Ring structure used in plasma chamber and system

Abstract

To provide a system for fixing an edge ring to a support ring, and a method.SOLUTION: In a system 900, an edge ring 924 is fixed to a support ring 112 via a plurality of fasteners inserted to a bottom face of the edge ring. The edge ring is fixed to the support ring, thereby stabilizing the edge ring during processing of a substrate in a plasma chamber. In addition, the support ring is fixed to an insulator ring 106 connected to an insulator wall 230 of the plasma chamber, such that the edge ring is fixed to the plasma chamber by fixing the edge ring to the support ring. Further, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms 920A during the processing of the substrate and pushed up vertically using the clasp mechanism in order to remove the edge ring and the support ring from the plasma chamber.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present embodiments relate to rings, systems, methods, and structures for securing a ring in a plasma chamber. [Background technology]

[0002] Plasma chambers are used to perform various processes on wafers. For example, plasma chambers are used to clean the wafer, deposit material on the wafer, or etch the wafer. Plasma chambers contain various components (such as various rings) that are used to process different portions of the wafer.

[0003] It is in this context that the embodiments described in this disclosure arise. Summary of the Invention

[0004] In the described embodiment, the plasma chamber is provided with an edge ring and a support ring. In one embodiment, the edge ring is coupled to a support ring disposed below the edge ring. The edge ring is coupled to the support ring, for example, by a number of screws attached to the underside of the edge ring. To secure the support ring, a number of pull-down structures are coupled to the underside of the support ring, which pull-down structures lower to keep the edge ring attached during processing. If the edge ring is not properly secured during processing, the adhesive used to secure the edge ring is insufficient. One reason that an adhesive alone is insufficient is that the adhesion provided by the adhesive gel formed between the support ring and the edge ring is reduced by high temperature cycling in the plasma chamber. Furthermore, the gel is subject to constant forces, which may cause the gel to break down over time. Therefore, it is desirable for the edge ring and the support ring to remain in place during processing of the substrate, even if the adhesion provided by the gel is reduced and / or the gel breaks down. As an example, it is desirable for the edge ring to be fixed relative to the support ring during processing of the substrate. Otherwise, if the edge ring shifts during processing of the substrate, undesired processes may be performed on the substrate or certain portions of the substrate may be processed where processing is undesirable. In one embodiment, the bottom surface of the edge ring has slots (e.g., screw holes) for receiving a number of fasteners that connect the edge ring to the support ring during processing of the substrate. This helps prevent the edge ring from moving relative to the support ring.

[0005] In one embodiment, it is desirable for the edge ring to have one or more curved edges that reduce the possibility of arcing when a plasma is formed in the plasma chamber.

[0006] In another embodiment, a covering ring is desirably provided to surround the edge ring. The covering ring is further configured to have one or more curved edges to reduce the possibility of arcing when plasma is formed in the plasma chamber. The width of the covering ring is also selected such that the tracking distance along its width facilitates achievement of a standoff voltage at the vertically oriented inner surface of the covering ring. For example, if the radio frequency (RF) voltage dissipated in the covering ring is between about 7 volts (V) and 10 volts (V) per thousandth of an inch (2.54 cm) of the covering ring, the width of the covering ring corresponds to the tracking distance to achieve a predetermined standoff voltage of 5000 volts (V) at the vertically oriented inner surface of the covering ring. The tracking distance is the ratio of a multiple (such as 2 or 3) of the standoff voltage to the voltage dissipated per unit length (e.g., per thousandth of an inch) of the covering ring. In some embodiments, the width of the covering ring is the tracking distance provided by the ratio. In another embodiment, the tracking distance is defined by the surface length (e.g., the surface length along some step faces) between the edge ring and ground.

[0007] In one embodiment, it is desirable for the support ring and edge ring to be fixed relative to an insulator ring located below the support ring. Otherwise, the moment of the support ring relative to the insulator ring will cause the edge ring above the support ring to move. It is undesirable for the edge ring to move during substrate processing. Misalignment of the support ring during substrate processing may result in undesired processes being performed on the substrate or certain portions of the substrate being processed where processing is undesirable. It is also desirable for the support ring and edge ring to be easily removed for maintenance or replacement of either or both of them.

[0008] In some embodiments, an edge ring for use in a plasma processing chamber is described. The edge ring has an annular body that surrounds a substrate support of the plasma processing chamber. The annular body has a bottom side, a top side, an inner side, and an outer side. The edge ring has a plurality of fastener holes disposed in the annular body along the bottom side. Each fastener hole has a threaded inner surface for receiving a fastener used to attach the annular body to the support ring. The edge ring further includes a step disposed on the inner side of the annular body. The step has a lower surface separated from an upper surface of the top side by a sloped surface. The edge ring has a curved edge formed between the upper surface of the top side and an outer side.

[0009] In some embodiments, a cover ring for use in a plasma processing chamber is described. The cover ring has an annular body surrounding an edge ring and adjacent to a ground ring. The annular body has an upper body portion, an intermediate body portion, and a lower body portion. The intermediate body portion defines a reduced width step from the upper body portion such that the intermediate body portion has a first annular width. The lower body portion defines a reduced width step from the intermediate body portion such that the lower body portion has a second annular width that is smaller than the first annular width.

[0010] In various embodiments, a system for securing an edge ring of a plasma chamber is described. The system includes a support ring on which the edge ring is oriented. The system further includes a gel layer disposed between a bottom surface of the edge ring and a top surface of the support ring. The system also includes a plurality of screws configured to secure the edge ring to the support ring. Each of the plurality of screws is attached to a threaded hole disposed on the bottom surface of the edge ring and passing through the support ring. The system also includes a plurality of pressure bars connected to the bottom surface of the support ring. The system includes a plurality of pneumatic pistons. Each of the plurality of pistons is coupled to a corresponding one of the plurality of pressure bars.

[0011] Some advantages of the systems and methods described herein include providing an edge ring having one or more curved edges that are not sharp. Sharp edges (such as edges having a 90° angle) typically cause arcing of RF power when a plasma is formed in a plasma chamber. The curved edge or edges reduce the likelihood of such arcing.

[0012] Further advantages of the system and method include providing an edge ring having one or more slots (e.g., screw holes) for receiving fasteners (e.g., screws) to couple the edge ring to the support ring. Such edge ring-support ring coupling secures the edge ring to the support ring even if the adhesion provided by the gel between the edge ring and the support ring is reduced, the gel wears off, or the gel collapses due to forces applied to the gel during processing of the substrate. Furthermore, the support ring is secured to the insulator ring via one or more pressure bars. Thus, there is no risk of the edge ring shifting during processing of the substrate because the edge ring is secured to the insulator ring via the support ring. The lack of such shifting reduces (e.g., avoids) the possibility of performing undesired processes on the substrate or of processing undesired areas of the substrate.

[0013] Additional advantages of the system and method include providing one or more mechanisms (such as one or more pneumatic mechanisms) for pulling down or pushing up the support ring via one or more pressure bars. The pulling down action is performed during processing of the substrate to reduce the possibility of the support ring becoming displaced relative to the insulator ring. Thus, the pulling down action allows the edge ring and support ring to remain secured within the plasma chamber for multiple processing operations (e.g., from one processing operation to the next) until they are replaced or removed from the plasma chamber for maintenance. The pushing up action is performed to remove the edge ring or support ring for replacement or maintenance (such as cleaning).

[0014] Further advantages of the systems and methods described herein include providing a cover ring having one or more curved edges that reduce the possibility of arcing when a plasma is formed within the plasma chamber, and further, the cover ring has an annular width to achieve a standoff voltage at a vertically oriented inner surface of the cover ring as described above.

[0015] Other aspects will become apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0016] The embodiments can be best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0017] [Figure 1] FIG. 1 is a diagram of one embodiment of a system illustrating a method for bonding an edge ring to a support ring.

[0018] [Diagram 2] FIG. 2 is a diagram of one embodiment of the system showing the coupling of the power pins to the support ring.

[0019] [Figure 3A]FIG. 3A is a diagram of one embodiment of the system showing multiple locations for connecting multiple pressure bars to the support ring.

[0020] [Figure 3B] FIG. 3B is an isometric view showing the connection of the pressure bar to the bottom surface of the support ring.

[0021] [Figure 4] FIG. 4 is a side view of one embodiment of a system for bonding the edge ring and the support ring to the insulator ring.

[0022] [Diagram 5] FIG. 5 is an isometric view of one embodiment of a clasp mechanism.

[0023] [Figure 6A] FIG. 6A is a diagram of one embodiment of a system for demonstrating synchronized downward movement of the pressure bars.

[0024] [Figure 6B] FIG. 6B is a diagram of one embodiment of a system for demonstrating synchronized lifting action of the pressure bars.

[0025] [Figure 7] FIG. 7 is a block diagram of one embodiment of a system showing air supply to multiple clasp mechanisms.

[0026] [Figure 8A] FIG. 8A is an isometric view of one embodiment of an edge ring.

[0027] [Figure 8B] FIG. 8B is a top view of one embodiment of the edge ring of FIG. 8A.

[0028] [Figure 8C] FIG. 8C is a cross-sectional view of the edge ring of FIG. 8A.

[0029] [Figure 8D] FIG. 8D is a diagram of one embodiment of a system illustrating coupling of fasteners to the edge ring of FIG. 8A.

[0030] [Figure 9A] FIG. 9A is an isometric view of one embodiment of a covering.

[0031] [Figure 9B] FIG. 9B is a bottom view of one embodiment of the cover ring of FIG. 9A.

[0032] [Figure 9C] FIG. 9C is a top view of one embodiment of the covering of FIG. 9A.

[0033] [Figure 9D] FIG. 9D is a cross-sectional view of one embodiment of the cover ring of FIG. 9A.

[0034] [Figure 9E] FIG. 9E is a cross-sectional view of one embodiment of the covering of FIG. 9A.

[0035] [Figure 9F] FIG. 9F is a cross-sectional view of one embodiment of the cover ring of FIG. 9A.

[0036] [Figure 9G] FIG. 9G is a cross-sectional view of one embodiment of a cover ring. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] The following embodiments describe systems and methods for bonding an edge ring in a plasma chamber. It will be apparent that the embodiments may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order to not unnecessarily obscure the embodiments.

