Connection structure between electronic circuit product and connection terminal and manufacturing method for the same

Abstract

To provide a connection structure for an electronic circuit product and a connection terminal and a manufacturing method for the same that can connect an electronic wiring component that can follow even complex three-dimensional shapes to a connection terminal provided at the end of a lead wire connected to a power supply while reducing the risk of disconnection, and that can be easily designed and manufactured.SOLUTION: A connection structure 100 has an electronic circuit product 1 and a connection terminal 3 provided at the end of a lead wire, which are electrically connected. A conductive layer 11 including a terminal electrode 16 is provided on a first surface of a base material sheet 10 of the electronic circuit product 1. A deformation suppression layer 12 is directly provided on a second surface opposite to the side provided with the conductive layer 11, at least in the area overlapping the terminal electrode 16. A plurality of crimped pieces 33 included in the connection terminal 3 penetrates from the deformation suppression layer 12 to the terminal electrode 16 by being crimped. A tip side portion that has penetrated is bent and is embedded in the terminal electrode 16.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a connection structure between an electronic circuit product and a connection terminal, and a method for manufacturing the same. [Background technology]

[0002] 2. Description of the Related Art Film heaters and touch sensors are known that have a conductive film formed on a flexible base sheet made of a polymer and can be placed on curved or uneven surfaces and can be freely deformed.

[0003] As connection structures between the terminal portion of an electronic circuit product using such a flexible base sheet and the connection terminal of a lead wire connected to a power source, a connection structure has been proposed in which a reinforcing plate is adhered to the base sheet and fixed by driving in grommets, and a connection structure in which a crimping piece provided on the connection terminal is crimped to connect the terminal (Patent Documents 1 and 2).

[0004] Film heaters and touch sensors that use a silicone base material with excellent heat resistance are also known, but when the above-mentioned connection structure is adopted, there is a higher risk of resistance increase and circuit breakage due to breakage of the base sheet compared to when a polyethylene terephthalate (PET) base material with excellent rigidity is used. Therefore, when connecting electronic circuit products that use a silicone base material to lead wires, a structure in which the lead wires are embedded in the base material to prevent stress concentration is mainly adopted.

[0005] As a connection structure that reduces the risk of disconnection, for example, a structure has been proposed in which a non-stretchable conductive plate is adhered to the circuit of the terminal portion of an electronic circuit product for reinforcement with a conductive adhesive, and connecting wiring is connected to the non-stretchable conductive plate and the connection portion is covered with a resin layer (Patent Document 3). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 08-162258 [Patent Document 2] JP 2023-17321 A [Patent Document 3] Patent Publication No. 2022-6833 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the structure as disclosed in Patent Document 3 is complicated and requires many manufacturing steps. In addition, the silicone substrate has low adhesion to different materials, making it difficult to attach a stiff reinforcing plate. Even if the surface of the silicone substrate to which the reinforcing plate is attached is subjected to surface treatment such as excimer treatment, corona treatment, or Itro treatment, or a silane coupling agent is applied, there is a risk that the reinforcing plate will crack or peel off from the substrate because a large load is applied when the pressure-bonding piece is penetrated. There is also a risk that the silicone substrate will break due to the end face of the reinforcing plate or the penetration part of the pressure-bonding piece in the reinforcing plate.

[0008] The present invention aims to provide a connection structure between an electronic circuit product and a connection terminal, which can connect an electronic wiring component that can conform to complex three-dimensional shapes to a connection terminal provided at the end of a lead wire connected to a power source while reducing the risk of disconnection, and which can be easily designed and manufactured, and a method for manufacturing the same. [Means for solving the problem]

