or a combination of such motions.

[0037] Each of the substrate chucks 162 is coupled to a substrate stage 164 configured to enable the corresponding substrate chuck 162 to move between the dispensing station 150 and at least one of the planarization stations 170. In an embodiment, each substrate chuck 162 is associated with one of the planarization stations 170, while in another embodiment, the substrate chuck 162 may be used with at least two different planarization stations 170.

[0038] The EFEM 120 further includes a controller 140. The controller 140 controls the operation of the apparatus 100, including the operations performed at the EFEM 120, the dispense station 150, and the planarization station 170. In another embodiment, the controller 140 may be located within or near the dispense station 150 or the planarization station 170. In another embodiment, more than one controller may be used. For example, each of the EFEM 120, the dispense station 150, and the planarization station 170 includes a controller. In the same or different embodiments, any one or more of the EFEM 120, the dispense station 150, and the planarization station 170 may have more than one controller. In an embodiment, a controller may control each or a combination of the processing station 124, the alignment station 126, or the substrate transfer station 130. In the same or different embodiments, within the dispense station 150, one controller may control the dispenser 152 and a different controller may control the dispenser conveyor 154. After reading this specification, one of ordinary skill in the art will understand that the location and number of controllers may be selected to meet the needs or desires of a particular application.

[0039] The dispensing station 150 includes a dispenser 152 and a dispenser conveyor 154. The dispenser 152 is configured to dispense the formable material onto the substrate. The dispenser 152 is coupled to a supply system (not shown) that supplies the formable material to a dispensing surface of the dispenser 152 from a storage tank (not shown). The storage tank may be internal to the apparatus 100 or external to the apparatus 100. The supply system may include a pump that helps to keep the physical properties of the formable material, the wettability of the dispensing surface of the dispenser, and the pressure inside the dispensing station 150 stable. In an embodiment, the dispensing station 150 may be configured to apply the formable material by a spin coater or a slit coater. In another embodiment, the dispensing station 150 may be configured to apply the formable material using a liquid jetting head, where the formable material is initially in the form of droplets or in the form of islands or a film that coalesces to form a layer of the formable material. An inkjet method may be used to dispense the formable material onto the substrate.

[0040] Each of the planarizing stations 170 includes a planarizing head 172 and is configured to form an exposed planarized surface of the layer of moldable material with a superstrate 174 therein. The superstrate 174 has a surface configured to contact the moldable material during the planarization process. The superstrate 174 is patternless and has a contact surface configured to contact the moldable material. The superstrate 174 occupies an area that is the same as or larger than the area occupied by the substrate. In the same or a different embodiment, the planarizing layer can be formed using as little as one exposure to actinic radiation.

[0041] Apparatus 100 includes lanes 182, 184, and 186 (shown in dashed lines) that include planarizing head 172 and corresponding portions of dispensing station 150. The significance of the lanes will be explained later in this specification with respect to Figures 3-8.

[0042] In Fig. 1, the dispense station 150 is located between the EFEM 120 and the planarization station 170. In Fig. 2, the apparatus 200 has the planarization station 170 located between the EFEM 120 and the dispense station 150. Each apparatus has advantages. For example, the apparatus 100 can have a relatively uncomplicated substrate transfer station 130. The apparatus 200 has lanes 282, 284 and 286 (shown in dashed lines). The dispense station 150 is more easily accessible from one side of the apparatus 200, and such a design allows for relatively easy cleaning and maintenance of the dispense station 150 as compared to the apparatus 100.

[0043] The apparatus described herein is intended for mass production. Thus, the design of the apparatus is influenced by the time that elapses between (1) the time the substrate is removed from the substrate container 122 and (2) the time the substrate with the planarization layer is returned to the same or a different substrate container 122. One or more other considerations also influence the design of the apparatus. The designs of the apparatus 100 and 200 are exemplary and are not intended to limit the invention as defined in the appended claims. Those skilled in the art can determine the design of the apparatus to achieve the needs or desires of a particular application.

[0044] The dispense and planarization operations are described with respect to the lanes as shown in Figures 3-5 for one configuration and as shown in Figures 6-8 for another configuration. Figures 3-5 show an embodiment in which the dispenser 152 remains stationary while the substrate chuck 162 moves during the dispense operation. Figures 6-8 show an embodiment in which the dispenser 152 remains stationary while the substrate chuck 162 moves during the dispense operation.