[0038] FIG. 1 is a diagram of an embodiment of a system 102 illustrating a method for attaching an edge ring 108 to a support ring 112. The support ring 112 may also be referred to herein as a tunable edge sheath (TES) ring. The system 100 includes an edge ring 108, a ground ring 114, a base ring 116, an insulator ring 106, a cover ring 118, and a chuck 104. The edge ring 108 is made of a conductive material such as silicon, boron-doped single crystal silicon, alumina, silicon carbide, or a silicon carbide layer on an alumina layer, or an alloy of silicon, or a combination thereof. It is noted that the edge ring 108 has an annular body, such as a circular body, or a ring-shaped body, or a dish-shaped body. Additionally, the support ring 112 is made of a dielectric material such as quartz, or a ceramic, or alumina (Al2O3), or a polymer. As an example, the support ring 112 has an inner diameter of about 12.5 inches, an outer diameter of about 13.5 inches, and a thickness along the y-axis of about 0.5 inches. Illustratively, the support ring 112 has an inner diameter of at least about 12.7 inches and no more than about 13 inches, an outer diameter of at least about 13.3 inches and no more than about 14 inches, and a thickness of at least about .5 inches and no more than about .7 inches. These are merely exemplary dimensions for a plasma chamber used to process 300 mm wafers.

[0039] Further, the insulator ring 106 is made of an insulator material, such as a dielectric material, and the base ring 116 is also made of a dielectric material. The ground ring 114 is made of a conductive material. The ground ring 114 is coupled to a ground potential. An example of the chuck 104 includes an electrostatic chuck. Each ring, such as the edge ring 108, the support ring 112, the ground ring 114, the base ring 116, and the insulator ring 106, has an annular shape, such as a ring or a disk. The cover ring 118 is made of a dielectric material, such as fused silica (fused quartz), or a ceramic material, such as aluminum oxide (Al2O3) or yttrium oxide (Y2O3). The cover ring 118 has an annular body, such as a disk or a ring.

[0040] The bottom surface of the edge ring 108 has a portion P1 that is coupled to the top surface of the support ring 112 via a thermally conductive gel layer 110A and thermally sinks the support ring 112 to the edge ring 108. Examples of thermally conductive gels used herein include polyimide, polyketone, polyetherketone, polyethersulfone, polyethylene terephthalate, fluoroethylene propylene copolymer, cellulose, triacetate, and silicone. Additionally, the bottom surface of the edge ring 108 has another portion P2 that is coupled to the top surface of the chuck 104 via a thermally conductive gel layer 110B. Additionally, the bottom surface of the edge ring 108 has yet another portion P3 that overlies and is adjacent to the base ring 116.

[0041] The edge ring 108 is positioned on the base ring 116, the support ring 112, and the chuck 104. A bottom surface of the edge ring 108 faces the base ring 116, the support ring 112, and a portion of the chuck 104. The edge ring 108 also surrounds a portion of the chuck 104 (such as the top portion PRTN1). The support ring 112 surrounds a portion of the chuck 104, and the insulator ring 106 surrounds another portion of the chuck 104. The base ring 116 surrounds a portion of the insulator ring 106 and the support ring 112. The cover ring 118 surrounds the edge ring 108 and the base ring 116. The ground ring 114 surrounds a portion of the cover ring 118 and the base ring 116. A portion of the cover ring 118 is positioned on the ground ring 114, and the cover ring 118 is positioned adjacent to a side of the ground ring 114.

[0042] The edge ring 108 has a number of edges, such as edge 1, edge 2, edge 3, edge 4, edge 5, and edge 6. Each of edges 1-6 is curved, such as an arc. By way of example, each of edges 1-6 is smooth, without sharp edges, has a radius, and is curved smoothly. It should be noted that in various embodiments, the radius of each of edges 1-6 is greater than about 0.01 inches and about 0.03 inches. Having an edge radius of about 0.01 inches and about 0.03 inches reduces the likelihood of edge chipping during semiconductor wafer fabrication. Chipping forms particles during semiconductor wafer processing.

[0043] In one embodiment, the edge ring 108 has multiple edges. In one embodiment, the edges defining the edge ring 108 are rounded. By way of example, edge 1 of the edge ring 108 is rounded to a radius of about .03 inches or more, preferably greater than .07 inches. By way of example, edge 1 is rounded to have a radius of about 0.03 inches or more and about 0.1 inches or less. By way of another example, edge 1 is rounded to have a radius of about 0.07 inches or more and about 0.1 inches or less. Edge 1 of the edge ring 108 is particularly susceptible to arcing due to its close proximity to the ground ring 114. Due to the high power levels used in plasma processing operations, high electric fields are generated between the edge ring 108 and the ground ring 114. The rounding of Edge 1 reduces the likelihood of such arcing. It has been found that less rounding of these edges may be insufficient to prevent or reduce the likelihood of RF power arcing during operation of the plasma chamber. Arcing is affected by the sharpness of the edges of features in the plasma chamber, and reducing the likelihood of arcing may be detrimental to the fabrication processes performed on and across semiconductor wafers. A slight rounding of the edges (e.g., Edge 1 is no less than about .01 inches and no more than about .03 inches) helps reduce the likelihood of particle generation during semiconductor wafer fabrication or edge chipping during fabrication. Therefore, while some rounding has been applied to the surfaces of features disposed in the plasma chamber (e.g., Edge 1), this rounding is less than sufficient to prevent or reduce arcing, given the high power levels used in plasma processing operations.

[0044] The curved edges 1-6 reduce the possibility of chipping or arcing occurring when a plasma is formed in the plasma chamber in which the system 100 is located. Note that edge 5 is less rounded compared to edge 1 to reduce the possibility of plasma ions of the plasma entering the gap between edge 5 and the chuck 104. For example, the radius of edge 5 is less than the radius of edge 1. As an example, the edge ring 108 has an outer diameter along the x-axis of about 13.6 inches or more and about 15 inches or less. As another example, the edge ring 108 has an outer diameter along the x-axis of about 13 inches or more and about 15 inches or less. As yet another example, the edge ring 108 has a thickness measured along the y-axis of about .248 inches. Illustratively, the edge ring 108 has a thickness of about .24 inches or more and about .256 inches or less. The x-axis is perpendicular to the y-axis. As the outer diameter of the edge ring 108 increases, the distance between the outer surface of the edge ring 108 that is continuous with the edge 1 and the cover ring 118 decreases. This reduced distance reduces the possibility of RF power arcing between the edge ring 108 and the cover ring 118 when a plasma is formed in the plasma chamber.

[0045] The edge ring 108 includes a number of slots (such as slot 125) formed in a bottom surface of the edge ring 108. An example of a slot in an edge ring is a screw hole. Each slot surrounds a fastener hole (such as fastener hole 124A). The fastener holes do not extend the entire length of the edge ring 108 along the y-axis to form a through hole in the edge ring 108. The number of fastener holes is formed in the bottom surface of the edge ring 108. An example of a fastener hole is a screw hole having a helical thread for receiving a screw. The slot 125 has a top surface TS and a side surface SS. The top surface TS and the side surface SS are surfaces formed by drilling into the lower surface of the edge ring 108. The side surface SS is substantially perpendicular to the top surface TS. For example, the side surface SS is inclined with respect to the top surface TS, forming an angle in a range such as 85 degrees to 95 degrees. As another example, the side surface SS is perpendicular to the top surface TS. Top surface TS partially surrounds fastener hole 124A and side surface SS partially surrounds fastener hole 124A.

[0046] Additionally, a through hole 132A is formed in the support ring 112 for receiving a fastener 122, such as a screw or bolt or pin. Similarly, a number of additional through holes (such as through hole 132A) are formed elsewhere in the support ring 112 for receiving a number of fasteners (such as fastener 122) that couple the support ring 112 to an edge ring as described herein. For example, three through holes are formed in the support ring 112 at the vertices of an equilateral triangle in a horizontal plane along the x-axis. As another example, six or nine through holes are formed in the support ring 112, and the distance between the through holes in one set of adjacent through holes is substantially equal (e.g., equal or within a predetermined limit) to the distance between the through holes in another set of adjacent through holes. It should be noted that in this set of adjacent through holes, at least one through hole is not the same as at least one of the other set of adjacent through holes.

[0047] The fastener 122 is made of a metal, such as steel, aluminum, a steel alloy, or an aluminum alloy. The through hole 132A is formed to match the shape of the fastener 122. For example, the fastener 122 has a head with a diameter larger than the body of the fastener 122. The lower part of the through hole 132A is fabricated to have a diameter slightly (e.g., a fraction of a millimeter (mm)) larger than the head of the fastener 122. Furthermore, the upper part of the through hole 132A is fabricated to have a diameter slightly (e.g., a fraction of a millimeter) larger than the body of the fastener 122. In addition, the diameter of the through hole 124A is fabricated to be slightly (e.g., a fraction of a millimeter) larger than the threaded portion of the fastener 122. Furthermore, a space is formed along the y-axis between the top surface TS of the slot 125 and the tip of the fastener 122. One example of the space is a gap 1 of about 0 mm or more and about 1 mm or less. Another example of the gap 1 is a space of about 0 mm or more and about .5 mm or less. Yet another example of Gap 1 is a space of about 0 mm or more and about .25 mm or less. The space of Gap 1 is vertically along the y-axis. The space between the top surface TS of the slot 125 and the threaded portion of the fastener 122 is about 0 mm or more and about 0.5 mm or less to reduce the possibility of arcing of RF power occurring within that space. If arcing occurs, the fastener 122 may melt due to the heat generated as a result of the arcing.

[0048] When fastener 122 is inserted into through hole 132A, the head and body of fastener 122 are positioned within support ring 112, and the threaded portion of fastener 122 is inserted into fastener hole 124A formed in edge ring 108. A space such as gap 2 formed between the side of fastener 122 and the inner surface of support ring 112 is about 0 mm or more and about 0.2 mm or less.

[0049] The support ring 112 has embedded therein an electrode EL for receiving radio frequency (RF) power of an RF signal received from an auxiliary RF generator via an auxiliary matching, such as an impedance matching circuit.

[0050] In some embodiments, the support ring 112 is a bond ring.

[0051] In various embodiments, the fastener 122 is made of plastic.

[0052] In some embodiments, the conductive gel layer is replaced with a double-sided conductive tape having conductive gel on both sides. In various embodiments, the conductive gel layer is replaced with a caulking bead having conductive gel.

[0053] In some embodiments, instead of providing fastener holes with multiple threads, an insert, such as a metal casing, is installed in the fastener holes in the bottom surface of the edge ring described herein. Illustratively, the metal casing is screwed into a slot formed in the bottom surface of the edge ring. The insert has threads on its inner surface. Fasteners are then screwed into the threads of the insert instead of being screwed into the threaded fastener holes.

[0054] FIG. 2 is a diagram of one embodiment of a system 200 showing the coupling of power pins 208 to the support ring 112. The system 200 includes an edge ring 228, a cover ring 201, a ground ring 114, an insulator ring 106, a base ring 210, an equipment plate 224, a chuck 104, a support ring 112, a bowl 218, and an insulator wall 230. The insulator wall 230 is a wall of a bias housing of a plasma chamber described herein. The insulator ring 106 is fixed (e.g., not movable) relative to the insulator wall 230. The ground ring 114 is not coated. The edge ring 228 is sometimes referred to herein as a hot edge ring (HER). The edge ring 228 is made of the same material as the edge ring 108 of FIG. 1, except that the edge ring 228 has a different shape than the edge ring 108 of FIG. 1. As one example, the edge ring 228 has an outer diameter along the x-axis of about 13.6 inches or more and about 15 inches or less. As another example, the outer diameter of the edge ring 228 is about 13 inches or more and about 15 inches or less. As yet another example, the edge ring 228 has a thickness measured along the y-axis of about .248 inches. Illustratively, the thickness of the edge ring 228 is about .24 inches or more and about .256 inches or less. A plurality of fastener holes, such as fastener holes 124A of FIG. 1, are formed in the edge ring 228 to secure the edge ring 228 to the support ring 112.

