Spindle assembly for wafer conveyance in multi-station processing module

Abstract

To provide a spindle assembly for conveying a wafer in a multi-station processing module.SOLUTION: A spindle assembly 100 includes a hub body 102 rotating around a central axis, a plurality of end effectors 104a to 104d each having a first end coupled to the hub body and a second end for supporting a wafer, a plurality of covers 106a to 106d, and a plurality of fastener assemblies 108a and 108b, wherein first ends of the respective end effectors are sandwiched between each cover and each outside of the hub body, by the respective fastener assemblies, and the respective fastener assemblies include wave springs for providing stable fastening power.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present embodiments relate to structures used in semiconductor processing tools, and in particular to spindle assemblies used to support and transport semiconductor wafers in multi-station processing modules. [Background technology]

[0002] In wafer processing, a processing module may have multiple processing stations (such as the quad-station process module manufactured by Lam Research Corporation). Such multi-station processing modules may use a spindle assembly to transport the wafer from one station to another. Generally, such a spindle assembly includes a number of paddles extending from a central hub that support the wafer during transport.

[0003] It is against this background that the embodiments described in this disclosure arise. Summary of the Invention

[0004] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure provide systems, apparatus, and methods that use a spindle assembly to support a wafer during transfer in a multi-station processing module.

[0005] A spindle assembly is disclosed that prevents loosening of parts used to attach a ceramic end effector to a spindle hub.

[0006] Existing designs use only fasteners to secure the end effector, which can loosen due to high operating temperatures. However, in accordance with embodiments of the present disclosure, a spindle assembly is provided using a barrel nut with a wave spring to separate the fastener torque from the clamping force and provide greater compliance with thermal expansion. Disclosed herein is a novel use of wave springs and interlocking geometries to secure ceramic end effectors, allowing for higher operating temperatures with low maintenance intervals (necessary in existing designs to re-thread loosened fasteners).

[0007] Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the invention. [Brief description of the drawings]

[0008] [Figure 1A] FIG. 2 is a perspective view of a spindle assembly according to an embodiment of the present disclosure.

[0009] [Figure 1B] 1 is a radial cross-sectional view of a portion of a spindle assembly 100 according to an embodiment of the present disclosure.

[0010] [Figure 2A] FIG. 1 is a perspective view showing the hub body 102, the cover 106a, and the fastener assembly according to an embodiment of the present disclosure.

[0011] [Figure 2B] FIG. 13 is a close-up cross-sectional view showing a loaded fastener assembly 108a according to an embodiment of the present disclosure.

[0012] [Figure 2C] FIG. 2 is a cross-sectional view of a portion of a spindle assembly according to an embodiment of the present disclosure.

[0013] [Figure 2D] FIG. 2 is a cross-sectional view of a portion of a spindle assembly according to an embodiment of the present disclosure.

[0014] [Diagram 3] FIG. 2 is a perspective view of a hub body 102 according to an embodiment of the present disclosure.

[0015] [Figure 4A] FIG. 1C is a top view of a cover 106a according to an embodiment of the present disclosure.

[0016] [Figure 4B] FIG. 13 is a side view of a cover 106a according to an embodiment of the present disclosure.

[0017] [Figure 4C] FIG. 13 is a bottom view of a cover 106a according to an embodiment of the present disclosure.

[0018] [Diagram 5] FIG. 2 is a perspective view of a barrel nut according to an embodiment of the present disclosure.

[0019] [Figure 6A] FIG. 2 is a perspective view of a wave spring according to an embodiment of the present disclosure.

[0020] [Figure 6B] FIG. 2 is a top view of a wave spring according to an embodiment of the present disclosure.

[0021] [Figure 6C] FIG. 2 is a side view of a wave spring according to an embodiment of the present disclosure.

[0022] [Figure 7A] FIG. 2 is a perspective view of a fender washer according to an embodiment of the present disclosure.

[0023] [Figure 7B] FIG. 2 is a top view of a fender washer according to an embodiment of the present disclosure.

[0024] [Figure 7C] FIG. 2 is a side view of a fender washer according to an embodiment of the present disclosure.