[0045] The controller 140, dispenser conveyor 154, substrate stage 164, planarization head 172 and superstrate 174 are not shown in Figures 3-8 to simplify understanding of the process within the lane, however such components are referenced below and are present in the apparatus.

[0046] In the embodiment illustrated in Figures 3-8, the dispenser 152 includes multiple dispense heads 156. The formable material is dispensed from the dispense heads 156 onto the substrate when the substrate is on the substrate chuck 162. In Figures 3-8, the substrate stage and substrate chuck 162 are configured to move from a position for a dispense operation to a position for a planarization operation, such movement being illustrated by double-headed arrows in each lane pointing to the top and bottom of Figures 3-8. The dispenser conveyor 154 is configured to move the dispenser 152 from a position in one lane to a position in another lane, such movement being illustrated by double-headed arrows pointing to the left and right of Figures 3-8. Thus, the dispenser 152 is configured to move in a direction perpendicular to the direction in which the substrate and substrate chuck 162 move.

[0047] In FIG. 3 , dispenser 152 is located within lane 312. From a top view, dispenser 152 has a length and a width, where the length is greater than the width. The length of dispenser 152 is oriented along axis 158. Within lane 312, substrate stage 164 is configured to move substrate chuck 162 along axis 318, within lane 412, substrate stage 164 is configured to move substrate chuck 162 along axis 418, and within lane 512, substrate stage 164 is configured to move substrate chuck 162 along axis 518. Ideally, axes 318, 418, and 518 are parallel to each other and orthogonal to axis 158. Due to manufacturing tolerances, axes 318, 418, and 518 may be within 1 degree of being parallel to each other and may be within 1 degree of being orthogonal to axis 158. As used herein, it means + / - 1 degree and does not include the intersection of at least two axes with respect to parallel (effectively 0 degrees), and with respect to orthogonal, includes the intersection of any two axes at an angle in the range of 89 degrees to 91 degrees, including 90 degrees within such range.

[0048] Before a dispensing operation begins, the substrate 302, substrate chuck 162, and substrate stage 164 within lane 312 may be moved, if necessary, from a position closer to the top of FIG. 3 to another position closer to the bottom of FIG. 3. During a dispensing operation within lane 312, substrate stage 164 moves substrate chuck 162 and substrate 302 under dispenser 152, which remains stationary. Moldable material is dispensed onto an exposed surface of substrate 302. In an embodiment, substrate 302 has an exposed surface having one or more protrusions in a relatively elevated localized region compared to another localized region having one or more recesses along the exposed surface. Controller 140 may instruct, or provide a signal to, dispensing station 150 to dispense a lower areal density of moldable material to the relatively elevated localized region compared to the other localized regions.

[0049] After the formable material is dispensed onto substrate 302, substrate stage 164 continues to move substrate 302 and substrate chuck 162 to a position near the top of Figure 3 where a planarization operation is performed. Planarization of the formable material is performed by planarization head 172 and superstrate 174 in lane 312, with the planarization operation performed within lane 312 near the top of Figure 3. After the planarization operation is completed, substrate 302 is removed and substrate 322 is placed on substrate chuck 162, as shown in Figure 4.

[0050] 3 and 4, the dispenser conveyor moves the dispenser 152 from a position within lane 312 to a position within lane 412. Before a dispensing operation begins, the substrate 402, substrate chuck 162, and substrate stage 164 within lane 412 can be moved, if necessary, from a position closer to the top of FIG. 4 to another position closer to the bottom of FIG. 4. During a dispensing operation within lane 412, the substrate stage 164 moves the substrate chuck 162 and substrate 402 under the dispenser 152, which remains stationary. The formable material is dispensed onto an exposed surface of the substrate 402. In an embodiment, the substrate 402 has an exposed surface that has one or more protrusions in localized regions that are relatively higher compared to other localized regions that have one or more recesses along the exposed surface. Controller 140 can instruct or provide a signal to dispensing station 150 to dispense a lower areal density of moldable material to localized areas that are located at relatively higher elevations compared to other localized areas.