[0055] 1. Cover ring 201 has an annular body, such as a disk-shaped or ring-shaped body. A portion of cover ring 201 overlies and is adjacent to ground ring 114, and another portion of cover ring 201 overlies and is adjacent to base ring 210. Similarly, base ring 210 is made from the same material as base ring 116 of FIG. 1, except that cover ring 201 has a different shape than cover ring 118 of FIG. 1. Cover ring 201 has an annular body, such as a disk-shaped or ring-shaped body. A portion of cover ring 201 overlies and is adjacent to ground ring 114, and another portion of cover ring 201 overlies and is adjacent to base ring 210. Similarly, base ring 210 has a different shape than base ring 116 of FIG. 1, except that cover ring 201 has an annular body, such as a disk-shaped or ring-shaped body. Cover ...

[0056] A portion P5 of the edge ring 228 is coupled to the support ring 112 through the gel layer 110C, thermally sinking the support ring 112 to the edge ring 228. Similarly, another portion P4 of the edge ring 228 is coupled to a portion of the chuck 104 through the gel layer 110C. The edge ring 228 surrounds the top portion PRTN1 of the chuck 104. Another portion P6 of the edge ring 228 is adjacent to a portion of the top surface of the base ring 210. Furthermore, the cover ring 201 surrounds the edge ring 228. The support ring 112 is located below the edge ring 228 and surrounds a portion of the chuck 104. The insulator ring 106 is located below the support ring 112 and surrounds the bottom of the chuck 104. The base ring 210 is located below the cover ring 201 and surrounds a portion of the insulator ring 106. The ground ring 114 surrounds a portion of the insulator ring 106 and the base ring 210. The bowl 218 is located below the insulator ring 106. The insulator wall 230 is located below a portion of the insulator ring 106 and the ground ring 114. The insulator wall 230 is fabricated from an insulator material.

[0057] The power pin feedthrough 206 is inserted through a through hole in the insulator ring 106 and a hole formed in the support ring 112. The power pin feedthrough 206 is a sleeve made of an insulator such as plastic or ceramic to protect the power pin 208. The power pin 208 is disposed in the power pin feedthrough 206. The power pin 210A is a conductive rod made of a metal such as aluminum or steel for conducting RF power to the support ring 112 or to the electrode EL in the support ring 112. The tip of the power pin 210A is in contact with the electrode EL and provides RF power to the electrode EL. The middle part of the power pin feedthrough 206 is surrounded by a mount 216A made of an insulator material.

[0058] An O-ring 214 located on and adjacent to the mount 216A seals the mount 216A against the power pin feedthrough 206. The O-ring 214 surrounds the bottom of the power pin feedthrough 206. An example of an O-ring described herein is a ring made of a metal, such as aluminum or steel. Additionally, another O-ring 204 is provided on the top of the power pin feedthrough 206 to prevent air between the power pin 210A and the power pin feedthrough 206 from entering the plasma in the plasma chamber that includes the system 200. There is no vacuum between the power pin 210A and the power pin feedthrough 206. The O-ring 204 surrounds the top of the power pin feedthrough 206.

[0059] It should be noted that in some embodiments, multiple power pins are used, for example, two power pins can be used with a power pin feedthrough, an O-ring surrounding the bottom of each of the power pin feedthroughs, and an O-ring surrounding the top of each of the power pin feedthroughs to provide power to the electrode EL at multiple locations.

[0060] The standoff RF voltage is generated from the RF power of the RF signal received from the auxiliary RF generator via the auxiliary matching. The standoff RF voltage has a trackable distance 213 from the vertically oriented inner surface 203 of the cover ring 201 to the grounded ring 114. The standoff RF voltage is generated via the trackable distance 213 from the vertically oriented inner surface 203 to the grounded ring 114. It should be noted that in some embodiments, the annular width of the cover ring 201 is selected such that the trackable distance 213 between the edge ring 228 and the grounded ring 114 is a sufficient distance to cause less than a predetermined amount of loss of RF voltage from the edge ring 228 to the grounded ring 114. For example, if a given amount of standoff voltage achieved at the vertically oriented inner surface 203 of the covering ring 201 is 5000 volts (V) and 7 to 10 volts are dissipated per thousandth of an inch (2.54 cm) of the covering ring 201, then the annular width of the covering ring 201 is selected such that the trackable distance 213 or annular width is a ratio of a multiple (such as 2 or 3) of 5000 volts to 10 volts. Illustratively, the ratio is (2×5000) / 10 volts. The trackable distance 213 lies in the xy plane of a cross section of the covering ring 201. The xy plane is formed by and lies between the x and y axes.

[0061] In some embodiments, a number of power pin feedthroughs are coupled to the support ring 112 to provide RF power, each of the power pin feedthroughs having a power pin.

[0062] In some embodiments, the ground ring 114 is coated with a conductive material, such as alumina, to increase the electrical conductivity of the ground ring 114 .

[0063] In various embodiments, the gel layer 110C is disposed in multiple locations along the underside of the edge ring 228 and along the upper surfaces of the support ring 112 and chuck 104 to provide electrical and thermal conductivity between the edge ring 228 and the support ring 112, and between the edge ring 228 and the chuck 104.

[0064] 3A is a diagram of one embodiment of the system 300. Each of the pressure bars 302A and 302B is inserted through a corresponding slot in the bottom surface 308 of the support ring 112. For example, the pressure bar 302A is inserted into a first slot in the bottom surface 308 at location L1 to secure the support ring 112 to the insulator ring 106 at location L1. Similarly, the pressure bar 302B is inserted into a second slot in the bottom surface 308 at location L2 to secure the support ring 112 to the insulator ring 106 at location L2. As another example, each of the pressure bars 302A and 302B has threads on the top thereof that mate with threads in a respective slot formed in the bottom surface 308. As yet another example, each of the pressure bars 302A and 302B has a spring-based telescopic mechanism that contracts prior to insertion into a respective slot in the bottom surface 308 and expands after insertion.

[0065] It should be noted that the size of each through hole formed along the length of the support ring 112 measured along the y-axis varies with the outer diameter (OD) and inner diameter (ID) of the support ring 112. The inner diameter of the support ring 112 varies with the diameter of the chuck 104 of FIGS.

[0066] In various embodiments, any number of pressure bars, such as two or more than two, are used to couple to the support ring 112 .

[0067] FIG. 3B is an isometric view showing the engagement of the pressure bar 302A with the bottom surface 308 of the support ring 112. A slot 330 is formed in the bottom surface along a portion of the length of the support ring 112. The length of the support ring 112 is along the y-axis. A metallic receptacle 332, such as aluminum or steel or titanium or an alloy of aluminum or steel or an alloy of titanium, is fitted into the slot 330. For example, the receptacle 332 is attached to a surface of the slot 330 via an attachment mechanism such as a screw thread. To further illustrate, the slot 330 has threads that mate with the threads of the receptacle 332. The tip of the pressure bar 302A is inserted into and engages the receptacle 332, connecting the pressure bar 302A to the support ring 112.

[0068] 4 is a side view of an embodiment of a system 900 for securing an edge ring 924 and a support ring 112 to an insulator ring 106. Examples of edge rings 924 include edge ring 108 of FIG. 1 and edge ring 228 of FIG. 2. System 900 includes a clasp mechanism 920A, an insulator ring 106, a support ring 112, and an edge ring 924. Clasp mechanism 920A includes an air cylinder 912, a pneumatic piston 922, a threaded adapter 908, a push connector 906, and a mount 604A for attaching pressure bar 302A to insulator wall 230. Mount 604A is attached to insulator wall 230 via a number of shoulder screws 902. Clasp mechanism 920A is coupled to a number of air fittings 914. Air fitting 914 includes air fitting 914A and air fitting 914B provided on a side of clasp mechanism 920A. The clasp mechanism described herein is made of a metal, such as steel, aluminum, a steel alloy, or an aluminum alloy, and the air fitting 914 is also made of a metal, such as steel, aluminum, a steel alloy, or an aluminum alloy.

[0069] The piston 922 has a piston body 916 and a piston rod 918. The piston body 916 is in the air cylinder 912. The diameter of the piston body 916 is larger than the diameter of the piston rod 918. The piston body 916 is integral with or attached to the piston rod 918. The mount 604A is attached to the air cylinder 912 via a number of screws 910 on the top surface of the air cylinder 912. The threaded adapter 908 is inserted into a central opening 930 of the mount 604A. The threaded adapter 908 fits into a slot formed in the top surface of the piston rod 918. The threaded adapter 908 further has a slot into which a push connector 906 fits. The push connector 906 fits with the pressure bar 302A that is inserted through the central opening 930 of the mount 604A. The push connector 906 is attached, such as by screwing, to the bottom of the pressure bar 302A.

[0070] Similarly, the other pressure bar 302B (FIG. 3A) is coupled to another pneumatic mechanism of the clasp mechanism 920B described below. For example, the clasp mechanism 920B includes a piston, such as piston 922, which is coupled to the pressure bar 302B and moves the pressure bar 302B up and down vertically along the y-axis. A thread 932 on the tip of the pressure bar 302A mates with a corresponding thread 934 in a slot 931 formed in the bottom surface 308 of the support ring 112. A top portion PR1 of the pressure bar 302A extends through the bottom surface of the support ring 112 into a slot in the support ring 112, and a middle portion PR2 of the pressure bar 302A extends through a through hole in the insulator ring 106. Similarly, a top portion of the pressure bar 302B extends into a slot in the bottom surface of the support ring 112, and a middle portion of the pressure bar 302B extends into a through hole in the insulator ring 106.

[0071] The support ring 112 is physically connected to the edge ring 924 via one or more fasteners as described above. When air is supplied to the bottom of the air cylinder 912 via the air fitting 914B, pressure is generated by the air beneath the bottom surface of the piston body 916. The pressure generated beneath the bottom surface of the piston body 916 causes the piston 922 to move vertically upward along the y-axis, pushing up the pressure bar 302A. As the pressure bar 302A is pushed up, the support ring 112 is lifted vertically upward relative to the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also lifted vertically upward and away from the insulator ring 106. To remove the support ring 112 and edge ring 924 from the plasma chamber 1512, the support ring 112 and edge ring 924 are pushed vertically upward and away from the insulator ring 106. The support ring 112 and edge ring 924 are removable for replacement or maintenance of the support ring 112, or the edge ring 924, or a combination thereof.

