Patterning mask

Abstract

To provide means for forming any pattern hole that notches a circumference with a simple structure.SOLUTION: Provided is a patterning mask including: a base material provided with a pattern hole; an adhesive layer provided on one surface of the base material; a peeling layer bonded to the adhesive layer in a peelable manner; and a stick-on sheet stuck on the other surface of the base material. The base material has impermeability to a material forming a thin film of a pattern formed on a target stuck with the adhesive layer interposed therebetween. The stick-on sheet is stuck on the other surface of the base material covering a range including the pattern hole.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a patterning mask used for printing a conductive pattern. [Background technology]

[0002] Conventionally, printing jigs such as metal masks and screen masks have been used in the manufacture of electronic circuit boards, semiconductors, etc. When forming a conductive pattern on a board, etc., a printing jig in which pattern holes corresponding to the conductive pattern are formed has been proposed (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-136797 A Summary of the Invention [Problem to be solved by the invention]

[0004] The printing jig described in Patent Document 1 mentioned above requires the formation of pattern holes that leave the peripheral edges, and cannot form pattern holes that would cut out the peripheral edges and split the printing jig, which limits the hole shapes that can be formed.

[0005] The present invention was made through intensive research by the inventors in consideration of the above problems, and has an object to provide a means for forming any pattern hole by cutting out the peripheral edge with a simple structure. [Means for solving the problem]

[0006] The patterning mask of the present invention comprises a substrate having pattern holes, an adhesive layer provided on one side of the substrate, a release layer removably adhered to the adhesive layer, and an adhesive sheet attached to the other side of the substrate, wherein the substrate is impermeable to a material constituting a thin film of a pattern to be formed on an object to which it is attached via the adhesive layer, and the adhesive sheet is attached to the other side of the substrate, covering an area including the pattern holes.

[0007] In addition, the patterning mask of the present invention is characterized in that the substrate can be separated into a plurality of partial bodies by the pattern holes, and the adhesive sheet holds each of the partial bodies together by being attached to the substrate.

[0008] In the patterning mask of the present invention, the pattern holes are formed by cutting out a plurality of portions of an edge portion of the base material and extend continuously.

[0009] In the patterning mask of the present invention, the pattern holes have a shape that turns back and forth in a predetermined direction.

[0010] In the patterning mask of the present invention, the adhesive layer has holes formed therein that overlap the pattern holes of the base material.

[0011] In the patterning mask of the present invention, the release layer has a higher releasability with respect to the adhesive layer than the substrate.

[0012] In the patterning mask of the present invention, the adhesive sheet has a lower adhesiveness to the base material than the adhesive layer.

[0013] In the patterning mask of the present invention, the adhesive layer has a stronger adhesive strength to the base material than to the release layer.

[0014] In the patterning mask of the present invention, the base material and the adhesive layer have heat resistance sufficient to withstand a high-temperature process in a high-temperature atmosphere.

[0015] The patterning mask of the present invention is characterized in that the high temperature process is a process of exposing the mask to a high temperature environment in a processing bath and / or a process of baking the mask.

[0016] In the patterning mask of the present invention, the base material has resistance to components of the material that constitutes the thin film of the pattern. Effect of the Invention

[0017] According to the present invention, any pattern of holes can be formed by cutting out the periphery with a simple structure. [Brief description of the drawings]

[0018] [Figure 1] 1 is a diagram showing a patterning mask according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a diagram showing a laminated substrate, a strong adhesive layer, and an easily peelable layer. [Diagram 3] FIG. 13 is a diagram showing a patterning mask provided with pattern holes. [Figure 4] FIG. 13 is a diagram showing a patterning mask with a weak adhesive sheet attached. [Diagram 5] FIG. 1 is a diagram showing an example of a substrate on which pattern holes are formed. [Figure 6] FIG. 1 shows a substrate that can be separated into two halves. [Figure 7] FIG. 2 is a diagram showing a substrate to which a weak adhesive sheet is attached. [Figure 8] FIG. 2 is a diagram showing a patterning mask before being placed on an adherend. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] An embodiment of the patterning mask of the present invention will be described below with reference to the drawings. Fig. 1 shows a patterning mask 1 according to this embodiment. The patterning mask 1 is used by being attached to an adherend, and is a jig for forming a thin film of a sputtering target in a predetermined pattern on the surface of the adherend. The patterning mask 1 has a base material 2 having pattern holes that correspond to the pattern shape to be formed in a thin film. A strong adhesive layer (adhesive layer) 4 and an easy peeling layer (peeling layer) 6 are arranged in this order on one surface of the base material 2, and a weak adhesive sheet (adhesive sheet) 10 is arranged on the other surface of the base material 2.