[0009] The present invention includes the following configurations. [1] A connection structure in which an electronic circuit product is electrically connected to a connection terminal provided at the end of a lead wire, The electronic circuit product includes a base sheet, a conductive layer provided on a surface of the base sheet, and a deformation suppressing layer provided directly on a surface of the base sheet opposite to the side on which the conductive layer is provided, the conductive layer includes a terminal electrode connected to the connection terminal, the deformation suppression layer is provided in a region of the conductive layer that overlaps at least the terminal electrode when viewed in a thickness direction of the base sheet, The connection terminal includes a plurality of crimping pieces, A connection structure between an electronic circuit product and a connection terminal, wherein the multiple crimping pieces are crimped to penetrate from the deformation suppression layer side to the terminal electrode, and the penetrated tip portions are bent and bitten into the terminal electrode. [2] The connection structure between the electronic circuit product and the connection terminal described in [1], wherein the material constituting the base sheet contains a silicone elastomer. [3] An insertion hole for inserting the compression piece is formed in advance in a portion of the deformation suppression layer through which the compression piece penetrates, The connection structure of an electronic circuit product and a connection terminal described in [1] or [2], wherein, when viewed in the thickness direction of the base sheet, the opening edge of the insertion hole before the crimping piece is inserted is located inside the outer edge of the portion of the crimping piece that penetrates the insertion hole, and the deformation suppression layer overlaps, the insertion hole is formed slightly smaller than the crimping piece. [4] A connection structure between an electronic circuit product and a connection terminal as described in [3], wherein the distance between the opening edge of the insertion hole when viewed in the thickness direction of the base sheet and the outer edge of the portion of the crimping piece that penetrates the insertion hole is smaller than the thickness of the deformation suppression layer. [5] A connection structure between an electronic circuit product and a connection terminal described in [3] or [4], in a cross section of the deformation suppression layer cut in the thickness direction, the surface shape of the peripheral portion of the insertion hole of the deformation suppression layer is a convex, approximately arc-shaped shape, and the thickness of the deformation suppression layer becomes thinner as it approaches the crimping piece. [6] The connection structure between an electronic circuit product and a connection terminal according to any one of [1] to [5], wherein the deformation suppression layer is an acrylic resin layer. [7] The connection structure between an electronic circuit product and a connection terminal according to any one of [1] to [6], wherein the deformation suppression layer has a thickness of 10 μm or more and 100 μm or less. [8] The connection structure between an electronic circuit product and a connection terminal according to any one of [1] to [7], wherein the electronic circuit product is a capacitive touch sensor or a film heater. [9] A method for manufacturing a connection structure in which an electronic circuit product is electrically connected to a connection terminal having a plurality of crimping pieces provided at an end of a lead wire, comprising: forming a conductive layer including terminal electrodes by screen printing on one surface of a base sheet, and forming a deformation suppression layer by screen printing on at least an area of ​​the other surface overlapping with the terminal electrodes, thereby obtaining the electronic circuit product; a plurality of crimping pieces provided on the connection terminal are crimped so that the plurality of crimping pieces penetrate the terminal electrode from the deformation suppression layer side, thereby connecting the connection terminal to the electronic circuit product; A method for manufacturing a connection structure between an electronic circuit product and a connection terminal, comprising: Effect of the Invention

[0010] According to the present invention, a connection structure between an electronic circuit product and a connection terminal is provided, which can connect an electronic wiring component that can conform to a complex three-dimensional shape to a connection terminal provided at the end of a lead wire connected to a power source while reducing the risk of disconnection, and which can be easily designed and manufactured, and a method for manufacturing the same is provided. [Brief description of the drawings]

[0011] [Figure 1] 1 is a plan view of a connection structure between an electronic circuit product and a connection terminal according to an embodiment, as viewed from the conductive layer side. [Diagram 2] 2 is a bottom view of the connection structure of FIG. 1, viewed from the deformation suppression layer side. [Diagram 3] FIG. 2 is a cross-sectional view of the connection structure of FIG. [Figure 4] 2 is a cross-sectional view of the connection structure of FIG. 1 taken along line II-II. [Diagram 5] 2 is a perspective view of a connection terminal provided at an end of a lead wire used in the connection structure of FIG. 1. [Figure 6] 5 is a cross-sectional view showing a state before a connection terminal is attached in the connection structure of FIG. 4. [Figure 7] 4 is a schematic diagram showing the relationship between an insertion hole formed in a deformation suppressing layer and a pressure-bonding piece inserted into the insertion hole. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] <Connection structure between electronic circuit products and connection terminals> The connection structure between an electronic circuit product and a connection terminal according to the embodiment is a connection structure in which an electronic circuit product is electrically connected to a connection terminal provided at an end of a lead wire. The electronic circuit product comprises a base sheet, a conductive layer provided on the surface of the base sheet, and a deformation suppression layer provided directly on the surface of the base sheet opposite the side on which the conductive layer is provided. The conductive layer includes a terminal electrode connected to the connection terminal, and the deformation suppression layer is provided in an area of ​​the conductive layer that overlaps at least the terminal electrode when viewed in the thickness direction of the base sheet. The connection terminal comprises a plurality of crimping pieces, which are crimped to penetrate from the deformation suppression layer side to the terminal electrode, and the penetrating tip portions are bent and bitten into the terminal electrode.