[0072] Meanwhile, when air is supplied to the top of the air cylinder 912 via air fitting 914A, pressure is generated by the air above the top surface of the piston body 916. The pressure generated above the top surface of the piston body 916 causes the piston 922 to move vertically downward along the y-axis, pulling down the pressure bar 302A. As the pressure bar 302A is pulled down, the support ring 112 is pulled vertically downward relative to the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also pulled vertically downward toward the insulator ring 106. The support ring 112 and edge ring 924 are pulled down toward the insulator ring 106 during processing of a substrate placed on the chuck 104.

[0073] Figure 5 is an isometric view of one embodiment of a clasp mechanism 920A. Shown in Figure 5 is one of the screws 910 and the mount 604A.

[0074] FIG. 6A is a diagram of one embodiment of a system 1100 for illustrating the synchronous pull-down operation of multiple pressure bars 302A and 302B (FIG. 3A). The system 1100 includes an air path 1102A, a clasp mechanism 920A, a clasp mechanism 920B, and a clasp mechanism 920C. The clasp mechanisms 920B and 920C have the same structure and function as the clasp mechanism 920A. As an example, the clasp mechanisms 920A-920C each have a double-acting cylinder. The clasp mechanism 920B is connected to the pressure bar 320B via the mount 604B of FIG. 6, and the clasp mechanism 920C is connected to the pressure bar 320C via the mount 604C of FIG. 6.

[0075] The air pathways described herein have multiple tubes, each made from an insulating material such as a plastic and plasticizer combination or plastic. The air pathways are flexible and can be connected to the top or bottom of the clasp mechanisms 920A-C.

[0076] The air path 1102A includes a plurality of tubes 1106A, 1106B, 1106C, 1106D, and 1106E. The tubes 1106A and 1106D are connected to the tube 1106B via a connector C1, and the tubes 1106B and 1106E are connected to the tube 1106C via a connector C2. Each connector connecting the plurality of tubes described herein has a hollow space that allows air to pass through. As an example, each connector connecting the plurality of tubes is made of an insulating material.

[0077] Tube 1106D is connected to top 1104A of clasp mechanism 920A via pneumatic fitting 914A (FIG. 4). Similarly, tube 1106E is connected to top 1104C of clasp mechanism 920B via a pneumatic fitting such as pneumatic fitting 914A, and tube 1106C is connected to top 1104E of clasp mechanism 920C via a pneumatic fitting such as pneumatic fitting 914A.

[0078] Air is supplied to the top 1104A of the clasp mechanism 920A via the tube 1106A, the connector C1, and the tube 1106D. Similarly, air is supplied to the top 1104C of the clasp mechanism 920B via the tube 1106A, the connector C1, the tube 1106B, the connector C2, and the tube 1106E. Furthermore, air is supplied to the top 1104E of the clasp mechanism 920C via the tube 1106A, the connector C1, the tube 1106B, the connector C2, and the tube 1106C. When air is supplied to the tops 1104A, 1104C, and 1104E, the pistons of the clasp mechanisms 920A-920C are pulled down synchronously (e.g., simultaneously) along the y-axis, moving the support ring 112 (FIG. 4) and the edge ring 924 (FIG. 4) toward the insulator ring 112 (FIG. 4).

[0079] Around the power pins 208, the pressure rods 302A and 302B, and the temperature probe shaft 1402 are a number of barrel seals, described below. These barrel seals exert a force on the support ring 112 in an upward vertical direction along the y-axis. The clasp mechanisms 920A-C limit the upward vertical lift and prevent the support ring 112 from rising vertically relative to the chuck 104. Additionally, the clasp mechanisms 920A-C exert a clamping force on the gel layers 110B and 110C (FIGS. 1 and 2) between the edge ring 924 and the chuck 104. The double-acting cylinder exerts a constant force on the support ring 112 in an upward vertical or downward vertical direction, regardless of the temperature of the support ring 112.

[0080] 6B is a diagram of one embodiment of a system 1150 for illustrating the asynchronous pushing up action of multiple pressure bars 302A and 302B (FIG. 3A). System 1150 includes air path 1102B, clasp mechanism 920A, clasp mechanism 920B, and clasp mechanism 920C.

[0081] Air pathway 1102A includes a plurality of tubes 1106F, 1106G, 1106H, 1106I, 1106J, and 1106K. Tubes 1106F and 1106I are connected to tube 1106G via connector C3, and tubes 1106G and 1106J are connected to tube 1106K via connector C4. Tube 1106I is connected to lower portion 1104B of clasp mechanism 920A via air fitting 914B (FIG. 4). Similarly, tube 1106J is connected to lower portion 1104D of clasp mechanism 920B via an air fitting such as air fitting 914B, and tube 1106K is connected to lower portion 1104F of clasp mechanism 920C via an air fitting such as air fitting 914B.

[0082] Air is supplied to the lower portion 1104B of the clasp mechanism 920A via the tube 1106F, the connector C3, and the tube 1106I. Similarly, air is supplied to the lower portion 1104D of the clasp mechanism 920B via the tube 1106F, the connector C3, the tube 1106G, the connector C4, and the tube 1106J. Furthermore, air is supplied to the lower portion 1104F of the clasp mechanism 920C via the tube 1106F, the connector C3, the tube 1106G, the connector C4, and the tube 1106H. When air is supplied to the lower portions 1104B, 1104D, and 1104F, the pistons of the clasp mechanisms 920A-920C are pushed up along the y-axis in a synchronized manner (e.g., simultaneously), moving the support ring 112 (FIG. 4) and the edge ring 924 (FIG. 4) away from the insulator ring 112 (FIG. 4).

[0083] 7 is a block diagram of one embodiment of a system 1200 illustrating the supply of air to the clasp mechanisms 920A-920C. The system 1200 includes a plurality of air compressors 1202A and 1202B, a plurality of air pressure regulators 1204A and 1204B, a plurality of orifices 1206A and 1206B, air paths 1102A and 1102B, and the clasp mechanisms 920A-920C. The air compressor 1202A is coupled to the upper portion of the clasp mechanisms 920A-920C via the regulator 1204A and the orifice 1206A and the air path 1102A. Similarly, the air compressor 1202B is coupled to the lower portion of the clasp mechanisms 920A-920C via the regulator 1204B and the orifice 1206B and the air path 1102B.

[0084] The air compressor 1202A compresses air to generate compressed air. The compressed air is supplied to the air pressure regulator 1204A. The air pressure regulator 1204A controls the pressure of the compressed air, for example by changing the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air having the predetermined air pressure to the upper part of the clasp mechanism 920A via the orifice 1206A and the air path 1102A. An example of the predetermined air pressure described herein is an air pressure of 28 pounds per square inch (psi) (12.7006 Kg / 2.54 square cm). Another example of the predetermined air pressure described herein is an air pressure in the range of 25 psi to 31 psi.

[0085] Similarly, the air compressor 1202B compresses air to generate compressed air. The compressed air is supplied to the air pressure regulator 1204B. The air pressure regulator 1204B controls the pressure of the compressed air to the predetermined air pressure, and supplies the compressed air having the predetermined air pressure to a lower portion of the clasp mechanism 920B via the orifice 1206B and the air path 1102B.

[0086] Figure 8A is an isometric view of one embodiment of the edge ring 228. The edge ring 228 has a top surface 1604. Figure 8A shows a perspective view of a number of fastener holes 124A, 124B, and 124C formed in a bottom surface 1612 of the edge ring 228.

[0087] In some embodiments, any other number of fastener holes (such as six or nine fastener holes) are formed in the bottom surface 1612 to fit the same number of fasteners within each hole. For example, the distance between two adjacent holes in one set of holes formed in the bottom surface 1612 of the edge ring 228 is the same as the distance between two adjacent holes in another set of holes formed in the bottom surface 1612 of the edge ring 228. Illustratively, any one of the two adjacent holes in the set of holes may or may not be the same as one of the two adjacent holes in the other set.

[0088] 8B is a top view of one embodiment of the edge ring 228. The edge ring 228 has an inner diameter ID1 and an outer diameter OD1. The outer diameter OD1 is greater than or equal to about 13.6 inches and less than or equal to about 15 inches. As another example, the diameter OD1 is greater than or equal to about 13.6 inches and less than or equal to about 16 inches. As yet another example, the diameter OD1 is greater than or equal to about 12 inches and less than or equal to about 18 inches. An outer diameter OD1 greater than 13.6 inches (e.g., greater than 14 inches or closer to 15 inches) reduces the likelihood of RF power arcing between the edge ring 228 and the cover ring 118. Inner diameter ID1 is the diameter at the inner circumferential edge of edge ring 228, and outer diameter OD1 is the diameter at the outer circumferential edge of edge ring 228. In a top view of edge ring 228, top surface 1604 is visible.

[0089] FIG. 8C is a cross-sectional view of the edge ring 228 along the AA section shown in FIG. 8B. The edge ring 228 has a top surface 1604 (sometimes referred to herein as a top side) and a bottom surface 1612 (sometimes referred to herein as a bottom side). Each of the top surface 1604 and the bottom surface 1612 is a horizontally oriented surface. The top surface 1612 is sometimes referred to herein as a top side. The edge ring 228 further has an inner surface 1620 (sometimes referred to herein as an inner side) and an outer surface 1614 (sometimes referred to herein as an outer side). The outer surface 1614 is a vertically oriented surface. It is noted that the edge ring 228 has an annular body, such as a circular body, or a ring-shaped body, or a dish-shaped body.

[0090] The edge ring 228 has a step 1622 including an inclined inner surface 1606 and a horizontally oriented inner surface 1608. The inclined inner surface 1606 forms an angle A2 with the vertically oriented inner surface 1610 that is about 15° or about 50°. In one embodiment, the angle A2 is in the range of about 5° to about 55°. In another embodiment, the angle A2 is in the range of between about 12° to about 20°.°. In yet another embodiment, the angle A2 is in the range of about 10° to about 20°. The inclined inner surface 1608 is continuous with the top surface 1604. For example, the inclined inner surface 1606 forms a radius R3 with the top surface 1604. Illustratively, the radius R3 is up to about .01 inches. For example, a curve having a radius R3 is formed between the inclined inner surface 1606 and the top surface 1604. As an example, radius R3 is greater than or equal to about .009 inches and less than or equal to about .011 inches.

[0091] The horizontally oriented inner surface 1608 is continuous with the inclined surface 1606. For example, the horizontally oriented inner surface 1608 forms a radius R4 with the inclined inner surface 1606. Illustratively, the radius R4 is about 0.032 inches. For example, a curve having a radius R4 is formed between the horizontally oriented inner surface 1608 and the inclined inner surface 1606. As an example, the radius R4 is greater than or equal to about .003 inches and less than or equal to about .0034 inches. The mid-diameter (MD) of the location on the edge ring 228 where the radius R4 is formed is about 11.858 inches. For example, the mid-diameter is greater than or equal to about 11.856 inches and less than or equal to about 11.86 inches.