[0051] After the moldable material is dispensed onto the substrate 402, the substrate stage 164 continues to move the substrate 402 and the substrate chuck 162 to a position near the top of FIG. 4 where a planarization operation is performed. Planarization of the moldable material is performed by the planarization head 172 and the superstrate 174 in the lane 412, the planarization operation being performed within the lane 412 near the top of FIG. 4. The planarization may be performed to form a planarization layer, as described later in this specification. After the planarization operation is completed, the substrate 402 is removed and a substrate 422 is placed on the substrate chuck 162, as shown in FIG. 5.

[0052] 4 and 5, the dispenser conveyor moves the dispenser 152 from a position within the lane 412 to a position within the lane 512. Before a dispensing operation begins, the substrate 502, substrate chuck 162, and substrate stage 164 within the lane 512 can be moved, if necessary, from a position closer to the top of FIG. 5 to another position closer to the bottom of FIG. 5. During a dispensing operation within the lane 512, the substrate stage 164 moves the substrate chuck 162 and substrate 502 under the dispenser 152, which remains stationary. The formable material is dispensed onto an exposed surface of the substrate 502. In an embodiment, the substrate 502 has an exposed surface that has one or more protrusions in localized regions that are relatively higher compared to other localized regions that have one or more recesses along the exposed surface. Controller 140 can instruct or provide a signal to dispensing station 150 to dispense a lower areal density of moldable material to localized areas that are located at relatively higher elevations compared to other localized areas.

[0053] After the formable material is dispensed onto the substrate 502, the substrate stage 164 continues to move the substrate 502 and the substrate chuck 162 to a position near the top of FIG. 5 where a planarization operation is performed. Planarization of the formable material is performed by the planarization head 172 and the superstrate 174 in the lane 512, the planarization operation being performed within the lane 512 near the top of FIG. 5. Planarization may be performed to form a planarization layer, as described later in this specification. After the planarization operation is completed, the substrate 502 is removed and another substrate (not shown in FIG. 5) is placed on the substrate chuck 162.

[0054] In FIG. 6 , dispenser 152 is located within lane 612. From a top view, dispenser 152 has a length and a width, where the length is greater than the width. The length of dispenser 152 is oriented along axis 159. Within lane 612, substrate stage 164 is configured to move substrate chuck 162 along axis 618, within lane 712, substrate stage 164 is configured to move substrate chuck 162 along axis 718, and within lane 812, substrate stage 164 is configured to move substrate chuck 162 along axis 818. Ideally, axes 618, 718, and 818 are parallel to each other and orthogonal to axis 159. Due to manufacturing tolerances, axes 159, 618, 718, and 818 may be within 1 degree of being parallel to each other.

[0055] Before a dispensing operation begins, the substrate 602, substrate chuck 162, and substrate stage 164 within lane 612 may be moved, if necessary, from a position closer to the top of FIG. 6 to another position closer to the bottom of FIG. 6. During a dispensing operation within lane 612, the dispenser conveyor moves the dispenser 152 over the substrate 602, while the substrate stage 164, substrate chuck 162, and substrate 602 remain stationary. Moldable material is dispensed onto an exposed surface of the substrate 602. In an embodiment, the substrate 602 has an exposed surface that has one or more protrusions in a localized region that is relatively higher than another localized region that has one or more recesses along the exposed surface. The controller 140 may instruct or provide a signal to the dispensing station 150 to dispense a lower areal density of moldable material to the relatively higher localized region compared to the other localized regions.

[0056] After the formable material is dispensed onto the substrate 602, the substrate stage 164 moves the substrate 602 and the substrate chuck 162 to a position near the top of FIG. 6 where a planarization operation is performed. Planarization of the formable material is performed by the planarization head 172 and the superstrate 174 in the lane 612, the planarization operation being performed within the lane 612 near the top of FIG. 6. The planarization may be performed to form a planarization layer, as described later in this specification. After the planarization operation is completed, the substrate 602 is removed and a substrate 622 is placed on the substrate chuck 162, as shown in FIG. 7.

[0057] 6 and 7, the dispenser conveyor moves the dispenser 152 from a position within lane 612 to a position within lane 712. Before a dispensing operation begins, the substrate 702, substrate chuck 162, and substrate stage 164 within lane 712 may be moved, if necessary, from a position closer to the top of FIG. 7 to another position closer to the bottom of FIG. 7. During a dispensing operation within lane 712, the dispenser conveyor moves the dispenser 152 over the substrate 702 while the substrate stage 164, substrate chuck 162, and substrate 702 remain stationary. The formable material is dispensed onto an exposed surface of the substrate 702. In an embodiment, the substrate 702 has an exposed surface that has one or more protrusions in localized regions that are relatively higher compared to other localized regions that have one or more recesses along the exposed surface. Controller 140 can instruct or provide a signal to dispensing station 150 to dispense a lower areal density of moldable material to localized areas that are located at relatively higher elevations compared to other localized areas.