[0020] The substrate 2 may be a thin flexible metal foil, a resin film, or a laminate of these. When the substrate 2 is a metal foil, it may be, for example, aluminum, zinc, tin, copper, nickel, chromium, silver, gold, iron, bismuth, titanium, indium, palladium, vanadium, tungsten, molybdenum, manganese, tantalum, cobalt, aluminum oxide, indium oxide, tin oxide, titanium oxide, silicon oxide, antimony oxide, bismuth oxide, zinc oxide, or an alloy containing one or more of these as a main component, such as stainless steel. When a metal foil is used as the substrate 2, it has sputter impermeability. The impermeability can be obtained by the material and thickness of the substrate 2. That is, it is preferable to use a metal foil that does not have pinholes that allow the sputter to pass through. In addition, the thickness of the metal foil may prevent the occurrence of pinholes and provide sputter impermeability. The thickness of the metal foil used as the substrate 2 is, for example, 1 μm or more and 50 μm or less.

[0021] Furthermore, when the base material 2 is in the form of a resin film, it can be made of polyimide. However, as long as it has sufficient heat resistance, sputter impermeability, mechanical strength, etc., against the environmental temperature during patterning by sputtering, etc., the base material 2 may be made of, for example, polyethylene, polypropylene, vinyl chloride, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene, polyacrylonitrile, polyamideimide, polyphenylene sulfide, polymethyl methacrylate, etc., or a composite material of these.

[0022] The sputter impermeability of the substrate 2 by the resin film or the like can be imparted by the thickness. That is, it is sufficient that the substrate 2 has a thickness that does not penetrate or pass through when it is hit by the sputters accelerated and flying out from the sputtering target. The thickness of the substrate such as the resin film is 1 μm or more and 2000 μm or less, but is not limited to this, and may be, for example, 0.9 μm or less, or 15 μm or more and 500 μm or less, 20 μm or more and 200 μm or less, or 25 μm or more and 100 μm or less, etc. However, if the thickness of the substrate 2 is too thick, the side walls of the pattern holes of the substrate 2 become too high (thick), which may cause a shadow during sputtering and make it difficult to accurately form the desired pattern, and in patterning on a curved surface, there is a risk that the patterning mask 1 cannot be attached well, so the thickness is set not to be too thick.

[0023] If the thickness is thin enough to allow adhesion to curved surfaces, the substrate 2 can also be used for curved shapes. In addition, when the substrate 2 is made of polyimide, the substrate 2 does not penetrate even when the accelerated target collides with it during sputtering, and has a breaking strength of 200 MPa to 600 MPa and a thermal decomposition temperature of 500° C. or higher, so that the substrate 2 can be impermeable, highly heat resistant, and highly strong.

[0024] Incidentally, the substrate 2 has a surface shape extending along one surface, but of course it is not limited to a planar shape and may have a curved surface shape, and when the patterning mask 1 is placed on the target surface from an initial state in which it has a planar shape, it may be bent to conform to the surface shape of the target.

[0025] The strong adhesive layer 4 is made of an adhesive having adhesion to the substrate 2 and the easily peelable layer 6. The strong adhesive layer 4 also has high heat resistance. That is, in sputtering, the strong adhesive layer 4 has high heat resistance that prevents it from being affected by a decrease in adhesion or the like during the process of exposure to a high-temperature environment (high-temperature process) in a sputtering tank (or vacuum tank) as a processing tank. The adhesive of the strong adhesive layer 4 may be made of a conventionally known adhesive, such as an acrylic adhesive, a rubber adhesive, a urethane adhesive, a silicone adhesive, or an adhesive mixture thereof.

[0026] The acrylic adhesive may be, for example, an adhesive containing an acrylic polymer obtained by polymerizing a polymerizable monomer including a (meth)acrylic acid alkyl ester monomer. The (meth)acrylic acid alkyl ester monomer is an ester of (meth)acrylic acid and an aliphatic alcohol, and the number of carbon atoms in the alkyl group of the aliphatic alcohol is, for example, 2 to 14. The acrylic adhesive may contain a tackifier resin. The polymerizable monomer may contain a polar group-containing vinyl monomer such as a carboxylic acid having a vinyl group (e.g., (meth)acrylic acid).

[0027] The rubber-based adhesive may contain a rubber component and a tackifier resin, and the rubber component may be, for example, a styrene-isoprene block copolymer.