[0092] The horizontal orientation surface described herein is substantially parallel to the x-axis, and the vertical orientation surface described herein is substantially parallel to the y-axis. For example, the horizontal orientation surface forms an angle in the range of -5° to +5° with respect to the x-axis, and the vertical orientation surface forms an angle in the range of -5° to +5° with respect to the y-axis. By way of example, the horizontal orientation surface is parallel to the x-axis and perpendicular to the y-axis, and the vertical orientation surface is parallel to the y-axis and perpendicular to the x-axis. The inclined surface described herein is neither a vertical orientation surface nor a horizontal orientation surface.

[0093] The horizontally oriented inner surface 1608 is separated from the top surface 1604 by the angled inner surface 1606. For example, the angled inner surface 1606 is adjacent to the top surface 1604 and the horizontally oriented inner surface 1608, but the horizontally oriented inner surface 1608 is not adjacent to the top surface 1604.

[0094] Additionally, the inner surface 1620 has a vertically oriented inner surface 1610 that is continuous with the horizontally oriented inner surface 1608. For example, the vertically oriented inner surface 1610 forms a radius R5 with respect to the horizontally oriented inner surface 1608. Illustratively, a curve having a radius R5 is formed between the vertically oriented inner surface 1610 and the horizontally oriented inner surface 1608. Illustratively, the radius R5 is about 0.012 inches. Illustratively, the radius R5 is greater than or equal to about .007 inches and less than or equal to about .017 inches. The vertically oriented inner surface 1610 has a distance d3 along the y-axis of about .0169 inches. For example, the distance d3 is greater than or equal to about .0164 inches and less than or equal to about 0.0174 inches. The distance of the vertically oriented surface is the length of the vertically oriented surface along the vertical y-axis. Additionally, the distance of the horizontally oriented surface is the width of the horizontally oriented surface along the horizontal x-axis. Additionally, the distance of the inclined surface is measured vertically along the y-axis. The vertically oriented inner surface 1610 has an inner diameter ID1, where the inner diameter ID1 is about 11.7 inches. For example, the inner diameter ID1 is greater than or equal to about 11 inches and less than or equal to about 12.4 inches.

[0095] Further, the inner surface 1620 has an inclined inner surface 1618 that is inclined with respect to the vertically oriented inner surface 1610 and the bottom surface 1612. The inclined inner surface 1618 is continuous with the vertically oriented inner surface 1610. For example, the inclined inner surface 1618 forms a radius R6 with respect to the vertically oriented inner surface 1610. Illustratively, a curve having a radius R6 is formed between the inclined inner surface 1618 and the vertically oriented inner surface 1610. Illustratively, the radius R6 is about .015 inches. Illustratively, the radius R6 is about .0149 inches or more and about .0151 inches or less. Further, the inclined inner surface 1618 is continuous with the bottom surface 1612. For example, the inclined inner surface 1618 forms a radius R7 with respect to the bottom surface 1612. Illustratively, a curve having a radius R7 is formed between the angled inner surface 1618 and the bottom surface 1612. Illustratively, radius R7 is about twice radius R6. Illustratively, radius R6 is about 2×.0149 inches or more and about 2×.0151 inches or less.

[0096] The length d2 of the inclined inner surface 1618 is about 0.035 inches. For example, the length d2 is about .0345 inches or more and about .0355 inches or less. The inclined inner surface 1618 forms an angle A1 with the vertically oriented inner surface 1610 that is about 30°. For example, the angle A1 is about 28° or more and about 32° or less. It should be noted that the combination of the inclined inner surface 1606, the horizontally oriented inner surface 1608, the vertically oriented inner surface 1610, and the inclined inner surface 1618 are sometimes referred to herein as the inside of the edge ring 228.

[0097] The outer surface 1614 is continuous (e.g., adjacent or continuous) with the bottom surface 1612. For example, the outer surface 1614 forms a radius R2 with the bottom surface 1612. Illustratively, a curve having a radius R2 is formed between the outer surface 1614 and the bottom surface 1612. By way of example, the radius R2 is about .012 inches. Illustratively, the radius R2 is greater than or equal to .0119 inches and less than or equal to .0121 inches.

[0098] The edge ring 228 includes a curved edge 1616 formed between the top surface 1604 and the outer surface 1614 of the edge ring 228. For example, the curved edge 1616 is adjacent (e.g., adjacent to) the top surface 1604 and the outer surface 1614. The curved edge 1616 has a radius R1. By way of example, the radius R1 is about .1 inches. By way of example, the radius R1 is in the range of .8 inches to .12 inches. The curvature of the curved edge 1616 reduces the possibility of arcing of RF power occurring between the edge ring 228 and the cover ring 201. Arcing occurs when a plasma is formed and maintained in the plasma chamber 1512. Sharp edges increase the possibility of arcing. Distance d1, which is the sum of the perpendicular distance between the height of curved edge 1616 along the y-axis and the length of side 1614 along the y-axis, is about .23 inches. As an example, distance d1 is about .229 inches or more and about .231 inches or less. Outer diameter OD1 of outer surface 1614 is about 14.06 inches, and as an example, outer diameter OD1 ranges from 13.5 inches to 14.5 inches. It should be noted that the inner or outer or intermediate diameters of edge rings described herein are defined relative to a central axis passing through the center of gravity of the edge ring.

[0099] It should be noted that the edge ring described herein is a consumable item. For example, the edge ring may wear out after multiple uses to process substrate 1518 of FIG. 15. Illustratively, the plasma used to process substrate 1508 leaves behind residual material that erodes the edge ring. In turn, the plasma erodes the edge ring.

[0100] In addition, the edge ring is replaceable. For example, the edge ring is replaced after repeated use of the edge ring. Illustratively, the edge ring is pushed vertically up and away from the insulator ring 106 (FIG. 2) using the pressure bars 302A and 302B of FIG. 3A and removed from the insulator ring 106 of FIGS. 1 and 2. The edge ring is then replaced with another edge ring. The other edge ring is then pushed vertically down towards the insulator ring 106 using the pressure bars 302A and 302B for processing the substrate 1518 or another substrate.

[0101] In some embodiments, the radii R1-R7 of the edge of the edge ring 228 are each greater than about 0.03 inches (0.0762 cm) to reduce the likelihood of RF power arcing to or away from the edge. By way of further example, the radii R1-R7 of the edge of the edge ring 228 are each greater than about 0.03 inches (0.0762 cm) and less than about 0.1 inches (0.254 cm) to reduce the likelihood of RF power arcing to or away from the edge. Note that in various embodiments, the radii R1-R7 are each greater than about 0.01 inches (0.0254 cm) and less than about 0.03 inches (0.0762 cm). A radius of about 0.01 inches (0.0254 cm) and less than about 0.03 inches (0.0762 cm) reduces the likelihood of chipping of the edge of the radius during fabrication of a semiconductor wafer.

[0102] In one embodiment, the edge ring 228 has multiple edges. In one embodiment, the edges defining the edge ring 228 are rounded. By way of example, the edges of the edge ring 228 having radii RA and RC are rounded to a radius of about .03 inches or more. It has been found that less rounding of these edges may be insufficient to prevent or reduce the possibility of arcing of RF power during operation of the plasma chamber. Arcing is affected by the sharpness of the edges of features in the plasma chamber, and reducing the possibility of arcing may be detrimental to the fabrication processes carried out on and across the semiconductor wafer. A slight rounding of the edges (e.g., radii RA and RC of about .03 inches or less, radii RA and RC of about .01 inches or more, and radii RA and RC of about .03 inches or less) helps reduce the possibility of particle generation during semiconductor wafer fabrication or edge chipping during fabrication. As a result, features disposed within a plasma chamber have been provided with some degree of rounding (e.g., radii RA and RC), but this rounding is less than sufficient to prevent or reduce arcing given the high power levels used in plasma processing operations.

[0103] FIG. 8D is a diagram of one embodiment of a system 1650 illustrating coupling of a fastener 122 to an edge ring 228. A cross-sectional view of the edge ring 228 is taken along cross-section aa shown in FIG. 8A. A slot 125 is drilled in a bottom surface 1612 of the edge ring 228. In addition to drilling the slot 125, a thread 1652 is formed on a side surface SS of the slot 125. The side surface SS is substantially perpendicular (e.g., perpendicular or in the range of 85-95°) to a top surface TS of the slot 125. The slot 125 surrounds a fastener hole 124A.

[0104] The fastener 122 has a thread 1654 formed at a tip thereof. Additionally, the fastener 122 has a body 1658 below the thread 1654. A head 1660 of the fastener 122 is located below the body 1658.

[0105] Fastener 122 is inserted into fastener hole 124A and turned clockwise to engage threads 1654 with threads 1652 to connect support ring 112 (FIG. 1) with edge ring 228. Similarly, additional fasteners (such as fastener 122) are inserted into multiple fastener holes 124B and 124C to connect support ring 112 with edge ring 228. Multiple fastener holes 124B and 124C are formed in respective slots in bottom surface 1612 of edge ring 228. For example, fastener holes 124A-124C form vertices of an equilateral triangle in the horizontal plane of bottom surface 1612 of edge ring 228. When four or more fastener holes are formed in bottom surface 1612, the fastener holes are substantially equidistantly spaced (e.g., equidistantly spaced). For example, the distance between two adjacent fastener holes in one set of fastener holes in the bottom surface 1612 is the same as the distance between two adjacent fastener holes in another set of fastener holes in the bottom surface 1612. A set is different from another set when at least one fastener hole in a set of fastener holes including two fastener holes is not the same as one fastener hole in another set of fastener holes. For example, two different sets of fastener holes have at least one fastener hole that is not common. For another example, the distance between two adjacent fastener holes in one set of fastener holes is within a predetermined limit relative to the distance between two adjacent fastener holes in another set of fastener holes in the bottom surface 1612. When the support ring 112 is connected with the edge ring 228 and the edge ring 228 or the support ring 112 is moved, the edge ring 228 and the support ring 112 move simultaneously in a vertical direction along the y-axis or a horizontal direction along the x-axis.

[0106] 9A is an isometric view of one embodiment of a covering ring 202. Covering ring 202 is used in some embodiments in place of covering ring 201 of FIG. 2. Covering ring 202 has a top surface 1704. It is noted that the covering rings described herein are consumable items. For example, the covering ring may wear out after multiple uses during processing of substrate 1518 of FIG. 15. Illustratively, processing of substrate 1508 with a plasma results in residual material that erodes the covering ring. In turn, the plasma erodes the covering ring.

[0107] In addition, the covering ring may be replaceable, e.g., after repeated use of the covering ring, e.g., the covering ring may be removed from the plasma chamber 1512 for replacement with another covering ring.