[0025] [Figure 8A] FIG. 2 is a cross-sectional perspective view of a hub body according to an embodiment of the present disclosure.

[0026] [Figure 8B] FIG. 2 is an enlarged perspective view of components of a spindle fastener assembly according to an embodiment of the present disclosure.

[0027] [Figure 9A] FIG. 1 is a top view of a hub body 102 according to an embodiment of the present disclosure.

[0028] [Figure 9B] FIG. 9 is a close-up top view of a through-hole 900a according to an embodiment of the present disclosure.

[0029] [Figure 9C] FIG. 2 is a bottom view of the hub body 102 according to an embodiment of the present disclosure.

[0030] [Figure 9D] FIG. 13 is an enlarged bottom view of a central portion of the hub body 102 in accordance with an embodiment of the present disclosure.

[0031] [Figure 10] 11A illustrates a cross-sectional view of a substrate processing system 1100' engaging multiple stations, according to an embodiment of the present disclosure.

[0032] [Figure 11A] FIG. 11 illustrates a top view of a multi-station substrate processing system 1100' with four processing stations in processing chambers according to an embodiment of the present disclosure.

[0033] [Figure 11B] 1 is a schematic diagram of an embodiment of a multi-station substrate processing system having an input load lock and an output load lock, in accordance with an embodiment of the present disclosure.

[0034] [Figure 12] A control module 1600 for controlling the system of the present disclosure, according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] The embodiments of the present disclosure provide various details of a spindle assembly for use in a processing chamber. The spindle assembly may be used in a processing chamber with multiple stations for processing, including multiple pedestals or chucks. In one configuration, if the processing chamber includes a set of pedestals, the spindle assembly will have an equal number of end effectors so that the system can transfer all wafers simultaneously (e.g., by a rotating assembly). In this way, all wafers are transferred to different pedestals to enable further processing in the processing chamber. It should be understood that the present embodiments can be implemented in several ways, such as a process, an apparatus, a system, a device, or a method. Several embodiments are described below.

[0036] A wafer processing system comprises one or more chambers or "reactors" suitable for wafer processing. Each chamber may comprise multiple stations for receiving one or more wafers for processing. The one or more chambers maintain the wafer in a fixed position, with or without movement in that position (e.g., rotation, vibration, or other movement). Wafers undergoing processing (e.g., deposition, etching, cleaning) are loaded into and out of the reactor chamber, and may be transferred from one station to another within the reactor chamber during processing. Of course, processing may occur all at one station, or portions of processing may be performed at any number of stations.

[0037] FIG. 1A depicts a perspective view of a spindle assembly 100 according to an embodiment of the present disclosure. The spindle assembly 100 comprises a hub body 102 to which a number of end effectors 104a, 104b, 104c, and 104d are attached. When attached, the end effectors extend radially outward from the hub body 102. The end effectors are used to support wafers in a multi-station processing module and to lift and transport wafers from one station to another. In the illustrated embodiment of the spindle assembly, there are specifically four end effectors, but it will be appreciated that in other embodiments there may be one, two, or more end effectors. For ease of explanation throughout this disclosure, components are described with respect to a particular portion or end effector of the spindle assembly, and it will be appreciated that the same also applies to other corresponding portions or end effectors of the spindle assembly. Thus, while elements / configurations are provided in a redundant manner to enable configuration of a spindle assembly having a given number of end effectors, it will be appreciated that for the sake of brevity, not all such redundant elements / configurations may be specifically described or shown.

[0038] End effectors 104a, 104b, 104c, and 104d are secured to the hub body 102 by covers 106a, 106b, 106c, and 106d, respectively, when the covers are fastened to the hub body 102. That is, each end effector is sandwiched between the hub body 102 and a corresponding cover when the cover is fastened to the hub body by a fastener assembly. For example, in the illustrated embodiment, cover 106a is secured to the hub body 102 by fastener assemblies 108a and 108b, thereby sandwiching end effector 104a between the hub body 102 and cover 106a.