[0013] An example of a connection structure between an electronic circuit product and a connection terminal according to an embodiment will be described below with reference to the drawings. Note that the dimensions of the drawings shown in the following description are merely examples, and the present invention is not necessarily limited thereto, and may be modified as appropriate within the scope of the present invention.

[0014] Fig. 1 is a plan view showing a connection structure 100 (hereinafter, simply referred to as "connection structure 100") between an electronic circuit product and a connection terminal according to an example of an embodiment. Fig. 2 is a bottom view of the connection structure 100 in Fig. 1. Fig. 3 is a cross-sectional view taken along line II of the connection structure 100. Fig. 4 is a cross-sectional view taken along line II of the connection structure 100 in Fig. 1.

[0015] The connection structure 100 is a connection structure in which an electronic circuit product 1 and a connection terminal 3 provided at the end of a lead wire 2 are electrically connected to each other.

[0016] [Electronic circuit products] The electronic circuit product 1 is not particularly limited, and can be used as, for example, a capacitive touch sensor or a film heater. The electronic circuit product 1 comprises a base sheet 10, a conductive layer 11 provided on a first surface 10a of the base sheet 10, and a deformation suppression layer 12 provided directly on a second surface 10b opposite the side of the base sheet 10 on which the conductive layer 11 is provided.

[0017] (Base sheet) The example base sheet 10 shown in Figures 1 and 2 has a square main body 13 and a strip portion 14 extending so as to protrude from one side of the main body 13, and the tip portion of the strip portion 14 forms a terminal portion. The planar shape of the base sheet 10 is not limited to the shape in this example, and can be appropriately set depending on the application.

[0018] The base sheet 10 may be any flexible sheet, for example a resin sheet, and is preferably a transparent insulating resin sheet. Here, "insulating" means that the electrical resistance is 1 MΩ or more, preferably 10 MΩ or more. Also, "transparent" means that the light transmittance measured according to JIS K7136 is 50% or more.

[0019] Examples of materials constituting the base sheet 10 include elastomers such as silicone elastomers. Among them, it is preferable to include a silicone elastomer because it is flexible and has excellent conformability to three-dimensional shapes. The material constituting the base sheet 10 may be one type or two or more types.

[0020] The Shore A hardness of the elastomer constituting the base sheet 10 is preferably 10 or more, and more preferably 20 or more. If the Shore A hardness is equal to or more than the lower limit, peeling or disconnection of the conductive layer 11 is easily suppressed. The Shore A hardness of the elastomer is preferably 60 or less, and more preferably 30 or less. If the Shore A hardness is equal to or less than the upper limit, conformability to the three-dimensional shape of the electronic circuit product 1 is easily obtained. The preferable lower limit and upper limit of the Shore A hardness of the elastomer can be arbitrarily combined. The Shore A hardness is a type A durometer hardness measured according to JIS K 6253 with a test piece having a thickness (height) of 1 cm.

[0021] The thickness of the base sheet 10 is preferably 12 μm or more, and more preferably 30 μm or more. If the thickness of the base sheet 10 is equal to or more than the lower limit, peeling or disconnection of the conductive layer 11 is easily suppressed. The thickness of the base sheet 10 is preferably 250 μm or less, and more preferably 100 μm or less. If the thickness of the base sheet 10 is equal to or less than the upper limit, conformability to the three-dimensional shape of the electronic circuit product 1 is easily obtained. The preferable lower and upper limits of the thickness of the base sheet 10 can be arbitrarily combined.

[0022] The breaking elongation of the base sheet 10 is preferably 100% or more, and more preferably 500% or more. If the breaking elongation of the base sheet 10 is equal to or more than the lower limit, the base sheet 10 is likely to be able to conform to the three-dimensional shape of the electronic circuit product 1. The breaking elongation of the base sheet 10 is preferably 1000% or less, and more preferably 800% or less. If the breaking elongation of the base sheet 10 is equal to or less than the upper limit, peeling or breakage of the conductive layer 11 due to excessive elongation is likely to be suppressed. The preferable lower and upper limits of the breaking elongation of the base sheet 10 can be arbitrarily combined. The breaking elongation is measured in accordance with JIS K 6251:2017 using a dumbbell-shaped No. 2 test piece at a tensile speed of 500 mm / min.