[0028] The urethane-based adhesive may be, for example, a urethane resin obtained by reacting a polyol with a polyisocyanate compound, and may further contain a tackifying resin. The silicone-based adhesive may be, for example, an addition reaction type, a peroxide curing type, or a condensation reaction type silicone-based adhesive.

[0029] A tackifier may be added to the adhesive to adjust the adhesive strength. Examples of the tackifier include hydrogenated rosin, rosin resin, terpene resin, hydrogenated terpene resin, phenol resin, acetylene resin, petroleum-based hydrocarbon resin, ethylene-vinyl acetate copolymer, synthetic rubber, natural rubber, petroleum resin, and coumarone resin. Additives such as plasticizers, softeners, flame retardants, fillers, colorants, and silane coupling agents may also be added to the adhesive. Before providing the strong adhesive layer 4 on the substrate 2, the surface of the substrate 2 may be subjected to surface treatment such as corona discharge treatment, Itro treatment, plasma treatment, or application of a primer in order to improve adhesion (adhesion) with the adhesive.

[0030] The easily peelable layer 6 is a so-called release liner that protects the strong adhesive layer 4, and is formed of a material that is easily peelable from the strong adhesive layer 4. Such a material is preferably at least one selected from the group consisting of silicone resins and fluororesins. The easily peelable layer 6 can be, for example, glassine paper, craft paper, clay-coated paper, paper laminated with a resin film such as polyethylene, or paper coated with a resin such as polyvinyl alcohol or an acrylic polymer. In addition, the surface of the easy-peel layer 6 can be made finely uneven or embossed to reduce the adhesion area with the strong adhesive layer 4 and improve the peelability, so that it can be peeled off more easily (before) the strong adhesive layer 4 is peeled off from the substrate 2.

[0031] The weak adhesive sheet 10 is formed by fixing a sheet material and a weak adhesive layer made of an adhesive composition substantially integrally. Examples of the sheet material include plastic films made of resin materials such as polyolefin resins such as polyethylene, polypropylene, and ethylene-propylene, polyester resins such as polyethylene terephthalate, vinyl acetate resins, polyimide resins, fluorine resins, polyvinyl chloride resins, and cellophane, rubber sheets made of natural rubber and butyl rubber, foam sheets made of foamed polyurethane, polychloroprene rubber, and polyethylene, paper such as kraft paper, crepe paper, and Japanese paper, cloth such as cotton cloth and stauff cloth, nonwoven fabrics such as cellulose nonwoven fabrics, polyester nonwoven fabrics, and vinylon nonwoven fabrics, metal foils such as aluminum foils and copper foils, and composites of these materials.

[0032] The weak adhesive layer is composed of an adhesive similar to that of the strong adhesive layer 4 described above, or an adhesive having lower adhesion to the substrate 2 than the strong adhesive layer 4. The weak adhesive sheet 10 can also be formed by directly applying an adhesive composition to a sheet material. At this time, the surface of the sheet material may be previously subjected to surface treatment such as corona discharge treatment, Itro treatment, plasma treatment, or application of a primer in order to improve adhesion (adhesion) to the adhesive composition. This makes it possible to suppress separation of the weak adhesive layer from the sheet material when the weak adhesive sheet 10 attached to the substrate 2 is peeled off.

[0033] An example of a method for manufacturing the patterning mask 1 will be described. Fig. 2 shows a laminated substrate 2, a strong adhesive layer 4, and an easy peeling layer 6, and as shown in Fig. 2(a), the strong adhesive layer 4 is provided on one surface of the substrate 2. The strong adhesive layer 4 can also be provided by, for example, applying an adhesive to the surface of the substrate 2. Next, as shown in Fig. 2(b), an easy peeling layer 6 is provided on the surface of the strong adhesive layer 4 opposite the substrate 2, thereby forming a patterning mask 1 to which the weak adhesive sheet 10 is not attached.

[0034] The procedure for laminating the substrate 2, the strong adhesive layer 4, and the easy peeling layer 6 is not limited to the above. For example, first, an adhesive is applied to the surface of the easy peeling layer 6 to provide the strong adhesive layer 4. Next, the substrate 2 may be superimposed on the surface of the strong adhesive layer 4 opposite to the easy peeling layer 6 to form the patterning mask 1.

[0035] Next, pattern holes 20 are formed in the substrate 2. Before the pattern holes 20 are formed, the orientation of the patterning mask 1 is determined in advance so that the weak adhesive sheet 10 can be attached to the surface of the substrate 2. That is, the patterning mask 1 is placed horizontally with the substrate 2 surface facing upward so that the substrate 2 surface is exposed. Of course, as long as the substrate 2 surface is exposed, the patterning mask 1 may be placed in an upright position, or may be placed in a position inclined at an angle relative to the horizontal direction.