[0058] After the formable material is dispensed onto the substrate 702, the substrate stage 164 moves the substrate 702 and the substrate chuck 162 to a position near the top of FIG. 7 where a planarization operation is performed. Planarization of the formable material is performed by the planarization head 172 and the superstrate 174 in lane 712, the planarization operation being performed within lane 712 near the top of FIG. 7. Planarization may be performed to form a planarization layer, as described later in this specification. After the planarization operation is completed, the substrate 702 is removed and a substrate 722 is placed on the substrate chuck 162, as shown in FIG.

[0059] 7 and 8, the dispenser conveyor moves the dispenser 152 from a position within lane 712 to a position within lane 812. Before a dispensing operation begins, the substrate 802, substrate chuck 162, and substrate stage 164 within lane 812 may be moved, if necessary, from a position closer to the top of FIG. 8 to another position closer to the bottom of FIG. 8. During a dispensing operation within lane 812, the dispenser conveyor 154 moves the dispenser 152 over the substrate 802 while the substrate stage 164, substrate chuck 162, and substrate 802 remain stationary. The formable material is dispensed onto an exposed surface of the substrate 802. In an embodiment, the substrate 802 has an exposed surface that has one or more protrusions in localized regions that are relatively higher compared to other localized regions that have one or more recesses along the exposed surface. Controller 140 can instruct or provide a signal to dispensing station 150 to dispense a lower areal density of moldable material to localized areas that are located at relatively higher elevations compared to other localized areas.

[0060] After the moldable material is dispensed onto the substrate 802, the substrate stage 164 moves the substrate 802 and the substrate chuck 162 to a position near the top of FIG 8 where a planarization operation is performed. The planarization of the moldable material is performed by the planarization head 172 and the superstrate 174 in lane 812, the planarization operation being performed within lane 812 at a position near the top of FIG 8. Planarization may be performed to form a planarization layer, as described later in this specification. After the planarization operation is completed, substrate 802 is removed and another substrate (not shown in FIG. 8) is placed on substrate chuck 162.

[0061] In Figures 3-8, substrates are shown on all substrate chucks. In fact, when the formable material is dispensed onto a particular substrate within a particular lane, the substrate may or may not be on the substrate chuck 162 in other lanes. The movement and processing of the substrates may be performed to have the highest sustainable machine throughput to achieve high volume production. In further embodiments, each lane may have its own dispenser so that each lane can operate independently from the other lanes. Those skilled in the art will be able to evaluate the complexity of the apparatus and its impact on the throughput of the apparatus and design the apparatus to achieve the needs or desires of a particular application.

[0062] The advantages of the device become even more apparent when considered in terms of planarization operations.

[0063] Figure 9 includes a flow diagram of a process that can be used with any of the apparatus described herein. The process in Figure 9 is described with respect to the apparatus 200 shown in Figure 2 and the dispense and flattening configuration of Figure 3. Such a process is also applicable to the apparatus 100 in Figure 1 and the dispense and flattening configurations in Figures 4-8.

[0064] 9, the process includes removing the substrate from the substrate container. The substrate 302 may be glass, ceramic, metal, semiconductor, resin, etc. In certain embodiments, the substrate 302 includes a silicon wafer, a compound semiconductor wafer, silica glass, etc. Referring to FIGS. 2 and 3, the substrate conveyor 132 moves the substrate handler 134 to the substrate container 122 and removes the substrate 302 from the substrate container 122.

[0065] At block 924, the process includes cleaning the substrate. The cleaning operation is optional since the substrate 302 only needs to be sufficiently clean. If the processing station 124 is configured to clean the substrate, the substrate conveyor 132 moves the substrate handler 134 with the substrate 302 to the processing station 124. The cleaning is performed while the substrate 302 is inside the processing station 124. In another embodiment, the cleaning operation can be performed before the substrate container 122 with the substrate 302 is placed in the apparatus 200. In this embodiment, if a cleaning operation is performed, the cleaning operation is performed before the substrate is removed at block 922 of FIG. 9 .