[0023] The tensile strength of the base sheet 10 is preferably 4 MPa or more, and more preferably 5 MPa or more. If the tensile strength of the base sheet 10 is equal to or more than the lower limit, peeling or breakage of the conductive layer 11 is easily suppressed. The tensile strength of the base sheet 10 is preferably 12 MPa or less, and more preferably 9 MPa or less. If the tensile strength of the base sheet 10 is equal to or less than the upper limit, conformability to the three-dimensional shape of the electronic circuit product 1 is easily obtained. The preferred lower and upper limits of the tensile strength of the base sheet 10 can be combined in any desired manner. The tensile strength is measured in accordance with JIS K 6251:2017 using a dumbbell-shaped No. 2 test piece at a tensile speed of 500 mm / min.

[0024] (Conductive layer) The example conductive layer 11 shown in Figure 1 includes an electrode 15 provided on the main body portion 13 of the base sheet 10, a terminal electrode 16 provided at the tip portion of the band portion 14 of the base sheet 10, and wiring 17 electrically connecting the electrode 15 and the terminal electrode 16. The pattern of the conductive layer 11 is not limited to the example shown in FIG. 1, and can be designed appropriately depending on the application.

[0025] The electrode 15 can be a detection electrode for detecting contact or proximity of a conductor by detecting a change in capacitance, for example. In this case, the detection of the change in capacitance by the electrode 15 may be a self-capacitance type or a mutual capacitance type. When the electrode 15 is a detection electrode, its form may be, for example, a solid electrode, a comb-tooth electrode, a mesh electrode, a checkered electrode pattern, a diamond pattern, or the like. 1, the shape of the electrode 15 in a plan view is rectangular, but it may be circular, elliptical, etc. The number of electrodes 15 is not limited to one, and may be two or more.

[0026] The shape of the terminal electrode 16 in a plan view is rectangular in the example shown in FIG. 1, but may be circular, elliptical, or the like. The dimensions of the terminal electrodes 16 can be designed appropriately according to the dimensions of the connection terminals 3 .

[0027] The line width of the wiring 17 is preferably 30 μm or more, and more preferably 50 μm or more, since peeling or breakage of the wiring 17 can be easily suppressed. The line width of the wiring 17 is preferably 1000 μm or less, and more preferably 500 μm or less, since design freedom can be ensured. The preferable lower and upper limits of the line width of the wiring 17 can be arbitrarily combined.

[0028] The aspect ratio (thickness / line width) of the thickness to line width of the wiring 17 is preferably 1 / 100 or more, more preferably 1 / 50 or more, and is preferably 1 / 5 or less, more preferably 1 / 10 or less.

[0029] An example of the material constituting the conductive layer 11 is a paste ink containing a metal filler as a main component and not containing a silicone resin. However, "containing a metal filler as a main component" means that the proportion of the metal filler in the total mass of the conductive material in the paste ink is 60 mass% or more. Examples of the metal filler include silver filler, copper filler, and gold filler, with silver filler being preferred.

[0030] The paste ink constituting the conductive layer 11 may contain other conductive materials such as conductive polymers (polythiophene-based conductive polymers (PEDOT / PSS), indium-doped tin oxide (ITO), etc.), conductive nanowires (silver nanowires, gold nanowires, etc.), conductive metal oxide particles (ITO particles, etc.), etc. The material constituting the conductive layer 11 is preferably a silver paste ink that does not contain silicone resin, and particularly preferably a silver paste ink in which a silver filler is added to an acrylic resin.

[0031] The thickness of the conductive layer 11 is preferably 1 μm or more, and more preferably 5 μm or more. If the thickness of the conductive layer 11 is equal to or more than the above-mentioned lower limit, peeling or breakage of the conductive layer 11 is easily suppressed. The thickness of the conductive layer 11 is preferably 20 μm or less, and more preferably 15 μm or less. If the thickness of the conductive layer 11 is equal to or less than the above-mentioned upper limit, it is easy to make the electronic circuit product 1 thinner. The preferable lower limit and upper limit of the thickness of the conductive layer 11 can be arbitrarily combined.