[0039] 1B depicts a radial cross-sectional view of a portion of a spindle assembly 100 according to an embodiment of the present disclosure. In the illustrated embodiment, a radial cross-sectional portion is shown including a cover 106a and an end effector 104. As shown, an inner end of the end effector 104a is sandwiched between the cover 106a and the bottom of the hub body 102. Also shown is an undercut portion 110 of the hub body that forms a groove or recess or slot into which a lip 112 of the cover 106a fits. This provision, which resembles a tongue-and-groove mechanism, secures the inner end of the cover 106a perpendicularly to the hub body 102, thereby allowing for clamping of the end effector 104a.

[0040] 2A depicts a perspective view of the hub body 102, cover 106a, and fastener assemblies according to an embodiment of the present disclosure. Fastener assemblies 108a and 108b are shown, each including several components that function to secure the cover 106a to the hub body 102. Fastener assembly 108a includes a barrel nut 200a, a wave spring 202a, a fender washer 204a, a Belleville spring 206a, and a screw 208a that threads into the barrel nut 200a. Fastener assembly 108b includes a barrel nut 200b, a wave spring 202b, a fender washer 204b, a Belleville spring 206b, and a screw 208b that threads into the barrel nut 200b.

[0041] Barrel nut 200a extends through a through hole 210a in cover 106a and a corresponding through hole 212a in hub body 102. Barrel nut 200b extends through a through hole 210b in cover 106a and a corresponding through hole 212b in hub body 102.

[0042] Although cover 106a and its associated fastener assembly are shown in detail, it will be appreciated that the other covers are secured in a similar manner by their respective fastener assemblies. For example, cover 106b is secured to hub body 102 by a fastener assembly that includes barrel nuts 200c and 200d.

[0043] 2B depicts a close-up cross-sectional view of fastener assembly 108a installed in accordance with an embodiment of the present disclosure. As shown, wave spring 202a fits around the lower end of the shaft of barrel nut 200a. Wave spring 202a exerts a force against fender washer 204a, effectively pulling barrel nut 200a downward and securing cover 106a. Of course, a similar mechanism is provided for fastener assembly 108b.

[0044] In this manner, the cover 106a enters the hub body 102 and is clamped by the wave spring, which separates the clamping force on the end effector (paddle) from the fastener torque.

[0045] Additionally, in some embodiments, the barrel nut, wave spring, fender washer, and disc spring are each made from the same material, such as Inconel (e.g., Inconel 625 in some embodiments), which eliminates CTE (coefficient of thermal expansion) differences in the fastener stack.

[0046] The present assembly allows for full torqueing of the fastener (eg, about 35 in / lbf (about 4 nm) for Inconel 625).

[0047] Wave springs provide large compliance (eg, about 0.050 inches) for CTE differences (eg, about 0.005 inches) and tolerance stacks.

[0048] All Inconel fastener stacks eliminate any relative axial movement due to CTE differences (due to different materials), which addresses the issue of fastener loosening due to thread shear from material expansion.

[0049] The clearance around the fastener stack in the hub body allows for lateral movement of the cover / fasteners due to thermal expansion (due to temperature differences between the cover and fasteners on the body), which addresses the issue of fasteners loosening due to lateral joint movement.

[0050] The provided wave spring provides a stable clamping force that is decoupled from the fastener clamping force, thereby addressing the issue of fastener loosening due to thread shear from the fastener clamping force.

[0051] 2C depicts a cross-sectional view of a portion of a spindle assembly according to an embodiment of the present disclosure. The cross-section of the figure is taken vertically across fastener assemblies 108a and 108b and further illustrates cover 106a, end effector 104a, and hub body 102. Specifically, the bearing surfaces are shown as shown.

[0052] 2D depicts a cross-sectional view of a portion of a spindle assembly according to an embodiment of the present disclosure. The cross-section of the figure is taken vertically across fastener assemblies 108a and 108b, and further illustrates cover 106a, end effector 104a, and hub body 102. Specifically, thermal expansion allowances around barrel nuts 200a and 200b are shown as illustrated. These provide tolerance for thermal expansion (such as that of cover 106a).