[0108] 9B is a bottom view of one embodiment of the covering 202. The covering has a bottom surface 1705.

[0109] 9C is a top view of one embodiment of the covering ring 202. The covering ring 202 has an inner diameter ID2 and a width W1. The inner diameter ID2 is the diameter of the inner peripheral edge of the covering ring 202. The width W1 is the width of the annular body of the covering ring 202, and is the width between the inner diameter ID1 and the outer diameter of the covering ring 202.

[0110] 9D is a cross-sectional view of one embodiment of the covering ring 202 along section AA of FIG. 9C. The covering ring 202 has a vertically oriented inner surface 1724, another vertically oriented inner surface 1720, a vertically oriented outer surface 1716, another vertically oriented outer surface 1714, and a vertically oriented outer surface 1710. The vertically oriented inner surface 1724 has a diameter ID2. The diameter ID2 is about 13.615 inches. For example, the diameter ID2 is about 13.4 inches or more and about 13.8 inches or less. Furthermore, the vertically oriented inner surface 1720 has a diameter D1. The diameter D1 is about 13.91 inches. For example, the diameter D1 is about 13.8 inches or more and about 14 inches or less. Additionally, the diameter of the vertically oriented outer surface 1716 is D2. The diameter D2 is about 14.21 inches. For example, the diameter D2 is greater than or equal to about 14 inches and less than or equal to about 14.5 inches. The diameter of the vertically oriented outer surface 1714 is D3, and the diameter of the vertically oriented outer surface 1710 is OD2. The diameter D3 is about 14.38 inches. For example, the diameter D3 is greater than or equal to about 14.2 inches and less than or equal to about 14.5 inches. The diameter OD2 is about 14.7 inches. For example, the diameter OD2 is greater than or equal to about 14 inches and less than or equal to about 15 inches.

[0111] Diameter D1 is larger than diameter ID2. Furthermore, diameter D2 is larger than diameter D1, diameter D3 is larger than diameter D2, and diameter OD2 is larger than diameter D3.

[0112] 9E is a cross-sectional view of one embodiment of the covering ring 202. The covering ring 202 includes an upper body portion 1730, an intermediate body portion 1732, and a lower body portion 1734. The upper body portion 1730 has a vertically oriented outer surface 1710, a horizontally oriented outer surface 1712, another horizontally oriented inner surface 1722, a vertically oriented inner surface 1724, and a horizontally oriented top surface 1704. A curved edge 1706 is formed between the vertically oriented outer surface 1710 and the top surface 1704. The curved edge 1706 has a radius RC that is about 0.06 inches. For example, the radius RC is about 0.059 inches or more and about 0.061 inches or less. The curved edge 1706 is continuous (eg, continuous with or adjacent to) the top surface 1704 and the vertically oriented outer surface 1710 .

[0113] The vertically oriented outer surface 1710 is continuous with the horizontally oriented surface 1712. For example, a curve having a radius RD is formed between the vertically oriented outer surface 1710 and the horizontally oriented surface 1712. The radius RD is about .015 inches. For example, the radius RD is greater than or equal to about .0145 inches and less than or equal to about .0155 inches.

[0114] Additionally, the horizontally oriented inner surface 1722 is continuous with the vertically oriented inner surface 1724. For example, a curve having a radius RK is formed between the vertically oriented inner surface 1724 and the horizontally oriented inner surface 1722. Illustratively, the radius RK is about .015 inches. As an example, the radius RK is greater than or equal to about .0145 inches and less than or equal to about .0155 inches.

[0115] Additionally, the top surface 1704 is continuous with the vertically oriented inner surface 1724. For example, a curve having a radius RA is formed between the vertically oriented inner surface 1724 and the top surface 1704. Illustratively, the radius RA is about .015 inches. As an example, the radius RA is about .0145 inches or more and about .0155 inches or less. The radius RA reduces the likelihood of RF power arcing between the cover ring 202 and the edge ring 228. Arcing occurs during formation of a plasma in the plasma chamber 1512.

[0116] The middle body portion 1732 includes a vertically oriented inner surface 1720, a vertically oriented outer surface 1714, and a horizontally oriented outer surface 1716. The vertically oriented outer surface 1714 is continuous with the horizontally oriented outer surface 1712 of the upper body portion 1730. For example, a curve having a radius RE is formed between the vertically oriented outer surface 1714 and the horizontally oriented outer surface 1712. In one example, the radius RE is about .03 inches. Illustratively, the radius RE is greater than or equal to about .029 inches and less than or equal to about .31 inches.

[0117] Additionally, the vertically oriented inner surface 1720 is continuous with the horizontally oriented inner surface 1722 of the upper body portion 1730. For example, a curve having a radius RB is formed between the horizontally oriented inner surface 1722 and the vertically oriented inner surface 1720. By way of example, the radius RB is about .01 inch (.0254 cm). Illustratively, the radius RB is greater than or equal to about .09 inch (.02286 cm) and less than or equal to about .011 inch (.02794 cm).

[0118] The horizontally oriented outer surface 1716 is continuous with the vertically oriented outer surface 1714. For example, a curve having a radius RF is formed between the horizontally oriented outer surface 1716 and the vertically oriented outer surface 1714. By way of example, the radius RF is about .015 inches. By way of example, the radius RF is greater than or equal to about .0145 inches and less than or equal to about .0155 inches.

[0119] The lower body portion 1734 includes a vertically oriented inner surface 1736, a bottom surface 1718, and a vertically oriented outer surface 1719. The vertically oriented inner surface 1736 is continuous with the vertically oriented inner surface 1720 of the middle body portion 1732. For example, the vertically oriented inner surfaces 1720 and 1736 are integrated as one surface and have the same diameter D1 (FIG. 9D). The vertically oriented inner surface 1736 is continuous with the bottom surface 1718. For example, a curve having a radius RJ is formed between the vertically oriented inner surface 1736 and the bottom surface 1718. By way of example, the radius RJ is about .02 inches. By way of example, the radius RJ is about .019 inches or more and about .021 inches or less.

[0120] Vertically oriented outer surface 1719 is continuous with bottom surface 1718. For example, a curve having a radius RH is formed between bottom surface 1718 and vertically oriented outer surface 1719. By way of example, radius RH is about .02 inches. Illustratively, radius RH is greater than or equal to about .019 inches and less than or equal to about .021 inches.

[0121] The vertically oriented outer surface 1719 is continuous with the horizontally oriented outer surface 1716 of the intermediate body portion 1732. For example, a curve having a radius RG is formed between the vertically oriented outer surface 1719 and the horizontally oriented outer surface 1716. By way of example, the radius RG is about .01 inch (about 0.0254 cm). By way of example, the radius RG is about .09 inch (about 0.2286 cm) or more and about .011 inch (about 0.0279 cm) or less.

[0122] A vertical distance dB, such as the distance along the y-axis, is formed between the horizontally oriented inner surface 1722 and the top surface 1704. By way of example, the vertical distance dB is about .27 inches (about 0.6858 cm). By way of illustration, the vertical distance dB is greater than or equal to about .25 inches (about 0.635 cm) and less than or equal to about .29 inches (about 0.7366 cm).

[0123] Additionally, a vertical distance dA is formed between the vertically oriented outer surface 1712 and the vertically oriented inner surface 1722. By way of example, the distance dA is about .011 inches. By way of example, the distance dA is greater than or equal to about .009 inches and less than or equal to about .013 inches.

[0124] Additionally, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented outer surface 1716 is dD. By way of example, the distance dD is about .172 inches. By way of example, the distance dD is greater than or equal to about .17 inches and less than or equal to about .174 inches.

[0125] Additionally, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented bottom surface 1718 is designated dC. As an example, the distance dC is about .267 inches. By way of example, the distance dC is greater than or equal to about .265 inches and less than or equal to about .269 inches.

[0126] It should be noted that bottom surface 1705 of covering 202 includes horizontally oriented inner surface 1722 , vertically oriented inner surfaces 1720 and 1736 , bottom surface 1718 , vertically oriented outer surface 1719 , horizontally oriented outer surface 1716 , vertically oriented outer surface 1714 , and horizontally oriented outer surface 1712 .

[0127] Additionally, note that all edges of covering 202 are arcuate, e.g., curved. For example, radii RA, RB, RC, RD, RE, RF, RG, RH, RJ, and RK define arcuate edges.

[0128] 9F is a cross-sectional view of one embodiment of a system including edge ring 228, cover ring 202, base ring 210, and ground ring 212. A reduced width step 1726 with a turn is formed from vertically oriented inner surface 1724 to vertically oriented inner surface 1720. The reduced width step 1726 is disposed horizontally along the x-axis (e.g., in the +x or x-direction). The reduced width step 1726 is between top body portion 1730 and middle body portion 1732. The reduced width 1726 is disposed in the +x-direction away from edge ring 228.

[0129] Additionally, another reduced width step 1729 is formed that occurs from vertically oriented outer surface 1710 to vertically oriented outer surface 1714. Again, reduced width step 1729 is horizontal (e.g., in the −x direction of the x-axis) but in the opposite direction to reduced width step 1726. Reduced width step 1729 is in the direction away from edge ring 228.

[0130] Intermediate body portion 1732 is formed with a depth 1762 that is the distance from horizontally oriented inner surface 1722 to horizontally oriented outer surface 1716. Depth, as used herein, is the depth in the y-axis direction (e.g., the -y direction).

[0131] In addition, another reduced width step 1728 is formed from vertically oriented outer surface 1714 to vertically oriented outer surface 1719. Reduced width step 1728 is located in the -x direction.

[0132] Additionally, another depth 1764 is formed between the horizontally oriented outer surface 1716 and the bottom surface 1718 of the lower body portion 1734. Depth 1764 is the depth of the lower body portion 1734. Note that depth 1764 is less than depth 1762. Additionally, the depth of the vertically oriented inner surface 1724 is greater than depth 1762.

[0133] An annular width 1746 is formed between the vertically oriented inner surface 1720 and the vertically oriented outer surface 1714. As used herein, annular width is along the x-axis. Additionally, another annular width 1754 is formed between the vertically oriented inner surface 1736 and the vertically oriented outer surface 1719. Annular width 1754 is smaller than annular width 1746.

[0134] The tracking distance 1735 is the distance between the edge ring 228 and the ground ring 212. The tracking distance 1735 is along the width L11 of the horizontally oriented inner surface 1722, the combined length L12 of the vertically oriented inner surfaces 1720 and 1736, the width L13 of the bottom surface 1718, the length L14 of the vertically oriented outer surface 1719, and the width L15 of the horizontally oriented outer surface 1716. The combined length L12 is the sum of the length of the vertically oriented inner surface 1720 and the length of the vertically oriented inner surface 1736. The tracking distance 1735 is the path that the voltage received from the RF power pins 208 dissipates along the cover ring 202. The edge ring 228 acts as a capacitor plate of the capacitor, and the electrode EL (FIG. 2) acts as another capacitor plate of the capacitor, with the dielectric material of the support ring 112 between these two capacitor plates. Distance 1 is the horizontal distance along the x-axis between the edge ring 228 and the ground ring 212 for the voltage provided by the RF power pin 208 to dissipate.