[0032] (Deformation suppression layer) The deformation suppression layer 12 is provided directly on the second surface 10b of the base sheet 10 without an adhesive layer. The deformation suppression layer 12 can be provided directly on the second surface 10b of the base sheet 10 by printing such as screen printing.

[0033] 2, the deformation suppression layer 12 is provided in a region overlapping with the conductive layer 11 when viewed in the thickness direction of the base sheet 10. In the example shown in Figures 2 to 4, the region on the second surface 10b of the base sheet 10 where the deformation suppression layer 12 is provided is slightly larger than the region on the first surface 10a of the base sheet 10 where the conductive layer 11 is provided. By providing the deformation suppression layer 12, stress concentration on the portion of the base sheet 10 where the conductive layer 11 is provided is suppressed, thereby suppressing local deformation, and thus peeling or breakage of the conductive layer 11.

[0034] When viewed in the thickness direction of the base sheet 10, the distance (offset amount) from the edge of the conductive layer 11 to the edge of the deformation suppression layer 12 is preferably 0.10 mm or more, and more preferably 0.15 mm or more. If the offset amount is equal to or greater than the lower limit, the effect of suppressing peeling or breakage of the conductive layer 11 by the deformation suppression layer 12 is easily obtained. The offset amount is preferably 0.30 mm or less, and more preferably 0.25 mm or less. If the offset amount is equal to or less than the upper limit, it is easy to ensure a sufficient deformation-prone region in the base sheet 10. The preferable lower and upper limits of the offset amount can be arbitrarily combined.

[0035] The material constituting the deformation suppression layer 12 may be any material capable of suppressing deformation of the portion of the base sheet 10 where the deformation suppression layer 12 is provided, and examples of such material include acrylic resin and silicone resin. The deformation suppression layer 12 is preferably a printed layer made of a single material, and an acrylic resin layer is particularly preferred because it can be formed by screen printing.

[0036] The Shore D hardness of the material constituting the deformation suppression layer 12 is preferably 60 or more, more preferably 65 or more, since this makes it easier to suppress peeling or breakage of the conductive layer 11. Furthermore, the Shore D hardness of the material is preferably 75 or less, since this makes it easier to obtain conformability to the three-dimensional shape of the electronic circuit product 1. The preferred lower and upper limits of the Shore D hardness of the material can be combined in any desired manner. The Shore D hardnesses of the materials constituting the deformation suppression layer 12 may be the same or different. The Shore D hardness is a type D durometer hardness measured according to JIS K 6253 with a test piece having a thickness (height) of 1 cm.

[0037] The flexural modulus of the deformation suppression layer 12 is preferably 500 MPa or more, more preferably 1500 MPa or more, since peeling or breakage of the conductive layer 11 can be easily suppressed. The flexural modulus of the deformation suppression layer 12 is preferably 2500 MPa or less, since conformability to the three-dimensional shape of the electronic circuit product 1 can be easily obtained. The preferred lower and upper limits of the flexural modulus of the deformation suppression layer 12 can be arbitrarily combined. The flexural moduli of the deformation suppression layers 12 may be the same or different. The flexural modulus is measured in accordance with JIS K 7171.

[0038] The thickness of the deformation inhibiting layer 12 is preferably 10 μm or more, and more preferably 30 μm or more. If the thickness of the deformation inhibiting layer 12 is equal to or more than the above-mentioned lower limit, peeling or breakage of the deformation inhibiting layer 12 is easily suppressed. The thickness of the deformation inhibiting layer 12 is preferably 100 μm or less, and more preferably 80 μm or less. If the thickness of the deformation inhibiting layer 12 is equal to or less than the above-mentioned upper limit, it is easy to obtain conformability to the three-dimensional shape of the electronic circuit product 1. The preferable lower and upper limits of the thickness of the deformation inhibiting layer 12 can be combined arbitrarily. The thickness of the deformation suppression layer 12 refers to the thickness of the region excluding the vicinity of a crimping piece 33 of a connection terminal 3 described later.

[0039] [Connection terminal] As shown in Figure 5, the connection terminal 3 in this example comprises a rectangular welded portion 31 to which the end of the lead wire 2 connected to the power source is fixed by welding, a strip-shaped portion 32 extending so as to protrude from one side of the welded portion 31, and a plurality of crimping pieces 33 spaced apart in the longitudinal direction of the strip-shaped portion 32 on both sides in the width direction of the strip-shaped portion 32. The connection terminal 3 is sometimes called a welding plate or a welding crimp.