[0053] 3 depicts a perspective view of the hub body 102 in accordance with an embodiment of the present disclosure. As shown, the hub body 102 includes a pocket 300a configured to receive the inner end of the end effector 104a. Similarly, a pocket is provided for each end effector (such as pocket 300b configured to receive the inner end of end effector 104b). Each pocket is a concave cutout along the top surface of the hub body and is shaped to match the shape of the inner / proximal end of the end effector.

[0054] The pocket includes reliefs (e.g., reliefs 302a, 302b, and 302c) to reduce adhesion of the end effector proximal end to the hub body 102 after cooling. As shown, the reliefs reduce the perimeter area of ​​the pocket that contacts the end effector, thereby reducing adhesion.

[0055] Also shown in the figure is undercut 110, which provides a groove for cover 106a to latch onto, as described above.

[0056] 4A depicts a top view of a cover 106a according to an embodiment of the present disclosure, including a lip 112 that fits into an undercut 110 in the hub body.

[0057] 4B depicts a side view of the cover 106a according to an embodiment of the present disclosure. As shown, the underside of the lip 112 is beveled to facilitate fitting the cover 106a into the undercut 110 in the hub body.

[0058] FIG. 4C depicts a bottom view of the cover 106a according to an embodiment of the present disclosure.

[0059] 5 depicts a perspective view of a barrel nut according to an embodiment of the present disclosure. Inconel barrel nuts are used to make all Inconel fastener assemblies to eliminate CTE differences. In some embodiments, the barrel nut is made of Inconel 625.

[0060] 6A depicts a perspective view of a wave spring according to an embodiment of the present disclosure. The wave spring is used to provide clamping force to the end effector and provide compliance to the system to reduce CTE and tolerance stacking. In some embodiments, the wave spring is made of Inconel X-750 (spring temper).

[0061] FIG. 6B depicts a top view of a wave spring according to an embodiment of the present disclosure.

[0062] FIG. 6C illustrates a side view of a wave spring according to an embodiment of the present disclosure.

[0063] 7A depicts a perspective view of a fender washer according to an embodiment of the present disclosure. The fender washer is used in making all Inconel fastener assemblies to eliminate CTE differences. In some embodiments, the fender washer is made of Inconel 625.

[0064] FIG. 7B depicts a top view of a fender washer according to an embodiment of the present disclosure.

[0065] FIG. 7C depicts a side view of a fender washer according to an embodiment of the present disclosure.

[0066] 8A depicts a cross-sectional perspective view of the hub body 102 according to an embodiment of the present disclosure. Shown in cross-section are spindle fastener assemblies 800a and 800b, which are configured to fasten the hub body 102 to an underlying spindle shaft assembly. The spindle shaft assembly is operable to raise, lower, and rotate the spindle assembly 100. In various embodiments, there can be more than one spindle fastener assemblies. In the illustrated embodiment, there are a total of four spindle fastener assemblies.

[0067] 8B depicts an expanded perspective view of the components of spindle fastener assembly 800a according to an embodiment of the present disclosure. As shown, spindle fastener assembly 800a includes screw 802, flat washer 804, Belleville spring 806, Belleville spring 808, and flat washer 810. Each of these components may be made of Inconel (e.g., Inconel 625). The configuration of the provided spindle fastener assembly adds compliance to allow for relative movement due to different CTEs.

[0068] 9A depicts a top view of hub body 102 according to the present disclosure. The depicted embodiment shows several through holes 900a, 900b, 900c, and 900d into which the spindle fastener assemblies described above are respectively inserted. For example, spindle fastener assemblies 800a and 800b may be inserted into and extend through through holes 900a and 900b, respectively.

[0069] 9B depicts an enlarged top view of a through hole 900a according to an embodiment of the present disclosure. The through hole 900a includes a spindle chip hole 902a (through which the threaded portion of the screw 802 passes). The spindle chip hole 902a is configured as a slot extending radially relative to the center of the hub body 102. That is, the spindle chip hole 902a does not have a perfectly circular cross-sectional shape, but extends radially away from (or toward) the center of the hub body 102 and has an elliptical or slot-like cross-sectional shape. Each of the other through holes is similarly configured with a spindle chip hole configured as a slot. This spindle chip hole configuration as a slot accounts for radial movement due to CTE differences.