[0066] At block 926, the process includes aligning with the notch in the substrate. The substrate conveyor 132 moves the substrate handler 134 with the substrate 302 to the alignment station 126. The alignment station 126 rotates the substrate 302 and measures the notch along the periphery of the substrate 302. This alignment allows for proper dispensing and planarizing operations described later in the process. The alignment helps ensure that the formable material is dispensed and planarized at the proper areal density on the substrate to achieve a properly formed planarized layer.

[0067] The process includes placing the substrate on the substrate chuck at block 928, and registering the pattern on the substrate or to the substrate chuck at block 930. Referring to Figures 2 and 3, the substrate conveyor 132 of the substrate transfer station 130 moves the substrate handler 134 with the substrate 302 from the alignment station 126 to the substrate chuck 162 in the lane 312. Within the lane 312, the substrate stage 164 is configured to move the substrate chuck 162 and the substrate 302 from the planarization head 172 to a corresponding portion within the dispensing station 150. When the substrate 302 is placed on the substrate chuck 162, the substrate chuck 162 and the substrate stage 164 are near the top of Figure 3.

[0068] 9, the process further includes moving the substrate and substrate chuck to the dispense station. The substrate stage 164 moves the substrate 302 and substrate chuck 162 to the dispense station 150 if the substrate stage 164 is not already inside the dispense station 150. Referring to FIG. 2, the planarization station 170 is disposed between the EFEM 120 and the dispense station 150. In this embodiment, if the substrate 302 is not in a proper position for the dispense operation, the substrate stage 164 moves the substrate chuck 162 and substrate 302 to a position near the bottom of FIG.

[0069] In block 944 in Figure 9, the process includes dispensing a formable material while the substrate is on the substrate chuck. With reference to Figures 2, 3 and 10, a formable material 1002 moves under dispenser 152 as it is dispensed onto substrate 302.

[0070] The moldable material 1002 can be cured by a curing energy. The manufacturer of the moldable material 1002 will provide information regarding the particular type of energy to be used with the moldable material 1002. The curing energy can include heat or actinic radiation having a wavelength ranging from 10 nm to 1000 nm. In an embodiment, the actinic radiation is ultraviolet, visible, or infrared. In the same or a different embodiment, the moldable material 1002 includes a polymerizable compound and a photoinitiator. The moldable material 1002 may or may not include a non-polymerizable compound or a solvent. The non-polymerizable compound can include a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, or a combination thereof.

[0071] Along the exposed surface of substrate 302 are protrusions 3022 and recesses 3024 . Where protrusions 3022 occupy a relatively large portion of a localized area, a lower areal density of moldable material 1002 is dispensed, and where recesses 3024 occupy a relatively large portion of a different localized area, a higher areal density of moldable material 1002 is dispensed. In reality, the exposed surface of substrate 302 is much more complex than shown in Figure 10 and is not limited to only two heights. The exposed surface of substrate 302 in Figure 10 has been simplified to aid in understanding the concepts described herein.

[0072] As shown in Figure 3, the substrate stage 164 moves the substrate chuck 162 and the substrate 302 while dispensing onto the substrate 302, and the dispenser 152 remains stationary. As shown in Figure 6, in another embodiment, the dispenser conveyor 154 moves the dispenser 152 while the substrate stage 164 remains stationary when dispensing the formable material onto the substrate 302.

[0073] At block 962 in Figure 9, the process further includes moving the substrate and substrate chuck to a planarization station. Referring to Figure 3, the substrate stage 164 moves the substrate chuck 162 and substrate 302 to a position near the bottom of Figure 3. Referring to Figures 2 and 3, the movement continues until the substrate 302 and substrate chuck 162 are in a proper position for planarization under the planarization head 172. If necessary or desired, the dispenser 152 can be moved to a different lane, such as lane 412 or 512, before, during, or after the substrate stage 164 has completed moving the substrate chuck 162 and substrate 302 to the planarization section in lane 312.

[0074] In block 964 in Figure 9, the process includes planarizing the moldable material while the substrate is on the substrate chuck. Referring to Figure 11, the superstrate 1122 is lowered until it contacts the moldable material 1002. The superstrate 1122 causes the moldable material 1002 to flow along the exposed surface of the substrate 302.