[0040] Before being connected to the electronic circuit product 1, the connection terminal 3 has each crimp piece 33 that protrudes widthwise from a side edge of the strip-shaped portion 32 and is bent 90° midway to stand up. The number of the crimping pieces 33 is ten in total in the example shown in FIG. 5, but is not limited to this form and can be designed as appropriate.

[0041] Examples of materials constituting the connection terminal 3 include metals such as nickel alloys, copper alloys, aluminum alloys, etc. The connection terminal 3 may be made of one type of material, or two or more types of material.

[0042] [Connection structure] 1 to 4, in the connection structure 100, the multiple crimping pieces 33 of the connection terminal 3 are crimped to penetrate from the deformation suppression layer 12 side to the terminal electrode 16. Also, as shown in Fig. 4, the tip side portions of the multiple crimping pieces 33 of the connection terminal 3 that penetrate the electronic circuit product 1 are each bent 180° inward in the width direction of the strip-shaped portion 32 and bit into the conductive layer 11. In this way, the connection terminal 3 and the conductive layer 11 are electrically connected to each other.

[0043] In the connection structure 100, a deformation suppression layer 12 is provided on the side of the base sheet 10 opposite the side on which the conductive layer 11 is provided, so as to overlap with the terminal electrode 16. Therefore, even if each crimping piece 33 of the connection terminal 3 is penetrated, stress is prevented from concentrating in that portion of the base sheet 10, and peeling or breakage of the conductive layer 11 is prevented.

[0044] 6, in the connection structure 100, it is preferable that insertion holes 18 for inserting the respective crimping pieces 33 are formed in advance in the portions of the deformation suppressing layer 12 through which the multiple crimping pieces 33 penetrate. This makes it easy to insert each crimping piece 33 of the connection terminal 3 into a desired position in the deformation suppressing layer 12 and penetrate it to the terminal electrode 16.

[0045] When viewed in the thickness direction of the base sheet 10, as shown in FIG. 7, the opening edge 19 of the insertion hole 18 before inserting the pressure-bonding piece 33 is located inside the outer edge 33a of the portion of the pressure-bonding piece 33 that penetrates the insertion hole 18. In this way, it is preferable that the insertion hole 18 before inserting the pressure-bonding piece 33 is formed to be slightly smaller than the pressure-bonding piece 33 so that the deformation suppression layer 12 overlaps. As a result, in a state where the pressure-bonding piece 33 is inserted into the insertion hole 18 and penetrates to the terminal electrode 16, the deformation suppression layer 12 adheres to the surface of the pressure-bonding piece 33 around the insertion hole 18. As a result, the pressure-bonding piece 33 is supported by the surrounding deformation suppression layer 12, so that the pressure-bonding piece 33 electrically connected to the terminal electrode 16 is fixed more stably.

[0046] When viewed in the thickness direction of the base sheet 10, the distance d1 (FIG. 7) between the opening edge 19 of the insertion hole 18 before inserting the pressure-bonding piece 33 and the outer edge 33a of the portion of the pressure-bonding piece 33 that penetrates the insertion hole 18 is preferably smaller than the thickness t of the deformation suppression layer 12. Thereby, it becomes easy to obtain the effect of stably fixing the pressure-bonding piece 33 while reducing the load on the pressure-bonding piece 33 when penetrating the electronic circuit product 1.

[0047] The distance d1 between the opening edge 19 of the insertion hole 18 before inserting the pressure-bonding piece 33 and the outer edge 33a of the portion of the pressure-bonding piece 33 that penetrates the insertion hole 18, that is, the overlap amount is preferably 50 μm or more, more preferably 100 μm or more. If the distance d1 is equal to or greater than the lower limit value, the effect of stably fixing the pressure-bonding piece 33 can be easily obtained. The distance d1 is preferably d1 < t, more preferably d1 < t / 2. If the distance d1 is less than the upper limit value, it is easy to reduce the load on the pressure-bonding piece 33 when penetrating the electronic circuit product 1. The preferable lower limit and upper limit of the distance d1 can be arbitrarily combined.