[0135] The tracking distance 1735 or distance 1 defines the annular width of the covering ring 202. Additionally, the voltage dissipation along the tracking distance 1735 or distance 1 defines the annular width of the covering ring 202. The annular width of the covering ring 202 is the difference between an inner diameter ID2 of the covering ring 202 and an outer diameter OD2 of the covering ring 202. The annular width of the covering ring 202 is defined such that a predetermined amount of standoff voltage is achieved at the vertically oriented inner surface 1724. For example, assuming 7 to 10 volts are dissipated along one thousandth of an inch of the covering ring 202 and the standoff voltage at the vertically oriented inner surface 1724 is 5000 volts, then the annular width of the covering ring 202 is equal to the ratio of a multiple (such as 2 or 3) of 5000 volts to the 7 to 10 volts dissipation per one thousandth of an inch of the covering ring 202.

[0136] In some embodiments, depth 1764 is greater than depth 1762. Further, in various embodiments, the depth of vertically oriented inner surface 1724 is less than depth 1762.

[0137] 9G is a cross-sectional view of one embodiment of a system including edge ring 108, cover ring 118, base ring 116, and ground ring 114. Cover ring 118 includes upper body portion 1761, middle body portion 1763, and lower body portion 1765.

[0138] The upper body portion 1761 includes a vertically oriented inner surface 1782, a horizontally oriented top surface 1766, a vertically oriented outer surface 1768, and a horizontally oriented outer surface 1770. The vertically oriented outer surface 1768 is continuous with the top surface 1766, and the horizontally oriented outer surface 1770 is continuous with the vertically oriented outer surface 1768. For example, a curve having a radius is formed between the vertically oriented outer surface 1768 and the top surface 1766, and a curve having a radius is formed between the horizontally oriented outer surface 1770 and the vertically oriented outer surface 1768. Additionally, the vertically oriented inner surface 1782 is continuous with the top surface 1766. For example, a curve having a radius is formed between the vertically oriented inner surface 1782 and the top surface 1766.

[0139] The middle body portion 1763 includes a vertically oriented outer surface 1772, a vertically oriented inner surface 1780, and a horizontally oriented inner surface 1781. The vertically oriented outer surface 1772 is continuous with the horizontally oriented outer surface 1770 of the upper body portion 1761. For example, a curve having a radius is formed between the vertically oriented outer surface 1772 and the horizontally oriented outer surface 1770.

[0140] Further, vertically oriented inner surface 1780 is contiguous (e.g., adjacent) with vertically oriented inner surface 1782. Illustratively, vertically oriented inner surface 1782 is in the same vertical plane as vertically oriented inner surface 1782.

[0141] Horizontally oriented inner surface 1781 is continuous with vertically oriented inner surface 1780. For example, a curve having a radius is formed between horizontally oriented inner surface 1781 and vertically oriented inner surface 1780.

[0142] Lower body portion 1765 includes a vertically oriented outer surface 1774, a horizontally oriented bottom surface 1776, and a vertically oriented inner surface 1778. Vertically oriented inner surface 1778 is continuous with a horizontally oriented inner surface 1781 of intermediate body portion 1763. For example, a curve having a radius is formed between vertically oriented inner surface 1778 and horizontally oriented inner surface 1781.

[0143] Additionally, the bottom surface 1776 is continuous with the vertically oriented inner surface 1778. For example, a curve having a radius is formed between the bottom surface 1776 and the vertically oriented inner surface 1778.

[0144] Additionally, bottom surface 1776 is continuous with vertically oriented outer surface 1774. For example, a curve having a radius is formed between bottom surface 1776 and vertically oriented outer surface 1774. Vertically oriented outer surface 1774 is in the same vertical plane as vertically oriented outer surface 1772 of intermediate body portion 1763.

[0145] A reduced width step 1783 is formed between the vertically oriented outer surface 1768 of the top body portion 1761 and the vertically oriented outer surface 1772 of the intermediate body portion 1763. The reduced width step 1783 is disposed in the -x direction toward the edge ring 108.

[0146] Additionally, another reduced width step 1784 is formed from the vertically oriented inner surface 1780 of the intermediate body portion 1763 to the horizontally oriented inner portion 1781 of the intermediate body portion 1763. The reduced width step 1784 from the vertically oriented inner surface 1780 is formed in the +x direction of the x-axis, away from the edge ring 108.

[0147] An annular width 1786 is formed between the vertically oriented inner surface 1780 and the vertically oriented outer surface 1772 of the middle body portion 1760. The annular width 1786 is aligned along the x-axis. Additionally, another annular width 1788 is formed between the vertically oriented inner surface 1778 and the vertically oriented outer surface 1774 of the lower body portion 1765. The annular width 1788 is aligned along the x-axis. The annular width 1788 is smaller than the annular width 1786.

[0148] A depth 1790 of middle body portion 1763 is defined along the y-axis from horizontally-oriented outer surface 1770 to horizontally-oriented inner surface 1781. Additionally, lower body portion 1765 defines another depth 1792 along the y-axis from horizontally-oriented inner surface 1781 to bottom surface 1776. Depth 1792 is less than depth 1790.

[0149] Note that the bottom surface of cover ring 118 includes surfaces 1781 , 1778 , 1776 , 1774 , 1772 , and 1770 .

[0150] A tracking distance 1794 is formed between the edge ring 108 and the ground ring 114. The tracking distance 1794 is along a depth L21 along the y-axis of the vertically oriented inner surface 1780, a width L22 along the x-axis of the horizontally oriented inner surface 1781, a depth L23 of the vertically oriented inner surface 1778, and a width L24 of the bottom surface 1776. The depth L23 is the same as the depth 1792. The tracking distance 1794 is the path by which a voltage received by the edge ring 108 through the support ring 112 reaches the ground ring 114. The edge ring 108 acts as a capacitor plate of a capacitor, and the electrode EL (FIG. 2) acts as another capacitor plate of the capacitor, with the dielectric material of the support ring 112 between these two capacitor plates.

[0151] Distance 2 along the x-axis is formed between edge ring 108 and ground ring 114. Distance 2 is less than distance 1 in FIG. 9F. Upper body portion 1730 of cover ring 202 in FIG. 9F is wider than upper body portion 1761 of cover ring 118 because the outer diameter of edge ring 228 in FIG. 9F is smaller than the outer diameter of edge ring 108. Distance 1 is greater than distance 2 because the width of upper body portion 1730 is greater than the width of upper body portion 1761. The smaller width of edge ring 228 compared to edge ring 108 is compensated for by the larger distance 1 to provide a predetermined amount of distance for the RF voltage of the RF signal provided by power pin 208 (FIG. 2) to traverse through tracking distance 213 (FIG. 2) or 1735 (FIG. 9F) to ground ring 212. For example, there is a loss of about 7 to about 10 volts per thousandth of an inch (2.54 thousandths of a centimeter) of the cover ring. If a given standoff voltage of 5000V is to be achieved on the vertically oriented inner surface of the upper body portion of the covering ring, then the annular width of the upper body portion of the covering ring is calculated as (positive real number x 5000) / (volts lost per thousandth of an inch (2.54 thousandths of a centimeter) of the covering ring), where "positive real number" is a multiple of 2 or 3 or 4, etc.

[0152] In some embodiments, the depth 1792 is greater than the depth 1790 .

[0153] The embodiments described herein may be practiced with a variety of computer system configurations including handheld hardware units, microprocessor systems, microprocessor-based or programmable consumer electronics, minicomputers, mainframe computers, etc. The embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing hardware units that are linked through a network.

[0154] In some embodiments, the controller described herein is part of a system, and such a system may be part of the examples described above. Such a system includes semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (wafer pedestal, gas flow system, etc.). These systems are integrated with electronics for controlling the system operations before, during, and after processing of a semiconductor wafer or substrate. Such electronics may be referred to as a "controller" and may control various components or subparts of the system or systems. The controller is programmed to control any of the processes disclosed herein depending on the processing requirements and / or type of system. Such processes include supply of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, RF generator settings, RF matching circuit settings, frequency settings, flow settings, fluid supply settings, position and motion settings, wafer loading and unloading from the tool, and wafer loading and unloading from other transport tools and / or load locks connected or interlocked with the system.

[0155] Broadly, in various embodiments, a controller is defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as ASICs, PLDs, and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions are instructions communicated to the controller in the form of various individual settings (or program files) that define parameters, coefficients, variables, etc. for performing a particular process on or for a semiconductor wafer or for a system. Program instructions, in some embodiments, are part of a recipe defined by a process engineer to accomplish one or more processing steps in the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0156] The controller, in some embodiments, is part of, coupled to, or a combination of a computer that is integrated or coupled with the system or otherwise networked to the system. For example, the controller may be in the "cloud" or all or part of a fab host computer system, allowing remote access of wafer processing. The computer allows remote access to the system to monitor the current progress of a fabrication operation, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, change parameters of a current process, set up processing steps following a current process, or create a new process 17D.

[0157] In some examples, a remote computer (e.g., a server) provides the process recipe to the system over a network. Such a network includes a local network or the Internet. The remote computer includes a user interface that allows for entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters, coefficients, and / or variables for each of the processing steps performed during one or more operations. It should be understood that the parameters, coefficients, and / or variables are specific to the type of process performed and the type of tool the controller is configured to interface with or control. Thus, as described above, the controller is distributed, for example, by including one or more individual controllers that are networked together and cooperate toward a common purpose (such as the processes and controls described herein). One example of a distributed controller for such purposes includes one or more integrated circuits on the chamber that are remotely located (e.g., at the platform level or as part of a remote computer) and communicate with one or more integrated circuits that are coupled to control the process in the chamber.

[0158] Without being limited thereto, in various embodiments, exemplary systems to which the methods may be applied include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, plasma enhanced chemical vapor deposition (PECVD) chambers or modules, cleaning type chambers or modules, ion implantation chambers or modules, tracking chambers or modules, and any other semiconductor processing systems associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0159] Further, it should be noted that in some embodiments, the above operations apply to multiple types of plasma chambers, such as plasma chambers including inductively coupled plasma (ICP) reactors, transformer coupled plasma chambers, conductor tools, dielectric tools, plasma chambers including electron cyclotron resonance (ECR) reactors, etc. For example, one or more RF generators are coupled to an inductor in an ICP reactor. Examples of inductor shapes include a solenoid, a dome coil, a planar coil, etc.

[0160] As described above, depending on the process step or steps being performed by the tool, the host computer communicates with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used for material transport to and from tool locations and / or load ports within the semiconductor manufacturing factory.