[0075] Because substrate 302 remains on the substrate chuck between the dispensing and planarizing operations, no registration operation is required between dispensing moldable material and planarizing moldable material 1002. Thus, higher throughput and higher yields (due at least in part to less substrate handling) may be achieved with the apparatus in Figure 2, and also with apparatus 100 in Figure 1.

[0076] After superstrate 1112 reaches its desired location, actinic radiation 1212 is used to expose the moldable material to polymerize it to form planarization layer 1202 having an upper surface 1222 as shown in Figure 12. In the embodiment illustrated in Figure 13, superstrate 1122 is removed.

[0077] 9, the process further includes baking the moldable material after planarization. The substrate conveyor 132 operates the substrate handler 134 of the substrate transfer station 130 to move the substrate 302 from the substrate chuck 162 to one of the processing stations 124. The substrate 302 is baked to reduce the amount of solvent in the planarization layer 1202 and to further polymerize the planarization layer 1202. The baking operation is also performed for shrinkage and strain relief of the planarization layer 1202. The baking operation is optional and may be performed outside the apparatus 100 or 200.

[0078] 9, the process includes returning the substrate to the substrate container. The substrate conveyor 132 operates the substrate handler 134 of the substrate transfer station 130 to move the substrate 302 from the processing station 124 to the substrate container 122.

[0079] Many of the processes have been described with respect to the apparatus 200 in FIG. 2 and the dispense and planarization operations with respect to FIG. 3. The processes for substrates 402 and 502 can have staggered start times to allow for higher throughput compared to performing all processes for substrate 302 before starting processes for substrate 402 or 502. For example, the process for substrate 402 can begin after substrate 302 is placed on substrate chuck 162. The dispense and planarization operations of apparatus 100 in FIG. 1 or FIGS. 6-8 may be used in place of the dispense and planarization operations of apparatus 200 or FIGS. 3-5. After reading this specification, one of ordinary skill in the art can design an apparatus and process flow to meet the needs or desires of a particular application consistent with the teachings disclosed herein.

[0080] The planarization process can be integrated as part of a manufacturing process to produce articles such as electrical circuit elements, optical elements, microelectromechanical systems (MEMS), recording elements, sensors, molds, etc. Electrical circuit elements include semiconductor memories such as dynamic random access memories (DRAMs), static random access memories (SRAMs), flash memories, magnetoresistive memories (MRAMs), microprocessors, microcontrollers, graphics processing units (GPUs), digital signal processors, field programmable gate arrays (FPGAs) or semiconductor elements, power transistors, charge coupled devices (CCDs), image sensors, etc. During manufacturing, a patterned masking layer is used to selectively etch or dope the substrate or a layer overlying the substrate.

[0081] The following description is directed to selectively patterning a layer overlying a substrate as illustrated in Figures 14-19. Apparatus 100 and 200 can be modified to pattern a layer of a formable material. Planarization station 170 with planarization head 172 can be a patterning station with a patterning head. Superstrate 174 is replaced with a patterned mold. The process associated with Figures 14-19 is described with respect to apparatus 200 in Figure 2 and with respect to the dispense and planarization operations associated with lane 312 in Figure 3, except that substrate 302 is replaced with a workpiece including substrate 1402 and layer 1422 overlying substrate 1402, and superstrate 174 is replaced with a patterned mold. In other embodiments, apparatus 100 in Figure 1 or other lanes such as those illustrated in Figures 4-8 are used.

[0082] With respect to Figure 14, the operations at blocks 922 through 944 have been completed. Figure 14 illustrates the workpiece after moldable material 1002 has been dispensed onto layer 1422, which is overlying substrate 1402. In an embodiment, substrate 1402 may include a single crystal semiconductor wafer, which may or may not include one or more other layers below layer 1422. Layer 1422 is along an exposed surface of the workpiece and is an insulating layer, a conductive layer, or an epitaxial layer. Layer 1422 has a planar surface that contacts moldable material 1002. The planar surface of layer 1422 may be achieved using a planarizing layer, which may be formed using any of the devices and techniques described above.

[0083] The process further includes moving the substrate and substrate chuck to a patterning station. After dispensing moldable material 1002, within lane 312, substrate stage 164 moves substrate chuck 162 and substrate 1402 and layer 1422 are moved to the patterning station near the top of Figure 3. Within the patterning station, a patterning head includes a mold 1522 having a patterned contact surface, as shown in Figure 15.