[0070] 9C depicts a bottom view of the hub body 102 according to an embodiment of the present disclosure. Visible in the depicted embodiment are through holes 900a, 900b, 900c, and 900d as viewed from the underside of the hub body 102.

[0071] 9D depicts an enlarged bottom view of a central portion of the hub body 102 showing the spindle chip holes with through holes and radial slot configurations. Material has been removed from the area around the spindle threads (e.g., threads 802). For example, material has been removed along the interior of spindle chip hole 902a in the area designated by reference numeral 910. Similar configurations are shown for the remaining spindle chip holes.

[0072] Removal of this material prevents deformation and subsequent swaging of the hub relative to the spindle.

[0073] 10 depicts a cross-sectional view of a substrate processing system 1100' engaging multiple stations according to an embodiment of the present disclosure. The processing chamber 1102' comprises an upper chamber portion 1102a' housing multiple showerheads 1150 and a lower chamber portion 1102b' housing multiple stations. The number of showerheads 1150 in the upper chamber portion 1102a' is equal to the number of stations disposed in the lower chamber portion 1102b'. The upper chamber portion 1102a' is configured to lower the showerheads 1150 such that the showerheads 1150 are substantially aligned above the pedestals 1140 of each station. The lower chamber portion 1102b' is configured to be supported by a support structure 1103. The support structure 1103 may be defined by any suitable structure capable of supporting the multi-station processing chamber 1102' as well as the equipment used to provide gases, RF power, pressure control, temperature control, timing, and associated controllers and electronics. In one embodiment, the support structure 1103 is defined as a metal tubular structure that supports the process chamber 1102' above a surface (e.g., a clean room floor) on which the process chamber 1102' of the substrate processing system 1100' is placed. Vacuum pumps 1160a and 1160b are provided in communication with the lower chamber portion 1102b'. The vacuum pumps 1160a and 1160b are configured to provide sufficient gas flow to remove process gases and / or provide pressure control within the process chamber 1102'. Process gases typically flow over the substrate 1101 and can flow from over the edge of the pedestal 1140 towards the vacuum pumps 1160a and 1160b, thereby defining the gas flow path 1402.

[0074] 11A depicts a top view of a multi-station substrate processing system 1100' with four processing stations disposed in a processing chamber 1102'. The top view is of a lower chamber portion 1102b' of the processing chamber 1102' (e.g., with the upper chamber portion 1102a' removed for illustration purposes). The four stations are served by a lifting mechanism that engages an end effector 1226'. The end effector is coupled to a rotation mechanism 1220. The end effector is configured to travel under the wafer when engaged and simultaneously lift the wafer out of the stations and rotate the wafer through at least one or more stations before lowering it to a next location for further plasma processing, treatment, and / or deposition to occur on the respective wafer.

[0075] 11B shows a schematic diagram of an embodiment of a multi-station substrate processing system 1100' comprising an input load lock 1301 and an output load lock 1303. A robot 1305 is configured to move wafers from a cassette loaded through a pod 1313 at atmospheric pressure to the input load lock 1301 through an atmospheric port 1310. The input load lock 1301 is coupled to a vacuum source (not shown) such that the input load lock 1301 is pumped down when the atmospheric port 1310 is closed. The input load lock 1301 also comprises a chamber transfer port 1316 connected to a processing chamber 1102'. Thus, when the chamber transfer port 1316 is open, another robot (not shown) may move wafers from the input load lock 1301 to the pedestal 1140 of the first processing station located in the lower chamber section 1102b' for processing.

[0076] The illustrated processing chamber 1102' includes four processing stations, numbered 1 through 4 in the embodiment shown in Figure 2B. In some embodiments, the processing chamber 1102' may be configured to maintain a low pressure environment so that wafers may be transferred between processing stations without vacuum break and / or exposure to atmosphere. Each processing station shown in Figure 11B includes a pedestal 1140 for receiving a wafer and a process gas supply line inlet (not shown).