[0048] As shown in the example of Fig. 4 and Fig. 6, in a cross section of the deformation suppression layer 12 cut in the thickness direction, the surface shape of the peripheral portion of the insertion hole 18 of the deformation suppression layer 12 is a convex, approximately arc-shaped, and it is preferable that the thickness of the deformation suppression layer 12 becomes thinner as it approaches the crimped piece 33. As a result, the rigidity of the deformation suppression layer 12 decreases toward the crimped piece 33, so that excessive stress concentration on the crimped piece 33 can be prevented. In addition, the approximately arc-shaped surface of the deformation suppression layer 12 functions as a guide when the crimped piece 33 is tightened, and even if the crimped piece 33 is slightly misaligned, it is easy to guide it to the insertion hole 18 along the surface of the deformation suppression layer 12. Furthermore, the deformation suppression layer 12 around the insertion hole 18 has a "rebound" effect on the portion through which the crimped piece 33 penetrates, so that the crimped piece 33 is stably fixed. The deformation suppression layer 12 having such a configuration can be easily formed by screen printing.

[0049] <Method of manufacturing the connection structure between the electronic circuit product and the connection terminal> The manufacturing method of a connection structure between an electronic circuit product and a connection terminal according to the embodiment is a manufacturing method of a connection structure in which an electronic circuit product is electrically connected to a connection terminal having a plurality of crimping pieces provided at the end of a lead wire, and includes the following (i) and (ii). (i) forming a conductive layer including terminal electrodes by screen printing on one surface of a base sheet, and forming a deformation suppression layer by screen printing on at least an area overlapping with the terminal electrodes on the other surface, thereby obtaining the electronic circuit product. (ii) Connecting the connection terminal to the electronic circuit product by crimping a plurality of crimp pieces provided on the connection terminal so that the crimp pieces each penetrate the terminal electrode from the deformation suppression layer side. Hereinafter, a method for manufacturing the connection structure 100 will be described as an example of a method for manufacturing the connection structure between an electronic circuit product and a connection terminal according to the embodiment.

[0050] (Step (i)) The base sheet 10 can be produced by utilizing a known molding method such as press molding, extrusion molding, or calendar molding. A conductive layer 11 including electrodes 15, wiring 17 and terminal electrodes 16 is formed on a first surface 10a of the base sheet 10 by screen printing. Moreover, a deformation suppression layer 12 is formed on a second surface 10b of the base sheet 10 by screen printing. In step (i), the deformation suppression layer 12 may be formed after the conductive layer 11 is formed, or the deformation suppression layer 12 may be formed before the conductive layer 11 is formed.

[0051] As a pre-step of screen printing, at least one of the first surface 10a and the second surface 10b of the base sheet 10 may be subjected to an optical surface treatment such as an excimer treatment, a corona treatment, or an itro treatment, or may be coated with an easy-adhesion coat (primer).

[0052] (Step (ii)) In step (ii), the multiple crimping pieces 33 provided on the connection terminal 3 are crimped so that each of the multiple crimping pieces 33 penetrates the conductive layer 11 from the deformation suppressing layer 12 side, and the penetrating tip side portion of each of the crimping pieces 33 is bent to bite into the terminal electrode 16. This makes it possible to connect the connection terminal 3 to the terminal electrode 16 of the electronic circuit product 1. The crimping work of the multiple crimping pieces 33 of the connection terminal can be performed, for example, by using a crimping tool that aligns each crimping piece 33 of the connection terminal 3 with an insertion hole 18 formed in the deformation suppression layer 12 of the electronic circuit product 1 and clamps them from above and below to crimp them.

[0053] As described above, in the connection structure 100 and its manufacturing method according to the embodiment, the deformation suppression layer 12 is provided on the side of the base sheet 10 in the electronic circuit product 1 opposite to the side on which the conductive layer 11 is provided, so as to overlap at least the terminal electrode 16. This prevents stress from concentrating on that portion of the base sheet 10 even when the crimping pieces 33 of the connection terminal 3 are crimped and connected to the terminal electrode 16 through the electronic circuit product 1, thereby preventing peeling or breakage of the conductive layer 11. Moreover, the connection structure 100 according to the embodiment is easy to design and can be manufactured simply.