[0084] The process further includes contacting the moldable material 1002 with a mold 1522 while the substrate 1402 is on the substrate chuck 162. Figure 16 shows the mold 1522 contacting the moldable material 1002 to form a pattern in the moldable material 1002. The moldable material 1002 is exposed to actinic radiation to polymerize the moldable material 1002 and form a patterned layer 1602.

[0085] Similar to the process described with respect to Figures 10 to 13, the process associated with Figures 14 to 19 does not require a registration operation between dispensing the moldable material and patterning the moldable material 1002 because the workpiece including the substrate 1402 and layer 1422 remains on the substrate chuck 162 between the dispensing and patterning operations.

[0086] 17, after image layer 1602 is formed, mold 1522 is removed. Mold 1522 corresponds to the step field and occupies an area that is smaller than the area occupied by substrate 1402. Mold 1522 is used repeatedly until most or all of the formable material over layer 1422 has been patterned.

[0087] The process further includes baking the moldable material after patterning. The substrate conveyor 132 operates the substrate handler 134 of the substrate transfer station 130 to move the workpiece, including the substrate 1402 and the patterned layer 1602, from the substrate chuck 162 to one of the processing stations 124. The workpiece is baked to reduce the amount of solvent in the patterned layer 1602 and to further polymerize the patterned layer 1602. The baking operation is also performed for shrinkage and strain relief of the patterned layer 1602. The baking operation is optional and may be performed outside the apparatus 100 or 200. The patterned layer 1602 is a masking layer that can be used to selectively process the substrate 1402 or the layer 1422.

[0088] The process includes returning the substrate to the substrate container. The substrate conveyor 132 operates the substrate handler 134 of the substrate transfer station 130 to move the workpieces, including the substrate 1402 and the image layer 1602, from the processing station 124 to the substrate container 122.

[0089] The substrate container 122 with the workpieces is transferred from the apparatus 200 to an etching tool (not shown). In an embodiment, as shown in Figure 18, the layer 1422 is etched to define an opening 1822 that extends down to the substrate 1402. The etching is performed using an etching tool. After the opening 1822 is defined, the pattern layer 1602 is removed, as shown in Figure 19. Further process operations are performed to complete the fabrication of the article.

[0090] The above described embodiments provide benefits to users of the device. Only one registration operation may be performed inside the device. Fewer operations can be performed when forming a planarization layer from a moldable material. Fewer operations allow for a higher throughput capability, substrates are processed through the device more quickly, and yields are higher due to less handling of the substrate. The design of the device allows for a significant reduction in the area occupied by the device compared to conventional devices. Different layouts are used with the device to allow users to configure the device to the needs or desires of a particular application.

[0091] It should be noted that in the general description or embodiments, not all of the activities described above are costs, some of the particular activities may not be required, and one or more additional activities may be performed in addition to those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed.

[0092] Benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, the benefits, advantages, solutions to problems, and any features that give rise to or make more prominent any benefit, advantage, or solution should not be construed as critical, necessary, or essential features of any or all of the claims.

[0093] The specification and drawings of the embodiments described herein are intended to provide a general understanding of the configuration of the various embodiments. The specification and drawings are not intended to serve as an exhaustive and comprehensive description of all of the elements and features of the apparatus and systems using the configurations or methods described herein. Separate embodiments may be provided in combination in a single embodiment, while various features that are described for brevity in the context of a single embodiment may also be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and every value within that range. Many other embodiments will be apparent to those skilled in the art after reading this specification. Other embodiments can be used and derived from the present disclosure, such that structural substitutions, logical substitutions, or other changes are made without departing from the scope of the present disclosure. Thus, the present disclosure should be interpreted as illustrative and not restrictive.

Claims

1. a first substrate chuck configured to hold a first substrate; a second substrate chuck configured to hold a second substrate; a dispenser configured to dispense a formable material onto the first substrate while the first substrate is disposed on the first substrate chuck and to dispense the formable material onto the second substrate while the second substrate is disposed on the second substrate chuck; An apparatus comprising:

2. a first planarization head configured to planarize the moldable material on the first substrate while the first substrate is placed on the first substrate chuck; a second planarizing head configured to planarize the moldable material on the second substrate while the second substrate is placed on the second substrate chuck; 2. The apparatus of claim 1, further comprising:

3. a loading station; the dispenser is part of a dispensing station; the dispensing station is disposed between the load station and the first planarizing head in a top view; 3. The apparatus according to claim 2 .