[0161] With the above embodiments in mind, it should be understood that some of the embodiments employ various computer-implemented operations involving data stored in computer systems. These operations are operations that physically manipulate physical quantities. Any of the operations described herein that form part of the embodiments are useful machine operations.

[0162] Some of the embodiments also relate to hardware units or devices for performing these operations. The device is specially constructed for a special purpose computer. When defined as a special purpose computer, the computer is operable for its dedicated purpose while performing other processes, program execution or routines that are not part of its dedicated purpose.

[0163] In some embodiments, the operations may be processed by a computer selectively activated or configured by one or more computer programs stored in a computer memory, cache, or obtained over a computer network. If data is obtained over a computer network, the data may be processed by other computers on the computer network, e.g., a cloud of computing resources.

[0164] One or more embodiments may also be fabricated as computer readable code on a non-transitory computer readable medium. A non-transitory computer readable medium is any data storage hardware unit (e.g., memory device, etc.) that stores data, which is then read by a computer system. Examples of non-transitory computer readable media include hard drives, network attached storage (NAS), ROM, RAM, compact disk ROM (CD-ROM), CD recordable (CD-R), CD rewriteable (CD-RW), magnetic tape, and other optical and non-optical data storage hardware units. In some embodiments, a non-transitory computer readable medium includes a computer readable tangible medium distributed over a network-coupled computer system such that the computer readable code is stored and executed in a distributed manner.

[0165] Although the method operations above have been described in a particular order, it should be understood that in various embodiments, other housekeeping operations are performed between each operation, or the method operations are coordinated to occur at slightly different times, or are distributed across a system that allows the method operations to occur at various intervals, or are performed in an order other than that described above.

[0166] Furthermore, it should be noted that in one embodiment, one or more features of any of the above-described embodiments may be combined with one or more features of any other embodiment without departing from the scope described in the various embodiments described in this disclosure.

[0167] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Thus, the present embodiments are to be considered as illustrative and not restrictive, and the embodiments should not be limited to the details set forth herein.

Claims

1. 1. An edge ring for use in a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber; the annular body having a bottom side, a top side, an inner side, and an outer side; a plurality of fastener holes disposed on the annular body along the bottom side, each fastener hole having a threaded inner surface for receiving a fastener used to attach the annular body to a support ring; a step disposed on the interior of the annular body, the step having a lower surface separated from the top upper surface by a sloped surface; a curved edge formed between the top surface and the outer side of the top side; An edge ring.

2. 2. The edge ring of claim 1, The edge ring is a consumable item and is replaceable.

3. 2. The edge ring of claim 1, the inner side has the inclined surface, a horizontally oriented surface continuous with the inclined surface, and a vertically oriented surface continuous with the horizontally oriented surface; the bottom side is horizontally oriented and continuous with the outer and vertically oriented faces; The outer side is a vertically oriented surface, The curved edge is adjacent the top side and the outer side.

4. 2. The edge ring of claim 1, The substrate support is a chuck, the support ring is an adjustable edge sheath ring, and the bottom side has a first portion configured to be conductively coupled to the chuck via a conductive gel, a second portion configured to be conductively coupled to the adjustable edge sheath ring via a conductive gel, and a third portion adjacent to a base ring.

5. 2. The edge ring of claim 1, The fastener holes are equidistantly spaced apart on the bottom side of the edge ring.

6. 2. The edge ring of claim 1, an edge ring, wherein one of the plurality of fastener holes is partially surrounded by a top surface of a slot and a side surface of the slot formed in the bottom side of the edge ring.

7. 7. The edge ring of claim 6, an edge ring, wherein a gap between the top surface of the slot and one of the fasteners when the fastener is received in the slot is less than 1 millimeter to reduce the possibility of arcing at the gap.

8. 2. The edge ring of claim 1, The edge ring has an outer diameter of about 13.6 inches or more and about 15 inches or less, the outer diameter being limited by the exterior.

9. 2. The edge ring of claim 1, an edge ring, the top side having an outer diameter of greater than 13.6 inches (35.544 cm) and up to 15 inches (38.1 cm) to reduce the possibility of arcing from the top side to the cover ring when a cover ring is placed adjacent to the outside.

10. 2. The edge ring of claim 1, An edge ring, wherein when a cover ring is placed adjacent to the outside, the curved edge reduces the possibility of arcing from the curved edge to the cover ring.

11. 2. The edge ring of claim 1, An edge ring, wherein all edges of the edge ring are arcuate.

12. 1. A cover ring for use in a plasma processing chamber, the cover ring having an annular body configured to surround an edge ring and adjacent to a ground ring; the annular body having an upper body portion, an intermediate body portion, and a lower body portion, the intermediate body portion defining a reduced width step from the upper body portion such that the intermediate body portion has a first annular width, and the lower body portion defining a reduced width step from the intermediate body portion such that the lower body portion has a second annular width that is less than the first annular width. Provided with a covering.

13. 13. A covering according to claim 12, The covering is a consumable and replaceable covering.

14. 13. A covering according to claim 12, A cover ring, wherein the upper body portion, the middle body portion and the lower body portion provide a path for a voltage from the edge ring to the ground ring.

15. 13. A covering according to claim 12, A cover ring, wherein the reduced width step of the intermediate body portion from the upper body portion is provided in a direction away from the edge ring, and the reduced width step of the lower body portion from the intermediate body portion is provided in a direction toward the edge ring.

16. 13. A covering according to claim 12, A cover ring, wherein the reduced width step of the intermediate body portion from the upper body portion is provided in a direction toward the edge ring, and the reduced width step of the lower body portion from the intermediate body portion is provided in a direction away from the edge ring.

17. 13. A covering according to claim 12, The middle body portion has a first elongated depth and the lower body portion has a second elongated depth.

18. 13. A covering according to claim 12, the upper body portion has a horizontally oriented top surface, a curved edge continuous with the horizontally oriented top surface, a vertically oriented outer surface continuous with the curved edge, a vertically oriented inner surface continuous with the horizontally oriented top surface, a horizontally oriented inner surface continuous with the vertically oriented inner surface, and a horizontally oriented outer surface continuous with the vertically oriented outer surface; the intermediate body portion having a vertically oriented inner surface that is continuous with the horizontally oriented inner surface of the upper body portion; the intermediate body portion having a vertically oriented outer surface contiguous with the horizontally oriented outer surface of the upper body portion and a horizontally oriented outer surface contiguous with the vertically oriented outer surface of the intermediate body portion; a covering, the lower body portion having a vertically oriented outer surface continuous with the horizontally oriented outer surface of the intermediate body portion, a horizontally oriented bottom surface continuous with the vertically oriented outer surface of the lower body portion, and a vertically oriented inner surface continuous with the horizontally oriented bottom surface of the lower body portion and continuous with the vertically oriented inner surface of the intermediate body portion.

19. 20. A covering according to claim 18, a covering, the upper body portion having a second curved edge between the vertically oriented outer surface of the upper body portion and the horizontally oriented outer surface of the upper body portion, the upper body portion having a third curved edge between the horizontally oriented top surface of the upper body portion and the vertically oriented inner surface of the upper body portion, and the upper body portion having a fourth curved edge between the vertically oriented inner surface of the upper body portion and the horizontally oriented inner surface of the upper body portion.

20. 20. A covering according to claim 19, the intermediate body portion has a fifth curved edge between the horizontally oriented outer surface of the upper body portion and the vertically oriented outer surface of the intermediate body portion, the intermediate body portion has a sixth curved edge between the horizontally oriented inner surface of the upper body portion and the vertically oriented inner surface of the intermediate body portion, and the intermediate body portion has a seventh curved edge between the vertically oriented outer surface of the intermediate body portion and the horizontally oriented outer surface of the intermediate body portion.

21. 21. A covering according to claim 20, a covering, wherein the lower body portion has an eighth curved edge between the horizontally oriented outer surface of the intermediate body portion and the vertically oriented outer surface of the lower body portion, the lower body portion has a ninth curved edge that is continuous with the vertically oriented outer surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion, and the lower body portion has a tenth curved edge between the vertically oriented inner surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion.

22. 13. A covering according to claim 12, A cover ring, wherein an inner edge of the cover ring is curved to reduce the possibility of arcing between the inner edge and the edge ring.

23. 13. A covering according to claim 12, A covering, wherein all edges of said covering are arcuate.

24. 1. A system for attaching an edge ring to a plasma chamber, comprising: A support ring and the edge ring oriented on the support ring; a gel layer disposed between a bottom surface of the edge ring and a top surface of the support ring; a plurality of screws configured to secure the edge ring to the support ring, each of the plurality of screws being attached to a threaded hole disposed on the bottom surface of the edge ring and passing through the support ring; A plurality of pressure bars connected to a bottom surface of the support ring; a plurality of pneumatic pistons, each of the plurality of pistons being coupled to a corresponding one of the plurality of pressure bars; A system comprising:

25. 25. The system of claim 24, The system, wherein the plurality of pneumatic pistons are configured to apply a downward force to the plurality of pressure bars such that the edge ring and the support ring are secured to an insulator ring during processing of a substrate in the plasma chamber.

26. 25. The system of claim 24, The system, wherein the pneumatic pistons are configured to push up on the pressure bars to remove the edge ring and the support ring from the plasma chamber during maintenance.

27. 25. The system of claim 24, an insulator ring located below the support ring; a plurality of clasp mechanisms configured to hold the pressure bars, each of the pressure bars having a portion that extends into the support ring and a portion that extends into the insulator ring, each of the clasp mechanisms configured to pull down a corresponding one of the pressure bars to engage the support ring and the edge ring with the insulator ring during processing operations in the plasma chamber and to push up the support ring and the edge ring against the insulator ring to release the support ring and the edge ring; The system further comprises:

28. 28. The system of claim 27, Each of the plurality of clasp mechanisms comprises: An air cylinder; A piston body in the air cylinder; A piston rod attached to the piston body; a mount configured to mount a corresponding one of the pressure bars to the air cylinder; Including, the system.

29. 29. The system of claim 28, an air passage configured to supply compressed air to the top of the air cylinder to pull down the pressure bars; an air passage configured to supply compressed air to a bottom of the air cylinder to push up the plurality of pressure bars; The system further comprises:

30. 25. The system of claim 24, a first piston of the plurality of pistons is part of a first clasp mechanism, a second piston of the plurality of pistons is part of a second clasp mechanism, and a third piston of the plurality of pistons is part of a third clasp mechanism; The system comprises: the second clasp mechanism configured to secure the support ring and the edge ring to the insulator ring at a different location compared to where the first clasp mechanism secures the support ring and the edge ring to the insulator ring; a third clasp mechanism configured to secure the support ring and the edge ring to the insulator ring at a different location compared to the location where the second clasp mechanism secures the support ring and the edge ring to the insulator ring and the location where the first clasp mechanism secures the support ring and the edge ring to the insulator ring; The system further comprises:

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