[0036] 3, the pattern hole 20 can be formed in a zigzag shape that folds back and forth in a predetermined direction, with both ends cutting out one end face of the base material 2. Such a pattern hole 20 can be formed by, for example, cutting using a cutter, water, a laser, or the like, shearing such as punching, etching, electric discharge machining such as wire cutting, or a combination of these processes.

[0037] The shape of the pattern hole 20 is not particularly limited, and for example, both ends of the pattern hole 20 may cut out a pair of opposing end faces of the base material 2, or a shape in which multiple end faces of the base material 2 are cut out is also possible. Furthermore, the number of zigzag folds of the pattern hole 20 can be appropriately set, and the pattern hole 20 can be set to a desired shape such as a zigzag shape, a curved shape, a lattice shape, or an appropriate geometric shape other than the zigzag shape.

[0038] In forming the pattern holes 20, the strongly adhesive layer 4 is cut together with the substrate 2. The easily peelable layer 6 may also be cut together with the substrate 2. As a result, pattern holes of a similar shape to the pattern holes 20 are formed in the strongly adhesive layer 4 (and the easily peelable layer 6) so as to overlap with the pattern holes 20.

[0039] After the pattern holes 20 are formed, the weak adhesive sheet 10 is attached to the substrate 2 (see, for example, FIG. 4). The weak adhesive sheet 10 has a surface shape that covers the pattern holes 20 and covers almost the entire surface of the substrate 2, and adheres to the substrate 2 to prevent the substrate 2 from being separated by the pattern holes 20.

[0040] Specifically, FIG. 5 is a diagram showing an example of a substrate 2 in which a pattern hole 20 is formed. Here, the pattern hole 20 extends in a single stroke, and both ends of the pattern hole 20 are cut out of the end face of the substrate 2. Therefore, the substrate 2 can be separated into a first partial body 2a in the area partitioned by the pattern hole 20 and a second partial body 2b outside the pattern hole 20. The first partial body 2a and the second partial body 2b can be displaced relative to each other in a direction parallel to the reciprocating direction of the pattern hole 20. Therefore, the substrate 2 cannot maintain the shape of the pattern hole 20 if the two partial bodies 2a and 2b are displaced relative to each other as shown in FIG. 6. Therefore, as shown in FIG. 7, a weak adhesive sheet 10 is attached to the substrate 2 to hold the substrate 2 so that the relative positions of the first partial body 2a and the second partial body 2b are maintained, thereby preventing separation of the substrate 2. In other words, the weak adhesive sheet 10 is attached to the substrate 2, and the first partial body 2a and the second partial body 2b are integrally held.

[0041] The substrate to which the patterning mask 1 of the present invention is attached is not particularly limited, and may be, for example, a component that defines the structure of a building (such as a building, a bridge, a railway rail, a road, an elevated highway, etc.), such as structural materials such as H-shaped steel, C-shaped steel, T-shaped steel, I-shaped steel, circular or square tubular steel, fastening members such as screw fastening members and rivets, reinforcing materials, joining members connecting members together, wall materials, concrete materials, as well as glass members, resin members, semiconductor wafers, etc.

[0042] Next, an example of a process for placing the patterning mask 1 on an adherend will be described. Fig. 8 is a diagram showing the patterning mask 1 before being placed on the adherend 50, where the adherend 50 is a plate-shaped member. First, the release layer 6 is peeled off from the patterning mask 1 so that the patterning mask 1 can be attached to the adherend 50.

[0043] Next, the surface of the patterning mask 1 where the strong adhesive layer 4 is exposed is placed opposite the adherend 50 (see, for example, FIG. 8(a)). The patterning mask 1 is placed in a state where the strong adhesive layer 4 is in contact with the adherend 50 and is substantially fixed on the adherend 50. That is, by adhering (bonding) the strong adhesive layer 4 to the surface of the adherend 50, the patterning mask 1 is fixed in a state where relative displacement with respect to the adherend 50 is suppressed.

[0044] 8(b), the weak adhesive sheet 10 is peeled off from the patterning mask 1 attached to the adherend 50 to expose the pattern holes 20. As a result, only the areas of the surface of the adherend 50 where the pattern holes 20 are arranged are exposed.

[0045] Then, the adherend 50 is subjected to a pattern forming process such as a conductive pattern, an etching pattern, etc. When a conductive pattern is formed on the adherend 50 by using a sputtering method, a part of the surface of the adherend 50 is exposed through the pattern hole 20 of the patterning mask 1, so that a thin film is formed on the surface of the adherend 50 by the sputtering method along the shape of the pattern hole 20. At this time, since the thin film is formed on the adherend 50 and the patterning mask 1 in a sputtering tank, the patterning mask 1 (the substrate 2 and the strong adhesive layer 4) has high heat resistance that is not affected by the maximum temperature reached in the sputtering tank.