[0054] It should be noted that the connection structure between an electronic circuit product and a connection terminal and the manufacturing method thereof according to the present invention are not limited to the above-described connection structure 100 and the manufacturing method thereof. For example, the deformation suppression layer may be provided on the side of the base sheet where the conductive layer is provided so as to cover the conductive layer, in addition to the side opposite the side where the conductive layer is provided.

[0055] The deformation suppression layer does not have to be provided so as to overlap the entire conductive layer as long as it is provided at least in the region overlapping with the terminal electrode when viewed from the thickness direction of the base sheet. In order to more stably suppress disconnection of the conductive layer, it is preferable to provide the deformation suppression layer so as to overlap the entire conductive layer when viewed from the thickness direction of the base sheet.

[0056] In addition, within the scope of the invention, the components in the above-described embodiments may be replaced with well-known components, and the above-described modified examples may be combined as appropriate. [Explanation of symbols]

[0057] 100 Connection structure between electronic circuit products and connection terminals 1 Electronic circuit products 2 Lead Wire 3 Connection terminal 10 Base sheet 10a First Surface 10b Second Surface 11 Conductive layer 12 Deformation suppression layer 13 Main body 14 Belt 15 electrodes 16 terminal electrode 17 Wiring 18 Insertion hole 19 Opening Edge 31 Welding 32 Belt 33 Crimping piece 33a Outer edge

Claims

1. A connection structure in which an electronic circuit product is electrically connected to a connection terminal provided at an end of a lead wire, The electronic circuit product includes a base sheet, a conductive layer provided on a surface of the base sheet, and a deformation suppression layer provided directly on a surface of the base sheet opposite to the side on which the conductive layer is provided, the conductive layer includes a terminal electrode connected to the connection terminal, the deformation suppression layer is provided in a region of the conductive layer that overlaps at least the terminal electrode when viewed in a thickness direction of the base sheet, The connection terminal includes a plurality of crimping pieces, A connection structure between an electronic circuit product and a connection terminal, wherein the multiple crimping pieces are crimped to penetrate from the deformation suppression layer side to the terminal electrode, and the penetrated tip portions are bent and bitten into the terminal electrode.

2. 2. The connection structure between an electronic circuit product and a connection terminal according to claim 1, wherein the material constituting the base sheet includes a silicone elastomer.

3. An insertion hole for inserting the compression piece is formed in advance in a portion of the deformation suppression layer through which the compression piece penetrates, 2. The connection structure between an electronic circuit product and a connection terminal as described in claim 1, wherein, when viewed in the thickness direction of the base sheet, the insertion hole is formed slightly smaller than the crimping piece so that the opening edge of the insertion hole before the crimping piece is inserted is located inside the outer edge of the portion of the crimping piece that penetrates the insertion hole and overlaps the deformation suppression layer.

4. 4. The connection structure between an electronic circuit product and a connection terminal as described in claim 3, wherein the distance between the opening edge of the insertion hole when viewed in the thickness direction of the base sheet and the outer edge of the portion of the crimping piece that penetrates the insertion hole is smaller than the thickness of the deformation suppression layer.

5. 4. The connection structure between an electronic circuit product and a connection terminal as described in claim 3, wherein, in a cross section of the deformation suppression layer cut in the thickness direction, the surface shape of the peripheral portion of the insertion hole of the deformation suppression layer is a convex, approximately arc-shaped shape, and the thickness of the deformation suppression layer becomes thinner as it approaches the crimping piece.

6. 2. The connection structure of claim 1, wherein the deformation suppression layer is an acrylic resin layer.

7. 2. The connection structure of claim 1, wherein the deformation suppression layer has a thickness of 10 μm or more and 100 μm or less.

8. 2. The connection structure of claim 1, wherein the electronic circuit product is a capacitive touch sensor or a film heater.

9. A method for manufacturing a connection structure in which an electronic circuit product is electrically connected to a connection terminal provided at an end of a lead wire and having a plurality of crimping pieces, comprising: forming a conductive layer including terminal electrodes by screen printing on one surface of a base sheet, and forming a deformation suppression layer by screen printing on at least an area of ​​the other surface overlapping with the terminal electrodes, thereby obtaining the electronic circuit product; a plurality of crimping pieces provided on the connection terminal are crimped so that the plurality of crimping pieces penetrate the terminal electrode from the deformation suppression layer side, thereby connecting the connection terminal to the electronic circuit product; A method for manufacturing a connection structure between an electronic circuit product and a connection terminal, comprising:

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