4. the dispenser is part of a dispensing station; The first flattening head is disposed between the load station and the distribution station in a top view.

3. The apparatus according to claim 2 .

5. a dispenser conveyor coupled to the dispenser; the first substrate chuck is configured to move along a first axis; the second substrate chuck is configured to move along a second axis; The dispenser conveyor is configured to move the dispenser along a third axis distinct from each of the first axis and the second axis.

2. The apparatus of claim 1 .

6. a first substrate stage coupled to the first substrate chuck and configured to move the first substrate from a first substrate position to a second substrate position; a second substrate stage coupled to the second substrate chuck and configured to move the second substrate from a third substrate position to a fourth substrate position; 2. The apparatus of claim 1, further comprising:

7. a dispenser conveyor coupled to the dispenser; the first substrate stage is configured to move the first substrate chuck along a first axis; the second substrate stage is configured to move the second substrate chuck along a second axis; The dispenser conveyor is configured to move the dispenser along a third axis distinct from each of the first axis and the second axis.

7. The apparatus according to claim 6 .

8. 8. The apparatus of claim 7, wherein the third axis is within 1 degree of orthogonal to the first axis or the second axis.

9. 8. The apparatus of claim 7, wherein the first substrate chuck is configured to move while dispensing and the dispenser is configured to remain stationary while dispensing.

10. 8. The apparatus of claim 7, wherein the first substrate chuck is configured to remain stationary while dispensing and the dispenser is configured to move while dispensing.

11. 7. The device of claim 6, wherein the dispenser has a length and a width, the length being greater than the width, and the length being oriented along a fourth axis.

12. 12. The apparatus of claim 11, wherein the fourth axis is within 1 degree of orthogonal to the first axis or the second axis.

13. 12. The apparatus of claim 11, wherein the fourth axis is within 1 degree parallel to the first axis or the second axis.

14. The apparatus of claim 1 , wherein the dispenser has multiple dispensing heads.

15. moving the first substrate over the first substrate chuck and removing the first substrate from the first substrate chuck; moving the second substrate over the second substrate chuck and removing the second substrate from the second substrate chuck; 10. The apparatus of claim 1 further comprising a substrate conveyor configured to:

16. placing a first substrate on a first substrate chuck; dispensing a formable material onto the first substrate while the first substrate is on the first substrate chuck; contacting the moldable material with a first superstrate while the moldable material is on the first substrate and the first substrate is on the first substrate chuck; curing the moldable material over the first substrate to form a first planarization layer; placing a second substrate on the second substrate chuck; dispensing the moldable material onto the second substrate while the second substrate is on the second substrate chuck; contacting the moldable material with a second superstrate while the moldable material is on the second substrate and the second substrate is on the second substrate chuck; curing the moldable material on the second substrate to form a second planarization layer; having the dispensing of the moldable material onto the first substrate and the dispensing of the moldable material onto the second substrate are performed using a same dispenser.

17. moving the first substrate along a first axis from a first dispensing station to a first planarizing station; moving the second substrate along a second axis from a second dispensing station to a second planarizing station; moving the dispenser from the first dispensing station to the second dispensing station along a third axis; 20. The method of claim 16, further comprising:

18. 20. The method of claim 17, wherein the third axis is within 1 degree of orthogonal to the first axis or the second axis.

19. hardening the moldable material on the first substrate comprises exposing the moldable material to actinic radiation while the moldable material is in contact with the first substrate and the first superstrate and the first substrate is on the first substrate chuck; The method further comprises separating the first superstrate from the moldable material after exposing the moldable material to the actinic radiation.

17. The method of claim 16.

20. While dispensing the moldable material onto the first substrate, the first substrate moves and the dispenser remains stationary; or the dispenser moves and the first substrate remains stationary; 17. The method of claim 16.

21. 1. A method of manufacturing an article, comprising the steps of:

20. The method of claim 16, comprising forming a first planarization layer on a first substrate; processing the first substrate to complete formation of the article; 13. The method of claim 12, further comprising:

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