[0077] 11A and 11B, there is no ground plate around each pedestal. Therefore, the lower chamber body is left exposed and the RF ground return is typically through the chamber wall. This configuration does not provide symmetry for the RF ground return. In another embodiment, a ground plate may be included to provide a symmetrical RF ground return.

[0078] The lifting mechanism includes an end effector 1226' attached to a rotation mechanism 1220. In some embodiments, the rotation mechanism 1220 is a spindle operated by a spindle motor (not shown).

[0079] When the wafer must be moved, the lift pins are engaged using the lift pin control. The lift pins lift the wafer off the pedestal 1140. The end effector (also known as a wafer blade or wafer paddle) moves under the wafer and lifts it off the lift pins. The lift pins retract into the housing and the spindle and end effector rotate the wafer to the next pedestal 1140. The lift pins are again engaged to receive the wafer from the end effector. The end effector and spindle rotate out and the wafer is received on the pedestal 1140. The wafer transport is coordinated so that the wafer is placed on a different pedestal to allow further processing of the wafer. In the illustrated embodiment, the lift pins are strategically positioned on the pedestal body so that they do not interfere with the operation of the end effector when engaged.

[0080] FIG. 12 shows a control module 1600 for controlling the above system. For example, the control module 1600 may include a processor, a memory, and one or more interfaces. The control module 1600 may be used to control devices in the system based in part on the sensed values. By way of example only, the control module 1600 may control one or more of the values ​​1602, the filter heater 1604, the pump 1606, and other devices 1608 based on the sensed values ​​and other control parameters. The control module 1600 receives sensed values ​​from a pressure gauge 1610, a flow meter 1612, a temperature sensor 1614, and / or other sensors 1616, by way of example only. The control module 1600 may be used to control process conditions during precursor delivery and deposition. The control module 1600 will typically include one or more memory devices and one or more processors.

[0081] The control module 1600 may control the operation of the precursor delivery system and deposition apparatus. The control module 1600 executes a computer program that includes a set of instructions for controlling process timing, temperature of the delivery system, pressure differential across the filter, pressure position, mixture of gases, chamber pressure, chamber temperature, wafer temperature, radio frequency (RF) power levels, wafer chuck or pedestal position, and other parameters of a particular process. The control module 1600 may monitor the pressure differential and automatically switch the vapor precursor delivery from one or more paths to one or more other paths. In some embodiments, other computer programs stored in a memory device associated with the control module 1600 may be used.

[0082] Typically, there will be a user interface associated with the control module 1600. The user interface may include a display device 1618 (e.g., a display screen and / or graphical software display of equipment and / or process conditions) and a user input device 1620 (pointing device, keyboard, touch screen, microphone, etc.).

[0083] Computer programs for controlling precursor delivery, deposition, and other processes in the process sequence can be written in any suitable computer readable programming language (e.g., assembly language, C, C++, Pascal, Fortran, or others). The compiled object code or script is executed by the processor to perform the tasks identified in the program.

[0084] The control module parameters relate to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions (such as RF power level and low frequency RF frequency), cooling gas pressure, and chamber wall temperature.

[0085] The system software may be designed or configured in many different ways. For example, various chamber component subroutines or control objects may be created to control the operation of the chamber components necessary to carry out the deposition process of the present invention. Examples of programs or program sections for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, and plasma control code.

[0086] The substrate positioning program may include program code for controlling chamber components used to load the substrate onto the pedestal or chuck and control the spacing between the substrate and other components of the chamber (gas inlets and / or targets). The process gas control program may include code for controlling the composition and flow rates of gases to stabilize the pressure in the chamber and for flowing gases into the chamber before deposition as necessary. The filter monitoring program includes code for comparing the measured difference with a preset value and / or code for switching paths. The pressure control program may include code for controlling the pressure in the chamber, for example by controlling a throttle valve in the exhaust system of the chamber. The heater control program may include code for controlling current to a heating device for heating the precursor delivery system, the substrate, and / or components in other parts of the system. Alternatively, the heater control program may control the supply of a heat transfer gas (such as helium) to the wafer chuck.