[0046] As described above, in the present invention, when the patterning mask can be separated into a plurality of partial bodies by the pattern holes, the weak adhesive sheet can prevent the partial bodies from being displaced relative to each other, and the shape of the pattern holes can be maintained. In addition, since the patterning mask can be attached and fixed to the adherend by providing a strong adhesive layer, even if the weak adhesive sheet is peeled off after the patterning mask is fixed to the adherend, the partial bodies do not displace relative to each other, and the shape of the pattern holes can be maintained, and a desired conductive pattern can be formed. In addition, since the base material 2 of the patterning mask of the present invention does not allow sputtering to penetrate or pass through, it is possible to reliably pattern only the areas where the pattern holes 20 are arranged.

[0047] Incidentally, the method of forming a pattern on an adherend using the pattern jig of the present invention is not limited to the sputtering method, and may also include, for example, screen printing, physical vapor deposition (PVD) (including sputtering, vacuum deposition, ion plating, etc.), chemical vapor deposition (CVD) (including metal chemical vapor deposition (MOCVD) method, atomic layer deposition (ALD) method, plasma enhanced chemical vapor deposition (PECVD) method, thermal CVD method, etc.), plating, etc.

[0048] The substrate may also be made of a magnetic material. When the substrate is made of a magnetic material and the main component of the adherend is a ferromagnetic material, the substrate and the adherend may be magnetically attracted to each other. In this case, it is necessary to select a material with a Curie point higher than the maximum temperature in the sputtering tank as the magnetic component (magnetic material) of the substrate.

[0049] In the above embodiment, the high heat resistance corresponding to the pattern formation by sputtering has been described as an example, but it goes without saying that the high heat resistance of the base material 2 and the strong adhesive layer 4 differs depending on the method of pattern formation. That is, in the case of baking coating when a bake-hardening paint is used, or plating, it is desirable to have high heat resistance that can withstand the temperature during baking as a high-temperature process in the case of baking coating, and high heat resistance that can withstand the high-temperature environment in a plating tank (treatment tank) as a high-temperature process in the case of plating. In addition, when a paint is used, since the paint generally contains a solvent, the base material 2 is required to have resistance (for example, solvent resistance, chemical resistance, etc.) to the components of the solvent or paint. [Explanation of symbols]

[0050] 1...patterning mask, 2...substrate, 4...strong adhesive layer, 6...easy peeling layer, 10...weak adhesive sheet, 20...pattern hole, 50...adherend.

Claims

1. A substrate having a pattern hole; An adhesive layer provided on one surface of the substrate; A release layer releasably attached to the adhesive layer; and an adhesive sheet attached to the other surface of the base material, The substrate is impermeable to a material constituting a thin film of a pattern to be formed on an object to which the substrate is attached via the adhesive layer; The adhesive sheet is attached to the other surface of the base material so as to cover an area including the pattern holes.

2. The substrate may be separated into a plurality of sections by the pattern holes; 2. The patterning mask according to claim 1, wherein the adhesive sheet is attached to the base material to integrally hold each of the sections.

3. 3. The patterning mask according to claim 2, wherein the pattern holes are formed by cutting out a plurality of portions of an edge portion of the base material and extending continuously.

4. 4. The patterning mask according to claim 3, wherein the pattern hole has a shape that turns back and forth in a predetermined direction.

5. 5. The patterning mask according to claim 2, wherein the adhesive layer has holes formed therein that overlap the pattern holes of the base material.

6. 2. The patterning mask according to claim 1, wherein the release layer has a higher releasability with respect to the adhesive layer than the substrate.

7. 2. The patterning mask according to claim 1, wherein the adhesive sheet has a lower adhesiveness to the base material than the adhesive layer.

8. 2. The patterning mask according to claim 1, wherein the adhesive layer has a stronger adhesive strength to the base material than to the release layer.

9. 2. The patterning mask according to claim 1, wherein the base material and the adhesive layer have heat resistance sufficient to withstand a high-temperature process in a high-temperature atmosphere.

10. 10. The patterning mask according to claim 9, wherein the high-temperature process is a process of exposing the mask to a high-temperature environment in a processing bath and / or a process of baking the mask.

11. 2. The patterning mask according to claim 1, wherein the base material has resistance to components of a material that constitutes the thin film of the pattern.

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