[0087] Examples of sensors that may be monitored during deposition include, but are not limited to, mass flow control modules, pressure sensors (such as pressure gauge 1610), thermocouples located in the delivery system, and the pedestal or chuck (e.g., temperature sensor 1614). Appropriately programmed feedback and control algorithms may be used in conjunction with data from these sensors to maintain desired process conditions. The foregoing describes the implementation of embodiments of the present invention in single or multi-chamber semiconductor processing tools.

[0088] The foregoing description of the present embodiments has been provided for purposes of illustration and description and is not intended to be exhaustive or to limit the present invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but may be interchangeable where applicable and may be used in selected embodiments without specific mention. The same may be modified in many ways. Such modifications are not considered as a departure from the present invention, and all such modifications are intended to be included within the scope of the present invention.

[0089] Although the foregoing embodiments have been described in some detail for clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Thus, the present embodiments should be considered as illustrative and not restrictive and should not be limited to the details set forth herein, but may be modified within the scope of the claims or their equivalents.

Claims

1. 1. A spindle assembly for transporting wafers within a multi-station processing module, comprising: a hub body configured to rotate about a central axis; a plurality of end effectors, each end effector having a first end configured to couple to the hub body and a second end configured to support a wafer; With multiple covers, a plurality of fastener assemblies; A spindle assembly, wherein the first end of each end effector is clamped between a respective cover and a respective exterior of the hub body by a respective fastener assembly, the respective fastener assembly including a wave spring that provides a stable clamping force.

2. 2. The spindle assembly of claim 1, a spindle assembly, wherein the respective fastener assemblies include a barrel nut extending through the respective cover and the respective exterior of the hub body, and a screw coupled to the barrel nut.

3. 3. The spindle assembly of claim 2, The wave spring surrounds the barrel nut.

4. 4. The spindle assembly of claim 3, The wave spring isolates torque applied to the screws from clamping forces applied by the fastener assemblies to the respective exteriors of the respective covers and the hub body.

5. 2. The spindle assembly of claim 1, a lip of each cover configured to fit within an undercut portion of the hub body,

6. 2. The spindle assembly of claim 1, The spindle assembly, wherein the plurality of fastener assemblies are made of Inconel material.

7. 2. The spindle assembly of claim 1, A spindle assembly, wherein the hub body includes a plurality of slotted holes that facilitate coupling of the hub body to a rotating spindle shaft assembly.

8. 1. A spindle assembly for transporting wafers within a multi-station processing module, comprising: a hub body configured to rotate about a central axis; a plurality of end effectors, each end effector having a first end configured to couple to the hub body, the hub body having a recess configured to receive the first end of the end effector, and each end effector having a second end configured to support a wafer during transfer in the multi-station processing module; a plurality of covers, each cover disposed over one of the first ends of the end effectors, each cover secured to the hub body by at least two fastener assemblies such that the first end of each end effector is sandwiched between one of the covers and the hub body; A spindle assembly, wherein each fastener assembly includes a wave spring that provides a substantially consistent clamping force.

9. 9. The spindle assembly of claim 8, Each fastener assembly includes a barrel nut extending through one of the covers and the hub body, and a screw coupled to the barrel nut.

10. 10. The spindle assembly of claim 9, The wave spring surrounds the barrel nut.

11. 11. The spindle assembly of claim 10, The wave spring isolates the torque applied to the screw from the clamping force applied by the fastener assembly to one of the covers and the hub body.

12. 9. The spindle assembly of claim 8, Each cover includes a lip configured to fit within an undercut portion of the hub body.

13. 9. The spindle assembly of claim 8, The spindle assembly, wherein the fastener assembly is made of Inconel material.

14. 9. The spindle assembly of claim 8, A spindle assembly, wherein the hub body includes a plurality of slotted holes that facilitate coupling of the hub body to a rotating spindle shaft assembly.

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